A circuit board design method and circuit board compatible with surface mount devices and pin devices

Abstract

The present invention provides a circuit board design method and circuit board that are compatible with surface mount devices and pin devices. The circuit board design method that is compatible with surface mount devices and pin devices includes: obtaining parameters of surface mount devices and pin devices; designing a surface mount device package library and a pin device package library; combining the surface mount device package library and the pin device package library, and judging whether the surface mount pad and the through hole pad overlap after the combination; opening a through hole on the surface mount pad; opening an annular groove around the outer periphery of the through hole, the annular groove separating the surface mount pad into pad one and pad two; performing solder mask opening on pad one and pad two; when welding a surface mount device, welding the surface mount device to pad one; when welding a pin device, welding the pin device to at least pad two. Through this design method and the circuit board obtained by the design, both surface mount devices and pin devices can be welded at the same position, and selection can be made according to demand during debugging, thereby reducing the cost of board manufacturing.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit board design, and in particular to a circuit board design method and a circuit board that are compatible with surface mount devices and pin devices. Background Art

[0002] Component replacement is often encountered in circuit design, so when designing a circuit board, it is necessary to consider whether the currently used components and the subsequent replacement components can be soldered to the circuit board. In actual projects, it is usually the replacement or compatibility between surface mount components and pin components. It is easier to deal with package compatibility issues for components of the same type (both surface mount or both pins). Surface mount components correspond to surface mount pads, and pin components correspond to through-hole pads. When a surface mount component is compatible with a surface mount component, it is only necessary to enlarge the pad size so that both components can be soldered. Similarly, when two pin components are compatible, it is only necessary to enlarge the through hole so that both pin components can be inserted.

[0003] However, there are often certain problems with the compatibility of different types of devices. When surface mount devices need to be compatible with pin devices, both through holes must be left for soldering pin devices and surface mount pads must be left for soldering surface mount devices. In the case of incompatibility, surface mount pads cannot be directly soldered to pin devices. Although through-hole pads can be soldered to surface mount devices, the presence of through holes will cause tin leakage during soldering, which will lead to poor soldering.

[0004] Therefore, it is very important to ensure the reliability of welding while being compatible with the pads in the circuit board design. The present invention conducts research on this in combination with actual work. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention provides a circuit board design method and a circuit board that are compatible with surface-mount devices and pin devices. Through this design method and the circuit board obtained by the design, both surface-mount devices and pin devices can be welded at the same position, and the selection can be made according to needs during debugging, without increasing the difficulty of the board making and welding process, and the reliability of welding can be guaranteed.

[0006] The technical solution of the present invention is as follows:

[0007] The present invention first provides a circuit board design method that is compatible with surface mount devices and pin devices, comprising: obtaining parameters of surface mount devices and pin devices; designing a surface mount device package library and a pin device package library according to the surface mount device and pin device parameters, wherein the surface mount device package library has a surface mount pad, and the pin device package library has a through hole pad; combining the surface mount device package library and the pin device package library, and judging whether the surface mount pad and the through hole pad overlap after the combination, if not, designing the surface mount pad and the through hole pad separately, and if overlapping, executing the next step; opening a through hole on the surface mount pad; opening an annular groove around the outer circumference of the through hole, wherein the annular groove separates the surface mount pad into pad one and pad two, wherein pad one is located on the outer side of the annular groove, and pad two is located on the inner side of the annular groove; performing solder mask opening on pad one and pad two; when welding the surface mount device, welding the surface mount device to pad one; when welding the pin device, welding the pin device to at least pad two.

[0008] In some embodiments, before forming an annular groove around the periphery of the through hole, the method includes: circling a mark on the periphery of the through hole according to the design size as the overlapping boundary line of the solder ring between the surface mount pad and the through hole pad, and forming the annular groove inside the overlapping boundary line.

[0009] In some embodiments, after an annular groove is opened around the periphery of the through hole, the method includes: setting a plurality of radial conductor channels in the annular groove between the first pad and the second pad, and the plurality of radial conductor channels connect the first pad with the second pad.

[0010] In some embodiments, the conductor channel widths in a plurality of radial directions are consistent with the annular groove width.

