A docking and transfer device for silicon wafer edge removal

Abstract

The present application provides a docking and transfer device for silicon wafer edge removal, a spin-drying mechanism, which is equipped with a clamping assembly that can clamp a single silicon wafer of different sizes, the clamping assembly includes a mounting plate and a multi-stage frame and positioning columns placed on the mounting plate, and a clamping block for clamping the outer edge of the silicon wafer is provided on the multi-stage frame; a transfer mechanism, which is equipped with dry fingers and wet fingers that are placed back to back and rotate in opposite directions, and are suspended across the spin-drying mechanism, the wet fingers can place the wet silicon wafer in the space enclosed by the positioning columns and be clamped by the clamping block; the dry fingers can take the dried silicon wafer away from the clamping block. The present application provides a docking and transfer device for silicon wafer edge removal, which can automatically receive and receive silicon wafers, and can take out wafers by dry or wet classification, and can clamp multiple sizes compatibly, with a reasonable structural design, precise coordination of each component, controllable placement position, good compatibility, high working efficiency and fast transfer speed.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor silicon wafer production equipment, and in particular, relates to a docking and transfer equipment for silicon wafer edge removal. Background Art

[0002] In the existing silicon wafer etching and edge removal machines, the loading and unloading transfer equipment at the front end that is connected to the production line has an unreasonable structural design, which results in low efficiency and easy wafer stacking during loading, and the wafer basket needs to be placed manually on the workbench, making the connection between the upper and lower processes incoherent. At the same time, since the drying mechanism can only control single-size silicon wafers and cannot be compatible with the placement of silicon wafers of multiple sizes, when changing the silicon wafer model, the clamping mechanism needs to be replaced to adapt to the clamping of the new size silicon wafer, and the equipment is poorly intelligent. Summary of the invention

[0003] The present application provides a docking and transferring device for silicon wafer edge removal, which solves the technical problems of poor automation and low compatibility in existing equipment.

[0004] In order to solve at least one of the above technical problems, the technical solution adopted in this application is:

[0005] A docking and transfer device for silicon wafer edge removal, comprising:

[0006] A spin-drying mechanism, which is equipped with a clamping assembly capable of clamping a single silicon wafer of different sizes, the clamping assembly comprising a mounting plate and a multi-stage frame and a positioning column placed on the mounting plate, and a clamping block for clamping the outer edge of the silicon wafer is provided on the multi-stage frame;

[0007] The transfer mechanism is equipped with dry fingers and wet fingers which are placed opposite to each other and rotate in opposite directions, and are suspended across the drying mechanism. The wet fingers can place the wet silicon wafers into the space enclosed by the positioning columns and be clamped by the clamping block; the dry fingers can take the dried silicon wafers away from the clamping block after being spun.

[0008] Furthermore, the mounting plate is constructed as a "cross" structure, the multi-stage frame and the positioning column are both arranged at the extended end thereof; and the multi-stage frame is pivotally connected to the mounting plate.

[0009] Furthermore, the clamping assembly also includes a support shaft for supporting the mounting plate, which is constructed as a hollow structure and has long holes arranged along its length on its axial wall surface; by driving the support shaft to rotate, it can drive the clamping block to rotate through the mounting plate.

[0010] Furthermore, the multi-stage frame is constructed as a multi-stage stepped structure, and all the step surfaces are arranged toward the center of the support shaft; it is provided with a downwardly suspended straight section and step sections that rise step by step and are inclined outward, and a plurality of slots that cooperate with the clamping block are provided on one side surface of the step section close to the support shaft.

[0011] Furthermore, the slot is constructed as a blind hole slot with a U-shaped structure; the clamping block includes a tail and an end, the tail is directly inserted into the slot, and the end clamps the outer edge of the silicon wafer; the end face of the end is constructed as a curved surface structure connected by double arc surfaces, the intersection of which is an arc surface groove, and the height of the upper arc surface is greater than the height of the lower arc surface.

[0012] Furthermore, a connecting block connected to the lifting cylinder through a connecting rod is provided on the inner side of the support shaft, a connecting claw connected to the connecting block is provided on the top of the connecting block, and a plurality of connecting rods pivotally connected to the connecting claw are provided on the connecting claw, and the connecting rods pass through the long holes on the support shaft and are pivotally connected to the lower end of the multi-stage frame;

[0013] The lifting cylinder drives the connection block to rise and fall through the connecting rod, so that the connection claw drives the multi-stage frame to expand outward or contract inward through the connecting rod, so as to adjust the area surrounded by the clamping block to loosen or clamp the silicon wafer.

[0014] Furthermore, the drying mechanism also includes a gas-liquid component and a protective component, wherein:

[0015] The gas-liquid assembly comprises: a lower nozzle placed at the center of the mounting plate and an upper nozzle suspended above the silicon wafer, the upper nozzle being connected to a swing motor through a pipe rack, the swing motor being able to drive the upper nozzle through the pipe rack, and when the clamping assembly drives the silicon wafer to rotate, the upper nozzle is swung while flushing water or blowing air; the lower nozzle is always fixed in position and does not move;

[0016] The protection assembly comprises an outer cylinder and an inner cylinder arranged inside the outer cylinder, and the inner cylinder is controlled to rise and fall so as to surround the silicon wafers therein when the silicon wafers are spun dry.

[0017] Furthermore, a finished product table is provided at the rear side of the drying mechanism, and the transfer mechanism includes a suspension beam arranged across the drying mechanism and the finished product table, and a transfer assembly for controlling the movement of the dry fingers and the wet fingers is provided on the suspension beam;

[0018] The dry finger and the wet hand are suspended on the transfer assembly through a fixing frame, separated by an isolation plate placed on the fixing frame, and are respectively connected to the two sides of the fixing frame through finger motors;

[0019] The dry finger and the wet hand are connected to the finger motor via a rotating shaft, and are driven by the rotating shaft to alternately flip between a horizontal state when working and a vertical state when not working; and the stretching direction of the dry finger and the wet hand in the horizontal state is consistent with the silicon wafer transmission direction, and the dry finger and the wet hand are placed upright in the vertical state.

[0020] Furthermore, a feeding mechanism and a temporary storage mechanism are provided in sequence before the drying mechanism, wherein:

[0021] The spin-drying mechanism is provided with an upper loading platform for storing the wafer basket and a placing platform for placing the silicon wafers, and the silicon wafers placed in the wafer basket are moved one by one to the placing platform for placement by means of the material taking finger;

[0022] The temporary storage mechanism includes a temporary storage table and a suspension suction cup for transferring silicon wafers, which can absorb and take out the silicon wafers that have been sliced ​​onto the placement table, and transfer the silicon wafers to the temporary storage table;

[0023] The structure of the temporary storage table is the same as that of the placement table, and both are provided with a matching groove with a radius length, but the orientations of the matching grooves in the two are different.

