A method and system for detecting abnormality of flexible circuit board patch

Abstract

The invention discloses a method and system for detecting abnormal patching of a flexible circuit board, relates to the technical field of patching of circuit boards, and solves the technical problem in the prior art that patching detection cannot be performed on a flexible circuit board and the fault tolerance rate of a patch production line cannot be guaranteed. Specifically, surface patching detection is performed on a patched flexible circuit board through image analysis, an initial patching detection is performed on the surface of the flexible circuit board, and patching efficiency detection is performed on the deviation of the patch component position to infer whether the current flexible circuit board needs to be re-patched or rectified; electrical parameter detection is performed on a performance-to-be-evaluated object to determine whether the electrical parameters of the flexible circuit board with qualified patch deviation during the current production line processing period are qualified, thereby performing real-time supervision on the error of the patch production line, increasing the fault tolerance rate of the production line, and improving the progress of the flexible circuit board of the production line without affecting the patching efficiency of the flexible circuit board, so that the patching efficiency is more efficient.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board patch technology, and in particular to a method and system for detecting abnormalities of flexible circuit board patches. Background Art

[0002] Abnormal detection of flexible circuit board patch is a crucial link in the field of electronic manufacturing; abnormal types Common flexible circuit board patch abnormalities include but are not limited to the following: component offset: patch components are not accurately installed in the predetermined position, which may cause poor circuit connection or short circuit; for example, the pins of resistors or capacitors are not aligned with the pads; cold solder joints: the soldering between component pins and pads is not firm and the contact is poor; short circuit: accidental connection between adjacent lines or component pins, affecting the normal operation of the circuit.

[0003] However, in the prior art, it is impossible to evaluate the impact of the welding process and the moving process on the production line before the flexible circuit board is mounted, so that the accuracy of the mounting cannot be guaranteed, resulting in the inability to adjust the production line in time, reducing the mounting efficiency. In addition, the flexible circuit board cannot be mounted for inspection, and the deviation of the circuit board with mounting offset cannot be evaluated within the qualified period of the mounting inspection, so the fault tolerance rate of the mounting production line cannot be guaranteed, and the mounting operation efficiency is not maximized.

[0004] In view of the above technical defects, a solution is now proposed. Summary of the invention

[0005] The purpose of the present invention is to solve the above-mentioned problems and to propose a method and system for detecting abnormalities in a flexible circuit board patch.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A patch abnormality detection system based on a flexible circuit board includes a patch supervision platform, the patch supervision platform is communicatively connected with a patch execution sub-platform and a patch evaluation sub-platform;

[0008] The patch execution sub-platform is connected to the following communication: a welding risk assessment unit, which is used to set the flexible circuit board that has not completed the patch execution as a substrate, and mark the installed patch as a patch component; when the patch component is installed on the substrate, the substrate is imaged and the image corresponding to the start time of the acquisition is marked as the substrate start image, and when the patch component is installed, the image acquisition is continuously performed and the acquired image is divided into several sub-images according to the acquisition time, and the sub-image at the current moment is set as the real-time end image, and the substrate start image and the real-time end image are compared, and the static level parameters and static gap parameters are obtained, and welding faults are detected and classified according to the parameter comparison;

[0009] The mobile risk assessment unit is used to set the movement trajectory of the flexible circuit board in the production line as a passive contact trajectory through image acquisition technology and in combination with the real-time position of the flexible circuit board in the acquired image, and mark the movement trajectory of the patch component installation equipment that cooperates with the flexible circuit board in the production line as an active contact trajectory; and perform movement analysis on the passive contact trajectory and the active contact trajectory, collect trajectory deviation parameters and trajectory adjustment parameters, and infer whether the production line movement risk is normal based on parameter analysis.

[0010] As a preferred embodiment of the present invention, the patch evaluation sub-platform communication connection has:

[0011] The surface patch detection unit is used to mark the flexible circuit board that has completed the patch as the object to be inspected, sort the objects to be inspected according to the processing order of the production line, collect pictures of the surface of the object to be inspected, and mark the real-time collected pictures as the pictures to be inspected. The position alternation data and position floating data are collected, and the patch detection is inferred based on the data comparison. After the detection is normal, the patch components processed in the current period that are not in the set position are set as the objects to be evaluated for performance;

[0012] The electrical parameter detection unit is used to mark the flexible circuit board that has completed the patch as the object to be tested, collect electrical impact information, and substitute it into the formula to obtain the real-time detection coefficient of the electrical parameters. According to the comparison of the real-time detection coefficient, it is inferred whether the electrical parameters of the object to be evaluated are normal.

