A chip detection feeding device with positioning correction structure

Abstract

This invention provides a chip inspection feeding device with a positioning correction structure for use in the field of transportation equipment. Depending on the situation, when the chips are of low cost, chip inspection only requires the addition of a low-cost electrostatic discharge (ESD) module with a detection and control terminal. Even if some chips are damaged due to excessive static charge, it is unlikely to cause significant economic losses. However, for the inspection of some high-cost chips, a high-cost ESD module with a detection and control terminal is required to promptly detect chips with excessive static charge, perform inspection and screening, and promptly stop the chip inspection system for inspection when excessive static charge occurs repeatedly. This reduces damage to chips caused by production line defects, improves economic efficiency, and utilizes static electricity as an auxiliary tool to correct the posture during chip inspection feeding, thereby improving inspection efficiency.

Description

Technical Field

[0001] The present application relates to the field of transport devices, and in particular to a feeding device for chip detection with a positioning correction structure. Background Art

[0002] Chip is a general term for semiconductor component products. It is an integrated circuit composed of a large number of transistors. Different chips have different integration scales, ranging from hundreds of millions to tens or hundreds of transistors. Transistors have two states, on and off, represented by 1 and 0. Multiple transistors generate multiple 1 and 0 signals, which are set to specific functions (i.e. instructions and data) to represent or process letters, numbers, colors, graphics, etc. After the chip is powered on, it first generates a startup instruction to start the chip, and then continuously receives new instructions and data to complete its functions. It is a basic component for the application of various electronic devices and is in great demand in today's social production process.

[0003] The complete chip manufacturing process includes chip design, wafer production, packaging production, testing and other links. The finished chips need to be tested before they can be used. The existing chip testing loading devices are mostly not precise enough for core posture correction. When the chip is loaded onto the testing table, the chip posture is often required to be further adjusted, which facilitates the chip testing process and affects the efficiency of chip testing.

[0004] Chips are electronic components made up of a large number of transistors. Static charges and magnetic fields in the production environment may cause irreversible damage to the chips. However, chips usually contain anti-static and anti-magnetic field structures during the production process, which can make the chips have certain anti-static and anti-magnetic field capabilities, and static electricity can be used to assist the production of chips. Summary of the invention

[0005] The purpose of the present application is to solve the problem of low detection efficiency caused by the disordered posture of the chip during loading. Compared with the prior art, a chip detection loading device with a positioning correction structure is provided. The posture correction module includes a traveling platform, a smooth surface is chiseled on the upper end of the traveling platform, and a chip is placed on the upper end of the smooth surface. A plurality of mounting grooves are chiseled on the side wall of the traveling platform, and a plurality of bristle brushes are fixedly connected in the plurality of mounting grooves. The plurality of bristle brushes pass through the openings of the mounting grooves and contact with the pins of the chip. A power belt 1 is provided at the upper end of the posture correction module. The power belt 1 includes an insulating belt, and a plurality of electrostatic carriers are inlaid on the outer wall of the insulating belt. The plurality of electrostatic carriers are distributed at equal intervals. A static elimination module matching its own position is provided on the upper side of the power belt 2. The static elimination module includes a grounding safety platform, and a static elimination telescopic rod is fixedly connected to the lower end of the grounding safety platform. When the chip moves to the lower end of the static elimination telescopic rod, the lower end of the static elimination telescopic rod contacts the upper end of the chip.

[0006] By using static electricity as an auxiliary tool, the chip's posture can be corrected during the chip detection and loading process, so that the chip can move to the detection module in a fixed posture, thereby improving the detection efficiency.

[0007] Furthermore, the multiple electrostatic carrier blocks are all made of flexible insulating materials, so that the electrostatic carrier blocks can adapt to the transmission process of the insulating belt and are not easily caused to fall out when the insulating belt moves to a bent position.

[0008] Furthermore, when multiple electrostatic carriers move to the side of the insulating belt away from the posture correction module, electrostatic replenishment is required to maintain the adsorption effect of the electrostatic carrier on the chip, so that the chip can move along the direction of the insulating belt on the smooth surface to the power belt 2 under the drive of the electrostatic carrier.

[0009] Furthermore, the posture correction module, power belt one, power belt two and static elimination module are placed in a dry environment to ensure that the chip and the static carrier block are quantitatively given static electricity and can be normally adsorbed to each other and take effect.

