Calibration device for wafer temperature measurement and calibration method thereof

Abstract

The invention relates to the technical field of wafer temperature measurement, and discloses a calibration device for wafer temperature measurement and a calibration method thereof, comprising a wafer, a support is arranged below the wafer, support side plates are fixedly connected to both sides of the support, a thermometer is arranged on the rear side of the support, a transmission line is fixedly connected to the front side of the thermometer, a sensor is fixedly connected to the top of the transmission line, and a wiring port is opened on the top of the support. In the present invention, a limit clamping frame limits the moving range of the transmission line after being fitted, so as to avoid the entanglement of the transmission line, thereby improving the safety and accuracy of the transmitted data, a semicircular arc positioning ring can clamp each transmission line separately, further avoiding the entanglement of the transmission line, and when the semicircular arc positioning ring clamps transmission lines of different thicknesses, the elastic telescopic shaft can be contracted or extended according to the thickness of the transmission line, thereby improving the clamping range and applicability.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer temperature measurement, and in particular to a calibration device for wafer temperature measurement and a calibration method thereof. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, which is the carrier used to produce integrated circuits and is also the basic material for manufacturing integrated circuits or chips.

[0003] Patent No. CN212300648U discloses a wafer cooling chamber temperature measuring device, which directly measures the temperature of the wafer in real time, and provides a guarantee for the consistency of the wafer temperature. The measuring head and the mounting flange of the temperature measuring device are separated, which is convenient for the disassembly and maintenance of the measuring head. Although this patent solves the above problems, it still cannot guarantee the stability of the detection data transmission when using the sensor to measure the temperature of the wafer, resulting in the problem that the detection is prone to errors. Therefore, a calibration device for wafer temperature measurement and its calibration method are proposed to solve the above problems. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a calibration device for wafer temperature measurement and a calibration method thereof in view of the deficiencies in the above-mentioned prior art.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: a calibration device for wafer temperature measurement, including a wafer, a support is arranged under the wafer, support side plates are fixedly connected to the two sides of the support, a thermometer is arranged on the rear side of the support, a transmission line is fixedly connected to the front side of the thermometer, a sensor is fixedly connected to the top of the transmission line, a wiring port is opened on the top of the support, a double-motor linear motor is fixedly connected to the side of the support side plate close to the support, two transmission sliders are slidably connected to the front and rear sides of the upper surface of the double-motor linear motor, and the two said The transmission slider is fixedly connected to one side away from the front and rear ends of the double-motor linear motor, and two transmission rods are fixedly connected to the inner surfaces of the two transmission rods. A clamping block is fixedly connected to the front side of the rear limit clamping frame, and a clamping groove is provided on the rear side of the front limit clamping frame. A sleeve shaft is fixedly connected to the inner surface of the sleeve shaft, and an elastic telescopic shaft is slidably connected to the inner surface of the sleeve shaft. A semicircular arc positioning ring is fixedly connected to the end of the elastic telescopic shaft away from the sleeve shaft. A wafer positioning device for fixing a wafer is arranged above the support, and a useful The invention relates to a detection and protection device for protecting a wafer when measuring the temperature of the wafer. The upper surface of the sensor and the lower surface of the wafer are in contact with each other, and the lower surface of the wafer and the upper surface of the support are in contact with each other. The wafer is placed on the support, and then the sensor is attached to the wafer through the wiring port. After the sensor detects the temperature of the wafer, the temperature data is transmitted to the thermometer through the transmission line, so that the staff can detect the temperature of the wafer, thereby processing the wafer with abnormal temperature. The double-acting linear motor is started, and the double-acting linear motor drives the front and rear transmission slides to approach each other, and the transmission slide The two transmission rods are driven to approach each other and finally fit together, and the transmission rod then drives the two limit clamping frames to fit together to frame the transmission line. After the two limit clamping frames are fitted together, the limit clamping frame on the rear side drives the clamping block to be inserted into the clamping groove provided on the limit clamping frame on the front side. The limit clamping frame drives the two semi-circular arc positioning rings to fit together through the sleeve shaft and the elastic telescopic shaft. When the semi-circular arc positioning ring clamps transmission lines of different thicknesses, the elastic telescopic shaft can be contracted or extended according to the thickness of the transmission line. When the transmission line is affected by the environment and shakes or twists, the semi-circular arc positioning ring and the elastic telescopic shaft are driven to twist in the sleeve shaft to generate friction.

