Ultrasonic probe, adaptive connection method and ultrasonic system

Abstract

The present invention discloses an ultrasonic probe, an adaptive connection method and an ultrasonic system, which relate to the field of ultrasonic technology, and include a piezoelectric element and a load component arranged on the back of the piezoelectric element, a heat sink is arranged on the back of the load component, and a heat conduction component is connected to the heat sink as a whole. By arranging a slidable compensation part structure at the head end of the heat conduction component, after the heat sink contacts the load component, the compensation part is pushed to contact the piezoelectric element by injecting molten rubber, and the molten rubber can pass through the flow holes arranged in the compensation part to fill the unfilled gaps in the load component caused by the existence of the compensation part. In this way, the heat sink can dissipate heat for both the heat conduction component and the load component. The problem in the prior art that the tail end surface of the heat conduction component usually exceeds the back surface of the load component, which makes it difficult for the heat sink to come into close contact with the load component, thereby wasting the large area of ​​contact and heat dissipation of the load component is solved.

Description

Technical Field

[0001] The present invention relates to the field of ultrasonic technology, and in particular to an ultrasonic probe, an adaptive connection method and an ultrasonic system. Background Art

[0002] In recent years, with the development of the wind power industry, the demand for wind power components has increased, and the quality requirements for products have also become higher and higher. Since wind power components are large in size, for example, wind power gears have a diameter of 400mm at the smallest and 2980mm at the largest, large wind power components bring difficulties in defect detection.

[0003] As a non-destructive testing technology, ultrasonic flaw detection technology is often used to detect large wind power components. The detection principle is that when ultrasonic waves encounter the interface of two different media or materials of different densities during propagation, they will be refracted or reflected at the interface. When ultrasonic waves propagate in wind power components, they can be reflected at the internal defects of wind power components and their backs. After the reflected ultrasonic waves pass through the ultrasonic receiver, the sound waves are converted into electrical energy and displayed as waveforms on the screen. According to the position, size and shape of the wave peaks, the position, size and shape of the defects of wind power components can be analyzed.

[0004] The ultrasonic probe used in ultrasonic flaw detection technology includes a piezoelectric element and a load component arranged at the back end of the pressure element. An acoustic matching layer for effectively transmitting and receiving ultrasonic waves is arranged at the front end of the piezoelectric element. A plurality of sheet-shaped heat conduction components are embedded in the load component, and the heat conduction components are in contact with or bonded to the heat sink on the back of the load component.

[0005] When the ultrasonic probe is working, an electric pulse of several hundred volts is applied to the piezoelectric element, causing the piezoelectric element to generate mechanical vibrations and send ultrasonic waves. The heat generated by the piezoelectric element is dissipated through the load component, the heat conduction component and the heat sink.

[0006] The reason for embedding multiple sheet-shaped heat-conducting components in the load component is that the mechanical vibration generated by the piezoelectric element is bidirectional, and the back of the piezoelectric element will send ultrasonic waves. In order to attenuate the ultrasonic waves on the back so that they do not return to the piezoelectric element to interfere with the results, the load component can only use materials that are filled with glass or high polymer hollow bodies to increase attenuation, such as ferrite rubber, or tungsten or aluminum oxide filled in high polymers such as epoxy resin or polyurethane rubber. For this reason, the heat dissipation capacity of the load component is extremely poor (1W / mK), and it can only rely on heat-conducting components (60~600W / mK) made of one of the other materials such as graphite, silicon carbide, copper, etc. with stronger heat dissipation capacity to dissipate heat.

[0007] In actual use, due to the large size of wind power components and the long duration of ultrasonic transmission, the ultrasonic probe is still exposed to temperatures exceeding the applicable temperature (10°C ~ 60°C). As a result, the piezoelectric effect of the piezoelectric element is weakened and the ability to send and receive ultrasonic waves is greatly reduced.

