Wafer shear force testing device

Abstract

The present invention relates to a wafer shear force testing device applied to the testing field. The wafer is magnetically wrapped by a main guide film and an auxiliary guide film so that the wafer can enter and exit a testing box. On the one hand, the sealing state of the testing box itself is effectively realized, an isolated testing environment is provided for the wafer, and the influence of dust on the wafer is preliminarily reduced. On the other hand, the wafer is wrapped by the main guide film and the auxiliary guide film so that the wafer can enter and exit the testing box without opening the testing box. Before and after the wafer enters and exits the testing box, the contact between the wafer and the air is also effectively blocked, further reducing the influence of dust on the wafer. In addition, after the test is completed, the gas in the testing box is circulated through the microporous area on the main guide film, which can effectively achieve the dust filtering effect, further providing a safe testing environment for the wafer test.

Description

Technical Field

[0001] The present invention relates to a testing device, and in particular to a wafer shear force testing device applied in the testing field. Background Art

[0002] The wafer shear force tester is a special dynamic testing instrument used in the fields of microelectronic packaging, PCBA electronic assembly manufacturing and failure analysis. It is an important instrument and equipment in the field of microelectronics and electronic manufacturing to promote the domestic development.

[0003] The specification of Chinese patent CN202210257341.1 discloses a wafer shear force testing machine, which records the changes of the wafer during the test by photographing the observation component. The left clamp and the right clamp of the clamping component are arranged on the side of the positioning seat away from the sliding support. As the sliding support moves, the wafer is driven to contact the left clamp and the right clamp to limit the wafer at three points. Multiple clamping plates are respectively slidably arranged on one side of the left clamp, the right clamp and the sliding support. After the wafer is limited, the clamping plate is started to lift and clamp the wafer to complete the fixation of the wafer. The shear force of the wafer is tested by the test component, which makes the installation of the wafer more convenient and stable.

[0004] The specification of Chinese patent CN201920990218.4 discloses a wafer shear force testing machine, including a base, a support base, and support piles arranged between the base and the support base, and test arms are symmetrically arranged on both sides of the support base; the set test arms can realize movement in three-dimensional space through a multi-axis linkage device, so that the test types are richer, the test process is simpler, and the test results are more accurate.

[0005] Since wafer testing generally needs to be carried out in a dust-free environment to reduce the impact of particulate dust on wafer quality, the existing dust-free testing environment is generally based on a dust-free workshop, but it is difficult for a dust-free workshop to always ensure the cleanliness of the air environment. Secondly, it is also difficult to always have the conditions of a dust-free workshop during testing. At this time, the wafers during the testing process are easily affected by particulate dust in the air. Summary of the invention

[0006] In view of the above-mentioned prior art, the technical problem to be solved by the present invention is that the wafers during the testing process are easily affected by air particles and dust.

[0007] In order to solve the above problems, the present invention provides a wafer shear force testing device, comprising a testing box and a pair of testing arms fixedly installed inside the testing box, both sides of the testing box are fixedly connected with a traction assembly, the traction assembly comprises a traction frame fixedly connected to the outer end of the testing box, a main winding roller and a main guide roller for traction of a main guide film are rotatably connected to the traction frame, one end of the main guide film is fixedly connected to the outer end of one of the main winding rollers, and the other end of the main guide film bypasses the main guide roller and moves through the interior of the testing box until it is fixedly connected to the other main winding roller;

[0008] The traction frame is also rotatably connected with an auxiliary winding roller and an auxiliary guide roller for pulling the auxiliary guide film. The interior of the detection box is rotatably connected with a plurality of inner guide rollers for pulling the auxiliary guide film. One end of the auxiliary guide film is fixedly connected to the outer end of one of the auxiliary winding rollers, and the other end of the auxiliary guide film bypasses the auxiliary guide roller and the inner guide roller and moves through the interior of the detection box until it is fixedly connected to another auxiliary winding roller.

