Chip frame cleaning and drying device

Abstract

The present invention relates to the field of chip processing technology, and specifically to a chip frame cleaning and drying device, which realizes the fully automatic processing process of batch cleaning, drying and detection and collection of chip frames through a cleaning mechanism, a batch drying mechanism, a material dividing and transporting mechanism, a single-piece drying mechanism and a detection and receiving mechanism, and places the whole box of chip frames in the cleaning mechanism box by box for batch cleaning. After the cleaning is completed, they are preliminarily dried one by one through the batch drying mechanism, and then the chip frames in the box are transported one by one to the single-piece drying mechanism for drying by the material dividing and transporting mechanism, and finally collected into the material box through the detection and receiving mechanism. The chip frame cleaning and drying is completed through the cooperation and connection between the various mechanisms, which effectively improves the work efficiency of the chip frame cleaning and drying process, improves the cleaning and drying process, saves labor costs, and avoids damage to the chip frame by manual operation.

Description

Technical Field

[0001] The invention relates to the technical field of chip processing, and in particular to a chip frame cleaning and drying device. Background Art

[0002] Chip refers to all electronic components and is the carrier of integrated circuits. It is the most important part of electronic equipment and undertakes the functions of calculation and storage. The application scope of integrated circuits covers almost all electronic equipment in military and civilian use. A chip is a circuit module that combines multiple electronic components on a silicon board to achieve a specific function. Pins are provided on both sides of the chip body for connecting to external circuits.

[0003] As the carrier of the chip, the chip frame is crucial to the chip production and performance. If the dirt and adhered debris caused by welding, punching and other processes in the processing of the chip frame are not cleaned up properly, it is easy to cause the chip product to be unqualified, thereby affecting the chip performance. The existing cleaning of the chip frame is basically carried out in batches in the material box. After cleaning, since the chip frames are stored in the material box, it is not easy to completely dry only the material box and the stacked chip frames. In addition, the process operation of drying a single chip frame is complicated and requires multiple workers and equipment to complete.

[0004] Therefore, the present invention provides a chip frame cleaning and drying device that realizes batch cleaning and batch drying of chip frames as well as integrated automatic cleaning and drying equipment for single-piece drying and storage. Summary of the invention

[0005] To solve the above technical problems.

[0006] The present application provides a chip frame cleaning and drying device, comprising: a cleaning mechanism for batch cleaning of a whole box of chip frames, a chip frame batch drying mechanism, a material dividing and transferring mechanism for dividing and transferring a whole box of chip frames, a single-piece drying mechanism for drying a single chip frame, and a detection and receiving mechanism for detecting and receiving a single chip frame. The cleaning mechanism, the batch drying mechanism, the material dividing and transferring mechanism, the single-piece drying mechanism and the detection and receiving mechanism are all installed on a workbench, the cleaning mechanism is arranged at one end of the workbench, the batch drying mechanism is located between the cleaning mechanism and the material dividing and transferring mechanism, and the detection and receiving mechanism is arranged on one side of the single-piece drying mechanism. The whole box of chip frames are placed in the cleaning mechanism one by one for batch cleaning. After cleaning, they are initially dried one by one through the batch drying mechanism, and then the chip frames in the box are transferred one by one to the single-piece drying mechanism for drying by using the material dividing and transferring mechanism, and finally collected into the material box through the detection and receiving mechanism.

[0007] Furthermore, the cleaning mechanism includes: a three-axis loading robot and an ultrasonic cleaning component for loading and transporting material boxes, the three-axis loading robot is arranged at one end of the workbench, the ultrasonic cleaning component is arranged on the workbench and a first material box conveying module is arranged at one end, the ultrasonic cleaning component includes a cleaning tank and a draining tank, one end of the cleaning tank is opposite to the first material box conveying module, and the other end is opposite to the draining tank, and the batch drying mechanism is located on one side of the cleaning tank and the draining tank.

[0008] Furthermore, the batch drying mechanism includes a hot drying component and an air drying component. The hot drying component is arranged on one side of the cleaning tank and the draining tank, and the air drying component is located between the hot drying component and the material dividing and transferring mechanism. The hot drying component includes a hot drying bin, a bin cover and a cover moving module. The bin cover is arranged on the top of the hot drying bin through the cover moving module, and the bin cover is connected to the cover moving module.

