A semiconductor high-power TVS preparation device and preparation method thereof

Abstract

The present invention relates to the technical field related to semiconductor processing, and discloses a semiconductor high-power TVS preparation device and a preparation method thereof, wherein the device comprises a drying box, an air supply part, a material receiving box, an intermittent feeding part, a vibration drying part, an intermittent pushing part and an intermittent buffer drying part; the method comprises stacking silver-plated molybdenum sheets and diffused TVS wafers in order from top to bottom until the last layer is a silver-plated molybdenum sheet, and welding the whole into a TVS wafer alloy sintered lump; screening wafer chip columns after cutting the TVS wafer alloy sintered lump; processing the wafer chip columns, and performing intermittent and orderly batch drying treatment on the processed wafer chip columns; achieving synchronous completion of transposition-type multi-position drying of the wafer chip columns during the intermittent delivery process, effectively avoiding the problem of incomplete drying caused by the wafer chip columns being concentrated and piled together for drying treatment, ensuring the drying efficiency of the wafer chip columns while ensuring the drying effect of the wafer chip columns.

Description

Technical Field

[0001] The present invention relates to the technical field related to semiconductor processing, and in particular to a semiconductor high-power TVS preparation device and a preparation method thereof. Background Art

[0002] Semiconductor high-power TVS (transient voltage suppression diode) is an important electronic component, mainly used to protect electronic equipment from damage caused by transient high voltage or surge current. The principle is that TVS is in a high-resistance state during normal operation. When a transient overvoltage occurs, it will quickly enter a low-resistance state to shunt or absorb excess energy, thereby protecting the back-end circuit.

[0003] The preparation of existing semiconductor high-power TVS includes stacking small-sized chips and small-sized silver-plated copper particles layer by layer to form wafer chip columns. In the drying process of the wafer chip columns, the wafer chip columns to be dried are generally stacked together and then dried by air intake and blow-drying. This method has the problem of insufficient drying of the contact surfaces between adjacent wafer chip columns, and it takes time to fully dry them. The overall drying efficiency is low and the drying effect cannot be guaranteed. Summary of the invention

[0004] The present invention provides a semiconductor high-power TVS preparation device and a preparation method thereof, which solves the problem that the preparation of the existing semiconductor high-power TVS includes stacking small-sized chips and small-sized silver-plated copper particles layer by layer to form a wafer chip column, and in the drying process of the wafer chip column, the wafer chip columns to be dried are generally piled together and then dried by air intake and drying. This method has the problem that the contact surfaces between adjacent wafer chip columns are not dried properly, and it takes time to fully dry the process, and the overall drying efficiency is low and the drying effect cannot be guaranteed.

[0005] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0006] In a first aspect, a semiconductor high-power TVS preparation device is provided, the device comprising a drying box and an air supply portion arranged in the drying box; the device comprises:

[0007] The material receiving box is fixedly connected with the outer wall of the drying box;

[0008] The intermittent feeding part is arranged in the middle of the drying box body, and is used to intermittently divide the wafer chip columns to be dried and then lay them flat for feeding;

[0009] The vibration drying section is arranged directly below the intermittent feeding section and is used for the initial position-changing vibration drying of the wafer chip column;

[0010] An intermittent pushing part is arranged at a side of the intermittent feeding part away from the receiving box and is located between the intermittent feeding part and the vibration drying part, and is used for intermittently pushing the vibration drying part to perform rolling transposition drying on the wafer chip column after the initial vibration drying; and

[0011] The intermittent buffer drying section is arranged on the other side of the intermittent feeding section close to the receiving box and is located between the intermittent feeding section and the vibration drying section, and is used for secondary position-changing drying and extending the drying time of the wafer chip column after the initial vibration drying while automatically receiving the material;

[0012] When the intermittent feeding section and the intermittent pushing section are in a state of no interaction force, the intermittent buffer drying section is in a state of having interaction force with the intermittent feeding section, the intermittent pushing section is in a state of moving toward the vibration drying section and acting on the vibration drying section, and the intermittent buffer drying section is in a state of moving toward the vibration drying section; when the intermittent feeding section and the intermittent pushing section are in a state of having interaction force, the intermittent buffer drying section is in a state of having no interaction force with the intermittent feeding section, the intermittent pushing section is in a state of moving away from the vibration drying section, and the intermittent buffer drying section is in a state of moving away from the vibration drying section.

[0013] Furthermore, a gap is provided at the connection between the drying box and the material receiving box.

[0014] Furthermore, a partition plate is fixedly arranged in the drying box, and a plurality of drying holes for ventilation are opened on the partition plate;

[0015] Wherein, the partition plate is composed of a horizontal section and an inclined section, the inclined section of the partition plate is located between the horizontal section and the notch of the partition plate, and the bottom end of the inclined section of the partition plate is fixedly connected to the bottom of the notch;

[0016] The intermittent feeding part, the vibration drying part, the intermittent pushing part and the intermittent buffer drying part are all located between the partition plate and the top inner wall of the drying box body, and the air supply part is arranged between the partition plate and the bottom inner wall of the drying box body.

[0017] Furthermore, the air supply unit includes:

[0018] A gas collecting chamber is fixedly arranged at the bottom of the partition plate, and the interior of the chamber is interconnected with the drying holes; and

[0019] The air supply mechanism is fixedly arranged on the inner wall of the bottom of the drying box body and is fixedly connected with the air collecting chamber through the air supply pipe.

[0020] Furthermore, a mounting platform is provided between the partition plate and the top inner wall of the drying box, and an avoidance mounting groove is provided at the bottom of the mounting platform. The intermittent feeding part includes:

[0021] A driving member is fixedly arranged on the drying box body;

[0022] The feeding avoidance groove is opened in the middle of the top surface of the mounting table;

[0023] A feeding roller is rotatably disposed in the feeding avoidance groove and is fixedly and detachably connected to the driving end of the driving member; and

[0024] The feeding trough is symmetrically arranged on the feeding roller;

[0025] Wherein, the top and bottom of the feeding avoidance groove are both open, and the vibration drying part is located directly below the feeding avoidance groove;

[0026] When the feeding roller and the intermittent pushing part are in a state of interaction force, the intermittent buffer drying part is in a state of no interaction force with the feeding roller, the intermittent pushing part is in a state of moving away from the vibration drying part, and the intermittent buffer drying part is in a state of moving away from the vibration drying part; when the feeding roller and the intermittent pushing part are in a state of no interaction force, the intermittent buffer drying part is in a state of interaction force with the feeding roller, the intermittent pushing part is in a state of moving toward the vibration drying part and acting on the vibration drying part, and the intermittent buffer drying part is in a state of moving toward the vibration drying part.

