A PCB circuit board etching processing device

Abstract

The present invention belongs to the technical field of PCB processing, and discloses a PCB circuit board etching processing device, including an etching pool, a loading frame is fixedly provided above the etching pool, an adapting groove is provided at the bottom of the loading frame, and a clamping component is movably sleeved inside the adapting groove. The present invention improves the etching effect by increasing the total etching area, and at the same time, the clamping frame is lifted up again to make the clamping frame drive the etched PCB circuit board to move to the position between the material guide processing component and the loading frame, and the clamping effect is cancelled. When the PCB circuit board is located on the clamping frame and loses the clamping and limiting, it tilts in either direction to the left or right, and the material guide processing components arranged obliquely on both sides are used to quickly guide out the etched PCB circuit board, the actual PCB circuit board is quickly and accurately positioned, the clamping action is simple and convenient, the etching area is maximized, and the loading, etching and discharging processing are quickly completed, and the actual etching effect is good and the efficiency is high.

Description

Technical Field

[0001] The invention belongs to the technical field of PCB processing, and in particular relates to a PCB circuit board etching processing device. Background Art

[0002] Circuit board etching is the process of removing excess copper foil from a circuit board by chemical or physical methods, leaving behind the desired circuit pattern. Specifically, it usually involves coating a layer of photosensitive material (such as photosensitive glue or anti-corrosion dry film) on the surface of the circuit board, and then forming the desired circuit pattern through light or exposure. After that, a chemical solution (etching solution) is used to corrode the unprotected part, leaving behind a conductive line made of copper foil.

[0003] In the prior art, the PCB circuit board etching processing device usually adopts a clamping tool to clamp the PCB circuit boards one by one and put them into the etching pool for etching during the etching process. However, in the current clamping process, for the synchronous clamping of multiple groups of PCB circuit boards, local clamping is usually adopted for the front and back sides at one end, and the PCB circuit boards are sent into the etching pool after clamping, which causes local clamping of the front and back sides of the PCB circuit board, shielding the front and back sides of the PCB circuit board, so that the front and back sides of the PCB circuit board have local areas that cannot effectively contact the etching liquid, greatly reducing the actual etching effect. Although the clamping surface can be controlled by controlling the clamping size, there are still a small number of positions that cannot be fully etched, and the position usually needs to be adjusted for secondary etching. At the same time, from the clamping, etching, discharge and lower wheel clamping action of the PCB circuit board, the clamping component needs to be adjusted in a non-single direction in space, and then it is often necessary to introduce a high-priced complete multi-axis action of the robot arm, the actual investment cost is high, and the multi-axis action takes more time than the single-axis action, further reducing the efficiency of batch etching continuous processing, the actual use effect is not good, the etching effect is poor, and the efficiency is not high enough. Summary of the invention

[0004] The object of the present invention is to provide a PCB circuit board etching processing device to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a PCB circuit board etching processing device, comprising an etching pool, a loading frame is fixedly provided above the etching pool, an adapting groove is provided at the bottom of the loading frame, a clamping component is movably sleeved inside the adapting groove, a composite power component is fixedly provided on the front of the etching pool, the clamping component corresponds to the loading frame one by one and is distributed in an array, a distribution component is provided on the front of the clamping component, an air outlet end of the distribution component is connected to the clamping component, and the other end of the distribution component is connected to the composite power component, the composite power component drives the clamping component to move up and down through the distribution component and delivers gas to the clamping component, both sides below the loading frame are provided with material guide processing components, and the spacing value between the top of the material guide processing component and the loading frame is greater than the width of the PCB board;

[0006] The clamping assembly comprises a clamping frame, a connecting groove, a stepped hole and a spring.

[0007] Preferably, an intermediate rod is fixedly connected between adjacent loading frames, and support columns are fixedly provided at both ends of the etching pool, and the upper ends of the support columns are fixedly connected to the loading frames on both sides.

