Wafer offset value calculation method, device, equipment and storage medium

Abstract

The present application relates to a method, device, equipment and storage medium for calculating wafer offset values, which are applied in the field of semiconductor integrated circuit manufacturing technology, including obtaining the movement information of the wafer when the robot loads the wafer and moves; setting the movement direction of the wafer as a first direction and the direction perpendicular to the first direction as a second direction according to the movement information of the wafer; obtaining user needs, configuring according to user needs, and generating user configuration data; receiving the position information of the wafer when it moves; and calculating the offset values ​​of the wafer in the first direction and the second direction according to the position information and the user configuration data. The present application has the technical effects of reducing storage costs and computing resources and ensuring the continuity of the wafer manufacturing process.

Description

Technical Field

[0001] The present application relates to the field of semiconductor integrated circuit manufacturing technology, and in particular to a wafer offset value calculation method, device, equipment and storage medium. Background Art

[0002] Semiconductor integrated circuits are the core components of electronic devices. During the semiconductor integrated circuit manufacturing process, wafers are transferred and handed over at multiple stages. The accuracy of wafer transfer and handover is a key technology in wafer manufacturing, cleaning, storage, and semiconductor integrated circuit manufacturing (photolithography) and testing, which directly affects the success or failure of the finished product.

[0003] Currently, the position correction during wafer transfer and handover usually adopts the fast and high-precision imaging method, which requires the wafer to be imaged first; during the imaging period, the wafer transfer and handover process stops, and after the imaging is completed, the standard position image loaded into the database is analyzed and compared using the visual image algorithm. The fast and high-precision imaging method requires the wafer imaging image to be compared with the standard position image to correct the position during the wafer transfer and handover process, which requires a fairly large database support. Since each image needs to be stored in the database, the image data is large, resulting in high storage costs. Summary of the invention

[0004] In order to help solve the problem that fast and high-precision imaging methods require a considerable database support, resulting in high storage costs, the present application provides a wafer offset value calculation method, device, equipment and storage medium.

[0005] In a first aspect, the present application provides a wafer offset value calculation method, which adopts the following technical solution: the method is applied to a wafer offset value calculation system, the wafer offset value calculation system includes a first photoelectric sensor and a second photoelectric sensor, and the method includes:

[0006] When the robot loads the wafer and moves, obtaining movement information of the wafer;

[0007] According to the movement information of the wafer, the movement direction of the wafer is set as a first direction, and a direction perpendicular to the first direction is set as a second direction;

[0008] Obtain user requirements, configure according to the user requirements, and generate user configuration data, wherein the user configuration data includes a long side value and an initial state data value, wherein the long side value is a long side value of a photosensitive area of ​​the first photoelectric sensor and the second photoelectric sensor, and the initial state data value is a data value of an encoder on the manipulator in an initial state;

[0009] Receiving the acquired position information of the wafer during movement, the position information including voltage data acquired by the first photoelectric sensor and the second photoelectric sensor and position data acquired by the encoder on the manipulator;

[0010] The offset values ​​of the wafer in the first direction and the second direction are calculated according to the position information and the user configuration data.

[0011] Through the above technical solution, an algorithm is used to calculate the offset values ​​of the wafer in the first direction and the second direction based on the data collected by the sensor. The calculated results can be output in real time, do not require large database support, and the amount of data collected is small, thereby reducing data storage costs; in addition, the use of fast and high-precision imaging methods requires visual image analysis algorithm calculations, and therefore requires too much computing resources of the hardware infrastructure, while the present application solution only requires calculations through the position data collected by the sensor, which can minimize the investment in infrastructure computing resources, thereby reducing the cost investment in the wafer manufacturing process; at the same time, the solution can be set according to user business needs, and the solution is highly flexible.

[0012] In a specific possible implementation scheme, the wafer offset value calculation system includes a monitoring unit, and the monitoring unit is used to monitor changes in voltage data collected by the first photoelectric sensor and the second photoelectric sensor;

[0013] The received and collected position information of the wafer during movement includes:

[0014] Controlling the monitoring unit to monitor the output voltage of the second photoelectric sensor;

[0015] When the output voltage of the second photoelectric sensor changes, receiving and recording voltage data output by the second photoelectric sensor, the voltage data output by the second photoelectric sensor including a maximum voltage value and a minimum voltage value;

[0016] Controlling the monitoring unit to monitor the output voltage of the first photoelectric sensor;

[0017] When the output voltage of the first photoelectric sensor changes, receiving the output voltage value of the first photoelectric sensor;

[0018] When the voltage data output by the first photoelectric sensor is equal to the maximum voltage value, the motion state data value of the encoder on the robot is received and recorded.

[0019] Through the above technical solution, during the movement of the wafer, the voltage value data of the photoelectric sensors set in the first direction and the second direction, as well as the position data provided by the encoder on the robot are collected respectively, so that the position data can be collected and calculated during the movement of the wafer, thereby ensuring the continuity of the wafer transmission and handover process and improving the efficiency of wafer manufacturing.