[0013] As a preferred embodiment of the present invention, the static level parameter and the static gap parameter are respectively the horizontality deviation value of the substrate at the same patch position corresponding to the substrate start image and the real-time end image, and the deviation value between the actual gap distance between the patch at the same patch position and the substrate after completion and the set gap distance.

[0014] As a preferred embodiment of the present invention, if the static level parameter exceeds the level deviation value threshold, and the static gap parameter exceeds the gap distance deviation value threshold, a static risk signal is generated; if the static level parameter exceeds the level deviation value threshold, and the static gap parameter does not exceed the gap distance deviation value threshold, a substrate detection signal is generated;

[0015] If the static horizontal parameter does not exceed the horizontality deviation value threshold, and the static gap parameter exceeds the gap distance deviation value threshold, a welding process debugging signal is generated; if the static horizontal parameter does not exceed the horizontality deviation value threshold, and the static gap parameter does not exceed the gap distance deviation value threshold, a welding qualified signal is generated.

[0016] As a preferred embodiment of the present invention, the trajectory deviation parameter and the trajectory adjustment parameter are respectively the numerical ratio of the vertical position deviation spacing between the active contact trajectory and the passive contact trajectory before and after the flexible circuit board position offset appears in the passive contact trajectory in the captured image to the width of the current patch component welding area, and the peak increase span of the current passive contact trajectory deviation floating frequency and the active contact trajectory response adjustment frequency after the active contact trajectory in the captured image is adjusted for the passive contact trajectory, and the peak increase span of the offset installation speed of the flexible circuit board for receiving the active contact trajectory adjustment and completing the patch component installation in the production line.

[0017] As a preferred embodiment of the present invention, if the trajectory deviation parameter exceeds the numerical ratio threshold, or the trajectory adjustment parameter exceeds the increase span threshold, a high-risk movement signal is generated; if the trajectory deviation parameter does not exceed the numerical ratio threshold, and the trajectory adjustment parameter does not exceed the increase span threshold, a low-risk movement signal is generated.

[0018] As a preferred embodiment of the present invention, the position alternation data and the position floating data are respectively the alternation frequency corresponding to the patch elements at the set position and not at the set position in the current image to be inspected, and the reduction span of the peak value ratio corresponding to the peak value of the continuous number of patch elements at the set position and not at the set position in the image to be inspected;

[0019] If the position alternating data exceeds the alternating frequency threshold, a patch invalid signal is generated; if the position floating data exceeds the peak ratio reduction span threshold, a patch inefficient signal is generated; if the position alternating data does not exceed the alternating frequency threshold, and the position floating data does not exceed the peak ratio reduction span threshold, a patch low risk signal is generated.

[0020] As a preferred embodiment of the present invention, the electrical impact information includes the difference between the maximum voltage fluctuation span value of any circuit in the circuit board corresponding to the performance object to be evaluated and the performance standard object at any time and the corresponding numerical ratio of the deviation value between the actual voltage and the set voltage at the corresponding time, the deviation of the voltage increase of the adjacent circuit during the time consumed for the voltage blocking in the adjacent circuit when the voltage of any circuit in the circuit board corresponding to the performance object to be evaluated and the performance standard object is infinite, and the difference in the proportion of non-short-circuit faults in the circuit board corresponding to the performance object to be evaluated and the performance standard object that cause damage to the circuit board due to continuous voltage abnormality in the circuit.

[0021] As a preferred embodiment of the present invention, if the real-time detection coefficient of the electrical parameters exceeds the detection coefficient threshold, the position deviation during the pasting process of the current performance object to be evaluated is marked as a tolerable deviation value; if the real-time detection coefficient of the electrical parameters does not exceed the detection coefficient threshold, the position deviation during the pasting process of the current performance object to be evaluated is marked as a risk deviation value.

[0022] A method for detecting abnormalities based on a flexible circuit board patch, the specific abnormality detection steps are as follows:

[0023] Step 1: Welding risk assessment: When the SMD components are installed on the substrate, the substrate is imaged and compared with the starting image and the real-time ending image to obtain static level parameters and static gap parameters. The welding faults are detected and classified according to the parameter comparison.