[0024] Furthermore, the material loading mechanism includes two loading platforms and two placing platforms, and the material taking finger is placed at the center of the interval surrounded by it; and the two loading platforms and the two placing platforms are relatively located relative to the position of the material taking finger;

[0025] The upper loading platform is arranged on the base through a rotating platform and is driven by a rotating motor arranged on the base; a horizontal motor is also arranged on the inner side of the base to drive the rotating motor to move along the length direction of the base;

[0026] The horizontal motor drives the rotating motor to move through the roller transmission, and drives the upper loading platform and the wafer basket carrying the silicon wafers through the rotating table to move from the loading end far from the material taking finger to the wafer separation end close to the material taking finger;

[0027] At the slice splitting end, the rotary motor drives the rotating table to drive the upper loading table and the slice basket to rotate together, and the opening of the slice basket is tilted toward the side of the material taking finger.

[0028] A docking and transferring device for silicon wafer edge removal designed in this application can automatically receive and receive silicon wafers, and can classify and take out wafers of different sizes, and can be compatible with clamping. It has a reasonable structural design, precise coordination of various components, controllable placement, good compatibility, high working efficiency and fast transfer speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a top view of a docking and transferring device for edge removal of silicon wafers according to an embodiment of the present application;

[0030] Figure 2is a three-dimensional diagram of a feeding mechanism according to an embodiment of the present application;

[0031] Figure 3 This is a state diagram of a feeding component of an embodiment of the present application at the feeding end;

[0032] Figure 4 This is a state diagram of a feeding assembly in an embodiment of the present application at the slice end;

[0033] Figure 5 is a cross-sectional view of the distribution of motors in a base according to an embodiment of the present application;

[0034] Figure 6 is a schematic diagram of a sheet placement assembly according to an embodiment of the present application;

[0035] Figure 7 is a schematic diagram of a temporary storage mechanism according to an embodiment of the present application;

[0036] Figure 8 is a three-dimensional diagram of a drying mechanism according to an embodiment of the present application;

[0037] Fig. 9 is a schematic diagram of a clamping assembly according to an embodiment of the present application;

[0038] Fig.10 It is a schematic diagram of the cooperation between the multi-stage frame and the clamping block according to an embodiment of the present application;

[0039] Fig.11 is a schematic diagram of a clamping assembly from another angle of an embodiment of the present application;

[0040] Fig.12 is a schematic diagram of a gas-liquid component according to an embodiment of the present application;

[0041] Fig.13 is a schematic diagram of a protection component according to an embodiment of the present application;

[0042] Fig.14 is a schematic diagram of a transfer mechanism according to an embodiment of the present application;

[0043] Fig.15 is a schematic diagram of a partial transfer mechanism of an embodiment of the present application;

[0044] Fig.16 Schematic diagram of the airway layout on a dry finger according to an embodiment of the present application.

[0045] In the figure:

[0046] 10. Feeding mechanism; 11. Feeding assembly; 111. Base; 112. Loading platform; 113. Rotating motor 1; 114. Rotating platform; 115. Sheet basket; 116. Translation motor; 12. Sheet placement assembly; 121. Placing platform; 122. Adjusting slide; 123. Matching slot; 13. Retrieving finger; 20. Temporary storage mechanism; 21. Temporary storage platform; 22. Suspended suction cup; 30. Drying mechanism; 31. Mounting platform; 32. Clamping assembly; 321. Support shaft; 322. Mounting plate; 323. Multi-stage rack; 324. Clamping block; 325. Positioning column; 326. Connecting rod; 327. Connecting claw; 328. Rotating motor 2; 329. Lifting cylinder ; 33. Gas-liquid component; 331. Upper nozzle; 332. Lower nozzle; 333. Upper pipe rack; 334. Pipe fixing frame; 335. Swing motor; 336. Identifier; 337. Identification disk; 338. Drain pipe; 34. Protection component; 341. Outer cylinder; 342. Inner cylinder; 343. Vertical plate rack; 344. Cylinder two; 40. Transfer mechanism; 41. Suspension beam; 42. Lifting and shifting group; 43. Horizontal shifting group; 44. Fixed frame; 45. Dry finger; 46. Wet finger; 47. Isolation plate; 48. Finger motor; 49. Rotating shaft; 410. Connector; 411. Cover plate; 412. Airway; 50. Finished product table; 60. Pickling mechanism. DETAILED DESCRIPTION

[0047] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] This embodiment provides a docking and transfer device for silicon wafer edge removal, such as Figure 1 As shown, the device comprises a loading mechanism 10 for taking out silicon wafers placed in a wafer basket one by one, a temporary storage mechanism 20 for transferring and storing silicon wafers, a spin-drying mechanism 30 for cleaning both sides of the silicon wafers and drying the surface of the silicon wafers, and a transfer mechanism 40 for taking wet silicon wafers from the temporary storage mechanism 20 and placing them in the spin-drying mechanism 30, and taking dry silicon wafers from the spin-drying mechanism 30 and transferring them to the unloading mechanism. The loading mechanism 10 is arranged at one end of the device, the spin-drying mechanism 30 is arranged at the other end of the device, the temporary storage mechanism 20 is arranged between the loading mechanism 10 and the spin-drying mechanism 30, and the transfer mechanism 40 is suspended on the top of the device and is located above the temporary storage mechanism 20 and the spin-drying mechanism 30. During the entire process, each mechanism is equipped with two sets of components to cooperate with each other, which not only saves time, but also does not interfere with each other and cooperates accurately. They can automatically take and place silicon wafers and accurately position them, and can also take out wafers by dry or wet classification. It is suitable for the production of silicon wafers of multiple sizes and does not require human assistance. The connections between each mechanism have a high utilization rate, good compatibility and high stability, high work efficiency and fast transfer speed.

[0049] like Figure 2As shown, the loading mechanism 10 includes two loading assemblies 11 for placing wafer baskets, two wafer placing assemblies 12 for placing silicon wafers, and a multi-axis rotating material taking finger 13 that moves back and forth between the loading assemblies 11 and the wafer placing assemblies 12. The two loading assemblies 11 and the two wafer placing assemblies 12 are arranged around the material taking finger 13 and are all arranged toward the center position of the material taking finger 13. The material taking finger 13 is arranged on the center line of the entire width direction of the equipment, that is, along the center line position of the silicon wafer transmission direction. The two loading assemblies 11 are located outside the material taking finger 13, that is, placed at the end of the machine table of the equipment. The wafer placement assembly 12 is located on the side of the material picking finger 13 close to the temporary storage mechanism 20, and is placed opposite to the center of the circle of the material picking finger 13. The material picking finger 13 is located in the middle position surrounded by the loading assembly 11 and the wafer placement assembly 12; and the extended lines of the silicon wafer picking and placing angles in the loading assembly 11 and the wafer placement assembly 12 intersect at the center of the circle of the material picking finger 13.

[0050] like Figure 3-Figure 4 As shown, in the loading mechanism 10, two loading platforms 112 and two placing platforms 121 are provided, and the material picking finger 13 is placed at the center of the area surrounded by it, and the two loading platforms 112 and the two placing platforms 121 are placed opposite to each other relative to the center line of the machine where the material picking finger 13 is located. The rotating platform 114 drives the loading platform 112 and the wafer basket carrying silicon wafers to move from the loading end to the wafer splitting end, and is driven by the rotating motor 113 placed on one side of the wafer splitting end, so that the rotating platform 114 drives the loading platform 112 and the wafer basket to rotate together, and the opening of the wafer basket is tilted toward the side of the material picking finger 13.

