A femtosecond laser processing method for synergistically improving surface integrity and bonding strength

Abstract

The present invention belongs to the technical field of femtosecond laser surface treatment, and aims to provide a femtosecond laser processing method for synergistically improving surface integrity and bonding strength. The present invention includes: constructing a bionic structure model matching the adherend according to the characteristic parameters of the adherend and the processing parameters for adhesive bonding processing to be performed on the adherend; based on the bionic structure model, obtaining a surface processing path for femtosecond laser processing of the adherend; obtaining target femtosecond laser strengthening process parameters matching the adherend; based on the target femtosecond laser strengthening process parameters, using a femtosecond laser to perform surface micro-nano structure processing operations on the adherend, and when performing the surface micro-nano structure processing operations, the femtosecond laser processing path on the surface of the adherend is consistent with the surface processing path, so as to obtain the adherend after surface treatment. The processing of the present invention has high precision, strong controllability, and at the same time, small environmental pollution, and can realize the synergistic improvement of bonding strength and surface integrity performance.

Description

Technical Field

[0001] The present invention belongs to the technical field of femtosecond laser surface treatment, and particularly relates to a femtosecond laser processing method for synergistically improving surface integrity and bonding strength. Background Art

[0002] The cementing connection technology is a technology that uses special adhesives to connect different material components together. It can effectively connect materials such as metals to form a strong bonding structure (which can be called a "bonded joint"), reduce stress concentration problems, and has low cost, high strength and high damage tolerance. Currently, it has been widely used in fields such as aerospace, electronics and medicine.

[0003] In practical applications, due to insufficient bonding strength at the bonding interface, the bonded joint often fails prematurely during service. To improve the bonding strength between the adhered components in the bonded joint, in the prior art, before bonding the adhered components with an adhesive, traditional surface treatment methods such as mechanical treatment, chemical treatment and plasma treatment are usually used to perform surface treatment on the adhered components to form a surface structure that can change the surface roughness and surface contact angle of the adhered components, thereby increasing the bonding strength of the bonding interface between the adhered components. However, in the process of using the prior art, the inventor found that there are at least the following problems in the prior art:

[0004] Using traditional surface treatment methods has uncontrollable problems. It is impossible to achieve precise control of the micro-nano structure processing on the surface of the adhered components, which will generate uncontrollable surface defects on the bonding interface of the adhered components. And the uncontrollable surface defects will inevitably greatly reduce the surface integrity properties such as the microhardness, residual stress and fatigue strength of the bonding interface, thereby reducing the service life of the bonded joint; in addition, traditional surface treatment methods will also generate consumables that pollute the environment, resulting in environmental pollution problems. Summary of the Invention

[0005] The present invention aims to solve at least to some extent the above technical problems, and provides a femtosecond laser processing method for synergistically improving surface integrity and bonding strength.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a femtosecond laser processing method for synergistically improving surface integrity and bonding strength, including:

[0008] According to the characteristic parameters of the adhered component and the processing parameters for the adhesive bonding processing to be performed on the adhered component, a bionic structure model matching the adhered component is constructed; wherein, the characteristic parameters include the material type.

[0009] Based on the bionic structure model, obtain the surface processing path for femtosecond laser processing of the adherend component;

[0010] According to the material type of the adherend component, obtain the target femtosecond laser strengthening process parameters matching the adherend component from a preset strengthening database;

[0011] Based on the target femtosecond laser strengthening process parameters, use a femtosecond laser to perform surface micro-nano structure processing operations on the adherend component, and when performing the surface micro-nano structure processing operations, the femtosecond laser processing path on the surface of the adherend component is consistent with the surface processing path, so as to obtain the adherend component after surface treatment.

[0012] In a possible design, the characteristic parameters further include structural parameters, and the processing parameters include application scenario information and bonding interface position information; correspondingly, according to the characteristic parameters of the adherend component and the processing parameters for adhesive bonding processing to be performed on the adherend component, construct a bionic structure model matching the adherend component, including:

[0013] According to the structural parameters, construct a three-dimensional structure model of the adherend component;

[0014] Obtain the target interface structure type of the adherend component according to the application scenario information, and obtain the interface structure model parameters matching the target interface type according to the bonding interface position information;

[0015] Based on the interface structure model parameters, construct a surface micro-nano structure model at the bonding interface of the three-dimensional structure model;

[0016] According to the three-dimensional structure model and the surface micro-nano structure model, obtain a bionic structure model matching the adherend component.

