A power module and uninterruptible power supply

Abstract

The application provides a power module and uninterruptible power supply, which comprises a heating device and a heat sink. The heating device comprises a first power device and a second power device; the first power device is adapted to work cooperatively with the second power device; the second power device comprises a first sub-power device and a second sub-power device which work alternately with each other. The heat sink comprises a base plate for connecting the first power device, and the base plate is also used for connecting the first sub-power device and / or the second sub-power device. Through the design of the structure, the heat dissipation capacity of the heat sink in the power module is fully and effectively utilized during the whole working process of the power module, and the overall heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic products, and in particular to a power module and an uninterruptible power supply. BACKGROUND

[0002] A heat sink is a component used to assist a heat generating device in timely heat dissipation, so as to avoid damage caused by high temperature of the heat generating device. The heat sink is divided into active heat dissipation and passive heat dissipation, and there is also a combination of active heat dissipation and passive heat dissipation, for example, the active heat dissipation is a forced air cooling heat sink, and the passive heat dissipation is a heat dissipation fin.

[0003] At present, a heat sink is usually arranged for each heat generating device in an electrical device such as a power module, and in order to meet the heat dissipation requirements of each heat generating device under extreme conditions (especially in harsh working conditions), the heat sink in the electrical device is usually large, which causes the electrical device to be not compact. In actual operation, the electrical device often has different working modes, and each heat generating device is not working at every moment, which will cause waste of the heat dissipation capacity of the heat sink and low overall heat dissipation efficiency. SUMMARY

[0004] The present application provides a power module and an uninterruptible power supply, which optimizes the heat dissipation mode in the power module, so that the power module has a more compact volume.

[0005] The present application provides a power module, which comprises: a heat generating device comprising a first power device and a second power device; the first power device is adapted to work cooperatively with the second power device, the second power device comprises a first sub-power device and a second sub-power device which work alternately with each other; and a heat sink comprising a substrate for connecting the first power device, the substrate is also used for connecting the first sub-power device and / or the second sub-power device.

[0006] Further, the present application further comprises: a circuit board member comprising a first PCB board and a second PCB board which are arranged in parallel with each other and are respectively used for electrically connecting the first power device and the second power device, and each heat sink is fixedly arranged between the first PCB board and the second PCB board; the heat sink further comprises a first heat dissipation fin group, the substrate comprises a first substrate and a second substrate which are respectively used for connecting the first power device and the second power device, and the first heat dissipation fin group is connected with the first substrate and the second substrate, so as to conduct heat of the first substrate and the second substrate.

[0007] Further, the first substrate and the second substrate are connected perpendicularly to each other; the first substrate is parallel to the first PCB board and the second PCB board, and the second substrate is perpendicular to the first PCB board and the second PCB board.

[0008] Further, the first heat sink group comprises a plurality of first heat sinks extending in the same direction and spaced apart from each other, part of the first heat sinks are connected to the first substrate, part of the first heat sinks are connected to the second substrate, and the spacing direction of each first heat sink is at an angle to both the first substrate and the second substrate.

[0009] Further, the substrate has opposite first and second sides, the first side is used to connect with the heat generating device, and the second side is used to connect with the first heat sink group; wherein the first side comprises a first substrate first side and a second substrate first side, and the second side comprises a first substrate second side and a second substrate second side; the first substrate first side is used to connect with the first power device, and the second substrate first side is used to connect with the first sub-power device and / or the second sub-power device; part of the first heat sinks are connected to the first substrate second side, and the rest of the first heat sinks are connected to the second substrate second side.

[0010] Further, the first heat sink has a first end and a second end in the extension direction, the first end is connected to the first substrate or the second substrate, and the second end extends away from the first substrate and the second substrate; wherein the second end of each first heat sink is flush with the end face of the first substrate or the end face of the second substrate.

[0011] Further, the heat sink further comprises a concentrated heat conduction part and a second heat sink group, the concentrated heat conduction part is connected to the first substrate second side and the second substrate second side respectively, and the second heat sink group comprises a plurality of second heat sinks, and the second heat sinks are connected to the concentrated heat conduction part.

[0012] Further, the concentrated heat conduction part has a triangular structure; the extension direction of the second heat sink is parallel to the extension direction of the first heat sink, the extension direction of the second heat sink is perpendicular to the first connection face, and the first connection face is a plane formed by the connection position of the second heat sink and the concentrated heat conduction part.

[0013] Further, the number of the heat sinks is a plurality, and a plurality of the heat sinks are spaced apart along the length direction of the second PCB, and the length direction is perpendicular to the plane where the first side of the second substrate is located; the first PCB and the second PCB are connected to a plurality of bus capacitors, the bus capacitors are located between the first PCB and the second PCB, and one group of the bus capacitors is close to one heat sink.

[0014] The embodiment of the present application also provides an uninterruptible power supply, comprising the power module according to any one of the preceding technical solutions; wherein the first power device is an inverter power tube, and the second power device is a rectifier power tube; the first sub-power device is a mains power device, and the second sub-power device is a battery power device.