[0009] Furthermore, the air-drying component includes an air shower, a flipping component and a second material box conveying module. The flipping component is located at one end of the air shower close to the hot drying chamber. The second material box conveying module is arranged in the air shower and its two ends are respectively opposite to the flipping component and the material distribution and transfer mechanism. The flipping component includes a flipping frame and a flipping motor. The flipping frame is arranged above the second material box conveying module and is connected to the flipping motor.

[0010] Furthermore, the material distribution and transfer mechanism includes a push rod assembly, a first material box clamping assembly capable of clamping the material box for horizontal and vertical movement, and a single-piece conveying module. The push rod assembly and the single-piece conveying module are respectively located on both sides of the air shower. The first material box clamping assembly is at one end of the air shower away from the flipping assembly. The single-piece conveying module is arranged between the first material box clamping assembly and the single-piece drying mechanism through a linear module.

[0011] Furthermore, the single-piece drying mechanism includes an external oven, a movable material transfer assembly, a sponge roller group and a conveyor belt module. The external oven is arranged on a workbench through a material guide rack and is opposite to the single-piece conveyor module. The movable material transfer assembly is arranged between the material guide rack and the external oven, and the sponge roller group is located between the material guide rack and the conveyor belt module.

[0012] Furthermore, the detection and material receiving mechanism includes a three-axis suction cup manipulator, a detection device, a detection frame and a second material box clamping assembly. The three-axis suction cup manipulator is arranged on the workbench at one end away from the three-axis loading manipulator, the detection device is installed between the detection frame and the conveyor belt module, and a feeding assembly is arranged on the detection frame. The second material box clamping assembly is located at the end of the detection frame away from the three-axis suction cup manipulator.

[0013] Further, the following implementation steps are included:

[0014] Step 1: Use the first material box conveying module to convey the flat material box with the chip frame to the cleaning tank direction of the ultrasonic cleaning component, and the three-axis loading robot clamps it and puts it into the cleaning tank for ultrasonic cleaning. After the cleaning is completed, the three-axis loading robot clamps the material box in the cleaning tank to the drain tank for draining for a period of time, and then clamps the material box to the batch drying mechanism for drying;

[0015] Step 2: Use the three-axis loading robot to grab the drained material box into the hot drying bin, and then the cover moving module covers the bin cover to the top of the hot drying bin to start hot drying, and then the three-axis loading robot takes out the hot drying box and puts it in the air drying component;

[0016] Step 3: The hot-dried material box in the horizontal state is clamped by the three-axis loading robot and placed on the flip frame of the flip assembly. The flip motor drives the flip frame to flip 90 degrees. When the flip is completed, the second material box conveying module drives the vertical material box to move into the air shower. The air shower air-dries the material box and conveys it to the material distribution and transfer mechanism to wait for distribution.

[0017] Step 4: The chip frames in the material box are ejected one by one through the material distribution and transfer mechanism and transferred to the single-piece drying mechanism for drying. After the air shower is finished, the first material box clamping assembly clamps the vertical material box and moves it horizontally to the position facing the ejector assembly and the single-chip conveying module. Then the ejector assembly ejects the chip frames in the material box one by one to the single-chip conveying module. The single-chip conveying module and the linear module transfer the single-piece chip frame to the single-piece drying mechanism for drying.

[0018] Step 5: Use the mobile material shifting assembly to push the chip frames one by one through the material guide rack through the hot drying port of the outer oven, and then push them to the sponge roller group for wiping, and then transport them to the detection and receiving mechanism by the conveyor belt module;

[0019] Step 6: Use a three-axis suction cup manipulator to suck the chip frame on the conveyor belt module onto the inspection rack. The chip frame is sent one by one to the inspection equipment for inspection by the delivery component. After the inspection is completed, it is sent to the material box clamped by the second material box clamping component to complete the material collection.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. In order to solve the technical problem of cleaning and drying chip frames, the present invention realizes the fully automatic processing process of batch cleaning, drying and detection and collection of chip frames through a cleaning mechanism, a batch drying mechanism, a material dividing and transporting mechanism, a single-piece drying mechanism and a detection and receiving mechanism. The whole box of chip frames is placed in the cleaning mechanism one by one for batch cleaning. After the cleaning is completed, they are initially dried one by one through the batch drying mechanism. Then, the chip frames in the box are transported one by one to the single-piece drying mechanism for drying by the material dividing and transporting mechanism. Finally, they are collected into the material box through the detection and receiving mechanism. The chip frame cleaning and drying are completed through the coordination and connection between the various mechanisms, which effectively improves the work efficiency of the chip frame cleaning and drying process, improves the cleaning and drying process, saves labor costs, and avoids damage to the chip frame by manual operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The three-dimensional structure of the present invention is shown in FIG. Figure 1 ;

