Encapsulating circuit modules and module encapsulation methods

Abstract

The application discloses a kind of encapsulated circuit module and module packaging method, the encapsulated circuit module includes first printed circuit board and at least one chip package module, first printed circuit board includes: at least one preset area, at least one preset area is one-to-one corresponding matching with at least one chip package module, so that each chip package module is encapsulated in the preset area corresponding to each chip package module;Circuit network, circuit network is electrically connected with control chip package module and cache chip package module and flash memory chip package module.This application is matched with the preset area of chip package module by being set on first printed circuit board, for different circuit design, it can be encapsulated in the preset area of uniformity with the preset area matching chip package module, without adjusting packaging process, so as to improve the efficiency of encapsulation.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a packaged circuit module and a module packaging method. BACKGROUND

[0002] With the rapid development of information technology, packaged circuit modules are increasingly widely used in various electronic devices. A packaged circuit module is a kind of microelectronic component that encapsulates multiple electronic components (such as transistors, resistors, capacitors, and chip packaging modules) and their circuit networks on one or several substrates (such as printed circuit boards) to complete certain circuit or system functions. Packaging is an important link in the production process of a packaged circuit module, which includes encapsulating a chip packaging module on a printed circuit board to realize the electrical connection between the chip packaging module and the printed circuit board.

[0003] With the current module packaging method, in the actual production process, a printed circuit board and a packaging process need to be customized for different circuit designs, and multiple chip packaging modules are packaged on the customized printed circuit board according to the customized packaging process to obtain a packaged circuit module.

[0004] However, customizing a printed circuit board and a packaging process often leads to frequent adjustment of the production line, increases the production preparation time and cost, and reduces the packaging efficiency. SUMMARY

[0005] To address the deficiencies of the prior art, the present application provides a packaged circuit module and a module packaging method. By providing a preset area on a first printed circuit board that matches a chip packaging module, the chip packaging module that matches the preset area can be packaged in the unified preset area for different circuit designs without adjusting the packaging process, thereby improving the packaging efficiency.

[0006] To solve the above problems, the present application provides the following technical solutions:

[0007] In a first aspect, the embodiments of the present application provide a packaged circuit module, which includes a first printed circuit board and at least one chip packaging module. The at least one chip packaging module includes a control chip packaging module, a cache chip packaging module, and a flash memory chip packaging module. The first printed circuit board includes:

[0008] at least one preset region corresponding to each of the chip package modules, so that each of the chip package modules is encapsulated in the preset region corresponding to each of the chip package modules, wherein the at least one preset region comprises a control region, a cache region and a flash region, the control region corresponds to the control chip package module, the cache region corresponds to the cache chip package module, and the flash region corresponds to the flash chip package module;

[0009] a circuit network electrically connecting the control chip package module, the cache chip package module and the flash chip package module.

[0010] In some embodiments, each of the chip package modules comprises a plurality of pins, and the pins of each of the chip package modules have a matched first interface in the circuit network.

[0011] In some embodiments, the chip package module comprises an input / output pin, and the input / output pin has a matched first input interface in the circuit network.

[0012] The circuit network comprises a conversion circuit module, and the conversion circuit module comprises at least one second interface, different second interfaces corresponding to chip package modules with different working voltages.

[0013] The first input interface is electrically connected to one of the second interfaces according to the working voltage of the chip package module, and different second interfaces are electrically connected to corresponding first input interfaces by jumpers with different resistances.

[0014] In some embodiments, a preset frame is arranged on the preset region, and the preset frame is used to accommodate at least two chip package modules corresponding to the preset region and stacked.

[0015] In some embodiments, the preset frame comprises an electrical connection structure, and at least two chip package modules are electrically connected to the circuit network through the electrical connection structure when the at least two chip package modules are stacked in the preset frame.

[0016] In some embodiments, at least two chip package modules are electrically connected through the electrical connection structure.

[0017] In some embodiments, the electrical connection structure is a conductive column.

[0018] In a second aspect, the embodiments of the present application provide a module encapsulation method, and the module encapsulation method comprises:

[0019] Obtaining a first printed circuit board and at least one chip package module as described in the first aspect;

[0020] Packaging each of the chip package modules in the corresponding preset area of the first printed circuit board to obtain a packaged circuit module.

[0021] In some embodiments, the preset area is provided with a preset frame, and the preset frame includes an electrical connection structure. The packaging of each of the chip package modules in the corresponding preset area of the first printed circuit board includes:

[0022] Traversing the at least one chip package module one by one, determining the corresponding preset area of the chip package module in the first printed circuit board, and determining a first interface matched with each pin of the chip package module in the circuit network;

[0023] Installing the chip package module in the preset frame of the corresponding preset area of the chip package module, and connecting each pin of the chip package module to the matched first interface through the electrical connection structure of the preset frame, and traversing the next chip package module.

[0024] In some embodiments, the method further includes:

[0025] Determining the working voltage and the input / output pin of the chip package module;

[0026] Connecting the input / output pin to the matched first interface through the electrical connection structure of the preset frame, and connecting the first interface to the second interface corresponding to the working voltage in the plurality of second interfaces in the conversion circuit module of the circuit network.

[0027] The present application provides a packaged circuit module and a module packaging method. The present application sets a preset area matched with a chip package module on a first printed circuit board. For different circuit designs, the chip package module matched with the preset area can be packaged in the unified preset area without adjusting the packaging process, thereby improving the packaging efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a schematic diagram of the first embodiment of the packaged circuit module provided by the present application.