[0051] Furthermore, the two loading components 11 have the same structure, and each loading component 11 is provided with an upper loading platform 112, which is placed on the base 111, and a film basket frame 115 for loading a film basket is provided on the upper loading platform 112. The base 111 is fixed on the machine platform, and the upper loading platform 112 is arranged on the base 111 through a rotating platform 114, and the base 111 is movably connected with the rotating platform 114, and the upper loading platform 112 is fixed on the top of the rotating platform 114. On the base 111, the end away from the material picking finger 13 is the loading end, and the end close to the material picking finger 13 is the film separation end.

[0052] like Figure 5As shown, the base 111 is arranged along the length direction of the machine, and in the middle of its upper end surface, a translation motor 116 is provided for driving the rotating table 114 to move along the length direction of the base 111, which is arranged on the inner side of the base 111. Correspondingly, the rotating motor 113 is located on the central axis of the base 111 and is arranged vertically. The translation motor 116 can drive the flat roller to rotate through the rotating shaft to drive the rotating motor 113 to gradually move from the feeding end to the slicing end, or from the slicing end to the feeding end along the length direction of the base 111. At the same time, at the slicing end, the rotating motor 113 can drive the rotating table 114 to rotate to control the direction of the opening end of the slice basket 115.

[0053] like Figure 3 As shown, when the upper loading platform 112 is located at the loading end of the base 111, the wafer basket 115 is provided with a wafer basket containing silicon wafers, and the opening end of the wafer basket is placed inward, that is, it is placed inward along the center line of the base 111. The translation motor 116 drives the roller to drive the rotating motor 113, the rotating platform 114, the upper loading platform 112 and the wafer basket 115 to move horizontally toward the wafer separation end until they move to the wafer separation end.

[0054] like Figure 4 As shown, when the rotating table 114 moves to the slicing end, the rotating motor 113 will drive the rotating table 114 to rotate, so that the open end of the wafer basket 115 placed on the upper loading platform 112 is offset and rotated 45° toward the position of the material picking finger 13, so that the opening of the wafer basket 115 placed on the upper loading platform 112 is tilted toward the material picking finger 13. At this time, the open ends of the wafer baskets 115 on both sides are tilted toward the material picking finger 13, which is convenient for the material picking operation of the material picking finger 13. The open end of the wafer basket is set forward at the loading end relative to the position of the material picking finger 13, and is set obliquely at the slicing position. The upper loading platform 112 is not only movable but also rotatable, which can drive the wafer basket carrying silicon wafers to adjust the different directions of posture at different positions to adapt to the requirements of different positions.

[0055] like Figure 5 As shown, each sheet placement assembly 12 is provided with a placement table 121, and the two placement tables 121 are oppositely placed on both sides of the material picking finger 13. A matching groove 123 with a radius length for matching with the material picking finger 13 is provided on one side of the placement table 121. The matching groove 123 starts from the center of the placement table 121 and directly penetrates to its outer wall surface. It is a groove with a single side opening, mainly matching the size and shape of the material picking finger 13. The matching grooves 123 in the two placement tables 121 are both arranged obliquely toward one side of the material picking finger 13, and the extension lines of the matching grooves 123 intersect at the center of the circle where the material picking finger 13 is located.

[0056] The material-picking finger 13 is a multi-axis ceramic finger, which is a long strip structure with a number of air holes on it. The silicon wafer can be stably placed on its upper end surface by vacuum adsorption. The material-picking finger 13 is driven by a multi-axis pivot connection, can be extended and retracted up and down along the vertical height direction, and can be rotated based on a preset angle on any horizontal plane, accurately taking out the silicon wafer from the wafer basket 115, and quickly placing the silicon wafer on the placement table 121. In order to save the time of rotation and movement of the material-picking finger 13 and optimize its route, preferably, the open end of the wafer basket 115 at the wafer splitting end and the open end of the matching groove 123 are tilted to point to the material-picking finger 13, and the tilt angle is 45°, which can minimize the rotation angle of the material-picking finger 13 and the transfer route.

[0057] Vacuum suction holes for adsorbing silicon wafers are provided outside the matching groove 123 and around the center of the placement table 121. These suction holes are spaced and evenly arranged. At the same time, an adjustment slide 122 for adjusting the position of the placement table 121 is provided at the periphery of the lower end of the placement table 121. The adjustment slide 122 is mainly used to fine-tune the horizontal and vertical positions of the placement table 121 in the horizontal plane.

[0058] In this process, the empty wafer basket 115 is first placed at the loading end of the base 111, and the robot places the wafer basket with silicon wafers in the wafer basket 115. At this time, the opening of the wafer basket 115 is facing the wafer splitting end, and all silicon wafers are inserted horizontally into the wafer basket. After that, the translation motor 116 drives the roller to drive the rotating motor 113 to move, thereby driving the rotating table 114, the upper loading table 112, and the wafer basket 115 to move horizontally to the wafer splitting end on the base 111; when the rotating table 114 is at the wafer splitting position, the rotating shaft of the rotating motor 113 rotates against the rotating table 114, so that the opening side of the wafer basket 115 rotates 45° toward the side of the center of the circle where the material picking finger 13 is located, and then stands still. The material picking finger 13 then adjusts its position and angle to take out the silicon wafers from the wafer basket 115, wherein the material picking finger 13 first takes the wafers from the top of the wafer basket, and then takes them out one by one from top to bottom along the height of the wafer basket. The material taking finger 13 drives the silicon wafer to rotate and adjust its position so that its height matches the height of the placing table 121, and then the silicon wafer is placed on the placing table 121. At this point, the loading work of the silicon wafer is completed.

[0059] In the loading mechanism 10, the loading assembly 11 can automatically adjust the wafer basket containing silicon wafers to different working postures at different positions, that is, two postures, one positive and one inclined, relative to the position of the material picking finger 13, which are respectively the positive posture at the loading position and the inclined posture at the material picking position. At the same time, multiple groups of loading platforms 112 and placement platforms 121 can work synchronously or asynchronously, and the silicon wafers can be picked up and placed through the same material picking finger 13, with fast flow efficiency; no human intervention is required, the docking efficiency is high and it is safe and reliable; not only can the transfer distance be shortened, but also the pick-up and placement accuracy is high, ensuring the consistency of docking and slicing of all silicon wafers.

[0060] After the feeding mechanism 10 is the pickling mechanism 60, which is located between the feeding mechanism 10 and the temporary storage mechanism 20. The pickling mechanism 60 is mainly used to pickle the surface layer on the surface of the silicon wafer. The pickling mechanism is provided with two pickling tanks, and the temporary storage mechanism 20 is provided with two temporary storage tables 21. Each pickling tank corresponds to the position of the placement table 121 and the temporary storage table 21 on the same side, and is located in the middle; and through the suspension suction cup 22 that spans the placement table 121, the pickling mechanism, and the temporary storage mechanism 20, it goes back and forth between these three positions. For the placement table 121, the cleaning tank, and the temporary storage table 21 on the same side, the suspension suction cup 22 can transfer the silicon wafer placed on the placement table 121 to the pickling tank, and then transfer the silicon wafer in the pickling tank to the temporary storage table 21 through the suspension suction cup 22. Because the pickling mechanism 60 is not the focus of this case, its structure and drawings are omitted here.