[0008] Preferably, the clamping frame is movably sleeved in the adapting groove, the connecting groove is opened inside the clamping frame, the step hole is opened on the inner side of the clamping frame and is connected with the connecting groove, the step rod is movably sleeved in the step hole, one end of the spring is fixed in the step hole and the other end is fixedly connected to the step rod.

[0009] Preferably, the composite power assembly includes a base, an electric push rod, a support tube, an air pump and an air pipe, the base is fixed on the front side of the etching pool, the electric push rod is fixedly installed on the top of the base, the support tube is fixedly connected to the movable end of the electric push rod, the air pump is fixedly installed on the top of the base, one end of the air pipe is fixedly connected to the support tube and the other end is fixedly connected to the air outlet end of the air pump.

[0010] Preferably, the distribution assembly includes a connecting sleeve, a side tube and a distribution sleeve, the connecting sleeve and the clamping frame are alternately distributed, the side tube is fixedly connected between the connecting sleeve and the clamping frame, the distribution sleeve is located on the front side of the connecting sleeve and is connected to the connecting sleeve, and the distribution sleeve is fixedly connected to the support tube.

[0011] Preferably, the material guide processing assembly includes an export frame, a connecting rod, a side plate and a permeation groove, the connecting rod is fixed at the oblique lower end of the export frame and is fixedly connected to the etching pool, the export frame is an inclined frame, the side plate is fixedly connected to the oblique lower end of the export frame and is located above the connecting rod, the permeation groove is opened on the inclined surface inside the export frame and passes through the export frame, and the internal array of the export frame is arranged with a vibration part.

[0012] Preferably, the vibration part includes a raised column and a raised strip, the raised column is fixedly installed on the top of the inner surface of the lead-out frame, the raised strip is fixedly connected to the top of the raised column, and the vibration part is installed in the lead-out frame with alternating high and low undulations.

[0013] Preferably, a limit assembly is fixedly provided at the bottom of the loading frame, and the number of the limit assemblies is four. The four limit assemblies are grouped into two groups of two, and the limit assembly includes a mounting seat, a limit block, a movable groove and a second spring. The mounting seat is fixedly connected to the bottom of the loading frame, the limit block is movably sleeved on the inner side surface of the mounting seat, the movable groove is opened on the inner side surface of the mounting seat, the limit block is movably sleeved in the movable groove, one end of the second spring is fixedly connected in the movable groove and the other end is fixedly connected to the limit block, and the limit block is a wedge-shaped block.

[0014] The beneficial effects of the present invention are as follows:

[0015] 1. The present invention utilizes the cooperation between the loading frame and the clamping assembly to enable the loading frame to realize the positioning function of the inserted PCB circuit board, so that the PCB circuit board falls stably in the clamping frame, and cooperates with the function of the air pump and the air pipe to input air into the distribution assembly, and uses the distribution assembly to input gas into the inside of the clamping frame, so as to achieve clamping and fixing from both sides of the PCB circuit board, ensuring that the front and back sides of the PCB circuit board are not blocked when the PCB circuit board is clamped, and cooperates with the vertical descent to immerse the PCB circuit board accurately clamped on the side in the etching pool to complete full etching, thereby avoiding the existing clamping tools to block the front and back sides of the PCB circuit board , increase the total etching area, improve the etching effect, and at the same time, lift the clamping frame again to make the clamping frame drive the etched PCB circuit board to the position between the material guide processing component and the loading frame, and cancel the clamping effect. The PCB circuit board is located on the clamping frame and loses the clamping and limit. The PCB circuit board tilts to the left or right direction, and the material guide processing components arranged obliquely on both sides are used to quickly export the etched PCB circuit board. The actual PCB circuit board positioning is fast and accurate, the clamping action is simple and convenient, the etching area is maximized, and the loading, etching and unloading processing are completed quickly, the actual etching effect is good and the efficiency is high.