[0029] Figure 2 is a schematic diagram of the first printed circuit board provided by the present application.

[0030] Figure 3 is a schematic diagram of the second embodiment of the packaged circuit module provided by the present application.

[0031] Figure 4 is a cross-sectional view of a preset frame provided by an embodiment of the present application.

[0032] Figure 5 is a schematic diagram of a first printed circuit board of a third electrical connection structure of a first embodiment.

[0033] Figure 6 is a schematic diagram of a first printed circuit board of a third electrical connection structure of a second embodiment.

[0034] Figure 7 is a schematic diagram of a three-layer printed circuit board stack provided by an embodiment of the present application.

[0035] Figure 8 is a flowchart of a first embodiment of a module packaging method provided by an embodiment of the present application.

[0036] Figure 9 is a detailed flowchart of step S200 in Figure 8

[0037] Figure 10 is a flowchart of a second embodiment of a module packaging method provided by an embodiment of the present application.

[0038] Figure 11 is a flowchart of a third embodiment of a module packaging method provided by an embodiment of the present application. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0040] In addition, the terms "first", "second" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0041] The present application provides a circuit module packaging method and a module packaging method. By setting a preset area matching the chip packaging module on the first printed circuit board, the chip packaging module matching the preset area can be packaged in the unified preset area for different circuit designs without adjusting the packaging process, thereby improving the packaging efficiency.​

[0042] The packaging circuit module provided by the present application will be described in detail below with reference to the accompanying drawings.

[0043] Please refer to Figure 1 , Figure 1 is a schematic diagram of the first embodiment of the packaging circuit module provided by the present application. As Figure 1 shown, in some embodiments, the packaging circuit module 10 includes a first printed circuit board 100 and at least one chip packaging module 200. The first printed circuit board 100 is a plate-shaped structure for supporting and connecting electronic components, and the chip packaging module 200 refers to a module for packaging chip components in a specific housing so that the chip components are connected and fixed with other electronic components. The first printed circuit board 100 includes a circuit network (the circuit network is more complex, Figure 1 not shown in the figure) for electrically connecting the at least one chip packaging module 200.

[0044] In some embodiments, the chip packaging module 200 includes a chip component, a circuit for connecting the contacts on the chip component, and a plurality of pins 201 electrically connected to the circuit.

[0045] In some embodiments, the chip packaging module 200 includes a plurality of chip components, a circuit for connecting the contacts on the plurality of chip components, and a plurality of pins 201 electrically connected to the circuit. In this way, compared with the way that the chip packaging module includes one chip component, the chip packaging module including a plurality of chip components can have a larger storage space; when the uses of the plurality of chip components are different, the chip packaging module can perform more complex functions.

[0046] In some embodiments, the number of chip packaging modules 200 can be at least one, for example, the number of chip packaging modules 200 can be one, two, three, four, five, or ten, etc.

[0047] As Figure 1 shown, optionally, the at least one chip packaging module 200 can include a control chip packaging module 210, a cache chip packaging module 220, and a flash memory chip packaging module 230.

[0048] But the present application is not limited to Figure 1 the embodiments shown, in some embodiments, the packaging circuit module 10 can include other electronic components, for example, can include resistors, capacitors, inductors, diodes, triodes, or various sensor components, etc.

[0049] In some embodiments, the packaged circuit module 10 can be a SSD (Solid State Disk), and the at least one chip package module 200 can include a control chip package module 210, a cache chip package module 220, and a flash chip package module 230.

[0050] In some embodiments, the control chip package module 210 is configured to manage data and instructions in the packaged circuit module, the cache chip package module 220 is configured to temporarily store frequently accessed data and instructions, and the flash chip package module 230 is configured to store data.

[0051] In some embodiments, the control chip package module 210 can be electrically connected to the cache chip package module 220 and the flash chip package module 230 respectively, and store received data that needs to be quickly accessed in the cache chip package module 220 and store data that is not frequently accessed in the flash chip package module 230.

[0052] In some embodiments, the cache chip package module 220 is electrically connected to the flash chip package module 230, and the cache chip package module 220 can store data that is not frequently accessed in the flash chip package module 230.

[0053] However, the present application is not limited thereto, and in some embodiments, the packaged circuit module 10 can further include other types of chip package modules 200, such as quantum computing chip package modules, etc.

[0054] Please refer to Figure 2 , Figure 2 is a schematic view of a first printed circuit board provided by an embodiment of the present application. As shown in Figure 1 and Figure 2 , in some embodiments, the first printed circuit board 100 includes at least one preset area 110 (since the preset area 110 coincides with the shape of the chip package module 200 in Figure 1 , the preset area 110 is not shown in Figure 1In the circuit diagram (not marked with a preset area 110), at least one preset area 110 corresponds one-to-one with at least one chip packaging module 200, so that each chip packaging module 200 is packaged in the preset area 110 corresponding to each chip packaging module 200. Specifically, the preset area 110 matches the shape of its corresponding chip packaging module 200. The preset area 110 refers to the area of ​​the first printed circuit board 100 covered by the chip packaging module 200 excluding the pins 201 when its corresponding chip packaging module 200 is packaged on the first printed circuit board 100, and a first interface 120 is provided on the outer periphery of the preset area for matching and electrically connecting with the pins 201 of the chip packaging module. In this way, for different circuit designs, chip packaging modules matching the preset area can be packaged in a unified preset area without adjusting the packaging process, thereby improving packaging efficiency.