[0027] Further, the vibration drying unit comprises:

[0028] A guide seat is symmetrically arranged on the partition plate;

[0029] A guide support member, elastically and slidably arranged on the guide seat;

[0030] A receiving frame is elastically rotatably arranged on the guide support member with damping; and

[0031] A plurality of drying avoidance grooves are arranged on the side wall and the bottom wall of the receiving frame.

[0032] Furthermore, a push avoidance groove is provided on the mounting platform, and the intermittent push portion includes:

[0033] A first mounting column is rotatably disposed in the push avoidance groove;

[0034] A first drive wheel is fixedly mounted on the first mounting post and intermittently interacts with the feed roller;

[0035] A first mainspring, disposed on the first mounting column and the top wall of the push avoidance groove, for storing energy and providing power;

[0036] The transmission mounting column is rotatably arranged in the push avoidance groove;

[0037] A first driving gear is fixedly mounted on the transmission mounting column;

[0038] An incomplete gear is rotatably disposed in the push avoidance groove and is intermittently meshed with the first driving gear;

[0039] A push plate, one end of which is horizontally slidably disposed in the push avoidance groove, and the other end of which is slidably penetrates through the side wall of the mounting platform; and

[0040] An elastic telescopic rod is used for power transmission between the incomplete gear and the push plate;

[0041] Among them, the pushing plate is T-shaped, the first mounting column and the transmission mounting column are connected through a first transmission member, one end of the elastic telescopic rod is eccentrically fixed on the incomplete gear, and the other end is rotatably set on the pushing plate away from the side of the receiving frame, and the first driving wheel overflows the surface of the feeding avoidance groove.

[0042] Further, the side wall of the avoidance installation groove opposite to the inclined section of the partition plate is a slope corresponding thereto, and the side wall of the avoidance installation groove opposite to the inclined section of the partition plate is provided with a buffer avoidance through groove of the same angle, and the intermittent buffer drying part comprises:

[0043] A second mounting column is rotatably disposed in the buffer avoidance slot;

[0044] A second drive wheel is fixedly mounted on the second mounting post and intermittently interacts with the feed roller;

[0045] A second mainspring is disposed on the second mounting column and the top wall of the buffer avoidance slot and is used to store energy and provide power;

[0046] A buffer installation column is rotatably arranged in the buffer avoidance slot;

[0047] A second driving gear is fixedly mounted on the buffer mounting column;

[0048] A transmission rack is slidably disposed in the buffer avoidance groove and meshed with the second driving gear;

[0049] The buffer connecting frame is U-shaped and fixedly arranged near the end of the transmission rack;

[0050] A buffer bearing mechanism is elastically rotatably arranged at the end of the buffer connecting frame;

[0051] A load-carrying reversing power mechanism is disposed between the buffer load-carrying mechanism and the inclined section of the partition plate and interacts with the buffer load-carrying mechanism intermittently; and

[0052] A toggle mechanism is arranged on the inclined section of the partition plate;

[0053] Wherein, the second mounting column and the buffer mounting column are transmission-connected via a second transmission member, the buffer connecting frame and the inclined section of the partition plate always maintain a vertical state in space, and the second driving wheel overflows the surface of the feeding avoidance groove.

[0054] Furthermore, the buffer bearing mechanism includes:

[0055] A load-bearing rotating shaft is elastically rotatably disposed on a buffer connecting frame away from a side of the transmission rack; and

[0056] A plurality of bearing rods are evenly and fixedly arranged on the bearing shaft.

[0057] In a second aspect, a method for preparing a semiconductor high-power TVS is provided, which uses the above-mentioned semiconductor high-power TVS preparation device and includes the following specific steps:

[0058] S1: Use ceramic sheets as jigs, stack silver-plated molybdenum sheets and diffused TVS wafers in order from top to bottom until the last layer is a silver-plated molybdenum sheet. The unidirectional TVS wafers must be stacked in the same direction, and use lead-tin solder sheets to weld the whole into a TVS wafer alloy lump through an alloy furnace or a vacuum welding furnace;

[0059] S2: Use a wire cutting machine to cut the TVS wafer alloy sintered lump into wafer chip columns of required size;

[0060] S3: Screen the wafer chip columns with edges and irregular cutting, and use a chemical agent to treat the damage on the wafer chip column caused by wire cutting to make the surface of the wafer chip column smooth;

[0061] S4: putting the processed wafer chip column into a drying box for intermittent and orderly batch drying treatment to obtain a dried wafer chip column.

[0062] The above solution of the present invention includes at least the following beneficial effects:

[0063] The present invention is provided with an intermittent feeding part, a vibration drying part, an intermittent pushing part and an intermittent buffer drying part. The intermittent feeding part distributes the wafer chip columns intermittently and then flattens them and delivers them to the vibration drying part, so as to utilize the downward impact force of the wafer chip columns and the elastic force of the vibration drying part to work together with the air supply part to perform initial transposition vibration drying on the wafer chips. When the intermittent feeding part is about to deliver the wafer chip columns into the vibration drying part, the intermittent feeding part and the intermittent pushing part are in a state of having an interaction force, while the intermittent buffer drying part is in a state of having no interaction force with the intermittent feeding part, the intermittent pushing part is in a state of moving away from the vibration drying part, and the intermittent buffer drying part is in a state of moving away from the vibration drying part. At this time, the vibration drying part is reset to its original state to receive the wafer chip columns to be dried so as to perform initial transposition vibration drying on the wafer chips.