[0017] In a possible design, obtaining a bionic structure model matching the adherend component according to the three-dimensional structure model and the surface micro-nano structure model includes:

[0018] Perform a bonding strength simulation test on the surface micro-nano structure model so as to optimize the surface micro-nano structure model and obtain an optimized surface micro-nano structure model;

[0019] Perform a combination process on the three-dimensional structure model and the optimized surface micro-nano structure model to obtain a bionic structure model matching the adherend component.

[0020] In a possible design, the strengthening database stores femtosecond laser strengthening process parameters corresponding to different material types, and any one of the femtosecond laser strengthening process parameters includes laser power, scanning speed, repetition frequency, and spot overlap rate.

[0021] In a possible design, before the femtosecond laser is used to perform surface micro-nano structure processing on the adhered component based on the target femtosecond laser strengthening process parameters, the method further includes:

[0022] Ultrasonically cleaning the adhered component with an ultrasonic cleaner;

[0023] Using an ethyl acetate solution to perform secondary cleaning on the bonding interface of the adhered component after ultrasonic cleaning;

[0024] Drying the adhered component after secondary cleaning.

[0025] In a possible design, after obtaining the adhered component after surface treatment, the method further includes:

[0026] Performing glue application on the adhered component after surface treatment to obtain a bonded joint.

[0027] In a possible design, after obtaining the bonded joint, the method further includes:

[0028] Testing the adhesive performance of the bonded joint.

[0029] In a second aspect, the present invention provides a femtosecond laser processing system for synergistically improving surface integrity and bonding strength, which is used to implement the femtosecond laser processing method for synergistically improving surface integrity and bonding strength as described in any one of the above; the femtosecond laser processing system for synergistically improving surface integrity and bonding strength includes:

[0030] A model construction module, which constructs a bionic structure model matching the adhered component according to the characteristic parameters of the adhered component and the processing parameters for the adhered component to be bonded and processed; wherein, the characteristic parameters include the material type;

[0031] A processing path confirmation module, which is communicatively connected to the model construction module and is used to obtain the surface processing path for performing femtosecond laser processing on the adhered component based on the bionic structure model;

[0032] A process parameter acquisition module, which is used to acquire the target femtosecond laser strengthening process parameters matching the adhered component from a preset strengthening database according to the material type of the adhered component;

[0033] The surface processing driving module is respectively communicatively connected to the processing path confirmation module and the process parameter acquisition module, and is used to perform surface micro-nano structure processing operations on the adhered component by using a femtosecond laser based on the target femtosecond laser strengthening process parameters. When performing the surface micro-nano structure processing operations, the femtosecond laser processing path on the surface of the adhered component is consistent with the surface processing path, so as to obtain the adhered component after surface treatment.

[0034] In a third aspect, the present invention provides an electronic device, including:

[0035] A memory for storing computer program instructions; and a processor for executing the computer program instructions to complete the operations of the femtosecond laser processing method for cooperatively improving surface integrity and bonding strength as described in any one of the above.

[0036] In a fourth aspect, the present invention provides a computer program product, including a computer program or instructions, and the computer program or the instructions, when executed by a computer, implement the femtosecond laser processing method for cooperatively improving surface integrity and bonding strength as described in any one of the above.

[0037] The beneficial effects of the present invention are as follows:

[0038] The present invention discloses a femtosecond laser processing method, system, device and product for synergistically improving surface integrity and bonding strength. By using high-energy and short-pulse femtosecond laser, the present invention realizes the processing of micro-nano structures on the surface of the adhered component, with high processing precision, strong controllability and little environmental pollution. Compared with the prior art, the defects of the surface structure of the adhered component can be greatly reduced. At the same time, the high-pressure shock wave induced by the femtosecond laser forms residual compressive stress on the surface of the adhered component, thereby realizing the synergistic improvement of bonding strength and surface integrity performance and prolonging the overall service life of the bonded joint. Specifically, in the implementation process of the present invention, first, according to the characteristic parameters of the adhered component and the processing parameters for the adhered component to be adhesively processed, a bionic structure model matching the adhered component is constructed; then, based on the bionic structure model, the surface processing path for femtosecond laser processing of the adhered component is obtained; at the same time, according to the material type of the adhered component, the target femtosecond laser strengthening process parameters matching the adhered component are obtained from a preset strengthening database; finally, based on the target femtosecond laser strengthening process parameters, a femtosecond laser is used to perform surface micro-nano structure processing operations on the adhered component, and when performing the surface micro-nano structure processing operations, the femtosecond laser processing path on the surface of the adhered component is consistent with the surface processing path, so as to obtain the adhered component after surface treatment. Based on this, the processing of the present invention has high efficiency, little environmental pollution, high processing precision and little thermal influence, can realize the precise processing of micro-nano structures on the surface of the adhered component, synergistically improve the surface integrity performance of the bonding interface while improving the bonding strength of the bonding interface, solves the technical problems of uncontrollable processing structure and damage to surface integrity performance in traditional surface treatment methods, and has strong process advantages.

[0039] Other beneficial effects of the present invention will be further described in the specific implementation manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a flowchart of a femtosecond laser processing method for synergistically improving surface integrity and bonding strength in an embodiment;

[0041] Figure 2 is a block diagram of a femtosecond laser processing system for synergistically improving surface integrity and bonding strength in an embodiment;

[0042] Figure 3 is a block diagram of an electronic device in an embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0043] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be briefly introduced below in conjunction with the accompanying drawings and the description of the embodiments or the prior art. Obviously, the following description of the structure of the drawings is only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. It should be noted here that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation to the present invention.

[0044] Embodiment 1:

[0045] This embodiment discloses a femtosecond laser processing method for synergistically improving surface integrity and bonding strength, which can be but is not limited to being executed by a computer device or virtual machine with certain computing resources, such as an electronic device like a personal computer, smartphone, personal digital assistant, or wearable device, or by a virtual machine.

[0046] As Figure 1 shown, a femtosecond laser processing method for synergistically improving surface integrity and bonding strength can be but is not limited to including the following steps:

[0047] S1. According to the characteristic parameters of the adhered component and the processing parameters for the adhesive bonding processing to be performed on the adhered component, a bionic structure model matching the adhered component is constructed; wherein, the characteristic parameters include the material type; it should be understood that in this embodiment, the adhered component may include two elements to be adhered together, and at this time, the material type of the adhered component is a combination composed of the material types of the respective elements to be adhered, which is not limited herein.

[0048] In this embodiment, the characteristic parameters further include structural parameters, and the processing parameters include application scenario information and adhesive bonding interface position information; correspondingly, in step S1, according to the characteristic parameters of the adhered component and the processing parameters for the adhesive bonding processing to be performed on the adhered component, constructing a bionic structure model matching the adhered component includes:

[0049] S101. According to the structural parameters, a three-dimensional structure model of the adhered component is constructed; specifically, in the implementation process, the three-dimensional structure model of the adhered component can be constructed by but is not limited to using CAD software.

[0050] S102. Obtain the target interface structure type of the adherend according to the application scenario information, and obtain the interface structure model parameters matching the target interface type according to the adhesive interface position information; It should be understood that in the implementation process, different interface structure types can be pre-matched according to different application scenarios, so as to construct a bionic structure model according to different processing parameters. In this embodiment, the interface structure type is a type of surface micro-nano structure that can improve the adhesive strength of the adhesive interface and is designed in advance according to bionics science.

[0051] S103. Based on the interface structure model parameters, construct a surface micro-nano structure model on the adhesive interface of the three-dimensional structure model;

[0052] S104. Obtain a bionic structure model matching the adherend according to the three-dimensional structure model and the surface micro-nano structure model.

[0053] It should be noted that in this embodiment, a surface micro-nano structure model is constructed on the adhesive interface of the three-dimensional structure model through a preset simulation analysis software, and then a bionic structure model matching the adherend is obtained; Specifically, in this embodiment, the simulation analysis software is implemented using Abaqus software (a general-purpose nonlinear finite element simulation analysis software) for simulation structure modeling and simulation optimization.