[0010] Furthermore, a method for using a chip detection feeding device with a positioning correction structure mainly includes the following steps:

[0011] S1. Static electricity is imparted to the chip plastic package, so that the chip surface carries static electricity. The static electricity carried by the special static electricity carrier is opposite to the static electricity on the chip surface.

[0012] S2, posture adjustment. The chip will move under the action of the electrostatic carrier with opposite static electricity. Under the action of multiple bristle brushes, the chip's posture will be adjusted until the resistance generated by the chip approaching the two ends of the mounting slot and contacting the mounting slot is balanced, completing the chip posture correction work. At the same time, the electrostatic carriers with equal spacing can control the distance between two adjacent chips, and the speed of chip loading can be controlled by controlling the speed of the insulating tape.

[0013] S3, static electricity elimination: the chip moves to the power belt 2 through the posture correction module, and then moves to the lower end of the static electricity elimination telescopic rod through the power belt 2. The static electricity on the chip plastic shell is grounded through the static electricity elimination telescopic rod, and the static electricity is transferred to the grounding end through the static electricity elimination telescopic rod, eliminating the damage to the chip caused by excessive static electricity accumulation.

[0014] Optionally, the lower end of the grounded safety table is fixedly connected with a screening telescopic rod that matches the position of the static elimination telescopic rod. The static elimination telescopic rod and the screening telescopic rod constitute the main structure of the static elimination structure and the chip screening structure respectively. The end of the screening telescopic rod away from the grounded safety table is fixedly connected with a vacuum suction cup. The grounded safety table is equipped with a control terminal and a charge detection terminal. Before the chip is tested, the static electricity on the plastic sealing surface of the chip can be tested. When the static electricity charge on the plastic sealing surface of the chip exceeds the limit, the chip screening structure with the screening telescopic rod as the main body is used to remove the chip and mark it.

[0015] Furthermore, the lower end of the grounded safety platform is fixedly connected with multiple sets of static elimination structures and chip screening structures. On the one hand, when the static charge on the chip surface exceeds the limit, after the chip is taken out and marked by the screening telescopic rod, it is not easy to affect the static elimination and detection of subsequent chips. On the other hand, when multiple chips have excessive static charge continuously, the charge abnormality can be discovered in time, and the line can be stopped for inspection in time to reduce damage to the chip.

[0016] Furthermore, a driven ring is fixedly connected to the static elimination telescopic rod, an active ring is fixedly connected to the screening telescopic rod, a linkage ring is connected between the static elimination telescopic rod and the grounded safety platform, and the ends of the static elimination telescopic rod and the screening telescopic rod away from the grounded safety platform respectively pass through the linkage ring, the active ring is located on the lower side of the linkage ring, and the driven ring is located on the upper side of the linkage ring, so that an effective linkage can be formed between the static elimination telescopic rod and the screening telescopic rod. After the screening telescopic rod and the vacuum suction cup are deformed to remove excessive static charge, the length of the corresponding driven ring will also be reduced, and the static charge on the subsequent chip surface will not be discharged, thereby increasing the accuracy of detection.

[0017] Furthermore, wear-resistant rings are connected between the linkage ring and the static elimination telescopic rod and the screening telescopic rod. A pair of wear-resistant rings are fixedly connected to the linkage ring, thereby reducing the wear between the linkage ring and the static elimination telescopic rod and the screening telescopic rod, so that the connection between the active ring and the static elimination telescopic rod and the screening telescopic rod is not prone to shaking.

[0018] Furthermore, a method for using a chip detection feeding device with a positioning correction structure mainly includes the following steps:

[0019] The method of use is the same as the above-mentioned step S1, electrostatic imparting and step S2, electrostatic imparting, so it will not be repeated here;

[0020] S3, static electricity elimination. When using the static electricity elimination telescopic rod to eliminate static electricity on the deformed plastic packaging shell, the amount of static electricity eliminated is tested. When the charge amount does not exceed the standard, the chip is loaded to the detection end. When the charge exceeds the standard, the screening telescopic rod and vacuum suction cup are used to remove the chip and mark it. The technicians will conduct a unified inspection later. If multiple chips exceed the standard continuously, the line will be stopped for inspection immediately to reduce the damage to the chip caused by production line defects.