[0015] The present application provides a power module and an uninterruptible power supply, in the power module, the first sub-power device and the second sub-power device in the second power device work alternately with each other, and the first power device and the second power device work cooperatively, that is, there is a mode that the first power device and the first sub-power device or the second sub-power device work together, in this case, the first power device and the second power device are arranged on the same heat sink, so that the heat sink is suitable for the common heat dissipation of the first power device and the second power device, in the actual working process, since there is always a working power device on the heat sink, the heat dissipation capacity of the heat sink can be always exerted, so that the heat sink is shared by the two types of power devices, the volume of the heat sink can be reduced, the heat dissipation capacity of the heat sink can be fully utilized and exerted, the heat dissipation mode in the power module is optimized, and the overall heat dissipation efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A structural schematic view of a heat sink provided for the implementation of the present application;

[0017] Figure 2 A structural schematic view of a heat sink from another perspective provided for the implementation of the present application;

[0018] Figure 3 A structural schematic view of another heat sink provided for the implementation of the present application;

[0019] Figure 4 A structural schematic view of another heat sink provided for the implementation of the present application;

[0020] Figure 5 A structural schematic view of another heat sink provided for the implementation of the present application;

[0021] Figure 6 A structural schematic view of a heat sink connected with an inverter power tube and a rectifier power tube provided for the implementation of the present application;

[0022] Figure 7 A structural schematic view of a power module provided for the implementation of the present application;

[0023] Figure 8 An exploded structural schematic view of a power module provided for the implementation of the present application;

[0024] REFERENCE SIGNS

[0025] 10, rectifier inverter device; 100, heat sink; 110, substrate; 111, first side; 1111, first substrate first side; 1112, first substrate second side; 112, second side; 1121, second substrate first side; 1122, second substrate second side; 113, first substrate; 1131, first substrate end face; 114, second substrate; 1141, second substrate end face; 120, first heat sink group; 121, first heat sink; 1211, first end; 1212, second end; 130, concentrated heat conduction part; 131, first connecting surface; 140, second heat sink group; 141, second heat sink; 200, heat generating device; 300, inverter board; 310, inverter power tube; 400, rectifier board; 410, rectifier power tube; 500, bus capacitor; α1, first preset included angle; α2, second preset included angle. DETAILED DESCRIPTION

[0026] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0027] In the specific embodiments, various specific technical features described can be combined in any suitable manner without contradiction, for example, different embodiments and technical solutions can be formed by combining different specific technical features. In order to avoid unnecessary repetition, various possible combinations of various specific technical features in the present application are not described again.

[0028] In the following description, the terms "first", "second", and the like are only used to distinguish different objects, and do not mean that the objects have the same or relationship. It should be understood that the position description "upper", "lower", "outer", "inner" is the position in the normal use state, and the "left" and "right" directions represent the left and right directions shown in the specific corresponding schematic diagram, which can be the left and right directions in the normal use state or not.

[0029] It should be noted that the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "comprises a" does not exclude the presence of additional same elements in the process, method, article or device including the element. The term "connected" includes direct connection and indirect connection unless specifically stated otherwise.

[0030] In the specific embodiments, the heat sink is suitable for heat dissipation of any electronic product, for example, the heat sink is suitable for heat dissipation of a mainboard in an electronic product; for example, the heat sink is suitable for heat dissipation of an uninterruptible power supply; for example, the heat sink is also suitable for heat dissipation of a power supply in an electronic product with double circuits or double switches. For the convenience of description, the following is exemplarily described by taking the heat sink suitable for heat dissipation of an uninterruptible power supply as an example.

[0031] At present, most of the related heat dissipation modes are designed for separate heat dissipation of each functional heating device, that is, the heat dissipation paths of each functional heating device are independent. In the working state of partial heating devices being suspended or at low power, the utilization rate of the heat dissipation device is low, which causes waste of resources. At the same time, the separate heat dissipation design needs to occupy a large space, which may cause waste of space utilization. In order to save space, part of the structure concentrates the heating devices on the same substrate of the heat sink, which may cause excessive concentration of heat and cannot dissipate heat in time. At the same time, the heat transfer path is long, and the heat dissipation effect is poor. In view of the above problems, the present application provides a heat sink to overcome the above problems.

[0032] In some embodiments, as shown in Figures 1 to 5 The heat sink 100 includes a substrate 110 and a first fin group 120. The substrate 110 has opposite first and second sides 111 and 112, and the first side 111 is connected with the heating device 200. The first fin group 120 has a plurality of first fins 121, and the first fins 121 are connected with the second side 112 of the substrate 110.

[0033] Firstly, the heat sink 100 is a structure for dissipating heat of the heating device 200. The heating device 200 includes functional power devices, for example, rectifier power tubes of rectifier power devices, inverter power tubes of inverter power devices, etc. The specific types are not limited, and any power device that needs to be cooled meets the requirements.

[0034] The heat sink 100 itself includes a substrate 110, which is used to fix the heating device 200 and realize heat conduction. The heating device 200 is fixedly connected to the substrate 110, and the specific connection mode can be determined according to the actual situation, for example, the heating device 200 is bonded to the substrate 110. The heat generated by the heating device 200 is transferred to the substrate 110, and then transferred to the fins for heat dissipation.