[0061] like Figure 7 As shown, the temporary storage mechanism 20 includes a temporary storage table 21 and a suspension suction cup 22 placed on the frame and suspended, which can absorb and take out the silicon wafers sliced ​​onto the placement table 121, and transfer the silicon wafers to the temporary storage table 21. Among them, the temporary storage mechanism 20 is provided with two temporary storage tables 21 and two suspension suction cups 22, the suspension suction cups 22 on both sides share the same fixed frame beam, and two independent moving components are respectively provided on both sides of the frame beam to control the moving position of the suspension suction cups 22. Among them, the moving component includes a transverse sliding group moving along the length direction of the frame beam, that is, the direction of silicon wafer transmission, and a lifting sliding group moving along the height direction of the frame. Since the placement table 121, the cleaning tank, and the temporary storage table 21 are in the same row along the length direction of the frame, there is no need to adjust the lateral position of the suspension suction cup 22, that is, there is no need to set a transverse sliding group moving along the width direction of the frame.

[0062] The structure of the temporary storage table 21 is the same as that of the placement table 121, and both are provided with a matching groove 123 of a radial length, but the orientations of the matching grooves 123 of the two are different. The matching groove 123 in the placement table 121 is arranged obliquely toward the position of the material picking finger 13, that is, it is arranged obliquely toward the position located at the center line of the machine; while the matching groove 123 in the temporary storage table 21 is arranged along the silicon wafer transmission direction, and its opening is arranged on the side facing the direction of the spin-drying mechanism 30. The suspension suction cup 22 is driven by the beam arranged along the length direction of the machine, and reciprocates between the placement table 121, the cleaning tank and the temporary storage table 21. The structure of the suspension suction cup 22 is a conventional structure and is not specifically limited here.

[0063] like Figure 8As shown, the drying mechanism 30 is located behind the temporary storage mechanism 20, and is mainly used to rinse the liquid on both sides of the silicon wafer and blow and dry the silicon wafer. The main purpose of rinsing is to dilute the acid liquid remaining on the surface of the silicon wafer, and the rinsing liquid is pure water. The drying mechanism 30 includes a workbench and two clamping assemblies 32 for clamping multiple types of silicon wafers. Each clamping assembly 32 is equipped with a gas-liquid assembly 33 for flushing and drying the silicon wafer and a protective assembly 34 for preventing gas and liquid from splashing during drying. That is, a set of clamping assemblies 32, gas-liquid assemblies 33 and protective assemblies 34 are respectively arranged on both sides of the frame beam to clean and dry the silicon wafer on one side.

[0064] The two clamping assemblies 32 share a workbench, and two mounting holes are provided on the workbench to respectively match the clamping assemblies 32 on both sides; and the spin-drying assemblies on both sides of the frame beam work independently of each other without interfering with each other. Therefore, the spin-drying assembly on one side is taken as an example for detailed description.

[0065] Specifically, the clamping assembly 32, the gas-liquid assembly 33 and the protective assembly 34 all pass through the mounting hole groove and are fixed together on the mounting platform 31. The mounting platform 31 is located below the workbench, and the clamping assembly 32 is constructed inside the protective assembly 34 and is suspended.

[0066] like Fig. 9 As shown, the clamping assembly 32 includes a second rotating motor 328 fixed under the mounting platform 31, and a synchronous pulley (omitted in the figure) connected to the output end of the second rotating motor 328. A support shaft 321 coaxially connected to the synchronous pulley is provided on the upper end surface of the mounting platform 31, and a mounting plate 322 with a "cross" structure is fixed on the top of the support shaft 321. A multi-stage frame 323 with a stepped structure and a positioning column 325 for supporting and positioning the position of the silicon wafer are provided on the four extension ends of the mounting plate 322; the stepped table surface of the multi-stage frame 323 is arranged toward the center side of the support shaft 321, and a clamping block 324 for clamping the outer edge of the silicon wafer is provided on the stepped table surface of the multi-stage frame 323.

[0067] Each type of silicon wafer is equipped with four clamping blocks 324 and four positioning columns 325 of the same type, and are evenly distributed on the four outer ends of the mounting plate 322; the four clamping blocks 324 can clamp the outer edges of the silicon wafer, and the positioning columns 325 can not only guide the silicon wafer, but also support the lower end surface of the silicon wafer, so that it can be placed horizontally and stably in the space surrounded by the clamping blocks 324. When the silicon wafer is placed in the space surrounded by the positioning columns 325 of the corresponding type, the silicon wafer will be immediately positioned and guided to the space clamped by the corresponding clamping block 324 for fixing. After the silicon wafer is clamped and fixed, the output end of the second rotating motor 328 transmits power to the support shaft 321 through the synchronous pulley, and then the support shaft 321 rotates to drive the clamped silicon wafer to rotate.

[0068] like Fig.10 As shown, the multi-stage frame 323 is provided with a straight section suspended downward and a step section that rises step by step and is tilted outward. On a single side surface of the step section, three groups of slots are provided from bottom to top along the height direction, and the slots are blind holes of U-shaped structure and their depth is less than the thickness of the multi-stage frame 323. The three groups of slots are arranged horizontally in a stepped manner, and their openings are all arranged toward the center of the silicon wafer. Along the stepped surface of the multi-stage frame, the opening positions of the three slots are all arranged horizontally and horizontally, and are arranged staggered outward in a stepped manner, in order to adapt to silicon wafers of different specifications and models; and a mounting hole for fixing the clamping block 324 is provided near the opening side of the slot. The clamping block 324 matched with the slot on the top layer has the largest size and is used to clamp the silicon wafer of the largest size; the clamping block 324 corresponding to the slot at the bottom can clamp the silicon wafer of smaller size, and the clamping block 324 corresponding to the slot in the middle position is mainly used to clamp the silicon wafer of the middle size. In this embodiment, the multi-stage rack 323 is mainly adapted to three types of silicon wafers, namely 8-inch, 6-inch, and 5-inch structures. Of course, it can also be designed to be silicon wafers of other different sizes. There is no specific restriction here, and the multi-stage rack 323 of this type of structure can be used for design and use.

[0069] The clamping block 324 is directly fixed on the multi-stage frame 323 by bolts, and the clamping block 324 includes a tail and an end. The tail is directly inserted into the slot, and the end is mainly used to clamp the outer edge of the silicon wafer; wherein, the thickness of the end is adapted to the thickness of the step section in the multi-stage frame 323 and is greater than the slot depth of the slot, and it is clamped at the end of the slot. The end surface of the end is constructed as a curved surface structure connected by double arc surfaces, and the intersection is an arc groove. In order to further ensure the stability and stability of the clamped silicon wafer, the groove is set at the lowest point of the double arc surface connection; at the same time, in order to improve the strength of the clamping, the height of the upper arc surface is required to be greater than the height of the lower arc surface, so as to prevent the silicon wafer from shaking or displacing out of the groove during the rotation process.

