A device for measuring thermal stability of resin

Abstract

The present invention discloses a device for measuring the thermal stability of resin, and relates to the technical field of resin performance testing, including a work frame, a placement plate on the work frame, a test assembly on the placement plate, a fixing plate on the work frame, an observation port on the fixing plate, an auxiliary fixing assembly on one side of the fixing plate, a mounting side plate on one side of the work frame, an adjustment assembly on the mounting side plate, and the adjustment assembly is arranged on the upper part of the test assembly. The present invention adopts a brand-new assembly and a brand-new connection relationship, and integrates the pressing and temperature heating of the resin together, reduces the time of step-by-step detection, and can perform continuous detection at the same time, reduces the influence of the external environment on the detection data, and also facilitates the operation of the staff.

Description

Technical Field

[0001] The invention relates to the technical field of resin performance testing, in particular to a device for measuring the thermal stability of resin. Background Art

[0002] Resin usually refers to an organic polymer that softens or melts when heated, tends to flow under external force when softened, and is solid, semi-solid, or sometimes liquid at room temperature. In a broad sense, any polymer compound that can be used as a raw material for plastic products is called a resin.

[0003] In the prior art, resins are used in multiple technical fields, and some fields consider the thermal stability of resins. However, the test and measurement of the thermal stability of resins in the prior art are mostly carried out by direct heating or compression, which cannot accurately test and measure the thermal stability of resins.

[0004] Therefore, it is necessary to propose a measuring device for the thermal stability of resin to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a device for measuring the thermal stability of resin to solve the problems existing in the prior art.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A device for measuring the thermal stability of resin comprises a work frame, a placing plate is provided on the work frame, a test assembly is provided on the placing plate, a fixing plate is provided on the work frame, an observation port is provided on the fixing plate, an auxiliary fixing assembly is provided on one side of the fixing plate, a mounting side plate is provided on one side of the work frame, an adjustment assembly is provided on the mounting side plate, and the adjustment assembly is arranged on the upper part of the test assembly.

[0008] A device for measuring the thermal stability of a resin as described above, wherein the test assembly includes a test plate, the test plate is fixed on a placement plate, a fixing hole is provided on the test plate, a movable column is provided on the test plate, the movable column is slidably connected to the test plate, a scale is provided on the test plate, and the movable column is arranged on the scale.

[0009] A device for measuring the thermal stability of a resin as described above, wherein the adjustment component includes a mounting plate, the mounting plate is arranged on a mounting side plate, a mounting upper plate is arranged at the lower part of the mounting plate, the mounting upper plate is vertically arranged on the mounting side plate, a sliding rod is arranged under the mounting upper plate, a mounting lower plate is arranged at the bottom end of the sliding rod, an adjusting telescopic rod is arranged on the mounting plate, an adjusting pressure plate is arranged at the top end of the adjusting telescopic rod, and the adjusting pressure plate is slidably connected to the sliding rod.

[0010] In the device for measuring thermal stability of resin as described above, a pressure needle is provided at the lower part of the adjusting pressure plate.

[0011] In the device for measuring thermal stability of resin as described above, a fixing frame is provided on the fixing plate.

[0012] In the above-mentioned device for measuring thermal stability of resin, the observation port comprises an observation frame, the observation frame is slidably connected to the fixing plate, and a magnifying glass is arranged in the observation frame.

[0013] In the device for measuring thermal stability of resin as described above, both the upper mounting plate and the lower mounting plate are provided with U-shaped grooves.

[0014] In the device for measuring thermal stability of resin as described above, the auxiliary fixing assembly comprises a telescopic motor fixed on a working frame, the telescopic motor is connected to an auxiliary telescopic rod, and an auxiliary pressure pad is provided at the top of the auxiliary telescopic rod.

[0015] In the device for measuring thermal stability of resin as described above, a circular groove is provided on the fixed frame, and the circular groove is connected to the auxiliary telescopic rod.

[0016] In the device for measuring thermal stability of resin as described above, a heating wire is arranged on the placement plate.

[0017] The advantages of the present invention are: the present invention adopts new components and a new connection relationship, integrates the resin pressing and temperature heating together, reduces the time of step-by-step detection, and can perform continuous detection at the same time, reduces the impact of the external environment on the detection data, and also facilitates the operation of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 is a stereogram of the present invention; Figure 3 yes Figure 2 A1 partial enlarged view; Figure 4 yes Figure 2 A2 partial enlarged view.