[0006] Preferably, the wafer positioning device includes an arc-shaped clamping plate, an arc-shaped pressure plate, a guide inclined groove, a sliding shaft, a sliding column, and a reset spring. The arc-shaped clamping plate is slidably connected to the upper surface of the support, the sliding column is slidably connected to the inner surface of the arc-shaped clamping plate, the arc-shaped pressure plate is fixedly connected to the top of the sliding column, the guide inclined groove is opened on the inner side of the support, the sliding shaft is slidably connected to the inner surface of the guide inclined groove, and the reset spring is fixedly connected to the lower surface of the arc-shaped pressure plate. The wafer positioning device also includes a delayed transmission frame, a limiting slide groove, a guide shaft, an elastic telescopic rod, an arc-shaped push block, an adaptive slide groove, and the self The adaptive slide groove is arranged on the inner side of the transmission rod, the guide shaft 1 is slidably connected to the inner surface of the adaptive slide groove, the delayed transmission frame is movably connected to the outer surface of the guide shaft 1, the limiting slide groove is arranged on the inner surface of the delayed transmission frame, the elastic telescopic rod is fixedly connected to the inner surface of the limiting slide groove, the arc push block is fixedly connected to the end of the elastic telescopic rod close to the guide shaft 1, the bottom end of the reset spring is fixedly connected to the inner surface of the arc splint, the top end of the sliding shaft is fixedly connected to the bottom surface of the arc splint, the inner arc surface of the arc push block and the circumferential surface of the guide shaft 1 are in contact with each other, and the arc push block and the inner surface of the limiting slide groove are in contact with each other. The arc-shaped clamping plate is connected with the arc-shaped clamping plate by sliding on the surface, and the inner surface of the sliding shaft and the delayed transmission frame near one end of the arc-shaped clamping plate is hinged. The wafer is placed in the middle of the four arc-shaped clamping plates. The arc-shaped clamping plate can clamp the edge of the wafer, and the arc-shaped pressure plate can press the top of the wafer. When encountering wafers of different thicknesses, the arc-shaped pressure plate can be lifted. The arc-shaped pressure plate drives the sliding column to rise, and the reset spring is stretched without separating from the arc-shaped clamping plate. Then the arc-shaped pressure plate is released. The arc-shaped pressure plate is pulled down by the reset spring and automatically adapts to the thickness of the wafer to clamp wafers of different thicknesses. The front and rear transmission rods are close to each other. When approaching, it drives the front and rear guide shafts 1 approaching each other, and the guide shaft 1 drives the front and rear delay transmission frames approaching each other, and the delay transmission frame then drives the sliding shaft to slide in the guide bevel groove 1, and approaches the wafer along the guide bevel groove 1. When the arc-shaped clamp clamps a wafer with a longer diameter, the arc-shaped clamp contacts the edge of the wafer and the guide shaft 1 can continue to slide in the delay transmission frame, thereby clamping the wafer without affecting the mutual fit of the two transmission rods. When the arc-shaped clamp releases the wafer, the arc-shaped push block drives the guide shaft 1 to return to its initial position in the delay transmission frame through the elastic action of the elastic telescopic rod.

[0007] The cam is fixedly connected to the upper surface of the support frame, and the cam is fixedly connected to the lower surface of the support frame, and the cam is connected to the lower surface of the support frame by a plurality of lifting and lowering means. The bottom end is clamped with the outer surface of the limit clamping plate, the bottom end of the guide shaft two is fixedly connected with the upper surface of the delayed transmission frame, the lifting inclined block and the two sides of the outer baffle are fixedly connected, and the sliding shaft drives the delayed transmission frame to move along the guide of the guide inclined slot one when sliding in the guide inclined slot one, and the delayed transmission frame then drives the guide shaft two to slide in the guide inclined slot two, and the guide shaft two drives the transmission inclined plate to approach the wafer along the guide of the guide inclined slot two. When the transmission inclined plate approaches the wafer, the lifting inclined block descends because of the inclined surface of the transmission inclined plate, and the lifting inclined block descends and drives the outer baffle to descend. After the lifting inclined block and the outer baffle are descended, they block the four sides of the wafer. At the same time, the inner frame plate exposed after the lifting inclined block and the outer baffle are descended blocks the gap between the top protective plate and the outer baffle. When the wafer inspection is completed, the guide shaft two moves along the guide inclined slot two in the direction away from the wafer, thereby driving the transmission inclined plate to move in the direction away from the wafer, and the transmission inclined plate pushes the lifting inclined block and the outer baffle to rise through the guidance of the inclined surface.