[0016] 2. The present invention again utilizes the material guiding processing components arranged obliquely on both sides, cooperates with the vibration part installed in an array on the material guiding processing component and the penetration groove in the material guiding processing component, so that the overturned PCB circuit board slides obliquely in the material guiding processing component and intermittently contacts with the undulating raised strips on the surface of the vibration part, cooperates with the sliding effect, so that the PCB circuit board vibrates and slides slightly, and in the collision process of sliding vibration and overturning and falling, the etching liquid attached to the PCB circuit board is vibrated and separated, and the separated etching liquid flows back to the etching pool along the penetration groove, so that the surface of the PCB circuit board after etching is quickly cleaned, and the separated etching liquid is automatically recovered, the operation is simple, and the use effect is good.

[0017] 3. The present invention adds a limiting component at the bottom of the loading frame, so that the PCB circuit board put into the loading frame is automatically limited and sleeved in the loading frame, and when the clamping component is moved and sleeved, the limiting component is automatically pushed open and the positioned PCB circuit board is automatically matched in the loading frame, thereby realizing early assembly. When the clamped PCB circuit board is being etched, the PCB circuit board to be processed can be put into the loading frame in advance and positioned, and after the etched PCB circuit board is discharged, the automatic positioning and clamping of the next group of PCB circuit boards is quickly and automatically completed, which further improves the continuous etching speed, shortens the batch etching time, greatly improves the batch etching efficiency, and has a good use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 It is a schematic diagram of the feeding frame of the present invention;

[0020] Figure 3 is a cross-sectional schematic diagram of the clamping assembly of the present invention;

[0021] Figure 4 Based Figure 3 A schematic diagram of the structure enlargement at the center A;

[0022] Figure 5 A schematic diagram of the distribution components of the present invention;

[0023] Figure 6 is a schematic diagram of a composite power assembly of the present invention;

[0024] Figure 7 It is a bottom schematic diagram of the material guiding and processing assembly of the present invention;

[0025] Figure 8 It is a schematic diagram of the material guiding processing assembly and the vibration part of the present invention;

[0026] Fig. 9 is a schematic diagram of a vibration part of the present invention;

[0027] Fig.10 This is a schematic diagram of a loading frame in the second embodiment;

[0028] Fig.11 It is an exploded schematic diagram of the limiting assembly of the present invention.

[0029] In the figure: 1. etching pool; 2. loading frame; 3. adapter groove; 4. middle rod; 5. support column; 6. clamping assembly; 61. clamping frame; 62. connecting groove; 63. step hole; 64. step rod; 65. spring one; 7. composite power assembly; 71. base; 72. electric push rod; 73. support pipe; 74. air pump; 75. air pipe; 8. distribution assembly; 81. connecting sleeve; 82. side pipe; 83. distribution sleeve; 9. material guide processing assembly; 91. lead-out frame; 92. connecting rod; 93. side plate; 94. penetration groove; 10. vibration part; 101. raised column; 102. raised strip; 11. limit assembly; 111. mounting seat; 112. limit block; 113. movable groove; 114. spring two. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] like Figures 1 to 11 As shown, an embodiment of the present invention provides a PCB circuit board etching processing device, including an etching pool 1, a loading frame 2 is fixedly provided above the etching pool 1, an adapting groove 3 is provided at the bottom of the loading frame 2, a clamping component 6 is movably sleeved inside the adapting groove 3, a composite power component 7 is fixedly provided on the front of the etching pool 1, the clamping component 6 corresponds to the loading frame 2 one by one and is distributed in an array, a distribution component 8 is provided on the front of the clamping component 6, an air outlet end of the distribution component 8 is connected to the clamping component 6, and the other end of the distribution component 8 is connected to the composite power component 7, the composite power component 7 drives the clamping component 6 to move up and down through the distribution component 8 and transports the gas to the clamping component 6, and both sides below the loading frame 2 are provided with material guide processing components 9, and the spacing value between the top of the material guide processing component 9 and the loading frame 2 is greater than the width of the PCB board;

[0032] The clamping assembly 6 includes a clamping frame 61, a connecting groove 62, a stepped hole 63 and a spring 65.

