Wafer sorting machine with multifunctional flipping component and wafer flipping method

Abstract

The present invention relates to the field of wafer transfer equipment, and in particular to a wafer sorting machine with a multifunctional flipping assembly and a wafer flipping method. The invention comprises a base, on which a film expansion device, a multifunctional flipping assembly and a transfer device are arranged; the film expansion device is used to disperse the wafers after cutting; the multifunctional flipping assembly has a flipping mechanism that can rotate around its own axis, the flipping mechanism is provided with a suction nozzle mechanism in the radial direction, and the suction nozzle mechanism has a suction station corresponding to the film expansion device and a delivery station corresponding to the transfer device under the drive of the flipping mechanism; the suction nozzle mechanism is arranged in pairs in the radial direction of the flipping mechanism, and is rotatably connected to the flipping mechanism through a suction nozzle rotation driver, so that it can revolve around the axis of the flipping mechanism and can also rotate around the execution end of the suction nozzle rotation driver.

Description

Technical Field

[0001] The present invention relates to the field of wafer transport equipment, and in particular to a wafer sorting machine with a multifunctional flipping component and a wafer flipping method. Background Art

[0002] During the wafer inspection process, it is usually necessary to inspect the upper and lower surfaces of the product. After the inspection is completed, some customers require the product to be turned over and placed on a tape, tray or blue film. However, some customers require the wafer to be placed on a tape, tray or blue film in the same direction as when it was sucked. Currently, the sorting equipment on the market cannot have the function of turning the wafer over or not turning it over at the same time. Summary of the invention

[0003] The purpose of the present invention is to provide a wafer sorting machine with a multifunctional flipping component and a wafer flipping method to solve the problem that the sorting equipment in the prior art cannot have the functions of flipping and not flipping the wafer at the same time.

[0004] The technical solution of the present invention is: a wafer sorting machine with a multifunctional flip assembly, comprising a base, on which a film expansion device, a multifunctional flip assembly and a transfer device are arranged;

[0005] The film expansion device is used to spread the cut wafers;

[0006] A multifunctional flip assembly has a flip mechanism that can rotate around its own axis, the flip mechanism is radially provided with a suction nozzle mechanism, and the suction nozzle mechanism has a suction station corresponding to the film expansion device and a delivery station corresponding to the transfer device under the drive of the flip mechanism;

[0007] The nozzle mechanisms are arranged in pairs in the radial direction of the flipping mechanism and are rotationally connected to the flipping mechanism via a nozzle rotation driver, so that they can revolve around the axis of the flipping mechanism and also rotate around the execution end of the nozzle rotation driver.

[0008] Preferably, a pair of the suction nozzle mechanisms have a handover station with the shortest distance between the suction ends under the drive of the suction nozzle rotation driver, and the end of the wafer adsorbed on any suction nozzle mechanism away from the suction nozzle mechanism can be adsorbed by another suction nozzle mechanism in the handover station, and with the cooperation of the flipping mechanism, the side of the wafer attached to the film expansion mechanism is different from the adsorption surface adsorbed by the transfer device.

[0009] Preferably, surface detection cameras are provided corresponding to the multifunctional flip assembly and the transfer device, and the surface detection cameras are arranged in pairs on both sides of the multifunctional flip assembly.

[0010] Preferably, the nozzle mechanism includes a nozzle base, and a nozzle is connected to the end of the nozzle base away from the nozzle rotation driver, and the nozzle is used to adsorb the wafer; the nozzle is connected to the nozzle base through a nozzle axial driver, and the nozzle axial driver drives the nozzle to move axially for adsorbing and placing the wafer.

[0011] Preferably, the nozzle base is configured as an L-shaped structure, and two vertical edges are respectively connected to the nozzle axial driver and the flip mechanism; the nozzle axial driver is connected to the nozzle through a nozzle connecting plate, and the nozzle connecting plate is configured as a Z-shaped structure, and the horizontal section away from the nozzle axial driver is fixed to the nozzle, and the vertical section is provided with a guide connected to the nozzle base.

[0012] Preferably, the guide comprises a slider and a guide rail, the guide rail is fixed to the vertical section of the nozzle connecting plate, and the slider is fixed to the nozzle base.