[0020] In a specific implementation scheme, calculating the offset value of the wafer in the first direction and the second direction according to the position information and the user configuration data includes:

[0021] Perform a preset function operation according to the long side value, the maximum voltage value and the minimum voltage value to generate a second offset value of the wafer in the second direction;

[0022] The difference between the motion state data value and the initial state data value is calculated to generate a first offset value of the wafer in a first direction.

[0023] Through the above technical solution, the offset values ​​in the first direction and the second direction are calculated according to the parameter variables, the software algorithm is concise and efficient, and the calculation results can be output in real time, thereby reducing the investment in infrastructure computing resources and reducing wafer manufacturing costs.

[0024] In a specific implementation scheme, the preset function operation includes:

[0025]

[0026] Among them, v1 is the maximum voltage value, v2 is the minimum voltage value, d is the long side value, and Y0 is the second offset value.

[0027] In a specific implementation manner, after receiving and recording the voltage data output by the second photosensor, the method further includes:

[0028] Determining whether the received voltage data output by the second photoelectric sensor conforms to a preset working curve characteristic;

[0029] If the received voltage data output by the second photoelectric sensor does not conform to the preset working curve characteristics, the voltage data output by the second photoelectric sensor is received again.

[0030] Through the above technical solution, the voltage value output by the sensor will generally conform to a certain working curve characteristic. The collected voltage value will be fitted and compared with a predetermined curve relationship to ensure that the collected voltage value meets the requirements, thereby ensuring the accuracy of the collected data, and further improving the accuracy of the calculated wafer offset value.

[0031] In a specific implementation manner, after receiving and recording the voltage data output by the second photosensor, the method further includes:

[0032] When the voltage values ​​of the received voltage data output by the second photosensor in two sampling periods are equal, the receiving of the voltage data output by the second photosensor is stopped.

[0033] Through the above technical solution, the voltage value output by the sensor will continue to change during the movement of the wafer. If the voltage value does not change within two consecutive sampling cycles, it means that the wafer has completely left the sensor and no further sampling is required. Stopping sampling means stopping receiving data, thereby saving resources.

[0034] In a specific possible implementation manner, before setting the movement direction of the wafer as the first direction and setting the direction perpendicular to the first direction as the second direction according to the movement information of the wafer, the method further includes:

[0035] The initial position of the wafer is adjusted according to the voltage data collected by the first photoelectric sensor and the second photoelectric sensor.

[0036] Through the above technical solution, before the user adopts this method to calculate the wafer offset value, the wafer position needs to be adjusted first to ensure that there is no deviation in the initial position of the wafer in the first direction and the second direction, so that the position data measured during the movement of the wafer can be more accurate, thereby improving the accuracy of the calculated offset value.

[0037] In a second aspect, the present application provides a wafer offset value calculation device, which adopts the following technical solution: the device is applied to a wafer offset value calculation system, the wafer offset value calculation system includes a first photoelectric sensor and a second photoelectric sensor, and the device includes:

[0038] An information acquisition module, used to acquire movement information of the wafer when the robot loads the wafer and moves;

[0039] A direction setting module, used for setting the movement direction of the wafer as a first direction and setting a direction perpendicular to the first direction as a second direction according to the movement information of the wafer;

[0040] A demand configuration module, used to obtain user demand, configure according to the user demand, and generate user configuration data, wherein the user configuration data includes a long side value and an initial state data value, wherein the long side value is the long side value of the photosensitive area of ​​the first photoelectric sensor and the second photoelectric sensor, and the initial state data value is the data value of the encoder on the manipulator in the initial state;

[0041] A data receiving module, used for receiving the acquired position information of the wafer during movement, wherein the position information includes voltage data acquired by the first photoelectric sensor and the second photoelectric sensor, and position data acquired by the encoder on the manipulator;

[0042] The offset calculation module is used to calculate the offset value of the wafer in the first direction and the second direction according to the position information and the user configuration data.

[0043] In a third aspect, the present application provides a computer device, which adopts the following technical solution: it includes a memory and a processor, and the memory stores a computer program that can be loaded by the processor and execute any of the above-mentioned wafer offset value calculation methods.

[0044] In a fourth aspect, the present application provides a computer-readable storage medium, which adopts the following technical solution: storing a computer program that can be loaded by a processor and execute any of the above-mentioned wafer offset value calculation methods.

[0045] In summary, this application has the following beneficial technical effects:

[0046] 1. Based on the data collected by the sensor, an algorithm is used to calculate the offset value of the wafer in the first direction and the second direction. The calculated results can be output in real time, without the need for a large database support, and the amount of data collected is small, thereby reducing the cost of data storage. In addition, the use of fast and high-precision imaging methods requires visual image analysis algorithm calculations, so it takes up too much computing resources of the hardware infrastructure. The present application solution only needs to perform calculations through the position data collected by the sensor, which can minimize the investment in infrastructure computing resources, thereby reducing the cost investment in the wafer manufacturing process. At the same time, the solution can be set according to user business needs, and the solution is highly flexible.

