Refrigerant flow path module and air conditioner

Abstract

A refrigerant flow path module having a refrigerant flow path (15) formed therein includes: a first plate (21); a second plate (22) overlapping the first plate (21); a copper-containing refrigerant pipe (12) mounted on the first plate (21); a copper-containing solder (17) that joins opposite surfaces of the first plate (21) and the second plate (22) to each other; and storage portions (40, 41, 42, 43, 72, 74) that store the remaining solder (17).

Description

Technical Field

[0001] The present disclosure relates to a refrigerant flow path module and an air conditioner. Background Art

[0002] In a refrigeration device including a refrigerant circuit that performs vapor compression refrigeration cycle operation, it is known to gather a plurality of refrigerant pipes through which refrigerant flows into one unit to achieve miniaturization of the refrigerant circuit. For example, Patent Document 1 discloses a plate-type refrigerant pipe including: a first plate; a second plate that is joined to the first plate and forms a refrigerant flow path together with the first plate; and a joint pipe that is installed on the first plate and the second plate and through which other refrigerant pipes are connected by brazing.

[0003] The first plate and the second plate of the plate-type refrigerant pipe are formed of stainless steel. The joint pipe is formed of the same material as other refrigerant pipes, such as copper, in consideration of the brazability with other refrigerant pipes. The plate-type refrigerant pipe is placed in a furnace in a state where a brazing filler metal is provided between the first plate and the second plate and between the first plate, the second plate, and the joint pipe, and is brazed in the furnace by heating.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2021-71268 Summary of the Invention

[0007] Technical Problem to be Solved by the Invention

[0008] In the brazing of the first plate and the second plate made of stainless steel, for example, a copper-containing brazing filler metal such as bronze brazing filler metal is used. The melting point of this brazing filler metal is lower than the melting point of the material of the joint pipe, which is copper. However, during the brazing in the furnace, when this brazing filler metal melts and comes into contact with the copper joint pipe, a phenomenon of a decrease in the melting point of the joint pipe sometimes occurs. When this phenomenon occurs, the joint pipe may melt due to the brazing in the furnace.

[0009] An object of the present disclosure is to provide a refrigerant flow path module and an air conditioner that can suppress the melting of the refrigerant pipe installed on the plate.

[0010] Technical Solution for Solving the Technical Problem

[0011] (1) The present disclosure is a refrigerant flow path module having a refrigerant flow path formed therein, including:

[0012] A first plate;

[0013] A second plate that coincides with the first plate;

[0014] A copper-containing refrigerant pipe installed on the first plate;

[0015] A copper-containing solder that joins the opposing surfaces of the first plate and the second plate to each other; and

[0016] A storage portion for storing the remaining solder.

[0017] According to this structure, the refrigerant flow path module includes a storage portion for storing the remaining solder. Therefore, it is possible to prevent the remaining solder from reaching the refrigerant pipe and melting the refrigerant pipe.

[0018] (2) In the refrigerant flow path module of the above (1), preferably, the refrigerant pipe is inserted into a hole formed in the first plate,

[0019] An opening that communicates with the refrigerant pipe and constitutes the flow path is formed in the second plate,

[0020] When viewed from the stacking direction of the first plate and the second plate, the hole is disposed inside the opening,

[0021] The storage portion is formed at a boundary portion between the inner peripheral surface of the opening and the plate surface of the first plate on the side closer to the second plate.

[0022] According to this structure, it is possible to use the boundary portion between the inner peripheral surface of the opening and the plate surface of the first plate to store the remaining solder, thereby preventing the solder from reaching the refrigerant pipe.

[0023] (3) In the refrigerant flow path module of the above (1), preferably, the refrigerant pipe is inserted into a hole formed in the first plate,

[0024] An opening that communicates with the refrigerant pipe and constitutes the flow path is formed in the second plate,

[0025] When viewed from the stacking direction of the first plate and the second plate, the hole is disposed inside the opening,

[0026] The storage portion is constituted by a groove that is arranged to extend radially outward from the hole and is formed in a portion of the plate surface of the first plate on the side closer to the second plate facing the flow path.

[0027] According to this structure, by storing the remaining solder in the groove, it is possible to prevent the solder from reaching the refrigerant pipe.

[0028] (4) Preferably, the refrigerant flow path module of the above (2) or (3) includes: a third plate that overlaps the side of the second plate opposite to the first plate; and a copper-containing solder that joins the opposing surfaces of the second plate and the third plate to each other,

[0029] A second opening that communicates with the refrigerant pipe and forms the flow path is formed in the third plate.

[0030] When viewed in the stacking direction of the first plate and the second plate, the opening is disposed inside the second opening.

[0031] The storage portion is formed at a boundary portion between an inner peripheral surface of the second opening and a plate surface of the second plate on a side closer to the third plate.

[0032] According to this structure, it is possible to store the remaining brazing filler metal using the boundary portion between the inner peripheral surface of the second opening and the plate surface of the second plate, thereby suppressing the brazing filler metal from reaching the refrigerant pipe.

[0033] (5) Preferably, the refrigerant flow path module of the above (2) or (3) includes: a third plate that overlaps the side of the second plate opposite to the first plate; and a copper-containing brazing filler metal that joins opposite surfaces of the second plate and the third plate to each other.

[0034] A second opening that communicates with the refrigerant pipe and forms the flow path is formed in the third plate.

[0035] When viewed in the stacking direction of the first plate and the second plate, the second opening is disposed inside the opening.

[0036] The storage portion is formed at a boundary portion between an inner peripheral surface of the opening and a plate surface of the third plate on a side closer to the second plate.

[0037] According to this structure, it is possible to store the remaining brazing filler metal using the boundary portion between the inner peripheral surface of the opening and the plate surface of the third plate, thereby suppressing the brazing filler metal from reaching the refrigerant pipe.

[0038] (6) In the refrigerant flow path module of the above (1), preferably, the storage portion includes: an insertion hole formed in the first plate and opening on a plate surface of the first plate on a side closer to the second plate; and an insertion member inserted into the insertion hole with a gap therebetween.

[0039] According to this structure, it is possible to store the remaining brazing filler metal using the gap between the insertion hole and the insertion member, thereby suppressing the brazing filler metal from reaching the refrigerant pipe.