[0013] Preferably, the flipping mechanism includes a flipping base fixed to the base, the flipping base is connected to a flipping driver, the execution end of the flipping driver passes through the flipping base and is connected to a flipping platform, the middle part of the flipping platform is fixed to the execution end of the flipping driver, and the two ends are correspondingly connected to a pair of suction nozzle mechanisms.

[0014] Preferably, a pin assembly is also provided, which is arranged below the film expansion device and has a lifting end that can move along a vertical axis and lift the wafer, and the suction nozzle mechanism absorbs the wafer lifted by the lifting end.

[0015] Preferably, a wafer flipping method is provided, wherein the upper side of the wafer on the film expansion device is set as the first surface, and the lower side is set as the second surface;

[0016] The wafer flipping method includes a first flipping mode and a second flipping mode; wherein the first flipping mode includes the following steps:

[0017] Step 1: The film expansion device carries the wafer on the base and moves along the horizontal plane, driving the wafer to be adsorbed thereon to the connecting line between the ejector head of the ejector assembly and the suction nozzle located at the suction station; then, the ejector assembly is actuated, and the ejector head rises to lift the wafer at the corresponding position on the wafer film, and at the same time, the suction nozzle located at the suction station is pressed down by the axial drive of the suction nozzle, and after contacting and adsorbing the first surface of the wafer, the axial drive of the suction nozzle drives the suction nozzle to reset; the flip mechanism drives the suction nozzle mechanism to rotate to the position corresponding to the detection end of the surface detection camera, so as to perform defect detection on the second surface of the adsorbed wafer;

[0018] Step 2: The flip mechanism continues to drive the suction nozzle mechanism to rotate to the placement station of the corresponding transfer device, and the suction nozzle axial driver drives the suction nozzle to carry the wafer to move axially to dock the wafer with the transfer device, so that the transfer device adsorbs the second surface of the wafer; at this time, the surface detection camera set corresponding to the transfer device detects the first surface of the wafer; the wafers with qualified first and second surfaces are transported to the braiding mechanism by the transfer device;

[0019] A pair of suction nozzle mechanisms are set to be a first suction nozzle mechanism and a second suction nozzle mechanism and the corresponding first suction nozzle and second suction nozzle;

[0020] The second flip mode comprises the following steps:

[0021] Step 1: The film expansion device carries the wafer on the base and moves along the horizontal plane, driving the wafer to be adsorbed thereon to the connecting line between the ejector head of the ejector assembly and the suction nozzle located at the suction station; then, the ejector assembly is actuated, and the ejector head rises to lift the wafer at the corresponding position on the wafer film, and at the same time, the suction nozzle located at the suction station is pressed down by the axial drive of the suction nozzle, and after contacting and adsorbing the first surface of the wafer, the axial drive of the suction nozzle drives the suction nozzle to reset; the flipping mechanism drives the suction nozzle mechanism to rotate to the position corresponding to the detection end of the surface detection camera, so as to perform defect detection on the second surface of the adsorbed wafer;

[0022] Step 2: After the second surface of the wafer is inspected by the surface inspection camera on either side, the two nozzle rotation drivers respectively drive the two nozzle mechanisms to rotate 180 degrees, so that the nozzles on the two nozzle mechanisms enter the handover station with the shortest distance between them;

[0023] Step 3: In the handover station, the second suction nozzle approaches the second surface of the wafer and sucks the second surface of the wafer under the drive of the suction nozzle driver, while the first suction nozzle releases the suction force on the wafer, completing the handover of the wafer from one suction nozzle mechanism to another suction nozzle mechanism;

[0024] Step 4: The wafer after the handover is rotated 180 degrees with the second nozzle mechanism so that it faces the radial direction away from the handover station, so that the first surface of the wafer facing outward is inspected for defects by another surface inspection camera;

[0025] Step 5: The flipping mechanism is actuated to drive the second nozzle mechanism currently carrying the wafer to the delivery station.