[0064] When the intermittent feeding section and the intermittent pushing section are in a state of no interaction force, the intermittent buffer drying section is in a state of having interaction force with the intermittent feeding section, the intermittent pushing section is in a state of moving toward the vibration drying section and acting on the vibration drying section, and the intermittent buffer drying section is in a state of moving toward the vibration drying section, that is, the intermittent pushing section pushes and rolls the wafer chip column in the vibration drying section into the adjacent intermittent buffer drying section to perform secondary transposition drying in combination with the air supply section and prolong the drying time of the wafer chip column after the initial vibration drying, and automatically collects the material into the collecting box;

[0065] The intermittent feeding section is again in a state of interaction force with the intermittent pushing section, while the intermittent buffer drying section is in a state of no interaction force with the intermittent feeding section, so that the wafer chip columns to be dried are intermittently and orderly paved and delivered in this cycle, so that the wafer chip columns can be simultaneously completed with multi-position drying of the displacement type during the intermittent delivery process, and the problem of incomplete drying of the contact surfaces of each wafer chip column caused by the wafer chip columns to be dried being piled together for drying is effectively avoided. Moreover, there is no need to pause during the entire process of intermittent and orderly delivery and drying of each wafer chip column, so as to ensure the drying efficiency of the wafer chip column and the drying effect of the wafer chip column. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 A schematic diagram of the overall three-dimensional structure of a semiconductor high-power TVS manufacturing device provided by an embodiment of the present invention;

[0067] Figure 2 This is a schematic diagram of the three-dimensional structure of the interior of the drying box in an embodiment of the present invention;

[0068] Figure 3 It is a three-dimensional structural schematic diagram of a partial cross-sectional view of the interior of a drying box in an embodiment of the present invention;

[0069] Figure 4 The embodiment of the present invention provides Figure 3 The structural diagram at A in the middle;

[0070] Figure 5 It is a schematic diagram of a partial three-dimensional structure of a combination of an intermittent feeding part and an intermittent pushing part in an embodiment of the present invention;

[0071] Figure 6 The embodiment of the present invention provides Figure 5 Schematic diagram of the structure at B in the middle;

[0072] Figure 7 It is a schematic diagram of the three-dimensional structure of the combination of the intermittent feeding section, the vibration drying section, the intermittent pushing section and the intermittent buffer drying section in an embodiment of the present invention;

[0073] Figure 8 The embodiment of the present invention provides Figure 7 Schematic diagram of the structure at C in the middle;

[0074] Fig. 9 The embodiment of the present invention provides Figure 7 Schematic diagram of the structure at D in the middle;

[0075] Fig.10 The embodiment of the present invention provides Figure 7 Schematic diagram of the structure at E in the middle;

[0076] Fig.11 It is a schematic diagram of the three-dimensional structure of the combination of the limiting unit and the bearing rod in an embodiment of the present invention.

[0077] Description of reference numerals:

[0078] In the figure: 1, drying box; 2, receiving box; 3, notch; 4, partition plate; 5, drying hole; 6, feeding bin; 7, air collecting chamber; 8, air supply mechanism; 9, mounting table; 10, feeding avoidance groove; 11, feeding roller; 12, driving member; 13, feeding groove; 14, avoidance mounting groove; 15, guide seat; 16, polygonal rod; 17, cylindrical rod; 18, drying avoidance groove; 19, receiving frame; 20, first mounting column; 21, first driving wheel; 22, first spring; 23, transmission mounting column; 24, first driving gear; 25 , incomplete gear; 26, push plate; 27, elastic telescopic rod; 28, buffer avoidance groove; 29, second mounting column; 30, second drive wheel; 31, second spring; 32, buffer mounting column; 33, second drive gear; 34, transmission rack; 35, buffer connecting frame; 36, load-bearing shaft; 37, load-bearing rod; 38, support drive rack; 39, meshing gear; 40, toggle protrusion; 41, limit support; 42, limit roller; 43, limit plate; 44, elastic sheet; 45, drying adsorption part; 46, push avoidance groove. DETAILED DESCRIPTION

[0079] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0080] like Figures 1 to 11 As shown, an embodiment of the present invention provides a semiconductor high-power TVS preparation device, the device includes a drying box 1 and an air supply portion arranged in the drying box 1, and the device also includes:

[0081] The receiving box 2 is fixedly connected to the outer wall of the drying box 1 and is used for storing the wafer chip columns after drying;

[0082] The intermittent feeding part is arranged in the middle of the drying box 1, and is used to intermittently divide the wafer chip columns to be dried and then lay them flat for feeding;

[0083] The vibration drying section is arranged directly below the intermittent feeding section and is used for the initial position-changing vibration drying of the wafer chip column;

[0084] An intermittent pushing part is arranged at a side of the intermittent feeding part away from the receiving box 2 and is located between the intermittent feeding part and the vibration drying part, and is used for intermittently pushing the vibration drying part to perform rolling transposition drying on the wafer chip column after the initial vibration drying; and

[0085] The intermittent buffer drying section is arranged on the other side of the intermittent feeding section close to the receiving box 2 and is located between the intermittent feeding section and the vibration drying section, and is used for secondary position-changing drying and extending the drying time of the wafer chip column after the initial vibration drying while automatically receiving the material;

[0086] When the intermittent feeding section and the intermittent pushing section are in a state of no interaction force, the intermittent buffer drying section is in a state of having interaction force with the intermittent feeding section, the intermittent pushing section is in a state of moving toward the vibration drying section and acting on the vibration drying section, and the intermittent buffer drying section is in a state of moving toward the vibration drying section; when the intermittent feeding section and the intermittent pushing section are in a state of having interaction force, the intermittent buffer drying section is in a state of having no interaction force with the intermittent feeding section, the intermittent pushing section is in a state of moving away from the vibration drying section, and the intermittent buffer drying section is in a state of moving away from the vibration drying section.

[0087] Specifically, a notch 3 is provided at the connection point between the drying box 1 and the material receiving box 2 so that the wafer chip column after drying can enter the material receiving box 2 through the notch 3 .

[0088] Furthermore, in order to better place the wafer chip columns to be dried, the top of the drying box 1 is fixedly connected to a placing bin 6 with an open top, and the front view cross-section of the placing bin 6 is V-shaped.