[0021] Compared with the prior art, the advantages of this application are:

[0022] For low-cost chips, the chip will move under the action of an electrostatic carrier with opposite static electricity. Under the action of multiple bristle brushes, the chip's posture will be adjusted until the resistance generated by the chip's contact with the two ends of the mounting slot is balanced, completing the chip's posture correction. At the same time, the electrostatic carriers distributed at equal intervals can control the distance between two adjacent chips, and control the speed of chip loading by controlling the speed of the insulating tape.

[0023] At the same time, for chips with higher costs, the static electricity on the plastic package surface of the chip can be tested before the chip is tested. When the static electricity charge on the plastic package surface of the chip exceeds the limit, the chip is removed and marked using a chip screening structure with a screening telescopic rod as the main body. By using multiple sets of static electricity elimination structures and chip screening structures, when the static electricity charge on the chip surface exceeds the limit, after the screening telescopic rod removes the chip and marks it, it is not easy to affect the static electricity elimination and detection of subsequent chips. On the other hand, when multiple chips have excessive static electricity charge continuously, the charge abnormality can be discovered in time, and the line can be stopped for inspection in time to reduce damage to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a working schematic diagram of the main structure of the chip detection feeding device of the present invention;

[0025] Figure 2 for Figure 1 The structural diagram at A in the middle;

[0026] Figure 3 A side view of a chip testing loading device according to the present invention;

[0027] Figure 4 A top view of the chip posture correction module of the present invention;

[0028] Figure 5 A partial top view of the chip posture correction module of the present invention;

[0029] Figure 6 It is a schematic diagram of the static elimination structure and chip screening structure in the static elimination module of the present invention;

[0030] Figure 7 It is a schematic diagram of the chip screening structure of the present invention;

[0031] Figure 8 It is a structural schematic diagram of the linkage ring of the present invention;

[0032] Fig. 9 This is a main flow chart of a chip testing loading device according to embodiment 1 of the present invention;

[0033] Fig.10 This is the main flow chart of the chip detection loading device according to Example 2 of the present invention.

[0034] Description of the numbers in the figure:

[0035] 1 posture correction module, 101 travel platform, 102 smooth surface, 103 mounting groove, 104 hard brush, 2 power belt one, 201 insulating belt, 202 static load block, 3 power belt two, 4 static elimination module, 401 grounding mounting platform, 402 static elimination telescopic rod, 403 driven ring, 404 screening telescopic rod, 405 vacuum suction cup, 406 active ring, 407 linkage ring. DETAILED DESCRIPTION

[0036] The embodiments will be combined with the drawings in the specification to clearly and completely describe the technical solution of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative work shall fall within the scope of protection of the present application.

[0037] Embodiment 1:

[0038] See also Figure 1-6 A chip detection loading device with a positioning correction structure includes a posture correction module 1 and a power belt 3 whose positions match each other. The chip is transported to the power belt 3 via the posture correction module 1, and then moved to the detection device via the power belt 3. The posture correction module 1 includes a traveling platform 101, a smooth surface 102 is cut on the upper end of the traveling platform 101, and a chip is placed on the upper end of the smooth surface 102. A plurality of mounting grooves 103 are cut on the side wall of the traveling platform 101, and a plurality of bristle brushes 104 are fixedly connected in the plurality of mounting grooves 103. The plurality of bristle brushes 104 pass through the openings of the mounting grooves 103. The upper end of the posture correction module 1 is provided with a power belt 2, which includes an insulating belt 201. A plurality of electrostatic carriers 202 are inlaid on the outer wall of the insulating belt 201. The plurality of electrostatic carriers 202 are distributed at equal intervals. An electrostatic elimination module 4 matching its own position is provided on the upper side of the power belt 23. The electrostatic elimination module 4 includes a grounding safety platform 401. The lower end of the grounding safety platform 401 is fixedly connected with a static elimination telescopic rod 402. When the chip moves to the lower end of the static elimination telescopic rod 402, the lower end of the static elimination telescopic rod 402 contacts the upper end of the chip.

[0039] In particular, each structure of the posture correction module 1, power belt one 2, power belt two 3 and static elimination module 4 in the present solution needs to be equipped with a separate frame to keep each structure in a relative position. At the same time, for the convenience of viewing, each structure in the present application is drawn in strict installation proportions. Technical personnel in this field can design the specific dimensions of each structure in the present application according to actual conditions to meet practical needs.