[0023] Figure 2 A top view of the present invention;

[0024] Figure 3 The three-dimensional structure diagram of the cleaning mechanism, batch drying mechanism and loading and transporting mechanism of the present invention is shown in FIG. Figure 1 ;

[0025] Figure 4 The three-dimensional structure diagram of the cleaning mechanism, batch drying mechanism and loading and transporting mechanism of the present invention is shown in FIG. Figure 2 ;

[0026] Figure 5 The three-dimensional structure diagram of the single-piece drying mechanism and the detection and receiving mechanism of the present invention is shown in FIG. Figure 1 ;

[0027] Figure 6 The three-dimensional structure diagram of the single-piece drying mechanism and the detection and receiving mechanism of the present invention is shown in FIG. Figure 2 ;

[0028] Figure 7 It is a top view of a single drying mechanism and a material detection and receiving mechanism of the present invention;

[0029] Figure 8 The three-dimensional structure diagram of the single-piece drying mechanism and the detection and receiving mechanism of the present invention is shown in FIG. Figure 3 .

[0030] The numbers in the figure are: 1-cleaning mechanism; 2-batch drying mechanism; 3-material distribution and transfer mechanism; 4-single piece drying mechanism; 5-detection and receiving mechanism; 6-workbench; 11-three-axis feeding manipulator; 12-ultrasonic cleaning component; 13-first material box conveying module; 14-cleaning tank; 15-draining tank; 21-heat drying component; 22-air drying component; 23-heat drying bin; 24-bin cover; 25-cover moving module; 221-air shower channel; 222-turning group Parts; 223-second material box conveying module; 224-turning frame; 225-turning motor; 31-rod assembly; 32-first material box clamping assembly; 33-single-piece conveying module; 34-linear module; 41-external oven; 42-mobile material shifting assembly; 43-sponge roller assembly; 44-conveyor belt module; 45-material guide rack; 51-three-axis suction cup manipulator; 52-detection equipment; 53-detection frame; 54-second material box clamping assembly; 55-shifting assembly. DETAILED DESCRIPTION

[0031] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.

[0032] like Figure 1 and Figure 2 As shown, the following preferred technical solutions are provided:

[0033] A chip frame cleaning and drying device comprises: a cleaning mechanism 1 for batch cleaning of a whole box of chip frames, a chip frame batch drying mechanism 2, a material dividing and transferring mechanism 3 for dividing and transferring a whole box of chip frames, a single-piece drying mechanism 4 for drying a single chip frame, and a detection and receiving mechanism 5 for detecting and receiving a single chip frame. The cleaning mechanism 1, the batch drying mechanism 2, the material dividing and transferring mechanism 3, the single-piece drying mechanism 4 and the detection and receiving mechanism 5 are all installed on a workbench 6, the cleaning mechanism 1 is arranged at one end of the workbench 6, the batch drying mechanism 2 is located between the cleaning mechanism 1 and the material dividing and transferring mechanism 3, the detection and receiving mechanism 5 is arranged on one side of the single-piece drying mechanism 4, the whole box of chip frames are placed in the cleaning mechanism 1 box by box for batch cleaning, after cleaning is completed, they are preliminarily dried one by one through the batch drying mechanism 2, and then the chip frames in the box are transferred one by one to the single-piece drying mechanism 4 for drying by the material dividing and transferring mechanism 3, and finally collected into the material box through the detection and receiving mechanism 5.

