An alpha particle detector

Abstract

The present application provides an alpha particle detector, belonging to the technical field of detectors, comprising: a shell, with a detection opening, the inner cavity of the shell forming a receiving cavity, the detection opening communicating with the receiving cavity; a detection assembly, arranged in the receiving cavity, the detection assembly comprising a stacked anode layer, a dielectric layer and a cathode layer, the dielectric layer being arranged on a side surface of the anode layer close to the detection opening, and the cathode layer being arranged on a side surface of the dielectric layer close to the detection opening; a connector, connected to the shell, the cathode layer and the anode layer being electrically connected to the connector; wherein the cathode layer is electrically connected to the connector via a cathode lead. The present application provides a structural basis for improving the detection efficiency of the detector.

Description

Technical Field

[0001] The present application relates to the field of detector technology, and in particular to an alpha particle detector. Background Art

[0002] In the field of nuclear energy and in the detection of radioactive materials, alpha particle spectrometers play a vital role. They are widely used to monitor environmental radiation levels and analyze radioactive materials. However, existing alpha particle spectrometer technology has some limitations.

[0003] The alpha particle energy spectrum detectors on the market mainly include PIPS (ion implanted silicon semiconductor) detectors, gold silicon surface barrier detectors and CZT / CdTe (cadmium zinc telluride / cadmium telluride) detectors. These detectors usually need to be electromagnetically shielded to reduce external electromagnetic interference, and metal packaging or metal shell packaging is generally used to achieve this purpose. Figure 1 As shown, in the packaging structure of the common α-particle energy spectrum detector on the market, the cathode surface electrode 01 of the detector component is connected to the shell 02 through a conductive film 03, and the anode signal is connected to the connector 04 through a wire, a spring, a shrapnel, etc.

[0004] In this prior art, a conductive film is used between the detector and the housing to lead out the signal. The thinnest thickness of the conductive film that can be processed into a designed pattern is 0.3mm. The thickness of the metal housing is about 0.5mm, so the minimum distance between the detector surface and the radiation source is 0.8mm. However, alpha particles are severely attenuated in the air. The range of 5MeV alpha particles in the air is only 35mm. Through modeling and Monte Carlo calculation, compared with 241 The emission of the Am radiation source surface is attenuated by 21% when the distance in the air is 1mm. Therefore, the 0.8mm distance in the prior art will lead to serious attenuation, affecting the detection accuracy and detector efficiency. Summary of the invention

[0005] In order to overcome the problems existing in the related art, this specification provides an alpha particle detector, which helps to improve the sealing performance of the detector.

[0006] According to a first aspect of the present application, an alpha particle detector comprises:

[0007] A shell body is provided with a detection opening, the inner cavity of the shell body forms a receiving cavity, and the detection opening is connected to the receiving cavity;

[0008] A detection component is disposed in the accommodating cavity, the detection component comprises an anode layer, a dielectric layer and a cathode layer which are stacked, the dielectric layer is disposed on a side surface of the anode layer close to the detection opening, and the cathode layer is disposed on a side surface of the dielectric layer close to the detection opening;

[0009] A connector connected to the housing, the cathode layer and the anode layer being electrically connected to the connector;

[0010] Wherein, the cathode layer is electrically connected to the connector via a cathode lead.

[0011] In some exemplary embodiments of the present application, the detection component further includes:

[0012] A flexible substrate is provided on a side surface of the cathode layer close to the detection opening, a detection through hole is provided at the center of the flexible substrate, the detection through hole is arranged opposite to the detection opening, and a conductive member is also provided on the flexible substrate, the conductive member connects the cathode layer and the cathode lead to lead the signal of the cathode layer to the connector through the cathode lead;

[0013] The thickness of the flexible substrate is no more than 0.3 mm.

[0014] In some exemplary embodiments of the present application, a conductive through hole is provided on the flexible substrate, the conductive member is located in the conductive through hole, and the conductive member is in contact with the cathode layer; or,

[0015] The conductive element is located on a surface of the flexible substrate that is away from the cathode layer.

[0016] In some exemplary embodiments of the present application, the detection component further includes:

[0017] The soft cushion layer is arranged on a surface of the anode layer which is away from the detection opening.

[0018] In some exemplary embodiments of the present application, the anode layer is electrically connected to the connector via an anode lead;

[0019] A first avoidance cavity is provided in the central area of ​​the cushion layer, and the anode lead passes through the first avoidance cavity to connect the anode layer and the connector.

[0020] In some exemplary embodiments of the present application, the cathode lead includes a first cathode lead and a second cathode lead;

[0021] The detection assembly further comprises a substrate and a cathode pad, wherein the substrate is arranged on a side of the anode layer away from the detection opening;

[0022] When the detection assembly further includes the soft cushion layer, the substrate is arranged on a side of the soft cushion layer away from the detection opening;

[0023] The cathode pad is disposed on the substrate;

[0024] Wherein, the first cathode lead connects the cathode layer and the cathode pad;

[0025] The second cathode lead connects the cathode pad and the housing, or the second cathode lead directly connects the cathode pad and the connector.

[0026] In some exemplary embodiments of the present application, the anode lead includes a first anode lead and a second anode lead;

[0027] The detection assembly further comprises an anode pad, and the anode pad is arranged on the substrate;

[0028] A second avoidance cavity is provided in the central area of ​​the substrate, and at least a part of the second avoidance cavity and the first avoidance cavity are arranged opposite to each other in a direction perpendicular to the substrate; one end of the first anode lead is connected to the anode layer, and the other end passes through the first avoidance cavity and the second avoidance cavity to be connected to the anode pad;

[0029] The second anode lead connects the anode pad and the connector.

[0030] In some exemplary embodiments of the present application, the cathode pad and / or the anode pad is disposed on a surface of the substrate that is away from the detection opening.

[0031] In some exemplary embodiments of the present application, the detection component further includes:

[0032] The protective layer is arranged on the cathode layer or the side of the flexible substrate close to the detection opening, and the protective layer is selected from one or more of a three-proof layer, a light-shielding layer and an anti-wiping layer.

[0033] In some exemplary embodiments of the present application, at least one of the three protective layers, the light shielding layer and the anti-scratch layer includes an organic layer. When the protective layer includes the organic layer, at least one of the organic layers is disposed on a surface of the cathode layer close to the detection opening.

