Chip packaging structure and chip packaging method

Abstract

The present invention relates to the field of chip packaging, and in particular to a chip packaging structure and a chip packaging method. The present invention comprises a workbench, a substrate frame is installed on the top of the workbench, a support frame is installed on one side wall of the workbench, and a first electric slide is installed on one side wall of the support frame; the present invention pushes two groups of adsorption mud glue to adhere to the chip surface, penetrates into the openings on the chip surface to adsorb impurities, and in the process of pushing the adsorption mud glue to adsorb, drives the second sliding plate to slide and buffer in the second sleeve plate, thereby avoiding the problem of chip damage caused by excessive pressure, and the second sliding plate starts to squeeze the second compression spring while sliding in the second sleeve plate, and the second compression spring starts to exert rebound force on the second sliding plate after sensing the pressure, so that the adsorption mud glue penetration and adsorption work is more thorough, improving the impurity adsorption effect and the chip packaging accuracy.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to a chip packaging structure and a chip packaging method. Background Art

[0002] Chip packaging refers to the process of assembling a semiconductor integrated circuit chip into a housing and forming electrical connections through appropriate connection technology to protect the chip and ensure its performance.

[0003] After searching, in the prior art, Chinese patent publication number: CN111696927B, authorization publication date: 2023-12-15, discloses a chip packaging frame and a chip packaging method, including an upper shell cover, a lower shell cover and a protective plate, the lower end of the upper shell cover is fixedly mounted by the lower shell cover, the protective plate is fixed by pasting the upper shell cover and the lower shell cover, the upper shell cover includes a first shell frame, a snap buckle, a first installation slot and a first W-shaped sealing groove; the above embodiment can improve the firmness after packaging and better meet the needs of use.

[0004] However, the device still has the following defects:

[0005] Impurities between chips cannot be completely adsorbed and removed, and the chip itself can be easily damaged during the removal process, which limits the packaging accuracy and reduces the working effect of chip packaging. Summary of the invention

[0006] In view of the above problems, the present invention provides a chip packaging structure, comprising a workbench, a substrate rack is installed on the top of the workbench, a support frame is installed on one side wall of the workbench, a first electric slide is installed on one side wall of the support frame, a compatible limit assembly is transmission-connected on the output end of the first electric slide, a packaging assembly is installed on the compatible limit assembly, and two sets of edge grinding assemblies are symmetrically arranged;

[0007] The packaging assembly includes two groups of second sleeve plates, one end of a group of second compression springs is mounted on the top inner wall of each group of the second sleeve plates, the other end of each group of the second compression springs is mounted on a group of second sliding plates, a group of snap-fit ​​shells is mounted on the bottom of each group of the second sliding plates, and a group of adsorption mud glue is mounted in each group of the snap-fit ​​shells;

[0008] In the process of pushing the adsorption mud glue for adsorption, the second sliding plate is driven to slide and buffer in the second sleeve plate.

[0009] Furthermore, the compatible limit assembly includes a first fixed plate, the top of the first fixed plate is transmission-connected to the output end of the first electric slide, two groups of first electric push rods are symmetrically installed on the bottom of the first fixed plate, a group of first sleeve plates are installed on the output end of each group of the first electric push rods, one end of a group of first compression springs is installed on the inner wall of one side of each group of the first sleeve plates, a group of first sliding plates is installed on the other end of each group of the first compression springs, and each group of the first sliding plates is slidably connected in the first sleeve plates.

[0010] Furthermore, a group of second electromagnetic blocks is installed on the top of each group of the first sliding plates, a group of second electric push rods is installed on the top of each group of the first socket plates, a group of first electromagnetic blocks is installed on the output end of each group of the second electric push rods, and the first electromagnetic blocks are magnetically connected to the second electromagnetic blocks.

[0011] Furthermore, a group of second fixed plates are installed on one side wall of each group of the first sliding plates, two groups of slideways are symmetrically opened on one side wall of each group of the second fixed plates, a group of mounting blocks are slidably connected in each group of the slideways, and an elastic protective plate is connected between the two groups of mounting blocks.

[0012] Furthermore, the packaging assembly also includes a third electric push rod, the top of the third electric push rod is installed on the bottom of the first fixed plate, the output end of the third electric push rod is installed with a first motor, the output end of the first motor is transmission-connected to a second electric slide, and the output end of the second electric slide is transmission-connected to a third fixed plate.