[0070] like Fig.11As shown, on the lower end surface of the mounting platform 31, there is also a lifting cylinder 329 for driving the clamping block 324 to expand outward or to fine-tune the contraction inward. The support shaft 321 is constructed as a hollow structure, and four long holes are arranged along its height on its wall. A connecting block connected to the lifting cylinder 329 through a connecting rod 326 is provided on the inner side of the support shaft 321, and a connecting claw 327 fixedly connected to the connecting block is provided on the top of the connecting block. The connecting claw 327 is a square-structured seat, which is directly connected to the connecting block, and four connecting grooves are provided on the periphery of the seat, and a connecting rod 326 connected to it by bolts is provided on each connecting groove, one end of all the connecting rods 326 is pivotally connected to the connecting groove, and the other end of the connecting rod 326 passes through the long hole on the wall of the support shaft 321 and is directly pivotally connected to the lower end of the multi-stage frame 323. Thus, the multi-stage frame 323 is pivotally connected to the connecting claw 327 in multiple sections, and the middle of the lower section of the multi-stage frame 323 passes through the slot on the mounting plate 322 and is pivotally connected to the mounting plate 322. The lifting cylinder 329 drives the connecting block to rise and fall through the connecting rod 326, so that the connecting claw 327 drives the multi-stage frame 323 to expand outward or contract inward through the connecting rod 326, so as to adjust the area surrounded by the clamping block 324 to loosen or clamp the silicon wafer.

[0071] Furthermore, when the silicon wafer is in the space enclosed by the positioning column 325, it is necessary to slightly adjust the position of the clamping block 324 so that the silicon wafer and the corresponding clamping block 324 expand outward first, so that the silicon wafer crosses the upper arc surface of the clamping block 324 and enters the groove of the clamping block 324, and then slightly adjust the clamping block 324 to shrink the space synchronously so that the outer edge of the silicon wafer is clamped by the groove of the clamping block 324. In this process, the lifting cylinder 329 is required to drive the connection block to rise, so that the connection block drives the connecting rod 326 in the connecting claw 327 to drive the multi-stage frame 323 to expand outward, thereby expanding the area enclosed by the clamping block 324, so that the silicon wafer can first cross the arc surface position of the upper end of the clamping block 324. The connecting block is then driven down by the lifting cylinder 329, so that the connecting rod 326 in the connecting claw 327 moves down, and drives the multi-stage frame 323 to move inward, thereby reducing the space enclosed by the clamping block 324, and the silicon wafer can be clamped in the groove in the clamping block 324.

[0072] The positioning posts 325 are arranged beside the multi-stage rack 323 and fixed on the mounting plate 322. Three positioning posts 325 are arranged in sequence from the inside to the outside beside each multi-stage rack 323, and the heights of the three positioning posts 325 increase from the inside to the outside, in order to match the heights of the clamping blocks 324, which increase in height, to match silicon wafers of different sizes. The heights of the positioning posts 325 matched with the same silicon wafer are consistent, and their heights are the same as the heights of the grooves in the corresponding clamping blocks 324.

[0073] The lower end surface of the positioning column 325 is fixedly arranged on the multi-stage frame 323, and all the positioning columns 325 are arranged at the same position on the same side of each multi-stage frame 323 to ensure the stability of its support for the silicon wafer. The upper end surface of the positioning column 325 is a guide column of a truncated cone structure, which is coaxially arranged with the body of the positioning column 325, and its largest end is directly connected to the body of the positioning column 325. The diameter of its largest end is half of the largest diameter of the positioning column 325. The generatrix chamfer of the guide column is not greater than 30°, in order to provide a downward sliding slope for the silicon wafer when it is placed horizontally, so as to enable the silicon wafer to be quickly and accurately clamped by the groove in the clamping block 324, and can also be stably supported by the upper end surface of the body of the positioning column 325 while being clamped, so as to ensure the stability of the silicon wafer clamping.

[0074] like Fig.12 As shown, the gas-liquid assembly 33 includes an upper nozzle 331 for spraying water or air toward the upper end surface of the silicon wafer and a lower nozzle 332 for spraying water or air toward the lower end surface of the silicon wafer, wherein the upper nozzle 331 is controlled by the upper pipe rack 333 to be suspended directly above the lower nozzle 332, and the upper pipe rack 333 is an L-shaped structure, wherein the inner pipe thereof is directly connected to the upper nozzle 331, and the lower end thereof is connected to the swing motor 335 through a coupling, and the vertical section of the upper pipe rack 333 is connected to the external pure water tank and the water cup. The vertical section of the upper pipe rack 333 is connected to the vertically arranged pipe fixing frame 334 through a connecting block, and can be driven by the swing motor 335 to drive the upper nozzle 331 to swing, so that during the rinsing process or the spin-drying process, the upper nozzle 331 is driven to swing back and forth within the radius range from the center of the silicon wafer to the diameter end thereof.

[0075] The lower end surface of the pipe fixing frame 334 is fixedly mounted on the mounting platform 31, and a side surface thereof close to the upper pipe frame 333 is provided with a plurality of connecting blocks arranged up and down, and the vertical section of the upper pipe frame 333 passes through the through hole on the connecting block and can rotate freely. The swing motor 335 is fixed to the pipe fixing frame 334 through an angle bracket; an identifier 336 is provided on the upper end surface of the pipe fixing frame 334, and an identification disk 337 adapted to the identifier 336 is provided on the vertical section of the upper pipe frame 333. A notch is provided on the identification disk 337, and the identifier 336 is a sensor that is projected up and down to identify the rotation position of the upper pipe frame 333. The swing motor 335 drives the identification disk 337 and the upper pipe frame 333 to rotate and swing synchronously, and identifies the swing angle of the upper pipe frame 333 through the identifier 336.

[0076] The swing angle driven by the swing motor 335 to swing the upper pipe rack 333 is preset in advance. The initial position of the upper pipe rack 333 is that its horizontal section is located directly above the pipe fixing rack 334. At this time, no interference will occur whether the silicon wafer is placed or removed. After the silicon wafer is placed stably, the upper nozzle 331 is controlled to rotate to the center of the circle. When spraying water or blowing air, it is controlled by the swing motor 335 to swing and rotate, spray water for dilution or blow air for drying.

[0077] like Fig.12 As shown, when the swing motor 335 drives the upper pipe rack 333 and drives the upper nozzle 331 to swing to the diameter of the silicon wafer, that is, when the upper nozzle 331 is located at the center of the silicon wafer, the notch of the identification disk 337 just corresponds to the position of the identifier 336. At this time, the identifier 336 can identify the signal and determine the position of the upper nozzle 331. When the upper pipe rack 333 drives the upper nozzle 331 to swing to other positions, the identification disk 337 will rotate with the swing of the upper pipe rack 333, and then the notch will not correspond to the identifier 336. The identifier 336 cannot identify the signal, and it can be determined that the upper nozzle 331 is not at the center of the circle, and it can be known that it has swung and rotated.

[0078] The lower nozzle 332 is arranged at the center position of the mounting plate 322, and is connected to an external pure water tank and an air pump through a pipe. The pipe connected to the lower nozzle 332 is fixedly arranged on the central axis of the support shaft 321, and passes through the support shaft 321, the connecting block, and the connecting claw 327, and is fixedly installed on the mounting plate 322.