[0055] Optionally, the preset area 110 can be partially hollowed out. This method facilitates heat dissipation of the chip packaging module, thereby improving its lifespan, and also reduces the weight of the packaging circuit module, making electronic devices with the packaged circuit module lighter and more portable.

[0056] like Figure 2 As shown, in some embodiments, at least one preset region 100 includes a control region 111, a cache region 112, and a flash memory region 113. For example... Figure 1 and Figure 2 As shown, Figure 2 Control area 111 and Figure 2 The control chip package module 210 in the middle is matched accordingly. Figure 2 Cache area 112 and Figure 3 The cache chip packaging module 220 in the middle is matched accordingly. Figure 3 Flash memory region 113 and Figure 3 The flash memory chip packaging module 230 in the middle is matched accordingly.

[0057] In some implementations, the first printed circuit board includes a circuit network (not shown) that electrically connects at least one chip package module to realize the function of the packaged circuit module.

[0058] In some implementations, the circuit network electrically connects the control chip package module, the cache chip package module, and the flash memory chip package module. Specifically, the circuit network electrically connects each of the control chip package module, the cache chip package module, and the flash memory chip package module in pairs.

[0059] like Figure 4 and Figure 4As shown, in some embodiments, each chip package module 200 includes a plurality of pins 201, and each pin 201 of the chip package module 200 has a matching first interface 120 in the circuit network.

[0060] Optionally, the first interface 120 is a hole with conductive periphery. When the chip packaging module 200 is packaged on the first printed circuit board 100, each pin 201 is inserted into the matching first interface 120, and the pin 201 is soldered to the matching first interface 120 to achieve electrical connection between the pin 201 and the first interface 120 and fix the chip packaging module 200 on the first printed circuit board 100.

[0061] In some implementations, different chip packaging modules correspond to different operating voltages, and the chip packaging module can only work normally when its corresponding operating voltage is applied.

[0062] In some implementations, the chip package module 200 includes input / output pins, also known as I / O pins, which have corresponding operating voltage requirements. The chip package module can only function normally when the voltage at the input / output pins is at the corresponding operating voltage. Therefore, the voltage at the input / output pins needs to be set to their corresponding operating voltage.

[0063] like Figure 4 and Figure 4 As shown, in some embodiments, the first interface 120 mating with pin 201 includes a first input interface 121, and the input / output pin has a mating first input interface 121 in the circuit network.

[0064] like Figure 4 As shown, in some implementations, the circuit network ( Figure 4 (Not shown) includes a conversion circuit module, which includes at least one second interface 130. Different second interfaces 130 correspond to chip package modules 200 with different operating voltages. Specifically, different second interfaces 130 output different voltage values, each second interface 130 corresponds to one voltage value, and each second interface corresponds to a chip package module 200 with one operating voltage.

[0065] Optionally, the number of second interfaces 130 can be at least one, for example, the number of second interfaces 130 can be 1, 2, 3 or 5, etc.

[0066] However, this application is not limited to Figure 4 In the embodiment shown, each first interface 120 can have at least one corresponding second interface 130 in the circuit network.

[0067] Optionally, for each first input interface 121, whether to set the second interface 130 corresponding thereto in the circuit network and how many second interfaces 130 corresponding thereto to set can be determined according to the actual working requirements of the chip packaging module 200.

[0068] In some embodiments, the conversion circuit module can include a plurality of groups of resistance modules, each second interface 130 can access or short-circuit a group of resistance modules, and by selecting to access or short-circuit different resistance modules corresponding to the second interfaces 130 in the circuit network, the voltage at the first input interface 121 can be adjusted, for example, the voltage at the first input interface 121 is raised or lowered.

[0069] In some embodiments, the first input interface is electrically connected to one of the second interfaces according to the working voltage of the chip packaging module. The working voltage of the chip packaging module refers to the input voltage required by the chip packaging module when it is working normally. If the input voltage of the chip packaging module is greater than the working voltage, the chip packaging module can be damaged, and if the input voltage of the chip packaging module is less than the working voltage, the chip packaging module can not work normally.

[0070] Optionally, the working voltage of the chip packaging module is the working voltage corresponding to the input / output pin, and the voltage value output from the at least one second interface according to the working voltage of the chip packaging module is the target second interface whose voltage value is the working voltage corresponding to the input / output pin. The input / output pin is electrically connected to the first input interface, the first input interface is electrically connected to the target second interface, so that the voltage at the first input interface is the working voltage corresponding to the input / output pin.

[0071] Please refer to Figure 5 , Figure 5 is a schematic diagram of a second embodiment of the packaging circuit module provided by the present application. As Figure 5 shown, in some embodiments, a second interface 130 is electrically connected to the corresponding first input interface 121 by using a jumper 140. For example, the conversion circuit module can include a plurality of groups of resistance modules, and by electrically connecting the second interface 130 to the corresponding first input interface 121 by using the jumper 130, different resistance modules corresponding to the second interfaces 130 in the circuit network can be selected to be accessed or short-circuited, so as to adjust the voltage value at the first input interface 121.

[0072] In some embodiments, different second interfaces 130 are electrically connected to corresponding first input interfaces 121 by jumpers 140 with different resistances. Specifically, one second interface 130 corresponds to jumpers 140 with a certain resistance, and the second interface 130 can be electrically connected to its corresponding first input interface 121 by jumpers 140 with the resistance corresponding to the second interface 130. In this way, jumpers with different resistances can themselves adjust the voltage value output by the second interface, thereby facilitating the simplification of the design of the conversion circuit module.