[0033] Among them, a middle rod 4 is fixedly connected between adjacent loading frames 2, and support columns 5 are fixedly provided at both ends of the etching pool 1, and the upper ends of the support columns 5 are fixedly connected to the loading frames 2 on both sides.

[0034] The multiple groups of loading frames 2 are connected as a whole through the middle rod 4 , and the multiple groups of loading frames 2 are centrally fixed above the etching pool 1 using the support column 5 .

[0035] Among them, the clamping frame 61 is movably sleeved in the adapter groove 3, the connecting groove 62 is opened inside the clamping frame 61, the step hole 63 is opened at the inner side of the clamping frame 61 and is connected with the connecting groove 62, the step rod 64 is movably sleeved in the step hole 63, one end of the spring 65 is fixed in the step hole 63 and the other end is fixedly connected to the step rod 64.

[0036] The clamping frame 61 quickly guides the airflow on both sides through the connecting groove 62, so that the step rods 64 on both sides clamp and fix the PCB circuit board. The outer surface of the inner end of the step rod 64 can be specifically provided with a sealing sleeve to maintain dynamic sealing and avoid air leakage.

[0037] Among them, the composite power assembly 7 includes a base 71, an electric push rod 72, a support tube 73, an air pump 74 and an air pipe 75. The base 71 is fixed on the front of the etching pool 1, the electric push rod 72 is fixedly installed on the top of the base 71, the support tube 73 is fixedly connected to the movable end of the electric push rod 72, the air pump 74 is fixedly installed on the top of the base 71, and one end of the air pipe 75 is fixedly connected to the support tube 73 and the other end is fixedly connected to the air outlet end of the air pump 74.

[0038] The composite power component 7 realizes uniaxial up and down movement, and completes the clamping, etching and discharge actions of the PCB circuit board only under the up and down movement. This is specifically achieved by moving the position, avoiding movements in different directions and improving processing efficiency. The composite power component 7 cooperates with the air pump 74 to provide pressurized air, and the gas is smoothly introduced into the distribution component 8 to realize the clamping air pressure provision.

[0039] Among them, the distribution component 8 includes a connecting sleeve 81, a side tube 82 and a distribution sleeve 83. The connecting sleeve 81 and the clamping frame 61 are alternately distributed. The side tube 82 is fixedly connected between the connecting sleeve 81 and the clamping frame 61. The distribution sleeve 83 is located on the front side of the connecting sleeve 81 and is connected to the connecting sleeve 81. The distribution sleeve 83 is fixedly connected to the support tube 73.

[0040] The distribution component 8 connects each group of clamping components 6, and cooperates with the input gas to maintain the input and output of gas in the up and down movement state, thereby realizing the synchronous clamping and clamping release operations of multiple groups of PCB circuit boards.

[0041] Among them, the material guide processing component 9 includes an export frame 91, a connecting rod 92, a side plate 93 and a penetration groove 94. The connecting rod 92 is fixed at the oblique lower end of the export frame 91 and is fixedly connected to the etching pool 1. The export frame 91 is an inclined frame. The side plate 93 is fixedly connected to the oblique lower end of the export frame 91 and is located above the connecting rod 92. The penetration groove 94 is opened on the inclined surface inside the export frame 91 and passes through the export frame 91. The internal array of the export frame 91 is arranged with a vibration part 10.

[0042] The material guiding processing components 9 are symmetrically distributed on both sides to ensure that the PCB circuit board that has been unclamped and fixed can be quickly guided out when it is tilted in any direction on the left or right, thereby improving the efficiency of discharging the PCB circuit board after etching and facilitating the clamping and etching processing of the next round of PCB circuit boards.