[0034] In some exemplary embodiments of the present application, the material of the triple-proof layer includes an organic material, and the organic material includes polytetrafluoroethylene and / or polyimide;

[0035] The material of the light-shielding layer includes one or more of metal, titanium dioxide, and thermoplastic polymer light-shielding material;

[0036] The material of the wipe-resistant layer includes one or more of silicon carbide, aluminum oxide, hard metal and quartz;

[0037] The material of the flexible substrate includes one or more of polyimide and polyester films.

[0038] In some exemplary embodiments of the present application, the protective layer includes at least one protective unit layer, and each protective unit layer includes one or more of the three protective layers, the light shielding layer, and the anti-wiping layer;

[0039] When the protection unit layer includes the three-proof layer, the light-shielding layer and the anti-wiping layer, the three-proof layer, the light-shielding layer and the anti-wiping layer are stacked in sequence in a direction away from the cathode layer.

[0040] The technical solution provided by this application may have the following beneficial effects:

[0041] The alpha particle detector provided in the present application includes a shell, a detection component and a connector. The detection component is located in the shell, and the connector is connected to the shell. The detection component includes an anode layer, a dielectric layer and a cathode layer arranged in a stacked manner, and the cathode layer is electrically connected to the connector through a cathode lead. In the present application, a stable and direct signal transmission path is provided. This design reduces the loss and interference of the signal during the transmission process, improves the response speed and measurement accuracy of the detector, and ensures the accuracy of the measurement results.

[0042] In addition, using cathode leads to lead out cathode signals instead of conductive films in the prior art can provide a structural basis for reducing the distance between the detector surface and the radiation source, help reduce the attenuation of alpha particles in the air, and improve the sensitivity and accuracy of the detector.

[0043] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0045] Figure 1 It is a schematic diagram of the packaging structure of an alpha particle energy spectrum detector in the prior art;

[0046] Figure 2 is a schematic diagram of a portion of the structure of a detection component in an exemplary embodiment of the present application;

[0047] Figure 3 is a schematic diagram of the protective layer structure in the detection component in the exemplary embodiment of the present application;

[0048] Figure 4 is a schematic diagram of the structure of an alpha particle detector in an exemplary embodiment of the present application;

[0049] Figure 5 is a partial structural schematic diagram of a detection component in another exemplary embodiment of the present application;

[0050] Figure 6 is a partial structural schematic diagram of a detection component in another exemplary embodiment of the present application;

[0051] Figure 7 is a partial structural schematic diagram of a detection component in another exemplary embodiment of the present application;

[0052] Figure 8 is a schematic diagram of a connection structure between a flexible substrate and a cathode layer in an exemplary embodiment of the present application;

[0053] Fig. 9 It is a schematic diagram of the cathode signal lead-out structure of the detection component in another exemplary embodiment of the present application.

[0054] Description of Reference Numerals

[0055] 100-shell; 110-first shell; 120-second shell; 200-detection component; 210-substrate; 211-cathode pad; 212-anode pad; 213-second avoidance cavity; 220-anode layer; 221-anode solder joint; 230-dielectric layer; 240-cathode layer; 241-cathode solder joint; 250-cushion layer; 251-first avoidance cavity; 260-protective layer; 261-three-proof layer; 262-light shielding layer; 263-wipe-resistant layer; 270-cathode lead; 271-first cathode lead; 272-second cathode lead; 280-anode lead; 281-first anode lead; 282-second anode lead; 290-flexible substrate; 291-conductive member; 300-sealing layer; 400-connector. DETAILED DESCRIPTION

[0056] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present application will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present application and are not necessarily drawn to scale.

[0057] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the illustration to another component, these terms are used in this specification only for convenience, such as according to the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0058] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used merely as labels and are not intended to limit the quantity of their objects.

[0059] In this application, the words "perpendicular" and "equal" refer to perpendicularity and equality within the process error range, not perpendicularity and equality in an absolute sense. The process error can be within ±10% or ±5%. For example, if the first direction is perpendicular to the second direction, it can be understood that the angle between the first direction and the second direction can be 90°±5°.

[0060] like Figures 2 to 5 As shown, an embodiment of the present application provides an alpha particle detector, including a shell 100, a detection assembly 200 and a connector 400. The shell 100 is provided with a detection opening, and the internal cavity of the shell 100 forms a receiving cavity, and the detection opening is connected to the receiving cavity. The detection assembly 200 is arranged in the receiving cavity, and the detection assembly 200 includes a stacked anode layer 220, a dielectric layer 230 and a cathode layer 240, the dielectric layer 230 is arranged on a side surface of the anode layer 220 close to the detection opening, and the cathode layer 240 is arranged on a side surface of the dielectric layer 230 close to the detection opening. The connector 400 is connected to the shell 100, and the cathode layer 240 and the anode layer 220 are both electrically connected to the connector 400. The cathode layer 240 is electrically connected to the connector 400 through the cathode lead 270.

[0061] The alpha particle detector provided in the present application includes a housing 100, a detection assembly 200 and a connector 400. The detection assembly 200 is located in the housing 100, and the connector 400 is connected to the housing 100. The detection assembly 200 includes a stacked anode layer 220, a dielectric layer 230 and a cathode layer 240, and the cathode layer 240 is electrically connected to the connector 400 through a cathode lead 270. In the present application, a stable and direct signal transmission path is provided. This design reduces the loss and interference of the signal during the transmission process, improves the response speed and measurement accuracy of the detector, and ensures the accuracy of the measurement results.

[0062] In addition, the cathode signal is led out by cathode lead 270 instead of conductive film in the prior art, which can provide a structural basis for reducing the distance between the detector surface and the radiation source, help reduce the attenuation of alpha particles in the air, and improve the sensitivity and accuracy of the detector.

[0063] The following will describe in detail the various parts of the alpha particle detector provided in the embodiment of the present application in conjunction with the accompanying drawings:

[0064] like Figures 2 to 5 As shown, the alpha particle detector provided by the present application includes a housing 100 , a detection assembly 200 and a connector 400 . The detection assembly 200 is disposed in the housing 100 , and the connector 400 is connected to the housing 100 .