[0008] A calibration method for a calibration device for wafer temperature measurement comprises the following steps:

[0009] Step 1: First, place the cut wafer on the support, and attach the transmission line and sensor to the wafer through the wiring port;

[0010] Step 2: Then, start the thermometer, the sensor transmits the detected temperature data to the thermometer through the transmission line, and the thermometer displays the detected data;

[0011] Step 3: Then, lift the lifting bevel block and the outer baffle, and then lift the arc-shaped pressing plate to take the wafer out of the arc-shaped clamping plate;

[0012] Step 4: Finally, the staff will check the parts of the wafer with abnormal temperature, process the abnormal parts, and complete the temperature measurement calibration.

[0013] The present invention adopts the above technical solution, which can bring the following beneficial effects:

[0014] 1. The calibration equipment and calibration method for wafer temperature measurement, after the limit clamping frame is fitted, limits the moving range of the transmission line to avoid the entanglement of the transmission line, improves the safety and accuracy of the transmitted data, the semi-circular arc positioning ring can clamp each transmission line individually, further avoiding the entanglement of the transmission line, and the semi-circular arc positioning ring can retract or extend the elastic telescopic shaft according to the thickness of the transmission line when clamping transmission lines of different thicknesses, thereby improving the clamping range and applicability, and the elastic telescopic shaft twists in the sleeve shaft to generate friction, and the friction force can reduce the sliding or twisting amplitude of the transmission line, thereby improving the protection effect of the transmission line, thereby improving its service life and the accuracy of data transmission.

[0015] 2. The calibration equipment and calibration method for wafer temperature measurement, the arc-shaped clamping plate can clamp the edge of the wafer, so that the wafer can remain stable and calibrated during detection, thereby improving the accuracy of detection; at the same time, the arc-shaped pressure plate can press the top of the wafer, further improving the clamping stability; the arc-shaped pressure plate is pulled down by the reset spring and automatically adapts to the thickness of the wafer to clamp wafers of different thicknesses, thereby improving the applicability of clamping; the arc-shaped clamping plate can clamp wafers of different diameters, further improving the applicability of clamping.

[0016] 3. The calibration equipment and calibration method for wafer temperature measurement, after the lifting bevel block and the outer baffle plate are lowered, they block the four sides of the wafer, which can prevent dust and impurities from falling on the wafer during detection and causing reduced detection accuracy. At the same time, the inner frame plate exposed after the lifting bevel block and the outer baffle plate are lowered blocks the gap between the top protective plate and the outer baffle plate, so that the wafer is completely enclosed, thereby improving the protection effect. The transmission bevel plate pushes the lifting bevel block and the outer baffle plate to rise through the guidance of the inclined surface. After the lifting bevel block and the outer baffle plate are raised, it is convenient to take out the wafer, and it is also convenient to put subsequent wafers into the device, thereby improving the convenience of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional overall structure of the present invention;

[0018] Figure 2 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the side and bottom three-dimensional structure of the support and the temperature measuring instrument of the present invention;

[0020] Figure 4 For the present invention Figure 3 A is a schematic diagram of the enlarged structure of the middle part;

[0021] Figure 5 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the wafer positioning device of the present invention;

[0022] Figure 6 For the present invention Figure 5 Schematic diagram of the enlarged structure of B;

[0023] Figure 7 It is a schematic diagram of the front side cross-sectional three-dimensional structure of the detection and protection device of the present invention;

[0024] Figure 8 For the present invention Figure 7 Schematic diagram of the enlarged structure of C in the figure.