[0035] In order to shorten the heat transfer path of the substrate 110 and accelerate the heat dissipation efficiency, the substrate 110 has opposite first side 111 and second side 112 in the thickness direction of the substrate 110, the first side 111 is connected with the heat generating device 200; the second side 112 is connected with the first heat dissipation fin 121, the heat generated by the heat generating device 200 only needs to pass through the thickness of the substrate 110 to be dissipated through the first heat dissipation fin 121, greatly reducing the heat transfer path.

[0036] In order to avoid excessive heat concentration, the heat generating device 200 is arranged as dispersedly as possible, the substrate 110 of the heat sink 100 can include multiple parts, the substrate 110 includes at least a first substrate 113 and a second substrate 114, the first side 111 includes a first substrate first side 1111 and a second substrate first side 1121, the second side 112 includes a first substrate second side 1112 and a second substrate second side 1122, the first substrate first side 1111 and the second substrate first side 1121 are respectively connected with different heat generating devices 200, it should be noted here that the different heat generating devices 200 include the same heat generating component and different heat generating components, which can be specifically understood as follows: first, the same heat generating component has multiple heat generating ends, and different heat generating ends are connected with different substrates, that is, the first substrate 113 and the second substrate 114 jointly conduct heat for the same heat generating component; second, two completely different heat generating components are respectively connected with different substrates, that is, the first substrate 113 and the second substrate 114 respectively conduct heat for different heat generating components. The first heat dissipation fin group 120 is respectively connected with the first substrate second side 1112 and the second substrate second side 1122, and the first heat dissipation fin group 120 can conduct heat of the first substrate 113 and the second substrate 114.

[0037] For example, the heat sink 100 is a cubic structure, the cubic structure has six faces, the substrate 110 of the heat sink 100 includes two parts, that is, the first substrate 113 and the second substrate 114, the first substrate 113 and the second substrate 114 respectively occupy two faces of the six faces of the cubic structure, the first substrate 113 and the second substrate 114 can be arranged adjacently or oppositely, which can be determined according to the actual heat dissipation condition.

[0038] For example, as shown in FIG. 1, the heat sink 100 is a cubic structure, the cubic structure has six faces, the substrate 110 of the heat sink 100 includes two parts, that is, the first substrate 113 and the second substrate 114, the first substrate 113 and the second substrate 114 respectively occupy two faces of the six faces of the cubic structure, the first substrate 113 and the second substrate 114 can be arranged adjacently or oppositely, which can be determined according to the actual heat dissipation condition. Figure 4As shown, a first substrate 113 and a second substrate 114 are arranged opposite to each other. The first substrate 113 has a first substrate first side 1111 and a first substrate second side 1112, and the second substrate 114 has a second substrate first side 1121 and a second substrate second side 1122. In this structure, the first substrate first side 1111 and the first substrate first side 1121 are arranged back to back. The first substrate first side 1111 and the first substrate first side 1121 are respectively connected to different heat-generating devices 200. The first substrate second side 1112 and the second substrate second side 1122 are arranged opposite to each other. One end of the first heat sink 121 is connected to the first substrate second side 1112, and the other end of the first heat sink 121 is connected to the second substrate second side 1122, so that the first heat sink 121 is simultaneously connected to the first substrate second side 1112 and the second substrate second side 1122. In this way, different heat-generating devices 200 transfer heat to the first heat sink 121 in the middle through the first substrate 113 and the second substrate 114 on both sides of the heat sink 100, and jointly use the same first heat sink 121 for heat dissipation.

[0039] For example, such as Figure 2 As shown, the first substrate 113 and the second substrate 114 are arranged adjacent to each other. The first substrate 113 has a first substrate first side 1111 and a first substrate second side 1112, and the second substrate 114 has a second substrate first side 1121 and a second substrate second side 1122. The first substrate 113 and the second substrate 114 are connected. In this structure, the first substrate first side 1111 and the second substrate first side 1121 form a first preset angle, defined as α1. For a cubic structure like the heat sink 100, the first preset angle α1 is 90 degrees. Depending on the structure, the first substrate... The first side 1111 of the first substrate and the first side 1121 of the second substrate form a first preset angle α1, which also varies accordingly. The first side 1111 of the first substrate and the first side 1121 of the second substrate are arranged adjacent to each other. The first side 1111 of the first substrate and the first side 1121 of the second substrate are respectively connected to different heat-generating devices 200. The second side 1112 of the first substrate and the second side 1122 of the second substrate are also arranged adjacent to each other. Considering the convenience of processing, some of the first heat sinks 121 can be connected to the second side 1112 of the first substrate, and the remaining first heat sinks 121 are connected to the second side 1122 of the second substrate. In this structure, the first heat sinks 121 connected to the first substrate 113 and the second substrate 114 are different. The heat-generating device 200 connected to the first substrate 113 mainly relies on the first heat sink 121 connected to the first substrate 113 for heat dissipation, while the heat-generating device 200 connected to the second substrate 114 mainly relies on the first heat sink 121 connected to the second substrate 114 for heat dissipation.