[0065] The housing 100 is an internal hollow structure, and a detection opening is provided in the housing 100. The internal cavity forms a receiving cavity, and the detection opening is connected to the receiving cavity. The detection opening can be provided on one wall of the housing 100. The detection opening is a channel for the detector to interact with the external environment, allowing alpha particles to enter and be detected by the detection assembly 200. The size and shape of the detection opening are optimized according to the application requirements and detection efficiency of the detector to ensure the maximum reception of alpha particles while reducing unnecessary interference to the inside of the detector.

[0066] like Figure 4 As shown, in some embodiments of the present application, the housing 100 includes a first housing 110 and a second housing 120 connected to each other, wherein the first housing 110 and the second housing 120 are buckled to form a receiving cavity inside. Optionally, the detection opening is provided on a side wall of the first housing 110, and the end of the first housing 110 opposite to the detection opening is an open end, and the second housing 120 can be connected to the open end to be arranged opposite to the detection opening. It should be noted that the above description of the structure of the housing 100 is only an exemplary description, and the structure of the housing 100 can be various, and the present application does not make any special limitation on this.

[0067] The housing 100 is the outer protective structure of the alpha particle detector and is made of durable materials to provide solid protection for the sensitive detection components 200 inside. The housing 100 can be made of metal materials, which not only plays a protective role but also has an electromagnetic shielding effect. Optionally, the material of the housing 100 may include 304 stainless steel, 316 stainless steel, etc., but is not limited thereto.

[0068] like Figure 2 and Figure 4 As shown, the detection assembly 200 is arranged in the housing 100, and includes an anode layer 220, a dielectric layer 230 and a cathode layer 240 that are stacked. The dielectric layer 230 is arranged on the side surface of the anode layer 220 close to the detection opening, and the cathode layer 240 is arranged on the side surface of the dielectric layer 230 close to the detection opening. Optionally, the materials of the anode layer 220 and the cathode layer 240 include but are not limited to at least one of In / Au / Pt / Cu / Ti / Al or a composite electrode material composed of other metals. The anode layer 220 and the cathode layer 240 can be an electrode layer composed of a single metal or a composite electrode layer composed of multiple metals. Preferably, the materials of the anode layer 220 and the cathode layer 240 are different. The dielectric layer 230 is located between the anode layer 220 and the cathode layer 240. The dielectric layer 230 can effectively stop alpha particles and make them lose energy. This interaction generates a large number of electron-hole pairs. The material of the dielectric layer 230 may include semiconductor materials such as cadmium zinc telluride, cadmium telluride, and ion-implanted silicon, but is not limited thereto.

[0069] In some embodiments of the present application, the alpha particle detector further includes a sealing layer 300, which is sealed and connected between the detection assembly 200 and the housing 100. The sealing layer 300 can be arranged at the detection opening of the housing 100. Specifically, the sealing layer 300 can be connected between the side surface of the detection assembly 200 close to the detection opening and the shell wall of the housing 100 provided with the detection opening, and can also be connected between the side of the detection assembly 200 and the side wall of the housing 100. Preferably, except for the side surface of the detection assembly 200 away from the detection opening, the other surfaces are connected with the shell wall of the housing 100 by the sealing layer 300 to ensure the sealing effect and the three-proof (moisture-proof, dust-proof, and salt-fog-proof) effect. The material of the sealing layer 300 may include one or more of silicone, rubber, fluororubber, silicone rubber, etc., but is not limited thereto. The sealing layer 300 can be directly embedded in the corresponding position of the housing 100, or can be formed by coating glue at the corresponding position of the housing 100 by a coating process.

[0070] In the prior art, since the cathode surface signal must be connected to the shell 02 through the conductive film 03, the cathode electrode must be a conductive material throughout. The conductive film is formed by dispersing conductive particles (such as copper, graphite, etc.) in glue (such as silicone) and curing them. The sealing effect of the conductive film is general, and it is impossible to achieve a seal between the cathode surface and the shell. In the present application, the use of the sealing layer 300 significantly improves the sealing performance of the detector, ensures a close connection between the detection component 200 and the shell 100, and effectively prevents the adverse effects of external environmental factors on the performance of the detector. This not only enhances the three-proof (moisture-proof, dust-proof, and salt spray-proof) performance of the detector, but also simplifies the maintenance and cleaning process, which helps to maintain the long-term stability and reliability of the detector.

[0071] The connector 400 is connected to the housing 100, and the cathode layer 240 and the anode layer 220 are both electrically connected to the connector 400 to achieve signal transmission. The connector 400 can be connected to the outside of the housing 100, and the cathode layer 240 and the anode layer 220 can be connected to the connector 400 through some conductive structures. The connector 400 may include a wire, SMA (Subminiature version A), BNC (Bayonet Neill-Concelman, bayonet connector), etc., but is not limited thereto.

[0072] like Figure 2 , Figure 4 and Figure 5 As shown, in some embodiments of the present application, the cathode layer 240 is electrically connected to the connector 400 through the cathode lead 270. The material of the cathode lead 270 may include metal or composite metal, which may be a metal wire composed of a single metal, or a metal wire composed of a plurality of metals. For example, it may be a copper wire, an aluminum wire, a gold wire, or a metal wire with other material layers plated thereon. The cathode layer 240 may be provided with a cathode welding point 241, and one end of the cathode lead 270 may be connected to the cathode layer 240 through the cathode welding point 241. The other end of the cathode lead 270 may be connected to the connector 400 indirectly or directly.

[0073] In some embodiments of the present application, Figure 6 and Figure 7As shown, the detection assembly 200 also includes a flexible substrate 290, which is arranged on a side surface of the cathode layer 240 close to the detection opening. A detection through hole is arranged in the center of the flexible substrate 290, and the detection through hole is arranged opposite to the detection opening. A conductive member 291 is also arranged on the flexible substrate 290, and the conductive member 291 connects the cathode layer 240 and the cathode lead 270 to lead the signal of the cathode layer 240 to the connector 400 through the cathode lead 270. The thickness of the flexible substrate 290 is not greater than 0.3 mm. Further, the thickness of the flexible substrate 290 is not greater than 0.1 mm. The flexible substrate 290 can be connected to the cathode layer 240 by a bonding process, such as connecting to the cathode layer 240 by epoxy glue or silicone glue.