[0025] In the figure: 1, wafer; 2, support; 3, support side plate; 4, temperature meter; 41, transmission line; 42, sensor; 43, wiring port; 5, double-actuator linear motor; 6, transmission slider; 61, transmission rod; 62, limit clamping frame; 63, clamping block; 64, clamping slot; 65, sleeve shaft; 66, elastic telescopic shaft; 67, semicircular arc positioning ring; 7, wafer positioning device; 71, arc clamping plate; 72, arc pressure plate; 73, guide inclined slot 1; 74 , sliding shaft; 75, sliding column; 76, reset spring; 77, delayed transmission frame; 78, limit slide groove; 79, guide shaft one; 710, elastic telescopic rod; 711, arc push block; 712, adaptive slide groove; 8, detection and protection device; 81, guide shaft two; 82, guide inclined groove two; 83, transmission inclined plate; 84, limit card plate; 85, support plate; 86, top protection plate; 87, inner frame plate; 88, lifting inclined block; 89, outer baffle. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1-Figure 8One embodiment of the present invention is: a calibration device for wafer temperature measurement, comprising a wafer 1, a support 2 is arranged below the wafer 1, support side plates 3 are fixedly connected to both sides of the support 2, a thermometer 4 is arranged on the rear side of the support 2, a transmission line 41 is fixedly connected to the front side of the thermometer 4, a sensor 42 is fixedly connected to the top of the transmission line 41, a wiring port 43 is opened on the top of the support 2, a double-acting linear motor 5 is fixedly connected to the side of the support side plate 3 close to the support 2, and the upper surface of the double-acting linear motor 5 has front and rear sides respectively. There are two transmission sliders 6 in sliding connection, and two transmission rods 61 are fixedly connected to the sides of the two transmission sliders 6 away from the front and rear ends of the double-motor linear motor 5, and the inner surfaces of the two transmission rods 61 are fixedly connected to two limit clamping frames 62, respectively. A clamping block 63 is fixedly connected to the front side of the limit clamping frame 62 on the rear side, and a clamping groove 64 is provided on the rear side of the limit clamping frame 62 on the front side. A sleeve shaft 65 is fixedly connected to the inner surface of the limit clamping frame 62, and an elastic telescopic shaft 66 is slidably connected to the inner surface of the sleeve shaft 65. The elastic telescopic shaft 66 is away from the sleeve One end of the shaft 65 is fixedly connected with a semicircular arc positioning ring 67. After the limit clamping frame 62 is fitted, the moving range of the transmission line 41 is limited to prevent the transmission line 41 from being entangled, thereby improving the safety and accuracy of the transmitted data. The semicircular arc positioning ring 67 can clamp each transmission line 41 individually to further prevent the transmission line 41 from being entangled. A wafer positioning device 7 for fixing the wafer 1 is arranged above the support 2. A detection protection device 8 for protecting the wafer 1 when the wafer 1 is measured for temperature is arranged above the support 2. The sensor 42 The upper surface and the lower surface of the wafer 1 are in contact with each other, and the lower surface of the wafer 1 and the upper surface of the support 2 are in contact with each other. When the semicircular arc positioning ring 67 clamps the transmission lines 41 of different thicknesses, the elastic telescopic shaft 66 can be contracted or extended according to the thickness of the transmission line 41, thereby improving the clamping range and applicability. The elastic telescopic shaft 66 twists in the sleeve shaft 65 to generate friction, and the friction force can reduce the sliding or twisting amplitude of the transmission line 41, thereby improving the protection effect of the transmission line 41, and thereby improving its service life and the accuracy of data transmission.