[0040] For example, such as Figure 5As shown, the heat sink 100 is a cubic structure, the cubic has 6 faces, the base plate 110 of the heat sink 100 includes three parts, namely the first base plate 113 and the second base plate 114, the third base plate 115, the first base plate 113, the second base plate 114 and the third base plate 115 respectively occupy 3 of the 6 faces of the cubic, the first base plate 113, the second base plate 114 and the third base plate 115 can be arranged adjacent to each other, and the three can also be arranged adjacent to each other in turn, which can be determined according to the actual heat dissipation condition and the arrangement requirement.

[0041] For example, the first base plate 113, the second base plate 114 and the third base plate 115 are adjacent to each other, and the first fin group 120 in the heat sink 100 can be connected to any two of them, and the first fin 121 is connected to the first base plate 113 and the second base plate 114 respectively, and the first fin 121 is connected to the second base plate 114 and the third base plate 115 respectively, and the first fin 121 is connected to the first base plate 113 and the third base plate 115 respectively.

[0042] For example, in order to realize good ventilation channel, the first base plate 113, the second base plate 114 and the third base plate 115 can be connected in turn, and the first fin 121 can also be connected to any one of the first base plate 113, the second base plate 114 and the third base plate 115, or any two of them.

[0043] It should be noted that, as Figure 2 As shown, the plurality of first fins 121 in the first fin group 120 extend in the same direction and are spaced apart from each other, and the spacing includes uniform spacing and non-uniform spacing. When the plurality of first fins 121 are parallel and spaced apart, the distance between the adjacent two first fins 121 is the tooth gap B, and the distance between the first fin 121 from the connection position to the other end away from the connection position is the tooth height H. When the heat sink 100 is manufactured by using aluminum extrusion or die casting and other processing technologies, the higher the H / B ratio, the more difficult the processing, the shorter the service life of the corresponding mold, and the higher the rejection rate of the processed heat sink 100. However, the heat dissipation area of the unit volume heat sink 100 is limited, and the increase of the tooth gap B will also lead to low wind speed and low heat exchange coefficient, so the numerical value and the corresponding proportional relationship of the tooth height H and the tooth gap B need to be considered comprehensively.

[0044] The heat sink provided by the application comprises a substrate and a first fin group, the substrate has opposite first and second sides, the first fin group has a plurality of first fins, the first side is connected with a heat generating device to conduct heat generated by the heat generating device to the substrate, and the second side is connected with the first fins to quickly dissipate the heat conducted to the substrate through the first fins. The structure arranged on both sides effectively shortens the heat conduction path of the substrate, improves the heat dissipation efficiency, and can also increase the contact area of the first fins and air. Avoiding the situation that part of the circulating air does not contact the fins due to the same side arrangement of the heat generating device and the first fins, thereby reducing the heat dissipation efficiency. Further, the substrate comprises at least a first substrate and a second substrate, the first side comprises a first side of the first substrate and a first side of the second substrate, the second side comprises a second side of the first substrate and a second side of the second substrate, the first side of the first substrate and the first side of the second substrate are connected with different heat generating devices respectively, and the first fin group is connected with the second side of the first substrate and the second side of the second substrate respectively. By connecting the first side of the first substrate and the first side of the second substrate with different heat generating devices respectively, and connecting the first fin group with the second side of the first substrate and the second side of the second substrate respectively, the problem of heat concentration and low heat dissipation efficiency caused by the fact that multiple heat generating devices are concentrated on the same substrate surface can be effectively avoided. At the same time, the multiple parts of the substrate are connected with the same group of fins, which improves the utilization rate of the fins, saves the space occupied by the heat sink, and improves the heat dissipation efficiency of the heat sink.

[0045] In some embodiments, as Figure 2As shown, the first heat dissipation fin 121 has a first end 1211 and a second end 1212 in the extending direction, the first end 1211 is connected with the first substrate 113 or the second substrate 114, and the second end 1212 extends away from the first substrate 113 and the second substrate 114. The extending direction of the first heat dissipation fin 121 forms a second preset angle with the second side 1112 of the first substrate 113, that is, the interval direction of each first heat dissipation fin 121 forms an angle with both substrates. Specifically, considering that the first substrate 113 and the second substrate 114 are arranged adjacent to each other, the first side 1111 of the first substrate 113 and the first side 1121 of the second substrate 114 form a first preset angle a1, for example, the first preset angle a1 is 90 degrees, and the first substrate 113 and the second substrate 114 are arranged in an L-shaped structure. One of the first end 1211 and the second end 1212 of the first heat dissipation fin 121 can be connected with one of the first substrate 113 or the second substrate 114, so as to realize the connection of each substrate with the first heat dissipation fin 121, and effectively improve the heat dissipation efficiency. Considering that the first heat dissipation fin 121 may be covered with dust, which may reduce the heat dissipation efficiency of the first heat dissipation fin 121. In order to avoid the dust as much as possible, the first heat dissipation fin 121 can be arranged obliquely. Specifically, in the case that the heat dissipation device 100 is horizontally placed, the first substrate 113 is located at the top of the heat dissipation device 100, and the second substrate 114 is located at the side of the heat dissipation device 100. The first end 1211 of the first heat dissipation fin 121 is connected with the first substrate 113 or the second substrate 114, and the extending direction of the first heat dissipation fin 121 forms a second preset angle a2 with the second side 1112 of the first substrate 113. In the case that the first preset angle a1 is 90 degrees, the angle between the extending direction of the first heat dissipation fin 121 and the second side 1122 of the second substrate 114 is the complementary angle of the second preset angle a2. The size of the second preset angle a2 is not limited, and the larger the second preset angle a2 is, the larger the oblique angle of the first heat dissipation fin 121 is, and the lower the probability of dust accumulation is. The larger the second preset angle a2 is, the smaller the angle between the first heat dissipation fin 121 and the second substrate 114 is, which may cause inconvenience in manufacturing and processing of the heat dissipation device 100, and therefore needs to be considered comprehensively. For example, the second preset angle a2 is 45 degrees, and the angle between the extending direction of the first heat dissipation fin 121 and the second side 1112 of the first substrate 113 and the angle between the extending direction of the first heat dissipation fin 121 and the second side 1122 of the second substrate 114 are both 45 degrees. In the case that the first substrate 113 and the second substrate 114 have the same shape and size, the first heat dissipation fins 121 are uniformly distributed on the first substrate 113 and the second substrate 114. Half of the first heat dissipation fins 121 are connected with the first substrate 113, and the other half of the first heat dissipation fins 121 are connected with the second substrate 114.