[0034] Specifically, in order to solve the technical problem of cleaning and drying the chip frame, the present invention realizes the fully automatic processing process of batch cleaning, drying and detection and collection of chip frames through the cleaning mechanism 1, batch drying mechanism 2, material dividing and transporting mechanism 3, single-piece drying mechanism 4 and detection and collection mechanism 5. The whole box of chip frames is placed in the cleaning mechanism 1 box by box for batch cleaning. After the cleaning is completed, they are preliminarily dried one by one through the batch drying mechanism 2, and then the chip frames in the box are transported one by one to the single-piece drying mechanism 4 for drying by the material dividing and transporting mechanism 3, and finally collected into the material box through the detection and collection mechanism 5. The chip frame is cleaned and dried through the cooperation and connection between the various mechanisms, which effectively improves the work efficiency of the chip frame cleaning and drying process, improves the cleaning and drying process, saves labor costs, and avoids damage to the chip frame by manual operation.

[0035] like Figures 1 to 8 As shown, the following preferred technical solutions are provided:

[0036] The cleaning mechanism 1 includes: a three-axis loading robot 11 and an ultrasonic cleaning component 12 for loading and transporting material boxes. The three-axis loading robot 11 is arranged at one end of the workbench 6. The ultrasonic cleaning component 12 is arranged on the workbench 6 and a first material box conveying module 13 is arranged at one end. The ultrasonic cleaning component 12 includes a cleaning tank 14 and a draining tank 15. One end of the cleaning tank 14 is opposite to the first material box conveying module 13, and the other end is opposite to the draining tank 15. The batch drying mechanism 2 is located on one side of the cleaning tank 14 and the draining tank 15.

[0037] Specifically, in order to solve the technical problems of loading, transporting and cleaning the whole box of chip frames, the present invention uses the first box conveying module 13 to transport the flat box containing the chip frames to the direction of the cleaning tank 14 of the ultrasonic cleaning component 12, and the three-axis loading robot 11 clamps and puts it into the cleaning tank 14 for ultrasonic cleaning. After the cleaning is completed, the three-axis loading robot 11 clamps the box in the cleaning tank 14 to the draining tank 15 for draining for a period of time, and then clamps the box to the batch drying mechanism 2 for drying. The efficient and automated loading, transporting, cleaning and draining operations of the chip frame box are realized.

[0038] like Figures 2 to 4 As shown, the following preferred technical solutions are provided:

[0039] The batch drying mechanism 2 includes a hot drying component 21 and an air drying component 22. The hot drying component 21 is arranged on one side of the cleaning tank 14 and the draining tank 15. The air drying component 22 is located between the hot drying component 21 and the material distribution and transfer mechanism 3. The hot drying component 21 includes a hot drying bin 23, a bin cover 24 and a cover moving module 25. The bin cover 24 is arranged on the top of the hot drying bin 23 through the cover moving module 25, and the bin cover 24 is connected to the cover moving module 25.

[0040] Specifically, in order to solve the technical problem of drying the chip frame material boxes that are cleaned in batches, the present invention uses a three-axis loading robot 11 to grab the drained material boxes into the hot drying bin 23, and then the cover moving module 25 covers the bin cover 24 to the top of the hot drying bin 23 to start hot drying, and then the three-axis loading robot 11 takes out the hot-dried material boxes and places them in the air-drying component 22.

[0041] like Figures 2 to 4 As shown, the following preferred technical solutions are provided:

[0042] The air-drying component 22 includes an air shower 221, a flipping component 222 and a second material box conveying module 223. The flipping component 222 is located at one end of the air shower 221 close to the hot drying chamber 23. The second material box conveying module 223 is arranged in the air shower 221 and its two ends are respectively opposite to the flipping component 222 and the material distribution and transfer mechanism 3. The flipping component 222 includes a flipping frame 224 and a flipping motor 225. The flipping frame 224 is arranged above the second material box conveying module 223 and is connected to the flipping motor 225.

[0043] Specifically, in order to solve the technical problem of air showering a horizontally placed and heat-dried material box from a vertical state and facilitating material distribution and transportation, the present invention uses a three-axis loading robot 11 to clamp the heat-dried material box in a horizontal state and place it on the flip frame 224 of the flip assembly 222, and the flip motor 225 drives the flip frame 224 to achieve a 90° flip. When the flip is completed, the second material box conveying module 223 drives the vertical material box to move into the air shower channel 221, and the air shower channel 221 air showers and dries the material box, and then conveys it to the material distribution and transportation mechanism 3 after passing through the air shower channel 221 to wait for material distribution.