[0009] The main guide film and the auxiliary guide film are both made of plastic films coated with magnetic coatings, and the magnetic coatings are located on one end surface of the two films close to each other. The main guide film is located on the lower side of the auxiliary guide film, and a plurality of linearly evenly distributed microporous areas are opened on the main guide film.

[0010] The inner bottom surface of the detection box is fixedly connected with a placement plate, and the upper end of the placement plate is fixedly connected with a vacuum suction cup. The upper end surface of the vacuum suction cup is tightly fitted with the lower end surface of the main guide film, and the upper end surface size of the vacuum suction cup is larger than the size of the micropore area.

[0011] As a further supplement to the present application, the wafer is placed at the upper end of the microporous area, and the diameter of the microporous area is smaller than the diameter of the wafer. In the initial state, the main guide film and the auxiliary guide film are both wound around the outer ends of the main winding roller and the auxiliary winding roller on the same side of the inspection box.

[0012] As a further supplement to the present application, a main motor and an auxiliary motor are fixedly connected to one side end of the traction frame, the output end of the main motor movably passes through the traction frame and is fixedly connected to the main winding roller, and the output end of the auxiliary motor movably passes through the traction frame and is fixedly connected to the auxiliary winding roller.

[0013] As a further supplement to the present application, a pair of side ends of the detection box close to the traction frame are provided with through channels, the upper inner wall of the through channel is fixedly connected with an upper sealing layer, the lower inner wall of the through channel is fixedly connected with a lower sealing layer, and the main guide membrane and the auxiliary guide membrane are both movable and pass through the upper sealing layer and the lower sealing layer.

[0014] As a further supplement to the present application, the vertical distance between the auxiliary guide roller and the main guide roller close to the detection box is 1-2 mm, and the vertical width of the through channel is the same as the sum of the vertical widths of the upper sealing layer and the lower sealing layer.

[0015] A wafer shear force testing device, the use method of which comprises the following steps:

[0016] S1, start the main motor and the auxiliary motor to drive the main guide film and the auxiliary guide film to move synchronously, and stop the movement of the main guide film and the auxiliary guide film when the microporous area reaches the lower side of the auxiliary winding roller;

[0017] S2, placing the wafer to be tested on the upper end of the micropore area, continuing the synchronous movement of the main guide film and the auxiliary guide film, under the magnetic attraction of the magnetic coatings of the two, the main guide film and the auxiliary guide film adhere to each other to wrap the wafer, isolate the air dust, and send the wafer into the interior of the inspection box;

[0018] S3. Inside the test box, the main guide film and the auxiliary guide film are separated. When the wafer reaches the upper end of the placement plate along with the movement of the main guide film, the movement of the main guide film and the auxiliary guide film is stopped, and the vacuum suction cup is started. Through the ventilation effect of the microporous area, the wafer is vacuum-adsorbed to be fixed, and then the wafer is tested by the test arm in the existing manner;

[0019] S4. After the test is completed, continue to move the main guide film and the auxiliary guide film, and move the wafer out of the inspection box in a wrapped state. When the wafer reaches the auxiliary winding roller, stop moving the main guide film and the auxiliary guide film, and take the wafer that has been inspected away from the main guide film. At the same time, the microporous area on the other side just reaches under the auxiliary winding roller on the other side, and continue with steps S2, S3 and S5.

[0020] As another improvement of the present application, a pair of cleaning rollers are rotatably connected to the traction frame, the pair of cleaning rollers are located on the upper side of the main guide roller and the auxiliary guide roller, and are in contact with the main guide film and the auxiliary guide film respectively.

[0021] As another improved supplement to the present application, the cleaning roller includes a square rod and a cotton rod fixedly connected to each other, a square hole is opened on one side end of the traction frame, one end of the square rod is inserted into the inside of the square hole, a round hole is opened on the end of the square hole close to the auxiliary guide film, the cotton rod movably passes through the round hole and is rotatably connected to the other side end of the traction frame.