[0013] Furthermore, a fourth fixing plate is installed on the bottom of the third fixing plate, a fourth electric push rod is installed on a side wall of the fourth fixing plate, a fifth fixing plate is installed on the output end of the fourth electric push rod, two groups of first connecting plates are symmetrically installed on a side wall of the fifth fixing plate, and a second connecting plate is connected between the two groups of the first connecting plates.

[0014] Furthermore, a fifth electric push rod is installed on the bottom of the second connecting plate, a second motor is installed on the output end of the fifth electric push rod, and a third connecting plate is transmission-connected to the output end of the second motor. A packaging structure is installed on the bottom edge of the third connecting plate, and a pressing structure is installed at the end away from the packaging structure, and the top of each group of the second socket plates is installed on the bottom of one of the groups of first connecting plates.

[0015] Furthermore, the edge grinding assembly includes a first mounting plate, the bottom of each group of the first mounting plates is mounted on the top edge of one group of the second fixed plates, a group of sixth electric push rods is mounted on one side wall of each group of the first mounting plates, and a group of second mounting plates is mounted on the output end of each group of the sixth electric push rods.

[0016] Furthermore, a group of sleeve tubes are installed on one side wall of each group of the second mounting plates, one end of a group of third compression springs are installed on one side inner wall of each group of the sleeve tubes, a group of sliding rods are installed on the other end of each group of the third compression springs, each group of the sliding rods are slidably connected in the sleeve tubes, a group of pressure sensors are installed at the junction of each group of the sliding rods and the third compression springs, and a group of edge grinding blocks are installed on one side wall of each group of the sliding rods.

[0017] A chip packaging method of a chip packaging structure, the chip packaging method comprising:

[0018] Start the compatible limit component to wrap and limit the chip;

[0019] Start the first electric slide to drive the chip to move directly above the substrate rack;

[0020] Push the two sets of adsorption glue to adhere to the chip surface;

[0021] Drive the second sliding plate to slide and buffer in the second sleeve plate;

[0022] The second sliding plate squeezes the second compression spring, and the second compression spring starts to exert a rebound force on the second sliding plate after sensing the pressure;

[0023] The edge grinding assembly is started to grind the outer wall of the chip.

[0024] The beneficial effects of the present invention are:

[0025] 1. Push two groups of adsorption mud glue to fit on the chip surface, penetrate into the openings on the chip surface to adsorb impurities, and in the process of pushing the adsorption mud glue for adsorption, drive the second sliding plate to slide and buffer in the second sleeve plate, thereby avoiding the problem of chip damage due to excessive pressure, and the second sliding plate starts to squeeze the second compression spring while sliding in the second sleeve plate. After the second compression spring senses the pressure, it starts to exert rebound force on the second sliding plate, thereby making the adsorption mud glue penetration and adsorption work more thorough, improving the impurity adsorption effect and the chip packaging accuracy.

[0026] 2. When the two sets of elastic protective plates limit the chip, the output end of the edge grinding block is driven to fit the outer wall of the chip. Then the sixth electric push rod is started to push the edge grinding block to grind the outer wall of the chip. When encountering an irregular chip, the edge grinding block will feel pressure. When the edge grinding block feels the pressure, it begins to squeeze the sliding rod. While the sliding rod slides in the sleeve, it begins to squeeze the third compression spring. After feeling the pressure, the third compression spring will apply force to the pressure sensor to observe the pressure value, thereby improving the edge grinding effect while improving the protection effect of the chip structure.

[0027] 3. The first electromagnetic block and the second electromagnetic block are separated from the electromagnetic state. When the second electromagnetic block senses that the magnetism disappears, the first sliding plate begins to rebound. During the rebound process, the two sets of first sliding plates drive the two sets of elastic protective plates to fit the outer wall of the chip. When encountering an irregular chip structure, the elastic protective plates are driven by pressure to bend according to the shape of the chip. During the bending process, the two sets of mounting blocks are driven to slide in the slideway, which avoids structural damage and improves the compatibility effect of the limit package.

