Electromagnetic shielding structure manufacturing method and packaging structure

Abstract

The present application provides a method for manufacturing an electromagnetic shielding structure and a packaging structure, and relates to the field of semiconductor packaging technology. The method for manufacturing an electromagnetic shielding structure includes providing a substrate having a first element. A shielding portion is formed on the substrate using 3D printing technology; wherein the shielding portion is arranged on the periphery of the first element; the step includes: constructing a three-dimensional model of the shielding portion; identifying the target position on the substrate; laying printed materials at the target position according to the three-dimensional model to preform the shielding portion. A plastic encapsulation material is injected onto the substrate to form a plastic encapsulation body that encapsulates the first element and the shielding portion; wherein the plastic encapsulation material and the printed material produce a cross-linking reaction. The plastic encapsulation body is grounded so that the shielding portion is exposed from the surface of the plastic encapsulation body. A metal layer electrically connected to the shielding portion is formed on the surface of the plastic encapsulation body; at least one of the metal layer and the shielding portion has a grounding property. The use of 3D printing technology can improve the bonding force between the shielding portion and the plastic encapsulation body and improve the packaging reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a method for manufacturing an electromagnetic shielding structure and a packaging structure. Background Art

[0002] With the rapid development of the semiconductor industry, the system-level packaging module structure is widely used in the semiconductor industry. It packages chips with different functions and stacks them. The main advantages are high-density integration, small packaged product size, superior product performance, and fast signal transmission frequency. As electronic products are used in the field of communications with high-frequency signals, products are required to have a partitioned electromagnetic shielding structure to prevent electromagnetic interference between various chips and components. The existing partition shielding technology mainly uses wire bonding to form a cage-shaped shielding structure.

[0003] The cage-like shielding structure is to wire in the substrate and form grounding pads on the surface of the substrate. The grounding pads are located around the chips or components that need to be shielded. Vertical metal wires are laid on the grounding pads. The vertical metal wires surround the chips or components that need to be shielded, thereby forming a cage-like shielding structure.

[0004] Since the existing vertical metal wire bonding machine uses metal wire welding wire for bonding, the vertical metal wire has a relatively large length-diameter ratio and is easily deformed or broken under the impact of the subsequent plastic encapsulation mold flow, resulting in uneven spacing between adjacent vertical metal wires, which easily leads to the passage of clutter and reduces the shielding effect. In addition, the thermal expansion coefficients of the existing vertical metal wires and the plastic encapsulation body are quite different, and structural stratification is prone to occur. Summary of the invention

[0005] The objectives of the present invention include, for example, providing a method for manufacturing an electromagnetic shielding structure and a packaging structure, which can improve wire bonding efficiency and wire bonding quality and improve electromagnetic shielding reliability.

[0006] The embodiments of the present invention can be implemented as follows:

[0007] In a first aspect, the present invention provides a method for manufacturing an electromagnetic shielding structure, comprising:

[0008] providing a substrate having a first element;

[0009] Using 3D printing technology to form a shielding portion on the substrate; wherein the shielding portion is arranged on the periphery of the first element; this step includes: constructing a three-dimensional model of the shielding portion; identifying a target position on the substrate; laying a printing material at the target position according to the three-dimensional model to preform the shielding portion;

[0010] Injecting a plastic encapsulation material onto the substrate to form a plastic encapsulation body encapsulating the first element and the shielding portion; wherein the plastic encapsulation material produces a cross-linking reaction with the printing material;

[0011] Grinding the plastic package body so that the shielding portion is exposed from the surface of the plastic package body;

[0012] A metal layer electrically connected to the shielding part is formed on the surface of the plastic package body; at least one of the metal layer and the shielding part has a grounding property.

[0013] In an optional embodiment, in the step of preforming the shielding portion by laying printed material at the target position according to the three-dimensional model: the preforming temperature is 100° C. to 200° C.;

[0014] In the step of injecting a molding compound onto the substrate to form a molding body encapsulating the first element and the shielding portion: the curing temperature of the molding compound is 250° C. to 350° C.

[0015] In an optional embodiment, the printing material uses nano-metal conductive silver paste.

[0016] In an optional embodiment, a green paint layer is provided on the surface of the substrate; in the step of forming the shielding portion on the substrate using 3D printing technology: the shielding portion is directly formed on the green paint layer.