[0073] In some embodiments, when one second interface is electrically connected to a corresponding first input interface by a jumper with different resistance, the first input interface outputs different voltages, that is, different resistances of the jumpers correspond to different voltages output by the first input interface, and the voltage value output by the first input interface can be adjusted to the working voltage value of the input / output pin by selecting the resistance of the jumper. For example, when a flash memory chip package module needs to be replaced, the working voltage of the new flash memory chip package module is 1.2V (volts) and the working voltage of the old flash memory chip package module is 1.8V, a suitable resistance jumper is selected to electrically connect one second interface to a corresponding first input interface, and the resistance in the circuit through the jumper has a voltage dividing effect, which can convert the voltage output by the first input interface from 1.8V to 1.2V. In this way, the function of converting the voltage can be realized by jumpers with different resistances, and the conversion circuit module at the second interface can only include resistance jumpers without other electronic components, thereby further simplifying the design of the conversion circuit module.

[0074] In this way, the voltage at the first input interface can be converted, so that the preset area can be compatible with chip package modules of the same type with multiple working voltages, and can adapt to the needs of different circuit designs. In addition, when a chip package module needs to be replaced, if the working voltages of the original chip package module and the new chip package module are different, the circuit network does not need to be redesigned, and the voltage input by the chip package module can be adjusted through the reserved second interfaces, thereby facilitating the maintenance of the package circuit module.

[0075] In some embodiments, at least two chip package modules can be stacked in the preset area.

[0076] In this way, the number of chip package modules in the package circuit module can be increased without increasing the area of the first printed circuit board, the computing power or storage capacity of the package circuit module can be improved, and the package circuit module can implement more complex functions.

[0077] In some embodiments, a preset frame is provided on the preset area, and the preset frame is used to accommodate at least two chip package modules corresponding to the preset area and stacked. In this way, the number of chip package modules in the package circuit module can be increased without increasing the area of the first printed circuit board, the computing power or storage capacity of the package circuit module can be improved, and the package circuit module can implement more complex functions.

[0078] Optionally, the chip packaging modules are mounted in the preset frame when the at least two chip packaging modules are stacked on the preset area.

[0079] In this way, the at least two chip packaging modules can be stacked on the preset area, the number of the chip packaging modules in the packaged circuit module can be increased without increasing the area of the first printed circuit board, the computing power or storage capacity of the packaged circuit module can be increased, the packaged circuit module can realize more complex functions, and the packaged circuit module is easy to process and maintain.

[0080] Optionally, the number of the stacked chip packaging modules is more than 2, for example, the number of the stacked chip packaging modules is 2, 3, 5, 10, 16, 20 or 30, etc.

[0081] In some embodiments, the preset frame includes a first electrical connection structure, and when the at least two chip packaging modules are stacked in the preset frame, the at least two chip packaging modules are electrically connected to the circuit network through the first electrical connection structure.

[0082] In some embodiments, the first electrical connection structure is arranged in the preset frame according to the type of the chip packaging module, and each first electrical connection structure matches one pin of the chip packaging module.

[0083] Optionally, the number of the first electrical connection structure is at least 2, for example, the number of the first electrical connection structure is 2, 3, 4, 5, 10 or 20, etc.

[0084] Please refer to Figure 5 , Figure 5 is a schematic cross-sectional view of the preset frame provided by the embodiments of the present application. As Figure 5 shown, in some embodiments, a preset frame 114 is arranged on the preset area, and the preset frame 114 is used to accommodate at least two chip packaging modules 200 stacked and matched with the preset area. Figure 6 Three chip packaging modules 200 stacked in the preset frame 114 are shown in

[0085] As Figure 6 shown, in some embodiments, the preset frame 114 includes a plurality of first electrical connection structures 150, and when three chip packaging modules 200 are stacked in the preset frame 114, the three chip packaging modules 200 are electrically connected to the circuit network through the first electrical connection structure 150.

[0086] Optionally, the number of the first electrical connection structure 150 can be at least 2, for example, the number of the first electrical connection structure 150 can be 2, 3, 4, 5 or 10, etc.

[0087] AsFigure 6 As shown, in some embodiments, the first electrical connection structure 150 is arranged on the surface of the preset frame 114 close to the first printed circuit board 100, and the first electrical connection structure 150 electrically connects the preset frame 114 and the first interface 120, thereby electrically connecting the chip package module 200 in the preset frame 114 and the circuit network of the first printed circuit board 100.

[0088] Optionally, the first electrical connection structure 150 of the preset frame 114 is welded or bonded with the corresponding first interface 120 on the first printed circuit board 100.

[0089] In some embodiments, the second electrical connection structure is arranged on the surface of the first printed circuit board close to the preset frame, and the second electrical connection structure electrically connects the preset frame and the first interface.

[0090] In some embodiments, at least two chip package modules are stacked in the preset frame, and then the preset frame is packaged in the corresponding preset area on the first printed circuit board. In this way, at least two chip package modules can be stacked in the preset area, and the processing efficiency is improved.

[0091] In some embodiments, the at least two chip package modules are electrically connected through the first electrical connection structure.

[0092] As shown, the three chip package modules 200 are electrically connected through the plurality of first electrical connection structures 150. Figure 6

[0093] In some embodiments, the sub-circuit network of the preset area is constructed by the plurality of first electrical connection structures in the preset frame, the sub-circuit network electrically connects the at least two chip package modules in the preset frame, and is used to realize the corresponding function of the preset area.

[0094] Optionally, the plurality of first electrical connection structures can be connected to each other.