[0040] (7) In the refrigerant flow path module of the above (6), preferably, in the stacking direction of the first plate and the second plate, the first plate is disposed at an end portion of the refrigerant flow path module.

[0041] The insertion hole opens on a plate surface of the first plate opposite to the second plate.

[0042] According to this structure, the remaining solder can be discharged from the gap between the insertion hole and the insertion member to the outside of the refrigerant flow path module.

[0043] (8) In the refrigerant flow path module of the above (1), preferably, the refrigerant pipe is inserted into the hole formed in the first plate,

[0044] An opening that communicates with the refrigerant pipe and constitutes the flow path is formed in the second plate,

[0045] A chamfered portion is formed at the boundary between the inner peripheral surface of the opening in the second plate and the plate surface of the second plate on the side close to the first plate,

[0046] The storage portion includes the chamfered portion.

[0047] According to this structure, the remaining solder can be stored in the space formed by the chamfered portion, thereby suppressing the solder from reaching the refrigerant pipe.

[0048] (9) The refrigerant flow path module of the above (8) preferably includes: a third plate that overlaps the side of the second plate opposite to the first plate; and a copper-containing solder that joins the opposing surfaces of the second plate and the third plate to each other,

[0049] A second opening that communicates with the refrigerant pipe and constitutes the flow path is formed in the third plate,

[0050] A second chamfered portion is formed at the boundary between the inner peripheral surface of the second opening in the third plate and the plate surface of the third plate on the side close to the second plate, or at the boundary between the inner peripheral surface of the first opening in the second plate and the plate surface of the second plate on the side close to the third plate,

[0051] The storage portion includes the second chamfered portion.

[0052] According to this structure, the remaining solder can be stored in the space formed by the second chamfered portion, thereby suppressing the solder from reaching the refrigerant pipe.

[0053] (10) In the refrigerant flow path module of any one of the above (1) to (9), preferably, a third chamfered portion is formed at the boundary between the outer peripheral surface of the second plate and the plate surface of the second plate on the side close to the first plate, or at the boundary between the outer peripheral surface of the first plate and the plate surface of the first plate on the side close to the second plate, and the storage portion includes the third chamfered portion.

[0054] According to this structure, the remaining solder can be stored in the space formed by the third chamfered portion, thereby suppressing the solder from reaching the refrigerant pipe.

[0055] (11) The air conditioner of the present disclosure includes the refrigerant flow path module according to any one of the above (1) to (10). Description of the Drawings

[0056] Figure 1 is a perspective view of the refrigerant flow path module of the first embodiment of the present disclosure.

[0057] Figure 2 is a top view of the refrigerant flow path module.

[0058] Figure 3 is a front view of the refrigerant flow path module.

[0059] Figure 4 is a front view showing the refrigerant flow path module disassembled.

[0060] Figure 5 is an enlarged cross-sectional view of a part of the refrigerant flow path module.

[0061] Figure 6 is a cross-sectional view of the refrigerant flow path module showing an enlarged part where the insertion member is inserted.

[0062] Figure 7 is a cross-sectional view of the refrigerant flow path module showing an enlarged part of the fastening portion of the plate achieved by the fastening member.

[0063] Figure 8 is an enlarged cross-sectional view of a part of the refrigerant flow path module of the second embodiment.

[0064] Figure 9 is an enlarged cross-sectional view of a part of the refrigerant flow path module of the third embodiment.

[0065] Figure 10 is an enlarged cross-sectional view of a part of the refrigerant flow path module of the fourth embodiment.

[0066] Figure 11 is a cross-sectional view showing an enlarged part where the insertion member is inserted in the refrigerant flow path module of the fifth embodiment.

[0067] Figure 12 is a cross-sectional view showing an enlarged part where the insertion member is inserted in the refrigerant flow path module of the sixth embodiment.

[0068] Figure 13 is an enlarged cross-sectional view of a part of the refrigerant flow path module of the seventh embodiment.

[0069] Figure 14 is an enlarged cross-sectional view of a part of the refrigerant flow path module of the eighth embodiment.

[0070] Figure 15An enlarged cross-sectional view of a part of the refrigerant flow path module according to the ninth embodiment.

[0071] Figure 16 An enlarged cross-sectional view of a part of the refrigerant flow path module according to the tenth embodiment.

[0072] Figure 17 A top view showing the interior of an air conditioner according to an embodiment of the present disclosure. Detailed Embodiments

[0073] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings.

[0074] [First Embodiment]

[0075] Figure 1 A perspective view of the refrigerant flow path module according to the first embodiment of the present disclosure. Figure 2 A top view of the refrigerant flow path module. Figure 3 A front view of the refrigerant flow path module.

[0076] The refrigerant flow path module 10 of the present embodiment can be applied, for example, to an air conditioner including a refrigerant circuit that performs a vapor compression refrigeration cycle operation. The refrigerant flow path module 10 is connected to devices such as a four-way reversing valve, a solenoid valve, a compressor, a storage tank, and an oil separator that constitute the refrigeration circuit.

[0077] The refrigerant flow path module 10 has a module main body 11, a joint pipe (refrigerant pipe 12), a fastening member 13, and an insertion member 14. A flow path 15 for refrigerant flow is formed inside the module main body 11 (refer to Figure 2 , Figure 3 ). The module main body 11 has a plurality of plates 21, 22, 23. The plurality of plates 21, 22, 23 are stacked and joined to each other. Adjacent plates 21, 22, 23 are joined to each other by brazing. The module main body 11 in the present embodiment is supported, for example, in the housing of the air conditioner with the plate surfaces of the plates 21, 22, 23 in a horizontal posture.

[0078] The plates 21, 22, and 23 of the present embodiment are made of stainless steel. The plates 21, 22, and 23 of the present embodiment are formed of, for example, SUS304L. The plates 21, 22, and 23 have rectangular plate surfaces. In the following description, the direction perpendicular to the plate surfaces of the plates 21, 22, and 23 (the normal direction of the plates 21, 22, and 23), in other words, the direction in which the plurality of plates 21, 22, and 23 are stacked is also referred to as the first direction Z. The two directions that are along the plate surfaces of the plates 21, 22, and 23 (directions orthogonal to the first direction Z) and orthogonal to each other are also referred to as the second direction X and the third direction Y. In the present embodiment, the long sides of the respective plates 21, 22, and 23 are arranged in the second direction X, and the short sides are arranged in the third direction Y. The shape of the plate surfaces of the plates 21, 22, and 23 is not limited to a rectangle, and it may be formed into a square, a polygon other than a quadrilateral, or a circular shape including an ellipse and an oblong, etc.