[0017] In an optional embodiment, a green paint layer is provided on the surface of the substrate; the substrate has a pad that exposes the surface of the green paint layer;

[0018] In the step of forming the shielding portion on the substrate by using 3D printing technology: the shielding portion is directly formed on the pad.

[0019] In an optional embodiment, the shielding portion has a first end and a second end that are arranged opposite to each other, the first end is connected to the substrate, and a cross-sectional area of ​​the second end is smaller than a cross-sectional area of ​​the first end.

[0020] In an optional embodiment, the second end is in a Z-shaped continuous bend, a wave shape, or a step shape.

[0021] In an optional embodiment, the cross-section of the second end is in an arc shape, a sector shape, or a polygon shape, and the cross-section of the second end gradually decreases in a direction away from the substrate.

[0022] In an optional embodiment, the second end has a through hole and / or a groove.

[0023] In an optional embodiment, the step of forming the shielding portion on the substrate using 3D printing technology includes:

[0024] forming a main body having a first end on the substrate by using 3D printing technology;

[0025] The second end is formed at the end of the main body away from the first end by using 3D printing technology; wherein the through hole and / or the groove are integrally formed in the step of forming the second end by using 3D printing.

[0026] In an optional embodiment, the shielding portion includes a plurality of shielding columns arranged at intervals; and / or the shielding portion includes a shielding wall having a continuous surface.

[0027] In an optional embodiment, a projection shape of the shielding portion on the substrate is a closed shape or has at least one opening.

[0028] In an optional embodiment, a second element is further provided on the substrate, and the shielding portion isolates the first element from the second element.

[0029] In a second aspect, the present invention provides a packaging structure, which is manufactured using the electromagnetic shielding structure manufacturing method as described in any one of the aforementioned embodiments.

[0030] The beneficial effects of the embodiments of the present invention include, for example:

[0031] The electromagnetic shielding structure manufacturing method and packaging structure provided by the embodiment of the present invention are used to form the shielding part for shielding and isolating the first element by 3D printing technology. The shielding part can be preformed first, and during the plastic sealing, the plastic sealing material and the printed material of the shielding part undergo a cross-linking reaction, which can further fix and strengthen the shielding part to prevent the shielding part from tilting or deforming. It is also beneficial to improve the bonding force between the shielding part and the plastic sealing body, which helps to improve the reliability of electromagnetic shielding. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 and Figure 2 A schematic diagram of a process for manufacturing an electromagnetic shielding structure provided by an embodiment of the present invention;

[0034] Figure 3 A schematic diagram of a structure in which a shielding column is used as a shielding part in a packaging structure provided in an embodiment of the present invention;

[0035] Figure 4 A schematic diagram of the projection structure of the shielding part on the substrate in the packaging structure provided by an embodiment of the present invention;

[0036] Figure 5A schematic diagram of a structure in which a shielding wall is used as a shielding part in a packaging structure provided in an embodiment of the present invention;

[0037] Figure 6 A schematic structural diagram of the projection of the shielding wall on the substrate in the packaging structure provided by an embodiment of the present invention;

[0038] Figure 7 A schematic structural diagram of a shielding portion in a packaging structure provided by an embodiment of the present invention;

[0039] Figure 8 and Fig. 9 A schematic diagram of a structure in which a projection shape of a shielding portion on a substrate has an opening in a packaging structure provided by an embodiment of the present invention;

[0040] Figures 10 to 14 Several structural schematic diagrams of the shielding part in the packaging structure provided by the embodiment of the present invention;

[0041] Fig.15 A schematic diagram of a structure in which a shielding portion is directly formed on a green paint layer in a packaging structure provided by an embodiment of the present invention;

[0042] Fig.16 A schematic diagram of a structure in which a shielding portion is formed on a pad in a packaging structure provided by an embodiment of the present invention;

[0043] Fig.17 Another schematic diagram of a structure in which a shielding portion is formed on a pad in a packaging structure provided by an embodiment of the present invention;

[0044] Fig.18 A schematic diagram of a structure in which no pad is required in the packaging structure provided by an embodiment of the present invention, and a shielding column is directly formed on a substrate;

[0045] Fig.19 A schematic diagram of a structure in which a shielding part adopts a hollow structure in a packaging structure provided by an embodiment of the present invention;

[0046] Fig. 20 A schematic diagram of a structure in which a shielding part in a packaging structure provided by an embodiment of the present invention adopts a hollow structure and is distributed on a cutting path.