[0095] For example, the sub-circuit network of the control area is constructed by the plurality of first electrical connection structures in the preset frame of the control area, the at least two control chip package modules are electrically connected, and all the control chip package modules are electrically connected with the circuit network, so that the corresponding control function of the control area can be realized.

[0096] In some embodiments, the plurality of first electrical connection structures 150 are divided into at least two groups of first electrical connection structures 150, each group of first electrical connection structures 150 has a different function.

[0097] ​Optionally, the plurality of electrical connection structures 150 are divided into two groups of electrical connection structures 150, the first group of electrical connection structures 150 being used to supply power to the at least two chip package modules 200, and the second group of electrical connection structures 150 being used to transmit data.

[0098] In some embodiments, the first electrical connection structure is a conductive pillar, which is a columnar structure that is electrically conductive.

[0099] Optionally, the conductive pillar can be a cylinder or a prism.

[0100] In some embodiments, the first electrical connection structure connected to the chip package module is a micro circuit board, which includes an interface matching the pins of the chip package module and a sub-circuit network.

[0101] In some embodiments, the package circuit module includes a plurality of printed circuit boards. In this way, the integration level of the package circuit module can be improved, thereby facilitating the reduction of the size of the package circuit module.

[0102] In some embodiments, at least two printed circuit boards can be stacked, and the number of stacked printed circuit boards can be two or more, such as two, three, four, five, six, seven, eight, or nine, etc.

[0103] Please refer to Figure 6 , Figure 6 is a schematic diagram of a first embodiment of a third electrical connection structure of a first printed circuit board provided by the embodiments of the present application. In Figure 6 , two printed circuit boards are stacked. As Figure 7 indicated, in some embodiments, the first printed circuit board 100 further includes a third electrical connection structure 160, which is used to electrically connect the first printed circuit board 100 and the second printed circuit board 300 when the second printed circuit board 300 is stacked on the first printed circuit board 100.

[0104] Optionally, the number of third electrical connection structures 160 can be at least two, such as two, three, four, five, or ten, etc.

[0105] In some embodiments, the second printed circuit board includes a first electrical contact area matching the third electrical connection structure, which is located in the circuit network of the second printed circuit board. When the second printed circuit board is stacked on the first printed circuit board, the third electrical connection structure of the first printed circuit board contacts the first electrical contact area of the second printed circuit board, thereby realizing the electrical connection between the two.

[0106] As Figure 7 indicated, optionally, the first electrical contact area includes a contact 310.

[0107] In some implementations, the third electrical connection structure is a conductive pillar, which is a conductive columnar structure.

[0108] Alternatively, the conductive post can be a cylinder or a prism.

[0109] like Figure 7 As shown, in some embodiments, the third electrical connection structure 160 is a conductive cylinder, and the first electrical contact area of ​​the second printed circuit board 300 includes contacts 310 that match the conductive cylinders one by one. When the second printed circuit board 300 is stacked on the first printed circuit board 100, the conductive cylinders of the first printed circuit board 100 and their matching contacts 310 are soldered or bonded together with conductive materials. In this way, not only can the electrical connection between the first and second printed circuit boards be achieved, but the first and second printed circuit boards can also be fixed together simultaneously.

[0110] Please see Figure 7 , Figure 7 This is a schematic diagram of a second embodiment of the third electrical connection structure of the first printed circuit board provided in this application. Figure 7 In this case, two layers of printed circuit boards are stacked. For example... Figure 7 As shown, in some embodiments, the third electrical connection structure 160 is a conductive prism. The first electrical contact area of ​​the second printed circuit board 300 includes holes 320A that match the conductive prisms one by one. The periphery of the holes 320A is conductive. When the second printed circuit board 300 is stacked on the first printed circuit board 100, the conductive prisms of the first printed circuit board 100 are inserted into the matching holes 320A, and the conductive prisms and holes 320A are soldered or bonded together using a conductive material. In this way, not only can the electrical connection between the first and second printed circuit boards be achieved, but the matching relationship between the conductive prisms and holes can also prevent the second printed circuit board from moving relative to the first printed circuit board, thereby improving the firmness of their fixation.

[0111] like Figure 8 As shown, in some embodiments, the third electrical connection structure 160 can be one, for example... Figure 8 There is one conductive prism in the sample.

[0112] like Figure 8 As shown, in some embodiments, when the second printed circuit board 300 is stacked on the first printed circuit board 100, an insulating material 400 may be filled between the first printed circuit board 100 and the second printed circuit board 300. The insulating material 400 can support the second printed circuit board 300 and fix the second printed circuit board 300 on the first printed circuit board 100. It can also prevent the circuit network of the second printed circuit board 300 from making improper contact with the circuit network of the first printed circuit board 100, which would cause a short circuit in the packaged circuit module.

[0113] In some embodiments, the third electric connection structure is a conductive socket, and the first electric contact area of the second printed circuit board comprises a conductive block matching the conductive socket, and the conductive socket of the first printed circuit board is clamped with the matching conductive block when the second printed circuit board is stacked on the first printed circuit board.

[0114] In some embodiments, the third electric connection structure is a conductive block, and the first electric contact area of the second printed circuit board comprises a conductive socket matching the conductive block, and the conductive block of the first printed circuit board is clamped with the matching conductive socket when the second printed circuit board is stacked on the first printed circuit board.