[0022] As another improvement of the present application, an air pipe is fixedly connected to the side end of the detection box, the mouth of the air pipe extends into the interior of the detection box and fits with the lower end of the main guide film, and the centers of the air pipe, vacuum suction cup and microporous area are located on the same straight line.

[0023] To summarize, the present application uses a main guide film and a secondary guide film to magnetically wrap the wafer so that the wafer can enter and exit the inspection box. On the one hand, it effectively realizes the sealed state of the inspection box itself, provides an isolated inspection environment for the wafer, and initially reduces the impact of dust on the wafer. On the other hand, by wrapping the wafer with the main guide film and the secondary guide film, the wafer can be moved in and out of the inspection box without opening the inspection box. Before and after the wafer enters and exits the inspection box, it also effectively prevents the contact between the wafer and the air, further reducing the impact of dust on the wafer. In addition, after the inspection is completed, the gas in the inspection box is circulated through the microporous area on the main guide film, which can effectively achieve the dust filtering effect, further providing a safe inspection environment for wafer inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 The first embodiment of the present application is a three-dimensional Figure 1 ;

[0025] Figure 2 The first embodiment of the present application is a three-dimensional Figure 2 ;

[0026] Figure 3 This is a schematic diagram of the side structure of the first embodiment of the present application when in use Figure 1 ;

[0027] Figure 4 This is a schematic diagram of the side structure of the first embodiment of the present application when in use Figure 2 ;

[0028] Figure 5 This is a schematic diagram of the side structure of the first embodiment of the present application when in use Figure 3 ;

[0029] Figure 6 The third embodiment of the present invention is Figure 1 ;

[0030] Figure 7 The third embodiment of the present invention is Figure 2 ;

[0031] Figure 8 The third embodiment of the present invention is Figure 3 ;

[0032] Fig. 9 The side structure diagram of the second and third embodiments of this application Figure 1 ;

[0033] Fig.10 The side structure diagram of the second and third embodiments of this application Figure 2 .

[0034] Description of the numbers in the figure:

[0035] 1 detection box, 101 upper sealing layer, 102 lower sealing layer, 2 test arm, 3 traction frame, 301 square hole, 302 round hole, 4 main film guide, 401 main winding roller, 402 main guide roller, 403 main motor, 5 auxiliary film guide, 501 auxiliary winding roller, 502 auxiliary guide roller, 503 auxiliary motor, 504 inner guide roller, 6 microporous area, 7 placement plate, 8 vacuum suction cup, 9 cleaning roller, 91 square rod, 92 cotton rod, 10 air pipe. DETAILED DESCRIPTION

[0036] The following describes two implementation modes of the present application in detail with reference to the accompanying drawings.

[0037] The first implementation method:

[0038] The present invention provides a wafer shear force testing device, see Figure 1 , including a test box 1 and a pair of test arms 2 fixedly installed inside the test box 1, and traction components are fixedly connected to both sides of the test box 1, see Figure 1-3 The traction assembly includes a traction frame 3 fixedly connected to the outer end of the detection box 1, and a main winding roller 401 and a main guide roller 402 for traction of the main guide film 4 are rotatably connected to the traction frame 3. One end of the main guide film 4 is fixedly connected to the outer end of one of the main winding rollers 401, and the other end of the main guide film 4 bypasses the main guide roller 402 and moves through the interior of the detection box 1 until it is fixedly connected to the other main winding roller 401.

[0039] Combination Figure 2 and Figure 3 The traction frame 3 is also rotatably connected with an auxiliary winding roller 501 and an auxiliary guide roller 502 for pulling the auxiliary guiding film 5. The interior of the detection box 1 is rotatably connected with multiple inner guide rollers 504 for pulling the auxiliary guiding film 5. One end of the auxiliary guiding film 5 is fixedly connected to the outer end of one of the auxiliary winding rollers 501, and the other end of the auxiliary guiding film 5 bypasses the auxiliary guide roller 502 and the inner guide roller 504 and moves through the interior of the detection box 1 until it is fixedly connected to another auxiliary winding roller 501.