[0079] Whether it is the upper nozzle 331 or the lower nozzle 332, the water spraying and the air jetting are carried out by sharing the same pipeline, that is, when the upper nozzle 331 sprays water or jets, it is operated through the pipeline fixed on the upper pipeline rack 333; when the lower nozzle 332 sprays water or jets, it is operated through the pipeline connected to it. A three-way pipe is provided at the lower ends of the two pipelines, which are respectively connected to the external pure water tank and the air pump. When spraying water for dilution, close the end connected to the air pump and open the end connected to the pure water tank, so that the upper nozzle 331 and the lower nozzle 332 can spray water synchronously; when drying, close the end connected to the pure water tank and open the end connected to the air pump to spray air synchronously. Whether it is spraying water or jetting, the position of the lower nozzle 332 is different, and the upper nozzle 331 always performs rotation spraying or jetting, and its rotation speed can be preset in advance and is not specifically limited here.

[0080] like Fig.13As shown, the protection assembly 34 includes an outer cylinder 341 fixed on the mounting platform 31, an inner cylinder 342 that can move up and down, a second cylinder 344 for driving the inner cylinder 342 to move up and down, and a vertical plate frame 343 for fixing the second cylinder 344. Among them, the lower end of the vertical plate frame 343 is fixed on the mounting platform 31 and is located on the outside of the outer cylinder 341, and the upper and lower ends of the second cylinder 344 are respectively fixed to the side of the vertical plate frame 343 away from the inner cylinder 342 through connecting plates. The second cylinder 344 supports the inner cylinder 342 and controls the inner cylinder 342 to move up and down along its height direction. Part of the inner cylinder 342 is stacked on the inner side of the outer cylinder 341 and supported by the second cylinder 344, and part of the inner cylinder 342 is convexly arranged on the upper end of the outer cylinder 341. In this embodiment, when the inner cylinder 342 is at the lowest position, its height is slightly convexly arranged at the end of the outer cylinder 341 and is located below the mounting plate 322. When the inner cylinder 342 is at its highest position, the inner cylinder 342 is driven by the second cylinder 344 to rise, and its height is higher than the height of the clamping block 324, and the silicon wafer clamped by the clamping block 324 is protected inside. The purpose is that when the silicon wafer is dried, there is a lot of water on the surface of the silicon wafer, and the silicon wafer rotates at a faster speed during drying. In order to prevent the water from splashing, the inner cylinder 342 is raised by the second cylinder 344 and the silicon wafer is surrounded inside the inner cylinder, so that the water can only flow downward along the inner wall of the inner cylinder 342. At the same time, a drainage pipe 338 for drainage is provided at the lower end of one side of the outer cylinder 341 to discharge all the waste water.

[0081] like Fig.14 As shown, the transfer mechanism 40 is suspended above the drying mechanism 30, and spans the drying mechanism 30 and the finished product table 50 located at the rear side of the drying mechanism 30. The transfer mechanism 40 includes a suspension beam 41 interconnected with the frame beam, and two sets of transfer components and wet and dry fingers arranged on both sides of the suspension beam 41. That is, on one side of the suspension beam 41, there are wet and dry fingers for transferring silicon wafers and a transfer component for controlling the movement of the wet and dry fingers, and the two sets of components work independently of each other. And at one end of the suspension beam 41 away from the drying mechanism 30, two finished product tables 50 are arranged on both sides, which are used to carry the silicon wafers after drying. The following is a detailed description taking the drying component on one side as an example.

[0082] A transfer assembly and dry and wet fingers are provided on either side of the suspension beam 41, wherein the transfer assembly includes a horizontal transfer group 43 and a lifting transfer group 42; the dry and wet fingers include a T-shaped fixing frame 44 connected to the suspension beam 41 through the lifting transfer group 42, and dry fingers 45 and wet fingers 46 connected to the fixing frame 44, the dry fingers 45 and the wet fingers 46 are placed on the fixing frame 44 with their backs to each other, and rotate in different directions relative to the fixing frame 44.

[0083] The suspension beam 41 is arranged along the length direction of the machine body and is located on the center axis of the machine body. The vertical section of the fixed frame 44 is connected to the lifting and shifting group 42, and its transverse section is located at its lower end, and a dry finger 45 for transferring dry silicon wafers and a wet finger 46 for transferring wet silicon wafers are arranged on its transverse section. The dry finger 45 and the wet finger 46 are fixed on both sides of the width direction of the fixed frame 44 in the same direction. Preferably, the dry finger 45 and the wet finger 46 are arranged in the fixed frame 44 along the width direction of the machine body near the side of the spin-drying mechanism 30. In order to isolate the working environment of the dry finger 45 and the wet finger 46, an isolation plate 47 of a transparent structure directly connected to the fixed frame 44 is also provided in the height direction of the fixed frame 44. The isolation plate 47 can isolate the dry finger 45 and the wet finger 46 in two operating spaces without affecting each other, thereby ensuring the safety and purity of the operation when the dry silicon wafers are transferred.

[0084] like Fig.15 As shown, the dry finger 45 and the wet finger 46 are respectively controlled by two small and independently operated finger motors 48, which are fixed to the lower end of the fixing frame 44, and the output shaft 49 of the finger motor 48 is perpendicular to the fixing frame 44 and extends toward the side close to the dry finger 45. The dry finger 45 and the wet finger 46 are arranged perpendicular to the shaft 49 and connected to the shaft 49 through the connecting member 410. The dry finger 45 and the wet finger 46 are arranged on the upper end surface of the connecting member 410, that is, they are arranged on the side away from the connecting surface of the connecting member 410 and the shaft 49, and the dry finger 45 and the wet finger 46 are fixed to the connecting member 410 through the cover plate 411.

[0085] The cross section of one end of the rotating shaft 49 connected to the dry and wet fingers is constructed as a superior arc structure, and the side of the side chord is a flat surface. The connecting piece 410 is a rectangular flat plate structure, and the end of the lower side is provided with an L-shaped groove facing downward, which is adapted to the flat surface of the rotating shaft 49. The connecting piece 410 is clamped on the flat surface of the rotating shaft 49 through the groove, so that the dry and wet fingers are in contact with the flat surface of the rotating shaft 49. The rotating shaft 49 can drive the dry finger 45 or the wet finger 46 to rotate between the horizontal state and the vertical state through the connecting piece 410. That is, when the dry finger 45 or the wet finger 46 is in a horizontal state, it is set horizontally, and the surface for adsorbing the silicon wafer is set upward. At this time, the connecting member 410 is set horizontally and transversely like the dry finger 45 or the wet finger 46, and the groove opening thereon is set downward, and the flat surface of the rotating shaft 49 connected to the groove is set horizontally and transversely; when there is no need to adsorb the silicon wafer, the finger motor 48 will drive the rotating shaft 49 to drive the dry finger 45 or the wet finger 46 to rotate to a vertical state.

[0086] Among them, the dry fingers 45 and the wet fingers 46 are in a horizontal state when they are working and in a vertical state when they are not working. They are driven by two independent motors to be flipped and adjusted respectively; when they move in the horizontal direction as a whole, they are controlled by the horizontal shifting group 43 and move horizontally along the length direction of the machine body; when they rise and fall in the vertical direction as a whole, they are controlled by the lifting and falling shifting group 42 and move up and down along the height direction of the machine body.