[0089] In the actual application process of this embodiment, first, the wafer chip column uses a ceramic sheet as a fixture to stack the silver-plated molybdenum sheet and the TVS wafer layer by layer, weld them as a whole into a burnt lump, and then line cut them. The cut wafer chip column needs to be dried after screening and chemical treatment to ensure the subsequent application of the wafer chip column. Then, the wafer chip column that needs to be dried is collectively put into the drying box 1, and the intermittent feeding part intermittently divides the wafer chip column and flattens it and sends it to the vibration drying part, so as to use the downward impact force of the wafer chip column and the elastic force of the vibration drying part to work together with the air supply part to stabilize the wafer. The chips undergo initial transposition vibration drying. When the intermittent feeding section is about to deliver the wafer chip column into the vibration drying section, the intermittent feeding section and the intermittent pushing section are in a state of interaction force, while the intermittent buffer drying section is in a state of no interaction force with the intermittent feeding section. The intermittent pushing section is in a state of moving away from the vibration drying section, and the intermittent buffer drying section is in a state of moving away from the vibration drying section. At this time, the vibration drying section is reset to its original state to receive the wafer chip column to be dried so as to perform initial transposition vibration drying on the wafer chips. Subsequently, the intermittent feeding section and the intermittent pushing section are in a state of no interaction force. In the state of mutual interaction force, the intermittent buffer drying section is in a state of mutual interaction force with the intermittent feeding section, the intermittent pushing section is in a state of moving toward the vibration drying section and acting on the vibration drying section, and the intermittent buffer drying section is in a state of moving toward the vibration drying section, that is, the intermittent pushing section pushes the wafer chip column in the vibration drying section into the adjacent intermittent buffer drying section to combine with the air supply section for secondary transposition drying and prolong the drying time of the wafer chip column after the initial vibration drying, and automatically collects the material into the collecting box 2, and then the intermittent feeding section is in a state of mutual interaction force with the intermittent pushing section again. There is an interaction force state, and the intermittent buffer drying part is in a state of no interaction force with the intermittent feeding part, so that the wafer chip columns to be dried are intermittently and orderly paved and delivered in this cycle, so that the wafer chip columns can be synchronously completed with multi-position drying of displacement type during the intermittent delivery process, and the problem of incomplete drying of the contact surfaces of each wafer chip column caused by the wafer chip columns to be dried being piled together for drying is effectively avoided. Moreover, there is no need to pause during the entire process of intermittent and orderly delivery and drying of each wafer chip column, so as to ensure the drying efficiency of the wafer chip column while ensuring the drying effect of the wafer chip column.

[0090] As a preferred embodiment of the present invention, a partition plate 4 is fixedly arranged in the drying box 1, and a plurality of drying holes 5 for ventilation are opened on the partition plate 4;

[0091] The partition plate 4 is composed of a horizontal section and an inclined section, the inclined section of the partition plate 4 is located between the horizontal section of the partition plate 4 and the notch 3, and the bottom end of the inclined section of the partition plate 4 is fixedly connected to the bottom of the notch 3;

[0092] The intermittent feeding section, the vibration drying section, the intermittent pushing section and the intermittent buffer drying section are all located between the partition plate 4 and the top inner wall of the drying box 1 , and the air supply section is arranged between the partition plate 4 and the bottom inner wall of the drying box 1 .

[0093] In actual application of this embodiment, during the process of delivering and exchanging drying of the wafer chip column by the intermittent feeding section, the vibration drying section, the intermittent pushing section and the intermittent buffer drying section, the air supply section blows the dry gas to the wafer chip column through the drying hole 5 to blow dry the wafer chip column.

[0094] As a preferred embodiment of the present invention, the air supply unit comprises:

[0095] The air collecting chamber 7 is fixedly disposed at the bottom of the partition plate 4, and the interior of the air collecting chamber 7 is interconnected with the drying holes 5; and

[0096] The air supply mechanism 8 is fixedly arranged on the inner wall of the bottom of the drying box body 1 and is fixedly connected with the air collecting chamber 7 through an air supply pipe.

[0097] It should be noted that the gas supply mechanism 8 in the embodiment of the present disclosure is an existing product in the prior art. The gas supply mechanism 8 mentioned in the embodiment of the present disclosure are all existing matching products selected on the market according to the use needs and the requirements of the installation space. We only use them and do not improve them. These products are equipped with corresponding instructions and technical support. Therefore, in the embodiment of the present disclosure, we only need to complete the assembly according to the instructions and technical support and then use it. The structural diagram of the gas supply mechanism 8 in the accompanying drawing is only for illustration. Therefore, the gas supply mechanism 8 in the embodiment of the present disclosure will not be described in detail. It is only necessary to achieve the purpose of providing dry gas to the wafer chip column.

[0098] In actual application of this embodiment, during the process of delivering and rotating the wafer chip column in the intermittent feeding section, the vibration drying section, the intermittent pushing section and the intermittent buffer drying section, the air supply mechanism 8 passes the dry gas into the gas collecting chamber 7 through the air supply pipe, and the concentrated dry gas is blown toward the wafer chip column through the drying hole 5 to blow and dry the wafer chip column.

[0099] As a preferred embodiment of the present invention, a mounting platform 9 is provided between the partition plate 4 and the top inner wall of the drying box 1 to provide installation space for the intermittent feeding part, the intermittent pushing part and the intermittent buffer drying part. The upper surface of the mounting platform 9 is V-shaped, and an avoidance installation groove 14 is provided at the bottom of the mounting platform 9. The intermittent feeding part includes:

[0100] The driving member 12 is fixedly arranged on the drying box body 1;

[0101] A feeding avoidance groove 10 is provided in the middle of the top surface of the mounting platform 9;

[0102] A feeding roller 11 is rotatably disposed in the feeding avoidance groove 10 and is fixedly and detachably connected to the driving end of the driving member 12; and

[0103] The feeding trough 13 is symmetrically arranged on the feeding roller 11;

[0104] The top and bottom of the feeding avoidance groove 10 are both open, the vibration drying section is located directly below the feeding avoidance groove 10 and in the avoidance installation groove 14, and the intermittent pushing section and the intermittent buffer drying section are arranged on both sides of the vibration drying section;

[0105] When the feed roller 11 and the intermittent pushing portion are in a state of interaction force, the intermittent buffer drying portion is in a state of no interaction force with the feed roller 11, the intermittent pushing portion is in a state of moving away from the vibration drying portion, and the intermittent buffer drying portion is in a state of moving away from the vibration drying portion; when the feed roller 11 and the intermittent pushing portion are in a state of no interaction force, the intermittent buffer drying portion is in a state of interaction force with the feed roller 11, the intermittent pushing portion is in a state of moving toward the vibration drying portion and acting on the vibration drying portion, and the intermittent buffer drying portion is in a state of moving toward the vibration drying portion.

[0106] Specifically, the driving member 12 is a driving motor, which is used to provide driving force for the rotation of the feeding roller 11 .