[0044] like Figures 2 to 4 As shown, the following preferred technical solutions are provided:

[0045] The material distribution and transfer mechanism 3 includes a push rod assembly 31, a first material box clamping assembly 32 capable of clamping the material box for horizontal and vertical movement, and a single-piece conveying module 33. The push rod assembly 31 and the single-piece conveying module 33 are respectively located on both sides of the air shower 221. The first material box clamping assembly 32 is located at one end of the air shower 221 away from the flipping assembly 222. The single-piece conveying module 33 is arranged between the first material box clamping assembly 32 and the single-piece drying mechanism 4 through a linear module 34.

[0046] Specifically, in order to solve the technical problem of drying and inspecting the chip frames in the material box one by one, the present invention uses the material dividing and transferring mechanism 3 to eject the chip frames in the material box one by one and transfer them to the single-piece drying mechanism 4 for drying. After the air shower is completed, the first material box clamping assembly 32 clamps the vertical material box and moves it horizontally to the position opposite to the ejector assembly 31 and the single-chip conveying module 33. Then the ejector assembly 31 ejects the chip frames in the material box one by one onto the single-chip conveying module 33. The single-chip conveying module 33 and the linear module 34 transfer the single-piece chip frames to the single-piece drying mechanism 4 for drying.

[0047] like Figures 2 to 8 As shown, the following preferred technical solutions are provided:

[0048] The single-piece drying mechanism 4 includes an external oven 41, a movable material-dispensing assembly 42, a sponge roller group 43 and a conveyor belt module 44. The external oven 41 is set on the workbench 6 through a material guide rack 45 and faces the single-piece conveying module 33. The movable material-dispensing assembly 42 is set between the material guide rack 45 and the external oven 41, and the sponge roller group 43 is located between the material guide rack 45 and the conveyor belt module 44.

[0049] Specifically, in order to dry a single chip frame, the present invention uses a mobile material transfer assembly 42 to push the chip frames one by one through the hot drying port of the outer oven 41 through the material guide rack 45, and then push them to the sponge roller group 43 for wiping, and then transport them to the detection and receiving mechanism 5 by the conveyor belt module 44.

[0050] The detection and material receiving mechanism 5 includes a three-axis suction cup manipulator 51, a detection device 52, a detection frame 53 and a second material box clamping assembly 54. The three-axis suction cup manipulator 51 is arranged on the workbench 6 at one end away from the three-axis loading manipulator 11, the detection device 52 is installed between the detection frame 53 and the conveyor belt module 44, and a feeding assembly 55 is arranged on the detection frame 53. The second material box clamping assembly 54 is located at the end of the detection frame 53 away from the three-axis suction cup manipulator 51.

[0051] Specifically, in order to solve the technical problem of inspecting and collecting single chip frames one by one, the present invention uses a three-axis suction cup manipulator 51 to suck the chip frames located on the conveyor belt module 44 onto the detection frame 53, and the chip frames are transported one by one to the detection equipment 52 by the delivery component 55 for inspection. After the inspection is completed, the chip frames are delivered to the material box clamped by the second material box clamping component 54 to complete the collection.

[0052] like Figures 1 to 8 As shown, the following preferred technical solutions are provided:

[0053] The implementation steps include:

[0054] Step 1: Use the first material box conveying module 13 to convey the flat material box with the chip frame to the direction of the cleaning tank 14 of the ultrasonic cleaning component 12, and the three-axis loading robot 11 clamps it and puts it into the cleaning tank 14 for ultrasonic cleaning. After the cleaning is completed, the three-axis loading robot 11 clamps the material box in the cleaning tank 14 to the drain tank 15 for draining for a period of time, and then clamps the material box to the batch drying mechanism 2 for drying;

[0055] Step 2: Use the three-axis loading robot 11 to grab the drained material box into the hot drying bin 23, and then the cover moving module 25 covers the bin cover 24 to the top of the hot drying bin 23 to start hot drying, and then the three-axis loading robot 11 takes out the hot dried material box and puts it in the air drying component 22;

[0056] Step 3: The hot-dried material box in the horizontal state is clamped by the three-axis loading manipulator 11 and placed on the flip frame 224 of the flip assembly 222. The flip motor 225 drives the flip frame 224 to flip 90 degrees. When the flip is completed, the second material box conveying module 223 drives the vertical material box to move into the air shower 221. The air shower 221 air-dries the material box, and after passing through the air shower 221, it is conveyed to the material distribution and transfer mechanism 3 to wait for distribution.