[0008] The reason for this is that the load component is connected under the piezoelectric element and is spaced apart from each other. The gap between them embeds the heat conduction component. The front end of the heat conduction component must be in contact with the piezoelectric element (there is actually an insulating film between the heat conduction component and the piezoelectric element for insulation), and the rear end surface of the heat conduction component must be flush with the back surface of the load component. However, this is difficult because the heat conduction component has errors. Therefore, the rear end surface of the heat conduction component usually exceeds the back surface of the load component. In other words, after the heat conduction component is connected to the heat sink, it is actually difficult for the heat sink to be in close contact with the load component, and the heat dissipation effect of the load component is greatly reduced, wasting the large-area contact heat dissipation of the load component.

[0009] Therefore, it is necessary to further improve the heat dissipation effect of the ultrasonic probe. Summary of the invention

[0010] One of the purposes of the present invention is to solve the problem that in the prior art, the tail end surface of the heat conducting component in the ultrasonic probe usually exceeds the back surface of the load component. After being connected to the heat dissipation block, the heat dissipation block is difficult to be in close contact with the load component, thereby wasting a large area of ​​contact heat dissipation of the load component.

[0011] A second object of the present invention is to provide an adaptive connection method.

[0012] A third object of the present invention is to provide an ultrasonic system.

[0013] To achieve one of the above purposes, the present invention adopts the following technical solution: an ultrasonic probe, comprising a piezoelectric element and a load component arranged on the back side of the piezoelectric element, a ground electrode attached to the front end surface of the piezoelectric element, a signal electrode attached to the back end surface of the piezoelectric element, the load component contacts the signal electrode, a heat conduction component is buried in the gap of the load component, and a heat sink is arranged on the back side of the load component, the heat conduction component is connected to the heat sink as a whole, the heat conduction component and the heat sink are an integrated structure, a protrusion and a compensation portion are arranged at the front end of the main body of the heat conduction component, and the protrusion is slidably embedded in the interlocking cavity of the compensation portion.

[0014] An insulating layer is disposed on the top of the compensation portion.

[0015] A flow hole communicating with the gap of the load component is provided at the bottom end or the side end of the compensation part, and the flow hole is connected to the embedded cavity.

[0016] The diameter of the compensation part is smaller than the main body of the heat conducting component. A fluid gap is formed between the compensation part and the gap side wall of the load component. The fluid gap is communicated with the flow hole.

[0017] The main body of the heat conducting component is provided with a through hole communicating with the fitting cavity, and the heat dissipating block is provided with an injection hole communicating with the through hole.

[0018] Furthermore, in an embodiment of the present invention, the ground electrode and the signal electrode are formed on the front and back sides of the piezoelectric element by evaporating or sputtering gold or silver or sintering silver.

[0019] Furthermore, in an embodiment of the present invention, the top end surface of the compensation portion is a conical annular surface, and the end surface portion of the heat conduction component body hanging out of the compensation portion is a conical surface.

[0020] The ultrasonic probe further includes a coil and an electrode plug-in end, and the ground terminal and the signal terminal are connected to the electrode plug-in end through the coil.

[0021] Furthermore, in an embodiment of the present invention, an outer convex ring is provided at the upper end of the protruding portion, and an inner convex ring is provided at the lower end of the compensating portion, and the inner convex ring is fitted to the side wall of the protruding portion. When the compensating portion slides along the protruding portion, the outer convex ring restricts the inner convex ring to prevent the compensating portion from detaching from the protruding portion.

[0022] A flow gap is formed between the outer convex ring and the compensation portion, a buffer groove is formed between the inner convex ring and the outer convex ring, the flow gap communicates with the interlocking cavity and the buffer groove, and the buffer groove communicates with the flow hole.

[0023] Furthermore, in an embodiment of the present invention, one or more acoustic matching layers are arranged in front of the ground electrode, and a plurality of piezoelectric elements are arranged, and sound insulation is performed between the plurality of piezoelectric elements through a sound insulation layer.