[0115] Through the clamping of the conductive socket and the conductive block, not only the electric connection between the first printed circuit board and the second printed circuit board can be achieved, but also the firmness of the two can be improved; in addition, when clamped tightly, the conductive socket and the matching conductive block do not need to be welded or bonded, and the processing flow can be simplified.

[0116] Please refer to Figure 9 , Figure 9 is a schematic diagram of the three-layer printed circuit board stack provided by the embodiments of the present application. As shown in Figure 8 , in some embodiments, the first printed circuit board 100 is electrically connected with the second printed circuit board 300 through the third electric connection structure 160, and the second printed circuit board 300 is electrically connected with the third printed circuit board 500 through the fourth electric connection structure 330.

[0117] As shown in Figure 9 , the second printed circuit board 300 further comprises the fourth electric connection structure 330, and the second printed circuit board 300 is electrically connected with the third printed circuit board 500 through the fourth electric connection structure 330 when the third printed circuit board 500 is stacked on the second printed circuit board 300.

[0118] As shown in Figure 10 , in some embodiments, the third electric connection structure 160 and the fourth electric connection structure 330 are both conductive cylinders, the first electric contact area of the second printed circuit board 300 comprises a hole 320B matching the conductive cylinder one by one, and the second electric contact area of the third printed circuit board 500 comprises a hole 510 matching the conductive cylinder one by one, and the hole periphery can be conductive, when the three-layer printed circuit board is stacked, the conductive cylinder of the first printed circuit board 100 is inserted into the matching hole 320B, and the conductive cylinder of the second printed circuit board 300 is inserted into the matching hole 510, so that the first printed circuit board 100 is electrically connected with the second printed circuit board 300, and the second printed circuit board 300 is electrically connected with the third printed circuit board 500.

[0119] As shown in Figure 10As shown, optionally, when the multi-layer printed circuit board is stacked, insulating material 400 can be filled between adjacent printed circuit boards, which can fix the printed circuit boards and prevent short circuit of the packaged circuit module caused by improper contact between the circuit networks of adjacent printed circuit boards.

[0120] Optionally, the conductive cylinder and the matching hole can be welded or bonded by a conductive material.

[0121] However, the present application is not limited thereto, and in some embodiments, more than 3 layers of printed circuit boards can be stacked, for example, a fourth printed circuit board can be stacked on the third printed circuit board 500, and so on.

[0122] In some embodiments, each printed circuit board includes a first surface and a second surface opposite to the first surface, the first surface can be provided with an electrical contact area matching the electrical connection structure of the next layer of printed circuit board, and the second surface can be provided with an electrical connection structure matching the electrical contact area of the previous layer of printed circuit board. In this way, the electrical connection of the multi-layer printed circuit board can be achieved.

[0123] In some embodiments, when one surface of the target printed circuit board does not need to be electrically connected with other printed circuit boards, the surface can not be provided with an electrical contact area or an electrical connection structure. For example, as shown in Figure 10 As shown, the surface of the third printed circuit board 500 away from the second printed circuit board 300 can not be provided with an electrical connection structure.

[0124] In the above manner, the multi-layer printed circuit board can be electrically connected in layers, and the integration level of the packaged circuit module can be improved, thereby facilitating the reduction of the size of the packaged circuit module.

[0125] In some embodiments, the material of the first electrical connection structure is any one of silicon, metal alloy, conductive polymer, metal gel and graphite material, the material of the second electrical connection structure is any one of silicon, metal alloy, conductive polymer, metal gel and graphite material, the material of the third electrical connection structure is any one of silicon, metal alloy, conductive polymer, metal gel and graphite material, and the material of the fourth electrical connection structure is any one of silicon, metal alloy, conductive polymer, metal gel and graphite material.

[0126] In addition to the packaged circuit module as described above, the present application also provides a module packaging method for manufacturing the packaged circuit module as described above. The module packaging method provided by the present application is described in detail below.

[0127] Please refer to Figure 11 , Figure 11 is a flowchart of the first embodiment of the module packaging method provided by the present application. As shown in Figure 11As shown, the module packaging method comprises steps S100 to S200.

[0128] Step S100: Obtain the first printed circuit board and the at least one chip packaging module as described above.

[0129] Step S200: Package each chip packaging module in the corresponding preset area of the first printed circuit board to obtain a packaged circuit module.

[0130] Please refer to ​ , ​ is ​ the detailed flowchart of step S200. As shown, step S200 comprises steps S210 to S220. ​

[0131] Step S210: Traverse the at least one chip packaging module one by one, determine the corresponding preset area of the chip packaging module in the first printed circuit board, and determine the first interface matching each pin of the chip packaging module in the circuit network.

[0132] Optionally, the model of the chip packaging module corresponding to each preset area can be predefined, and the first interface matching each pin of the chip packaging module can be preset on the first printed circuit board according to the model of the chip packaging module corresponding to each preset area.

[0133] Optionally, the corresponding preset area of the chip packaging module and the first interface matching each pin of the chip packaging module can be determined according to the model of the chip packaging module.

[0134] Step S220: Install the chip packaging module in the preset frame of the corresponding preset area of the chip packaging module, make each pin of the chip packaging module connected with the matching first interface through the electrical connection structure of the preset frame, and traverse the next chip packaging module.

[0135] In some embodiments, the at least two chip packaging modules are stacked in the preset frame first, and then the preset frame is packaged in the corresponding preset area on the first printed circuit board. In this way, the at least two chip packaging modules can be stacked in the preset area conveniently, and the processing efficiency is improved.

[0136] In some embodiments, the corresponding preset frame is packaged in the preset area first, and then the chip packaging module is installed in the preset frame of the corresponding preset area of the chip packaging module.