[0087] like Fig.16 As shown, the dry finger 45 and the wet finger 46 have the same structure, and their working principle and operation process are the same; the layout structure of the vacuum air channel 412 on the upper end surface of the adsorbed silicon wafer is also the same. The dry finger 45 includes a body of a long strip structure, one end of which is fixed to the connecting piece 410 through a cover plate 411, and the other suspended end is a circular structure. Two parallel air channels 412 are provided along the length midline of the body; along the width direction of the body, a number of arc-shaped air channels 412 are provided at intervals in the middle section, and on the suspended end, a number of circular air channels 412 with the same center as the circular end are provided. Such air channels 412 with different structures can not only ensure that the contact surface with the silicon wafer is increased, but also further improve the stability of the overall placement of the silicon wafer; improve the safety of the silicon wafer and the finger in close contact during the transfer process. These air channels 412 are built into the body and connected to an external air pump through an air pipe joint.

[0088] Two finished product tables 50 are arranged on one side of the drying mechanism 30 away from the temporary storage mechanism 20, and are arranged on both sides of the suspension beam 41. On each finished product table 50, a sheet basket for carrying silicon wafers is also arranged, and all silicon wafers are placed horizontally in the sheet basket.

[0089] Take the single-sided cleaning and drying of silicon wafers as an example. In this process, the silicon wafers on the temporary storage table 21 are wet silicon wafers, and need to be taken out by wet fingers 46. Among them, the wet fingers 46 and the dry fingers 45 are both set vertically when not in operation, and their initial positions are located between the drying mechanism 30 and the finished product table 50, and their heights are located at their upper limit positions, that is, above the clamping assembly 32. The horizontal shifting group 43 in the transfer mechanism 40 drives the wet fingers 46 to move to the temporary storage table 21, and the opening of the matching groove of the temporary storage table 21 corresponds to the angle of the wet fingers 46 when they are horizontally unfolded. When the wet fingers 46 arrive near the temporary storage table 21, they stop moving horizontally; the lifting and lowering shifting group 42 drives the wet fingers 46 down to the height of the material taking position, and then the finger motor 48 drives the rotating shaft 49 to drive the wet fingers 46 to rotate in the opposite direction, so that the wet fingers 46 rotate from a vertical state to a horizontal state. The horizontal shifting group 43 then drives the horizontally spread wet fingers 46 to gradually approach the temporary storage table 21, until the wet fingers 46 are inserted into the matching grooves on the temporary storage table 21, and then slowly controls the wet fingers 46 to move up and close to the bottom surface of the silicon wafer, and then controls the air passages on the wet fingers 46 to vacuum absorb the silicon wafer. When the silicon wafer is stably placed on the wet fingers 46, the lifting and lowering shifting group 42 first drives the wet fingers 46 to drive the wet silicon wafer to rise to a safe height, and then the horizontal shifting group 43 drives the wet fingers 46 to move toward the side of the drying mechanism 30 until it moves to the side of the drying mechanism 30 close to the finished product table 50 and stops. In this process, the dry fingers 45 located on the right side of the wet fingers 46 remain stationary and are in the initial state of vertical setting.

[0090] Before the wet finger 46 drives the silicon wafer to be transferred to the spin-drying mechanism 30, the position of the upper nozzle 331 needs to be adjusted first, and the upper pipe rack 333 is driven by the swing motor 335 to rotate 90 degrees and move to the same side as the position of the pipe fixing rack 334, and the lateral section of the upper pipe rack 333 is located directly above the pipe fixing rack 334, so that enough space is reserved in the position of the clamping assembly 32 to place the silicon wafer. At the same time, the cylinder 2 344 drives the inner cylinder 342 to move down to its lower limit position.

[0091] When the wet finger 46 moves with the wet silicon wafer to the top of the spin-drying mechanism 30, the lifting and shifting group 42 controls the wet finger 46 to move downward, and horizontally mounts the silicon wafer in the space surrounded by four positioning columns 325 that match the silicon wafer, and the silicon wafer is supported and placed flat by the positioning columns 325. Then, the lifting cylinder 329 drives the clamping block 324 to expand outward through the connecting claw 327 and the multi-stage frame 323, so that the outer edge of the silicon wafer first crosses the upper end arc surface of the matching clamping block 324, and then controls the clamping block 324 to shrink inward, so that the silicon wafer is completely clamped by the groove in the clamping block 324, thereby completing the feeding and clamping work of the wet silicon wafer.

[0092] Then control the upper nozzle 331 to rotate to its working position, that is, to be located directly above the center of the silicon wafer, and then drive the second rotary motor 328 to drive the clamping block 324 to clamp the silicon wafer and rotate through the support shaft 321. Then, synchronously control the upper nozzle 331 and the lower nozzle 332 to spray water to the upper and lower surfaces of the silicon wafer respectively, and control the lower nozzle 332 to flush water in a fixed manner, and at the same time control the swing motor 335 to drive the upper pipe rack 333 to control the upper nozzle 331 to do swing flushing, that is, control the upper nozzle 331 to do reciprocating swing rotation between the center of the silicon wafer and its diameter edge, and continuously flush the upper surface of the silicon wafer until the flushing is completed. During the flushing process, the three-way pipe is directly connected to the external pure water source, and the valve connected to the air pump is closed; after the flushing is completed, the air pump valve in the three-way pipe is opened, and the valve connected to the pure water source is closed, and both are unidirectional. In addition, in order to improve the effect of diluting the pickling solution on the surface of the silicon wafer during rinsing, the swing speed of the upper nozzle 331 is relatively slow during rinsing, and the speed at which the silicon wafer is rotated is also relatively slow, so as to increase the time that the pure water stays in contact with the surfaces on both sides of the silicon wafer and improve the dilution effect.

[0093] After rinsing, the silicon wafer needs to be blown and dried to quickly evaporate the double-sided surfaces. Because it needs to be dried quickly in this process, the rotation speed of the silicon wafer and the swing speed of the upper nozzle 331 are both fast. Since water will be thrown out on the double-sided surfaces of the silicon wafer during drying, it is easy to splash everywhere. At this time, the inner cylinder 342 needs to be raised to its highest position so that the silicon wafer is surrounded by it until the drying is completed. In this process, the silicon wafer continues to be driven to rotate by the rotating motor 2 328; accordingly, the lower nozzle 332 and the upper nozzle 331 both blow air toward the double-sided surfaces of the silicon wafer; at the same time, the lower nozzle 332 does not move, and the upper nozzle 331 located above is still controlled by the swing motor 335, and reciprocates and swings between the center of the silicon wafer and its diameter edge, and continuously blows air to the upper surface of the silicon wafer until the drying is completed.

[0094] After the silicon wafer is dried, the inner cylinder 342 is controlled to move down to the lowest position, and the upper nozzle 331 is controlled to rotate to its initial position, that is, to the side where the pipe fixing frame 334 is located. Then the horizontal shifting group 43 in the transfer mechanism 40 is controlled to drive the right dry finger 45 to move to the side of the drying mechanism 30 close to the temporary storage mechanism 20, and the dry finger 45 is controlled to move down to its downward position through the lifting shifting group 42; then the dry finger 45 is controlled to flip from the vertical state to its horizontal state through the finger motor 48, and its finger is horizontally pointed to the side of the silicon wafer. Then the dry finger 45 is controlled by the horizontal shifting group 43 and the lifting shifting group 42 to gradually approach the silicon wafer and tightly support the lower bottom surface of the silicon wafer, and then the lifting cylinder 329 is controlled to adjust the clamping block 324 to expand outward to loosen the silicon wafer so that it can be placed steadily on the upper end surface of the dry finger 45.