[0028] 4. Start the fourth electric push rod to drive the adsorption mud glue to adsorb back and forth, and then start the second electric slide to drive the two groups of adsorption mud glue to rotate. When it rotates to the specified position, start the fourth electric push rod to drive the adsorption mud glue to retract and adsorb, which increases the adsorption range and improves the flexibility of structural adjustment.

[0029] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 A schematic diagram of a packaging structure according to an embodiment of the present invention is shown;

[0032] Figure 2 A schematic diagram of the structure of a compatible limiter assembly according to an embodiment of the present invention is shown;

[0033] Figure 3 It shows a schematic structural diagram of a first socket plate according to an embodiment of the present invention;

[0034] Figure 4 A top cross-sectional view of a first sleeve plate according to an embodiment of the present invention is shown;

[0035] Figure 5 A schematic diagram of the structure of a packaging assembly according to an embodiment of the present invention is shown;

[0036] Figure 6 It shows a schematic structural diagram of a second socket plate according to an embodiment of the present invention;

[0037] Figure 7 A schematic cross-sectional view of a second socket plate according to an embodiment of the present invention is shown;

[0038] Figure 8 A schematic diagram of the structure of an edge grinding assembly according to an embodiment of the present invention is shown;

[0039] Fig. 9 A top cross-sectional view of a sleeve according to an embodiment of the present invention is shown.

[0040] In the figure: 1, workbench; 2, substrate rack; 3, placement box; 4, support frame; 5, first electric slide; 6, compatible limit assembly; 601, first fixed plate; 602, first electric push rod; 603, first socket plate; 604, first compression spring; 605, first sliding plate; 606, second electric push rod; 607, first electromagnetic block; 608, second electromagnetic block; 609, second fixed plate; 610, slideway; 611, mounting block; 612, elastic protective plate; 7, packaging assembly; 701, third electric push rod; 702, first motor; 703, second electric slide; 704, third fixed plate; 705, fourth fixed plate ;706, fourth electric push rod;707, fifth fixed plate;708, first connecting plate;709, second connecting plate;710, fifth electric push rod;711, second motor;712, third connecting plate;713, packaging structure;714, pressing structure;715, second socket plate;716, second compression spring;717, second sliding plate;718, snap-on shell;719, adsorbed mud glue;8, edge grinding assembly;801, first mounting plate;802, sixth electric push rod;803, second mounting plate;804, socket tube;805, third compression spring;806, sliding rod;807, pressure sensor;808, edge grinding block. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] The embodiment of the present invention provides a chip packaging structure. It includes a workbench 1, exemplarily, as Figure 1 and Figure 2 As shown, a substrate rack 2 is installed on the top of the workbench 1, and a placement box 3 is installed at the end away from the substrate rack 2, a support frame 4 is installed on one side wall of the workbench 1, and a first electric slide 5 is installed on one side wall of the support frame 4, and a compatible limit component 6 is transmission-connected on the output end of the first electric slide 5, a packaging component 7 is installed on the compatible limit component 6, and two groups of edge grinding components 8 are symmetrically arranged.

[0043] For example, Figure 3 and Figure 4 As shown, the compatible limit assembly 6 includes a first fixed plate 601, the top of the first fixed plate 601 is transmission-connected to the output end of the first electric slide 5, two groups of first electric push rods 602 are symmetrically installed on the bottom of the first fixed plate 601, and a group of first sleeve plates 603 are installed on the output end of each group of the first electric push rods 602, and one end of a group of first compression springs 604 are installed on the inner wall of one side of each group of the first sleeve plates 603, and a group of first sliding plates 605 are installed on the other end of each group of the first compression springs 604, and each group of the first sliding plates 605 are slidably connected in the first sleeve plates 603, and each group of the first sliding A group of second electromagnetic blocks 608 are installed on the top of each group of the first socket plates 603, a group of second electric push rods 606 are installed on the top of each group of the first socket plates 603, a group of first electromagnetic blocks 607 are installed on the output end of each group of the second electric push rods 606, the first electromagnetic blocks 607 are magnetically connected to the second electromagnetic blocks 608, a group of second fixed plates 609 are installed on one side wall of each group of the first sliding plates 605, two groups of slideways 610 are symmetrically opened on one side wall of each group of the second fixed plates 609, each group of the slideways 610 is slidably connected with a group of mounting blocks 611, and an elastic protective plate 612 is connected between the two groups of the mounting blocks 611.