[0040] The main guide film 4 and the auxiliary guide film 5 are both made of plastic films coated with a magnetic coating, and the magnetic coating is located on one end surface of the two that are close to each other. The main guide film 4 is located on the lower side of the auxiliary guide film 5. The main guide film 4 is provided with a plurality of linearly evenly distributed microporous areas 6. A placement plate 7 is fixedly connected to the inner bottom surface of the detection box 1. A vacuum suction cup 8 is fixedly connected to the upper end of the placement plate 7. The upper end surface of the vacuum suction cup 8 is tightly fitted with the lower end surface of the main guide film 4, and the upper end surface size of the vacuum suction cup 8 is larger than the size of the microporous area 6. The wafer is placed at the upper end of the microporous area 6, and the diameter of the microporous area 6 is smaller than the diameter of the wafer. The microporous area 6 can provide positioning for wafer placement, and it is also convenient for the vacuum suction cup 8 to vacuum adsorb and fix the wafer.

[0041] like Figure 3 As shown, in the initial state, the main guide film 4 and the auxiliary guide film 5 are wound around the outer ends of the main winding roller 401 and the auxiliary winding roller 501 on the same side of the detection box 1, so as to facilitate the synchronous movement of the main guide film 4 and the auxiliary guide film 5 in the same direction to send the wafer into the detection box 1.

[0042] See also Figure 1 and Figure 2 A main motor 403 and an auxiliary motor 503 are fixedly connected to one side end of the traction frame 3. The output end of the main motor 403 movably passes through the traction frame 3 and is fixedly connected to the main winding roller 401. The output end of the auxiliary motor 503 movably passes through the traction frame 3 and is fixedly connected to the auxiliary winding roller 501. The main winding roller 401 is driven to rotate by the main motor 403 to traction and move the main guide film 4. The auxiliary winding roller 501 is driven to rotate by the auxiliary motor 503 to traction and move the auxiliary guide film 5.

[0043] See also Figure 2 and Figure 3 A pair of side ends of the detection box 1 near the traction frame 3 are provided with through channels, the upper inner wall of the through channel is fixedly connected with an upper sealing layer 101, and the lower inner wall of the through channel is fixedly connected with a lower sealing layer 102. The main guide film 4 and the auxiliary guide film 5 are both movable and penetrate between the upper sealing layer 101 and the lower sealing layer 102. The vertical distance between the auxiliary guide roller 502 and the main guide roller 402 near the detection box 1 is 1-2 mm. The vertical width of the through channel is the same as the sum of the vertical widths of the upper sealing layer 101 and the lower sealing layer 102. The upper sealing layer 101 and the lower sealing layer 102 are made of elastic material. Furthermore, since the thickness of the wafer is generally less than 1 mm, the main guide film 4 and the auxiliary guide film 5 are in a thin film state. Therefore, through the flexible deformation of the upper sealing layer 101 and the lower sealing layer 102, the main guide film 4 and the auxiliary guide film 5 and the wafer therebetween can smoothly pass through the upper sealing layer 101 and the lower sealing layer 102 and enter the interior of the detection box 1. The slight deformation caused by the three to the upper sealing layer 101 and the lower sealing layer 102 can be ignored, and the upper sealing layer 101 and the lower sealing layer 102 are not likely to hinder the delivery of the wafer.