[0079] The plurality of plates 21, 22, and 23 have rectangular plate surfaces with the same shape. The plurality of plates 21, 22, and 23 have the same thickness (length in the first direction Z). However, the plurality of plates 21, 22, and 23 may have rectangular shapes that are different from each other. For example, the lengths of the long sides or the short sides may be different from each other, and they may have different thicknesses.

[0080] The plurality of plates 21, 22, and 23 include two end plates 21 arranged at both ends in the first direction Z and intermediate plates 22 and 23 arranged between the two end plates 21. The refrigerant flow path module 10 of the present embodiment has three intermediate plates 22 and 23. The three intermediate plates 22 and 23 are stacked between the end plates 21 at both ends.

[0081] As Figure 2 and Figure 3 shown, mounting holes 26 for mounting the joint pipes 12 are formed in each end plate 21. The mounting holes 26 penetrate the end plate 21 in the first direction Z. The mounting holes 26 are circular.

[0082] Each of the intermediate plates 22 and 23 is formed with openings 24 and 25 that form a flow path 15 for the refrigerant. The openings 24 and 25 penetrate the intermediate plates 22 and 23 in the first direction Z. The openings 24 and 25 are formed longer in the second direction X or the third direction Y, or are formed into a circular shape. The shape of the openings 24 and 25 is not particularly limited, and is set to a suitable shape according to the form of the required flow path 15.

[0083] As Figure 2 shown, the mounting holes 26 formed in the end plate 21 are arranged inside the openings 24 and 25 formed in the intermediate plates 22 and 23 when observed in the first direction Z ( Figure 2 the paper surface penetration direction).

[0084] The adapter tube 12 is formed in a substantially cylindrical shape. The adapter tube 12 is formed of a copper-containing material, such as copper (pure copper) or a copper alloy. The adapter tube 12 is arranged such that its axis is parallel to the first direction Z. Therefore, the axis of the adapter tube 12 is perpendicular to the plate surface of the end plate 21.

[0085] As Figure 3 shown, the adapter tube 12 has a large-diameter portion 12a on one end side in the axial direction, a small-diameter portion 12b on the other end side, and a stepped portion 12c in the middle. The large-diameter portion 12a and the small-diameter portion 12b are cylindrical. The diameter of the large-diameter portion 12a is larger than the diameter of the small-diameter portion 12b. The stepped portion 12c is formed in a conical shape such that the diameter gradually decreases from the large-diameter portion 12a toward the small-diameter portion 12b. The small-diameter portion 12b of the adapter tube 12 is inserted into the mounting hole 26 formed in the end plate 21. The outer peripheral surface of the small-diameter portion 12b and the inner peripheral surface of the mounting hole 26 are joined by brazing.

[0086] The large-diameter portion 12a of the adapter tube 12 is connected to, for example, a refrigerant pipe constituting a refrigerant circuit of an air conditioner. The large-diameter portion 12a of the adapter tube 12 may also be directly connected to a port of a component such as a valve constituting the refrigerant circuit.

[0087] The fastening member 13 fastens a plurality of plates 21, 22, 23. The fastening member 13 is, for example, made of stainless steel. As Figure 1 and Figure 3 shown, the fastening member 13 includes a bolt 31 and a nut 32. The bolt 31 penetrates through the plurality of plates 21, 22, 23 along the first direction Z, and the nut 32 is installed at the front end portion of the bolt 31 that has penetrated through the plates 21, 22, 23. The refrigerant flow path module 10 of the present embodiment includes a plurality of (five in the present embodiment) fastening members 13. The plurality of fastening members 13 are provided at the four corners and substantially the center of the module body 11 when viewed along the first direction Z. The number and arrangement of the fastening members 13 are not particularly limited. The fastening member 13 will be described in detail later.

[0088] The insertion member 14 is formed of a cylindrical pin. The insertion member 14 is, for example, made of stainless steel. As Figure 3 shown, the insertion member 14 penetrates through the plurality of plates 21, 22, 23 along the first direction Z. The insertion member 14 is installed on the plurality of plates 21, 22, 23 by brazing. The refrigerant flow path module 10 includes a plurality of (two in the present embodiment) insertion members 14. The plurality of insertion members 14 are separately arranged on both sides in the long side direction of the module body 11. However, the number and arrangement of the insertion members 14 are not particularly limited. The insertion member 14 will be described in detail later.

[0089] Figure 4 is a front view showing the refrigerant flow path module disassembled.

[0090] The multiple plates 21, 22, 23 that constitute the module body 11 of the refrigerant flow path module 10 are joined by brazing (hereinafter also referred to as furnace brazing) in a heating furnace. To manufacture the refrigerant flow path module 10, first, a sheet-like filler metal 17 is disposed between adjacent plates 21, 22, 23, and the plates 21, 22, 23 and the filler metal 17 are stacked. Insertion holes 16 for inserting the bolts 31 of the fastening member 13 and insertion holes 18 for inserting the insertion member 14 are formed in the multiple plates 21, 22, 23 so as to penetrate along the first direction Z. Insertion holes 17a corresponding to the insertion holes 16 and insertion holes 17b corresponding to the insertion holes 18 are also formed in the sheet-like filler metal 17 so as to penetrate along the first direction Z.

[0091] The shaft portion 31a of the bolt 31 is inserted from below into the insertion holes 16 of the stacked plates 21, 23, 23 and the insertion holes 17a of the filler metal 17, and the nut 32 is mounted to the thread groove 31a1 at the upper end portion of the shaft portion 31a, and the multiple plates 21, 22, 23 are fastened by the bolt 31 and the nut 32. The insertion member 14 is inserted from below or above into the insertion holes 18 of the stacked plates 21, 22, 23 and the insertion holes 17b of the filler metal 17.