[0044] The first electric slide 5 is started to drive the two sets of elastic protective plates 612 to move to the top of the placement box 3, and then the second electric push rod 606 is started to push the first electromagnetic block 607 and the second electromagnetic block 608 to be magnetically connected, and then the second electric push rod 606 is started to drive the first sliding plate 605 to slide in the first sleeve plate 603. The first sliding plate 605 begins to squeeze the first compression spring 604 during the sliding process, and then the first electric push rod 602 is started to drive the two sets of elastic protective plates 612 to descend to the two ends of the packaged chip, and then the first The electromagnetic block 607 and the second electromagnetic block 608 are out of the electromagnetic state. When the second electromagnetic block 608 senses that the magnetism disappears, the first sliding plate 605 starts to rebound. During the rebound process, the two groups of first sliding plates 605 drive the two groups of elastic protective plates 612 to fit the outer wall of the chip. When encountering an irregular chip structure, the elastic protective plates 612 are driven by pressure to bend according to the shape of the chip. During the bending process, the two groups of mounting blocks 611 are driven to slide in the slide 610, thereby avoiding structural damage and improving the compatibility effect of the limiting package.

[0045] For example, Figure 5 , Figure 6 and Figure 7As shown, the packaging component 7 includes a third electric push rod 701, the top of the third electric push rod 701 is installed on the bottom of the first fixed plate 601, the output end of the third electric push rod 701 is installed with a first motor 702, the output end of the first motor 702 is transmission-connected with a second electric slide 703, the output end of the second electric slide 703 is transmission-connected with a third fixed plate 704, the bottom of the third fixed plate 704 is installed with a fourth fixed plate 705, a side wall of the fourth fixed plate 705 is installed with a fourth electric push rod 706, a fifth fixed plate 707 is installed on the output end of the fourth electric push rod 706, two groups of first connecting plates 708 are symmetrically installed on one side wall of the fifth fixed plate 707, a second connecting plate 709 is connected between the two groups of the first connecting plates 708, and a fifth electric push rod is installed on the bottom of the second connecting plate 709. 710, a second motor 711 is installed on the output end of the fifth electric push rod 710, and a third connecting plate 712 is transmission-connected to the output end of the second motor 711, a packaging structure 713 is installed on the bottom edge of the third connecting plate 712, and a pressing structure 714 is installed on the end away from the packaging structure 713, a group of second sleeve plates 715 is installed on the bottom of each group of the first connecting plates 708, one end of a group of second compression springs 716 is installed on the top inner wall of each group of the second sleeve plates 715, and a group of second sliding plates 717 is installed on the other end of each group of the second compression springs 716, the outer wall of each group of the second sliding plates 717 is slidably connected to the inner wall of the second sleeve plate 715, a group of snap-on shells 718 are installed on the bottom of each group of the second sliding plates 717, and a group of adsorption mud glue 719 is installed in each group of the snap-on shells 718.

[0046] The first electric push rod 602 drives the elastic protective plate 612 that clamps the chip to reset, and then starts the first electric slide 5 to drive the chip to move to the top of the substrate rack 2. Then, the first electric push rod 602 is started to drive the chip to move to the specified position on the substrate rack 2, and the third electric push rod 701 is started to push the two sets of adsorption mud glue 719 to fit on the surface of the chip. Since the adsorption mud glue 719 is made of soft glue material, it can penetrate into the openings on the surface of the chip to adsorb impurities, and in the process of pushing the adsorption mud glue 719 for adsorption, it drives the second sliding plate 717 to slide and buffer in the second socket plate 715, avoiding the problem of chip damage due to excessive pressure, and the second sliding plate 717 starts to squeeze the second compression spring 716 while sliding in the second socket plate 715. After sensing the pressure, the second compression spring 716 starts to exert a rebound force on the second sliding plate 717, so that the adsorption mud glue 719 can penetrate and adsorb more thoroughly, thereby improving the impurity adsorption effect and the chip packaging accuracy.

[0047] Start the fourth electric push rod 706 to drive the adsorption mud glue 719 to adsorb back and forth, and then start the second electric slide 703 to drive the two groups of adsorption mud glue 719 to rotate. When it rotates to the specified position, start the fourth electric push rod 706 to drive the adsorption mud glue 719 to retract and adsorb, thereby increasing the adsorption range and the flexibility of the structural adjustment.