[0043] Among them, the vibration part 10 includes a raised column 101 and a raised strip 102. The raised column 101 is fixedly installed on the top of the inner surface of the lead-out frame 91, and the raised strip 102 is fixedly connected to the top of the raised column 101. The vibration part 10 is installed in the lead-out frame 91 with alternating high and low rises.

[0044] By means of the vibration part 10 arranged in ups and downs, the PCB circuit board sliding down along the material guide processing component 9 is vibrated to a certain extent, so that the etching liquid attached to the surface is quickly shaken off and separated, and automatically guided downward to flow back into the etching pool 1 in cooperation with the penetration groove 94, so that the post-etching processing is simple and convenient.

[0045] Embodiment 1: When in use, the composite power assembly 7 is started, and the support tube 73 is driven upward by the electric push rod 72, and the distribution assembly 8 and the clamping assembly 6 are moved, so that the clamping frame 61 in the clamping assembly 6 is sleeved in the adapter groove 3 at the bottom of the loading frame 2, and the PCB circuit board to be etched is put into the loading frame 2, and the PCB circuit board in the loading frame 2 is automatically aligned and falls into the clamping frame 61, and the air pump 74 in the composite power assembly 7 is started, so that the gas is output along the air pipe 75 and input to the distribution assembly 8 through the support tube 73. In the component 8, the gas entering the distribution component 8 is distributed to each connecting sleeve 81 through the distribution sleeve 83, and is introduced into the connecting groove 62 of the clamping frame 61 through the side tube 82, and the airflow entering the connecting groove 62 quickly enters the step hole 63 and pushes the step rod 64 in the step hole 63 to move. With the elastic deformation of the spring 65, the step rod 64 moves and is clamped and fixed from the side of the PCB circuit board. After the clamping and fixing is completed, the electric push rod 72 is started again to drive the clamping component 6 to move downward, so that the clamping The component 6 moves the PCB circuit board to the etching pool 1 for etching, and cooperates with the lifting effect so that the PCB circuit board is immersed in the etching pool 1 under the clamping of the bottom end face and the two side end faces, and completes the comprehensive etching; after the etching is completed, the composite power component 7 is used again to drive the clamped PCB circuit board to move out of the etching pool 1, and the clamping component 6 is moved to the top of the material guide processing component 9 distributed on both sides and is located below the loading frame 2. As the air supply of the air pump 74 is cancelled, the contact clamping effect is lost, and the etched PCB circuit board that loses the clamping fixation tilts and overturns in any direction on the left and right sides, and the overturned PCB circuit board falls into the inclined material guide processing component 9 and falls on the top of the vibration part 10. As the overturned PCB circuit board slides down along the inclined lead-out frame 91, the PCB circuit board shakes and slides down under the action of the raised column 101 and the raised strip 102 in the vibration part 10, and the excess etching liquid on the surface is shaken off, and the shaken off etching liquid drips back into the etching pool 1 along the penetration groove 94, completing the automatic discharge and cleaning and recovery of the etching liquid.

[0046] First, by utilizing the cooperation between the loading frame 2 and the clamping assembly 6, the loading frame 2 realizes the positioning function of the inserted PCB circuit board, so that the PCB circuit board falls stably in the clamping frame 61, and cooperates with the air pump 74 and the air pipe 75 to input air into the distribution assembly 8, and uses the distribution assembly 8 to input gas into the inside of the clamping frame 61, so as to achieve clamping and fixing from both sides of the PCB circuit board, ensuring that the front and back sides of the PCB circuit board are not blocked when the PCB circuit board is clamped, and cooperates with the vertical descent to immerse the PCB circuit board accurately clamped on the side in the etching pool 1 to complete sufficient etching, thereby avoiding the existing clamping tools on the front and back sides of the PCB circuit board. Blocking increases the total etching area and the etching effect. At the same time, the clamping frame 61 is lifted up again, so that the clamping frame 61 drives the etched PCB circuit board to move to the position between the material guide processing component 9 and the loading frame 2. The clamping effect is cancelled. The PCB circuit board is located on the clamping frame 61 and loses the clamping and limiting. The PCB circuit board tilts to either direction, and the material guide processing components 9 arranged obliquely on both sides are used to quickly export the etched PCB circuit board. The actual PCB circuit board positioning is fast and accurate, the clamping action is simple and convenient, the etching area is maximized, and the loading, etching and unloading processes are completed quickly, with good actual etching effect and high efficiency.