[0092] The plates 21, 22, 23 fastened by the fastening member 13 are put into a furnace for brazing and heated. As a result, the filler metal 17 melts, and thus the multiple plates 21, 22, 23 are joined. The insertion member 14 is brazed to the plates 21, 22, 23 by the remaining filler metal that overflows from between the plates 21, 22, 23.

[0093] Figure 5 It is an enlarged cross-sectional view of a part of the refrigerant flow path module. Figure 5 And the following Figures 6 to 16 Are all shown in the posture during brazing.

[0094] In the brazing of the stainless steel end plate 21 and the intermediate plates 22, 23, for example, a copper-containing filler metal 17 such as a bronze filler metal is used. The melting point of this filler metal 17 is lower than the melting point of copper, which is the material of the joint pipe 12. In furnace brazing, heating is performed at a temperature lower than the melting point of the joint pipe 12 and higher than the melting point of the filler metal 17. Therefore, generally, only the filler metal 17 melts. However, when the remaining portion of the melted filler metal 17 overflows from between the plates 21, 22, 23 and flows to the copper joint pipe 12 and contacts it, sometimes a phenomenon occurs in which the melting point of the joint pipe 12 decreases. When the melting point of the joint pipe 12 decreases, the joint pipe 12 melts due to furnace brazing, resulting in manufacturing defects.

[0095] The refrigerant flow path module 10 of the present embodiment includes storage portions 40, 41, and 42 for storing the remaining solder 17 that overflows between the plates 21, 22, and 23. By storing the solder 17 in these storage portions 40, 41, and 42, the arrival of the solder 17 at the joint pipe 12 is suppressed, thereby suppressing the melting of the joint pipe 12.

[0096] The storage portion 40 of the present embodiment is provided at the boundary portion between the end plate (first plate) 21 and the adjacent intermediate plate (second plate) 22. Specifically, when viewed in the first direction Z, the mounting hole 26 formed in the end plate 21 for inserting the joint pipe 12 is disposed inside the opening 24 formed in the intermediate plate 22 and forming the flow path 15. Therefore, around the joint pipe 12, the plate surface (upper surface) on the intermediate plate 22 side of the end plate 21 is exposed into the flow path 15. The storage portion 40 is formed at the boundary portion between the inner peripheral surface of the opening 24 and the plate surface on the intermediate plate 22 side of the end plate 21. The remaining solder 17 that overflows between the plates 21, 22, and 23 accumulates in a rounded shape as indicated by reference numeral 17c and exists in the storage portion 40 in a solidified state.

[0097] Figure 5 The lower end plate 21 shown is connected to the joint pipe 12, but the upper end plate 21 is not connected to the joint pipe 12 communicating with the flow path 15. The boundary portion between the plate surface (lower surface) on the intermediate plate 22 side of the end plate 21 and the inner peripheral surface of the opening 24 of the intermediate plate 22 also constitutes the storage portion 40. The remaining solder 17 that overflows between the plates 21, 22 also accumulates in a rounded shape as indicated by reference numeral 17c and exists in this storage portion 40 in a solidified state.

[0098] Figure 6 It is a cross-sectional view of the refrigerant flow path module showing an enlarged portion where the insertion member is inserted.

[0099] The insertion member 14 is inserted into the insertion holes 18 formed in the plurality of plates 21, 22, 23. The insertion member 14 is formed to be slightly longer than the length of the module body 11 in the first direction Z and protrudes slightly from the end plates 21 on both sides. A minute gap is formed between the insertion member 14 and the insertion holes 18.

[0100] As described above, when the solder 17 melts due to furnace brazing, the remaining solder 17 that overflows between the plates 21, 22, and 23 flows into the gap between the insertion member 14 and the insertion hole 18 as indicated by the symbol 17d. Thereby, the insertion member 14 is joined to the plates 21, 22, and 23, and the remaining solder 17d is stored in the gap between the insertion member 14 and the insertion hole 18. Therefore, the gap between the insertion member 14 and the insertion hole 18 functions as a storage portion 41 for storing the remaining solder 17d. By storing the solder 17d in this storage portion 41, the amount of the remaining solder 17 that overflows to the flow path 15 side is reduced, and thus it is possible to suppress the remaining solder 17 from reaching the joint pipe 12. Since the insertion hole 18 formed in the lower end plate 21 opens downward, the solder 17 that is not completely stored in the storage portion 41 is discharged to the outside from the lower end of the insertion hole 18.

[0101] Figure 7 It is a cross-sectional view of a refrigerant flow path module in which the fastening portion of the plates realized by the fastening member is enlarged and shown.

[0102] The fastening member 13 fastens the plurality of plates 21, 22, and 23 to each other. The bolt 31 constituting the fastening member 13 is, for example, a hexagon bolt and has a shaft portion 31a and a head portion 31b. The shaft portion 31a is formed in a cylindrical shape. The head portion 31b is formed at one end in the long side direction of the shaft portion 31a. The outer peripheral surface of the head portion 31b is formed in a hexagonal shape. A thread groove 31a1 is formed on the outer peripheral surface of the end portion of the shaft portion 31a on the side opposite to the head portion 31b.

[0103] The nut 32 is, for example, a hexagon nut. The nut 32 is formed in a cylindrical shape. A thread groove 32a1 is formed on the inner peripheral surface of the nut 32. The thread groove 32a1 of the nut 32 can be engaged with the thread groove 31a1 of the bolt 31.

[0104] The shaft portion 31a of the bolt 31 is inserted into the insertion holes 16 formed in the plurality of plates 21, 22, and 23. A minute gap is formed between the bolt 31 (shaft portion 31a) and the insertion hole 16. As described above, when the solder 17 melts due to furnace brazing, the remaining solder that overflows between the plates 21, 22, and 23 flows into the gap between the bolt 31 and the insertion hole 16 as indicated by the symbol 17e. Thereby, the remaining solder 17e is stored in the gap between the bolt 31 and the insertion hole 16. Therefore, the gap between the fastening member 13 and the insertion hole 16 functions as a storage portion 42 for storing the remaining solder 17e. By storing the solder 17e in this storage portion 42, the amount of the remaining solder 17 that overflows to the flow path 15 side is reduced, and thus it is possible to suppress the solder 17 from reaching the joint pipe 12.