[0024] The beneficial effects of the present invention are:

[0025] The present invention sets a slidable compensation part structure at the head end of the heat conduction component. After the heat sink contacts the load component, the compensation part is pushed to contact the piezoelectric element by injecting molten rubber. Moreover, the molten rubber can pass through the flow holes set in the compensation part to fill the unfilled gaps in the load component caused by the existence of the compensation part. In this way, the heat sink can dissipate heat for both the heat conduction component and the load component. This solves the problem in the prior art that the tail end surface of the heat conduction component usually exceeds the back surface of the load component, making it difficult for the heat sink to make close contact with the load component, thereby wasting a large area of ​​contact and heat dissipation for the load component.

[0026] In addition, the heat sink is connected to the heat conducting component as a whole, which also solves the problem that a connection layer will be formed after the heat sink is connected (bonded or welded) to the heat conducting component, making it difficult for the heat sink to contact the load component, thereby wasting the large area contact heat dissipation of the load component.

[0027] To achieve the second objective, the present invention adopts the following technical solution: an adaptive connection method, the adaptive connection method is based on the ultrasonic probe described in one of the objectives of the invention, and the adaptive connection method comprises the following steps:

[0028] After the piezoelectric element is connected to the load component, it pushes the heat sink connected to the heat conduction component, so that the heat conduction component is inserted into the gap in the load component until the heat sink is in close contact with the back of the load component, and the pushing pressure on the heat sink is continuously maintained.

[0029] Then, molten rubber is injected into the injection hole of the heat dissipation block. The rubber material is the same as that of the load component. The molten rubber enters the fitting cavity of the compensation part through the through hole provided in the main body of the heat conduction component.

[0030] When a gap is retained between the compensation portion of the heat conduction component and the piezoelectric element, the molten rubber entering the fitting cavity pushes the compensation portion forward until the insulating layer in front of the compensation portion contacts the signal electrode of the piezoelectric unit.

[0031] Finally, the molten rubber in the fitting cavity enters the flow hole and flows into the unfilled gap in the load component through the flow hole to fill it.

[0032] Furthermore, in an embodiment of the present invention, in the above steps, when the heat conducting component is inserted downward into the gap in the load component, the outer convex ring of the protruding portion restricts the inner convex ring of the compensating portion to prevent the compensating portion from detaching from the protruding portion.

[0033] Then, when the molten rubber flows into the fitting cavity, the molten rubber enters the buffer grooves of the outer convex ring and the inner convex ring along the flow gap to be filled, and then enters the unfilled gap in the load component along the flow hole.

[0034] Furthermore, in an embodiment of the present invention, in the above steps, after the molten rubber is cooled and solidified, the pushing pressure on the heat sink block is released.

[0035] In order to achieve the third of the above objectives, the present invention adopts the following technical solution: an ultrasonic system, wherein the ultrasonic system has the ultrasonic probe described in one of the above objectives of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the side structure of the ultrasonic probe according to an embodiment of the present invention.

[0037] Figure 2 It is a schematic diagram of the front structure of the ultrasonic probe according to an embodiment of the present invention.

[0038] Figure 3 It is a three-dimensional schematic diagram of the heat dissipation block and the heat conduction component connected according to the embodiment of the present invention.

[0039] Figure 4 FIG. 4 is a schematic diagram of a partial structure of a heat conduction component according to an embodiment of the present invention.

[0040] Figure 5 FIG. 4 is a schematic diagram of a partial structure of another heat conduction component according to an embodiment of the present invention.