[0028] Working principle: Place the wafer 1 on the support 2, and then attach the sensor 42 to the wafer 1 through the wiring port 43. After the sensor 42 detects the temperature of the wafer 1, it transmits the temperature data to the thermometer 4 through the transmission line 41, so that the staff can detect the temperature of the wafer 1, and thus process the wafer 1 with abnormal temperature. Start the double-acting linear motor 5, and the double-acting linear motor 5 drives the front and rear transmission sliders 6 to approach each other. The transmission slider 6 drives the two transmission rods 61 to approach each other and finally fit together. The transmission rod 61 then drives the two limit clamping frames 62 to fit together to frame the transmission line 41, limit the moving range of the transmission line 41, avoid the transmission line 41 from being entangled, and improve the safety and accuracy of the transmitted data. After the two limit clamping frames 62 are fitted together, the limit clamping frame 62 on the rear side drives the card block 63 to insert into the limit clamping frame 6 on the front side. 2, so that the two limit clamping frames 62 fit more closely, improving the cable bundling effect, the limit clamping frame 62 drives the two semi-circular arc positioning rings 67 to fit together through the sleeve shaft 65 and the elastic telescopic shaft 66, and the semi-circular arc positioning ring 67 can clamp each transmission line 41 separately, further avoiding the entanglement of the transmission line 41, and when the semi-circular arc positioning ring 67 clamps the transmission lines 41 of different thicknesses, the elastic telescopic shaft 66 can be contracted or extended according to the thickness of the transmission line 41, thereby improving the clamping range and applicability, and when the transmission line 41 is affected by the environment and shakes or twists, the semi-circular arc positioning ring 67 and the elastic telescopic shaft 66 are driven to twist in the sleeve shaft 65 to generate friction, and the friction force can reduce the sliding or twisting amplitude of the transmission line 41, thereby improving the protection effect of the transmission line 41, thereby improving its service life and the accuracy of data transmission.

[0029] See also Figure 1-Figure 8On the basis of the above embodiment, in another embodiment of the present invention, the wafer positioning device 7 includes an arc clamping plate 71, an arc pressure plate 72, a guide inclined groove 73, a sliding shaft 74, a sliding column 75, and a reset spring 76. The arc clamping plate 71 is slidably connected to the upper surface of the support 2, the sliding column 75 is slidably connected to the inner surface of the arc clamping plate 71, the arc pressure plate 72 is fixedly connected to the top of the sliding column 75, the guide inclined groove 73 is opened on the inner side of the support 2, the sliding shaft 74 is slidably connected to the inner surface of the guide inclined groove 73, and the reset spring The spring 76 is fixedly connected to the lower surface of the arc-shaped pressure plate 72. The arc-shaped clamping plate 71 can clamp the edge of the wafer 1, so that the wafer 1 can remain stable and calibrated during detection, thereby improving the accuracy of detection. At the same time, the arc-shaped pressure plate 72 can press the top of the wafer 1, further improving the clamping stability. The wafer positioning device 7 also includes a delayed transmission frame 77, a limit slide 78, a guide shaft 79, an elastic telescopic rod 710, an arc-shaped push block 711, and an adaptive slide 712. The adaptive slide 712 is provided on the transmission rod 61, the guide shaft 79 is slidably connected to the inner surface of the adaptive slide groove 712, the delay transmission frame 77 is movably connected to the outer surface of the guide shaft 79, the limit slide groove 78 is opened on the inner surface of the delay transmission frame 77, the elastic telescopic rod 710 is fixedly connected to the inner surface of the limit slide groove 78, the arc push block 711 is fixedly connected to the end of the elastic telescopic rod 710 close to the guide shaft 79, the bottom end of the reset spring 76 is fixedly connected to the inner surface of the arc clamping plate 71, and the top end of the sliding shaft 74 is fixedly connected to the bottom surface of the arc clamping plate 71. The inner arc surface of the arc push block 711 and the circumferential surface of the guide shaft 79 are in contact with each other, the arc push block 711 and the inner surface of the limiting slide groove 78 are slidingly connected, the sliding shaft 74 and the delay transmission frame 77 are hinged on the inner surface near one end of the arc clamping plate 71, and the arc pressure plate 72 is pulled down by the reset spring 76 and automatically adapts to the thickness of the wafer 1 to clamp wafers 1 of different thicknesses, thereby improving the applicability of clamping. The arc clamping plate 71 can clamp wafers 1 of different diameters, further improving the applicability of clamping.