[0107] In actual application of this embodiment, the wafer chip column to be dried falls on the upper surface of the mounting table 9 through the delivery bin 6, and the driving member 12 drives the feeding roller 11 to rotate. During the rotation of the feeding roller 11, since the upper surface of the mounting table 9 is V-shaped, the wafer chip column automatically falls into the feeding trough 13, and the wafer chip column can be divided and flattened for delivery to perform intermittent and orderly transportation of the wafer chip column. During the delivery and transportation process, when the feeding roller 11 and the intermittent pushing part are in a state of interaction force, the intermittent buffer drying part is in a state of no interaction force with the feeding roller 11, the intermittent pushing part is in a state of moving away from the vibration drying part, and the intermittent buffer drying part is in a state of moving away from the vibration drying part. At this time, the vibration drying part is in a stable equilibrium state, and the wafer chip column falls into the vibration drying part. Due to the downward impact force of the wafer chip column and the elastic force of the vibration drying part combined with the air supply part to act on the wafer The chips undergo initial position-shifting vibration drying, and then when the feed roller 11 and the intermittent pushing section are in a state of no interaction force, the intermittent buffer drying section is in a state of interaction force with the feed roller 11, and the intermittent pushing section is in a state of moving toward the vibration drying section and acting on the vibration drying section, and the intermittent buffer drying section is in a state of moving toward the vibration drying section, that is, the intermittent pushing section pushes the wafer chip column at the vibration drying section into the adjacent intermittent buffer drying section, and then the intermittent feeding section is again in a state of interaction force with the intermittent pushing section, while the intermittent buffer drying section is in a state of no interaction force with the intermittent feeding section, and combined with the air supply section, secondary position-shifting drying of the wafer chip column is performed, and the drying time of the wafer chip column after the initial vibration drying is extended, and the material is automatically collected into the collecting box 2, so that the wafer chip column is intermittently and orderly delivered in batches and position-shifted for multi-faceted drying and automatic collection is circulated.

[0108] As a preferred embodiment of the present invention, the vibration drying unit comprises:

[0109] The guide seat 15 is symmetrically arranged on the partition plate 4 to provide a mounting support space;

[0110] A guide support member, elastically and slidably disposed on the guide seat 15;

[0111] The receiving frame 19 is elastically rotatably arranged on the guide support member with damping; and

[0112] A plurality of drying avoidance grooves 18 are provided on the side wall and the bottom wall of the receiving frame 19, and are used to provide a passage for the drying gas to assist in drying the wafer chip column;

[0113] Specifically, the guide support member is composed of a polygonal rod 16 and a cylindrical rod 17. The polygonal rod 16 corresponds to the guide seat 15 one by one and is elastically slidably arranged in the guide seat 15. The cylindrical rod 17 is fixedly connected between adjacent polygonal rods 16. The receiving frame 19 is elastically rotatably arranged on the cylindrical rod 17 with damping.

[0114] Specifically, the guide seat 15 is provided with a guide slot that cooperates with the polygonal rod 16 , and a vibration spring is provided between the polygonal rod 16 and the bottom wall of the guide slot.

[0115] Specifically, a torsion spring for resetting to restore a balanced state is provided at the rotation connection between the receiving frame 19 and the cylindrical rod 17 .

[0116] In the actual application of this embodiment, the wafer chip column falls into the receiving frame 19 from the feeding trough 13. Under the combined action of its own downward impact force and the vibration spring, the wafer chip column is in a reciprocating state of falling and bouncing, thereby performing the initial displacement vibration drying of the wafer chip column. At the same time, it is combined with the air supply mechanism 8 to perform the initial displacement vibration and blowing synchronous drying of the wafer chip column. At this time, the feeding roller 11 and the intermittent pushing part are in a state of interaction force, and the intermittent buffer drying part is in a state of no interaction force with the feeding roller 11. When the feeding roller 11 and the intermittent pushing part are in a state of no interaction force, the intermittent buffer drying part is in a state of interaction force with the feeding roller 11, the intermittent pushing part is in a state of moving toward the vibration drying part and acting on the vibration drying part, and the intermittent buffer drying part is in a state of moving toward the vibration drying part, that is, the intermittent pushing part pushes the wafer chip column that has been initially dried into the adjacent intermittent buffer drying part.

[0117] As a preferred embodiment of the present invention, a push avoidance groove 46 is provided on the mounting platform 9, and the intermittent push portion includes:

[0118] The first mounting post 20 is rotatably disposed in the push avoidance groove 46;

[0119] The first driving wheel 21 is fixedly mounted on the first mounting column 20 and interacts with the feed roller 11 intermittently;

[0120] The first mainspring 22 is disposed on the first mounting column 20 and the top wall of the push avoidance groove 46 and is used to store energy and provide power;

[0121] The transmission mounting column 23 is rotatably disposed in the push avoidance groove 46;

[0122] The first driving gear 24 is fixedly mounted on the transmission mounting column 23;

[0123] The incomplete gear 25 is rotatably disposed in the push avoidance groove 46 and is intermittently meshed with the first driving gear 24;

[0124] The push plate 26 has one end horizontally slidably disposed in the push avoidance groove 46 and the other end slidingly penetrates the side wall of the mounting platform 9; and

[0125] The elastic telescopic rod 27 is used for power transmission between the incomplete gear 25 and the push plate 26;

[0126] The push plate 26 is T-shaped, the first mounting column 20 is connected to the transmission mounting column 23 by a first transmission member, one end of the elastic telescopic rod 27 is eccentrically fixed on the incomplete gear 25, and the other end is rotatably set on the push plate 26 away from the receiving frame 19, one end of the first mainspring 22 is fixed on the first mounting column 20, and the other end is fixed on the top wall of the push avoidance groove 46, and the first driving wheel 21 overflows the surface of the feeding avoidance groove 10;

[0127] Specifically, the first transmission member in this embodiment can be a belt pair or a chain pair, and it adopts an existing product in the prior art. This embodiment is not limited here. The first transmission member and the combined structure diagram of the first transmission member, the first mounting column 20 and the transmission mounting column 23 in the accompanying drawings are only for illustration. Therefore, the first transmission member in the disclosed embodiment will not be described in detail, and it is only necessary to achieve the purpose of power transmission.

[0128] In actual application of this embodiment, when the feed roller 11 contacts the first drive wheel 21, under the friction force, the positive rotation of the feed roller 11 drives the first drive wheel 21 to rotate in the opposite direction, that is, drives the first mounting column 20 to rotate in the opposite direction, and under the joint action of the first transmission member and the transmission mounting column 23, drives the first drive gear 24 to rotate in the opposite direction. Due to the intermittent meshing and matching arrangement of the incomplete gear 25 and the first drive gear 24, the incomplete gear 25 is driven to rotate in the positive direction. In the process of the incomplete gear 25 rotating to have no meshing relationship with the first drive gear 24, the incomplete gear 25 drives the push plate 26 to move in the direction away from the receiving frame 19 through the elastic telescopic rod 27, that is, releases the force on the receiving frame 19, and restores the balance state of the receiving frame 19 under the reset action of the torsion spring. At the same time, the first spring 22 is in a tightened state to store energy.