[0074] In this embodiment, the thickness of the flexible substrate 290 can be less than 0.1 mm, so that the minimum distance between the detector surface and the radiation source is 0.6 mm, which is 0.2 mm lower than the prior art. This design can greatly reduce the attenuation of α particles in the air and improve the detection sensitivity and accuracy of the detector. In addition, the flexible substrate 290 also has a certain buffering performance, which can play a certain protective role for the α particle detector.

[0075] When the detection assembly 200 further includes a flexible substrate 290 , the sealing layer 300 may be disposed between the flexible substrate 290 and the housing 100 .

[0076] In some embodiments, the material of the conductive member 291 may include solder, conductive glue, etc. The conductive glue may include conductive silver glue, conductive carbon glue, etc., and the solder may include tin-containing solder, indium-containing solder, bismuth-containing solder, etc. The conductive member 291 may structurally include one or more of a through-hole pad provided on the flexible substrate 290, a conductive circuit, and a lead pad provided on the back side of the flexible substrate 290 (a side surface close to the cathode layer 240). The conductive circuit connects the through-hole pad and the lead pad. When the cathode layer 240 is led out, the cathode layer 240 and the through-hole pad may be interconnected using a conductive lead, and the lead pad may be connected to the connector through the cathode lead.

[0077] like Figure 6 As shown, in a specific embodiment, a conductive through hole is provided on the flexible substrate 290, and a conductive member 291 is located in the conductive through hole, and the conductive member 291 is in contact with the cathode layer 240. Furthermore, a conductive lead may be provided on the flexible substrate 290, and the conductive lead may be connected to the conductive member 291 to lead the cathode signal to the back side of the flexible substrate 290 (the side surface connected to the cathode layer 240).

[0078] In another specific embodiment, Figure 7 and Figure 8As shown, the conductive member 291 is located on a side surface of the flexible substrate 290 away from the cathode layer 240, and the conductive member 291 is connected to the cathode layer 240 through a conductive line. In this embodiment, the cathode signal can also be led to the back of the flexible substrate 290 through some conductive structures, and the specific lead-out method is not limited in this application. The material of the conductive member 291 can be conductive glue.

[0079] Optionally, the material of the flexible substrate 290 may include polyimide or polyester film. For example, the material of the flexible substrate 290 includes polyimide, and may specifically be a FPC (Flexible Printed Circuit) board.

[0080] Optionally, the detection assembly 200 provided in the present application further includes a substrate 210, which is disposed on a side of the anode layer 220 away from the detection opening. The material of the substrate 210 may include one or more of ceramics, copper frame, etc., but is not limited thereto.

[0081] like Figure 2 As shown, the cathode lead 270 can be connected to a side of the substrate 210 away from the cathode layer 240 (hereinafter collectively referred to as the back side of the substrate 210), and then connected to the connector 400. Further, the detection component 200 also includes a cathode pad 211, which is provided on the substrate 210, and the cathode lead 270 is connected to the substrate 210 through the cathode pad 211.

[0082] In this embodiment, by connecting the cathode lead 270 to the back of the substrate 210, the packaging effect of the alpha particle detector can be significantly improved. This connection method effectively increases the proportion of the effective detection area of ​​the alpha particle detector in the total area, thereby improving the packaging efficiency. Higher packaging efficiency means that a larger detection area can be achieved without increasing the overall size of the detector, thereby enhancing the detection capability. Moreover, this back connection design helps to reduce the size of the alpha particle detector, because the cathode lead 270 occupies the back space of the substrate 210, reducing the demand for side space. The more compact alpha particle detector design is easy to integrate into small devices and also helps to reduce production costs. Furthermore, smaller-sized detectors have a wider range of adaptability and can be used in portable devices, space-constrained industrial detection equipment, and scientific research instruments with special requirements for size. Without sacrificing performance, by improving packaging efficiency and reducing size, material and production costs are also reduced, making the detector more economical and practical.

[0083] In addition, the optimized packaging design also enhances the structural stability of the alpha particle detector and reduces the impact of external shock or vibration on its performance. This not only simplifies the assembly and maintenance process of the alpha particle detector, but also improves its reliability and durability.

[0084] Specifically in one embodiment, the cathode lead 270 includes a first cathode lead 271 and a second cathode lead 272; the first cathode lead 271 connects the cathode layer 240 and the cathode pad 211. The second cathode lead 272 connects the cathode pad 211 and the housing 100, or the second cathode lead 272 directly connects the cathode pad 211 and the connector 400. Figure 2 As shown, optionally, the cathode pad 211 is disposed on a side surface of the substrate 210 away from the detection opening (the back side of the substrate 210). The first cathode lead 271 can be routed from the side of the detection component 200 and then connected to the cathode pad 211. It should be noted that when the detection component 200 includes a flexible substrate 290, one end of the first cathode lead 271 can be electrically connected to the back side of the flexible substrate 290, and the cathode signal led to the back side of the flexible substrate 290 can be further led out.

[0085] In some embodiments of the present application, the detection assembly 200 further includes a cushion layer 250, which is disposed on a surface of the anode layer 220 on a side away from the detection opening. In this embodiment, the substrate 210 is disposed on a side of the cushion layer 250 away from the detection opening. The cushion layer 250 can reduce the impact of external vibration on the detector signal. The material of the cushion layer 250 includes one or more soft vibration-damping materials such as silicone, rubber, silicone gel, silicone rubber, etc., but is not limited thereto.

[0086] The anode layer 220 is electrically connected to the connector 400 through the anode lead 280. A first avoidance cavity 251 is provided in the central area of ​​the cushion layer 250, and the anode lead 280 passes through the first avoidance cavity 251 to connect the anode layer 220 and the connector 400. The anode lead 280 can be connected to the back of the substrate 210 and then connected to the connector 400. Further, the detection component 200 also includes an anode pad 212, which is provided on the substrate 210, and the anode lead 280 is connected to the substrate 210 through the anode pad 212. The material of the anode lead 280 may include metal or composite metal, which may be a metal wire composed of a single metal, or a metal wire composed of a plurality of metals. For example, it may be a copper wire, an aluminum wire, a gold wire, or a metal wire with a layer of other materials plated thereon.