[0047] Icon: 100-packaging structure; 110-substrate; 111-wiring layer; 112-solder pad; 113-green paint layer; 114-solder pad; 115-ground wiring layer; 121-first element; 122-second element; 130-shielding part; 131-shielding column; 132-shielding wall; 141-first end; 142-second end; 143-through hole; 144-groove; 145-main body; 150-plastic package; 160-solder ball; 170-metal layer. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0049] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0051] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0052] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0053] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0054] Please refer to Figure 1 and Figure 2 This embodiment provides a method for manufacturing an electromagnetic shielding structure, which mainly includes the following steps:

[0055] Step S1: providing a substrate 110 having a first element 121 .

[0056] Step S2: using 3D printing technology to form a shielding portion 130 on the substrate 110; wherein the shielding portion 130 is arranged on the periphery of the first element 121; this step includes: constructing a three-dimensional model of the shielding portion 130; identifying a target position on the substrate 110; and laying printed material at the target position according to the three-dimensional model to preform the shielding portion 130.

[0057] Step S3: injecting a molding compound onto the substrate 110 to form a molding body 150 encapsulating the first element 121 and the shielding portion 130 ; wherein the molding compound and the printing material undergo a cross-linking reaction.

[0058] Step S4 : grinding the plastic package body 150 to expose the shielding portion 130 from the surface of the plastic package body 150 .

[0059] Step S5: forming a metal layer 170 electrically connected to the shielding part 130 on the surface of the plastic package body 150; at least one of the metal layer 170 and the shielding part 130 has a grounding property.

[0060] In this embodiment, the shielding part 130 used for shielding and isolating the first element 121 is formed by 3D printing technology. The shielding part 130 can be preformed first, and during the plastic packaging, the plastic packaging material and the printed material of the shielding part 130 undergo a cross-linking reaction, which can further fix and strengthen the shielding part 130 and prevent the shielding part 130 from tilting or deforming. It is also helpful to improve the bonding force between the shielding part 130 and the plastic packaging body 150, which helps to improve the reliability of electromagnetic shielding.

[0061] In step S1, a substrate 110 is provided, in which a wiring layer 111 is pre-buried. The wiring layer 111 is led out to the surface of the substrate 110 to form a pad 112. The first component 121 is mounted on the pad 112 of the substrate 110 to achieve electrical connection between the first component 121 and the substrate 110. The first component 121 includes but is not limited to a chip or a component. The number of the first component 121 can be one or more.

[0062] Optionally, a second element 122 spaced apart from the first element 121 may be mounted on the substrate 110. The second element 122 is electrically connected to the substrate 110. The second element 122 may be one or more. The second element 122 includes but is not limited to a chip or a component. The shielding portion 130 is used to isolate the first element 121 and the second element 122 to avoid mutual interference between the first element 121 and the second element 122.

[0063] In step S2, a preformed shielding part 130 is formed on the substrate 110 by 3D printing according to the pre-constructed three-dimensional model of the shielding part 130. Optionally, the printing material of the shielding part 130 is a nano-metal conductive silver paste. The nano-metal conductive silver paste can be a composition formed by nano-metal, epoxy resin, polyurethane resin, nano-graphene powder and high molecular polymer. Among them, the nano-metal includes but is not limited to at least one of nano-gold, nano-silver and nano-copper. The printing material is a thermosetting material. The preforming temperature is 100°C to 200°C, which is conducive to the pre-curing and forming of the shielding part 130. Optionally, the printing time of each shielding part 130 is about 30 seconds to 2 minutes depending on the printing material and the printing area.

[0064] In step S3, a molding process is used to form a plastic encapsulation body 150. During the molding process, the molding and baking temperatures are used to cause a cross-linking reaction between the molding material and the printing material, so that the nano-metal conductive silver paste is completely cured and the bonding force between the plastic encapsulation body 150 and the conductive silver paste is improved. Optionally, the molding and baking curing temperature of the molding material is 250° C. to 350° C.