[0030] Working principle: Place the wafer 1 in the middle of the four arc-shaped clamping plates 71. The arc-shaped clamping plates 71 can clamp the edge of the wafer 1, so that the wafer 1 can remain stable and calibrated during detection, thereby improving the accuracy of detection. At the same time, the arc-shaped pressure plate 72 can press the top of the wafer 1, further improving the clamping stability. When encountering wafers 1 of different thicknesses, the arc-shaped pressure plate 72 can be lifted. The arc-shaped pressure plate 72 drives the sliding column 75 to rise without separating from the arc-shaped clamping plates 71 to stretch the reset spring 76, and then release the arc-shaped pressure plate 72. The arc-shaped pressure plate 72 is pulled down by the reset spring 76 and automatically adapts to the thickness of the wafer 1, thereby clamping wafers 1 of different thicknesses, thereby improving the applicability of clamping. When the front and rear transmission rods 61 approach each other, they drive the front and rear guide rods 61 to move upward. The shafts 79 approach each other, and the guide shaft 79 drives the front and rear delay transmission frames 77 to approach each other. The delay transmission frame 77 then drives the sliding shaft 74 to slide in the guide bevel groove 73, and approaches the wafer 1 along the guide bevel groove 73. When the arc-shaped clamping plate 71 clamps the wafer 1 with a longer diameter, the arc-shaped clamping plate 71 contacts the edge of the wafer 1 and the guide shaft 79 can continue to slide in the delay transmission frame 77, thereby clamping the wafer 1 without affecting the mutual fit of the two transmission rods 61. When the arc-shaped clamping plate 71 releases the wafer 1, the arc-shaped push block 711 drives the guide shaft 79 to return to the initial position in the delay transmission frame 77 through the elastic action of the elastic telescopic rod 710, which is convenient for clamping wafers 1 of different diameters next time, further improving the applicability of clamping.

[0031] See also Figure 1-Figure 8On the basis of the above embodiment, in another embodiment of the present invention, the detection protection device 8 includes a support plate 85, a top protection plate 86, an inner frame plate 87, a lifting bevel block 88, and an outer baffle plate 89. The support plate 85 is fixedly connected to the side of the support side plate 3 away from the support 2, the top protection plate 86 is fixedly connected to the inner surface of the top of the support plate 85, the inner frame plate 87 is fixedly connected to the lower surface of the top protection plate 86, the lifting bevel block 88 is slidably connected to the outer surface of the inner frame plate 87, and the outer baffle plate 89 is slidably connected to the outer surface of the inner frame plate 87. After the lifting bevel block 88 and the outer baffle plate 89 are lowered, they block the four sides of the wafer 1, which can prevent dust and impurities from falling on the wafer 1 during detection, resulting in reduced detection accuracy. At the same time, the inner frame plate 87 exposed after the lifting bevel block 88 and the outer baffle plate 89 are lowered blocks the gap between the top protection plate 86 and the outer baffle plate 89, so that the wafer 1 is completely closed, thereby improving the protection effect. The detection protection device 8 also includes a guide shaft 2 81, a guide bevel groove The guide inclined groove 82 is provided inside the support 2, the guide shaft 81 is slidably connected to the inner surface of the guide inclined groove 82, the transmission inclined plate 83 is fixedly connected to the top of the guide shaft 81, the limiting card plate 84 is fixedly connected to the upper surface of the transmission inclined plate 83, the bottom end of the guide shaft 81 and the top of the guide shaft 79 are in contact with each other, the bottom end of the transmission inclined plate 83 and the upper surface of the support 2 are slidably connected, and the lower surface of the lifting inclined block 88 and the transmission inclined plate 8 The upper surfaces of the lifting bevel 88 and the outer surface of the limit clamping plate 84 are in contact with each other, the bottom end of the lifting bevel 88 is clamped with the outer surface of the limit clamping plate 84, the bottom end of the guide shaft 81 is fixedly connected with the upper surface of the delay transmission frame 77, the lifting bevel 88 and the two sides of the outer baffle 89 are fixedly connected, and the transmission bevel plate 83 pushes the lifting bevel 88 and the outer baffle 89 to rise through the guidance of the inclined surface. After the lifting bevel 88 and the outer baffle 89 are raised, it is convenient to take out the wafer 1, and it is also convenient to put the subsequent wafer 1 into the device, which improves the convenience of the device.