[0024] Step 2: Mobile risk assessment: Perform mobile analysis on the passive contact trajectory and active contact trajectory, collect trajectory deviation parameters and trajectory adjustment parameters, and infer whether the production line movement risk is normal based on parameter analysis;

[0025] Step 3: Surface patch detection: collect images of the surface of the object to be inspected, collect position alternation data and position floating data, and infer whether the patch detection is normal based on data comparison;

[0026] Step 4: Electrical parameter detection: collect electrical impact information and substitute it into the formula to obtain the real-time detection coefficient of the electrical parameters. Compare and infer whether the electrical parameters of the object to be evaluated are normal based on the real-time detection coefficient.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. In the present invention, a patch welding risk assessment is performed on the flexible circuit board. The patch welding risk assessment is used to infer whether there are any abnormalities during the execution of the flexible circuit board patch, so as to avoid the patch position deviation caused by the welding abnormality, resulting in a short circuit or open circuit in the circuit of the flexible circuit board, causing power failure, and even causing the flexible circuit board substrate to be scrapped; the mobile trajectory detection of the flexible circuit board patch process is used to infer whether there is a risk in the movement of the flexible circuit board in the current production line, so as to avoid a decrease in the patch accuracy of the patch components of the flexible circuit, resulting in a decrease in the patch efficiency of the production line, and in batch production, the real-time mobile trajectory detection can avoid the movement risk in advance to cause rework of a large number of circuit boards, causing the production progress of the entire production line to be affected.

[0029] 2. In the present invention, the surface patch detection is performed on the flexible circuit board that has completed the patch through image analysis, the initial patch detection is performed on the surface of the flexible circuit board, and the patch efficiency is detected by the deviation of the patch component position to infer whether the current flexible circuit board needs to be re-patched or rectified; the electrical parameter detection is performed on the performance object to be evaluated to determine whether the electrical parameters of the flexible circuit board with qualified patch deviation in the current production line processing period are qualified, so as to monitor the error of the patch production line in real time, increase the fault tolerance of the production line, and improve the progress of the flexible circuit board of the production line without affecting the patch efficiency of the flexible circuit board, so that the patch efficiency is more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0031] Figure 1 It is a principle block diagram of the present invention as a whole;

[0032] Figure 2 This is a principle block diagram of Embodiment 1 of the present invention;

[0033] Figure 3 This is a principle block diagram of Embodiment 2 of the present invention;

[0034] Figure 4 This is a principle block diagram of Embodiment 3 of the present invention. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0037] See also Figure 1 As shown, a patch abnormality detection system based on a flexible circuit board includes a patch supervision platform, which is communicatively connected to a patch execution sub-platform and a patch evaluation sub-platform; wherein the patch execution sub-platform is used to supervise the patch execution process of the flexible circuit board and infer whether there is a patch abnormality during the execution process; and the patch evaluation sub-platform is used to perform abnormality detection on the flexible circuit board after the patch execution is completed and infer whether there is an abnormality on the flexible circuit board; Embodiment 1

[0038] See also Figure 2 As shown, the patch supervision platform is connected to the patch execution sub-platform in communication with a welding risk assessment unit and a mobile risk assessment unit;

[0039] After the patch supervision platform generates a patch execution supervision instruction to the patch execution sub-platform, the patch execution sub-platform generates a welding risk assessment signal and sends the welding risk assessment signal to the welding risk assessment unit. After receiving the welding risk assessment signal, the welding risk assessment unit performs a patch welding risk assessment on the flexible circuit board, and infers whether there is an abnormality in the execution of the flexible circuit board patch through the patch welding risk assessment, so as to avoid the position deviation of the patch caused by the welding abnormality, resulting in a short circuit or open circuit in the circuit of the flexible circuit board, causing a power failure, and even causing the flexible circuit board substrate to be scrapped;

[0040] The flexible circuit board on which patch execution has not been completed is set as a substrate, and the installed patch is marked as a patch component; when the patch component is installed on the substrate, the substrate is imaged and the image corresponding to the start time of the acquisition is marked as the substrate start image, and the image acquisition is continued when the patch component is installed and the acquired image is divided into a plurality of sub-images according to the acquisition time;

[0041] The sub-image at the current moment is set as the real-time end image, and the substrate start image and the real-time end image are compared to obtain the horizontal deviation value of the substrate at the same patch position corresponding to the substrate start image and the real-time end image, and the deviation value of the actual gap distance with the substrate after the patch at the same patch position is completed and the set gap distance is collected, and the horizontal deviation value of the substrate at the same patch position corresponding to the substrate start image and the real-time end image, and the deviation value of the actual gap distance with the substrate after the patch at the same patch position is completed and the set gap distance are marked as static horizontal parameters and static gap parameters, respectively, and compared with the horizontal deviation value threshold and the gap distance deviation value threshold, respectively:

[0042] If the horizontality deviation value of the substrate at the same patch position between the substrate start image and the real-time end image exceeds the horizontality deviation value threshold, and the deviation value between the actual gap distance between the patch at the same patch position and the substrate after completion and the set gap distance exceeds the gap distance deviation value threshold, it is determined that there is a static risk in patch welding, a static risk signal is generated and sent to the patch supervision platform, and after receiving the static risk signal, the patch supervision platform rectifies the welding process of the patch;

[0043] If the horizontality deviation value of the substrate at the same patch position corresponding to the substrate start image and the real-time end image exceeds the horizontality deviation value threshold, and the deviation value of the actual gap distance between the patch and the substrate after the patch at the same patch position is completed and the set gap distance does not exceed the gap distance deviation value threshold, it is determined that there is a risk of substrate deformation during the patch welding process, and a substrate detection signal is generated and sent to the patch supervision platform. After receiving the substrate detection signal, the patch supervision platform detects the deformation effect of the substrate under the currently matched welding process, and replaces the substrate or reduces the welding power when the effect is abnormal;

[0044] If the horizontality deviation value of the substrate at the same patch position corresponding to the substrate start image and the real-time end image does not exceed the horizontality deviation value threshold, and the deviation value of the actual gap distance between the patch and the substrate after the patch at the same patch position is completed and the set gap distance exceeds the gap distance deviation value threshold, it is determined that the welding process is not suitable for the current substrate welding, and a welding process debugging signal is generated and sent to the patch supervision platform. After receiving the welding process debugging signal, the patch supervision platform adjusts the welding process to avoid installing patch components on the substrate;

[0045] If the horizontality deviation value of the substrate at the same patch position corresponding to the substrate start image and the real-time end image does not exceed the horizontality deviation value threshold, and the deviation value between the actual gap distance between the patch and the substrate after the patch at the same patch position is completed and the set gap distance does not exceed the gap distance deviation value threshold, then the substrate welding risk assessment is determined to be qualified, a welding qualified signal is generated and sent to the patch supervision platform;

[0046] After the patch supervision platform determines that the welding is completed and qualified, it generates a mobile risk assessment signal and sends the mobile risk assessment signal to the mobile risk assessment unit. After receiving the mobile risk assessment signal, the mobile risk assessment unit conducts a mobile risk assessment on the flexible circuit board patch process. Through the mobile trajectory detection of the flexible circuit board patch process, it is inferred whether there is a risk in the movement of the flexible circuit board in the current production line, so as to avoid the decrease in the patch accuracy of the patch components of the flexible circuit, resulting in a decrease in the patch efficiency of the production line. In addition, during mass production, real-time mobile trajectory detection can avoid the mobile risk in advance, causing rework of large quantities of circuit boards, which affects the production progress of the entire production line;

[0047] Through image acquisition technology and combined with the real-time position of the flexible circuit board in the acquired image, the movement trajectory of the flexible circuit board in the production line is set as a passive contact trajectory, and the movement trajectory of the patch component installation equipment that cooperates with the flexible circuit board in the production line is marked as an active contact trajectory; and the passive contact trajectory and active contact trajectory are analyzed for movement;

[0048] The ratio of the vertical position deviation spacing between the active contact track and the passive contact track to the width of the current patch component welding area before and after the passive contact track in the acquired image appears to be offset from the position of the flexible circuit board. The vertical direction represents that when the flexible circuit board and the patch mounting equipment are installed in coordination, in the original set track, the vertical direction should be overlapped. If an offset occurs, there is also a spacing deviation in the vertical direction. After the active contact track in the acquired image is obtained and the passive contact track is adjusted, the current passive contact track deviation floating frequency and the active contact track should be adjusted. The flexible circuit board in the production line that has completed the installation of patch components for receiving the active contact track adjustment The peak value of the offset installation speed is increased by the span, and the numerical ratio of the vertical position deviation spacing between the active contact track and the passive contact track before and after the flexible circuit board position offset appears in the passive contact track in the acquired image to the width of the current patch component welding area, the current passive contact track deviation floating frequency and the active contact track response adjustment frequency after the active contact track in the acquired image is adjusted to the passive contact track. The peak value of the offset installation speed of the flexible circuit board for patch component installation in the production line to receive the active contact track adjustment is marked as the track deviation parameter and the track adjustment parameter, and compared with the numerical ratio threshold and the increase span threshold respectively:

[0049] If the ratio of the vertical position deviation distance between the active contact track and the passive contact track before and after the flexible circuit board position deviation appears in the passive contact track in the acquired image to the width of the current patch component welding area exceeds the numerical ratio threshold, or after the active contact track in the acquired image adjusts the passive contact track, the peak increase span of the offset installation speed of the flexible circuit board in the production line for receiving the active contact track adjustment and completing the patch component installation under the adjustment frequency of the active contact track exceeds the increase span threshold, then it is determined that the real-time patch production line movement risk assessment of the flexible circuit board is abnormal, and a high-risk movement signal is generated and sent to the patch supervision platform. After receiving the high-risk movement signal, the patch supervision platform controls the speed of the current production line and controls the adjustment speed of the patch equipment, and performs speed control in time when the flexible circuit board position deviation appears in the production line;

[0050] If the numerical ratio of the vertical position deviation spacing between the active contact track and the passive contact track before and after the flexible circuit board position offset appears in the passive contact track in the acquired image and the width of the current patch component welding area does not exceed the numerical ratio threshold, and after the active contact track in the acquired image adjusts the passive contact track, the peak increase span of the current passive contact track deviation floating frequency and the active contact track response adjustment frequency in the production line for receiving the active contact track adjustment to complete the patch component installation does not exceed the increase span threshold, then it is determined that the real-time patch production line movement risk assessment of the flexible circuit board is normal, and a low movement risk signal is generated and sent to the patch supervision platform; Embodiment 2

[0051] The above embodiment detects abnormalities in the real-time production line patch process of the flexible circuit board, so as to facilitate timely production line regulation. Based on the above embodiment, this embodiment detects real-time parameters of the flexible circuit board to infer whether the patch of the current flexible circuit board is abnormal. Please refer to Figure 3 As shown, the patch supervision platform and the patch evaluation sub-platform are communicatively connected with a surface patch detection unit and an electrical parameter detection unit;

[0052] After the patch supervision platform detects the existence of a flexible circuit board with completed patch, it generates a patch evaluation instruction to the patch evaluation sub-platform. The patch evaluation sub-platform generates a surface patch detection signal and sends the surface patch detection signal to the surface patch detection unit. After receiving the surface patch detection signal, the surface patch detection unit performs surface patch detection on the flexible circuit board with completed patch through image analysis, performs initial patch detection on the surface of the flexible circuit board, and performs patch efficiency detection on the deviation of the patch component position to infer whether the current flexible circuit board needs to be re-patched or rectified.

[0053] The flexible circuit board with completed patch is marked as the object to be inspected, and the objects to be inspected are sorted according to the processing order of the production line, and the surface of the object to be inspected is imaged, and the real-time image is marked as the image to be inspected, and the alternating frequency corresponding to the patch components at the set position and not at the set position in the current image to be inspected is obtained, and at the same time, the reduction span of the peak value ratio of the continuous number peak of the patch components at the set position and not at the set position in the image to be inspected is obtained, and the alternating frequency corresponding to the patch components at the set position and not at the set position in the current image to be inspected, and the reduction span of the peak value ratio of the continuous number peak of the patch components at the set position and not at the set position in the image to be inspected are marked as position alternation data and position floating data, respectively, and compared with the alternating frequency threshold and the peak ratio reduction span threshold, respectively:

[0054] If the alternating frequency corresponding to the patch components at the set position and not at the set position in the current image to be inspected exceeds the alternating frequency threshold, the patch of the flexible circuit board production line corresponding to the current image to be inspected is determined to be abnormal, and an invalid patch signal is generated and sent to the patch supervision platform. After receiving the invalid patch signal, the patch supervision platform repairs the substrate welding equipment and the patch equipment in the flexible circuit board production line and performs real-time detection of the welding patch coordination process to avoid position deviation caused by the production line;

[0055] If the reduction span of the peak value of the continuous number of patch components at the set position in the image to be inspected and the corresponding peak value of the continuous number of patch components not at the set position exceeds the peak value ratio reduction span threshold, it is determined that the patch of the flexible circuit board production line corresponding to the current image to be inspected is inefficient, and a patch inefficiency signal is generated and sent to the patch supervision platform. After receiving the patch inefficiency signal, the patch supervision platform increases the processing time period for the number of patch components not at the set position corresponding to the current image to be inspected to trace the equipment processing, screen out the production line processing faults and perform maintenance;