[0087] The anode lead 280 includes a first anode lead 281 and a second anode lead 282. A second avoidance cavity 213 is provided in the central area of ​​the substrate 210, and at least a part of the second avoidance cavity 213 and the first avoidance cavity 251 are arranged opposite to each other in a direction perpendicular to the substrate 210; one end of the first anode lead 281 is connected to the anode layer 220, and the other end passes through the first avoidance cavity 251 and the second avoidance cavity 213 to be connected to the anode pad 212. The second anode lead 282 connects the anode pad 212 and the connector 400. The anode pad 212 is provided on a side surface of the substrate 210 away from the detection opening (the back side of the substrate 210).

[0088] like Figure 3 As shown, in some embodiments of the present application, the detection component 200 further includes a protective layer 260, which is disposed on the cathode layer 240 or the side of the flexible substrate 290 close to the detection opening, and the protective layer 260 is selected from one or more of the three-proof layer 261, the light-shielding layer 262, and the wipe-resistant layer 263. It should be noted here that the number of layers of the three-proof layer 261, the light-shielding layer 262, and the wipe-resistant layer 263 included in the protective layer 260 is not limited, and the number of layers of the three-proof layer 261, the light-shielding layer 262, and the wipe-resistant layer 263 included therein can be one layer, two layers, three layers or more layers, and the number of layers of each layer can be the same or different.

[0089] It should be noted that the protection layer 260 may also be disposed on the side of the detection component 200 , that is, all around, to protect the detection component 200 as a whole.

[0090] The main function of the three-proof layer 261 is to provide protection against moisture, dust and salt spray, ensuring the performance and reliability of the detector under harsh environmental conditions. The material of the three-proof layer 261 includes organic materials, and the organic materials include polytetrafluoroethylene and / or polyimide, but are not limited thereto.

[0091] The main purpose of the light shielding layer 262 is to block external light sources, reduce the interference of stray light on the performance of the detector, and ensure the stability and accuracy of the detector under lighting conditions. The material of the light shielding layer 262 includes one or more of metal, titanium dioxide, and thermoplastic polymer light shielding materials, but is not limited thereto. Specifically, the material of the light shielding layer 262 may include metals such as nickel (Ni), chromium (Cr), platinum (Pt), gold (Au), silver (Ag), zinc (Zn), etc., or light shielding materials such as titanium dioxide, ABS (Acrylonitrile Butadiene Styrene).

[0092] The function of the wipe-resistant layer 263 is to provide a hard protection so that the detector surface can withstand routine cleaning and maintenance operations without damaging the performance of the detector. The material of the wipe-resistant layer 263 includes one or more of silicon carbide, aluminum oxide, hard metal and quartz, but is not limited thereto. It should be noted that when the wipe-resistant layer 263 itself has a light-shielding effect, the light-shielding layer 262 may not be provided. For example, when the wipe-resistant layer 263 is made of silicon carbide, it itself has a light-shielding effect, and the light-shielding layer 262 may not be provided.

[0093] Preferably, the three-proof layer 261, the light shielding layer 262 and the anti-wiping layer 263 can be made of low-density organic or inorganic materials, which helps to reduce the absorption of α particles, so that more α particles can reach the dielectric layer 230 of the detector, thereby improving the detection efficiency. The anti-wiping layer 263 is made of ceramics such as silicon carbide or corundum with a high Mohs hardness, which can withstand multiple cleaning and wiping, and the surface is wiped with acetone for 1,000 times without scratches.

[0094] The thickness of each layer of the three-proof layer 261, the light-shielding layer 262 and the anti-wiping layer 263 can be set according to actual needs. When the number of layers of the three-proof layer 261, the light-shielding layer 262 and the anti-wiping layer 263 included in the protective layer 260 is multiple, the total thickness of the three-proof layer 261 is 0.05-5μm, such as 0.1μm, 0.5μm, 1μm, 1.5μm, 2μm, 2.5μm, 3μm, 3.5μm, 4μm, 4.5μm, 5μm, but not limited to this; the total thickness of the light-shielding layer 262 is 0.04-2μm, such as 0.1μm, 0.5μm, 0.6μm, 0.7μm, 1μm, 1.1μm, 1.2μm, 1.3μm, 1.5μm, 1.8μm, 2μm, but not limited to; the total thickness of the wipe-resistant layer 263 is 0.02-2μm, such as 0.1μm, 0.5μm, 0.6μm, 0.7μm, 1μm, 1.1μm, 1.2μm, 1.3μm, 1.5μm, 1.8μm, 2μm, but not limited to.

[0095] Preferably, at least one of the three protective layers 261, the light shielding layer 262 and the anti-wiping layer 263 includes an organic layer. When the protective layer 260 includes an organic layer, at least one organic layer is disposed on the surface of the cathode layer 240 near the detection opening. In this embodiment, a soft organic layer is selected on the surface of the cathode layer 240 as a buffer layer, and other layers are formed on the organic layer, which can completely prevent cracking, film peeling and other problems caused by stress.

[0096] In a specific embodiment, the protective layer 260 includes a three-proof layer 261, a light shielding layer 262, and an anti-wiping layer 263 stacked in a direction away from the cathode layer 240. The thickness of the three-proof layer 261 is 0.05-5 μm; the thickness of the light shielding layer 262 is 0.04-2 μm; and the thickness of the anti-wiping layer 263 is 0.02-2 μm.

[0097] In another specific embodiment, the protective layer 260 includes a plurality of protective unit layers stacked together, and a single protective unit layer may include one or more of the three-proof layer 261, the light shielding layer 262, and the anti-wiping layer 263. The number of layers included in a single protective unit layer may be zero or one. When a single protective unit layer includes the three-proof layer 261, the distance between the three-proof layer 261 and the cathode layer 240 is the shortest. When the protective unit layer includes the three-proof layer 261, the light shielding layer 262, and the anti-wiping layer 263, the three-proof layer 261, the light shielding layer 262, and the anti-wiping layer 263 are stacked in sequence in a direction away from the cathode layer 240. In a single protective unit layer, the thickness of the three-proof layer 261 is 0.01-0.5 μm; the thickness of the light shielding layer 262 is 0.01-0.2 μm; and the thickness of the anti-wiping layer 263 is 0.005-0.1 μm.