[0047] 2. During the movement of the wafer, the voltage value data of the photoelectric sensors set in the first direction and the second direction, as well as the position data provided by the encoder on the robot are collected respectively, so that the position data can be collected and calculated during the movement of the wafer, thereby ensuring the continuity of the wafer transmission and handover process and improving the efficiency of wafer manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 is a schematic diagram for explaining the composition and structure of the photoelectric sensor in the embodiment of the present application;

[0049] Figure 2 is a flow chart of a method for calculating a wafer offset value in an embodiment of the present application;

[0050] Figure 3 is a schematic diagram of a state in which a wafer moves through a y-direction photoelectric sensor in an embodiment of the present application;

[0051] Figure 4 is a schematic diagram of a state in which a wafer moves through an x-direction photoelectric sensor in an embodiment of the present application;

[0052] Figure 5 is a characteristic diagram of the working curve of the photoelectric sensor in the embodiment of the present application;

[0053] Figure 6 is a schematic diagram of a wafer offset value calculation device in an embodiment of the present application;

[0054] Figure 7 It is a schematic diagram used to embody a computer device in an embodiment of the present application.

[0055] Reference numerals: 601, information acquisition module; 602, direction setting module; 603, demand configuration module; 604, data receiving module; 605, offset calculation module. DETAILED DESCRIPTION

[0056] The following combination Figure 1-Figure 7 This application is described in further detail.

[0057] The embodiment of the present application discloses a method for calculating the offset value of a wafer, which is applied to a wafer offset value calculation system. The method can be used to calculate the offset value of a wafer during the wafer transmission and handover process, and output the calculation result in real time, so as to report the calculation result to a central computer or distribute it to other production application modules for process correction. In actual applications, the fork on the manipulator loads the wafer to move, and transfers and hands over the wafer to different processes in wafer manufacturing. During the wafer transmission and handover process, the accuracy of the wafer position needs to be ensured, so as to ensure the quality and performance of wafer production, as well as the stability and reliability of the final product.

[0058] In the embodiment of the present application, the two sensors used are photoelectric sensors, which are devices that can convert light signals into electrical signals and are composed of a transmitter and a receiver; the receiver is linear, that is, the amount of light received is proportional to the voltage output. Figure 1 , is a schematic diagram of the composition and structure of the photoelectric sensor. The light is emitted from the transmitter and received by the receiver. There is a photosensitive area on the receiver, and the photosensitive area is rectangular. During measurement, the wafer passes between the transmitter and the photosensitive area. The photosensitive area can convert the received light signal into a corresponding electrical signal and output the corresponding voltage value. Figure 1 In the figure, d is the length of the rectangular photosensitive area, b is the width of the rectangular photosensitive area. Generally, the width b ≥ 1 mm, and DS represents the distance between the transmitting end and the receiving end.

[0059] At present, the commonly used wafer position correction usually adopts a fast and high-precision imaging method. The fast and high-precision imaging method requires the wafer to be imaged first; during the imaging period, the wafer transmission and handover process stops, and after the imaging is completed, the standard position image loaded into the database is analyzed and compared using a visual image algorithm. However, the use of a fast and high-precision imaging method will lead to the following problems, such as the need to rely on expensive high-speed and high-precision imaging equipment; the need for a considerable database support, because each image needs to be stored in the database, the image data is large, resulting in high storage costs; the need to introduce costly visual image analysis algorithms; the need to occupy too many computing resources of the hardware infrastructure; the transmission and handover must be stopped during imaging, resulting in discontinuous business processes; the need to create suitable imaging conditions, such as lighting conditions, but in some working conditions, additional lighting is not allowed, such as the lithography system; and the high misjudgment rate and insufficient judgment accuracy require manual intervention. In order to help improve the accuracy of the position during wafer transmission and handover and reduce storage costs, the present application provides a method for calculating wafer offset values.

[0060] Reference Figure 2 , the method comprises the following steps:

[0061] S10, when the robot arm loads the wafer and moves, the movement information of the wafer is obtained.

[0062] Specifically, the robot fork loading the wafer will move in one direction, and the wafer movement information is obtained when the wafer moves. In actual applications, before using this method to measure and calculate the offset value of the wafer, two photoelectric sensors need to be installed first. One of the photoelectric sensors is fixed and installed vertically in the direction of the wafer's movement. At the same time, it is necessary to ensure that the robot fork loading the wafer can smoothly pass through the transmitting end and the receiving end; the other photoelectric sensor is installed on the same straight line as the other photoelectric sensor, referring to Figure 3-Figure 4 , wherein the other photoelectric sensor is non-fixedly installed to be compatible with wafers of different sizes, such as 4-inch, 8-inch, 12-inch and other sizes of wafers. It should be noted that two identical photoelectric sensors are used, one of which is fixedly installed and the other is non-fixedly installed; in the embodiment of the present application, the first photoelectric sensor is fixed and installed vertically in the movement direction of the wafer, and the second photoelectric sensor is non-fixedly installed in a straight line with the first photoelectric sensor.