[0020] Figure numerals: 1. work frame; 2. placement plate; 3. test assembly; 4. fixing plate; 5. observation port; 6. auxiliary fixing assembly; 7. installation side plate; 8. adjustment assembly; 31. test plate; 32. fixing hole; 33. moving column; 34. scale; 41. fixing frame; 51. observation frame; 52. magnifying glass; 61. telescopic motor; 62. auxiliary telescopic rod; 63. auxiliary pressure pad; 81. installation plate; 82. installation upper plate; 83. sliding rod; 84. installation lower plate; 85. adjustment of telescopic rod; 86. adjustment of pressure plate; 87. pressure needle. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] like Figure 1-4 As shown, a device for measuring thermal stability of resin includes a work frame 1, a placing plate 2 is provided on the work frame 1, a test assembly 3 is provided on the placing plate 2, a fixing plate 4 is provided on the work frame 1, an observation port 5 is provided on the fixing plate 4, an auxiliary fixing assembly 6 is provided on one side of the fixing plate 4, a mounting side plate 7 is provided on one side of the work frame 1, an adjusting assembly 8 is provided on the mounting side plate 7, and the adjusting assembly 8 is arranged on the upper part of the test assembly 3. When using the present invention, it is necessary to connect the components together according to the connection relationship. The electrical components in the present invention are all externally connected to a power supply and a control switch. The staff places the resin to be tested on the placement plate 2, the test component 3 simply fixes the resin, the adjustment component 8 presses the resin, the test component 3 heats, and observes the movement of the moving column 33 to judge the thermal stability performance. In this embodiment, a thermometer is provided on the placement plate 2 to observe the influence of temperature changes on the thermal stability of the resin, so as to roughly judge the thermal stability of the resin. The staff can place another resin to be tested on the fixing plate 4, the auxiliary fixing component 6 fixes the resin in a single direction, and then the adjustment component 8 squeezes the resin. The staff can observe the deformation of the resin after being compressed through the observation port 5. Combined with the data for preliminary judgment of the thermal stability of the resin, relatively accurate thermal stability data of the resin can be obtained.

[0023] Specifically, if Figure 1-4As shown, the test assembly 3 of this embodiment includes a test plate 31, which is fixed on the placement plate 2, and is provided with a fixing hole 32. The test plate 31 is provided with a moving column 33, which is slidably connected with the test plate 31, and a scale 34 is provided on the test plate 31, and the moving column 33 is arranged on the scale 34. The adjustment assembly 8 includes a mounting plate 81, which is arranged on the mounting side plate 7, and a mounting upper plate 82 is arranged at the lower part of the mounting plate 81, and the mounting upper plate 82 is vertically arranged on the mounting side plate 7, and a sliding rod 83 is arranged under the mounting upper plate 82, and a mounting lower plate 84 is arranged at the bottom end of the sliding rod 83, and an adjustment telescopic rod 85 is arranged on the mounting plate 81, and an adjustment pressing plate 86 is arranged at the top of the adjustment telescopic rod 85, and the adjustment pressing plate 86 is slidably connected with the sliding rod 83. A pressure pin 87 is arranged at the lower part of the adjustment pressing plate 86. The fixed plate 4 is provided with a fixed frame 41. The observation port 5 includes an observation frame 51, which is slidably connected to the fixed plate 4, and a magnifying glass 52 is arranged in the observation frame 51. The upper mounting plate 82 and the lower mounting plate 84 are both provided with U-shaped grooves. The placement plate 2 is provided with a heating wire. The staff places the resin on the test plate 31, the moving column 33 is set to the edge of the resin, the adjustment telescopic rod 85 in the adjustment component 8 is extended, the pressing needle 87 presses the resin tightly, and the heating wire is heated. The resin will deform after being subjected to a certain amount of heat, and the moving column 33 will move due to the thrust of the resin. According to the moving distance of the moving column 33 and the heating temperature of the heating wire, a data can be calculated according to some test standard data within the industry.