[0047] In addition, by again utilizing the material guiding processing components 9 arranged obliquely on both sides, in conjunction with the vibration parts 10 installed in an array on the material guiding processing components 9 and the penetration grooves 94 in the material guiding processing components 9, the overturned PCB circuit board can slide obliquely in the material guiding processing components 9 and intermittently contact the raised strips 102 on the surface of the vibration parts 10 with ups and downs, and in conjunction with the sliding effect, the PCB circuit board can slide slightly by vibrating, and in the collision process of sliding vibration and overturning and falling, the etching liquid attached to the PCB circuit board can be vibrated and separated, and the separated etching liquid can flow back to the etching pool 1 along the penetration grooves 94, so that the surface of the PCB circuit board after etching can be quickly cleaned, and the separated etching liquid can be automatically recovered, the operation is simple, and the use effect is good.

[0048] Among them, a limit assembly 11 is fixedly provided at the bottom of the loading frame 2, and the number of the limit assemblies 11 is four. The four limit assemblies 11 are divided into two groups, two in each group, and the limit assembly 11 includes a mounting seat 111, a limit block 112, a movable groove 113 and a second spring 114. The mounting seat 111 is fixedly connected to the bottom of the loading frame 2, the limit block 112 is movably sleeved on the inner side surface of the mounting seat 111, the movable groove 113 is opened on the inner side surface of the mounting seat 111, the limit block 112 is movably sleeved in the movable groove 113, one end of the second spring 114 is fixedly connected in the movable groove 113 and the other end is fixedly connected to the limit block 112, and the limit block 112 is a wedge-shaped block.

[0049] The PCB circuit board put into the loading frame 2 is automatically limited by the limiting component 11, and the limit is automatically released and the positioning clamping is completed when the clamping component 6 moves. The loading process can also be carried out in advance during etching, thereby improving the continuous etching efficiency.

[0050] Embodiment 2: Before etching, the PCB circuit boards to be etched are put into the loading frame 2 one by one, and the PCB circuit boards that fall from the inside of the loading frame 2 are brought into contact with the limit block 112 in the limit assembly 11 to complete the limiting. When the electric push rod 72 drives the clamping assembly 6 to move upward and insert into the adapter groove 3, the two ends of the top of the clamping frame 61 are pushed along one side of the bottom of the limit block 112, so that the limit block 112 is subjected to a component force in the horizontal direction, and is inserted along the movable groove 113 and the spring 2 114 is compressed, so that the limit block 112 is completely squeezed into the movable groove 113 and hidden. The PCB circuit board that loses its support continues to slide downward and cooperates with the upward clamping frame 61 to complete the positioning of automatic feeding.

[0051] Firstly, by adding a limiting component 11 at the bottom of the loading frame 2, the PCB circuit board put into the loading frame 2 is automatically limited and sleeved in the loading frame 2, and when the clamping component 6 moves and sleeves in, the limiting component 11 is automatically pushed open and the positioned PCB circuit board is automatically matched in the loading frame 2, thereby realizing early assembly. When the clamped PCB circuit board is being etched, the PCB circuit board to be processed can be pre-positioned in the loading frame 2, and after the etched PCB circuit board is discharged, the automatic positioning and clamping of the next group of PCB circuit boards can be completed quickly and automatically, which further improves the continuous etching speed, shortens the batch etching time, greatly improves the batch etching efficiency, and has a good use effect.