[0063] S20, according to the movement information of the wafer, setting the movement direction of the wafer as a first direction, and setting a direction perpendicular to the first direction as a second direction.

[0064] Specifically, in actual applications, the wafer moves in one direction, and the direction of the wafer movement is set as the first direction, and the direction perpendicular to the direction of the wafer movement, that is, the direction perpendicular to the first direction, is set as the second direction; by setting the first direction and the second direction, a coordinate system can be established, and the movement of the wafer in the coordinate system can obtain the coordinate points of the wafer at different positions. The coordinate points can facilitate the calculation of the wafer position and the wafer position offset value. In the embodiment of the present application, for the sake of convenience of explanation, the first direction is the x-direction and the second direction is the y-direction. The user does not limit the setting method in actual application and can set it according to the user's application habits. In the embodiment of the present application, the first direction is the x-direction and the second direction is the y-direction, then the installation positions of the two photoelectric sensors are, such as Figure 3-Figure 4 The robot fork loads the wafer and moves in one direction, the movement direction is the first direction, that is, the x direction. The first photoelectric sensor is installed in the x direction, and the second photoelectric sensor is parallel to the y direction and in a straight line with the first photoelectric sensor. The second photoelectric sensor can be moved and adjusted according to the size of the wafer to be measured. In the embodiment of the present application, the first photoelectric sensor is the x-direction photoelectric sensor and the second photoelectric sensor is the y-direction photoelectric sensor. Figure 3-Figure 4 , Sensor-X represents the photoelectric sensor in the x direction, and Sensor-Y represents the photoelectric sensor in the y direction.

[0065] S30, obtaining user needs, configuring according to user needs, and generating user configuration data, the user configuration data includes a long side value and an initial state data value, the long side value is the long side value of the photosensitive area of ​​the first photoelectric sensor and the second photoelectric sensor, and the initial state data value is the data value of the encoder on the manipulator in the initial state.

[0066] Specifically, different users have different requirements for the error range, resolution, and photoelectric sensors used in the wafer manufacturing process. Before using this method to calculate the wafer position offset value, the different requirements are first transmitted to the system, and the system is configured according to different user requirements to generate user configuration data. The user configuration data includes a long side value and an initial state data value. The long side value is the long side value of the photosensitive area of ​​the first photoelectric sensor and the second photoelectric sensor. For example, referring to Figure 1 , the long side value is d, the initial state data value is the data value of the encoder on the robot in the initial state. The robot has an encoder. The encoder will have different data values ​​when the robot is in different positions. The encoder will have values ​​in different states when the wafer moves. In addition, the user configuration data also includes the encoder resolution. The encoder resolution can be understood as the resolution required by the user for wafer deviation correction.

[0067] It should be noted that in actual applications, users can choose the specific model and type of photoelectric sensors by themselves, and are not limited to one or several types of photoelectric sensors. However, when selecting photoelectric sensors, the long side value d of the photosensitive area needs to meet certain requirements. There will be a maximum wafer deviation d during the wafer manufacturing process. x For example, the maximum wafer deviation can be ±3 mm, then the length d of the photosensitive area of ​​the selected photoelectric sensor needs to satisfy: d = 2*|±d x |.

[0068] S40, receiving the acquired position information of the wafer during movement, wherein the position information includes voltage data acquired by the first photoelectric sensor and the second photoelectric sensor, and position data acquired by the encoder on the robot.

[0069] Specifically, when the wafer is moving, the first and second photoelectric sensors, which can also be understood as x-direction photoelectric sensors and y-direction photoelectric sensors in the embodiment of the present application, will continuously output different voltage data after being converted into electrical signals because the received light signals are constantly changing. At the same time, the robot loads the wafer to move. At different positions, the position data of the encoder is also different. The data required to calculate the wafer offset value is received as a parameter to realize the calculation of the wafer position deviation.

[0070] S50, calculating the offset values ​​of the wafer in the first direction and the second direction according to the position information and the user configuration data.

[0071] Specifically, after receiving the parameters required to calculate the wafer offset value, the offset values ​​of the wafer in the first and second directions are calculated according to the position information and the user configuration data, which can also be understood as calculating the x-direction offset value and the y-direction offset value.

[0072] In the present application scheme, an algorithm is used to calculate the offset values ​​of the wafer in the first direction and the second direction based on the data collected by the sensor. The calculated results can be output in real time, do not require large database support, and the amount of data collected is small, thereby reducing data storage costs. In addition, the use of fast and high-precision imaging methods requires visual image analysis algorithm calculations, and therefore requires too much computing resources of the hardware infrastructure. The present application scheme only requires calculations based on the position data collected by the sensor, which can minimize the investment in infrastructure computing resources, thereby reducing the cost investment in the wafer manufacturing process. At the same time, the scheme can be set according to user business needs, and the scheme is highly flexible.