[0105] [Second Embodiment]

[0106] Figure 8An enlarged cross-sectional view of a part of the refrigerant flow path module according to the second embodiment.

[0107] In the refrigerant flow path module 10 of the second embodiment, the sizes of the openings 24 and 25 formed in the intermediate plates 22 and 23 are different from each other. In the present embodiment, the lower intermediate plate among the plurality of intermediate plates 22 is denoted by the symbol 22a, and the upper intermediate plate is denoted by the symbol 22b. In the present embodiment, the opening of the intermediate plate 22a is denoted by the symbol 24a, and the opening of the intermediate plate 22b is denoted by the symbol 24b.

[0108] In the present embodiment, on the intermediate plate (second plate) 22a adjacent to the lower end plate (first plate) 21 to which the joint pipe 12 is attached, an opening (first opening) 24a identical to that of the first embodiment is formed. The mounting hole 26 for mounting the joint pipe 12 is disposed inside the first opening 24a when viewed in the first direction Z.

[0109] In another intermediate plate (third plate) 23 adjacent to the upper side of the intermediate plate 22a, an opening (second opening) 25 is formed. The first opening 24a is disposed inside the second opening 25 when viewed in the first direction Z. Further, in another intermediate plate (fourth plate) 22b adjacent to the upper side of the other intermediate plate 23, an opening 24b (third opening) is formed. The second opening 25 is disposed inside the third opening 24b when viewed in the first direction Z. Therefore, in the present embodiment, as the distance from the end plate 21 provided with the joint pipe 12 increases, the openings 24a, 25, and 24b formed in the intermediate plates 22a, 23, and 22b gradually increase.

[0110] In the present embodiment, similarly to the first embodiment, a storage portion 40 is provided at the boundary portion between the end plate (first plate) 21 to which the joint pipe 12 is attached and the adjacent intermediate plate (second plate) 22a. Specifically, the mounting hole 26 into which the joint pipe 12 is inserted is disposed inside the opening 24 formed in the intermediate plate 22 and forming the flow path 15 when viewed in the first direction Z. Therefore, around the joint pipe 12, the plate surface of the end plate 21 on the intermediate plate 22 side is exposed into the flow path 15. The storage portion 40 is formed at the boundary portion between the inner peripheral surface of the first opening 24a and the plate surface of the end plate 21 on the intermediate plate 22 side. The remaining brazing material 17 flowing out from the plates 21 and 22a accumulates in a rounded shape as indicated by the symbol 17c and exists in the storage portion 40 in a solidified state.

[0111] The plate surface (upper surface) of the intermediate plate (second plate) 22a on the side of the intermediate plate (third plate) 23 is exposed into the flow path 15. Therefore, the storage portion 40 is also formed at the boundary portion between the inner peripheral surface of the second opening 25 and the plate surface of the intermediate plate 22a on the side of the intermediate plate 23. The remaining solder 17 that has overflowed between the plates 22a and 23 accumulates in a rounded shape as indicated by reference numeral 17c and exists in the storage portion 40 in a solidified state.

[0112] Similarly, the plate surface (upper surface) of the intermediate plate (third plate) 23 on the side of the intermediate plate (fourth plate) 22b is exposed into the flow path 15. Therefore, the storage portion 40 is formed between the inner peripheral surface of the third opening 24b and the plate surface of the intermediate plate 23 on the side of the intermediate plate 22b. The remaining solder 17 that has overflowed between the intermediate plates 22b and 23 accumulates in a rounded shape as indicated by reference numeral 17c and exists in the storage portion 40 in a solidified state.

[0113] In Figure 8 the upper end plate 21 is not connected to the joint pipe 12 communicating with the flow path 15. The boundary portion between the plate surface (lower surface) of the end plate 21 on the side of the intermediate plate 22b and the inner peripheral surface of the opening 24b of the intermediate plate 22b also constitutes the storage portion 40. The remaining solder 17 that has overflowed between the plates 21 and 22b also accumulates in a rounded shape as indicated by reference numeral 17c and exists in the storage portion 40 in a solidified state.

[0114] [Third Embodiment]

[0115] Figure 9 is an enlarged cross-sectional view of a part of the refrigerant flow path module of the third embodiment.

[0116] In the third embodiment, similar to the first embodiment, openings 24 and 25 are respectively formed in the plurality of intermediate plates 22 and 23. The opening 25 of the intermediate plate (third plate) 23 formed in the exact middle of the intermediate plates 22 and 23 is smaller than the openings 24 formed in the intermediate plates 22 above and below it. Specifically, the opening 25 formed in the intermediate plate 23 is disposed inside the opening 24 of the intermediate plate 22 when viewed in the first direction Z. Therefore, the plate surfaces (upper surface and lower surface) of the intermediate plate 23 on the side of the intermediate plate 22 are exposed into the flow path 15. Therefore, in the present embodiment, the boundary portion between the inner peripheral surface of the opening 24 and the plate surface of the intermediate plate 23 on the side of the intermediate plate 22 constitutes the storage portion 40. Other structures are the same as those of the first embodiment.

[0117] [Fourth Embodiment]

[0118] Figure 10 is an enlarged cross-sectional view of a part of the refrigerant flow path module of the fourth embodiment.

[0119] In the present embodiment, a groove 27 is formed around the mounting hole 26 of the end plate 21 to which the joint pipe 12 is mounted. The groove 27 is formed in the plate surface (upper surface) of the end plate 21 exposed into the flow path 15. In other words, the groove 27 is arranged to be away from the mounting hole 26 toward the radially outer side and is formed in a portion of the plate surface of the intermediate plate 22 side of the end plate 21 facing the flow path 15.

[0120] The remaining solder 17 overflowing between the plates 21, 22, and 23 enters the groove 27 and is stored therein before reaching the joint pipe 12 as indicated by reference numeral 17f. Therefore, the groove 27 constitutes the storage portion 43. Accordingly, it is possible to suppress a decrease in the melting point of the joint pipe 12 due to contact with the solder 17. In addition, the groove 27 may be formed to surround the entire circumference of the mounting hole 26, or may be locally formed in a region where the remaining solder 17 is likely to flow in.