[0024] Specifically, Figure 1-4 As shown, the auxiliary fixing assembly 6 described in this embodiment includes a telescopic motor 61, which is fixed on the work frame 1. The telescopic motor 61 is connected to an auxiliary telescopic rod 62, and an auxiliary pressure pad 63 is provided at the top of the auxiliary telescopic rod 62. A circular groove is provided on the fixed frame 41, and the circular groove is connected to the auxiliary telescopic rod 62. The resin is placed on the fixed frame 41 of the fixed plate 4, and then the auxiliary telescopic rod 62 is extended and then the auxiliary pressure pad 63 presses the resin, and the adjustment assembly 8 presses the resin. Then the staff can observe the deformation of the resin through the observation port 5. At the same time, the adjustment assembly 8 can display the size of the applied pressure, and the pressure resistance of the resin can be judged. Then, according to the data obtained in the previous step plus the deformation data of the resin under pressure, the thermal stability of the resin can be accurately obtained.

[0025] Working principle: When using the present invention, first connect the components in sequence according to their connection relationship, and all electrical components in the present invention are connected to external power supplies and control switches to provide normal energy supply for the normal use of the present invention, ensure the normal use of the present invention, place the resin to be tested on the test plate 31, and the moving column 33 is connected to the test plate 31 by sliding. In this embodiment, a magnetic suction method is adopted, and the moving column 33 is close to the edge of the resin. The position of the adjusting plate 86 is adjusted so that the adjusting plate 86 contacts and presses the resin, and the heating wire on the placement plate 2 is started to indirectly heat the test plate 31. After being heated, the resin will be deformed, so that the position of the moving column 33 will change. Because the test plate 31 is provided with a scale 34, the displacement distance of the moving column 33 can be easily observed. The deformation size can be calculated based on the displacement distance of the moving column 33 and compared with the original position. When the resin is irregular, the deformation size is uneven , the size of the deformation can be measured and then averaged, and further judgment is made. The standards for the thermal deformation of the resin are different in each industry. In this embodiment, the resin gasket is taken as an example for analysis. Because the heating temperature of the heating wire in the placement plate 2 can be adjusted at any time, the changing heating temperature further indicates that the heating temperature of the resin can be adjusted. The standard for the resin gasket is a heating temperature of 90 degrees, a deformation distance of 0.2 cm, a heating temperature of 105 degrees, a deformation distance of 0.35 cm, a heating temperature of 120 degrees, a deformation distance of 0.4 cm, a heating temperature of 150 degrees, a deformation distance of 0.55 cm, a heating temperature of 180 degrees, a deformation distance of 0.65 cm, and when the heating temperature is greater than 220 degrees and less than 300 degrees, the deformation standard is less than 0.85 cm. When the heating temperature in this embodiment is at this detection standard and the deformation amount is less than the detection standard, it proves that the thermal stability of the resin is good. Otherwise, it proves that the thermal stability of the resin is poor.