[0032] Working principle: When the sliding shaft 74 slides in the guide bevel groove 1 73, it drives the delay transmission frame 77 to move along the guide of the guide bevel groove 1 73, and the delay transmission frame 77 then drives the guide shaft 2 81 to slide in the guide bevel groove 2 82, and the guide shaft 2 81 drives the transmission bevel plate 83 to approach the wafer 1 along the guide of the guide bevel groove 2 82, and when the transmission bevel plate 83 approaches the wafer 1, the lifting bevel block 88 descends because of the inclined surface of the transmission bevel plate 83, and the lifting bevel block 88 descends, driving the outer baffle plate 89 to descend, and after the lifting bevel block 88 and the outer baffle plate 89 descend, they block the four sides of the wafer 1, which can prevent dust and impurities from falling on the wafer 1 and causing inaccurate detection during detection. The inner frame plate 87 exposed after the lifting bevel block 88 and the outer baffle plate 89 are lowered blocks the gap between the top protective plate 86 and the outer baffle plate 89, so that the wafer 1 is completely closed, and the protection effect is improved. After the inspection of the wafer 1 is completed, the guide shaft 81 moves along the guide bevel groove 82 in the direction away from the wafer 1, thereby driving the transmission bevel plate 83 to move in the direction away from the wafer 1. The transmission bevel plate 83 pushes the lifting bevel block 88 and the outer baffle plate 89 to rise through the guidance of the inclined surface. After the lifting bevel block 88 and the outer baffle plate 89 are raised, it is convenient to take out the wafer 1, and it is also convenient to put the subsequent wafer 1 into the device, which improves the convenience of the device.

[0033] The present invention provides a calibration device for wafer temperature measurement and a calibration method thereof. There are many methods and ways to implement the technical solution. The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention. All components not specified in this embodiment can be implemented by existing technologies.