[0040] Multiple electrostatic carrier blocks 202 are all made of flexible insulating materials, so that the electrostatic carrier blocks 202 can adapt to the transmission process of the insulating belt 201, and are not easy to cause the electrostatic carrier blocks 202 to fall out when the insulating belt 201 moves to the bending position. When multiple electrostatic carrier blocks 202 move to the side of the insulating belt 201 away from the posture correction module 1, static electricity needs to be supplemented to maintain the adsorption effect of the electrostatic carrier blocks 202 on the chip, so that the chip can be driven by the electrostatic carrier blocks 202 and move along the direction of the insulating belt 201 on the smooth surface 102 to the power belt 2 3. The posture correction module 1, power belt 1 2, power belt 2 3 and static electricity elimination module 4 are in a dry environment to ensure that the quantitative static electricity on the chip and the electrostatic carrier blocks 202 can be normally adsorbed to each other and take effect.

[0041] See also Figure 4-5 and Fig. 9 A method for using a chip detection feeding device with a positioning correction structure mainly includes the following steps:

[0042] S1, static electricity is imparted to the chip plastic package, so that the chip surface has static electricity, and the static electricity carried by the special static electricity carrier 202 is opposite to the static electricity on the chip surface;

[0043] S2, posture adjustment, the chip will move under the action of the electrostatic carrier 202 with opposite electrical charge, and under the action of multiple bristle brushes 104, the posture of the chip will be adjusted, so that the chip will move. Figure 4-5 until the resistance generated by the contact between the two ends of the chip close to the mounting groove 103 and the mounting groove 103 is balanced, and the chip posture correction work is completed. At the same time, the electrostatic load blocks 202 with equal spacing can control the distance between two adjacent chips, and the speed of chip loading is controlled by controlling the speed of the insulating tape 201.

[0044] S3, static electricity elimination. The chip moves to the power belt 2 3 through the posture correction module 1, and moves to the lower end of the static electricity elimination telescopic rod 402 through the power belt 2 3. The static electricity on the chip plastic shell is grounded through the static electricity elimination telescopic rod 402, and the static electricity is transferred to the grounding end through the static electricity elimination telescopic rod 402, thereby eliminating the damage to the chip caused by excessive static electricity accumulation.

[0045] Embodiment 2:

[0046] The present invention provides a chip testing feeding device with a positioning correction structure, please refer to Figure 1-8 The lower end of the grounded safety platform 401 is fixedly connected with a screening telescopic rod 404 that matches the position of the static elimination telescopic rod 402. The static elimination telescopic rod 402 and the screening telescopic rod 404 respectively constitute the main structure of the static elimination structure and the chip screening structure. The end of the screening telescopic rod 404 away from the grounded safety platform 401 is fixedly connected with a vacuum suction cup 405. The grounded safety platform 401 is equipped with a control terminal and a charge detection terminal. Before the chip is tested, the static electricity on the plastic packaging surface of the chip can be detected. When the static electricity charge on the plastic packaging surface of the chip exceeds the limit, the static electricity on the plastic packaging surface of the chip can be detected. The chip screening structure with the screening telescopic rod 404 as the main body is used to remove the chip and mark it. The lower end of the grounding safety platform 401 is fixedly connected with multiple groups of static elimination structures and chip screening structures. On the one hand, when the static charge on the chip surface exceeds the limit, after the screening telescopic rod 404 removes the chip and marks it, it is not easy to affect the static elimination and detection of subsequent chips. On the other hand, when multiple chips continuously have excessive static charges, the charge abnormality can be discovered in time, and the line can be stopped for inspection in time to reduce damage to the chip. The static elimination telescopic rod 402 is fixedly connected with a driven ring 40 3. An active ring 406 is fixedly connected to the sub-screening telescopic rod 404, and a linkage ring 407 is connected between the static elimination telescopic rod 402 and the grounding safety platform 401. The static elimination telescopic rod 402 and the sub-screening telescopic rod 404, one end away from the grounding safety platform 401, respectively penetrate the linkage ring 407. The active ring 406 is located at the lower side of the linkage ring 407, and the driven ring 403 is located at the upper side of the linkage ring 407, so that an effective linkage can be formed between the static elimination telescopic rod 402 and the sub-screening telescopic rod 404. After removing the deformation caused by excessive static charge, the length of the corresponding driven ring 403 will also be reduced, and the static charge on the subsequent chip surface will not be discharged, thereby increasing the accuracy of detection. Wear-resistant rings are connected between the linkage ring 407 and the static elimination telescopic rod 402 and the screening telescopic rod 404. A pair of wear-resistant rings are fixedly connected to the linkage ring 407 to reduce the wear between the linkage ring 407 and the static elimination telescopic rod 402 and the screening telescopic rod 404, so that the connection between the active ring 406 and the static elimination telescopic rod 402 and the screening telescopic rod 404 is not prone to shaking.