[0054] Specifically, in step S104, obtaining a bionic structure model matching the adherend according to the three-dimensional structure model and the surface micro-nano structure model includes:

[0055] S1041. Conduct a simulation test on the adhesive strength of the surface micro-nano structure model to optimize the surface micro-nano structure model; It should be noted that in this embodiment, conducting a simulation test on the adhesive strength of the surface micro-nano structure model is also to verify the feasibility of improving the adhesive strength of the corresponding surface micro-nano structure of the surface micro-nano structure model, so as to ensure that the formation of the surface micro-nano structure can play a positive feedback role in the interface adhesive strength of the adherend.

[0056] It should also be noted that when performing the bonding strength simulation test on the surface micro-nano structure model, it is necessary to perform the simulation according to the determined application scenario information, that is, the adhesive scenario, in accordance with the preset adhesive steps in the simulation analysis software. During this process, it is necessary to preset parameters such as the analysis step, loading method, and boundary conditions in the simulation analysis software so that the simulation analysis software can perform the bonding strength simulation test on the surface micro-nano structure model. During the simulation test, by modifying the surface structure parameters such as the groove spacing and depth on the surface micro-nano structure model, and comparing to obtain the surface structure parameter values with the best test effect, the geometric model of the surface micro-nano structure model can also be modified according to the simulation results, that is, the optimal surface structure parameter values, so as to obtain the optimized surface micro-nano structure model.

[0057] S1042. Combine the three-dimensional structure model and the optimized surface micro-nano structure model to obtain a bionic structure model that matches the adherend.

[0058] It should be noted that in this embodiment, the scheme for optimizing the surface micro-nano structure model can help to further improve the bonding strength and other characteristics of the surface structure of the subsequent adherend.

[0059] In this embodiment, during the process of constructing a bionic structure model that matches the adherend, the three-dimensional structure model of the adherend is constructed first, then the surface micro-nano structure model is constructed, and then the surface micro-nano structure model is optimized to obtain the final bionic structure model. Based on this, the working accuracy of the femtosecond laser for surface micro-nano structure processing of the adherend can be improved, and at the same time, it is beneficial to enhance the bonding strength and other characteristics of the surface micro-nano structure of the finally obtained adherend.

[0060] S2. Based on the bionic structure model, obtain the surface processing path for femtosecond laser processing of the adherend, so as to realize the processing of the surface micro-nano structure of the bionic structure model based on the surface processing path.

[0061] S3. According to the material type of the adherend, obtain the target femtosecond laser strengthening process parameters that match the adherend from the preset strengthening database; it should be noted that in this embodiment, the adherend is a material or part that needs to be bonded by cementing technology.

[0062] In step S1, if the material type of any element to be bonded in the bonded component is copper alloy, titanium alloy, aluminum alloy or nickel-based superalloy; correspondingly, in step S3, the enhanced database stores femtosecond laser enhancement process parameters corresponding to different material types, and any of the femtosecond laser enhancement process parameters includes laser power, scanning speed, repetition frequency and spot overlap rate. It should be noted that since different metal materials usually have different damage thresholds and ablation thresholds, different femtosecond laser enhancement process parameters are required. Therefore, in this embodiment, femtosecond laser enhancement process parameters set for different material types are pre-stored. As an example, when the material type of the bonded component is titanium alloy, in the corresponding target femtosecond laser enhancement process parameters, the enhancement power density must reach 7 GW / cm 2 or more; when the material types of the bonded component are aluminum alloy and titanium alloy, in the corresponding target femtosecond laser enhancement process parameters, the enhancement power density must reach 9 GW / cm 2 or more.

[0063] S4. Based on the target femtosecond laser enhancement process parameters, use a femtosecond laser to perform surface micro-nano structure processing on the bonded component, and when performing the surface micro-nano structure processing, the femtosecond laser processing path on the surface of the bonded component is the same as the surface processing path, so as to obtain the bonded component after surface treatment. It should be noted that in this embodiment, before performing the surface micro-nano structure processing on the bonded component, the bonded component should be pre-cleaned and dried on the surface to ensure that the surface of the bonded component is free of impurity contamination. In addition, after the bonded component is cleaned and dried on the surface, the thickness of the bonded component should be re-measured to ensure the accuracy of the surface micro-nano structure processing.