[0046] In some embodiments, as Figure 2 and Figure 3As shown, the heat sink 100 further comprises a concentrated heat conduction part 130 and a second fin group 140, the concentrated heat conduction part 130 is connected with the first substrate second side 1112 and the second substrate second side 1122 respectively, for concentrating the part of heat conducted to the first substrate 113 and the second substrate 114 to conduct outward. The second fin group 140 comprises a plurality of second fins 141, the second fins 141 are connected with the concentrated heat conduction part 130 to conduct the heat conducted to the concentrated heat conduction part 130 by the first substrate 113 and the second substrate 114. Specifically, the second substrate first side 1121 of the second substrate 114 is connected with the heat generating device 200, the second substrate second side 1122 of the second substrate 114 is connected with the first fin 121, the heat generating device 200 only occupies part of the position of the second substrate first side 1121, the entire second substrate second side 1122 is connected with the first fin 121, the connection position occupied by the heat generating device 200 must be higher than the other areas without the heat generating device 200, the heat quickly passes through the second substrate 114 to the nearest first fin 121, which may cause the temperature of part of the first fin 121 to be too high, the heat dissipation is not timely, and part of the first fin 121 does not fully play its heat dissipation role. Considering the problem of heat dissipation efficiency, in order to better enable each fin to quickly and uniformly dissipate heat, improve the utilization efficiency of individual fins, and avoid heat being too concentrated on part of the fins, the concentrated heat conduction part 130 is arranged on the heat sink 100, the concentrated heat conduction part 130 is connected with the first substrate second side 1112 and the second substrate second side 1122 respectively, and the heat sink 100 further comprises the second fin 141 connected with the concentrated heat conduction part 130. It should be noted that the second fin 141 and the first fin 121 have the same structure and performance, and are defined as the first fin 121 and the second fin 141 for the sake of distinction due to different connection positions. By arranging the concentrated heat conduction part 130, the concentrated heat conduction part 130 can increase the thickness of the substrate, the heat transfer path is wider, and the heat capacity of the heat generating device 200 on the first substrate 113 and the heat generating device 200 on the second substrate 114 in the corresponding area of the substrate can be effectively increased, and the core heat generating part of the heat generating device (such as the chip part of the IGBT power tube) can be arranged corresponding to the concentrated heat conduction part, which can effectively cope with the instantaneous high heat and high loss of the heat generating device. At the same time, the greater the thickness of the heat conduction part, the smaller the corresponding thermal resistance, the concentrated heat conduction part 130 can reduce the thermal resistance of heat transfer to the central area, not only can the instantaneous high heat of the heat generating device be temporarily collected in the concentrated heat conduction part, but also the temperature uniformity of the first fin 121 and the second fin 141 is better, and the heat dissipation is more uniform; and the concentrated heat conduction part 130 can also reduce the tooth height of the second fin 141, which is convenient for the processing and manufacturing of the heat sink 100, thereby facilitating the realization of a denser array of heat dissipation teeth, and further realizing a larger heat exchange area.

[0047] The specific shape of the centralized heat-conducting part 130 is not limited, and the entire heat sink 100 can be a one-piece molded structure. In this embodiment, the first substrate 113, the second substrate 114, the centralized heat-conducting part 130, the first heat sink assembly, and the second heat sink assembly are all integrally molded by aluminum extrusion or die casting processes.

[0048] In some embodiments, such as Figure 3 As shown, the concentrated heat-conducting part 130 has a cubic structure. The concentrated heat-conducting part 130 is connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The second heat sink 141 is connected to the two sides of the concentrated heat-conducting part 130.