[0056] If the alternating frequency corresponding to the patch components at the set position and those not at the set position in the current image to be inspected does not exceed the alternating frequency threshold, and the reduction span of the peak ratio of the continuous number peak of the patch components at the set position in the image to be inspected and the continuous number peak of the patch components not at the set position does not exceed the peak ratio reduction span threshold, then it is judged that the risk of the patch on the surface of the flexible circuit board in the current image to be inspected is low, a patch low risk signal is generated and the patch low risk signal is sent to the patch supervision platform. After receiving the patch low risk signal, the patch supervision platform sets the patch components not at the set position processed in the current period as the performance to be evaluated objects, and at the same time generates an electrical parameter detection signal and sends the electrical parameter detection signal to the electrical parameter detection unit;

[0057] After receiving the electrical parameter detection signal, the electrical parameter detection unit performs electrical parameter detection on the object to be evaluated, and determines whether the electrical parameters of the flexible circuit board with qualified patch deviation in the current production line processing period are qualified, thereby real-time monitoring of the error of the patch production line is performed, and the fault tolerance rate of the production line is increased. While not affecting the patch efficiency of the flexible circuit board, the progress of the production line flexible circuit board is improved, making the patch efficiency more efficient;

[0058] The flexible circuit board without patch deviation is marked as a performance standard object, and the difference between the maximum voltage floating span value at any time in any circuit of the circuit board corresponding to the performance object to be evaluated and the performance standard object and the corresponding numerical ratio of the deviation value between the actual voltage and the set voltage at the corresponding time is obtained, and the difference between the maximum voltage floating span value at any time in any circuit of the circuit board corresponding to the performance object to be evaluated and the performance standard object and the corresponding numerical ratio of the deviation value between the actual voltage and the set voltage at the corresponding time is marked as WZC;

[0059] Obtain the deviation of the voltage increase amount of the adjacent circuit in the time taken for the voltage to be blocked in the adjacent circuit when the voltage of any circuit in the circuit board corresponding to the performance object to be evaluated and the performance standard object is infinite, and mark the deviation of the voltage increase amount of the adjacent circuit in the time taken for the voltage to be blocked in the adjacent circuit when the voltage of any circuit in the circuit board corresponding to the performance object to be evaluated and the performance standard object as YXV, wherein when the voltage is infinite, it indicates that there is a short circuit in the current circuit, which is infinitely close to the voltage of the actual power supply;

[0060] Obtain the difference in the percentage of non-short-circuit faults in the circuit board corresponding to the performance evaluation object and the performance standard object that causes damage to the circuit board due to continuous circuit voltage abnormality, and mark the difference in the percentage of non-short-circuit faults in the circuit board corresponding to the performance evaluation object and the performance standard object that causes damage to the circuit board due to continuous circuit voltage abnormality as XLZ;

[0061] The above collected data are uniformly marked as electrical impact information, and substituted into the formula to obtain the electrical parameter real-time detection coefficient DX, the formula is: , where jb1, jb2 and jb3 are respectively the difference between the maximum span value and the corresponding numerical ratio of the deviation value, the deviation of the voltage increase of the adjacent circuits during the time consumption, and the preset proportional coefficients of the proportion of the number of circuit boards damaged by abnormalities, and α is the error correction factor, which is 1.12;

[0062] Compare the electrical parameter real-time detection coefficient DX with the detection coefficient threshold:

[0063] If the real-time detection coefficient DX of the electrical parameters exceeds the detection coefficient threshold, the electrical parameter detection of the performance object to be evaluated is determined to be qualified, and the position deviation of the current performance object to be evaluated during the patch process is collected and sent to the patch supervision platform. After receiving the position deviation, the patch supervision platform uniformly marks it as the tolerance deviation value. Among them, the fault tolerance rate update of this technical solution is supported by a certain base number of flexible circuit boards to avoid inefficient fault tolerance rate control caused by chance, resulting in abnormal production line processing;

[0064] If the electrical parameter real-time detection coefficient DX does not exceed the detection coefficient threshold, the electrical parameter detection of the performance evaluation object is determined to be unqualified, and the position deviation of the current performance evaluation object during the patch process is collected and sent to the patch supervision platform. After receiving the position deviation, the patch supervision platform uniformly marks it as a risk deviation value;

[0065] When the flexible circuit board is subsequently mounted, the tolerance deviation value and risk deviation value stored in real time are used as hard standards for movement risk assessment and welding risk assessment. Embodiment 3

[0066] See also Figure 4 As shown, a method for detecting abnormalities based on flexible circuit board patches is described, and the specific abnormality detection steps are as follows:

[0067] Step 1: Welding risk assessment: When the SMD components are installed on the substrate, the substrate is imaged and the image corresponding to the start time of the acquisition is marked as the substrate start image. When the SMD components are installed, the image is continuously acquired and the acquired image is divided into several sub-images according to the acquisition time. The sub-image at the current moment is set as the real-time end image. The substrate start image and the real-time end image are compared to obtain the static level parameters and static gap parameters. The welding faults are detected and classified according to the parameter comparison.