[0011] In some embodiments, the diameter of the through hole is D1, and the outer diameter of the annular groove is D2, then the width L1 of the through hole welding ring is (D2-D1) / 2, and the width L2 of the annular groove satisfies:

[0012] 0.1mm≤L2≤L1-0.1mm

[0013] Where: D1 is the through hole diameter, D2 is the outer diameter of the annular groove.

[0014] In some embodiments, the width L2 of the annular groove is:

[0015] L2=L1 / 2.

[0016] In some embodiments, the solder resist windowing of the pad 1 and the pad 2 includes: the pad 1, the pad 2, the conductor channel and the annular groove are not covered with solder resist ink.

[0017] In some embodiments, when soldering the pin device, the amount of solder paste is increased, and the pin device is soldered together with the first pad and the second pad at the same time.

[0018] The present invention also provides a circuit board compatible with surface mount devices and pin devices, which is designed according to the above-mentioned circuit board design method compatible with surface mount devices and pin devices. Surface mount pads are arranged on the circuit board, and is characterized in that a through hole is provided in the center of the surface mount pad, and an annular groove is provided on the periphery of the through hole, and the annular groove separates the surface mount pad into pad one and pad two. Pad one is located on the outside of the annular groove and is at least used for welding surface mount devices, and pad two is located on the inside of the annular groove and is used for welding pin devices.

[0019] In some embodiments, a plurality of radial conductor channels are provided in the annular groove between the first pad and the second pad, and the plurality of radial conductor channels connect the first pad with the second pad.

[0020] The beneficial effects of the present invention compared to the prior art are as follows: the present invention provides a circuit board design method and a circuit board that are compatible with surface mount devices and pin devices. On the one hand, in order to be compatible with two types of devices, the pads are fused so that two different types of devices can be welded; on the other hand, in order to ensure that there is no tin leakage during welding, the form of the compatible pads is processed, and the connectivity of the pads can be ensured at the same time; through this design method and the circuit board obtained by the design, both surface mount devices and pin devices can be welded at the same position, and the selection can be made according to the needs during debugging, and the process difficulty of board making and welding is not increased, the reliability of welding can be guaranteed, and the cost of board making can be reduced. It should be understood that the realization of any embodiment of the present invention does not mean that multiple or all of the above beneficial effects must be possessed or achieved at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0022] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment in size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0023] Figure 1A schematic diagram showing a flow chart of a circuit board design method for a surface mount device and a pin device that are compatible with the present invention;

[0024] Figure 2 Schematic diagrams showing two devices, wherein (a) shows a pin-mount device and (b) shows a surface-mount device;

[0025] Figure 3 Schematic diagrams showing the corresponding pads of two devices on a circuit board, where (a) is a design diagram and (b) is a physical diagram;

[0026] Figure 4 Schematic diagrams of transistors with two types of device packages are shown, wherein (a) shows a pin package and (b) shows a surface mount package;

[0027] Figure 5 Schematic diagrams of package libraries of two types of devices are shown exemplarily, wherein (a) shows a package library of pin devices, and (b) shows a package library of surface-mount devices;

[0028] Figure 6 Schematic diagrams of package library combinations of two devices of the present invention are exemplified, wherein (a) shows a situation where the pin device is larger and the surface mount device is smaller, and (b) shows a situation where the surface mount device is larger and the pin device is smaller;

[0029] Figure 7 A schematic diagram of a package library combination of two devices of the present invention is exemplarily shown (pads overlap);

[0030] Figure 8 A schematic diagram of circled marks showing, by way of example, a package library combination of two devices of the present invention;

[0031] Fig. 9 A schematic diagram showing, by way of example, the opening of an annular groove in a package library combination of two devices of the present invention;

[0032] Fig.10 A schematic diagram of adding conductor channels for a package library combination of two devices of the present invention is exemplified.

[0033] Markings in the figure:

[0034] 1. Through-hole pad; 2. Surface-mount pad; 21. Pad one; 22. Pad two; 3. Through-hole; 4. Marking; 5. Annular groove; 6. Conductor channel.