[0065] Combination Figure 3 and Figure 4 Optionally, the shielding portion 130 includes a plurality of shielding columns 131 arranged at intervals. Figure 5 and Figure 6 The shielding part 130 includes a shielding wall 132 having a continuous surface. The shielding wall 132 may be a solid or hollow structure. Alternatively, Figure 7 The shielding part 130 may also include shielding columns 131 and shielding walls 132. For example, one or several surfaces are shielded by shielding columns 131, and the remaining surfaces are shielded by shielding walls 132.

[0066] Optionally, the projection shape of the shielding portion 130 on the substrate 110 is a closed shape or has at least one opening. Figure 4 , if it is a closed shape, such as a circle, oval, square, rectangle, triangle, rhombus, pentagon, hexagon or other polygon, etc. Figure 6 , Figure 8 , Fig. 9 The projection has an opening shape including but not limited to a straight line, L-shape, cross-shape, C-shape, U-shape, T-shape, X-shape, H-shape, Z-shape or N-shape, etc., which is not specifically limited here.

[0067] It can be understood that the shielding part 130 can be in the form of a shielding column 131 or a shielding wall 132. Figure 5 The shielding part 130 has a first end 141 and a second end 142 that are arranged opposite to each other. The first end 141 is connected to the substrate 110, and the second end 142 is relatively far away from the substrate 110. The cross-sectional area of ​​the second end 142 is smaller than the cross-sectional area of ​​the first end 141. That is, the second end 142 is formed with a relative tip. With such an arrangement, when performing plastic encapsulation, the tip has a diversion effect on the plastic encapsulation mold flow, which can accelerate the flow of the mold flow, and at the same time reduce the pressure of the mold flow on the top of the shielding part 130, thereby preventing the shielding part 130 from bending, tilting, breaking or other deformation caused by the mold flow pressure. In addition, the tip can also increase the contact area between the shielding part 130 and the plastic encapsulation body 150, give full play to the cross-linking reaction, improve the bonding force between the two, and improve the structural reliability.

[0068] Optional, such as Fig.10 As shown, the second end 142 may be stepped, and the number of steps may be two, three, four or more. Fig.11 As shown, it can also be in the shape of a cone or a truncated cone, that is, the surface is smoothly reduced.

[0069] Or, if Fig.12 As shown, the second end 142 is Z-shaped continuous bend or wave-shaped. In this way, since the second end 142 has multiple bends, the stress state and stress point of the second end 142 can be changed, which is conducive to alleviating mold flow impact and reducing the risk of deformation of the shielding part 130 due to molding.

[0070] Optionally, the cross section of the second end 142 gradually decreases in the direction away from the substrate 110. It is understood that the second end 142 can be spherical, hemispherical, ellipsoidal, prism-shaped, pyramid-shaped or any other shape. The cross section of the second end 142 can be arc-shaped, fan-shaped, triangular or other polygonal or a combination of multiple shapes.

[0071] Optional, such as Fig.13 , Fig.14 As shown, the second end 142 has a through hole 143 and / or a groove 144. It is understood that the second end 142 is provided with a through hole 143, or is provided with a groove 144, or is provided with a through hole 143 and a groove 144 respectively, which is not specifically limited here.

[0072] It can be understood that in the step of forming the shielding portion 130 on the substrate 110 using 3D printing technology, a main body 145 having a first end 141 can be first formed on the substrate 110 using 3D printing technology. The main body 145 is perpendicular to the substrate 110 and extends in a direction away from the substrate 110. The second end 142 is then formed at the end of the main body 145 away from the first end 141 using 3D printing technology. Among them, the through hole 143 and / or the groove 144 are integrally formed in the step of forming the second end 142 using 3D printing. Of course, it is not limited to this. After the second end 142 is formed by 3D printing, a through hole 143 or a groove 144 can be formed on the second end 142 by laser, etching, electron beam or other methods. Fig.13 , a through hole 143 is formed on the shielding column 131. Fig.14 , a structure of a through hole 143 and a groove 144 is formed on the shielding wall 132.