[0026] Compared with the prior art, the advantages of the present invention are: the present invention arranges two suction nozzle mechanisms on the same flipping mechanism, and the two suction nozzle mechanisms are rotatably connected to the flipping mechanism, so that a pair of suction nozzle mechanisms can complete the wafer handover operation by self-rotation, so that the suction nozzle mechanism can transfer the wafer from the film expansion device to the subsequent transfer device in the same posture. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0028] Figure 1 This is a structural diagram of a wafer sorting machine with a multifunctional flipping component according to the present invention;

[0029] Figure 2 This is a structural diagram of the multifunctional flip assembly of the present invention;

[0030] Figure 3 This is a structural diagram of the nozzle mechanism of the present invention;

[0031] Figure 4 This is a structural diagram of the nozzle mechanism of the present invention;

[0032] Figure 5 This is a structural diagram of the ejector assembly of the present invention;

[0033] Figure 6 This is a structural diagram of the film expansion device of the present invention;

[0034] Wherein: 1. base, 2. film expansion device, 21. first part, 22. second part, 3. multifunctional flip assembly, 31. flip mechanism, 311. flip base, 312. flip drive, 313. flip platform, 32. nozzle mechanism, 32a. first nozzle mechanism, 32b. second nozzle mechanism, 321. nozzle base, 322. nozzle axial drive, 323. nozzle connecting plate, 324. guide, 325. nozzle, 325a. first nozzle, 325b. second nozzle, 4. transfer device, 5. ejector assembly, 51. ejector head, 6. surface detection camera. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below in conjunction with specific embodiments:

[0036] like Figure 1 As shown, a wafer sorting machine with a multifunctional flip assembly 3 includes a base 1, on which a film expansion device 2, a multifunctional flip assembly 3 and a transfer device 4 are arranged. The multifunctional flip assembly 3 is used to absorb and remove the wafer on the film expansion device 2, and after the surface of both sides of the wafer is absorbed by a surface detection camera 6, it is transferred to the subsequent tape device via the transfer device 4.

[0037] like Figure 6 As shown, the purpose of the film expansion device 2 is as follows: the cut wafer is attached to the wafer film, and the outer side of the wafer film is fixed by an iron ring. The film expansion device 2 includes a first part 21 and a second part 22 that can perform relative movement. The first part 21 is fixed to the iron ring and drives the iron ring to move downward. The second part 22 is arranged on the inner side of the first part 21, and abuts against the wafer film when the first part 21 drives the iron ring together with the wafer film to move downward, and as the first part 21 continues to move, the wafer film is expanded, so that the spacing between the multiple wafers cut thereon is increased, thereby facilitating the adsorption of the multifunctional flip assembly 3. The film expansion device 2 is connected to a linear module, which can move along the horizontal plane on the base 1, so that the multifunctional flip assembly 3 can adsorb different wafers.

[0038] A ejector assembly 5 is also provided, and the ejector assembly 5 is provided below the film expansion device 2, such as Figure 5 As shown, it has a pin head 51 corresponding to the adsorption end of the multifunctional flip component 3. The pin head 51 is driven by the pin driver to move up and down along its own axis and abut against the lower surface of the wafer film, so that the wafer corresponding to the abutting position is lifted up and close to the adsorption end of the multifunctional flip component 3, so that it can adsorb the wafer.

[0039] like Figure 2 As shown, the multifunctional flip assembly 3 includes a flip mechanism 31, and the flip mechanism 31 includes a flip base 311 fixed to the base 1, and the flip base 311 is connected to a flip driver 312, and the execution end of the flip driver 312 passes through the flip base 311 and is connected to a flip platform 313, and the middle part of the flip platform 313 is fixed to the execution end of the flip driver 312 and is radially connected to a suction nozzle mechanism 32.

[0040] The transfer device 4 is arranged above the multifunctional turning assembly 3 .

[0041] Driven by the turning mechanism 31 , the nozzle mechanism 32 has a suction station corresponding to the film expanding device 2 and a delivery station corresponding to the transfer device 4 .