[0044] A wafer shear force testing device, the use method of which comprises the following steps:

[0045] S1, start the main motor 403 and the auxiliary motor 503, drive the main guide film 4 and the auxiliary guide film 5 to move synchronously, and stop the movement of the main guide film 4 and the auxiliary guide film 5 when the microporous area 6 reaches the lower side of the auxiliary winding roller 501, such as Figure 2 As shown;

[0046] S2, such as Figure 3 and Figure 4As shown, the wafer to be tested is placed at the upper end of the microporous area 6, and the main guide film 4 and the auxiliary guide film 5 continue to move synchronously. Under the magnetic attraction of the magnetic coatings of the two, the main guide film 4 and the auxiliary guide film 5 adhere to each other and wrap the wafer, isolating the air dust, and sending the wafer into the interior of the detection box 1;

[0047] S3, such as Figure 5 As shown, inside the test box 1, the main guide film 4 and the auxiliary guide film 5 are separated. When the wafer reaches the upper end of the placement plate 7 along with the movement of the main guide film 4, the movement of the main guide film 4 and the auxiliary guide film 5 is stopped, and the vacuum suction cup 8 is started. Through the ventilation effect of the microporous area 6, the wafer is vacuum-adsorbed to be fixed, and then the wafer is tested by the test arm 2 in the existing manner;

[0048] S4. After the test is completed, continue to move the main guide film 4 and the auxiliary guide film 5, and move the wafer out of the inspection box 1 in a wrapped state. When the wafer reaches the auxiliary winding roller 501, stop moving the main guide film 4 and the auxiliary guide film 5, and take the wafer that has been tested away from the main guide film 4. At the same time, the microporous area 6 on the other side just reaches under the auxiliary winding roller 501 on the other side, and continue with steps S2, S3 and S5.

[0049] The present application uses a main guide film 4 and a secondary guide film 5 to magnetically wrap the wafer so that the wafer can enter and exit the detection box 1. On the one hand, the sealing state of the detection box 1 itself is effectively achieved, providing an isolated detection environment for the wafer, and preliminarily reducing the impact of dust on the wafer. On the other hand, by wrapping the wafer with the main guide film 4 and the secondary guide film 5, the wafer can be moved in and out of the detection box 1 without opening the detection box 1. Before and after the wafer enters and exits the detection box 1, the contact between the wafer and the air is also effectively blocked, further reducing the impact of dust on the wafer. In addition, after the detection is completed, the gas in the detection box 1 is circulated through the microporous area 6 on the main guide film 4, which can effectively achieve the dust filtering effect, further providing a safe detection environment for wafer detection.

[0050] Second implementation method:

[0051] This embodiment adds the following structure based on the embodiment 1: Figure 6 and Fig.10 As shown, the side end of the detection box 1 is fixedly connected with an air pipe 10, the mouth of the air pipe 10 extends into the interior of the detection box 1 and fits with the lower end of the main guide film 4, and the centers of the air pipe 10, the vacuum suction cup 8 and the microporous area 6 are located on the same straight line;

[0052] The air pipe 10 can filter the dust inside the testing box 1, thereby further ensuring the quality and safety of the wafer during the testing process, as follows: Fig.10As shown, step 1, start the main motor 403 and the auxiliary motor 503, the main guide membrane 4 and the auxiliary guide membrane 5 move synchronously until a certain microporous area 6 enters the detection box 1 and is located just above the air pipe 10, the outlet end of the air pipe 10 is connected with the air inlet end of the air pump, the air outlet end of the air pump passes through the outer end of the detection box 1 and is connected with the inside of the detection box 1, after starting the air pump, the air in the detection box 1 is filtered and purified by the microporous area 6 and then enters the air pipe 10, and the filtered gas enters the detection box 1 again under the action of the air pump, so the filtering effect of the gas in the detection box 1 is achieved through the microporous area 6;

[0053] Step 2: After the filtration is completed, continue to move the main guide membrane 4 and the auxiliary guide membrane 5 so that they can send the dust filtered on the microporous area 6 out of the detection box 1. When there is too much dust on the microporous area 6, step 1 can be performed again until there is no obvious dust on the microporous area 6.