[0035] The same or corresponding symbols in the drawings indicate the same or corresponding parts. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clearly understood, the embodiments of the present invention are further described in detail below in conjunction with the embodiments and drawings. Here, the illustrative embodiments of the present invention and their description are used to explain the present invention, but are not intended to limit the present invention.

[0037] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] It should be understood that the terms "include / comprise", "consist of..." or any other variations are intended to cover non-exclusive inclusion, so that a product, device, process or method that includes a series of elements includes not only those elements, but also may include other elements not explicitly listed when necessary, or also includes elements inherent to such product, device, process or method. In the absence of more restrictions, the elements defined by the sentence "include / comprise...", "consist of..." do not exclude the presence of other identical elements in the product, device, process or method that includes the elements.

[0039] It is also necessary to understand that terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside" and "outside" to indicate directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device, component or structure must have a specific direction, be constructed or operate in a specific direction, and should not be understood as a limitation on the present invention.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] Devices of the same type may have pin-type and surface-mount packages. Due to structural problems, cost issues, or replacements after debugging, it may be impossible to determine which package to use when designing a circuit board. Therefore, device replacements are often encountered in circuit design, and it is considered to design both types of devices to be solderable. This way, it can be determined according to needs during debugging, which can improve design flexibility and reduce costs.

[0042] In view of this, the present invention provides a circuit board design method 100 that is compatible with surface mount devices and pin devices, such as Figure 1 The flow chart shown includes the following steps: S101, obtaining the parameters of the surface mount device and the pin device; S102, designing the surface mount device package library and the pin device package library according to the surface mount device and the pin device parameters; S103, combining the surface mount device package library and the pin device package library, and judging whether the surface mount pad and the through hole pad overlap after the combination, if not, designing the surface mount pad and the through hole pad separately; if overlapping, executing the next step; S104, opening a through hole on the surface mount pad; S105, opening an annular groove around the periphery of the through hole, the annular groove separating the surface mount pad into pad one and pad two, pad one being located on the outside of the annular groove, and pad two being located on the inside of the annular groove; S106, performing solder mask opening on pad one and pad two; S107, when soldering the surface mount device, using solder to solder the surface mount device to pad one; when soldering the pin device, using solder to solder the pin device to at least pad two.

[0043] The implementation of the present invention is described in detail below in conjunction with preferred embodiments.

[0044] like Figure 2 As shown in the figure, (a) shows a pin device. When in use, the pin needs to pass through the circuit board, so a through hole needs to be left on the circuit board. The through hole on the circuit board is called a through-hole pad, which includes a through hole that passes through the circuit board and a metal ring around the hole. (b) shows a surface mount device. The surface mount device only needs to be soldered on the surface of the circuit board and does not need to pass through the circuit board. The schematic diagram of the pads corresponding to the two devices on the circuit board is as follows Figure 3 As shown, (a) is the design drawing, and (b) is the actual picture, where the red arrow points to the through-hole pad 1 corresponding to the installation of the pin component (the black center is the through-hole, and the yellow circle is the solder ring), and the yellow arrow points to the surface-mount pad 2 (gold pad) corresponding to the installation of the surface-mount component.

[0045] Let's take the transistor as an example. Figure 4 The following are two types of transistor packages. Except for the different packages, other parameters are the same and they can be used interchangeably. (a) is a pin package and (b) is a surface mount package.

[0046] S101, obtaining parameters of surface mount devices and pin devices;

[0047] Parameters include device size, pad size, pin size, etc. Usually, the data sheet provided by the device manufacturer will have a detailed description of the device size, which can be obtained from it.

[0048] S102, designing a surface mount device package library and a pin device package library according to the parameters of the surface mount device and the pin device;

[0049] Design the package library of two devices such as Figure 5 As shown, (a) corresponds to Figure 4 (a) is the pin device package library, (b) is the corresponding Figure 4 The surface mount device package library in (b), where the black outer frame is the silk-screen frame of the device package, representing the outline of the device body. The small circles in (a) represent the through holes for the pins, which are used to insert the pins of the device into the circuit board. The large circle represents the solder ring of the pin, that is, the through-hole pad 1, which is used to solder the pins inserted into the circuit board. The pink rectangle in (b) represents the pad of the surface mount device on the circuit board, that is, the surface mount pad 2, which is used to solder the device.