[0042] Specifically, Figure 3 and Figure 4As shown, the nozzle mechanism 32 includes a nozzle base 321, and one end of the nozzle base 321 is connected to a nozzle 325, and the nozzle 325 is used to adsorb wafers. The nozzle 325 is connected to the nozzle base 321 through a nozzle axial driver 322, and the nozzle axial driver 322 drives the nozzle 325 to move axially for adsorption and placement of wafers. The nozzle base 321 is set as an L-shaped structure, and the two vertical edges are respectively connected to the nozzle axial driver 322 and the flip mechanism 31. The nozzle axial driver 322 is connected to the nozzle 325 through a nozzle connecting plate 323, and the nozzle connecting plate 323 is set as a Z-shaped structure. The horizontal section away from the nozzle axial driver 322 is fixed to the nozzle 325, and its vertical section is provided with a guide 324 connected to the nozzle base 321. The guide 324 includes a slider and a guide rail, the guide rail is fixed to the vertical section of the nozzle connecting plate 323, and the slider is fixed to the nozzle base 321.

[0043] The present application is also provided with a surface detection camera 6. In this embodiment, three surface detection cameras 6 are provided. One surface detection camera 6 is provided corresponding to the adsorption end of the transfer device 4, and the detection ends of the two surface detection cameras 6 are provided on both sides corresponding to the suction nozzle mechanism 32 on the flip platform 313.

[0044] The multifunctional flip assembly 3 of the present application has two modes when transferring the wafer from the film expansion device 2 to the transfer device 4:

[0045] When the wafer is on the film expansion device 2 , the side facing upward is set as the first surface, and the side facing downward is set as the second surface.

[0046] Mode 1 is that after the first surface of the wafer is transferred to the transfer device 4 , the first surface faces downward, that is, the posture of the wafer is reversed before and after the transfer.

[0047] Mode 2 is that after the first surface of the wafer is transferred to the transfer device 4, the first surface is still facing upward, that is, the posture of the wafer does not flip before and after the transfer.

[0048] When this application works in Mode 1:

[0049] Step 1: The film expansion device 2 carries the wafer and moves along the horizontal plane on the base 1, driving the wafer to be adsorbed thereon to the connecting line between the ejector head 51 of the ejector assembly and the suction nozzle 325 located at the suction station. Subsequently, the ejector assembly 5 is actuated, and the ejector head 51 rises to lift the wafer at the corresponding position on the wafer film. At the same time, the suction nozzle 325 located at the suction station is pressed down by the suction nozzle axial driver 322. After contacting and adsorbing the first surface of the wafer, the suction nozzle axial driver 322 drives the suction nozzle 325 to reset. The flip mechanism 31 drives the suction nozzle mechanism 32 to rotate to the position corresponding to the detection end of the surface detection camera 6, so as to perform defect detection on the second surface of the adsorbed wafer.

[0050] Step 2: The flip mechanism 31 continues to drive the suction nozzle mechanism 32 to rotate to the corresponding placement position of the transfer device 4, and the suction nozzle axial driver 322 drives the suction nozzle 325 to carry the wafer along the axial direction to dock the wafer with the transfer device 4, so that the transfer device 4 adsorbs the second surface of the wafer. At this time, the surface detection camera 6 set corresponding to the transfer device 4 detects the first surface of the wafer. Wafers with qualified first and second surfaces are transported to the braiding mechanism by the transfer device 4.

[0051] In order to be able to transport the wafers in mode 2, in this embodiment, the nozzle mechanism 32 is set as a pair, which are respectively set as the first nozzle mechanism 32a and the second nozzle mechanism 32b and the corresponding first nozzle 325a and the second nozzle 325b. The first nozzle mechanism 32a and the second nozzle mechanism 32b are respectively connected to the two ends of the flip platform 313 through the nozzle rotation driver, so that they can revolve around the axis of the flip mechanism 31 and can also revolve around the axis of the flip mechanism 31. Figure 2 The end of the wafer adsorbed on any suction nozzle mechanism 32 away from the suction nozzle mechanism 32 can be adsorbed by another suction nozzle mechanism 32 in the handover station, and with the cooperation of the flip mechanism 31, the side of the wafer attached to the film expansion mechanism is different from the adsorption surface adsorbed by the transfer device 4.