[0129] When the feeding trough 13 rotates to the position of the first driving wheel 21, that is, the feeding roller 11 and the first driving wheel 21 are in a state of no interaction force, the energy stored in the first mainspring 22 will be gradually released, driving the first mounting column 20 to rotate in the opposite direction to the previous direction. Under the joint action of the first transmission member and the transmission mounting column 23, the first driving gear 24 is driven to rotate in the opposite direction to the previous direction. Since the incomplete gear 25 is intermittently meshed with the first driving gear 24, the incomplete gear 25 is driven to rotate in the opposite direction to the previous direction. In the process of the incomplete gear 25 rotating to have no meshing relationship with the first driving gear 24, the incomplete gear 25 drives the push plate 26 to move in the direction close to the receiving frame 19 through the elastic telescopic rod 27, until the receiving frame 19 is pushed to roll the wafer chip column inside it into the intermittent buffer drying part, so that the wafer chip column is repeatedly dried in batches.

[0130] As a preferred embodiment of the present invention, the side wall of the avoidance installation groove 14 opposite to the inclined section of the partition plate 4 is a corresponding inclined surface, and the side wall of the avoidance installation groove 14 opposite to the inclined section of the partition plate 4 is provided with a buffer avoidance through groove 28 of the same angle, and the intermittent buffer drying part includes:

[0131] The second mounting column 29 is rotatably disposed in the buffer avoidance slot 28;

[0132] The second driving wheel 30 is fixedly mounted on the second mounting post 29 and interacts with the feed roller 11 intermittently;

[0133] The second mainspring 31 is disposed on the second mounting column 29 and the top wall of the buffer avoidance slot 28, and is used to store energy and provide power;

[0134] The buffer mounting column 32 is rotatably disposed in the buffer avoidance slot 28;

[0135] The second driving gear 33 is fixedly mounted on the buffer mounting column 32;

[0136] The transmission rack 34 is slidably disposed in the buffer avoidance groove 28 and meshed with the second driving gear 33;

[0137] The buffer connecting frame 35 is U-shaped and fixedly arranged at the end of the transmission rack 34 close to one side of the receiving frame 19;

[0138] The buffer bearing mechanism is elastically rotatably arranged at the end of the buffer connecting frame 35 away from the transmission rack 34, and is used to bear the wafer chip column;

[0139] A load-carrying reversing power mechanism is disposed between the buffer load-carrying mechanism and the inclined section of the partition plate 4, and interacts with the buffer load-carrying mechanism intermittently to provide power for flipping the buffer load-carrying mechanism; and

[0140] A toggle mechanism is provided on the inclined section of the partition plate 4 and is used to toggle the wafer chip column on the buffer bearing mechanism;

[0141] The second mounting column 29 and the buffer mounting column 32 are connected to each other by a second transmission member, the buffer connecting frame 35 and the inclined section of the partition plate 4 are always kept vertical to each other in space, one end of the second spring 31 is fixedly arranged on the second mounting column 29, and the other end is fixedly arranged on the top wall of the buffer avoidance groove 28, and the second driving wheel 30 overflows the surface of the feeding avoidance groove 10;

[0142] Specifically, the second transmission member in this embodiment can be a belt pair or a chain pair, and it adopts an existing product in the prior art. This embodiment is not limited here. The second transmission member and the combined structure diagram of the second transmission member, the second mounting column 29 and the buffer mounting column 32 in the accompanying drawings are only for illustration. Therefore, the second transmission member in the disclosed embodiment will not be described in detail, and it is only necessary to achieve the purpose of power transmission.

[0143] In the actual application of this embodiment, the air supply mechanism 8 continuously blows dry gas into the avoidance installation groove 14. When the feed roller 11 contacts the second drive wheel 30, under the friction force between the feed roller 11 and the second drive wheel 30, the positive rotation of the feed roller 11 drives the second drive wheel 30 to rotate in the opposite direction, that is, drives the second installation column 29 to rotate in the opposite direction. Under the joint action of the second transmission member and the buffer installation column 32, the second drive gear 33 is driven to rotate in the opposite direction. Due to the meshing and matching arrangement of the transmission rack 34 and the second drive gear 33, the transmission rack 34 is driven to move toward the direction close to the receiving frame 19, that is, drives the buffer bearing mechanism to release the interaction relationship with the bearing reversing power mechanism, and the buffer bearing mechanism is reset to a state of stably receiving the wafer chip column in the receiving frame 19. At this time, the push plate 26 moves toward the direction close to the receiving frame 19 until the receiving frame 19 is pushed to roll the wafer chip column inside it into the intermittent buffer drying part, and at the same time, the second spring 31 is in a tightened state to store energy;

[0144] When the feeding trough 13 rotates to the position of the second driving wheel 30, that is, the feeding roller 11 and the second driving wheel 30 are in a state of no interaction force, the energy stored in the second mainspring 31 will be gradually released, driving the second mounting column 29 to rotate in the opposite direction to the previous direction. Under the joint action of the second transmission member and the buffer mounting column 32, the second driving gear 33 is driven to rotate in the opposite direction to the previous direction. Since the transmission rack 34 is meshed with the second driving gear 33, the transmission rack 34 is driven to move in the opposite direction to the previous direction, and the transmission rack 34 is driven to move in the direction away from the receiving frame 19, that is, the buffer bearing mechanism of the wafer chip column is driven to move in the direction away from the receiving frame 19. When the buffer bearing mechanism and the bearing reversing power mechanism interact with each other, the bearing reversing power mechanism drives the buffer bearing mechanism to flip, that is, drives the wafer chip column in the buffer bearing mechanism to move down to the inclined section of the partition plate 4 until it automatically enters the material receiving box 2 through the notch 3, thereby preventing the wafer chip column in the receiving frame 19 from directly rolling from the inclined section of the partition plate 4 to the material receiving box 2, effectively increasing the time that the wafer chip column is located on the inclined section of the partition plate 4, thereby increasing the contact time between the drying gas and the wafer chip column, and at the same time being able to maintain the rotation effect of the wafer chip column to perform multi-faceted drying of the wafer chip column in a displaced manner, effectively improving the drying effect of the wafer chip column.