[0073] Optional, combined Fig.15 , a green paint layer 113 is provided on the surface of the substrate 110; in the step of forming the shielding part 130 on the substrate 110 using the 3D printing technology: the shielding part 130 can be directly formed on the green paint layer 113. In this way, there is no need to form the pad 114 on the substrate 110, which greatly reduces the design of the ground wiring layer 115, reduces the number of layers and length of the wiring layer 111 in the substrate 110, and thus can greatly reduce the parasitic effect and electromagnetic interference generated by the wiring layer 111.

[0074] In some embodiments, in combination Fig.16 and Fig.17 The surface of the substrate 110 is provided with a green paint layer 113; the substrate 110 has a pad 114 that exposes the surface of the green paint layer 113. In the step of forming the shielding part 130 on the substrate 110 using the 3D printing technology: the shielding part 130 is directly formed on the pad 114. Fig.16 In the embodiment, the shielding column 131 is formed on the pad 114 . Fig.17 In the embodiment, the shielding wall 132 is formed on the pad 114 .

[0075] The arrangement of the pad 114 facilitates the positioning of the printing target position during 3D printing, and is also conducive to improving the bonding force between the substrate 110 and the shielding portion 130. The pad 114 may be formed by extending the ground wiring layer 115 inside the substrate 110 to the surface, that is, the pad 114 and the wiring layer 111 are electrically connected. Alternatively, the pad 114 may also be formed directly on the green paint layer 113 as a seed layer for forming the shielding portion 130, that is, the pad 114 and the ground wiring layer 115 may not be electrically connected.

[0076] Optionally, the pad 114 has a grounding property. The number and shape of the pads 114 can be flexibly designed and are not specifically limited. If the shielding portion 130 adopts the structure of the shielding column 131, a shielding column 131 is printed on each pad 114. The number of pads 114 is equal to the number of shielding columns 131, such as Figure 4 In some embodiments, the number of pads 114 may be less than the number of shielding columns 131, that is, no pads 114 are provided under some shielding columns 131, and only some shielding columns 131 have pads 114 under them. Fig. 9 , the number of pads 114 can be reduced, thereby reducing the number of layers and length of the wiring layer 111, reducing parasitic effects and electromagnetic interference. Alternatively, all shielding columns 131 are directly printed on the green paint layer 113 of the substrate 110, without setting pads 114, such as Fig.18 shown.

[0077] In some embodiments, the surface of the pad 114 can be larger than the sum of the cross-sectional areas of the plurality of shielding posts 131, that is, the size of the pad 114 is designed to be relatively large and distributed in a planar manner. Multiple shielding posts 131 can be printed on one pad 114. If the shielding portion 130 adopts the structural form of a shielding wall 132, the area of ​​the bottom of the shielding wall 132 and the area of ​​the pad 114 can be equal and similar in shape. Alternatively, in some embodiments, the area of ​​the pad 114 is smaller than the area of ​​the bottom of the shielding wall 132, and the bottom of the shielding wall 132 is partially located on the pad 114 and partially located on the green paint layer 113, which is not specifically limited here.

[0078] In addition, the pads 114 can be distributed in a dotted, planar, or dot-planar combination, and the pads 114 can extend to the cutting path area, that is, the pads 114 are cut and exposed from the side edges during cutting and separation. Of course, the pads 114 can also be distributed to avoid the cutting paths, which is not specifically limited here.

[0079] It is worth noting that if traditional metal wire bonding is used, a bonding pad must be designed on the surface of the substrate, and the shielding wire is bonded on the bonding pad, because traditional bonding cannot be achieved on non-metallic materials such as green paint layers. In this embodiment, 3D printing is used, and the shielding part 130 can be directly formed on the green paint layer 113 without setting the pad 114. The process is simpler, the process efficiency is higher, and the structural design of the substrate 110 is more flexible.

[0080] Step S4: After the plastic package 150 is cured, the plastic package 150 is ground to expose the shielding portion 130 from the surface of the plastic package 150. In the grinding process, the portion of the plastic package 150 that is higher than the shielding portion 130 needs to be completely ground. Alternatively, the plastic package 150 and part of the shielding portion 130 are ground and removed together to make the surface smoother. The grinding thickness depends on the actual situation. The second end 142 can be partially ground and removed or the second end 142 can be completely ground and removed, which is not specifically limited here.