[0052] When this application works in Mode 2:

[0053] Step 1: The film expansion device 2 carries the wafer and moves along the horizontal plane on the base 1, driving the wafer to be adsorbed thereon to the connecting line between the ejector head 51 of the ejector assembly and the suction nozzle 325 located at the suction station. Subsequently, the ejector assembly 5 is actuated, and the ejector head 51 rises to lift the wafer at the corresponding position on the wafer film. At the same time, the suction nozzle 325 located at the suction station is pressed down by the suction nozzle axial driver 322. After contacting and adsorbing the first surface of the wafer, the suction nozzle axial driver 322 drives the suction nozzle 325 to reset. The flip mechanism 31 drives the suction nozzle mechanism 32 to rotate to the position corresponding to the detection end of the surface detection camera 6, so as to perform defect detection on the second surface of the adsorbed wafer.

[0054] Step 2: After the second surface of the wafer is inspected by the surface inspection camera 6 on either side, the two nozzle rotation drivers respectively drive the two nozzle mechanisms 32 to rotate 180° around the rotation axis, so that the nozzles 325 on the two nozzle mechanisms 32 enter the handover station with the shortest distance between each other.

[0055] Step 3. In the handover station, the second suction nozzle 325b approaches the second surface of the wafer and, driven by the suction nozzle 325 driver, sucks the second surface of the wafer. At the same time, the first suction nozzle 325a releases the suction force on the wafer, completing the handover of the wafer from one suction nozzle mechanism 32 to another suction nozzle mechanism 32.

[0056] Step 4: The wafer after the handover is rotated 180° along with the second nozzle mechanism 32 b so as to face the radial direction away from the handover station, so that the first surface of the wafer facing outward is inspected for defects by another surface inspection camera 6 .

[0057] Step 5: The flipping mechanism 31 is activated to drive the second nozzle mechanism 32b currently carrying the wafer to the placement station.

[0058] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention.

Claims

1. A wafer sorting machine with a multifunctional flipping assembly, characterized in that: It comprises a base, on which a film expanding device, a multifunctional turning component and a transfer device are arranged; The film expansion device is used to spread the cut wafers; A multifunctional flip assembly has a flip mechanism that can rotate around its own axis, the flip mechanism is radially provided with a suction nozzle mechanism, and the suction nozzle mechanism has a suction station corresponding to the film expansion device and a delivery station corresponding to the transfer device under the drive of the flip mechanism; The nozzle mechanism is arranged in pairs in the radial direction of the flip mechanism, and is rotationally connected to the flip mechanism through a nozzle rotation driver, so that it can revolve around the axis of the flip mechanism and also rotate around the execution end of the nozzle rotation driver; The pair of nozzle mechanisms have a handover station with the shortest distance between the suction ends under the drive of the nozzle rotation driver, and the end of the wafer suctioned on any nozzle mechanism away from the nozzle mechanism can be suctioned by another nozzle mechanism in the handover station, and with the cooperation of the flip mechanism, the side of the wafer attached to the film expansion mechanism is different from the suction surface suctioned by the transfer device; Surface detection cameras are provided corresponding to the multifunctional flip assembly and the transfer device, and the surface detection cameras are provided in pairs on both sides of the multifunctional flip assembly.

2. A wafer sorting machine with a multifunctional flipping assembly according to claim 1, characterized in that: The suction nozzle mechanism includes a suction nozzle base, and a suction nozzle is connected to one end of the suction nozzle base away from the suction nozzle rotation driver, and the suction nozzle is used to suck the wafer; the suction nozzle is connected to the suction nozzle base through a suction nozzle axial driver, and the suction nozzle axial driver drives the suction nozzle to move axially for sucking and placing the wafer.

3. A wafer sorting machine with a multifunctional flipping assembly according to claim 2, characterized in that: The nozzle base is configured as an L-shaped structure, and two vertical edges are respectively connected to the nozzle axial driver and the flip mechanism; the nozzle axial driver is connected to the nozzle through a nozzle connecting plate, and the nozzle connecting plate is configured as a Z-shaped structure, and the horizontal section away from the nozzle axial driver is fixed to the nozzle, and its vertical section is provided with a guide connected to the nozzle base.