[0064] Specifically, in step S4, before using a femtosecond laser to perform surface micro-nano structure processing on the bonded component based on the target femtosecond laser enhancement process parameters, the method further includes:

[0065] Ultrasonically clean the bonded component with an ultrasonic cleaner;

[0066] Use ethyl acetate solution to perform secondary cleaning on the bonding interface of the bonded component after ultrasonic cleaning;

[0067] Dry the bonded component after secondary cleaning.

[0068] Based on the above surface cleaning and drying treatment process, the two cleanings can improve the cleaning effect of the bonded component, thereby ensuring that the surface of the bonded component is free of impurity contamination.

[0069] It should also be understood that in this embodiment, after the surface of the adhered component is cleaned and dried, its thickness needs to be re-measured to ensure that the laser energy can be focused on the surface of the adhered component, so as to perform efficient femtosecond laser processing on it.

[0070] In step S4, after obtaining the adhered component after surface treatment, the method further includes:

[0071] S5. Perform a gluing operation on the adhered component after surface treatment to obtain a glued joint by processing.

[0072] It should be noted that in this embodiment, during the process of performing a gluing operation on the adhered component after surface treatment, processes such as glue formulation and gluing should all meet the corresponding national standards, and at the same time, the operators should wear gas masks.

[0073] In this embodiment, after obtaining the glued joint by processing, the method further includes:

[0074] S6. Perform a test on the adhesive performance of the glued joint.

[0075] It should be noted that performing a test on the adhesive performance of the glued joint helps to further determine whether the glued joint meets the expected performance requirements to ensure the quality of the gluing operation.

[0076] It should be noted that traditional physical and chemical methods cannot precisely control the surface morphology of materials to prepare surface micro-nano bionic structures that meet the conditions. The femtosecond laser has an extremely narrow pulse width, extremely high energy density, and an extremely short interaction time with materials, which will produce a mechanism almost completely different from that of conventional laser processing and can achieve sub-micron and nano-scale manufacturing, ultra-high-precision manufacturing, and full-material manufacturing.

[0077] In this embodiment, high-energy and short-pulse femtosecond lasers are used to process the surface micro-nano structures of the components to be bonded. The processing has high precision, strong controllability, and little environmental pollution. Compared with the prior art, it can greatly reduce the defects of the surface structures of the components to be bonded. At the same time, the high-pressure shock wave induced by the femtosecond laser forms residual compressive stress on the surface of the components to be bonded, so as to achieve the synergistic improvement of the bonding strength and the surface integrity performance, and extend the overall service life of the bonded joint. Specifically, in the implementation process of this embodiment, first, according to the characteristic parameters of the components to be bonded and the processing parameters for the bonding processing to be performed on the components to be bonded, a bionic structure model matching the components to be bonded is constructed; then, based on the bionic structure model, the surface processing path for the femtosecond laser processing of the components to be bonded is obtained; at the same time, according to the material type of the components to be bonded, the target femtosecond laser strengthening process parameters matching the components to be bonded are obtained from a preset strengthening database; finally, based on the target femtosecond laser strengthening process parameters, a femtosecond laser is used to perform surface micro-nano structure processing operations on the components to be bonded, and when performing the surface micro-nano structure processing operations, the femtosecond laser processing path on the surface of the components to be bonded is consistent with the surface processing path, so as to obtain the components to be bonded after surface treatment. Based on this, the processing of this embodiment has high efficiency, little environmental pollution, high processing precision and little thermal influence, can realize the precision processing of the surface micro-nano structures of the components to be bonded, and while improving the bonding strength of the bonding interface, synergistically improve the surface integrity performance of the bonding interface, solving the technical problems of uncontrollable processing structures and damage to the surface integrity performance in the traditional surface treatment methods, and having strong process advantages.

[0078] The following gives an application example of this application:

[0079] S1. When the application scenario of the adhered component is a pneumatic valve sealing flap and the material type is aluminum bronze, the structural parameters of aluminum bronze and rubber are preset in advance. According to the corresponding application scenario, the interface structure type of the bonding interface can be a linear or circular stripe-shaped bionic functional surface that matches the biological form of an octopus sucker, and the interface structure model parameters corresponding to the morphological and structural characteristics of the non-smooth surface of the sucker are determined. Then, a bilinear bonding model is adopted for the simulation analysis software, and a static general analysis step is used for model simulation to obtain a surface micro-nano structure model that matches the adhered component. Subsequently, based on the conclusion that factors such as the shape, distribution, and quantity of the grooves on the lower cavity surface of the sucker in the simulation structure model affect the excellent sealing function of the sucker structure, a variety of surface micro-nano structure models are initially designed by controlling various variables such as shape, distribution, and quantity. The relevant parameters of these various surface micro-nano structure models are shown in Table 1 below. Then, through the bonding strength simulation test of various surface micro-nano structure models, the optimal solutions 8 and 15 are selected as the optimized surface micro-nano structure models that match the adhered component. Finally, a simulation structure model can be obtained based on the three-dimensional structure models of the optimized surface micro-nano structure model and the adhered component.