[0081] In this embodiment, the second end 142 is completely removed by grinding, so that a larger cross section of the shielding part 130 contacts the subsequently sputtered metal layer 170, increasing the contact area and improving the contact reliability. In addition, the second end 142 is set as a tip and the cross-sectional area is gradually reduced, which is conducive to reducing the possibility of contact between adjacent shielding columns 131 during the grinding process, avoiding cracks or breaks in the shielding part 130 during the grinding process, and reducing the grinding volume of the shielding part 130, thereby improving the grinding efficiency.

[0082] After grinding, solder balls 160 are implanted on the side of the substrate 110 away from the plastic package 150. The substrate 110 is cut along the dicing lines to separate into individual products.

[0083] Step S5: Protect the solder ball 160 at the bottom, sputter the single product, and form a metal layer 170 on the upper surface and four sides of the plastic package 150. The metal layer 170 contacts the shielding part 130 exposed on the surface of the plastic package 150 to achieve electrical connection, thereby completing the preparation of the shielding structure.

[0084] Combination Fig.19, if the shielding wall 132 adopts a hollow structure. After the second end 142 is ground and removed, the cavity of the shielding wall 132 will be exposed. When the metal layer 170 is subsequently sputtered, the metal layer 170 will adhere to the inner wall of the cavity and to the surface of the substrate 110. Optionally, the metal layer 170 attached to the surface of the substrate 110 contacts the pad 114. In this way, double-layer shielding can be achieved, and the shielding is more reliable.

[0085] Combination Fig. 20 In some embodiments, the hollow shielding wall 132 can also be arranged on the cutting path, and after subsequent cutting, the remaining inner wall on one side is used as electromagnetic shielding isolation. If the first component 121 is symmetrically arranged relative to the cutting path when mounting the first component 121, and the hollow shielding wall 132 is located on the cutting path, after cutting and separation, one shielding wall 132 is divided into two halves and used in two single products respectively, one half is used as the shielding of one first component 121, and the other half is used as the shielding of another first component 121, which can greatly improve the packaging efficiency.

[0086] Of course, in some embodiments, the hollow shielding wall 132 can also avoid the cutting path distribution, which is not specifically limited here. It should be understood that similarly, when the shielding part 130 adopts the shielding column 131, it can also adopt a hollow or solid structure, and can also be set on the cutting path, or avoid the cutting path design, which is not specifically limited here.

[0087] It should be noted that if there is no pad 114 on the green paint layer 113; or if there is a pad 114, but the pad 114 and the ground wiring layer 115 in the substrate 110 are not electrically connected. The ground wiring layer 115 in the substrate 110 can be extended to the cutting path, so that the wiring layer 111 is exposed from the cutting sidewall after subsequent cutting, such as Fig.15 , and then metal sputtering is performed to form a metal layer 170, so that the metal layer 170 contacts the ground wiring layer 115 exposed on the side wall and has a grounding property, which can achieve the effect of electromagnetic shielding. Of course, the shielding part 130 or the metal layer 170 can also be grounded in other ways to achieve the electromagnetic shielding effect.

[0088] The embodiment of the present invention also provides a packaging structure 100, which is prepared by the electromagnetic shielding structure manufacturing method as described above. In the packaging structure 100, the shielding part 130 used to isolate the first element 121 and the second element 122 is formed by 3D printing technology, which can improve the wiring efficiency and quality. The printing material uses conductive silver paste, which can undergo a cross-linking reaction with the plastic packaging material, thereby improving the structural strength and bonding force, and improving the packaging reliability. In addition, the shielding part 130 can adopt a structure such as a shielding column 131 or a shielding wall 132, and the structure is more flexible. The second end 142 of the shielding part 130 has a combination of one or more structural forms such as a tip, a step, a Z-shaped bending part, a groove 144 and a through hole 143, which effectively reduces the molding, reduces the risk of deformation of the shielding part 130, ensures that the shielding part 130 adopts a shielding column 131 structure with uniform spacing, reliable electromagnetic shielding performance, and prevents clutter from passing through.