[0121] [Fifth Embodiment]

[0122] Figure 11 is a cross-sectional view showing an enlarged part of the refrigerant flow path module of the fifth embodiment in which the insertion member is inserted.

[0123] In the present embodiment, different from the first embodiment, the insertion member 14 does not penetrate the module body 11. Specifically, insertion holes 18 are formed in the lower end plate 21 and the intermediate plates 22 and 23 among the plates 21, 22, and 23 constituting the module body 11, but no insertion hole is formed in the upper end plate 21. Therefore, the insertion member 14 is inserted into the insertion hole 18 from Figure 11 the lower side of the module body 11 and does not protrude to the upper side.

[0124] In the present embodiment, each solder 17 is connected to the gap (storage portion 41) between the insertion member 14 and the insertion hole 18, and therefore, the remaining solder 17 flows into and is stored in the storage portion 41. The insertion hole 18 formed in the lower end plate 21 opens downward, and thus, the solder 17d that cannot be completely stored in the storage portion 41 is discharged to the outside.

[0125] [Sixth Embodiment]

[0126] Figure 12 is a cross-sectional view showing an enlarged part of the refrigerant flow path module of the sixth embodiment in which the insertion member is inserted.

[0127] In this embodiment, different from the first embodiment, the insertion member 14 does not penetrate the module main body 11. Specifically, insertion holes 18 penetrating in the first direction Z are formed in the upper end plate 21 and the intermediate plates 22 and 23 among the plates 21, 22, and 23 constituting the module main body 11, but an insertion hole penetrating in the first direction Z is not formed in the lower end plate 21. An insertion hole 19 that is open upward and closed downward is formed in the lower end plate 21.

[0128] In this embodiment, each solder 17 is connected to the gaps (storage portions 41) between the insertion member 14 and the insertion holes 18 and 19, and thus the remaining solder 17 is stored in the storage portions 41. However, in this embodiment, since the lower ends of the storage portions 41 are not open to the outside, the remaining solder 17 cannot be discharged.

[0129] [Seventh Embodiment]

[0130] Figure 13 is an enlarged cross-sectional view of a part of the refrigerant flow path module of the seventh embodiment.

[0131] In the seventh embodiment, similarly to the first embodiment, openings 24 and 25 are respectively formed in the plurality of intermediate plates 22 and 23. The openings 24 and 25 formed in the plurality of intermediate plates 22 and 23 are formed to have the same size. Chamfered portions 22c, 22d, and 23c are formed at the boundaries between the inner peripheral surfaces of the openings 24 and 24 in each of the intermediate plates 22 and 23 and the lower plate surfaces (lower surfaces). The chamfered portions 22c, 22d, and 23c of this embodiment are all C chamfers and are constituted by tapered surfaces that are inclined between the inner peripheral surfaces of the openings 24 and 25 and the lower plate surfaces. However, the chamfered portions 22c, 22d, and 23c may also be R chamfers (circular chamfers).

[0132] Specifically, in the intermediate plate (second plate) 22 adjacent to the end plate (first plate) 21 to which the joint pipe 12 is attached, a chamfered portion (first chamfered portion) 22c is formed at the boundary between the inner peripheral surface of the opening (first opening) 24 and the plate surface on the end plate 21 side (lower side). Through this chamfered portion 22c, a space having a substantially triangular cross-section is formed between the end plate 21 and the intermediate plate 22, and the remaining solder 17g that overflows between the plates 21 and 22 accumulates and exists in a solidified state in this space. Therefore, this chamfered portion 22c functions as a storage portion 72 for the remaining solder 17g.

[0133] Similarly, in another intermediate plate (third plate) 23 adjacent to the upper side of the intermediate plate (second plate) 22, a chamfered portion (second chamfered portion) 23c is formed at the boundary between the inner peripheral surface of the opening (second opening) 25 and the plate surface (lower side) on the side of the intermediate plate (second plate) 22. Further, in yet another intermediate plate (fourth plate) 22 adjacent to the upper side of the other intermediate plate (third plate) 23, a chamfered portion (second chamfered portion) 22d is formed at the boundary between the inner peripheral surface of the opening (third opening) 24 and the plate surface (lower side) on the side of the other intermediate plate (third plate) 23. Through the above-described chamfered portions 23c and 22d, a space having a substantially triangular cross-section is formed between the intermediate plate 22 and the intermediate plate 23, and the remaining solder 17g that has overflowed between the respective plates 21 and 22 accumulates and exists in a solidified state in this space. Therefore, the above-described chamfered portions 23c and 22d also function as a storage portion 72 for the remaining solder 17g.

[0134] Further, in the present embodiment, similar to the first embodiment (refer to Figure 5 ), the boundary portion between the plate surface (lower surface) on the side of the intermediate plate 22 of the upper end plate 21 and the inner peripheral surface of the opening 24 of the intermediate plate 22 functions as a storage portion 40, and the remaining solder 17c accumulates in a rounded shape and exists in a solidified state.

[0135] The refrigerant flow path module 10 of the present embodiment includes a storage portion 72 formed by the chamfered portions 22c, 23c, and 22d, and thus, it is possible to suppress the remaining solder 17g from entering the inside of the openings 24 and 25.

[0136] In the present embodiment, even if the openings 24 and 24 of the plurality of intermediate plates 22 and 23 are the same size as each other, the storage portion 72 can be formed. However, in the present embodiment, for example, similar to the embodiments shown in Figure 8 or Figure 9 , the openings 24 and 25 of the intermediate plates 22 and 23 may be different sizes from each other.

[0137] [Eighth Embodiment]

[0138] Figure 14 is an enlarged cross-sectional view of a part of the refrigerant flow path module of the eighth embodiment.

[0139] In the eighth embodiment, similar to the seventh embodiment, chamfered portions 22c, 22d, 23c, 22e, 22f, 23d are formed in each of the intermediate plates 22, 23. However, in the present embodiment, chamfered portions 22c, 22d, 23c, 22e, 22f, 23d are respectively formed at the boundaries between the inner peripheral surfaces of the openings 24, 25 in each of the intermediate plates 22, 23 and the upper and lower plate surfaces. The chamfered portions 22c, 22d, 23c, 22e, 22f, 23d in the present embodiment are all C chamfers, and are constituted by tapered surfaces that are inclined between the inner peripheral surfaces of the openings 24, 25 and the upper and lower plate surfaces. However, the chamfered portions 22c, 22d, 23c, 22e, 22f, 23d may also be R chamfers (circular chamfers).