[0145] As a preferred embodiment of the present invention, the buffer bearing mechanism comprises:

[0146] A bearing shaft 36 is elastically rotatably disposed on the buffer connecting frame 35 away from the transmission rack 34; and

[0147] The bearing rods 37 are L-shaped, and a plurality of them are evenly and fixedly arranged on the bearing shaft 36 .

[0148] Specifically, a torsion spring for resetting is provided at the rotation connection between the bearing shaft 36 and the buffer connecting frame 35 .

[0149] In the actual application of this embodiment, the spaced-apart supporting rods 37 provide more contact surfaces with the drying gas for the wafer chip columns to better perform air drying.

[0150] As a preferred embodiment of the present invention, the load-bearing reversing power mechanism comprises:

[0151] Supporting driving racks 38, at least one set, fixedly mounted on the inclined plate of the partition plate 4; and

[0152] The meshing gear 39 is intermittently meshed with the supporting driving rack 38 and fixedly disposed on the bearing rotating shaft 36;

[0153] When the meshing gear 39 and the supporting driving rack 38 are in a mutually meshing state, the bearing rod 37 is in a rotating state;

[0154] When the meshing gear 39 and the supporting driving rack 38 are in a disengaged state, the bearing rod 37 is reset to a state with the open end facing the receiving frame 19 .

[0155] In actual application of this embodiment, when the bearing rod 37 approaches and moves away from the receiving frame 19 , the meshing gear 39 and the supporting driving rack 38 are intermittently meshed with each other to provide a driving force for flipping the bearing rod 37 .

[0156] As a preferred embodiment of the present invention, the toggle mechanism comprises:

[0157] The moving protrusions 40 are evenly arranged on the inclined plate of the partition plate 4, and the upper surface thereof is uneven;

[0158] The shifting protrusions 40 are all located between adjacent bearing rods 37 , and the shifting protrusions 40 are located between the receiving frame 19 and the supporting driving rack 38 .

[0159] In actual application of this embodiment, under the action of the pushing protrusions 40 located between adjacent supporting rods 37, the wafer chip column on the supporting rod 37 contacts the pushing protrusions 40 during movement, and under the action of the friction between the two, the wafer chip column is pushed for multi-position air blowing drying.

[0160] Furthermore, in order to prevent the wafer chip column from falling, a limiting unit is provided between the carrying bars 37 on both sides, and the limiting unit includes:

[0161] The limiting supports 41 are symmetrically arranged on the bearing rods 37 on both sides;

[0162] The limiting roller 42 is rotatably disposed on the limiting support 41; and

[0163] The limiting plates 43 are symmetrically arranged on the bearing rods 37 on both sides and are located outside the limiting supports 41;

[0164] The lowest point of the limiting roller 42 is higher than the highest point of the moving protrusion 40 .

[0165] Furthermore, in order to better improve the drying effect of the wafer chip column, a plurality of elastic sheets 44 staggered with the drying holes 5 and a drying adsorbent 45 located between the elastic sheets 44 and the notch 3 are arranged on the inclined plate of the partition plate 4 near the notch 3.

[0166] A semiconductor high-power TVS preparation method, using the semiconductor high-power TVS preparation device, includes the following specific steps:

[0167] S1: Use ceramic sheets as jigs, stack silver-plated molybdenum sheets and diffused TVS wafers in order from top to bottom until the last layer is a silver-plated molybdenum sheet. The unidirectional TVS wafers must be stacked in the same direction, and use lead-tin solder sheets to weld the whole into a TVS wafer alloy lump through an alloy furnace or a vacuum welding furnace;

[0168] S2: Use a wire cutting machine to cut the TVS wafer alloy sintered lump into wafer chip columns of required size;

[0169] S3: Screen the wafer chip columns with edges and irregular cutting, and use a chemical agent to treat the damage on the wafer chip column caused by wire cutting to make the surface of the wafer chip column smooth;

[0170] S4: The processed wafer chip columns are placed in a drying box 1 for intermittent and orderly batch drying to obtain dried wafer chip columns.

[0171] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A semiconductor high-power TVS manufacturing device, comprising a drying box (1) and an air supply unit arranged in the drying box (1); characterized in that: The device also includes: The material receiving box (2) is fixedly connected to the outer wall of the drying box (1); The intermittent feeding part is arranged in the middle of the drying box body, and is used to intermittently divide the wafer chip columns to be dried and then lay them flat for feeding; The vibration drying section is arranged directly below the intermittent feeding section and is used for the initial position-changing vibration drying of the wafer chip column; An intermittent pushing section is arranged on a side of the intermittent feeding section away from the receiving box (2) and is located between the intermittent feeding section and the vibration drying section, and is used to intermittently push the vibration drying section to perform rolling and transposition drying on the wafer chip columns after the initial vibration drying; and An intermittent buffer drying section is arranged on the other side of the intermittent feeding section close to the receiving box (2) and is located between the intermittent feeding section and the vibration drying section, and is used for secondary position-changing drying and extending the drying time of the wafer chip column after the initial vibration drying while automatically receiving the material; When the intermittent feeding section and the intermittent pushing section are in a state of no interaction force, the intermittent buffer drying section is in a state of having interaction force with the intermittent feeding section, the intermittent pushing section is in a state of moving toward the vibration drying section and acting on the vibration drying section, and the intermittent buffer drying section is in a state of moving toward the vibration drying section; when the intermittent feeding section and the intermittent pushing section are in a state of having interaction force, the intermittent buffer drying section is in a state of having no interaction force with the intermittent feeding section, the intermittent pushing section is in a state of moving away from the vibration drying section, and the intermittent buffer drying section is in a state of moving away from the vibration drying section.

2. The semiconductor high-power TVS manufacturing device according to claim 1, characterized in that: A notch (3) is provided at the connection point between the drying box body (1) and the material receiving box body (2).

3. The semiconductor high-power TVS manufacturing device according to claim 2, characterized in that: A partition plate (4) is fixedly arranged in the drying box (1), and a plurality of drying holes (5) for ventilation are provided on the partition plate (4); The partition plate (4) is composed of a horizontal section and an inclined section, the inclined section of the partition plate (4) is located between the horizontal section of the partition plate (4) and the notch (3), and the bottom end of the inclined section of the partition plate (4) is fixedly connected to the bottom of the notch (3); The intermittent feeding section, the vibration drying section, the intermittent pushing section and the intermittent buffer drying section are all located between the partition plate (4) and the top inner wall of the drying box (1), and the air supply section is arranged between the partition plate (4) and the bottom inner wall of the drying box (1).