[0068] Step 2: Mobile risk assessment: Set the mobile trajectory of the flexible circuit board in the production line as the passive contact trajectory, and mark the mobile trajectory of the patch component installation equipment that cooperates with the flexible circuit board in the production line as the active contact trajectory; perform mobile analysis on the passive contact trajectory and the active contact trajectory, collect the trajectory deviation parameters and trajectory adjustment parameters, and infer whether the production line movement risk is normal based on the parameter analysis;

[0069] Step 3: Surface patch inspection: sort the objects to be inspected according to the processing order of the production line, collect images of the surface of the objects to be inspected, mark the real-time collected images as the images to be inspected, collect the position alternation data and position floating data, and infer whether the patch inspection is normal based on the data comparison; and if the inspection is normal, set the patch components that are not in the set position processed in the current period as the objects to be evaluated for performance;

[0070] Step 4: Electrical parameter detection: mark the flexible circuit board that has completed the patch as the object to be tested, collect the electrical impact information, and substitute it into the formula to obtain the real-time detection coefficient of the electrical parameters. Compare and infer whether the electrical parameters of the object to be evaluated are normal based on the real-time detection coefficient;

[0071] The above formulas are obtained by collecting a large amount of data and performing software simulation, and a formula close to the actual value is selected. The coefficients in the formula are set by technicians in this field according to actual conditions;

[0072] When the present invention is in use, when the patch component is installed on the substrate, the welding risk assessment unit collects images of the substrate and compares the substrate start image and the real-time end image to obtain static level parameters and static gap parameters, and performs welding fault detection and classification based on parameter comparison; the mobile risk assessment unit performs mobile analysis on the passive contact trajectory and the active contact trajectory, collects trajectory deviation parameters and trajectory adjustment parameters, and infers whether the production line movement risk is normal based on the parameter analysis; the surface patch detection unit collects images of the surface of the object to be inspected, collects position alternation data and position floating data, and infers whether the patch detection is normal based on data comparison; the electrical parameter detection unit collects electrical influence information, and substitutes it into the formula to obtain the real-time detection coefficient of the electrical parameter, and infers whether the electrical parameters of the performance object to be evaluated are normal based on the real-time detection coefficient comparison.

[0073] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A flexible circuit board patch abnormality detection system, including a patch supervision platform, characterized in that: The patch supervision platform is connected to the patch execution sub-platform and the patch evaluation sub-platform; The patch execution sub-platform is connected to the following communication: a welding risk assessment unit, which is used to set the flexible circuit board that has not completed the patch execution as a substrate, and mark the installed patch as a patch component; when the patch component is installed on the substrate, the substrate is imaged and the image corresponding to the start time of the acquisition is marked as the substrate start image, and when the patch component is installed, the image acquisition is continuously performed and the acquired image is divided into several sub-images according to the acquisition time, and the sub-image at the current moment is set as the real-time end image, and the substrate start image and the real-time end image are compared, and the static level parameters and static gap parameters are obtained, and welding faults are detected and classified according to the parameter comparison; The mobile risk assessment unit is used to set the movement trajectory of the flexible circuit board in the production line as a passive contact trajectory through image acquisition technology and in combination with the real-time position of the flexible circuit board in the acquired image, and mark the movement trajectory of the patch component installation equipment that cooperates with the flexible circuit board in the production line as an active contact trajectory; and perform movement analysis on the passive contact trajectory and the active contact trajectory, collect trajectory deviation parameters and trajectory adjustment parameters, and infer whether the production line movement risk is normal based on parameter analysis; The communication connections of the patch evaluation sub-platform are: The surface patch detection unit is used to mark the flexible circuit board that has completed the patch as the object to be inspected, sort the objects to be inspected according to the production line processing order, collect pictures of the surface of the object to be inspected, and mark the real-time collected pictures as the pictures to be inspected. The position alternation data and position floating data are collected, and the patch detection is inferred based on the data comparison to determine whether it is normal; After the detection is normal, the patch components processed in the current period that are not in the set position are set as the objects to be evaluated for performance; The electrical parameter detection unit is used to mark the flexible circuit board that has completed the patch as the object to be tested, collect electrical impact information, and substitute it into the formula to obtain the real-time detection coefficient of the electrical parameters. According to the comparison of the real-time detection coefficient, it is inferred whether the electrical parameters of the object to be evaluated are normal.