[0057] Step 4: The chip frames in the material box are ejected one by one through the material distribution and transfer mechanism 3 and transferred to the single-piece drying mechanism 4 for drying. After the air shower is finished, the first material box clamping assembly 32 clamps the vertical material box and moves it horizontally to the position facing the ejector assembly 31 and the single-chip conveying module 33. Then the ejector assembly 31 ejects the chip frames in the material box one by one to the single-chip conveying module 33. The single-chip conveying module 33 and the linear module 34 transfer the single-piece chip frame to the single-piece drying mechanism 4 for drying.

[0058] Step 5: Use the mobile material shifting assembly 42 to push the chip frames one by one through the hot drying port of the outer oven 41 through the material guide rack 45, and then push them to the sponge roller group 43 for wiping, and then convey them to the detection and receiving mechanism 5 by the conveyor belt module 44;

[0059] Step 6: Use the three-axis suction cup manipulator 51 to suck the chip frame on the conveyor belt module 44 onto the detection rack 53, and the delivery component 55 delivers the chip frame one by one to the detection equipment 52 for detection. After the detection is completed, it is delivered to the material box clamped by the second material box clamping component 54 to complete the material collection.

[0060] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A chip frame cleaning and drying device, characterized in that: include: A cleaning mechanism (1) for batch cleaning of a whole box of chip frames, a chip frame batch drying mechanism (2), a material dividing and transporting mechanism (3) for dividing and transporting the whole box of chip frames, a single piece drying mechanism (4) for drying a single chip frame, and a detection and receiving mechanism (5) for detecting and receiving a single chip frame. The cleaning mechanism (1), the batch drying mechanism (2), the material dividing and transporting mechanism (3), the single piece drying mechanism (4) and the detection and receiving mechanism (5) are all installed on a workbench (6). The cleaning mechanism (1) is arranged on a At one end of the workbench (6), the batch drying mechanism (2) is located between the cleaning mechanism (1) and the material dividing and transporting mechanism (3), and the detection and receiving mechanism (5) is arranged on one side of the single-piece drying mechanism (4). The chip frames of the whole box are placed in the cleaning mechanism (1) one by one for batch cleaning. After the cleaning is completed, they are first dried one by one through the batch drying mechanism (2). Then, the chip frames in the box are transported one by one to the single-piece drying mechanism (4) for drying by the material dividing and transporting mechanism (3). Finally, they are collected into the material box through the detection and receiving mechanism (5); The batch drying mechanism (2) comprises a heat drying component (21) and an air drying component (22), the heat drying component (21) is arranged on one side of the cleaning tank (14) and the draining tank (15), the air drying component (22) is located between the heat drying component (21) and the material distribution and transfer mechanism (3), the heat drying component (21) comprises a heat drying bin (23), a bin cover (24) and a cover plate moving module (25), the bin cover (24) is arranged on the top of the heat drying bin (23) through the cover plate moving module (25), and the bin cover (24) is connected to the cover plate moving module (25); The air-drying component (22) comprises an air shower (221), a flip component (222) and a second material box conveying module (223); the flip component (222) is located at one end of the air shower (221) close to the hot drying bin (23); the second material box conveying module (223) is arranged in the air shower (221) and its two ends are respectively opposite to the flip component (222) and the material distribution and transfer mechanism (3); the flip component (222) comprises a flip frame (224) and a flip motor (225); the flip frame (224) is arranged above the second material box conveying module (223) and is connected to the flip motor (225); The material distribution and transfer mechanism (3) comprises a push rod assembly (31), a first material box clamping assembly (32) capable of clamping a material box for horizontal and vertical movement, and a single-piece conveying module (33); the push rod assembly (31) and the single-piece conveying module (33) are respectively located on both sides of an air shower channel (221); the first material box clamping assembly (32) is located at one end of the air shower channel (221) away from the flip assembly (222); and the single-piece conveying module (33) is arranged between the first material box clamping assembly (32) and the single-piece drying mechanism (4) via a linear module (34).