[0041] 10. piezoelectric element, 11. ground electrode, 12. signal electrode, 13. ground terminal, 14. signal terminal, 15. acoustic matching layer, 16. sound insulation layer;

[0042] 20. Load components;

[0043] 30. heat conducting component, 301. conical surface, 31. raised portion, 32. compensation portion, 321. conical ring surface, 322. inner convex ring, 33. fitting cavity, 34. flow hole, 35. insulating layer, 36. fluid gap, 37. outer convex ring, 38. flow gap, 39. buffer groove;

[0044] 40. Heat sink;

[0045] 50. Coil. 51. Electrode plug-in terminal. DETAILED DESCRIPTION

[0046] In order to make the purpose and technical solution of the present invention clearly and completely described, and the advantages more clearly understood, the embodiments of the present invention are further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, rather than all of the embodiments, and are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] In the description of the present invention, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "one", "first", "second", "third", "fourth", "fifth", "sixth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0048] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] For the purpose of simplicity and illustration, the principles of the embodiments are described mainly by reference to examples. In the following description, many specific details are proposed to provide a thorough understanding of the embodiments. However, it is obvious. For those of ordinary skill in the art, these embodiments may not be limited to these specific details in practice. In some instances, known adaptive connection methods and structures are not described in detail to avoid making these embodiments unnecessarily difficult to understand. In addition, all embodiments can be used in combination with each other. Example 1

[0050] It should be noted that the drawings in the specification are the contents of the specification. The structural shapes, connection relationships, matching relationships, and positional relationships that can be obtained without any doubt in the drawings in the specification should be understood as the contents of the specification.

[0051] An ultrasonic probe, such as Figure 1 , Figure 2 As shown, it includes a piezoelectric element 10 and a load component 20 arranged on the back of the piezoelectric element 10, a ground electrode 11 is attached to the front end surface of the piezoelectric element 10, a signal electrode 12 is attached to the back end surface of the piezoelectric element 10, the load component 20 contacts the signal electrode 12, a heat conduction component 30 is buried in the gap of the load component 20, and a heat sink 40 is arranged on the back of the load component 20, and the heat conduction component 30 and the heat sink 40 are connected as a whole, and the heat conduction component 30 and the heat sink 40 are an integrated structure.

[0052] like Figure 3 , Figure 4 As shown, a protrusion 31 and a compensation portion 32 are provided at the front end of the main body of the heat conducting component 30 , and the protrusion 31 is slidably embedded in the embedding cavity 33 of the compensation portion 32 .

[0053] like Figure 4 As shown, an insulating layer 35 is disposed at the top of the compensation part 32. A flow hole 34 communicating with the gap of the load component 20 is disposed at the bottom or side of the compensation part 32, and the flow hole 34 communicates with the fitting cavity 33.

[0054] The diameter of the compensation portion 32 is smaller than the main body of the heat conducting component 30 . A fluid gap 36 is formed between the compensation portion 32 and the gap sidewall of the load component 20 . The fluid gap 36 communicates with the flow hole 34 .

[0055] like Figure 2 , Figure 4 As shown, the main body of the heat conducting component 30 is provided with a through hole communicating with the fitting cavity 33 , and the heat dissipating block 40 is provided with an injection hole communicating with the through hole.

[0056] Implementation steps: After the piezoelectric element 10 is connected to the load component 20, the heat sink 40 connected to the heat conduction component 30 is pushed, so that the heat conduction component 30 is inserted into the gap in the load component 20 until the heat sink 40 is in close contact with the back of the load component 20, and the pushing pressure on the heat sink 40 is continuously maintained.

[0057] Then, molten rubber is injected into the injection hole of the heat dissipation block 40 . The rubber material is the same as that of the load component 20 . The molten rubber enters the fitting cavity 33 of the compensation part 32 through the through hole provided in the main body of the heat conduction component 30 .

[0058] The molten rubber material is the same as the load member 20, so the ultrasonic wave will not be refracted or reflected at the interface.

[0059] When a gap remains between the compensation portion 32 of the heat conducting component 30 and the piezoelectric element 10 , the molten rubber entering the fitting cavity 33 pushes the compensation portion 32 forward until the insulating layer 35 in front of the compensation portion 32 contacts the signal electrode 12 of the piezoelectric unit.

[0060] Finally, the molten rubber in the fitting cavity 33 enters the flow hole 34 and flows into the unfilled space in the load component 20 through the flow hole 34 to fill the space.