[0089] In summary, the electromagnetic shielding structure manufacturing method and the packaging structure 100 provided in the embodiments of the present invention have the following beneficial effects, including:

[0090] The electromagnetic shielding structure manufacturing method and packaging structure 100 provided in the embodiment of the present invention are used to form the shielding part 130 for shielding and isolating the first element 121 by using 3D printing technology. The shielding part 130 can be preformed first, and during the plastic packaging, the plastic packaging material and the printed material of the shielding part 130 undergo a cross-linking reaction, which can further fix and strengthen the shielding part 130 and prevent the shielding part 130 from tilting or deforming. It is also beneficial to improve the bonding force between the shielding part 130 and the plastic packaging body 150, which helps to improve the reliability of electromagnetic shielding.

[0091] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for manufacturing an electromagnetic shielding structure, characterized in that: include: providing a substrate having a first element; Using 3D printing technology to form a shielding portion on the substrate; wherein the shielding portion is arranged on the periphery of the first element; this step includes: constructing a three-dimensional model of the shielding portion; identifying a target position on the substrate; laying a printing material at the target position according to the three-dimensional model to preform the shielding portion; Injecting a plastic encapsulation material onto the substrate to form a plastic encapsulation body encapsulating the first element and the shielding portion; wherein the plastic encapsulation material produces a cross-linking reaction with the printing material; Grinding the plastic package body so that the shielding portion is exposed from the surface of the plastic package body; A metal layer electrically connected to the shielding part is formed on the surface of the plastic package; at least one of the metal layer and the shielding part has a grounding property; In the step of preforming the shielding portion by laying printed material at the target position according to the three-dimensional model: the preforming temperature is 100° C. to 200° C.; In the step of injecting a molding compound onto the substrate to form a molding body encapsulating the first element and the shielding portion: the curing temperature of the molding compound is 250° C. to 350° C.; The shielding portion has a first end and a second end that are oppositely disposed, the first end is connected to the substrate, the cross-sectional area of ​​the second end is smaller than the cross-sectional area of ​​the first end, and the second end is a pointed portion.

2. The method for manufacturing an electromagnetic shielding structure according to claim 1, characterized in that: The printing material adopts nano-metal conductive silver paste.

3. The method for manufacturing an electromagnetic shielding structure according to claim 1, characterized in that: A green paint layer is provided on the surface of the substrate; in the step of forming a shielding part on the substrate using 3D printing technology: the shielding part is directly formed on the green paint layer.

4. The method for manufacturing an electromagnetic shielding structure according to claim 1, characterized in that: The surface of the substrate is provided with a green paint layer; the substrate has a solder pad that exposes the surface of the green paint layer; In the step of forming the shielding portion on the substrate by using 3D printing technology: the shielding portion is directly formed on the pad.

5. The method for manufacturing an electromagnetic shielding structure according to claim 1, characterized in that: The second end is in a Z-shaped continuous bend, a wave shape or a step shape.

6. The method for manufacturing an electromagnetic shielding structure according to claim 1, characterized in that: The cross section of the second end is in an arc shape, a sector shape or a polygon shape, and the cross section of the second end gradually decreases in a direction away from the substrate.

7. The method for manufacturing an electromagnetic shielding structure according to claim 1, characterized in that: The second end has a through hole and / or a groove.

8. The method for manufacturing an electromagnetic shielding structure according to claim 7, characterized in that: The step of forming a shielding portion on the substrate using 3D printing technology includes: forming a main body having a first end on the substrate by using 3D printing technology; The second end is formed at the end of the main body away from the first end by using 3D printing technology; wherein the through hole and / or the groove are integrally formed in the step of forming the second end by using 3D printing.

9. The method for manufacturing an electromagnetic shielding structure according to claim 1, characterized in that: The shielding part includes a plurality of shielding columns arranged at intervals; and / or the shielding part includes a shielding wall having a continuous surface.

10. The method for manufacturing an electromagnetic shielding structure according to claim 1, characterized in that: A projection shape of the shielding portion on the substrate is a closed shape or has at least one opening.

11. The method for manufacturing an electromagnetic shielding structure according to any one of claims 1 to 10, characterized in that: The substrate also has a second element thereon, and the shielding portion isolates the first element from the second element.

12. A packaging structure, characterized in that: The electromagnetic shielding structure is manufactured by the manufacturing method according to any one of claims 1 to 11.

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