[0140] Specifically, in the eighth embodiment, in addition to the chamfered portions 22c, 23c, 22d described in the seventh embodiment, chamfered portions (second chamfered portions) 22e, 22f, 23d are also formed at the boundaries between the inner peripheral surfaces of the openings 24, 25 formed in each of the intermediate plates (second plate, third plate, fourth plate) 22, 23, 22 and the upper plate surfaces of the intermediate plates 22, 23, 22.

[0141] Therefore, in the present embodiment, the storage portion 72 located between the adjacent intermediate plates 22, 23 can be formed to be larger, so that the storage amount of the remaining solder 17g can be increased. In addition, in the present embodiment, a storage portion 72 constituted by the chamfered portion 22f can also be provided between the upper end plate 21 and the adjacent intermediate plate 22.

[0142] In the eighth embodiment, the second chamfered portion may also be constituted only by the chamfered portions 22e, 22f, 23c, 23d formed at the boundaries between the inner peripheral surfaces of the openings 24, 25 formed in the intermediate plates (second plate 22, third plate 23, fourth plate 22) and the upper plate surfaces of the intermediate plates 22, 23, 22.

[0143] [Ninth Embodiment]

[0144] Figure 15 It is an enlarged cross-sectional view of a part of the refrigerant flow path module of the ninth embodiment.

[0145] In the ninth embodiment, chamfered portions 21g, 22g, 23g are formed at the boundaries between the outer peripheral surfaces of the upper end plate 21 of the module main body 11 and the intermediate plates 22, 23 and the lower plate surfaces of these plates 21, 22, 23. The chamfered portions 21g, 22g, 23g are all C chamfers, and are constituted by tapered surfaces that are inclined between the outer peripheral surfaces of the plates 21, 22, 23 and the lower plate surfaces. However, the chamfered portions 21g, 22g, 23g may also be R chamfers (circular chamfers).

[0146] Specifically, in an intermediate plate (second plate) 22 adjacent to a lower end plate (first plate) 21, a chamfered portion (third chamfered portion) 22g is formed at a boundary between an outer peripheral surface thereof and a plate surface on the side of the end plate 21 (lower side). Through this chamfered portion 22g, a space having a substantially triangular cross-section is formed between the end plate 21 and the intermediate plate 22, and the remaining solder 17h that overflows between the respective plates 21 and 22 accumulates and exists in a solidified state in this space. Therefore, this chamfered portion 22g functions as a storage portion 74 for the remaining solder 17h.

[0147] Similarly, in another intermediate plate (third plate) 23 adjacent to the upper side of the intermediate plate (second plate) 22, a chamfered portion 23g is formed at a boundary between an outer peripheral surface thereof and a plate surface on the side of the intermediate plate (second plate) 22 (lower side). Further, in yet another intermediate plate (fourth plate) 22 adjacent to the upper side of this another intermediate plate (third plate) 23, a chamfered portion 22g is formed at a boundary between an outer peripheral surface thereof and a plate surface on the side of this another intermediate plate (third plate) 23 (lower side). In an upper end plate 21 adjacent to another intermediate plate (fourth plate) 22, a chamfered portion 21g is formed at a boundary between an outer peripheral surface thereof and a plate surface on the side of yet another intermediate plate (fourth plate) 22 (lower side).

[0148] Through the above-described chamfered portions 21g, 22g, and 23g, spaces having a substantially triangular cross-section are formed between the intermediate plate 22 and the intermediate plate 23 and between the intermediate plate 22 and the end plate 21, and the remaining solder 17h that overflows between the respective plates 21, 22, and 23 accumulates and exists in a solidified state in these spaces. Therefore, these chamfered portions 21g, 22g, and 23g also function as a storage portion 74 for the remaining solder 17h.

[0149] In the present embodiment, the solder 17h that is melted by furnace brazing and overflows from between the end plate 21 and the intermediate plates 22 and 23 to the outer peripheral surface side is stored in the storage portion 74. Therefore, the amount of the remaining solder 17 that overflows to the flow path 15 side is reduced, and thus it is possible to suppress the solder 17 from reaching the copper joint pipe 12.

[0150] [Tenth Embodiment]

[0151] Figure 16 is an enlarged cross-sectional view of a part of a refrigerant flow path module according to the tenth embodiment.

[0152] In the tenth embodiment, similar to the ninth embodiment, chamfered portions 21g, 22g, and 23g are formed on each of the intermediate plates 22 and 23 and the upper end plate 21. However, in this embodiment, chamfered portions 22h and 23h are also respectively formed at the boundaries between the outer peripheral surfaces of the intermediate plates 22 and 23 and the upper plate surfaces. In addition, in this embodiment, a chamfered portion (third chamfered portion) 21h is also formed at the boundary between the outer peripheral surface of the lower end plate (first plate) 21 and the upper plate surface.

[0153] The above-mentioned chamfered portions 21g, 21h, 22g, 22h, 23g, and 23h are all C chamfers, which are composed of tapered surfaces inclined between the outer peripheral surfaces of the plates 21, 22, and 23 and the lower or upper plate surfaces. However, the chamfered portions 21g, 21h, 22g, 22h, 23g, and 23h can also be R chamfers (circular chamfers).

[0154] In this embodiment, the storage portions 74 located between the adjacent end plates 21 and intermediate plates 22 and the storage portions 74 located between the adjacent intermediate plates 22 and 23 can be formed larger, so that the storage amount of the remaining solder 17g can be increased.

[0155] In the tenth embodiment, the third chamfered portion can also be formed only at the boundary between the outer peripheral surface of the lower end plate (first plate) 21 and the upper plate surface.

[0156] As described above, the first to tenth embodiments can be implemented by combining some or all of them with each other.

[0157] [Structure of air conditioner]

[0158] Figure 17 It is a top view showing the inside of an air conditioner according to an embodiment of the present disclosure.