[0048] Start the second motor 711 to drive the pressing structure 714 to rotate to the top of the chip, then start the fifth electric push rod 710 to push the pressing structure 714 to contact the surface of the chip, and then use the magnetic connection between the first electromagnetic block 607 and the second electromagnetic block 608 to disengage the chip from the two sets of elastic protection plates 612, and then take another set of chips and place them in the substrate rack 2, and use the fifth electric push rod 710 to drive the packaging structure 713 to perform packaging work.

[0049] For example, Figure 8 and Fig. 9 As shown, the edge grinding assembly 8 includes a first mounting plate 801, the bottom of each group of the first mounting plates 801 is mounted on the top edge of one group of the second fixed plates 609, a group of sixth electric push rods 802 are mounted on one side wall of each group of the first mounting plates 801, a group of second mounting plates 803 are mounted on the output end of each group of the sixth electric push rods 802, a group of sleeve tubes 804 are mounted on one side wall of each group of the second mounting plates 803, one end of a group of third compression springs 805 are mounted on the inner wall of one side of each group of the sleeve tubes 804, a group of sliding rods 806 are mounted on the other end of each group of the third compression springs 805, each group of the sliding rods 806 are slidably connected in the sleeve tube 804, a group of pressure sensors 807 are mounted at the junction of each group of the sliding rods 806 and the third compression springs 805, and a group of edge grinding blocks 808 are mounted on one side wall of each group of the sliding rods 806.

[0050] When the two sets of elastic protective plates 612 limit the chip, they also drive the output end of the edge grinding block 808 to fit the outer wall of the chip. Then the sixth electric push rod 802 is started to push the edge grinding block 808 to grind the outer wall of the chip. When encountering an irregular chip, the edge grinding block 808 will feel pressure. When the edge grinding block 808 feels the pressure, it begins to squeeze the sliding rod 806. While the sliding rod 806 slides in the sleeve 804, it begins to squeeze the third compression spring 805. After feeling the pressure, the third compression spring 805 will apply force to the pressure sensor 807 for observing the pressure value, thereby improving the edge grinding effect while improving the protection effect of the chip structure.

[0051] The two groups of adsorption glue 719 are pushed to fit on the chip surface and penetrate into the openings on the chip surface to adsorb impurities. In the process of pushing the adsorption glue 719 for adsorption, the second sliding plate 717 is driven to slide and buffer in the second socket plate 715, thereby avoiding the problem of chip damage due to excessive pressure. The second sliding plate 717 starts to squeeze the second compression spring 716 while sliding in the second socket plate 715. After sensing the pressure, the second compression spring 716 starts to exert a rebound force on the second sliding plate 717, thereby making the adsorption work of the adsorption glue 719 more thorough, thereby improving the impurity adsorption effect and the chip packaging accuracy.

[0052] When the two sets of elastic protective plates 612 limit the chip, the output end of the edge grinding block 808 is driven to fit the outer wall of the chip. Then the sixth electric push rod 802 is started to push the edge grinding block 808 to grind the outer wall of the chip. When encountering an irregular chip, the edge grinding block 808 will feel pressure. When the edge grinding block 808 feels the pressure, it begins to squeeze the sliding rod 806. While the sliding rod 806 slides in the sleeve 804, it begins to squeeze the third compression spring 805. After feeling the pressure, the third compression spring 805 will apply force to the pressure sensor 807 to observe the pressure value, thereby improving the edge grinding effect while improving the protection effect of the chip structure.

[0053] The first electromagnetic block 607 and the second electromagnetic block 608 are separated from the electromagnetic state. When the second electromagnetic block 608 senses that the magnetism disappears, the first sliding plate 605 starts to rebound. During the rebound process, the two groups of first sliding plates 605 drive the two groups of elastic protection plates 612 to fit the outer wall of the chip. When encountering an irregular chip structure, the elastic protection plates 612 are driven by pressure to bend according to the shape of the chip. During the bending process, the two groups of mounting blocks 611 are driven to slide in the slide 610, thereby avoiding structural damage and improving the compatibility effect of the limit package.