[0080] Table 1 Multiple bionic structure models

[0081]

[0082] S2. Based on the bionic structure model, obtain the surface processing path for femtosecond laser processing of the adhered component. In this embodiment, the determined surface processing path includes a line scan and a circular scan path.

[0083] S3. According to the material type of the adhered component, that is, aluminum bronze, obtain the target femtosecond laser strengthening process parameters that match the adhered component from the preset strengthening database. The target femtosecond laser strengthening process parameters corresponding to aluminum bronze include: wavelength 1030nm, spot diameter 30μm, pulse width 300fs, repetition frequency 100KHz, laser power 3w, spot overlap rate 33.3%, and number of scans 3 times.

[0084] S4. After the surface of the adhered component is cleaned and dried, based on the target femtosecond laser strengthening process parameters, use a femtosecond laser to perform surface micro-nano structure processing operations on the adhered component, and the femtosecond laser processing path on the surface of the adhered component during the surface micro-nano structure processing operation is consistent with the surface processing path, so as to obtain the adhered component after surface treatment.

[0085] In step S4, during the process of cleaning and drying the adherend, first add distilled water to an ultrasonic cleaner, then place the adherend in the ultrasonic cleaner for ultrasonic cleaning. After cleaning, take out the adherend from the ultrasonic cleaner, then use ethyl acetate to perform secondary cleaning on the bonding interface of the adherend, and finally place it at room temperature for drying, thereby completing the cleaning and drying operation to ensure that the surface of the adherend is free of impurity contamination.

[0086] During the process of surface micro-nano structure processing of the adherend, according to the thickness of the adherend, determine the focal position of the femtosecond laser, and based on the target femtosecond laser strengthening process parameters, set the laser power range of the femtosecond laser to be 3 - 9W and the repetition frequency to be 50 - 150KHz, so that the laser power density is higher than the damage threshold of the material, and at the same time, there are fewer remelting impurities generated by the thermal effect; in addition, through the determined linear or circular stripe-shaped optimization scheme, determine the femtosecond laser processing path during the operation of the femtosecond laser as a line scan and circular scan path, and then process the surface of the adherend, so that the surface of the adherend forms a surface micro-nano structure scheme matching the bionic structure model.

[0087] Example 2:

[0088] This example discloses a femtosecond laser processing system for synergistically improving surface integrity and bonding strength, which is used to implement the femtosecond laser processing method for synergistically improving surface integrity and bonding strength in Example 1; as Figure 2 shown, the femtosecond laser processing system for synergistically improving surface integrity and bonding strength includes:

[0089] A model construction module, which constructs a bionic structure model matching the adherend according to the characteristic parameters of the adherend and the processing parameters for adhesive bonding processing of the adherend; wherein, the characteristic parameters include the material type;

[0090] A processing path confirmation module, which is communicatively connected to the model construction module and is used to obtain the surface processing path for femtosecond laser processing of the adherend based on the bionic structure model;

[0091] A process parameter acquisition module, which is used to obtain the target femtosecond laser strengthening process parameters matching the adherend from a preset strengthening database according to the material type of the adherend;

[0092] The surface processing driving module is respectively communicatively connected to the processing path confirmation module and the process parameter acquisition module, and is configured to perform surface micro-nano structure processing operations on the adhered component by using a femtosecond laser based on the target femtosecond laser strengthening process parameters, and the femtosecond laser processing path on the surface of the adhered component during the surface micro-nano structure processing operation is consistent with the surface processing path, so as to obtain the adhered component after surface treatment.

[0093] It should be noted that for the working process, working details and technical effects of the femtosecond laser processing system for synergistically improving surface integrity and bonding strength provided in Embodiment 2, reference can be made to Embodiment 1, and details will not be repeated here.