[0047] See also Fig.10 A method for using a chip detection feeding device with a positioning correction structure mainly includes the following steps:

[0048] The practical method of this embodiment 2 is the same as step S1, electrostatic imparting and step S2, electrostatic imparting in embodiment 1, so it will not be repeated here;

[0049] S3, static electricity elimination. When the static electricity of the deformed plastic shell is eliminated by using the static electricity elimination telescopic rod 402, the amount of static electricity eliminated is detected. When the charge amount does not exceed the standard, the chip is loaded to the detection end. When the charge exceeds the standard, the chip is removed and marked by using the screening telescopic rod 404 and the vacuum suction cup 405. The technicians will conduct a unified inspection later. When multiple chips exceed the standard continuously, the line will be stopped for inspection immediately to reduce the damage to the chip caused by production line defects.

[0050] In the present application, Example 1 and Example 2 are actually aimed at different situations. Due to the characteristics of the chip itself, there are a large number of low-cost types. At this time, for chip detection, only the low-cost static elimination module 4 without the detection and control terminal installed in Example 1 is needed to complete the task. Even if some chips are damaged due to excessive static charge, it is not easy to cause a large amount of economic losses. At the same time, there are also some high-cost chips. At this time, for chip detection, it is necessary to use the high-cost static elimination module 4 with the detection and control terminal installed in Example 2 to promptly detect chips with excessive static charge, and perform detection and screening. When the static charge exceeds the standard continuously, the chip detection system is promptly stopped for inspection to reduce damage to the chip due to production line defects and improve economic benefits.

[0051] The above is only the best implementation method adopted by this application in combination with current actual needs, but the protection scope of this application is not limited to this.

Claims

1. A chip detection loading device with a positioning correction structure, comprising a posture correction module (1) and a power belt (3) whose positions match each other, characterized in that: The posture correction module (1) comprises a traveling platform (101), the upper end of the traveling platform (101) is provided with a smooth surface (102), a chip is placed on the upper end of the smooth surface (102), a plurality of mounting grooves (103) are formed on the side wall of the traveling platform (101), a plurality of bristle brushes (104) are fixedly connected in each of the plurality of mounting grooves (103), the plurality of bristle brushes (104) pass through the openings of the mounting grooves (103) and contact the pins of the chip, a power belt (2) is provided at the upper end of the posture correction module (1), the power belt (2) includes The invention comprises an insulating belt (201), wherein a plurality of electrostatic carriers (202) are inlaid on the outer wall of the insulating belt (201), wherein the plurality of electrostatic carriers (202) are distributed at equal intervals, and an electrostatic elimination module (4) matching its position is provided on the upper side of the power belt 2 (3), wherein the electrostatic elimination module (4) comprises a grounding safety platform (401), wherein the lower end of the grounding safety platform (401) is fixedly connected to a electrostatic elimination telescopic rod (402), and when the chip moves to the lower end of the electrostatic elimination telescopic rod (402), the lower end of the electrostatic elimination telescopic rod (402) contacts the upper end of the chip.

2. The chip testing feeding device with a positioning correction structure according to claim 1, characterized in that: The plurality of electrostatic carriers (202) are all made of flexible insulating material.

3. The chip testing feeding device with a positioning correction structure according to claim 1, characterized in that: When the plurality of electrostatic carriers (202) move to a side of the insulating belt (201) away from the posture correction module (1), electrostatic replenishment is required.

4. The chip testing feeding device with a positioning correction structure according to claim 1, characterized in that: The posture correction module (1), power belt one (2), power belt two (3) and static electricity elimination module (4) are in a dry environment.