[0137] In step S220, when all the chip packaging modules are traversed, the traversal is ended.

[0138] Please refer to ​ , ​ ​is a flowchart of a second embodiment of the module packaging method provided by the present application. As shown in ​ The module packaging method further includes steps S300 to S400.

[0139] Step S300: Determine the working voltage and input / output pins of the chip packaging module.

[0140] In some embodiments, the working voltage and input / output pins of the chip packaging module are determined according to the model of the chip packaging module.

[0141] Optionally, the specification corresponding to the chip packaging module can be found according to the model of the chip packaging module, and the specification can record various parameters of the chip packaging module in detail, including the working voltage and input / output pins.

[0142] Step S400: Connect the input / output pins to the matching first interface through the electrical connection structure of the preset frame, and connect the first interface to the second interface corresponding to the working voltage in the conversion circuit module of the circuit network.

[0143] As described above, different second interfaces correspond to chip packaging modules with different working voltages. In some embodiments, the second interface corresponding to the working voltage is selected from the plurality of second interfaces according to the working voltage of the chip packaging module determined in step S300, and the first interface is connected to the second interface corresponding to the working voltage.

[0144] In some embodiments, the first interface is connected to the second interface corresponding to the working voltage by using a jumper. Exemplarily, the conversion circuit module can include a plurality of groups of resistance modules. By electrically connecting different second interfaces to the corresponding first input interface by using a jumper, the corresponding resistance modules can be selected to be connected or short-circuited in the circuit, so as to adjust the voltage value at the first input interface to the working voltage value corresponding to the input / output pins.

[0145] In some embodiments, different second interfaces are electrically connected to the corresponding first input interface by using jumpers with different resistances. In this way, the jumpers with different resistances themselves can adjust the voltage value output by the second interface, thereby facilitating the simplification of the design of the conversion circuit module.

[0146] In this way, the voltage at the first input interface can be converted, so that the preset area can be compatible with chip packaging modules of the same type with matching multiple working voltages, and can adapt to the needs of different circuit designs. In addition, when the chip packaging module needs to be replaced, if the working voltage of the original chip packaging module is different from that of the new chip packaging module, the circuit network does not need to be redesigned, and the voltage input by the chip packaging module is adjusted through the plurality of reserved second interfaces, thereby making the packaging circuit module easy to maintain.

[0147] In some embodiments, the chip package module can be replaced, and the replacement requires that the old chip package module (i.e., the target chip package module) be disassembled first, and then the new chip package module is packaged in the preset area matching the target chip package module.

[0148] Please refer to ​ , ​ is a flowchart of a third embodiment of the module packaging method provided by the embodiments of the present application. As shown in ​ , the module packaging method further includes steps S500 to S600.

[0149] Step S500: When the target chip package module needs to be disassembled, the electrical connection structure connected to each pin of the target chip package module is disconnected.

[0150] Optionally, when each pin of the target chip package module is welded with the corresponding electrical connection structure, the welding area can be heated to melt the welding material, so as to disconnect the electrical connection structure connected to each pin of the target chip package module.

[0151] Step S600: Disassemble the target chip package module.

[0152] In some embodiments, after step S600, a new chip package module can be installed in the preset frame on the preset area matching the target chip package module, and the new chip package module matches the preset area.

[0153] Optionally, the method of installing the new chip package module can refer to steps S200, S300 and S400. For example, the method of installing the new chip package module can include the following steps:

[0154] (1) Determine the electrical connection structure matching each pin of the new chip package module in the circuit network.

[0155] (2) Package the new chip package module in the preset frame in the preset area matching the target chip package module, and connect each pin of the new chip package module to the matching electrical connection structure.

[0156] (3) Determine the working voltage of the new chip package module and the input / output pin.

[0157] (4) Connect the input / output pin to the matching first interface through the matching electrical connection structure, and connect the first interface to the second interface corresponding to the working voltage in the plurality of second interfaces in the conversion circuit module of the circuit network.

[0158] In some embodiments, after the chip packaging module is packaged, the method further comprises: sealing the printed circuit board on which the packaged chip packaging module is arranged with an insulating material. Exemplarily, an insulating layer covering the entire printed circuit board can be formed by using the insulating material, and only at least two connection ports in the circuit network of the printed circuit board for electrical connection with external circuit networks are exposed. In this way, not only can the printed circuit board be prevented from short-circuiting due to water ingress, but the chip packaging module can also be further fixed.

[0159] In summary, the packaging circuit module provided by the embodiments of the present application has the following advantages:

[0160] 1. By arranging a preset area matched with the chip packaging module on the first printed circuit board, the chip packaging module matched with the preset area can be packaged in the unified preset area for different circuit designs without adjusting the packaging process, thereby improving the packaging efficiency.

[0161] 2. By arranging the conversion circuit module and connecting the first input interface with the target second interface, the voltage at the first input interface can be converted, so that the preset area can be compatible with the same type of chip packaging module matching multiple working voltages, and can adapt to the needs of different circuit designs. In addition, when the chip packaging module needs to be replaced, if the working voltage of the original chip packaging module is different from that of the new chip packaging module, the circuit network does not need to be redesigned, and the voltage input by the chip packaging module is adjusted through the reserved multiple second interfaces, so that the packaging circuit module is easy to maintain.

[0162] 3. When the conversion circuit module includes multiple groups of resistance modules, by electrically connecting different second interfaces with corresponding first input interfaces through jumpers, the corresponding resistance modules can be selected to be connected or short-circuited in the circuit, so as to adjust the voltage value at the first input interface.