[0049] In some embodiments, such as Figure 2 As shown, multiple second heat sinks 141 in the second heat sink group extend in the same direction and are spaced apart from each other. Each second heat sink also has a first end and a second end in its extending direction. The first end of each second heat sink 141 is connected to the centralized heat conduction part 130, and the second end of each second heat sink 141 extends away from the centralized heat conduction part 130. It can be seen that the extending direction of the second heat sink 141 is parallel to the extending direction of the first heat sink 121, and the extending direction of the second heat sink 141 is perpendicular to the first connecting surface 131, which is the plane formed by the connection point between the second heat sink 141 and the centralized heat conduction part 130. Specifically, the concentrated heat-conducting part 130 is a right-angled triangular prism structure (triangular construction). The two right-angled faces of the right-angled triangular prism are connected to the second side 1112 of the first substrate and the second side 1122 of the second substrate, respectively. The other face of the right-angled triangular prism is the first connecting surface 131. The second heat sink 141 is connected to the first connecting surface 131, and the extension direction of the second heat sink 141 is perpendicular to the first connecting surface 131.

[0050] In some embodiments, such as Figure 2 As shown, considering the space utilization of the heat sink 100 and minimizing space waste, the first end 1211 of the first heat sink 121 is connected to the first substrate 113 or the second substrate 114, and the second end 1212 of the first heat sink 121 extends away from the first substrate 113 and the second substrate 114, and the second end 1212 of the first heat sink 121 is flush with the end face 1131 of the first substrate or the end face 1141 of the second substrate. If the heat sink 100 also includes a concentrated heat conduction part 130 and a second heat sink 141, one end of the second heat sink 141 is connected to the concentrated heat conduction part 130, and the second end of the second heat sink 141 also extends away from the first substrate 113 and the second substrate 114, and the second end of the second heat sink 141 is also flush with the end face of the first substrate 113 or the end face of the second substrate 114.

[0051] This application also provides a power module 10. In this embodiment, it is described using an uninterruptible power supply as an example. It is constructed as a power module in a modular uninterruptible power supply, namely, a rectifier-inverter device 10, such as... Figures 6 to 8 As shown, the rectifier-inverter device 10 includes a heat sink 100, a heat-generating device 200, an inverter board 300, and a rectifier board 400. The inverter board 300 can be understood as a first PCB board, on which a first power device, namely an inverter power transistor 310, is electrically connected. The inverter power transistor 310 is connected to the first substrate 113. The rectifier board 400 can also be understood as a second PCB board, on which a second power device, namely a rectifier power transistor 410, is electrically connected. The rectifier power transistor 410 is connected to the second substrate 114. The heat-generating device 200 includes both the first and second power devices. Specifically, by interconnecting multiple power modules (rectifier-inverter devices 10), an uninterruptible power supply (UPS) further provided by the present invention is formed, thereby realizing UPS technology.

[0052] To facilitate understanding, let's first briefly explain uninterruptible power supply (UPS) technology. A UPS is a type of uninterruptible power supply containing energy storage devices, primarily used to provide uninterrupted power to equipment with high power stability requirements. When the mains input is normal, the UPS stabilizes the mains voltage and supplies it to the load. In this state, the UPS acts as an AC voltage regulator, simultaneously charging its internal battery. When the mains power is interrupted, the UPS immediately switches from the battery's DC power to the load via an inverter, continuing to supply 220V AC power, ensuring the load maintains normal operation and protecting its hardware and software from damage. UPS devices typically provide protection against both overvoltage and undervoltage. Uninterruptible power supplies (UPS) are widely used in: mining, aerospace, industry, communications, defense, hospitals, computer terminals, network servers, network equipment, data storage devices, emergency lighting systems, railways, shipping, transportation, power plants, substations, nuclear power plants, fire safety alarm systems, wireless communication systems, program-controlled exchanges, mobile communications, solar energy storage and conversion equipment, control equipment and their emergency protection systems, personal computers, and other fields. For electrical equipment with dual circuits or dual switches, there are also scenarios similar to the alternating operation of rectifier and battery modes in UPS systems.

[0053] The uninterruptible power supply has multiple working states, and the losses of different power devices are different in different working states. Usually, the alternating working mode is adopted. The uninterruptible power supply mainly includes a bypass part and a power part. The power part has a heating device 200. For example, the heating device 200 includes an inverter power tube 310 and a rectifier power tube 410. For the power part, it is divided into a mains state and a battery state. In the mains state, the power devices related to the battery state in the rectifier circuit, such as IGBT, diode, inductor, etc., are not operated temporarily, and the power devices in the mains state in the rectifier circuit and the power devices in the inverter circuit continue to operate. In the battery state, the power devices related to the battery state in the rectifier circuit and the power devices in the inverter circuit continue to operate, and the power devices related to the mains state in the rectifier circuit are not operated temporarily. In other words, the second power device includes a first sub-power device and a second sub-power device that operate alternately with each other, that is, the rectifier power tube 410 includes the power devices in the mains state and the power devices related to the battery state. The first power device can work cooperatively with the second power device. In the mains state, the inverter power tube 310 cooperates with the power devices in the mains state in the rectifier power tube 410, and in the battery state, the inverter power tube 310 cooperates with the power devices in the battery state in the rectifier power tube 410. Even in the mains state and the battery state, the power devices in the inverter circuit continue to operate, and the losses of the power devices in different working conditions are different. By connecting the inverter power tube 310 on the inverter board 300 with the first substrate 113 and connecting the rectifier power tube 410 on the rectifier board 400 with the second substrate 114, the inverter power tube 310 and the rectifier power tube 410 are avoided from being concentrated on the same substrate surface, which causes excessive heat concentration. At the same time, the use of the same heat sink 100 for the inverter power tube 310 and the rectifier power tube 410 can improve the utilization rate of the heat dissipation fins. In the alternating working state of the power tube, there is no waste of the performance of the heat sink 100. It can be understood that the above-mentioned alternating working is not limited to the case that one of the two devices is turned on and the other is turned off, but also covers the case that one of the two devices works at a relatively high power and the other works at a relatively low power.