[0073] In one embodiment, the wafer offset value calculation system includes a monitoring unit, which is used to monitor the change of voltage data collected by the first photoelectric sensor and the second photoelectric sensor. In this embodiment, the first direction is the x direction, the second direction is the y direction, the first photoelectric sensor is the x-direction photoelectric sensor, and the second photoelectric sensor is the y-direction photoelectric sensor. The step of receiving the collected position information of the wafer during movement can be specifically performed as follows:

[0074] First, the control monitoring unit monitors the output voltage of the second photoelectric sensor, that is, the y-direction photoelectric sensor; when the output voltage of the y-direction photoelectric sensor changes, the voltage data output by the y-direction photoelectric sensor is received and recorded. The voltage data output by the y-direction photoelectric sensor is a number of data points collected at a fixed sampling frequency, and the collected voltage data includes a maximum voltage value and a minimum voltage value. Figure 3 , a schematic diagram of the state of the robot loading the wafer and moving through the y-direction photoelectric sensor. In the figure, the y-direction and x-direction photoelectric sensors have two upper and lower edges. The upper edge of the sensor is recorded as S2, and the lower edge is recorded as S1. When the wafer passes through the y-direction photoelectric sensor, the wafer completely covers the x-direction photoelectric sensor. At this time, the voltage output value of the x-direction photoelectric sensor remains unchanged, while the voltage value of the y-direction sensor keeps changing and will conform to a certain working curve characteristic. The y-direction photoelectric sensor transmits the collected voltage data to the system. After the system analyzes and extracts the collected voltage data, the maximum voltage value and the minimum voltage value are obtained; the maximum voltage value is recorded as v1, and the minimum voltage value is recorded as v2. During the movement of the wafer, the maximum voltage value v1 is the voltage value when the last point of the outer arc of the wafer leaves the S2 edge of the y-direction photoelectric sensor, and the minimum voltage value v2 is the voltage value when the area of ​​the photosensitive area of ​​the y-direction photoelectric sensor is the largest during the movement of the wafer.

[0075] Afterwards, the control monitoring unit monitors the output voltage of the first photoelectric sensor, that is, the x-direction photoelectric sensor; when the output voltage of the x-direction photoelectric sensor changes, the output voltage value of the x-direction photoelectric sensor is received; when the voltage data output by the x-direction photoelectric sensor is equal to the maximum voltage value collected by the y-direction photoelectric sensor, the motion state data value of the encoder on the manipulator is received and recorded. Figure 4 , a schematic diagram of the robot loading the wafer and moving through the x-axis photoelectric sensor state. When the wafer begins to contact the x-axis photoelectric sensor, the wafer has completely left the y-axis photoelectric sensor. At this time, the x-axis photoelectric sensor will detect and output different voltage values. When the voltage value output by the x-axis photoelectric sensor is equal to the maximum voltage value collected by the y-axis photoelectric sensor, the system will request the data value of the robot encoder and set the value to the motion state data value.

[0076] It should be noted that, under normal circumstances, after obtaining the motion state data value, the user will compare it with the empirical value. If the motion state data value is consistent with the empirical value, the motion state data value will be recorded. If it is not consistent, the system will output a re-sampling instruction, and the wafer will return to the position where the arc of the tail of the wafer is tangent to the lower side S1 of the x-axis photoelectric sensor, and collect data after re-movement.

[0077] In the present application scheme, during the movement of the wafer, the voltage value data of the photoelectric sensors arranged in the first direction and the second direction, as well as the position data provided by the encoder on the robot are collected respectively, so that the position data can be collected and calculated during the movement of the wafer, thereby ensuring the continuity of the wafer transmission and handover process and improving the efficiency of wafer manufacturing.

[0078] In one embodiment, the step of calculating the offset values ​​of the wafer in the first direction and the second direction according to the position information and the user configuration data may be specifically performed as follows:

[0079] A preset function operation is performed according to the long side value d, the maximum voltage value v1 and the minimum voltage value v2 to generate a second offset value of the wafer in the second direction, which can also be understood as a y-direction offset value; specifically, the function operation can be expressed as:

[0080]

[0081] Among them, v1 is the maximum voltage value, v2 is the minimum voltage value, d is the long side value, and Y0 is the second offset value, that is, the y-direction offset value.

[0082] The difference between the motion state data value fed back by the encoder and the initial state data value is calculated to generate the first offset value of the wafer in the first direction, which can also be understood as the x-direction offset value; the motion state data value is recorded as x1, and the initial state data value is recorded as x2, where the motion state data value x1 is the encoder position feedback data of the wafer after the position has been adjusted when there is no deviation in the x-direction, and the x-direction offset value can be expressed as:

[0083] X0=x1-x2

[0084] Among them, x1 is the motion state data value, x2 is the initial state data value, and X0 is the first offset value, that is, the x-direction offset value.

[0085] In the present application scheme, the offset values ​​in the first direction and the second direction are calculated based on the parameter variables, the software algorithm is concise and efficient, and the calculation results can be output in real time, thereby reducing the investment in infrastructure computing resources and reducing wafer manufacturing costs.