[0052] The working principle and use process of the present invention are as follows: when in use, the composite power component 7 is started, the support tube 73 is driven upward by the electric push rod 72, and the distribution component 8 and the clamping component 6 are moved, so that the clamping frame 61 in the clamping component 6 is sleeved in the adapter groove 3 at the bottom of the loading frame 2, and the PCB circuit board to be etched is put into the loading frame 2. The PCB circuit board in the loading frame 2 is automatically aligned and falls into the clamping frame 61, and the air pump 74 in the composite power component 7 is started, so that the gas is output along the air pipe 75 and input into the distribution component 8 through the support tube 73. The gas entering the distribution component 8 is distributed to each connecting sleeve 81 through the distribution sleeve 83, and is introduced into the clamping frame 6 through the side pipe 82. 1, and the airflow entering the connecting groove 62 quickly passes into the step hole 63 and pushes the step rod 64 in the step hole 63 to move. With the elastic deformation of the spring 1 65, the step rod 64 moves and is clamped and fixed from the side of the PCB circuit board. After the clamping and fixing is completed, the electric push rod 72 is started again and drives the clamping assembly 6 to move downward, so that the clamping assembly 6 moves the PCB circuit board into the etching pool 1 for etching. With the lifting effect, the PCB circuit board is immersed in the etching pool 1 under the clamping of the bottom end face and the two side end faces, and the full etching is completed. After the etching is completed, the composite power assembly 7 is used again to drive the clamped PCB circuit board to move out of the etching pool 1, and the clamping assembly 6 is driven to move downward. The component 6 moves to the top of the material guide processing components 9 distributed on both sides and is located below the loading frame 2. As the air supply of the air pump 74 is cancelled, the contact clamping effect is lost, and the etched PCB circuit board that loses the clamping fixation tilts and overturns in any direction on the left and right sides, and the overturned PCB circuit board falls into the inclined material guide processing components 9 and falls on the top of the vibration part 10. As the overturned PCB circuit board slides down along the inclined lead-out frame 91, the PCB circuit board shakes and slides down under the action of the raised columns 101 and the raised strips 102 in the vibration part 10, and the excess etching liquid on the surface is shaken off, and the shaken etching liquid drips back into the etching pool 1 along the penetration groove 94, completing the automatic discharge and cleaning of the etching liquid. Processing and recycling; before etching, the PCB circuit boards to be etched are put into the loading frame 2 one by one, and the PCB circuit boards that fall from the loading frame 2 are moved downward to contact the limit block 112 in the limit assembly 11 to complete the limit. When the electric push rod 72 drives the clamping assembly 6 to move upward and insert it into the adapter groove 3, the top two ends of the clamping frame 61 are pushed along one side of the bottom of the limit block 112, so that the limit block 112 is subjected to a component force in the horizontal direction, and is inserted along the active groove 113 and the spring 114 is compressed, so that the limit block 112 is completely squeezed into the active groove 113 and hidden, and the PCB circuit board that loses support continues to slide downward and cooperates with the upward clamping frame 61 to complete the positioning of automatic feeding.