[0061] The present invention provides a slidable compensation part 32 structure at the head end of the heat conducting component 30. After the heat dissipation block 40 contacts the load component 20, the compensation part 32 is pushed to contact the piezoelectric element 10 by injecting molten rubber. Moreover, the molten rubber can pass through the flow hole 34 provided on the compensation part 32 to fill the unfilled gap in the load component 20 caused by the existence of the compensation part 32. In this way, the heat dissipation block 40 can dissipate heat for both the heat conducting component 30 and the load component 20. This solves the problem in the prior art that the tail end surface of the heat conducting component 30 usually exceeds the back surface of the load component 20, which makes it difficult for the heat dissipation block 40 to make close contact with the load component 20, thereby wasting the large area of ​​contact and heat dissipation of the load component 20.

[0062] In addition, the heat sink 40 is connected to the heat conducting component 30 as a whole, which also solves the problem that a connection layer will be formed after the heat sink 40 and the heat conducting component 30 are connected (bonded or welded), making it difficult for the heat sink 40 to contact the load component 20, thereby wasting a large area of ​​contact heat dissipation for the load component 20.

[0063] Specifically, the ground electrode 11 and the signal electrode 12 are formed on the front and back surfaces of the piezoelectric element 10 by evaporating or sputtering gold or silver or sintering silver.

[0064] Specifically, Figure 3 , Figure 4 As shown, the top end surface of the compensation portion 32 is a conical annular surface 321 , and the end surface portion of the main body of the heat conducting component 30 hanging out of the compensation portion 32 is divided into a conical surface 301 .

[0065] The compensation part 32, the protrusion 31 and the main body of the heat conduction component 30 are made of the same material, but the heat conduction component 30 and the load component 20 are made of different materials. The ultrasonic wave is directed downward, and the cone ring surface 321 and the cone surface 301 function to refract the ultrasonic wave, so that when the ultrasonic wave encounters the interface between two different media or materials with different densities (there is an insulating layer 35 in front of the compensation part 32), it is reflected at the interface.

[0066] It should be noted that providing the conical surface 301 to refract ultrasonic waves is a solution disclosed and commonly used in the prior art (refer to CN100563577C).

[0067] Specifically, a ground terminal 13 and a signal terminal 14 are provided on both sides of the piezoelectric element 10 . The ground terminal 13 is connected to the ground electrode 11 , and the signal terminal 14 is connected to the signal electrode 12 .

[0068] The ultrasonic probe further includes a coil 50 and an electrode plug-in terminal 51 , and the ground terminal 13 and the signal terminal 14 are connected to the electrode plug-in terminal 51 through the coil 50 .

[0069] Specifically, Figure 5 As shown, an outer convex ring 37 is provided at the upper end of the protruding portion 31, and an inner convex ring 322 is provided at the lower end of the compensating portion 32. The inner convex ring 322 is fitted to the side wall of the protruding portion 31. When the compensating portion 32 slides along the protruding portion 31, the outer convex ring 37 restricts the inner convex ring 322 to prevent the compensating portion 32 from detaching from the protruding portion 31.

[0070] A flow gap 38 is formed between the outer convex ring 37 and the compensation portion 32 , a buffer groove 39 is formed between the inner convex ring 322 and the outer convex ring 37 , the flow gap 38 communicates with the interlocking cavity 33 and the buffer groove 39 , and the buffer groove 39 communicates with the flow hole 34 .

[0071] Specifically, Figure 2As shown, one or more acoustic matching layers 15 are arranged in front of the ground electrode 11, and a plurality of piezoelectric elements 10 are arranged, and sound insulation layers 16 are used to isolate the plurality of piezoelectric elements 10 from each other. Example 2

[0072] An adaptive connection method is provided. The adaptive connection method is based on the ultrasonic probe in the above embodiment 1. The adaptive connection method comprises the following steps:

[0073] After the piezoelectric element 10 is connected to the load component 20, the heat sink 40 connected to the heat conduction component 30 is pushed, so that the heat conduction component 30 is inserted into the gap in the load component 20 until the heat sink 40 is in close contact with the back of the load component 20, and the pushing pressure on the heat sink 40 is continuously maintained.