[0054] In some embodiments, as Figure 7As shown, the rectification inverter device 10 includes an inverter plate 300 and a rectification plate 400, the inverter plate 300 and the rectification plate 400 are arranged in the vertical direction and parallel to each other, and the specific form is not limited, the inverter plate 300 is above the rectification plate 400 or the rectification plate 400 is above the inverter plate 300, both of which meet the requirements, and hereinafter, the inverter plate 300 is above the rectification plate 400 as an example, and the extension direction of the inverter plate 300 and the rectification plate 400 is parallel to the horizontal plane as an example, and the heat sink 100 is located between the inverter plate 300 and the rectification plate 400, and the specific fixing position can be determined according to the actual situation, for example, the heat sink 100 can be fixed on the PCB plate with the rectification power tube 410, that is, on the rectification plate 400, and the specific fixing form can also be determined according to the demand, for example, the heat sink 100 is welded on the rectification plate 400, for example, the heat sink 100 is fixed on the rectification plate 400 by locking screws. The first base plate 113 and the second base plate 114 of the heat sink 100 are arranged adjacent to each other, the first base plate 113 and the second base plate 114 are connected, the first preset included angle a1 between the first side 1111 of the first base plate and the first side 1121 of the second base plate is 90 degrees, the first base plate 113 and the second base plate 114 are arranged in an L-shaped structure, and after being placed, the specific structure is that the first base plate 113 is parallel to the horizontal plane, and the second base plate 114 is parallel to the vertical direction, that is, the extension direction of the second base plate 114 is perpendicular to the extension direction of the inverter plate 300. The first base plate 113 of the heat sink 100 is connected with the inverter power tube 310, and the second base plate 114 of the heat sink 100 is connected with the rectification power tube 410, which can effectively save the space occupied by the rectification inverter device 10 in the height direction and improve the space utilization. At the same time, the heat sink 100 includes the first heat sink fin 121 and the second heat sink fin 141, the first heat sink fin 121 and the second heat sink fin 141 are parallel, and the included angle between the extension direction of the first heat sink fin 121 and the second side 1122 of the second base plate is 45 degrees, which facilitates heat dissipation of the inverter power tube 310 and the rectification power tube 410.

[0055] In some embodiments, in order to further improve the heat dissipation efficiency of the heat sink, the rectification inverter device 10 further includes a fan, and the specific arrangement position of the fan can be determined according to the actual situation. It should be noted that in order to ensure that the airflow generated by the fan can better contact the first heat sink fin 121 and the second heat sink fin 141 for heat exchange, the direction of the airflow generated by the fan is substantially parallel to the plane in which the second side 112 of the base plate 110 is located, that is, the direction of the airflow is parallel to the width direction of the rectification inverter device 10. Figure 8(As indicated by the middle arrow), the inverter board 300 and rectifier board 400 are arranged vertically in the height direction, the multiple heat sinks 100 are arranged sequentially in the length direction, and the direction perpendicular to both the length and height directions is the width direction. In the width direction, airflow enters from one end of the heat sink 100 and fully exchanges heat with the first heat sink 121 and the second heat sink 141, and then exits from the other end of the heat sink 100. In some embodiments, such as Figure 7 and Figure 8 As shown, there are multiple heat sinks 100, which are spaced apart along the length of the rectifier plate 400. The length direction is perpendicular to the plane of the first side 1121 of the second substrate. Multiple sets of bus capacitors 500 are connected to both the inverter plate 300 and the rectifier plate 400 of the rectifier-inverter device 10. To further optimize the layout and improve the structural compactness, the bus capacitors 500 are located between the inverter plate 300 and the rectifier plate 400, and are arranged side by side with the heat sinks 100 to save space in the height direction of the rectifier-inverter device 10. Based on the number of bus capacitors 500 and heat sinks 100, the bus capacitors 500 and heat sinks 100 are arranged adjacent to each other, with one set of bus capacitors 500 close to one heat sink 100. To improve the heat dissipation effect, bus capacitors 500 are located on both sides of the heat sink 100, and heat sinks 100 are located on both sides of the bus capacitors 500. This structure can effectively avoid heat concentration between two adjacent heat sinks 100 and accelerate the heat dissipation efficiency.

[0056] In some embodiments, the power devices in the inverter circuit operate continuously, regardless of whether it is in mains power mode or battery mode, meaning that the inverter power transistor 310 continuously generates heat. Considering that the rectifier power transistor 410 includes mains power devices and battery power devices, in mains power mode, the mains power devices in the rectifier power transistor 410 operate and generate heat, while the battery power devices in the rectifier power transistor 410 stop operating and do not generate heat; in battery mode, the battery power devices in the rectifier power transistor 410 operate and generate heat, while the mains power devices in the rectifier power transistor 410 stop operating and do not generate heat. Therefore, the mains power devices and battery power devices in the rectifier power transistor 410 operate alternately.