[0054] Start the fourth electric push rod 706 to drive the adsorption mud glue 719 to adsorb back and forth, and then start the second electric slide 703 to drive the two groups of adsorption mud glue 719 to rotate. When it rotates to the specified position, start the fourth electric push rod 706 to drive the adsorption mud glue 719 to retract and adsorb, thereby increasing the adsorption range and the flexibility of the structural adjustment.

[0055] Based on the above chip packaging structure, an embodiment of the present invention further proposes a chip packaging method of the chip packaging structure. Exemplarily, the chip packaging method includes:

[0056] The first electric slide drives the two sets of elastic protective plates to move to the top of the placement box, the second electric push rod is started to push the first electromagnetic block and the second electromagnetic block to be magnetically connected, and then the second electric push rod is started to drive the first sliding plate to slide in the first sleeve plate;

[0057] The first sliding plate squeezes the first compression spring, and then the first electric push rod is started to drive the two sets of elastic protection plates to descend to the two ends of the packaged chip, so that the first electromagnetic block and the second electromagnetic block are out of the electromagnetic state;

[0058] After the second electromagnetic block senses that the magnetism disappears, the first sliding plate begins to rebound, and the two sets of first sliding plates drive the two sets of elastic protective plates to fit the outer wall of the chip;

[0059] When encountering an irregular chip structure, the elastic protection plate is driven by pressure to bend according to the shape of the chip, and the two sets of mounting blocks are driven to slide in the slideway during the bending process;

[0060] The first electric push rod drives the elastic protective plate holding the chip to reset, and the first electric slide is started to drive the chip to move to the top of the substrate rack;

[0061] Start the first electric push rod to drive the chip to the designated position on the substrate rack, and then start the third electric push rod to push the two sets of adsorption mud glue to adhere to the surface of the chip;

[0062] In the process of pushing the adsorption mud glue to perform adsorption, the second sliding plate is driven to slide and buffer in the second sleeve plate;

[0063] The second sliding plate slides in the second sleeve plate while squeezing the second compression spring, and the second compression spring starts to exert a rebound force on the second sliding plate after sensing the pressure;

[0064] Start the fourth electric push rod to drive the adsorption mud glue to adsorb back and forth, and then start the second electric slide to drive the two groups of adsorption mud glue to rotate;

[0065] The second motor is started to drive the pressing structure to rotate to the top of the chip, and then the fifth electric push rod is started to push the pressing structure to contact the surface of the chip;

[0066] The first electromagnetic block and the second electromagnetic block are magnetically connected to release the chips from the two sets of elastic protective plates, and then a set of chips is taken and placed in the substrate rack, and the packaging structure is driven by the fifth electric push rod to perform packaging work;

[0067] When the two sets of elastic protection plates limit the chip, the output end of the edge grinding block is driven to fit on the outer wall of the chip, and then the sixth electric push rod is started to push the edge grinding block to grind the outer wall of the chip;

[0068] When encountering an irregular chip, the edge grinding block starts to squeeze the sliding rod after feeling the pressure. The sliding rod starts to squeeze the third compression spring while sliding in the sleeve. The third compression spring will exert force on the pressure sensor after feeling the pressure.