[0054] The third implementation method:

[0055] This embodiment adds the following structure based on the embodiment 1 or the embodiment 2: Figure 6 and Figure 7 A pair of cleaning rollers 9 are rotatably connected to the traction frame 3. The pair of cleaning rollers 9 are located on the upper side of the main guide roller 402 and the auxiliary guide roller 502, and are in contact with the main guide film 4 and the auxiliary guide film 5 respectively. Figure 8 and Fig. 9 The cleaning roller 9 includes a square rod 91 and a cotton rod 92 which are fixedly connected to each other. A square hole 301 is provided on one side of the traction frame 3. One end of the square rod 91 is inserted into the inside of the square hole 301. A round hole 302 is provided on the end of the square hole 301 close to the auxiliary guide film 5. The cotton rod 92 can move through the round hole 302 and is rotatably connected to the other side of the traction frame 3. The cotton rod 92 is made of a straight rod and absorbent cotton wrapped around the outer end of the straight rod.

[0056] By setting the cleaning roller 9, the main guide film 4 and the auxiliary guide film 5 can be cleaned. Fig. 9 As shown, after the detection is completed, the wet cotton rod 92 is inserted through the square hole 301 and the round hole 302 until the square rod 91 is inserted into the square hole 301, so that the cotton rod 92 contacts the main guide film 4 on the upper side of the auxiliary guide roller 502, and the same method can be used to make another cotton rod 92 contact the auxiliary guide film 5 on the upper side of the main guide roller 402, and then the traction process of the main guide film 4 and the auxiliary guide film 5 is started, so that the cotton rod 92 can clean the moving main guide film 4 and the auxiliary guide film 5.

[0057] In view of current practical needs, the above-mentioned implementation mode adopted in this application is not limited to the scope of protection. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the scope of protection of the present invention.

Claims

1. A wafer shear force testing device, comprising a testing box (1) and a pair of testing arms (2) fixedly installed inside the testing box (1), characterized in that: Both sides of the detection box (1) are fixedly connected with a traction assembly, and the traction assembly comprises a traction frame (3) fixedly connected to the outer end of the detection box (1), and the traction frame (3) is rotatably connected with a main winding roller (401) and a main guide roller (402) for pulling the main guide film (4), one end of the main guide film (4) is fixedly connected to the outer end of one of the main winding rollers (401), and the other end of the main guide film (4) bypasses the main guide roller (402) and moves through the interior of the detection box (1) until it is fixedly connected to the other main winding roller (401); The traction frame (3) is also rotatably connected to a secondary winding roller (501) and a secondary guide roller (502) for pulling the secondary guide film (5); the interior of the detection box (1) is rotatably connected to a plurality of inner guide rollers (504) for pulling the secondary guide film (5); one end of the secondary guide film (5) is fixedly connected to the outer end of one of the secondary winding rollers (501); the other end of the secondary guide film (5) bypasses the secondary guide roller (502) and the inner guide roller (504) and moves through the interior of the detection box (1) until it is fixedly connected to another secondary winding roller (501); The main guide film (4) and the auxiliary guide film (5) are both made of plastic films coated with a magnetic coating, and the magnetic coating is located on one end surface of the two films that are close to each other. The main guide film (4) is located on the lower side of the auxiliary guide film (5). The main guide film (4) is provided with a plurality of microporous areas (6) that are evenly distributed linearly. The wafer is placed at the upper end of the microporous area (6), and the diameter of the microporous area (6) is smaller than the diameter of the wafer. In an initial state, the main guide film (4) and the auxiliary guide film (5) are both wound around the outer ends of a main winding roller (401) and an auxiliary winding roller (501) on the same side of the detection box (1); The inner bottom surface of the detection box (1) is fixedly connected to a placement plate (7), the upper end of the placement plate (7) is fixedly connected to a vacuum suction cup (8), the upper end surface of the vacuum suction cup (8) is tightly fitted to the lower end surface of the main guide film (4), and the size of the upper end surface of the vacuum suction cup (8) is larger than the size of the microporous area (6); A pair of side ends of the detection box (1) close to the traction frame (3) are each provided with a through channel, the upper inner wall of the through channel is fixedly connected to an upper sealing layer (101), the lower inner wall of the through channel is fixedly connected to a lower sealing layer (102), and the main guide film (4) and the auxiliary guide film (5) are both movably inserted between the upper sealing layer (101) and the lower sealing layer (102).