[0086] In one embodiment, considering that the curve of the voltage data collected by the photoelectric sensor should conform to a certain working curve feature, after receiving and recording the voltage data output by the second photoelectric sensor, the following steps may be performed:

[0087] Determine whether the received voltage data output by the y-direction photoelectric sensor meets the preset working curve characteristics; if the received voltage data output by the second photoelectric sensor does not meet the preset working curve characteristics, then re-receive the voltage data output by the second photoelectric sensor. Figure 5 , is the working curve characteristic that the voltage data output by the photoelectric sensor should conform to in the embodiment of the present application. After a large number of experimental studies and verifications by the inventor, the voltage output by the photoelectric sensor is related to the length d of the photosensitive area and the position of the wafer. The system analyzes the received voltage data and if it conforms to Figure 5 The working curve characteristics shown in the figure indicate that the data is normal. Figure 5 The working curve characteristics shown in the figure require the wafer to be returned to the position where it just contacts the y-axis sensor, the wafer to move again, and the system to re-receive the data collected by the y-axis photoelectric sensor.

[0088] In the present application scheme, the voltage value output by the sensor generally conforms to a certain working curve characteristic. The collected voltage value is fitted and compared with a predetermined curve relationship to ensure that the collected voltage value meets the requirements, thereby ensuring the accuracy of the collected data, and further improving the accuracy of the calculated wafer offset value.

[0089] In one embodiment, considering that after the wafer completely leaves the photoelectric sensor, if the system continues to receive and collect data, data redundancy and resource waste will result. Therefore, after receiving and recording the voltage data output by the second photoelectric sensor, the following steps may be performed:

[0090] When the voltage data output by the second photoelectric sensor, that is, the y-direction photoelectric sensor, is equal in two sampling cycles, the voltage data output by the y-direction photoelectric sensor is stopped. The system collects data by sampling periodically. During the movement of the wafer, the area covered by the wafer on the photoelectric sensor is different, so the collected voltage values ​​are different. If the voltage values ​​sampled in two cycles are the same, it means that the wafer has completely left the sensor. At this time, the system stops sampling, that is, receiving data, thereby avoiding data redundancy and saving resources.

[0091] In the present application, the voltage value output by the sensor will continue to change during the movement of the wafer. If the voltage value does not change within two consecutive sampling cycles, it means that the wafer has completely left the sensor and no further sampling is required. Stopping sampling means stopping receiving data, thereby saving resources.

[0092] In one embodiment, considering that the initial position of the wafer will affect the calculation result of the wafer offset value, the following steps may be further performed before setting the movement direction of the wafer as the first direction and setting the direction perpendicular to the first direction as the second direction according to the movement information of the wafer:

[0093] According to the voltage data collected by the first photoelectric sensor and the second photoelectric sensor, the initial position of the wafer is adjusted. Specifically, before calculating the wafer offset value, the data collected by the photoelectric sensors in two directions are first obtained, and the wafer offset value calculation method is used to calculate whether the initial position of the wafer has a deviation based on the data collected by the photoelectric sensors. If it is calculated that the wafer has no deviation in the first direction and the second direction, the robot controls the movement of the wafer and calculates the offset value of the wafer during the movement driven by the robot; if it is calculated that the initial position has a deviation, the user adjusts the position of the wafer.

[0094] The initial position of the wafer can be determined by determining whether the outer arc of the wafer is tangent to the center line of the second photoelectric sensor, that is, the y-direction photoelectric sensor in the x-direction. Figure 3 , the midline of the y-direction photoelectric sensor in the x-direction is also the black and white dividing line, that is, d / 2; if the outer edge arc of the wafer is tangent to the midline of the y-direction photoelectric sensor in the x-direction, it is determined that the wafer has no deviation in the second direction, that is, the wafer has no deviation in the y-direction.

[0095] When the wafer leaves the first photoelectric sensor, that is, the x-direction photoelectric sensor, and is tangent to the long side of the photosensitive area of ​​the x-direction photoelectric sensor, Figure 4 , that is, when the arc edge of the wafer tail is tangent to the S2 side of the x-direction photoelectric sensor, the data value transmitted by the encoder on the receiving robot is judged whether the data value transmitted by the encoder is consistent with the preset standard data value; if the data value transmitted by the encoder is consistent with the preset standard data value, it is judged that the wafer has no deviation in the first direction, that is, the wafer has no deviation in the x-direction. Among them, the preset standard value is the standard position value of the wafer, and different wafers have different standard values, which are generally values ​​set in advance by the user.

[0096] In the present application scheme, before the user uses this method to calculate the wafer offset value, the wafer position needs to be adjusted first to ensure that there is no deviation in the initial position of the wafer in the first direction and the second direction, so that the position data measured during the movement of the wafer can be more accurate, thereby improving the accuracy of the calculated offset value.

[0097] Figure 2 FIG. 1 is a flow chart of a method for calculating a wafer offset value in one embodiment. It should be understood that although Figure 2The steps in the flowchart are shown in sequence as indicated by the arrows, but the steps are not necessarily executed in the order indicated by the arrows; unless otherwise specified in this document, there is no strict order restriction for the execution of the steps, and the steps may be executed in other orders; and Figure 2 At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0098] Based on the above method, an embodiment of the present application also discloses a wafer offset value calculation device.