[0094] Embodiment 3:

[0095] Based on Embodiment 1 or 2, this embodiment discloses an electronic device, which may be a smart phone, a tablet computer, a laptop computer, a desktop computer, etc. The electronic device may be referred to as a user terminal, a portable terminal, a desktop terminal, etc. As Figure 3 shown, the electronic device includes:

[0096] A memory for storing computer program instructions; and a processor for executing the computer program instructions to complete the operations of the femtosecond laser processing method for synergistically improving surface integrity and bonding strength as described in any one of Embodiment 1.

[0097] Specifically, the processor 301 may include one or more processing cores, such as a quad-core processor, an octa-core processor, etc. The processor 301 may be implemented in at least one hardware form of DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), PLA (Programmable Logic Array). The processor 301 may also include a main processor and a coprocessor. The main processor is a processor for processing data in the wake state, also known as the CPU (Central Processing Unit); the coprocessor is a low-power processor for processing data in the standby state. In some embodiments, the processor 301 may be integrated with a GPU (Graphics Processing Unit), and the GPU is responsible for rendering and drawing the content to be displayed on the display screen.

[0098] The memory 302 may include one or more computer-readable storage media, which may be non-transitory. The memory 302 may also include high-speed random access memory, as well as non-volatile memory, such as one or more disk storage devices and flash storage devices. In some embodiments, the non-transitory computer-readable storage medium in the memory 302 is used to store at least one instruction for being executed by the processor 301 to implement the femtosecond laser processing method for synergistically improving surface integrity and bonding strength provided in Embodiment 1 of this application.

[0099] In some embodiments, the terminal may further optionally include: a communication interface 303 and at least one peripheral device. The processor 301, the memory 302, and the communication interface 303 may be connected through a bus or signal lines. Each peripheral device may be connected to the communication interface 303 through a bus, signal lines, or a circuit board. Specifically, the peripheral device includes at least one of a radio frequency circuit 304, a display screen 305, and a power supply 306.

[0100] The communication interface 303 may be used to connect at least one peripheral device related to I / O (Input / Output) to the processor 301 and the memory 302. In some embodiments, the processor 301, the memory 302, and the communication interface 303 are integrated on the same chip or circuit board; in some other embodiments, any one or two of the processor 301, the memory 302, and the communication interface 303 may be implemented on a separate chip or circuit board, and this embodiment does not limit this.

[0101] The radio frequency circuit 304 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The radio frequency circuit 304 communicates with a communication network and other communication devices through electromagnetic signals.

[0102] The display screen 305 is used to display a UI (User Interface). The UI may include graphics, text, icons, videos, and any combination thereof.

[0103] The power supply 306 is used to supply power to each component in the electronic device.

[0104] Embodiment 4:

[0105] Based on any one of Embodiments 1 to 3, this embodiment discloses a computer program product, including a computer program or instruction, and the computer program or the instruction, when executed by a computer, implements the femtosecond laser processing method for synergistically improving surface integrity and bonding strength as described in any one of Embodiment 1.

[0106] Obviously, those skilled in the art should understand that the above-mentioned modules or steps of the present invention can be implemented by a general-purpose computing device. They can be concentrated on a single computing device or distributed on a network composed of multiple computing devices. Optionally, they can be implemented by program codes executable by the computing device. Thus, they can be stored in a storage device and executed by the computing device, or they can be separately fabricated into individual integrated circuit modules, or multiple modules or steps among them can be fabricated into a single integrated circuit module to be implemented. In this way, the present invention is not limited to any specific combination of hardware and software.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features. And these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A femtosecond laser processing method for synergistically improving surface integrity and bonding strength, characterized in that: Including: Construct a bionic structure model matching the adherend according to the characteristic parameters of the adherend and the processing parameters for adhesive bonding processing of the adherend; wherein, the characteristic parameters include the material type; Based on the bionic structure model, obtain the surface processing path for femtosecond laser processing of the adherend; According to the material type of the adherend, obtain the target femtosecond laser strengthening process parameters matching the adherend from a preset strengthening database; Based on the target femtosecond laser strengthening process parameters, use a femtosecond laser to perform surface micro-nano structure processing operations on the adherend, and when performing the surface micro-nano structure processing operations, the femtosecond laser processing path on the surface of the adherend is consistent with the surface processing path, so as to obtain the adherend after surface treatment; The characteristic parameters further include structural parameters, and the processing parameters include application scenario information and adhesive interface position information; correspondingly, according to the characteristic parameters of the adherend and the processing parameters for adhesive bonding processing of the adherend, constructing a bionic structure model matching the adherend includes: Construct a three-dimensional structure model of the adherend according to the structural parameters; Obtain the target interface structure type of the adherend according to the application scenario information, and obtain the interface structure model parameters matching the target interface structure type according to the adhesive interface position information; Based on the interface structure model parameters, construct a surface micro-nano structure model at the adhesive interface of the three-dimensional structure model; According to the three-dimensional structure model and the surface micro-nano structure model, obtain a bionic structure model matching the adherend.