2. According to claim 1, a flexible circuit board patch abnormality detection system is characterized in that: The static level parameter and static gap parameter are respectively the horizontal deviation value of the substrate at the same patch position corresponding to the substrate start image and the real-time end image, and the deviation value between the actual gap distance between the patch at the same patch position and the substrate and the set gap distance.

3. The flexible circuit board patch abnormality detection system according to claim 2 is characterized in that: If the static level parameter exceeds the level deviation value threshold, and the static gap parameter exceeds the gap distance deviation value threshold, a static risk signal is generated; if the static level parameter exceeds the level deviation value threshold, and the static gap parameter does not exceed the gap distance deviation value threshold, a substrate detection signal is generated; If the static level parameter does not exceed the levelness deviation value threshold, and the static gap parameter exceeds the gap distance deviation value threshold, a welding process debugging signal is generated; If the static level parameter does not exceed the levelness deviation value threshold, and the static gap parameter does not exceed the gap distance deviation value threshold, a welding qualified signal is generated.

4. The flexible circuit board patch abnormality detection system according to claim 1 is characterized in that: The trajectory deviation parameter and trajectory adjustment parameter are respectively the numerical ratio of the vertical position deviation distance between the active contact trajectory and the passive contact trajectory before and after the flexible circuit board position offset appears on the passive contact trajectory in the acquired image to the width of the current patch component welding area, and the peak increase span of the offset installation speed of the flexible circuit board for receiving the active contact trajectory adjustment and completing the patch component installation in the production line under the active contact trajectory adjustment frequency after the active contact trajectory in the acquired image is adjusted for the passive contact trajectory.

5. The flexible circuit board patch abnormality detection system according to claim 4 is characterized in that: If the trajectory deviation parameter exceeds the numerical ratio threshold, or the trajectory adjustment parameter exceeds the increase span threshold, a high-risk movement signal is generated; if the trajectory deviation parameter does not exceed the numerical ratio threshold, and the trajectory adjustment parameter does not exceed the increase span threshold, a low-risk movement signal is generated.

6. The flexible circuit board patch abnormality detection system according to claim 1 is characterized in that: The position alternation data and the position floating data are respectively the alternation frequency corresponding to the patch components at the set position and not at the set position in the current image to be inspected, and the reduction span of the peak value ratio corresponding to the peak value of the continuous number of patch components at the set position and not at the set position in the image to be inspected; If the position alternating data exceeds the alternating frequency threshold, a patch invalid signal is generated; if the position floating data exceeds the peak ratio reduction span threshold, a patch inefficient signal is generated; if the position alternating data does not exceed the alternating frequency threshold, and the position floating data does not exceed the peak ratio reduction span threshold, a patch low risk signal is generated.

7. The flexible circuit board patch abnormality detection system according to claim 1 is characterized in that: The electrical impact information includes the difference between the maximum voltage fluctuation span value at any time in any circuit in the circuit board corresponding to the performance object to be evaluated and the performance standard object and the corresponding numerical ratio of the deviation value between the actual voltage and the set voltage at the corresponding time, the deviation of the voltage increase amount of the adjacent circuit during the time consumed for the voltage blocking in the adjacent circuit when the voltage of any circuit in the circuit board corresponding to the performance object to be evaluated and the performance standard object is infinite, and the difference in the proportion of non-short-circuit faults in the circuit board corresponding to the performance object to be evaluated and the performance standard object that cause damage to the circuit board due to continuous voltage abnormality in the circuit.

8. The flexible circuit board patch abnormality detection system according to claim 7 is characterized in that: If the real-time detection coefficient of the electrical parameters exceeds the detection coefficient threshold, the position deviation during the patch process of the current performance object to be evaluated is marked as the tolerable deviation value; if the real-time detection coefficient of the electrical parameters does not exceed the detection coefficient threshold, the position deviation during the patch process of the current performance object to be evaluated is marked as the risk deviation value.

9. A method for detecting abnormality of a patch on a flexible circuit board, characterized in that: A method based on a flexible circuit board patch abnormality detection system as described in any one of claims 1 to 8 above.

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