[0053] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB circuit board etching processing device, comprising an etching pool (1), characterized in that: A loading frame (2) is fixedly provided above the etching pool (1), an adapting groove (3) is provided at the bottom of the loading frame (2), a clamping assembly (6) is movably sleeved inside the adapting groove (3), a composite power assembly (7) is fixedly provided on the front of the etching pool (1), the clamping assembly (6) corresponds to the loading frame (2) one by one and is arranged in an array, a distribution assembly (8) is provided on the front of the clamping assembly (6), an air outlet end of the distribution assembly (8) is connected to the clamping assembly (6), the other end of the distribution assembly (8) is connected to the composite power assembly (7), the composite power assembly (7) drives the clamping assembly (6) to move up and down through the distribution assembly (8) and transports gas to the clamping assembly (6), both sides below the loading frame (2) are provided with material guide processing assemblies (9), the spacing value between the top of the material guide processing assembly (9) and the loading frame (2) is greater than the width of the PCB board; The clamping assembly (6) comprises a clamping frame (61), a connecting groove (62), a stepped hole (63) and a spring (65); the clamping frame (61) is movably sleeved in the adapting groove (3); the connecting groove (62) is arranged inside the clamping frame (61); the stepped hole (63) is arranged on the inner side of the clamping frame (61) and is connected to the connecting groove (62); the stepped rod (64) is movably sleeved in the stepped hole (63); one end of the spring (65) is fixed in the stepped hole (63) and the other end is fixedly connected to the stepped rod (64); The material guide processing assembly (9) comprises an outlet frame (91), a connecting rod (92), a side plate (93) and a permeation groove (94); the connecting rod (92) is fixed to the oblique lower end of the outlet frame (91) and is fixedly connected to the etching pool (1); the outlet frame (91) is an inclined frame; the side plate (93) is fixedly connected to the oblique lower end of the outlet frame (91) and is located above the connecting rod (92); the permeation groove (94) is opened on the inclined surface inside the outlet frame (91) and penetrates the outlet frame (91); and a vibration part (10) is arranged in an array inside the outlet frame (91).

2. A PCB circuit board etching processing device according to claim 1, characterized in that: An intermediate rod (4) is fixedly connected between adjacent loading frames (2), and support columns (5) are fixedly provided at both ends of the etching pool (1), and the upper ends of the support columns (5) are fixedly connected to the loading frames (2) on both sides.

3. A PCB circuit board etching processing device according to claim 2, characterized in that: The composite power assembly (7) comprises a base (71), an electric push rod (72), a support tube (73), an air pump (74) and an air pipe (75); the base (71) is fixed on the front side of the etching pool (1); the electric push rod (72) is fixedly mounted on the top of the base (71); the support tube (73) is fixedly connected to the movable end of the electric push rod (72); the air pump (74) is fixedly mounted on the top of the base (71); one end of the air pipe (75) is fixedly connected to the support tube (73) and the other end is fixedly connected to the air outlet end of the air pump (74).

4. A PCB circuit board etching processing device according to claim 3, characterized in that: The distribution assembly (8) comprises a connecting sleeve (81), a side tube (82) and a distribution sleeve (83); the connecting sleeve (81) and the clamping frame (61) are alternately arranged; the side tube (82) is fixedly connected between the connecting sleeve (81) and the clamping frame (61); the distribution sleeve (83) is located on the front side of the connecting sleeve (81) and is connected to the connecting sleeve (81); and the distribution sleeve (83) is fixedly connected to the support tube (73).

5. A PCB circuit board etching processing device according to claim 4, characterized in that: The vibration part (10) comprises a raised column (101) and a raised strip (102); the raised column (101) is fixedly mounted on the top of the inner surface of the lead-out frame (91); the raised strip (102) is fixedly connected to the top of the raised column (101); and the vibration part (10) is mounted in the lead-out frame (91) in an alternating manner of high and low rises.

6. A PCB circuit board etching processing device according to claim 5, characterized in that: A limit assembly (11) is fixedly provided at the bottom of the loading frame (2). The number of the limit assemblies (11) is four. The four limit assemblies (11) are divided into two groups, namely, a left group and a right group, with two limit assemblies in each group. The limit assembly (11) comprises a mounting seat (111), a limit block (112), a movable groove (113) and a second spring (114). The mounting seat (111) is fixedly connected to the bottom of the loading frame (2). The limit block (112) is movably sleeved on the inner side surface of the mounting seat (111). The movable groove (113) is provided on the inner side surface of the mounting seat (111). The limit block (112) is movably sleeved in the movable groove (113). One end of the second spring (114) is fixedly connected in the movable groove (113) and the other end is fixedly connected to the limit block (112). The limit block (112) is a wedge-shaped block.

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