[0099] Reference Figure 6 , the device includes the following modules:

[0100] The information acquisition module 601 is used to acquire the movement information of the wafer when the robot loads the wafer;

[0101] A direction setting module 602, configured to set the movement direction of the wafer as a first direction and a direction perpendicular to the first direction as a second direction according to the movement information of the wafer;

[0102] The demand configuration module 603 is used to obtain user demand, configure according to the user demand, and generate user configuration data, wherein the user configuration data includes a long side value and an initial state data value, wherein the long side value is the long side value of the photosensitive area of ​​the first photoelectric sensor and the second photoelectric sensor, and the initial state data value is the data value of the encoder on the manipulator in the initial state;

[0103] The data receiving module 604 is used to receive the acquired position information of the wafer during movement, wherein the position information includes the voltage data acquired by the first photoelectric sensor and the second photoelectric sensor and the position data acquired by the encoder on the manipulator;

[0104] The offset calculation module 605 is used to calculate the offset value of the wafer in the first direction and the second direction according to the position information and the user configuration data.

[0105] In one embodiment, the data receiving module 604 is specifically used to control the monitoring unit to monitor the output voltage of the second photoelectric sensor; when the output voltage of the second photoelectric sensor changes, receive and record the voltage data output by the second photoelectric sensor, and the voltage data output by the second photoelectric sensor includes a maximum voltage value and a minimum voltage value; control the monitoring unit to monitor the output voltage of the first photoelectric sensor; when the output voltage of the first photoelectric sensor changes, receive the output voltage value of the first photoelectric sensor; when the voltage data output by the first photoelectric sensor is equal to the maximum voltage value, receive and record the motion state data value of the encoder on the manipulator.

[0106] In one embodiment, the offset calculation module 605 is specifically used to perform a preset function operation based on the long side value, the maximum voltage value and the minimum voltage value to generate a second offset value of the wafer in the second direction; calculate the difference between the motion state data value and the initial state data value to generate a first offset value of the wafer in the first direction.

[0107] In one embodiment, the offset calculation module 605 specifically includes:

[0108]

[0109] Among them, v1 is the maximum voltage value, v2 is the minimum voltage value, d is the long side value, and Y0 is the second offset value.

[0110] In one embodiment, the data receiving module 605 is also used to determine whether the received voltage data output by the second photoelectric sensor meets the preset working curve characteristics; if the received voltage data output by the second photoelectric sensor does not meet the preset working curve characteristics, the voltage data output by the second photoelectric sensor is received again.

[0111] In one embodiment, the data receiving module 604 is further configured to stop receiving the voltage data output by the second photosensor when the voltage values ​​of the voltage data output by the second photosensor are equal in two sampling periods.

[0112] In one embodiment, the direction setting module 602 is further used to adjust the initial position of the wafer according to the voltage data collected by the first photoelectric sensor and the second photoelectric sensor.

[0113] The wafer offset value calculation device provided in the embodiment of the present application can be applied to the wafer offset value calculation method provided in the above embodiment. For relevant details, refer to the above method embodiment. The implementation principle and technical effect are similar and will not be repeated here.

[0114] It should be noted that: the wafer offset value calculation device provided in the embodiment of the present application only uses the division of the above-mentioned functional modules / functional units as an example when performing wafer offset value calculation. In practical applications, the above-mentioned functions can be assigned to different functional modules / functional units as needed, that is, the internal structure of the wafer offset value calculation device is divided into different functional modules / functional units to complete all or part of the functions described above. In addition, the implementation method of the wafer offset value calculation method provided in the above method embodiment and the implementation method of the wafer offset value calculation device provided in this embodiment belong to the same concept. The specific implementation process of the wafer offset value calculation device provided in this embodiment is detailed in the above method embodiment, and will not be repeated here.

[0115] The embodiment of the present application also discloses a computer device.

[0116] Specifically, if Figure 7 As shown, the computer device can be a computer device such as a desktop computer, a laptop computer, a PDA, and a cloud server. The computer device may include, but is not limited to, a processor and a memory. The processor and the memory may be connected via a bus or otherwise. The processor may be a central processing unit (CPU). The processor may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, graphics processors (GPU), embedded neural network processors (NPU) or other dedicated deep learning coprocessors, discrete gates or transistor logic devices, discrete hardware components and other chips, or a combination of the above-mentioned various chips.

[0117] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs, non-transient computer executable programs and modules, such as program instructions / modules corresponding to the methods in the above-mentioned embodiments of the present application. The processor executes various functional applications and data processing of the processor by running the non-transient software programs, instructions and modules stored in the memory, that is, the method in the above-mentioned method implementation is realized. The memory may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created by the processor, etc. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network and a combination thereof.

[0118] The embodiment of the present application also discloses a computer-readable storage medium.