[0069] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip packaging structure, comprising a workbench (1), characterized in that: A substrate frame (2) is installed on the top of the workbench (1), a support frame (4) is installed on one side wall of the workbench (1), a first electric slide (5) is installed on one side wall of the support frame (4), a compatible limit assembly (6) is transmission-connected on the output end of the first electric slide (5), a packaging assembly (7) is installed on the compatible limit assembly (6), and two sets of edge grinding assemblies (8) are symmetrically arranged; The packaging assembly (7) comprises two groups of second sleeve plates (715), one end of a group of second compression springs (716) is mounted on the top inner wall of each group of the second sleeve plates (715), a group of second sliding plates (717) is mounted on the other end of each group of the second compression springs (716), a group of snap-fit ​​shells (718) is mounted on the bottom of each group of the second sliding plates (717), and a group of adsorption mud glue (719) is mounted in each group of the snap-fit ​​shells (718); In the process of pushing the adsorption mud glue (719) to perform adsorption, the second sliding plate (717) is driven to slide and buffer inside the second sleeve plate (715); The compatible limit assembly (6) comprises a first fixed plate (601), the top of the first fixed plate (601) is transmission-connected to the output end of the first electric slide (5), two groups of first electric push rods (602) are symmetrically mounted on the bottom of the first fixed plate (601), a group of first sleeve plates (603) are mounted on the output end of each group of the first electric push rods (602), one end of a group of first compression springs (604) are mounted on the inner wall of one side of each group of the first sleeve plates (603), a group of first sliding plates (605) are mounted on the other end of each group of the first compression springs (604), and each group of the first sliding plates (605) are slidably connected in the first sleeve plates (603); A group of second electromagnetic blocks (608) is installed on the top of each group of the first sliding plates (605), a group of second electric push rods (606) is installed on the top of each group of the first sleeve plates (603), and a group of first electromagnetic blocks (607) is installed on the output end of each group of the second electric push rods (606), and the first electromagnetic blocks (607) are magnetically connected to the second electromagnetic blocks (608); A group of second fixed plates (609) are installed on one side wall of each group of the first sliding plates (605), two groups of slideways (610) are symmetrically opened on one side wall of each group of the second fixed plates (609), a group of mounting blocks (611) are slidably connected in each group of the slideways (610), and an elastic protective plate (612) is connected between the two groups of mounting blocks (611).

2. The chip packaging structure according to claim 1, characterized in that: The packaging component (7) also includes a third electric push rod (701), the top of the third electric push rod (701) is installed on the bottom of the first fixed plate (601), the output end of the third electric push rod (701) is installed with a first motor (702), the output end of the first motor (702) is transmission-connected to a second electric slide (703), and the output end of the second electric slide (703) is transmission-connected to a third fixed plate (704).

3. The chip packaging structure according to claim 2, characterized in that: A fourth fixing plate (705) is mounted on the bottom of the third fixing plate (704), a fourth electric push rod (706) is mounted on a side wall of the fourth fixing plate (705), a fifth fixing plate (707) is mounted on the output end of the fourth electric push rod (706), two groups of first connecting plates (708) are symmetrically mounted on a side wall of the fifth fixing plate (707), and a second connecting plate (709) is connected between the two groups of the first connecting plates (708).

4. The chip packaging structure according to claim 3, characterized in that: A fifth electric push rod (710) is mounted on the bottom of the second connecting plate (709), a second motor (711) is mounted on the output end of the fifth electric push rod (710), a third connecting plate (712) is transmission-connected to the output end of the second motor (711), a packaging structure (713) is mounted on the bottom edge of the third connecting plate (712), and a pressing structure (714) is mounted on the end away from the packaging structure (713), and the top of each group of the second sleeve plates (715) is mounted on the bottom of one group of the first connecting plates (708).

5. The chip packaging structure according to claim 1, characterized in that: The edge grinding assembly (8) comprises a first mounting plate (801), the bottom of each group of the first mounting plates (801) is mounted on the top edge of one group of the second fixed plates (609), a group of sixth electric push rods (802) is mounted on a side wall of each group of the first mounting plates (801), and a group of second mounting plates (803) is mounted on the output end of each group of the sixth electric push rods (802).

6. The chip packaging structure according to claim 5, characterized in that: A set of sleeve tubes (804) are installed on one side wall of each set of the second mounting plates (803), one end of a set of third compression springs (805) are installed on one side inner wall of each set of the sleeve tubes (804), a set of sliding rods (806) are installed on the other end of each set of the third compression springs (805), each set of the sliding rods (806) are slidably connected in the sleeve tubes (804), a set of pressure sensors (807) are installed at the junction of each set of the sliding rods (806) and the third compression springs (805), and a set of edge grinding blocks (808) are installed on one side wall of each set of the sliding rods (806).

7. A chip packaging method according to any one of claims 1 to 6, characterized in that: The chip packaging method comprises: Start the compatible limit component to wrap and limit the chip; Start the first electric slide to drive the chip to move directly above the substrate rack; Push the two sets of adsorption glue to adhere to the chip surface; Drive the second sliding plate to slide and buffer in the second sleeve plate; The second sliding plate squeezes the second compression spring, and the second compression spring starts to exert a rebound force on the second sliding plate after sensing the pressure; The edge grinding assembly is started to grind the outer wall of the chip.

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