[0026] The above description is about measuring the thermal stability of the value by heating. Because in real life or industrial production, the resin may be subjected to excessive pressure, which may also change the heating and thermal stability of the resin. In this embodiment, the resin is pressurized by the fixing plate 4, the auxiliary fixing component 6, the adjusting component 8 and the observation port 5, and the pressure bearing capacity of the resin is detected, so as to indirectly measure the thermal stability of the resin. The resin is placed on the fixing plate 4. In this embodiment, the pressure applied to the adjusting plate 86 on the upper part of the fixing plate 4 can be measured and changed at any time. In this embodiment, the detection standard used is the same as the detection standard of the resin gasket. When the resin is under pressure less than or equal to 2KN When the resin is under pressure greater than 2KN and less than 10KN, the deformation distance is less than or equal to 0.7cm. When the resin is under pressure greater than 10KN and less than 20KN, the deformation distance is less than or equal to 1.2cm. Before placing the resin on the fixed plate 4, use a measuring tool, such as a ruler, to measure the length, width and thickness of the resin and make a record. Then place the resin on the fixed plate 4, and the auxiliary pressure pad 63 presses the resin tightly. Then the pressure needle 87 presses into the inside of the resin. At the same time, after the adjustment pressure plate 86 contacts the resin, measure the length, width and thickness of the resin again and record them. Compare the size of the resin measured at this time with the original size of the resin. , get the first numerical difference, record the applied pressure on the adjusting plate 86 at this time, continue to apply pressure to the adjusting plate 86, in this embodiment, the observation port 5 slides along the fixed plate 4, and the observation position can be changed at any time. The observation port 5 is provided with a magnifying glass 52, and whether there is deformation can be clearly observed. Because one side of the resin is pressed tightly by the auxiliary pressure pad 63, the deformation of the resin will occur on the other side, which is convenient for observing the deformation of the resin. When the adjusting plate 86 contacts the resin, the pressure applied on the adjusting plate 86 reaches 2KN, and then it is maintained for 5-10 seconds, and then the resin is removed, and the various dimensions of the resin are measured and compared with the original dimensions to obtain the second numerical difference, and then compared with the adjusting plate 86. The data measured when the pressure plate 86 contacts the resin are compared to obtain the third numerical difference. When the first numerical difference is the same as the second numerical difference and the third numerical difference is zero, it proves that the resin has not deformed. The resin is returned to its original position, and then pressure is applied to the adjusting pressure plate 86. When the pressure on the adjusting pressure plate 86 reaches 10KN, it is maintained for 5-10 seconds, and then the resin is removed. The dimensions of the resin are measured and compared with the original dimensions to obtain the second numerical difference, which is then compared with the data measured when the adjusting pressure plate 86 contacts the resin to obtain the third numerical difference. When the second numerical difference is greater than the first numerical difference, and the third numerical difference is less than or equal to 0.When the resin is less than 7cm, it proves that the resin has not deformed, which indirectly proves that the resin has good thermal stability. Otherwise, the resin has poor thermal stability. Then put the resin back to its original position, and continue to apply pressure to the adjustment plate 86. Repeat the above steps to further measure the deformation of the resin. It is necessary to ensure that when the resin is compressed to less than 20KN, the deformation of the resin is less than 1.2cm, which proves that the resin has strong thermal stability. Otherwise, it proves that the resin has poor compressive resistance, which indirectly proves that the resin has poor thermal stability.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for measuring thermal stability of resin, characterized in that: The device comprises a working frame (1), wherein a placing plate (2) is provided on the working frame (1), a testing assembly (3) is provided on the placing plate (2), a fixing plate (4) is provided on the working frame (1), the fixing plate (4) is provided with an observation port (5), an auxiliary fixing assembly (6) is provided on one side of the fixing plate (4), a mounting side plate (7) is provided on one side of the working frame (1), an adjusting assembly (8) is provided on the mounting side plate (7), and the adjusting assembly (8) is arranged on the upper part of the testing assembly (3); The placement plate (2) is provided with an electric heating wire; The test assembly (3) comprises a test plate (31), the test plate (31) is fixed on the placement plate (2), a fixing hole (32) is provided on the test plate (31), a movable column (33) is provided on the test plate (31), the movable column (33) is slidably connected to the test plate (31), a scale (34) is provided on the test plate (31), and the movable column (33) is arranged on the scale (34); The adjustment assembly (8) comprises a mounting plate (81), the mounting plate (81) being arranged on the mounting side plate (7), a mounting upper plate (82) being arranged at the lower part of the mounting plate (81), the mounting upper plate (82) being arranged vertically on the mounting side plate (7), a sliding rod (83) being arranged at the lower part of the mounting upper plate (82), a mounting lower plate (84) being arranged at the lower end of the sliding rod (83), an adjusting telescopic rod (85) being arranged on the mounting plate (81), an adjusting pressing plate (86) being arranged at the top end of the adjusting telescopic rod (85), and the adjusting pressing plate (86) being slidably connected to the sliding rod (83); A pressure needle (87) is provided at the lower part of the regulating pressure plate (86); The upper mounting plate (82) and the lower mounting plate (84) are both provided with U-shaped grooves; The fixing plate (4) is provided with a fixing frame (41); The fixed frame (41) is provided with a circular groove, which is connected to the auxiliary telescopic rod (62).

2. The device for measuring thermal stability of resin according to claim 1, characterized in that: The observation port (5) comprises an observation frame (51), the observation frame (51) is slidably connected to the fixed plate (4), and a magnifying glass (52) is arranged inside the observation frame (51).

3. The device for measuring thermal stability of resin according to claim 1, characterized in that: The auxiliary fixing assembly (6) comprises a telescopic motor (61), the telescopic motor (61) is fixed on the working frame (1), the telescopic motor (61) is connected to an auxiliary telescopic rod (62), and an auxiliary pressure pad (63) is provided at the top end of the auxiliary telescopic rod (62).

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