2. A wafer shear force testing device according to claim 1, characterized in that: A main motor (403) and an auxiliary motor (503) are fixedly connected to one side end of the traction frame (3); an output end of the main motor (403) movably passes through the traction frame (3) and is fixedly connected to the main winding roller (401); and an output end of the auxiliary motor (503) movably passes through the traction frame (3) and is fixedly connected to the auxiliary winding roller (501).

3. A wafer shear force testing device according to claim 1, characterized in that: The vertical distance between the auxiliary guide roller (502) and the main guide roller (402) close to the detection box (1) is 1-2 mm, and the vertical width of the through channel is the same as the sum of the vertical widths of the upper sealing layer (101) and the lower sealing layer (102).

4. A wafer shear force testing device according to claim 2, characterized in that: The method of use includes the following steps: S1, starting the main motor (403) and the auxiliary motor (503), driving the main guide film (4) and the auxiliary guide film (5) to move synchronously, and stopping the movement of the main guide film (4) and the auxiliary guide film (5) when the microporous area (6) reaches the lower side of the auxiliary winding roller (501); S2, placing the wafer to be inspected at the upper end of the microporous area (6), continuing the synchronous movement of the main guide film (4) and the auxiliary guide film (5), under the magnetic attraction of the magnetic coatings of the two, the main guide film (4) and the auxiliary guide film (5) adhere to each other to wrap the wafer, isolate the air dust, and send the wafer into the interior of the inspection box (1); S3. Inside the testing box (1), the main guide film (4) and the auxiliary guide film (5) are separated. When the wafer reaches the upper end of the placement plate (7) along with the movement of the main guide film (4), the movement of the main guide film (4) and the auxiliary guide film (5) is stopped, and the vacuum suction cup (8) is started. The wafer is fixed by vacuum adsorption through the ventilation effect of the microporous area (6), and then the wafer is tested by the test arm (2) in the existing manner; S4. After the test is completed, the main guide film (4) and the auxiliary guide film (5) continue to move, and the wafer is moved out of the inspection box (1) in a wrapped state. When the wafer reaches the auxiliary winding roller (501), the movement of the main guide film (4) and the auxiliary guide film (5) is paused, and the wafer that has completed the test is taken off the main guide film (4). At the same time, the microporous area (6) on the other side just reaches under the auxiliary winding roller (501) on the other side, and steps S2, S3 and S5 are continued.

5. The wafer shear force testing device according to claim 1, characterized in that: A pair of cleaning rollers (9) are rotatably connected to the traction frame (3); the pair of cleaning rollers (9) are located on the upper side of the main guide roller (402) and the auxiliary guide roller (502), and are in contact with the main guide film (4) and the auxiliary guide film (5) respectively.

6. A wafer shear force testing device according to claim 5, characterized in that: The cleaning roller (9) comprises a square rod (91) and a cotton rod (92) which are fixedly connected to each other; a square hole (301) is provided at one side end of the traction frame (3); one end of the square rod (91) is inserted into the square hole (301); a round hole (302) is provided at one end of the square hole (301) close to the auxiliary guide film (5); the cotton rod (92) movably passes through the round hole (302) and is rotatably connected to the other side end of the traction frame (3).

7. The wafer shear force testing device according to claim 1, characterized in that: The side end of the detection box (1) is fixedly connected to an air tube (10), the mouth of the air tube (10) extends into the interior of the detection box (1) and fits with the lower end of the main guide film (4), and the centers of the air tube (10), the vacuum suction cup (8) and the microporous area (6) are located on the same straight line.

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