[0074] Then, molten rubber is injected into the injection hole of the heat dissipation block 40 . The rubber material is the same as that of the load component 20 . The molten rubber enters the fitting cavity 33 of the compensation part 32 through the through hole provided in the main body of the heat conduction component 30 .

[0075] The molten rubber material is the same as the load member 20, so the ultrasonic wave will not be refracted or reflected at the interface.

[0076] When a gap remains between the compensation portion 32 of the heat conducting component 30 and the piezoelectric element 10 , the molten rubber entering the fitting cavity 33 pushes the compensation portion 32 forward until the insulating layer 35 in front of the compensation portion 32 contacts the signal electrode 12 of the piezoelectric unit.

[0077] Finally, the molten rubber in the fitting cavity 33 enters the flow hole 34 and flows into the unfilled space in the load component 20 through the flow hole 34 to fill the space.

[0078] The present invention provides a slidable compensation part 32 structure at the head end of the heat conducting component 30. After the heat dissipation block 40 contacts the load component 20, the compensation part 32 is pushed to contact the piezoelectric element 10 by injecting molten rubber. Moreover, the molten rubber can pass through the flow hole 34 provided on the compensation part 32 to fill the unfilled gap in the load component 20 caused by the existence of the compensation part 32. In this way, the heat dissipation block 40 can dissipate heat for both the heat conducting component 30 and the load component 20. This solves the problem in the prior art that the tail end surface of the heat conducting component 30 usually exceeds the back surface of the load component 20, which makes it difficult for the heat dissipation block 40 to make close contact with the load component 20, thereby wasting the large area of ​​contact and heat dissipation of the load component 20.

[0079] In addition, the heat sink 40 is connected to the heat conducting component 30 as a whole, which also solves the problem that a connection layer will be formed after the heat sink 40 and the heat conducting component 30 are connected (bonded or welded), making it difficult for the heat sink 40 to contact the load component 20, thereby wasting a large area of ​​contact heat dissipation for the load component 20.

[0080] Specifically, in the above steps, when the heat conducting component 30 is inserted downward into the gap in the load component 20 , the outer convex ring 37 of the protruding portion 31 restricts the inner convex ring 322 of the compensating portion 32 to prevent the compensating portion 32 from being separated from the protruding portion 31 .

[0081] Then, when the molten rubber flows into the fitting cavity 33, the molten rubber enters the buffer groove 39 of the outer convex ring 37 and the inner convex ring 322 along the flow gap 38 to fill the gap, and then enters the unfilled gap in the load component 20 along the flow hole 34. The present invention is applicable to more connection methods.

[0082] More specifically, in the above steps, when the molten rubber is cooled and solidified, the pushing pressure on the heat sink 40 is released. Example 3

[0083] An ultrasonic system comprises the ultrasonic probe in the first embodiment.

[0084] Although the above describes the illustrative specific embodiments of the present invention so that those skilled in the art can understand the present invention, the present invention is not limited to the scope of the specific embodiments. For those of ordinary skill in the art, as long as various changes are within the spirit and scope of the present invention as defined and determined by the attached claims, all inventions and creations using the concepts of the present invention are protected.

Claims

1. An ultrasonic probe, comprising a piezoelectric element and a load component arranged on the back of the piezoelectric element, wherein a ground electrode is attached to the front end surface of the piezoelectric element, a signal electrode is attached to the back end surface of the piezoelectric element, the load component contacts the signal electrode, a heat conduction component is buried in a gap of the load component, and a heat sink is arranged on the back of the load component, characterized in that: The heat conducting component is connected to the heat dissipation block as a whole, and the heat conducting component and the heat dissipation block are an integrated structure. The front end of the main body of the heat conducting component is provided with a protrusion and a compensation part, and the protrusion is slidably embedded in the embedding cavity of the compensation part; An insulating layer is disposed on the top of the compensation portion; A flow hole communicating with the gap of the load component is provided at the bottom or side of the compensation part, and the flow hole communicates with the fitting cavity; The diameter of the compensation part is smaller than the main body of the heat conducting component, a fluid gap is formed between the compensation part and the gap side wall of the load component, and the fluid gap is communicated with the flow hole; The main body of the heat conducting component is provided with a through hole communicating with the fitting cavity, and the heat dissipating block is provided with an injection hole communicating with the through hole.