[0119] Specifically, a computer-readable storage medium is used to store a computer program, and when the computer program is executed by a processor, the method in the above-mentioned method implementation is implemented. Those skilled in the art will understand that the implementation of all or part of the process in the above-mentioned implementation method of the present application can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, and the program, when executed, may include the process of the implementation of the above-mentioned methods. Among them, the storage medium may be a disk, an optical disk, a read-only memory (ROM), a random access memory (RAM), a flash memory (Flash Memory), a hard disk (Hard Disk Drive, abbreviated as: HDD) or a solid-state drive (SSD), etc.; the storage medium may also include a combination of the above-mentioned types of memory.

[0120] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A method for calculating wafer offset value, characterized in that: The method is applied to a wafer offset value calculation system, the wafer offset value calculation system includes a first photoelectric sensor and a second photoelectric sensor, and the method includes: When the robot loads the wafer and moves, obtaining movement information of the wafer; According to the movement information of the wafer, the movement direction of the wafer is set as a first direction, and a direction perpendicular to the first direction is set as a second direction; Obtain user requirements, configure according to the user requirements, and generate user configuration data, wherein the user configuration data includes a long side value and an initial state data value, wherein the long side value is a long side value of a photosensitive area of ​​the first photoelectric sensor and the second photoelectric sensor, and the initial state data value is a data value of an encoder on the manipulator in an initial state; Receiving the acquired position information of the wafer during movement, the position information including voltage data acquired by the first photoelectric sensor and the second photoelectric sensor and position data acquired by the encoder on the manipulator; Calculate the offset value of the wafer in the first direction and the second direction according to the position information and the user configuration data; The wafer offset value calculation system includes a monitoring unit, and the monitoring unit is used to monitor the change of the voltage data collected by the first photoelectric sensor and the second photoelectric sensor; The received and collected position information of the wafer during movement includes: Controlling the monitoring unit to monitor the output voltage of the second photoelectric sensor; When the output voltage of the second photoelectric sensor changes, receiving and recording voltage data output by the second photoelectric sensor, the voltage data output by the second photoelectric sensor including a maximum voltage value and a minimum voltage value; Controlling the monitoring unit to monitor the output voltage of the first photoelectric sensor; When the output voltage of the first photoelectric sensor changes, receiving the output voltage value of the first photoelectric sensor; When the voltage data output by the first photoelectric sensor is equal to the maximum voltage value, receiving and recording the motion state data value of the encoder on the manipulator; Calculating the offset value of the wafer in the first direction and the second direction according to the position information and the user configuration data comprises: Perform a preset function operation according to the long side value, the maximum voltage value and the minimum voltage value to generate a second offset value of the wafer in the second direction; The difference between the motion state data value and the initial state data value is calculated to generate a first offset value of the wafer in a first direction.

2. The method according to claim 1, characterized in that: The preset function operation includes: Among them, v1 is the maximum voltage value, v2 is the minimum voltage value, d is the long side value, and Y0 is the second offset value.

3. The method according to claim 1, characterized in that: After receiving and recording the voltage data output by the second photoelectric sensor, the method further includes: Determining whether the received voltage data output by the second photoelectric sensor conforms to a preset working curve characteristic; If the received voltage data output by the second photoelectric sensor does not conform to the preset working curve characteristics, the voltage data output by the second photoelectric sensor is received again.

4. The method according to claim 1, characterized in that: After receiving and recording the voltage data output by the second photoelectric sensor, the method further includes: When the voltage values ​​of the received voltage data output by the second photosensor in two sampling periods are equal, the receiving of the voltage data output by the second photosensor is stopped.

5. The method according to claim 1, characterized in that: Before setting the movement direction of the wafer as the first direction and setting the direction perpendicular to the first direction as the second direction according to the movement information of the wafer, the method further includes: The initial position of the wafer is adjusted according to the voltage data collected by the first photoelectric sensor and the second photoelectric sensor.

6. A wafer offset value calculation device, characterized in that: The device is applied to a wafer offset value calculation system, the wafer offset value calculation system includes a first photoelectric sensor and a second photoelectric sensor, and the device includes: An information acquisition module (601) is used to acquire movement information of the wafer when the robot loads the wafer and moves; A direction setting module (602) is used to set the movement direction of the wafer as a first direction and set a direction perpendicular to the first direction as a second direction according to the movement information of the wafer; A demand configuration module (603) is used to obtain user demand, configure according to the user demand, and generate user configuration data, wherein the user configuration data includes a long side value and an initial state data value, wherein the long side value is the long side value of the light-sensitive area of ​​the first photoelectric sensor and the second photoelectric sensor, and the initial state data value is the data value of the encoder on the manipulator in the initial state; A data receiving module (604) is used to receive the collected position information of the wafer during movement, wherein the position information includes voltage data collected by the first photoelectric sensor and the second photoelectric sensor and position data collected by the encoder on the robot; An offset calculation module (605) is used to calculate the offset value of the wafer in the first direction and the second direction according to the position information and the user configuration data.

7. A computer device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executes any one of the methods of claims 1 to 5.

8. A computer-readable storage medium, characterized in that: A computer program is stored which can be loaded by a processor and execute the method according to any one of claims 1 to 5.

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