4. The semiconductor high-power TVS manufacturing device according to claim 3, characterized in that: The air supply unit comprises: A gas collecting chamber (7) is fixedly arranged at the bottom of the partition plate (4), and the interior of the chamber is interconnected with the drying holes (5); and The air supply mechanism (8) is fixedly arranged on the inner wall of the bottom of the drying box (1) and is fixedly connected to the air collecting chamber (7) via an air supply pipe.

5. The semiconductor high-power TVS manufacturing device according to claim 3, characterized in that: A mounting platform (9) is provided between the partition plate (4) and the top inner wall of the drying box body (1), and an avoidance mounting groove (14) is provided at the bottom of the mounting platform (9). The intermittent feeding section comprises: A driving member (12) is fixedly mounted on the drying box body (1); A feeding avoidance groove (10) is provided in the middle of the top surface of the mounting platform (9); A feeding roller (11) is rotatably disposed in the feeding avoidance groove (10) and is fixedly and detachably connected to a driving end of a driving member (12); and A feeding trough (13) is symmetrically arranged on the feeding roller (11); The top and bottom of the feeding avoidance groove (10) are both open, and the vibration drying section is located directly below the feeding avoidance groove (10); When the feed roller (11) and the intermittent pushing section are in a state where there is an interaction force, the intermittent buffer drying section is in a state where there is no interaction force with the feed roller (11), the intermittent pushing section is in a state where it moves away from the vibration drying section, and the intermittent buffer drying section is in a state where it moves away from the vibration drying section; when the feed roller (11) and the intermittent pushing section are in a state where there is no interaction force, the intermittent buffer drying section is in a state where there is an interaction force with the feed roller (11), the intermittent pushing section is in a state where it moves toward the vibration drying section and acts on the vibration drying section, and the intermittent buffer drying section is in a state where it moves toward the vibration drying section.

6. The semiconductor high-power TVS manufacturing device according to claim 5, characterized in that: The vibration drying section comprises: A guide seat (15) is symmetrically arranged on the partition plate (4); A guide support member elastically slidably disposed on the guide seat (15); A receiving frame (19) is elastically rotatably arranged on the guide support member with damping; and A plurality of drying avoidance grooves (18) are provided on the side wall and the bottom wall of the receiving frame (19).

7. The semiconductor high-power TVS manufacturing device according to claim 6, characterized in that: The mounting platform (9) is provided with a push avoidance groove (46), and the intermittent push portion comprises: A first mounting column (20) is rotatably disposed in the push avoidance groove (46); A first driving wheel (21) is fixedly mounted on the first mounting column (20) and intermittently interacts with the feeding roller (11); A first mainspring (22) is disposed on the first mounting column (20) and the top wall of the push avoidance groove (46) and is used to store energy and provide power; A transmission mounting column (23) is rotatably disposed in the push avoidance groove (46); A first driving gear (24) is fixedly mounted on the transmission mounting column (23); An incomplete gear (25) is rotatably disposed in the push avoidance groove (46) and is intermittently meshed with the first driving gear (24); A push plate (26), one end of which is horizontally slidably disposed in the push avoidance groove (46), and the other end of which is slidably penetrates the side wall of the mounting platform (9); and An elastic telescopic rod (27) for transmitting power between the incomplete gear (25) and the push plate (26); The push plate (26) is T-shaped, the first mounting column (20) is connected to the transmission mounting column (23) via a first transmission member, one end of the elastic telescopic rod (27) is eccentrically fixed on the incomplete gear (25), and the other end is rotatably arranged on the push plate (26) away from the receiving frame (19), and the first driving wheel (21) overflows the surface of the feeding avoidance groove (10).

8. The semiconductor high-power TVS manufacturing device according to claim 5, characterized in that: The side wall of the avoidance installation groove (14) opposite to the inclined section of the partition plate (4) is a corresponding inclined surface, and the side wall of the avoidance installation groove (14) opposite to the inclined section of the partition plate (4) is provided with a buffer avoidance through groove (28) with the same angle, and the intermittent buffer drying section comprises: A second mounting column (29) is rotatably disposed in the buffer avoidance slot (28); A second driving wheel (30) is fixedly mounted on the second mounting column (29) and intermittently interacts with the feeding roller (11); A second mainspring (31) is disposed on the second mounting column (29) and the top wall of the buffer avoidance slot (28) and is used to store energy and provide power; A buffer mounting column (32) is rotatably disposed in the buffer avoidance slot (28); A second driving gear (33) is fixedly mounted on the buffer mounting column (32); A transmission rack (34) is slidably disposed in the buffer avoidance groove (28) and meshed with the second driving gear (33); The buffer connecting frame (35) is U-shaped and fixedly arranged near the end of the transmission rack (34); A buffer bearing mechanism, elastically rotatably disposed at the end of the buffer connecting frame (35); A load-carrying reversing power mechanism, which is disposed between the buffer load-carrying mechanism and the inclined section of the partition plate (4) and interacts with the buffer load-carrying mechanism in an intermittent manner; and A toggle mechanism is arranged on the inclined section of the partition plate (4); The second mounting column (29) and the buffer mounting column (32) are connected in transmission via a second transmission member, the buffer connecting frame (35) and the inclined section of the partition plate (4) always maintain a mutually perpendicular state in space, and the second driving wheel (30) overflows the surface of the feeding avoidance groove (10).

9. The semiconductor high-power TVS manufacturing device according to claim 8, characterized in that: The buffer bearing mechanism comprises: A load-bearing rotating shaft (36) is elastically rotatably disposed on a buffer connecting frame (35) on a side away from the transmission rack (34); and A plurality of bearing rods (37) are evenly and fixedly arranged on the bearing rotating shaft (36).

10. A method for preparing a semiconductor high-power TVS, using the semiconductor high-power TVS preparation device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: Use ceramic sheets as jigs, stack silver-plated molybdenum sheets and diffused TVS wafers in order from top to bottom until the last layer is a silver-plated molybdenum sheet. The unidirectional TVS wafers must be stacked in the same direction, and use lead-tin solder sheets to weld the whole into a TVS wafer alloy lump through an alloy furnace or a vacuum welding furnace; S2: Use a wire cutting machine to cut the TVS wafer alloy sintered lump into wafer chip columns of required size; S3: Screen the wafer chip columns with edges and irregular cutting, and use a chemical agent to treat the damage on the wafer chip column caused by wire cutting to make the surface of the wafer chip column smooth; S4: The processed wafer chip columns are placed in a drying box (1) for intermittent and orderly batch drying to obtain dried wafer chip columns.

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