[0050] S103, for compatibility purposes, the surface mount device package library and the pin device package library are combined into one package.

[0051] Specifically, the packages of the two devices are combined into one package in a 1:1 ratio, that is, the packages of the two devices are combined according to the manual body. There are three situations after the combination: First, the packages of the two devices are quite different, and the surface-mount device is smaller than the pin device, such as Figure 6 As shown in (a) in the figure; second, the packaging of the two devices is quite different, and the pin device is smaller than the surface mount device, such as Figure 6 (b) in the figure; third, the two are almost the same size, such as Figure 7 shown.

[0052] for Figure 6 In the two cases (a) and (b), the two device packages are quite different. The through-hole pad 1 and the surface-mount pad 2 do not overlap. When designing for compatibility, you only need to design their respective pads separately. The surface-mount pad 2 and the through-hole pad 1 are independent, and there is no tin leakage during welding.

[0053] for Figure 7 In this case, the two device packages are not much different, and the through-hole pad 1 and the surface mount pad 2 overlap. When designing for compatibility, follow the steps below.

[0054] S104, opening a through hole on the surface mount pad;

[0055] In order to facilitate the replacement of welding, we add through holes 3 required for soldering pin components on the surface mount pad 2, such as Figure 7 In the figure, the pink rectangle is the surface mount pad 2, and the circle is the through hole 3. At this time, both surface mount devices and pin devices can be soldered. However, when soldering surface mount devices on such pads, due to the through hole 3, the solder paste will overflow to the other side of the circuit board through the through hole 3, resulting in uncontrollable effects. In order to avoid tin leakage when the pads overlap, continue to take the following measures:

[0056] S105, forming an annular groove around the outer circumference of the through hole;

[0057] In compatible design, since the surface mount pad and the through hole pad overlap, the boundary of the through hole pad cannot be distinguished intuitively. For the convenience of implementation, a mark 4 is circled on the periphery of the through hole 3 according to the design size, such as Figure 8 As shown, a red circle is circled as a mark 4, indicating a through-hole solder ring, which serves as an overlapping boundary line of the solder rings of the surface mount pad 2 and the through-hole pad 1.

[0058] Then, an annular groove 5 is opened inside the red circle as a boundary, such as Fig. 9 As shown, the annular groove 5 separates the surface mount pad 2 into a pad 1 21 and a pad 2 22 , the pad 1 21 is located on the outside of the annular groove 5 , and the pad 2 22 is located on the inside of the annular groove 5 .

[0059] Assuming that the diameter of the through hole 3 is D1, and the diameter of the red circle, i.e. the outer diameter of the annular groove 5, is D2, the width of the through hole solder ring L1=(D2-D1) / 2, and the width of the pad 22 inside the annular groove 5 should be at least 0.1 mm, which is determined by the board manufacturing capacity. Then the width L2 of the annular groove 5 satisfies:

[0060] 0.1mm≤L2≤L1-0.1mm

[0061] Where: D1 is the through hole diameter, D2 is the outer diameter of the annular groove.

[0062] Preferably, the width L2 of the annular groove is: L2=L1 / 2, that is, half of the width L1 of the through-hole welding ring, that is, half is dug out and half is left.

[0063] In a specific embodiment of the present invention, the above dimensions are:

[0064] The diameter of through hole 3, i.e. the diameter of the white circle in the figure, is D1=1mm;

[0065] The diameter of the annular groove 5, i.e. the diameter of the red circle is D2 = 1.5 mm;

[0066] The width of the through-hole welding ring is L1=(D2-D1) / 2=0.25mm;

[0067] The width of the annular groove 5 is L2==L1 / 2=0.125mm;

[0068] The side length of the surface mount pad is A=2mm (approximately a square).

[0069] Select above Figure 8 One of the positions is described in detail, and the other positions are handled similarly.

[0070] S106, performing solder mask opening on pad 1 and pad 2;

[0071] The annular groove 5 has separated the surface mount pad 2 outside the through hole 3 into two independent pads. When making the board, the solder mask opening is performed according to the surface mount pad 2, that is, Fig. 9 The pink and white areas are not covered with solder resist ink, that is, the pad 1 21 and the pad 2 22 are exposed, and subsequent device welding operations can be performed.