[0095] Then, through the cooperation of the lifting and shifting group 42 and the horizontal shifting group 43 , the dry fingers 45 are controlled in a coordinated manner to move the dry silicon wafers to the finished product stage 50 , and drive the silicon wafers to be inserted into the empty wafer basket on the finished product stage 50 .

[0096] The above steps are repeated until the wafer basket on the finished product table 50 is filled with dry silicon wafers.

[0097] The present application designs a docking and transferring device for silicon wafer edge removal, which can automatically receive and receive silicon wafers, and can sort and take out wafers of different sizes, and can be compatible with clamping. It has a reasonable structural design, precise coordination of various components, controllable placement, good compatibility, high working efficiency and fast transfer speed.

[0098] All the mechanisms proposed in this application are equipped with two independently working processing components. All processing components are relatively and independently operated. They can work on a single line or perform dual-line parallel processing as needed, which not only has high work efficiency but also high utilization rate.

[0099] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.

Claims

1. A docking and transfer device for silicon wafer edge removal, characterized in that: include: A spin-drying mechanism, which is equipped with a clamping assembly capable of clamping a single silicon wafer of different sizes, the clamping assembly comprising a mounting plate and a multi-stage frame and a positioning column placed on the mounting plate, and a clamping block for clamping the outer edge of the silicon wafer is provided on the multi-stage frame; The transfer mechanism is equipped with dry fingers and wet fingers which are placed opposite to each other and rotate in opposite directions and are suspended across the drying mechanism. The wet fingers can place the wet silicon wafer into the space surrounded by the positioning columns and be clamped by the clamping block; the dry fingers can take the dried silicon wafer away from the clamping block after being spun; The multi-stage frame is provided with step sections which are gradually ascended and tilted outwards, and a plurality of slots which cooperate with the clamping blocks are provided on one side surface of the step section close to the supporting shaft; The slot is constructed as a blind hole slot with a U-shaped structure; the clamping block includes a tail and an end, the tail is directly inserted into the slot, and the end clamps the outer edge of the silicon wafer; the end face of the end is constructed as a curved surface structure connected by double arc surfaces, the intersection of which is an arc surface groove, and the height of the upper arc surface is greater than the height of the lower arc surface.

2. The device for docking and transferring silicon wafers for edge removal according to claim 1, characterized in that: The mounting plate is constructed as a "cross" structure, and the multi-stage frame and the positioning column are both arranged at its extended end; and the multi-stage frame is pivotally connected to the mounting plate.

3. A docking and transferring device for edge removal of silicon wafers according to claim 1 or 2, characterized in that: The clamping assembly also includes a support shaft for supporting the mounting plate, which is constructed as a hollow structure and has long holes arranged along its length on its axial wall surface; the support shaft is driven to rotate, which can drive the clamping block to rotate through the mounting plate.

4. The device for docking and transferring silicon wafers for edge removal according to claim 3, characterized in that: The multi-stage frame is constructed as a multi-stage stepped structure, and all the step surfaces are arranged toward the center of the supporting shaft; it is also provided with a straight section suspended downward.

5. A docking and transferring device for edge removal of silicon wafers according to any one of claims 1 to 2 and 4, characterized in that: A connecting block connected to the lifting cylinder through a connecting rod is provided on the inner side of the supporting shaft, a connecting claw connected to the connecting block is provided on the top of the connecting block, a plurality of connecting rods pivotally connected to the connecting claw are provided on the connecting claw, and the connecting rods pass through the long strip holes on the supporting shaft and are pivotally connected to the lower end of the multi-stage frame; The lifting cylinder drives the connection block to rise and fall through the connecting rod, so that the connection claw drives the multi-stage frame to expand outward or contract inward through the connecting rod, so as to adjust the area surrounded by the clamping block to loosen or clamp the silicon wafer.

6. The device for docking and transferring silicon wafers for edge removal according to claim 5, characterized in that: The drying mechanism also includes a gas-liquid component and a protective component, wherein: The gas-liquid assembly comprises: a lower nozzle placed at the center of the mounting plate and an upper nozzle suspended above the silicon wafer, the upper nozzle being connected to a swing motor through a pipe rack, the swing motor being able to drive the upper nozzle through the pipe rack, and when the clamping assembly drives the silicon wafer to rotate, the upper nozzle is swung while flushing water or blowing air; the lower nozzle is always fixed in position and does not move; The protection assembly comprises an outer cylinder and an inner cylinder arranged inside the outer cylinder, and the inner cylinder is controlled to rise and fall so as to surround the silicon wafers therein when the silicon wafers are spun dry.

7. A docking and transferring device for edge removal of silicon wafers according to any one of claims 1-2, 4 and 6, characterized in that: A finished product table is also provided at the rear side of the drying mechanism, and the transfer mechanism includes a suspension beam arranged across the drying mechanism and the finished product table, and a transfer assembly for controlling the movement of the dry fingers and the wet fingers is also provided on the suspension beam; The dry finger and the wet hand are suspended on the transfer assembly through a fixing frame, separated by an isolation plate placed on the fixing frame, and are respectively connected to the two sides of the fixing frame through finger motors; The dry finger and the wet hand are connected to the finger motor via a rotating shaft, and are driven by the rotating shaft to alternately flip between a horizontal state when working and a vertical state when not working; and the stretching direction of the dry finger and the wet hand in the horizontal state is consistent with the silicon wafer transmission direction, and the dry finger and the wet hand are placed upright in the vertical state.

8. The device for docking and transferring silicon wafers for edge removal according to claim 1, characterized in that: A feeding mechanism and a temporary storage mechanism are arranged in sequence before the drying mechanism, wherein: The loading mechanism is provided with an upper loading platform for storing the wafer basket and a placing platform for placing the silicon wafers, and the silicon wafers placed in the wafer basket are moved one by one to the placing platform for placement by means of the material taking finger; The temporary storage mechanism includes a temporary storage table and a suspension suction cup for transferring silicon wafers, which can absorb and take out the silicon wafers that have been sliced ​​onto the placement table, and transfer the silicon wafers to the temporary storage table; The structure of the temporary storage table is the same as that of the placement table, and both are provided with a matching groove with a radius length, but the orientations of the matching grooves in the two are different.

9. The docking and transferring device for edge removal of silicon wafers according to claim 8, characterized in that: The material loading mechanism includes two loading platforms and two placing platforms, and the material taking finger is placed at the center of the interval surrounded by it; and the two loading platforms and the two placing platforms are relatively located relative to the position of the material taking finger; The upper loading platform is arranged on the base through a rotating platform and is driven by a rotating motor arranged on the base; A horizontal motor is also provided on the inner side of the base, which can drive the rotary motor to move along the length direction of the base; the horizontal motor drives the rotary motor to move through the roller transmission, and drives the upper loading platform and the wafer basket carrying the silicon wafers through the rotating table, moving from the loading end away from the feeding finger to the wafer separation end close to the feeding finger; At the slice splitting end, the rotary motor drives the rotating table to drive the upper loading table and the slice basket to rotate together, and the opening of the slice basket is tilted toward the side of the material taking finger.

Images