Claims

1. A calibration device for wafer temperature measurement, comprising a wafer (1), characterized in that: A support (2) is provided below the wafer (1), support side plates (3) are fixedly connected to both sides of the support (2), a temperature measuring instrument (4) is provided on the rear side of the support (2), a transmission line (41) is fixedly connected to the front side of the temperature measuring instrument (4), a sensor (42) is fixedly connected to the top of the transmission line (41), a wiring port (43) is provided on the top of the support (2), a dual-motor linear motor (5) is fixedly connected to the side of the support side plate (3) close to the support (2), two transmission slide blocks (6) are slidably connected to the front and rear sides of the upper surface of the dual-motor linear motor (5), and the two transmission slide blocks (6) are respectively connected to the transmission line (41). ) Two transmission rods (61) are respectively fixedly connected to one side away from the front and rear ends of the double-motor linear motor (5); the inner surfaces of the two transmission rods (61) are respectively fixedly connected to two limit clamping frames (62); a clamping block (63) is fixedly connected to the front side of the limit clamping frame (62) on the rear side; a clamping groove (64) is provided on the rear side of the limit clamping frame (62) on the front side; a sleeve shaft (65) is fixedly connected to the inner surface of the limit clamping frame (62); an elastic telescopic shaft (66) is slidably connected to the inner surface of the sleeve shaft (65); and a semicircular arc positioning ring (67) is fixedly connected to one end of the elastic telescopic shaft (66) away from the sleeve shaft (65); A wafer positioning device (7) for fixing the wafer (1) is arranged above the support (2), and a detection protection device (8) for protecting the wafer (1) when the temperature of the wafer (1) is measured is arranged above the support (2); The upper surface of the sensor (42) and the lower surface of the wafer (1) are in contact with each other, and the lower surface of the wafer (1) and the upper surface of the support (2) are in contact with each other; The wafer positioning device (7) comprises an arc-shaped clamping plate (71), an arc-shaped pressure plate (72), a guide inclined groove (73), a sliding shaft (74), a sliding column (75), and a reset spring (76); the arc-shaped clamping plate (71) is slidably connected to the upper surface of the support (2); the sliding column (75) is slidably connected to the inner surface of the arc-shaped clamping plate (71); the arc-shaped pressure plate (72) is fixedly connected to the top of the sliding column (75); the guide inclined groove (73) is provided on the inner side of the support (2); the sliding shaft (74) is slidably connected to the inner surface of the guide inclined groove (73); and the reset spring (76) is fixedly connected to the lower surface of the arc-shaped pressure plate (72); The wafer positioning device (7) also includes a delayed transmission frame (77), a limiting slide groove (78), a guide shaft (79), an elastic telescopic rod (710), an arc-shaped push block (711), and an adaptive slide groove (712), wherein the adaptive slide groove (712) is arranged on the inner side of the transmission rod (61), the guide shaft (79) is slidably connected to the inner surface of the adaptive slide groove (712), the delayed transmission frame (77) is movably connected to the outer surface of the guide shaft (79), the limiting slide groove (78) is arranged on the inner surface of the delayed transmission frame (77), the elastic telescopic rod (710) is fixedly connected to the inner surface of the limiting slide groove (78), and the arc-shaped push block (711) is fixedly connected to one end of the elastic telescopic rod (710) close to the guide shaft (79); The bottom end of the return spring (76) is fixedly connected to the inner surface of the arc-shaped clamping plate (71), the top end of the sliding shaft (74) is fixedly connected to the bottom surface of the arc-shaped clamping plate (71), the inner arc surface of the arc-shaped push block (711) and the circumferential surface of the guide shaft (79) are in contact with each other, the arc-shaped push block (711) and the inner surface of the limiting slide groove (78) are slidably connected, and the inner surface of the sliding shaft (74) and the delay transmission frame (77) near one end of the arc-shaped clamping plate (71) are hinged; The detection protection device (8) comprises a support plate (85), a top protection plate (86), an inner frame plate (87), a lifting inclined block (88), and an outer baffle plate (89), wherein the support plate (85) is fixedly connected to a side of the support side plate (3) away from the support (2), the top protection plate (86) is fixedly connected to the inner surface of the top of the support plate (85), the inner frame plate (87) is fixedly connected to the lower surface of the top protection plate (86), the lifting inclined block (88) is slidably connected to the outer surface of the inner frame plate (87), and the outer baffle plate (89) is slidably connected to the outer surface of the inner frame plate (87); The detection and protection device (8) further comprises a second guide shaft (81), a second guide inclined groove (82), a transmission inclined plate (83), and a limit clamping plate (84); the second guide inclined groove (82) is arranged on the inner side of the support (2); the second guide shaft (81) is slidably connected to the inner surface of the second guide inclined groove (82); the transmission inclined plate (83) is fixedly connected to the top end of the second guide shaft (81); and the limit clamping plate (84) is fixedly connected to the upper surface of the transmission inclined plate (83).

2. The wafer temperature measurement calibration device according to claim 1, characterized in that: The bottom end of the guide shaft 2 (81) and the top end of the guide shaft 1 (79) are in contact with each other, the bottom end of the transmission inclined plate (83) is slidably connected to the upper surface of the support (2), the bottom surface of the lifting inclined block (88) and the upper surface of the transmission inclined plate (83) are in contact with each other, the bottom end of the lifting inclined block (88) is clamped to the outer surface of the limit clamping plate (84), the bottom end of the guide shaft 2 (81) is fixedly connected to the upper surface of the delay transmission frame (77), and the lifting inclined block (88) is fixedly connected to both sides of the outer baffle (89).

3. A calibration method for a calibration device for wafer temperature measurement, using the calibration device for wafer temperature measurement according to claim 2, characterized in that: The following steps are involved: Step 1: First, place the cut wafer on the support (2), and attach the transmission line (41) and the sensor (42) to the wafer through the wiring port (43); Step 2: Then, the thermometer (4) is started, and the sensor (42) transmits the detected temperature data to the thermometer (4) through the transmission line (41), and the thermometer (4) displays the detected data; Step 3: Subsequently, the lifting inclined block (88) and the outer baffle (89) are lifted, and then the arc-shaped pressing plate (72) is lifted to remove the wafer from the arc-shaped clamping plate (71); Step 4: Finally, the staff will check the parts of the wafer with abnormal temperature, process the abnormal parts, and complete the temperature measurement calibration.

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