2. The ultrasonic probe according to claim 1, characterized in that: The ground electrode and the signal electrode are formed on the front and back surfaces of the piezoelectric element by evaporating or sputtering gold or silver or sintering silver.

3. The ultrasonic probe according to claim 1, characterized in that: The top end surface of the compensation portion is a conical annular surface, and the end surface portion of the heat conduction component body hanging out of the compensation portion is a conical surface.

4. The ultrasonic probe according to claim 1, characterized in that: A ground terminal and a signal terminal are provided on both sides of the piezoelectric element, the ground terminal is connected to the ground electrode, and the signal terminal is connected to the signal electrode; The ultrasonic probe further comprises a coil and an electrode plug-in end, and the ground terminal and the signal terminal are connected to the electrode plug-in end through the coil.

5. The ultrasonic probe according to claim 1, characterized in that: An outer convex ring is disposed at the upper end of the protruding portion, and an inner convex ring is disposed at the lower end of the compensating portion. The inner convex ring is fitted to the side wall of the protruding portion. When the compensating portion slides along the protruding portion, the outer convex ring restricts the inner convex ring to prevent the compensating portion from detaching from the protruding portion. A flow gap is formed between the outer convex ring and the compensation portion, a buffer groove is formed between the inner convex ring and the outer convex ring, the flow gap communicates with the interlocking cavity and the buffer groove, and the buffer groove communicates with the flow hole.

6. The ultrasonic probe according to claim 1, characterized in that: One or more acoustic matching layers are arranged in front of the ground electrode. A plurality of piezoelectric elements are arranged, and sound insulation is performed between the plurality of piezoelectric elements through a sound insulation layer.

7. An adaptive connection method, characterized in that: The adaptive connection method is based on the ultrasonic probe described in any one of claims 1 to 6, and the adaptive connection method comprises the following steps: After the piezoelectric element is connected to the load component, the heat sink block connected to the heat conduction component is pushed, so that the heat conduction component is inserted into the gap in the load component until the heat sink block is in close contact with the back of the load component, and the pushing pressure on the heat sink block is continuously maintained; Then, molten rubber is injected into the injection hole of the heat dissipation block. The material of the rubber is the same as that of the load component. The molten rubber enters the fitting cavity of the compensation part through the through hole provided in the main body of the heat conduction component. When a gap is retained between the compensation part of the heat conducting component and the piezoelectric element, the molten rubber entering the fitting cavity pushes the compensation part forward until the insulating layer in front of the compensation part contacts the signal electrode of the piezoelectric unit; Finally, the molten rubber in the fitting cavity enters the flow hole and flows into the unfilled gap in the load component through the flow hole to fill it.

8. The adaptive connection method according to claim 7, characterized in that: In the above steps, when the heat conducting component is inserted downward into the gap in the load component, the outer convex ring of the protruding part restricts the inner convex ring of the compensating part to prevent the compensating part from being separated from the protruding part; Then, when the molten rubber flows into the fitting cavity, the molten rubber enters the buffer grooves of the outer convex ring and the inner convex ring along the flow gap to be filled, and then enters the unfilled gap in the load component along the flow hole.

9. The adaptive connection method according to claim 8, characterized in that: In the above steps, when the molten rubber is cooled and solidified, the pushing pressure on the heat sink block can be released.

10. An ultrasonic system, characterized in that: The ultrasonic system comprises the ultrasonic probe described in any one of claims 1 to 6.

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