[0163] 4. By installing the chip packaging module in the preset frame, at least two chip packaging modules can be stacked in the preset area, the number of chip packaging modules in the packaging circuit module can be increased without increasing the area of the first printed circuit board, the computing power or storage capacity of the packaging circuit module can be improved, which is conducive to the packaging circuit module to realize more complex functions, and the packaging circuit module is easy to process and maintain.

[0164] 5. By arranging the second printed circuit board on the first printed circuit board, multiple layers of printed circuit boards can be electrically connected in layers, the integration level of the packaging circuit module can be improved, thereby facilitating the reduction of the size of the packaging circuit module.

[0165] In summary, the application provides a packaging circuit module and a module packaging method. The first printed circuit board comprises: at least one preset area corresponding to at least one chip packaging module, so that each chip packaging module is packaged in the preset area corresponding to each chip packaging module, wherein the at least one preset area comprises a control area, a cache area and a flash area, the control area corresponds to the control chip packaging module, the cache area corresponds to the cache chip packaging module, and the flash area corresponds to the flash chip packaging module; and a circuit network, which electrically connects the control chip packaging module, the cache chip packaging module and the flash chip packaging module. The application sets the preset area corresponding to the chip packaging module on the first printed circuit board. For different circuit designs, the chip packaging module corresponding to the preset area can be packaged in the unified preset area, without adjusting the packaging process, thereby improving the packaging efficiency.

[0166] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the application, and not to limit them; although the application has been described in detail with reference to the foregoing examples, those skilled in the art will understand that the technical solutions described in the foregoing examples can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the application.

Claims

1. A packaged circuit module, characterized by The package circuit module comprises a first printed circuit board and at least one chip package module, the at least one chip package module comprises a control chip package module, a cache chip package module and a flash chip package module, and the first printed circuit board comprises: at least one preset area corresponding to the at least one chip package module, so that each chip package module is packaged in the preset area corresponding to each chip package module, wherein the at least one preset area comprises a control area, a cache area and a flash area, the control area corresponds to the control chip package module, the cache area corresponds to the cache chip package module, and the flash area corresponds to the flash chip package module; a circuit network electrically connecting the control chip package module, the cache chip package module and the flash chip package module; Each of the chip package modules comprises a plurality of pins, and the pins of each of the chip package modules have a matching first interface in the circuit network. The chip package module comprises input / output pins, and the input / output pins have a matching first input interface in the circuit network. The circuit network comprises a conversion circuit module, the conversion circuit module comprises at least one second interface, different second interfaces correspond to chip package modules with different working voltages, the conversion circuit module comprises a plurality of groups of resistance modules, each second interface corresponds to a group of resistance modules or a group of short-circuited resistance modules, and the voltage at the first input interface is adjusted by selecting resistance modules corresponding to different second interfaces to be connected or short-circuited in the circuit network. The first input interface is electrically connected to one of the second interfaces according to the working voltage of the chip package module, and different second interfaces are electrically connected to corresponding first input interfaces by jumpers with different resistances. The preset area is provided with a preset frame for accommodating at least two chip package modules corresponding to the preset area and stacked in the preset frame. The preset frame comprises an electrical connection structure, and when at least two chip package modules are stacked in the preset frame, the at least two chip package modules are electrically connected to the circuit network through the electrical connection structure. The at least two chip package modules are electrically connected through the electrical connection structure; wherein the preset frame comprises a plurality of first electrical connection structures for constructing a sub-circuit network of the preset area, the sub-circuit network electrically connects at least two chip package modules in the preset frame, and is used for realizing the function corresponding to the preset area, and the plurality of first electrical connection structures are connected to each other.

2. The package circuit module according to claim 1, wherein: The electrical connection structure is a conductive column.

3. A module packaging method, characterized by, The module packaging method comprises: obtaining the first printed circuit board and at least one chip package module according to any one of claims 1 to 2; packaging each chip package module in the corresponding preset area of the first printed circuit board to obtain a package circuit module. The preset area is provided with a preset frame, and the preset frame comprises an electrical connection structure; When at least two chip packaging modules are stacked in the preset frame, the at least two chip packaging modules are electrically connected with the circuit network through the electrical connection structure; The at least two chip packaging modules are electrically connected through the electrical connection structure; wherein a sub-circuit network of the preset area is constructed by a plurality of first electrical connection structures in the preset frame, the sub-circuit network electrically connects at least two chip packaging modules in the preset frame, and is used for realizing a corresponding function of the preset area, and the plurality of first electrical connection structures are connected with each other.

4. The module packaging method according to claim 3, wherein The packaging of each chip packaging module in the corresponding preset area of the first printed circuit board comprises: The at least one chip packaging module is traversed one by one, the corresponding preset area of the chip packaging module in the first printed circuit board is determined, and a first interface matched with each pin of the chip packaging module in the circuit network is determined; The chip packaging module is installed in the preset frame of the preset area corresponding to the chip packaging module, and each pin of the chip packaging module is connected with the matched first interface through the electrical connection structure of the preset frame, and the next chip packaging module is traversed.

5. The module packaging method according to claim 4, wherein The method further comprises: The working voltage of the chip packaging module and the input / output pin are determined; The input / output pin is connected with the matched first interface through the electrical connection structure of the preset frame, and the first interface is connected with the second interface corresponding to the working voltage in the plurality of second interfaces of the conversion circuit module of the circuit network.

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