[0098] For example, the protective layer 260 includes a plurality of protective unit layers, each of which includes a three-proof layer 261, a light shielding layer 262, and a wipe-resistant layer 263, wherein the three-proof layer 261, the light shielding layer 262, and the wipe-resistant layer 263 are sequentially stacked in a direction away from the cathode layer 240. For another example, the protective layer 260 includes a plurality of protective unit layers, wherein some of the protective unit layers include a three-proof layer 261, a light shielding layer 262, and a wipe-resistant layer 263, wherein the three-proof layer 261, the light shielding layer 262, and the wipe-resistant layer 263 are sequentially stacked in a direction away from the cathode layer 240. Some of the protective unit layers include only one or two of the three-proof layer 261, the light shielding layer 262, and the wipe-resistant layer 263, such as only the light shielding layer 262 and the wipe-resistant layer 263. Optionally, the protection unit layer including only the light shielding layer 262 and the wipe-resistant layer 263 may be the protection unit layer farthest from the cathode layer 240 in the protection layer 260 , which can reduce costs and improve economic benefits while enhancing the wipe-resistant performance of the detection component 200 .

[0099] Furthermore, the α particle detector further includes an elastic support member, which is disposed between the detection assembly 200 and the housing 100, specifically between the detection assembly 200 and the second housing 120, to support the detection assembly 200. The elastic support member can be made of elastic materials such as springs and silicone pads.

[0100] like Fig. 9As shown, the present application also provides an alpha particle detector, including a shell 100, a detection assembly 200 and a connector 400. The shell 100 is provided with a detection opening, the internal cavity of the shell 100 forms a receiving cavity, and the detection opening is connected to the receiving cavity. The detection assembly 200 is arranged in the receiving cavity, and the detection assembly 200 includes a stacked anode layer 220, a dielectric layer 230 and a cathode layer 240, the dielectric layer 230 is arranged on a side surface of the anode layer 220 close to the detection opening, and the cathode layer 240 is arranged on a side surface of the dielectric layer 230 close to the detection opening. The connector 400 is connected to the shell 100, and the cathode layer 240 and the anode layer 220 are both electrically connected to the connector 400. The detection assembly 200 further includes a flexible substrate 290, which is disposed on a side surface of the cathode layer 240 close to the detection opening, a detection through hole is disposed at the center of the flexible substrate 290, and the detection through hole is disposed opposite to the detection opening, and a conductive member 291 is also disposed on the flexible substrate 290, which connects the cathode layer 240 and the housing 100 to lead the signal of the cathode layer 240 to the connector 400 through the housing 100. The thickness of the flexible substrate 290 is not greater than 0.3 mm. Further, the thickness of the flexible substrate 290 is not greater than 0.1 mm.

[0101] In this embodiment, the thickness of the flexible substrate 290 can be less than 0.1 mm, so that the minimum distance between the detector surface and the radiation source is 0.6 mm, which is 0.2 mm lower than the prior art. This design can greatly reduce the attenuation of α particles in the air and improve the detection sensitivity and accuracy of the detector. In addition, the cathode signal is directly led out through the housing 100, which is simple in process and convenient in manufacturing, and helps to improve production efficiency.

[0102] The specific structure of the detection component 200 may refer to the α-particle detector in any of the above embodiments, such as further including a cushion layer 250 , a substrate 210 and other structures, which will not be described in detail here.

[0103] The present application also provides a method for preparing an alpha particle detector, comprising:

[0104] like Figure 2 and Figure 3 As shown, S1, preparing and forming a detection component 200.

[0105] (1) A cathode layer 240 and an anode layer 220 are formed on two opposite surfaces of the dielectric layer 230, respectively. The cathode layer 240 and the anode layer 220 may cover the entire dielectric layer 230 or only cover a portion of the dielectric layer 230. When the detection assembly 200 further includes a flexible substrate 290, the flexible substrate 290 is bonded to the surface of the cathode layer 240, and the cathode signal is led to the flexible substrate 290.

[0106] (2) The soft cushion layer 250 having the first avoidance cavity 251 is attached to the anode layer 220. It should be noted that when the detection assembly 200 does not include the soft cushion layer 250, the preparation method may not include this step.

[0107] (3) Connect the components formed in steps (1) and (2) to the substrate 210. Glue may be used for bonding. The glue includes but is not limited to commonly used packaging glues such as silicone, epoxy resin, silicone rubber, and red glue. An anode pad 212 and a cathode pad 211 may be provided on the substrate 210. It should be noted that when the detection component 200 does not include the substrate 210, the preparation method may not include this step.

[0108] (4) The signal of the cathode layer 240 is led out through the cathode lead 270, and the signal of the anode layer 220 is led out through the anode lead 280. Specifically, the signals of the cathode layer 240 and the anode layer 220 can be led out through a wire bonding process or a conductive adhesive bonding process. For example, the signals of the cathode layer 240 and the anode layer 220 can be connected to the corresponding cathode pad 211 and anode pad 212 on the substrate 210 through the cathode lead 270 and the anode lead 280, respectively.

[0109] (5) A protective layer 260 is formed on the surface of the cathode layer 240 or the surface of the flexible substrate 290. The specific structure of the protective layer 260 can refer to the above content and will not be described in detail here. It should be noted that when the detection component 200 does not include the protective layer 260, the preparation method may not include this step.

[0110] like Figure 4 As shown, S2, the detection assembly 200 and the shell 100 are assembled to form a complete α particle detector.

[0111] (1) Provide a housing 100, which is provided with a detection opening and connected with a connector 400. The housing 100 includes a first housing 110 and a second housing 120 that can be engaged with each other, and the detection opening is provided in the first housing 110. Embed a sealing layer 300 near the detection opening of the housing 100, and install the prepared detection assembly 200 into the housing 100.

[0112] (2) The cathode layer 240 signal and the anode layer 220 signal are further led out to the connector 400. For example, the anode pad 212 and the cathode pad 211 on the substrate 210 are connected to the connector 400 through corresponding leads.

[0113] (3) An elastic support member is placed between the detection assembly 200 and the housing 100. The structure and placement of the elastic support member can refer to the above content and will not be described in detail here.

[0114] (4) A through hole is opened on the second shell 120, and glue is filled into the inner cavity of the shell 100 through the through hole to improve the reliability of the α-particle detector.