5. The chip testing feeding device with a positioning correction structure according to claim 1, characterized in that: The method of use mainly includes the following steps: S1, imparting static electricity, imparting static electricity to the chip plastic package, so that the chip surface carries static electricity, and the static electricity carried by the static electricity carrier (202) is opposite to the static electricity on the chip surface; S2, posture adjustment, the chip will move under the action of the electrostatic carrier (202) with opposite electrical properties, and the posture of the chip will be adjusted under the action of multiple bristle brushes (104) until the resistance generated by the contact between the two ends of the chip close to the installation groove (103) and the installation groove (103) is balanced, completing the work of chip posture correction. At the same time, the electrostatic carrier (202) with equal spacing can control the distance between two adjacent chips, and the speed of chip loading is controlled by controlling the speed of the insulating tape (201); S3, static electricity elimination: the chip moves to the power belt 2 (3) via the posture correction module (1), and moves to the lower end of the static electricity elimination telescopic rod (402) via the power belt 2 (3). The static electricity on the chip plastic package is grounded via the static electricity elimination telescopic rod (402), and the static electricity is transferred to the grounding end via the static electricity elimination telescopic rod (402), thereby eliminating the damage to the chip caused by excessive static electricity accumulation.

6. The chip testing feeding device with a positioning correction structure according to claim 1, characterized in that: The lower end of the grounded safety platform (401) is fixedly connected to a screening telescopic rod (404) that matches the position of the static elimination telescopic rod (402); the static elimination telescopic rod (402) and the screening telescopic rod (404) respectively constitute the main structure of the static elimination structure and the chip screening structure; one end of the screening telescopic rod (404) away from the grounded safety platform (401) is fixedly connected to a vacuum suction cup (405); and a control terminal and a charge detection terminal are mounted inside the grounded safety platform (401).

7. The chip testing feeding device with a positioning correction structure according to claim 6, characterized in that: The lower end of the grounded safety platform (401) is fixedly connected with multiple groups of static elimination structures and chip screening structures.

8. The chip testing feeding device with a positioning correction structure according to claim 6, characterized in that: A driven ring (403) is fixedly connected to the static elimination telescopic rod (402), an active ring (406) is fixedly connected to the sub-screening telescopic rod (404), a linkage ring (407) is connected between the static elimination telescopic rod (402) and the grounding safety platform (401), and the ends of the static elimination telescopic rod (402) and the sub-screening telescopic rod (404) away from the grounding safety platform (401) respectively penetrate the linkage ring (407), the active ring (406) is located at the lower side of the linkage ring (407), and the driven ring (403) is located at the upper side of the linkage ring (407).

9. The chip testing feeding device with a positioning correction structure according to claim 8, characterized in that: Wear-resistant rings are connected between the linkage ring (407) and the static elimination telescopic rod (402) and the screening telescopic rod (404), and a pair of the wear-resistant rings are fixedly connected to the linkage ring (407).

10. The chip testing loading device with a positioning correction structure according to claim 6, characterized in that: The method of use mainly includes the following steps: S1, imparting static electricity, imparting static electricity to the chip plastic package, so that the chip surface carries static electricity, and the static electricity carried by the static electricity carrier (202) is opposite to the static electricity on the chip surface; S2, posture adjustment, the chip will move under the action of the electrostatic carrier (202) with opposite electrical properties, and the posture of the chip will be adjusted under the action of multiple bristle brushes (104) until the resistance generated by the contact between the two ends of the chip close to the installation groove (103) and the installation groove (103) is balanced, completing the work of chip posture correction. At the same time, the electrostatic carrier (202) with equal spacing can control the distance between two adjacent chips, and the speed of chip loading is controlled by controlling the speed of the insulating tape (201); S3, static electricity elimination. When the static electricity of the deformed plastic package shell is eliminated by using the static electricity elimination telescopic rod (402), the amount of static electricity eliminated is detected. When the charge amount does not exceed the standard, the chip is loaded to the detection end. When the charge amount exceeds the standard, the chip is removed and marked by using the screening telescopic rod (404) and the vacuum suction cup (405). The technicians will conduct a unified inspection later. If multiple chips exceed the standard continuously, the line will be stopped immediately for inspection.

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