2. The femtosecond laser processing method for synergistically improving surface integrity and bonding strength according to claim 1, wherein: According to the three-dimensional structure model and the surface micro-nano structure model, obtaining a bionic structure model matching the adherend includes: Perform a bonding strength simulation test on the surface micro-nano structure model to optimize the surface micro-nano structure model and obtain an optimized surface micro-nano structure model; Combine the three-dimensional structure model and the optimized surface micro-nano structure model to obtain a bionic structure model matching the adherend.

3. A femtosecond laser processing method for synergistically improving surface integrity and bonding strength according to claim 1, characterized in that: The strengthening database stores femtosecond laser strengthening process parameters corresponding to different material types, and any of the femtosecond laser strengthening process parameters includes laser power, scanning speed, repetition frequency, and spot overlap rate.

4. A femtosecond laser processing method for synergistically improving surface integrity and bonding strength according to claim 1, characterized in that: Before using a femtosecond laser to perform surface micro-nano structure processing operations on the adherend based on the target femtosecond laser strengthening process parameters, the method further includes: Perform ultrasonic cleaning on the adherend through an ultrasonic cleaner; Perform secondary cleaning on the adhesive interface of the adherend after ultrasonic cleaning using an ethyl acetate solution; Perform a drying process on the adherend after secondary cleaning.

5. A femtosecond laser processing method for synergistically improving surface integrity and bonding strength according to claim 1, characterized in that: After obtaining the adherend after surface treatment, the method further includes: Perform a gluing operation on the adherend after surface treatment to process an adhesive joint.

6. A femtosecond laser processing method for synergistically improving surface integrity and bonding strength according to claim 1, characterized in that: After processing the adhesive joint, the method further includes: Perform an adhesive performance test on the adhesive joint.

7. A femtosecond laser processing system for synergistically improving surface integrity and bonding strength, characterized in that: A femtosecond laser processing method for synergistically improving surface integrity and bonding strength as described in any one of claims 1 to 6; the femtosecond laser processing system for synergistically improving surface integrity and bonding strength includes: A model construction module that constructs a bionic structure model matching the adherend according to the characteristic parameters of the adherend and the processing parameters for adhesive bonding processing of the adherend; wherein, the characteristic parameters include the material type. A processing path confirmation module, communicatively connected to the model construction module, for obtaining a surface processing path for femtosecond laser processing of the adherend based on the bionic structure model. A process parameter acquisition module for obtaining target femtosecond laser strengthening process parameters matching the adherend from a preset strengthening database according to the material type of the adherend. A surface processing driving module, communicatively connected to the processing path confirmation module and the process parameter acquisition module respectively, for performing surface micro-nano structure processing operations on the adherend using a femtosecond laser based on the target femtosecond laser strengthening process parameters, and when performing the surface micro-nano structure processing operations, the femtosecond laser processing path on the surface of the adherend is consistent with the surface processing path, so as to obtain the adherend after surface treatment.

8. An electronic device, characterized in that: Including: A memory for storing computer program instructions; and a processor for executing the computer program instructions to complete the operations of the femtosecond laser processing method for synergistically improving surface integrity and bonding strength as described in any one of claims 1 to 6.

9. A computer program product, comprising a computer program or instructions, characterized in that: The computer program or the instructions, when executed by a computer, implement the femtosecond laser processing method for synergistically improving surface integrity and bonding strength as described in any one of claims 1 to 6.

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