[0115] Example 1

[0116] like Figures 2 to 4 As shown, in this embodiment, the alpha particle detector includes a housing 100, a detection assembly 200, a sealing layer 300 and a connector 400. An elastic support is also provided between the housing 100 and the detection assembly 200. The preparation method of the alpha particle detector can refer to the above-mentioned steps S1 and S2. Among them, the detection assembly 200 includes an anode layer 220, a dielectric layer 230, a cathode layer 240, a cushion layer 250, a protective layer 260 and a substrate 210. The cathode pad 211 and the anode pad 212 are arranged on the back of the substrate 210, and the signals of the cathode layer 240 and the anode layer 220 are respectively led to the back of the substrate 210 through the cathode lead 270 and the anode lead 280, and further led out to the connector 400. The protective layer 260 includes three anti-layers 261, a light shielding layer 262 and a scratch-resistant layer 263 which are stacked in sequence in a direction away from the cathode layer 240. Among them, the material of the three-proof layer 261 is polytetrafluoroethylene, the light-shielding layer 262 is Ni, and the wipe-resistant layer 263 is aluminum oxide. The thickness of the three-proof layer 261, the light-shielding layer 262 and the wipe-resistant layer 263 are shown in Table 1. The thickness of the sealing layer 300 is 0.5 mm, and the thickness of the shell 100 is 0.5 mm. The manufactured α particle detector was tested, and the test results are shown in Table 2. The test contents include α resolution and efficiency test, β source efficiency test, packaging efficiency, light-shielding effect, wipe-resistant effect, and salt spray test. The test methods for each test content are as follows:

[0117] (1) Alpha resolution and efficiency test: Using the ORTEC energy spectrum test system, the alpha particle detector was vacuum tested (the pressure in the chamber was <10Pa), and the radiation source was 241 Am.

[0118] Qualification criteria: efficiency>30%, resolution<3.5%.

[0119] (2) β source efficiency test, use 90 Sr / 90 Gamma radiation source, tested in air, source distance 5mm. Qualification standard: efficiency >30%.

[0120] (3) Packaging efficiency, detector effective area / detector total area (projected area)

[0121] Qualification standard: The greater the packaging efficiency, the better.

[0122] (4) Light-shielding effect: A light source with adjustable light intensity is placed 5 cm away from the detection surface. The α-particle detector model is output to the oscilloscope, and the oscilloscope trigger threshold is set to an equivalent of 100 kV. Adjust the light intensity and observe whether the oscilloscope is triggered by a visible light signal.

[0123] Eligibility criteria: The greater the light shielding effect, the better. The greater the light shielding effect, the wider the environment in which the detector can be used.

[0124] (5) Wipe resistance: Use an absorbent cotton ball dipped in acetone to wipe the α particle detector test surface, and test it three times each time, front and back, left and right, and in a circle. After wiping, visually observe whether there are scratches on the surface. If there are visible scratches, it means that it is not resistant to wipe.

[0125] Qualification standard: Generally, it needs to be wiped once a week. If the design life is 5 years, it must withstand at least 260 wipes.

[0126] (6) Salt spray test: in accordance with GJB360 Method 101 Salt spray test.

[0127] Test conditions: 35℃±2℃, PH value 6.5-7.2, salt spray deposition rate 80cm 2 1ml-2ml, measure the salt spray deposition rate and pH value at least every 24 hours. Place the sample at an angle of 15-30°, test time: 4h, 12h, 24h, 48h, 72h, 96h, 120h, 144h, 240h.

[0128] Judgment: Gently wash the salt deposited on the sample surface with clean water, leave it for 1-2 hours, and use 10-20X visual inspection.

[0129] Generally, it is required to endure for more than 48 hours.

[0130] Example 2

[0131] In this embodiment, except for the thickness of the three-proof layer, everything else is the same as that of Embodiment 1.

[0132] Example 3

[0133] In this embodiment, except for the thickness of the three-proof layer, everything else is the same as that of Embodiment 1.

[0134] Example 4

[0135] In this embodiment, except for the thickness of the light shielding layer, other aspects are the same as those of the first embodiment.

[0136] Example 5

[0137] In this embodiment, except for the thickness of the light shielding layer, other aspects are the same as those of the first embodiment.

[0138] Example 6

[0139] In this embodiment, except for the thickness of the scratch-resistant layer, other aspects are the same as those of the embodiment 1.

[0140] Example 7

[0141] In this embodiment, except for the thickness of the scratch-resistant layer, other aspects are the same as those of the embodiment 1.

[0142] Example 8

[0143] In this embodiment, the protective layer includes 5 protective unit layers, each of which includes a three-protective layer with a thickness of 0.1 μm, a light shielding layer with a thickness of 0.02 μm, and an anti-wiping layer with a thickness of 0.01 μm stacked in a direction away from the cathode layer. In Table 1, the thickness of the three-protective layer, the light shielding layer, and the anti-wiping layer is the total thickness of each layer in the detection component. The rest is the same as in Example 1.

[0144] Example 9

[0145] In this embodiment, the protective layer includes 5 protective unit layers, wherein the protective unit layer includes a three-proof layer with a thickness of 0.01 μm, a light-shielding layer with a thickness of 0.01 μm and a scratch-resistant layer with a thickness of 0.005 μm stacked in a direction away from the cathode layer, and the rest is the same as Example 8.

[0146] Example 10

[0147] In this embodiment, the protective layer includes 5 protective unit layers, wherein the protective unit layer includes a three-protective layer with a thickness of 0.5 μm, a light-shielding layer with a thickness of 0.2 μm and a scratch-resistant layer with a thickness of 0.1 μm stacked in a direction away from the cathode layer, and the rest is the same as Example 8.

[0148] Embodiment 11

[0149] like Figure 5 As shown, the cathode pad is arranged on the front side of the substrate, and the rest is the same as in Example 1.

[0150] Example 12

[0151] like Figure 6 As shown, in this embodiment, the α particle detector does not include a sealing layer 300, and the detection component 200 includes a flexible substrate 290 made of rubber material with a thickness of 0.1 mm. The detection component 200 and the housing 100 are bonded with silicone, and the rest is the same as in the eighth embodiment.

[0152] Example 13

[0153] like Figure 6 As shown, in this embodiment, the detection component 200 includes a flexible substrate 290 with a thickness of 0.1 mm, and the flexible substrate 290 is an FPC board. The rest is the same as that of the twelfth embodiment.