[0072] Furthermore, since the two parts of the pads are separated, it is easy to cause a cold solder joint when soldering different devices, that is, the device is only soldered to one part of the pads and is separated from the other part. In order to avoid the problem of cold solder joint when soldering different devices, a conductor channel 6 is further added between the two parts of the pads, that is, a conductor channel 6 is set in the annular groove 5, such as Fig.10 As shown, multiple conductor channels 6 are arranged radially. The figure shows that four conductor channels 6 are evenly arranged. The specific number can be increased or decreased. The width of the conductor channel 6 can be set to be consistent with the width of the annular groove 5, that is, w=L2=0.125mm.

[0073] The conductor channel 6 can be a bare conductor block or a bare conductor strip, and has a solid structure, such as Fig.10 As shown in , the inner and outer pads can be connected.

[0074] S107, at this time, surface mount devices or pin devices can be selectively soldered on the above-mentioned pads as needed.

[0075] The pad 1 21 and the pad 2 22 are already connected together through the conductor channel 6. When soldering the surface mount device, the surface mount device is soldered to the pad 1 using solder. It is only necessary to apply solder paste on the pad 1 21, specifically, to apply solder paste through the steel mesh window. Through the treatment of the steel mesh, the solder paste overflow during welding is avoided. After applying the solder paste, the surface mount device is placed, and then the solder paste is melted in the furnace and fused with the device pad to achieve the purpose of welding. When the solder paste melts, due to the barrier effect of the annular groove 5, the melted solder paste will only flow to the area where the pad 2 22 is located through the conductor channel 6, but because the conductor channel 6 is small, the solder paste flowing to the pad 2 22 is less, and it will not overflow into the through hole 3 at all, that is, it will not flow to the other side of the circuit board through the through hole 3. And the amount of solder paste flowing to the pad 2 22 can be adjusted by adjusting the size of the previously opened annular groove 5 and the width of the conductor channel 6 to ensure that no tin leaks.

[0076] When soldering the pin device, use solder to solder the pin device to at least pad 22. Since pad 1 21 and pad 2 22 are already connected together through conductor channel 6, and pad 2 22 is connected to through-hole 3, pad 1 21 is also connected to through-hole 3. That is to say, even if the pin device is only soldered to pad 22, it can also be conductive with pad 1 21.

[0077] Another way is to increase the amount of solder paste so that the pin is welded together with pad 1 21 and pad 2 22 at the same time. This can enhance the welding strength of the pin device, ensure the stability of welding and the reliability of connection. The pin device is also conductive with both pad 1 21 and pad 2 22.

[0078] In addition, usually, the solder mask window is in the shape of an exposed pad, the purpose is to not brush ink, so that the pad is exposed, and the steel mesh window is in the shape of a solder paste, which is used to apply solder paste, so the solder mask window of the pad is consistent with the steel mesh shape. However, the steel mesh and solder mask window shapes used in the present invention are inconsistent, because the pin device is manually soldered or wave soldered, and solder paste does not need to be brushed. Tin is added to the contact position between the pad and the device after the device is plugged in, so the pad 22 does not need to be brushed with solder paste in advance, so there is a solder mask window, but no steel mesh window.

[0079] The design method of the present invention is used to design a circuit board that is compatible with surface mount devices and pin devices. The circuit board uses a conventional circuit board, such as Fig.10 As shown, the difference is that the circuit board is arranged with a surface mount pad 2 designed by the design method of the present invention, the surface mount pad 2 has a through hole 3 in the center, and an annular groove 5 is provided on the periphery of the through hole 3, and the annular groove 5 separates the surface mount pad 2 into pad 1 21 and pad 2 22, the pad 1 21 is located on the outside of the annular groove 5, and is used to weld surface mount devices, and the pad 2 22 is located on the inside of the annular groove 5, and is used to weld pin devices. Of course, the pin device can also be welded to both pad 1 21 and pad 2 22 at the same time. By separating the original surface mount pad 2 into pad 1 21 and pad 2 22 with the help of the annular groove 5, both surface mount devices and pin devices can be welded, and the annular groove 5 can prevent excessive melted solder paste on the surface mount pad 2 from flowing into the through hole 3 and affecting the welding quality.