4. The wafer sorting machine with a multifunctional flipping assembly according to claim 3, characterized in that: The guide comprises a slide block and a guide rail, wherein the guide rail is fixed to the vertical section of the nozzle connecting plate, and the slide block is fixed to the nozzle base.

5. The wafer sorting machine with a multifunctional flipping assembly according to claim 1, characterized in that: The flipping mechanism includes a flipping base fixed to the base, the flipping base is connected to a flipping driver, the execution end of the flipping driver passes through the flipping base and is connected to a flipping platform, the middle part of the flipping platform is fixed to the execution end of the flipping driver, and the two ends are correspondingly connected to a pair of suction nozzle mechanisms.

6. A wafer sorting machine with a multifunctional flipping assembly according to claim 4 or 5, characterized in that: A pin assembly is also provided, which is arranged below the film expansion device and has a lifting end that can move along a vertical axis and lift the wafer, and the suction nozzle mechanism absorbs the wafer lifted by the lifting end.

7. A wafer flipping method, using a wafer sorting machine with a multifunctional flipping component as claimed in claim 6, characterized in that: The upward side of the wafer on the film expansion device is set as the first surface, and the downward side is set as the second surface; The wafer flipping method includes a first flipping mode and a second flipping mode; wherein the first flipping mode includes the following steps: Step 1: The film expansion device carries the wafer on the base and moves along the horizontal plane, driving the wafer to be adsorbed thereon to the connecting line between the ejector head of the ejector assembly and the suction nozzle located at the suction station; then, the ejector assembly is actuated, and the ejector head rises to lift the wafer at the corresponding position on the wafer film, and at the same time, the suction nozzle located at the suction station is pressed down by the axial drive of the suction nozzle, and after contacting and adsorbing the first surface of the wafer, the axial drive of the suction nozzle drives the suction nozzle to reset; the flip mechanism drives the suction nozzle mechanism to rotate to the position corresponding to the detection end of the surface detection camera, so as to perform defect detection on the second surface of the adsorbed wafer; Step 2: The flip mechanism continues to drive the suction nozzle mechanism to rotate to the placement station of the corresponding transfer device, and the suction nozzle axial driver drives the suction nozzle to carry the wafer to move axially to dock the wafer with the transfer device, so that the transfer device adsorbs the second surface of the wafer; at this time, the surface detection camera set corresponding to the transfer device detects the first surface of the wafer; the wafers with qualified first and second surfaces are transported to the braiding mechanism by the transfer device; A pair of suction nozzle mechanisms are set to be a first suction nozzle mechanism and a second suction nozzle mechanism and the corresponding first suction nozzle and second suction nozzle; The second flip mode comprises the following steps: Step 1: The film expansion device carries the wafer on the base and moves along the horizontal plane, driving the wafer to be adsorbed thereon to the connecting line between the ejector head of the ejector assembly and the suction nozzle located at the suction station; then, the ejector assembly is actuated, and the ejector head rises to lift the wafer at the corresponding position on the wafer film, and at the same time, the suction nozzle located at the suction station is pressed down by the axial drive of the suction nozzle, and after contacting and adsorbing the first surface of the wafer, the axial drive of the suction nozzle drives the suction nozzle to reset; the flipping mechanism drives the suction nozzle mechanism to rotate to the position corresponding to the detection end of the surface detection camera, so as to perform defect detection on the second surface of the adsorbed wafer; Step 2: After the second surface of the wafer is inspected by the surface inspection camera on either side, the two nozzle rotation drivers respectively drive the two nozzle mechanisms to rotate 180 degrees, so that the nozzles on the two nozzle mechanisms enter the handover station with the shortest distance between each other; Step 3: In the handover station, the second suction nozzle approaches the second surface of the wafer and sucks the second surface of the wafer under the drive of the suction nozzle driver, while the first suction nozzle releases the suction force on the wafer, completing the handover of the wafer from one suction nozzle mechanism to another suction nozzle mechanism; Step 4: The wafer after the handover is rotated 180 degrees with the second nozzle mechanism so that it faces the radial direction away from the handover station, so that the first surface of the wafer facing outward is inspected for defects by another surface inspection camera; Step 5: The flipping mechanism is actuated to drive the second nozzle mechanism currently carrying the wafer to the delivery station.

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