[0154] Embodiment 14

[0155] In this embodiment, the α particle detector structure is as follows Figure 7 As shown, the detection component 200 includes a flexible substrate 290 with a thickness of 0.1 mm, and the flexible substrate 290 is an FPC board. The rest is the same as that of the twelfth embodiment.

[0156] Comparative Example 1

[0157] like Figure 1 As shown, the cathode layer is connected to the housing 02 via a conductive film 03. The surface of the cathode layer is plated with 200nm Al as a light shielding layer.

[0158] Table 1

[0159]

[0160] Table 2

[0161]

[0162] It can be seen from the data in Table 2 that the resolution, α efficiency, and β efficiency of Examples 12 to 14 are all improved, indicating that the α particle detector provided in the present application helps to improve the detection efficiency when it includes a flexible substrate with a relatively thin thickness.

[0163] Compared with Comparative Example 1, all Examples 1-11 have significantly improved light-shielding effect, wipe-resistance effect and salt spray effect, indicating that the α particle detector provided in the present application, when provided with a protective layer, can effectively improve the device quality and enhance the reliability of the device compared with Comparative Example 1.

[0164] Compared with Example 1, Example 2 has lower wipe resistance and salt spray effect than Example 1, while Example 3 has higher wipe resistance and salt spray effect than Example 1, which indicates that increasing the thickness of the wipe-resistant layer to a certain extent helps to improve the wipe resistance and salt spray effect of the device.

[0165] Compared with Example 11, the packaging efficiency of Examples 1 to 10 is significantly improved, which means that the packaging duty cycle can be effectively improved by leading the signal of the cathode layer to the back side of the substrate through the cathode lead compared to leading it to the front side of the substrate.

[0166] It should be noted that, although the steps of the method for forming the structure in the present application are described in a specific order in the drawings, this does not require or imply that the steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps, etc.

[0167] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the appended claims.

Claims

1. An alpha particle detector, characterized in that: include: A shell body is provided with a detection opening, the inner cavity of the shell body forms a receiving cavity, and the detection opening is connected to the receiving cavity; A detection component is disposed in the accommodating cavity, the detection component comprises an anode layer, a dielectric layer and a cathode layer which are stacked, the dielectric layer is disposed on a side surface of the anode layer close to the detection opening, and the cathode layer is disposed on a side surface of the dielectric layer close to the detection opening; A connector connected to the housing, the cathode layer and the anode layer are both electrically connected to the connector, and the cathode layer is electrically connected to the connector via a cathode lead; A flexible substrate is arranged on a side surface of the cathode layer close to the detection opening. A detection through hole is arranged at the center of the flexible substrate. The detection through hole is arranged opposite to the detection opening. A conductive member is also arranged on the flexible substrate. The conductive member connects the cathode layer and the cathode lead to lead the signal of the cathode layer to the connector through the cathode lead.

2. The alpha particle detector according to claim 1, characterized in that: The thickness of the flexible substrate is no more than 0.3 mm.

3. The alpha particle detector according to claim 2, characterized in that: The flexible substrate is provided with a conductive through hole, the conductive member is located in the conductive through hole, and the conductive member is in contact with the cathode layer; or, The conductive element is located on a surface of the flexible substrate that is away from the cathode layer.

4. The alpha particle detector according to claim 1, characterized in that: The detection component also includes: The soft cushion layer is arranged on a surface of the anode layer which is away from the detection opening.

5. The alpha particle detector according to claim 4, characterized in that: The anode layer is electrically connected to the connector via an anode lead; A first avoidance cavity is provided in the central area of ​​the cushion layer, and the anode lead passes through the first avoidance cavity to connect the anode layer and the connector.

6. The alpha particle detector according to claim 5, characterized in that: The cathode lead includes a first cathode lead and a second cathode lead; The detection assembly further comprises a substrate and a cathode pad, wherein the substrate is arranged on a side of the anode layer away from the detection opening; When the detection assembly further includes the soft cushion layer, the substrate is arranged on a side of the soft cushion layer away from the detection opening; The cathode pad is disposed on the substrate; Wherein, the first cathode lead connects the cathode layer and the cathode pad; The second cathode lead connects the cathode pad and the housing, or the second cathode lead directly connects the cathode pad and the connector.

7. The alpha particle detector according to claim 6, characterized in that: The anode lead includes a first anode lead and a second anode lead; The detection assembly further comprises an anode pad, and the anode pad is arranged on the substrate; A second avoidance cavity is provided in the central area of ​​the substrate, and at least a part of the second avoidance cavity and the first avoidance cavity are arranged opposite to each other in a direction perpendicular to the substrate; One end of the first anode lead is connected to the anode layer, and the other end passes through the first avoidance cavity and the second avoidance cavity to be connected to the anode pad; The second anode lead connects the anode pad and the connector.

8. The alpha particle detector according to claim 7, characterized in that: The cathode pad and / or the anode pad is arranged on a side surface of the substrate away from the detection opening.

9. The alpha particle detector according to claim 2, characterized in that: The detection component also includes: A protective layer, disposed on the cathode layer or the side of the flexible substrate close to the detection opening, wherein the protective layer is selected from one or more of a three-proof layer, a light shielding layer and an anti-wiping layer; At least one of the three protective layers, the light shielding layer and the anti-wiping layer includes an organic layer. When the protective layer includes the organic layer, at least one organic layer is disposed on a surface of the cathode layer close to the detection opening.

10. The alpha particle detector according to claim 9, characterized in that: The material of the three-proof layer includes organic material, and the organic material includes polytetrafluoroethylene and / or polyimide; The material of the light-shielding layer includes one or more of metal, titanium dioxide, and thermoplastic polymer light-shielding material; The material of the wipe-resistant layer includes one or more of silicon carbide, aluminum oxide, hard metal and quartz; The material of the flexible substrate includes polyimide or polyester film.

11. The alpha particle detector according to claim 9, characterized in that: The protective layer includes at least one protective unit layer, and each protective unit layer includes one or more of the three protective layers, the light shielding layer and the anti-wiping layer; When the protection unit layer includes the three-proof layer, the light-shielding layer and the anti-wiping layer, the three-proof layer, the light-shielding layer and the anti-wiping layer are stacked in sequence in a direction away from the cathode layer.

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