[0080] Preferably, a plurality of radial conductor channels 6 are provided in the annular groove 5 between the first pad 21 and the second pad 22, and the plurality of radial conductor channels 6 connect the first pad 21 with the second pad 22, so as to avoid the phenomenon of cold solder joint when soldering different devices.

[0081] Although several specific implementation details are included in the above discussion, these should not be construed as limiting the scope of the present invention. Certain features described in the context of separate embodiments may also be implemented in a single implementation in combination. On the contrary, the various features described in the context of a single implementation may also be implemented in multiple implementations individually or in any suitable sub-combination.

[0082] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A circuit board design method that is compatible with surface mount devices and pin devices. It is characterized in that include: Get the parameters of surface mount devices and pin devices; According to the parameters of surface mount devices and pin devices, a surface mount device package library and a pin device package library are designed. The surface mount device package library has surface mount pads, and the pin device package library has through-hole pads. Combine the surface mount device package library and the pin device package library, and determine whether the surface mount pads and through hole pads overlap after the combination. If not, design the surface mount pads and through hole pads separately. If they overlap, proceed to the next step. Opening a through hole on the surface mount pad; An annular groove is formed around the outer periphery of the through hole, and the annular groove separates the surface mount pad into a first pad and a second pad, wherein the first pad is located outside the annular groove, and the second pad is located inside the annular groove; A plurality of radial conductor channels are arranged in the annular groove between the first pad and the second pad, and the plurality of radial conductor channels connect the first pad with the second pad; Perform solder mask opening on the pad 1 and the pad 2; When soldering a surface mount device, solder the surface mount device to the first soldering pad; when soldering a pin device, solder the pin device to at least the second soldering pad.

2. The circuit board design method for surface mount devices and pin devices according to claim 1, It is characterized in that Before the annular groove is formed around the outer periphery of the through hole, the method comprises: A mark is circled on the outer periphery of the through hole according to the design size as the overlapping boundary line of the solder ring of the surface mount pad and the through hole pad, and the annular groove is opened inside the overlapping boundary line.

3. The circuit board design method for surface mount devices and pin devices according to claim 1, It is characterized in that The conductor channel widths in a plurality of radial directions are consistent with the annular groove width.

4. The circuit board design method for surface mount devices and pin devices according to claim 1, It is characterized in that The diameter of the through hole is D1, and the outer diameter of the annular groove is D2. Then the width of the through hole welding ring L1=(D2-D1) / 2, and the width of the annular groove L2 satisfies: 0.1mm≤L2≤L1-0.1mm Where: D1 is the through hole diameter, D2 is the outer diameter of the annular groove.

5. The circuit board design method for surface mount devices and pin devices according to claim 4, It is characterized in that The width L2 of the annular groove is: L2=L1 / 2.

6. The circuit board design method for surface mount devices and pin devices according to claim 1, It is characterized in that The solder resist windowing of the pad 1 and the pad 2 comprises: The first pad, the second pad, the conductor channel and the annular groove are not covered with solder resist ink.

7. The circuit board design method for surface mount devices and pin devices compatible according to claim 1, It is characterized in that When soldering the pin component, increase the amount of solder paste and solder the pin component with the first soldering pad and the second soldering pad at the same time.

8. A circuit board compatible with surface mount devices and pin devices designed by the circuit board design method compatible with surface mount devices and pin devices according to any one of claims 1 to 7, wherein the circuit board is provided with surface mount pads, It is characterized in that A through hole is provided at the center of the surface mount pad, and an annular groove is provided at the periphery of the through hole. The annular groove separates the surface mount pad into pad one and pad two. Pad one is located on the outside of the annular groove and is at least used for welding surface mount devices. Pad two is located on the inside of the annular groove and is used for welding pin devices.

9. The circuit board compatible with surface mount devices and pin devices according to claim 8, It is characterized in that A plurality of radial conductor channels are arranged in the annular groove between the first pad and the second pad, and the plurality of radial conductor channels connect the first pad with the second pad.

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