[0057] Regarding the connection between the second substrate 114 and the second power device, the embodiments of the present invention include two main connection methods. The first method is to connect the second substrate of the same heat sink to either the first sub-power device or the second sub-power device. The second method is to connect the second substrate of the same heat sink to both the first sub-power device and the second sub-power device.

[0058] For example, the first substrate 113 of the heat sink 100 is connected with the inverter power tube 310, and the second substrate 114 of the heat sink 100 is connected with the utility power device and the battery power device in the rectifier power tube 410. The inverter power tube 310 on the first substrate 113 continuously generates heat regardless of the state, and the utility power device and the battery power device on the second substrate 114 alternately generate heat. In other words, the first substrate 113 and the second substrate 114 always generate heat. This structure is also convenient to install, and the installation mode of each heat sink 100 is the same, which improves the installation efficiency.

[0059] For example, the first substrate 113 of the heat sink 100 is connected with the inverter power tube 310, and the second substrate 114 of the heat sink 100 is connected with one of the utility power device and the battery power device in the rectifier power tube 410, that is, the utility power device and the battery power device are connected with the second substrate 114 of different heat sinks 100. For example, the first substrate 113 of the same heat sink 100 is connected with the inverter power tube 310, and the second substrate 114 is connected with the utility power device. In the utility power state, the first substrate 113 and the second substrate 114 both generate heat, and in the battery power state, only the first substrate 113 generates heat. The first substrate 113 of another heat sink 100 is connected with the inverter power tube 310, and the second substrate 114 is connected with the battery power device. In the utility power state, only the first substrate 113 generates heat, and in the battery power state, the first substrate 113 and the second substrate 114 both generate heat.

[0060] The above merely describes the preferred embodiments of the present application, but is not used to limit the protection scope of the present application.

Claims

1. A power module, characterized by The power module comprises: a heating device comprising a first power device and a second power device; the first power device is adapted to work in cooperation with the second power device, the second power device comprises a first sub-power device and a second sub-power device working alternately with each other; and a plurality of heat sinks, the heat sink comprises a substrate for connecting the first power device, the substrate is also used for connecting the first sub-power device and / or the second sub-power device; a circuit board member comprising a first PCB board and a second PCB board arranged in parallel with each other and respectively used for electrically connecting the first power device and the second power device, each of the heat sinks is fixedly arranged between the first PCB board and the second PCB board; the heat sink further comprises a first fin group, the substrate comprises a first substrate and a second substrate respectively used for connecting the first power device and the second power device, the first fin group is connected with the first substrate and the second substrate to conduct heat away from the first substrate and the second substrate; the first substrate and the second substrate are connected perpendicularly to each other; the first substrate is parallel to the first PCB board and the second PCB board, and the second substrate is perpendicular to the first PCB board and the second PCB board; the first fin group comprises a plurality of first fins extending in the same direction and arranged at intervals; part of the first fins are connected to the first substrate, and part of the first fins are connected to the second substrate; the interval direction of each of the first fins is at an angle to the first substrate and the second substrate; the substrate has opposite first and second sides, the first side is used for connecting the heating device, and the second side is used for connecting the first fin group; wherein the first side comprises a first substrate first side and a second substrate first side, and the second side comprises a first substrate second side and a second substrate second side; the first substrate first side is used for connecting the first power device, and the second substrate first side is used for connecting the first sub-power device and / or the second sub-power device; part of the first fins are connected to the first substrate second side, and the rest of the first fins are connected to the second substrate second side.

2. The power module of claim 1, wherein: the first fin has a first end and a second end in the extension direction, the first end is connected to the first substrate or the second substrate, and the second end extends away from the first substrate and the second substrate; wherein the second end of each of the first fins is flush with the end face of the first substrate or the end face of the second substrate.

3. A power module according to claim 2, characterised in that: the heat sink further comprises a concentrated heat conduction part and a second fin group, the concentrated heat conduction part is connected to the first substrate second side and the second substrate second side respectively, and the second fin group comprises a plurality of second fins connected to the concentrated heat conduction part.

4. A power module according to claim 3, characterised in that: the concentrated heat conduction part has a triangular structure. The extending direction of the second heat dissipation fin is parallel to the extending direction of the first heat dissipation fin, and the extending direction of the second heat dissipation fin is perpendicular to the first connecting surface, which is a plane formed by the connecting position of the second heat dissipation fin and the concentrated heat conduction part.

5. The power module of claim 1, wherein: The number of the heat sinks is multiple, and multiple heat sinks are arranged at intervals along the length direction of the second PCB, which is perpendicular to the plane where the first side of the second substrate is located. The first PCB and the second PCB are connected to multiple groups of bus capacitors, the bus capacitors are located between the first PCB and the second PCB, and one group of bus capacitors is close to one heat sink.

6. An uninterruptible power supply, characterized by: The power module comprises the power module as claimed in any one of claims 1-5; wherein the first power device is an inverter power tube, and the second power device is a rectifier power tube; the first sub-power device is a mains power device, and the second sub-power device is a battery power device.

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