2. A chip frame cleaning and drying device according to claim 1, characterized in that: The cleaning mechanism (1) comprises: a three-axis loading manipulator (11) and an ultrasonic cleaning component (12) for loading and transporting a material box, the three-axis loading manipulator (11) being arranged at one end of a workbench (6), the ultrasonic cleaning component (12) being arranged on the workbench (6) and having a first material box conveying module (13) arranged at one end, the ultrasonic cleaning component (12) comprising a cleaning tank (14) and a draining tank (15), one end of the cleaning tank (14) facing the first material box conveying module (13), and the other end facing the draining tank (15), and the batch drying mechanism (2) being located on one side of the cleaning tank (14) and the draining tank (15).

3. A chip frame cleaning and drying device according to claim 2, characterized in that: The single-piece drying mechanism (4) comprises an external oven (41), a movable material shifting assembly (42), a sponge roller group (43) and a conveyor belt module (44); the external oven (41) is arranged on a workbench (6) through a material guide frame (45) and directly faces the single-piece conveyor module (33); the movable material shifting assembly (42) is arranged between the material guide frame (45) and the external oven (41); and the sponge roller group (43) is located between the material guide frame (45) and the conveyor belt module (44).

4. The chip frame cleaning and drying device according to claim 3, characterized in that: The detection and receiving mechanism (5) comprises a three-axis suction cup manipulator (51), a detection device (52), a detection frame (53) and a second material box clamping assembly (54); the three-axis suction cup manipulator (51) is arranged on the workbench (6) at one end away from the three-axis feeding manipulator (11); the detection device (52) is installed between the detection frame (53) and the conveyor belt module (44); a feeding assembly (55) is arranged on the detection frame (53); and the second material box clamping assembly (54) is located at one end of the detection frame (53) away from the three-axis suction cup manipulator (51).

5. A chip frame cleaning and drying device according to any one of claims 1 to 4, characterized in that: The implementation steps include: Step 1: Use the first material box conveying module (13) to convey the material box containing the chip frame in a horizontal position to the direction of the cleaning tank (14) of the ultrasonic cleaning component (12), and the three-axis loading robot (11) clamps and places it into the cleaning tank (14) for ultrasonic cleaning. After the cleaning is completed, the three-axis loading robot (11) clamps the material box in the cleaning tank (14) to the draining tank (15) for draining for a period of time, and then clamps the material box to the batch drying mechanism (2) for drying; Step 2: Using the three-axis loading robot (11) to grab the drained material box into the hot drying bin (23), and then the cover moving module (25) covers the bin cover (24) to the top of the hot drying bin (23) to start hot drying, and then the three-axis loading robot (11) takes out the hot dried material box and puts it in the air drying component (22); Step 3: The hot-dried material box in a horizontal state is clamped by a three-axis loading robot (11) and placed on the flip frame (224) of the flip assembly (222). The flip motor (225) drives the flip frame (224) to flip 90 degrees. When the flip is completed, the second material box conveying module (223) drives the vertical material box to move into the air shower (221). The air shower (221) air-dries the material box, and after passing through the air shower (221), it is conveyed to the material distribution and transfer mechanism (3) to wait for distribution. Step 4: The chip frames in the material box are ejected one by one through the material distribution and transfer mechanism (3) and transferred to the single-piece drying mechanism (4) for drying. After the air shower is completed, the first material box clamping assembly (32) clamps the vertical material box and moves it horizontally to the position facing the ejector assembly (31) and the single-chip conveying module (33). Then, the ejector assembly (31) ejects the chip frames in the material box one by one to the single-chip conveying module (33). The single-chip conveying module (33) and the linear module (34) transfer the single-piece chip frames to the single-piece drying mechanism (4) for drying. Step 5: Using the movable material shifting assembly (42), the chip frames are pushed through the hot drying port of the outer oven (41) one by one through the material guide frame (45), and then pushed to the sponge roller assembly (43) for wiping, and then transported to the detection and receiving mechanism (5) by the conveyor belt module (44); Step 6: Use a three-axis suction cup manipulator (51) to suck the chip frame located on the conveyor belt module (44) onto the detection rack (53), and use the transfer component (55) to transfer the chip frame one by one to the detection device (52) for detection. After the detection is completed, the chip frame is transferred to the material box clamped by the second material box clamping component (54) to complete the material collection.

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