[0159] Figure 17 The outdoor unit 51 of a split air conditioner 1 separated into an outdoor unit and an indoor unit is shown, and the refrigerant flow path module 10 is provided in the outdoor unit 51.

[0160] As Figure 17 shown, the outdoor unit 51 has a housing 60, and components constituting a refrigerant circuit such as a compressor 44, a storage tank 45, an outdoor heat exchanger 47, an oil separator 46, etc. and an electrical installation unit 61 are housed in the housing 60. The housing 60 is formed in a substantially rectangular parallelepiped shape. The housing 60 has a bottom plate 63, support columns 64, a top plate (not shown), a front panel 66, etc. The bottom plate 63 and the top plate are formed in a quadrilateral shape when viewed from above. The support columns 64 are composed of long members having a substantially L-shaped cross-sectional shape and being long in the vertical direction, and are installed at the four corners of the bottom plate 63 and the top plate.

[0161] An opening 60a for maintenance is formed on the front surface of the housing 60. The opening 60a is blocked by a front panel (front side plate) 66. By removing the front panel 66 from the housing 60, maintenance, replacement, etc. of the components inside the housing 60 can be performed via the opening 60a.

[0162] Components such as a compressor 44, a storage tank 45, an outdoor heat exchanger 47, and an oil separator 46 are installed on the bottom plate 63 of the housing 60. The outdoor heat exchanger 47 is arranged corresponding to (opposite to) three sides of the housing 60, specifically, the left side, the right side, and the rear side of the housing 60. A gas header 47e is provided at one end of the outdoor heat exchanger 47, and a liquid header 47f is provided at the other end. Suction ports 60b for sucking external air are respectively formed on the left side, the right side, and the rear side of the housing 60.

[0163] The outdoor unit 51 is configured to suck air from the suction port 60b of the housing 60 by driving a fan (not shown), and blow the air upward from the upper part of the housing 60 after heat exchange between the air and the outdoor heat exchanger 47.

[0164] The compressor 44 is arranged approximately at the center in the left - right direction Y near the front surface of the housing 60. The electrical installation unit 61 is arranged near the front surface of the housing 60 and is adjacent to the right side of the compressor 44. The storage tank 45 is arranged behind the compressor 44. The oil separator 46 is arranged on the left side of the storage tank 45. The electrical installation unit 61 includes a controller 61a for controlling the operations of the compressor 44, valves, fans, etc.

[0165] The refrigerant flow path module 10 described above is provided in the outdoor unit 51. The refrigerant flow path module 10 constitutes a part of the flow path of the refrigerant piping that connects the components of the refrigerant circuit such as the compressor 44, the storage tank 45, the flow path switching valve, the outdoor heat exchanger 47, the expansion valve, the oil separator 46, and the stop valves 49a, 49b.

[0166] The refrigerant flow path module 10 of the first to tenth embodiments described above is arranged on the left side (one side in the third direction Y) of the compressor 44 and the storage tank 45. The refrigerant flow path module 10 is arranged on the front side (one side in the second direction X) of the oil separator 46. The refrigerant flow path module 10 of the present embodiment is supported in the housing 60 with the plate surfaces of the plates 21, 22, 23 (refer to Figure 1 ) that constitute the module body 11 being horizontal. For example, the refrigerant flow path module 10 is supported by the refrigerant piping 52 - 55 by being fixed to the components 49a, 44, 45, etc. of the refrigerant circuit inside the housing 60.

[0167] [Function and effect of the embodiment]

[0168] AsFigures 5 to 16 As shown, the refrigerant flow path module 10 of the above-described embodiment includes: a first plate (e.g., end plate 21); a second plate (e.g., intermediate plate 22) that coincides with the first plate 21; a copper-containing refrigerant pipe (e.g., joint pipe 12) installed on the first plate 21; a copper-containing solder 17 that joins the opposing surfaces of the first plate 21 and the second plate 22 to each other; and storage portions 40, 41, 42, 43, 72, 74 that store the remaining solder 17. Therefore, it is possible to suppress the remaining solder 17 from reaching the refrigerant pipe 12 and melting the refrigerant pipe 12.

[0169] As Figure 5 , Figure 8 and Figure 9 shown, in the above-described embodiment, the refrigerant pipe 12 is installed in the mounting hole 26 formed in the first plate 21, and an opening 24 that communicates with the refrigerant pipe 12 and constitutes the flow path 15 is formed in the second plate 22. When viewed in the stacking direction (first direction Z) of the first plate 21 and the second plate 22, the mounting hole 26 is disposed inside the opening 24, and the storage portion 40 is formed at the boundary portion between the inner peripheral surface of the opening 24 and the plate surface of the first plate 21 on the second plate 22 side. Therefore, it is possible to use the boundary portion between the inner peripheral surface of the opening 24 and the plate surface of the first plate 21 to store the remaining solder 17, thereby suppressing the solder 17 from reaching the refrigerant pipe 12.

[0170] As Figure 10 shown, in the above-described embodiment, the refrigerant pipe 12 is installed in the mounting hole 26 formed in the first plate 21, and an opening 24 that communicates with the refrigerant pipe 12 and constitutes the flow path 15 is formed in the second plate 22. When viewed in the stacking direction (first direction Z) of the first plate 21 and the second plate 22, the mounting hole 26 is disposed inside the opening 24, and the storage portion 43 is constituted by a groove 27. The groove 27 is configured to be away from the mounting hole 26 in the radial outer direction and is formed in a portion of the plate surface of the first plate 21 on the second plate 22 side that faces the flow path 15. Thus, by storing the remaining solder 17 in the groove 27, it is possible to suppress the solder 17 from reaching the refrigerant pipe 12.

[0171] As Figure 8As shown in the above embodiment, it includes: a third plate (e.g., the intermediate plate 23) that coincides with the side of the second plate 22 opposite to the first plate 21; and a copper-containing solder 17 that joins the opposite surfaces of the second plate 22 and the third plate 23 to each other. A second opening (e.g., the opening 25) that communicates with the refrigerant pipe 12 and forms a flow path 15 is formed in the third plate 23. When viewed from the lamination direction (the first direction Z) of the first plate 21 and the second plate 22, the opening 24 is disposed inside the second opening 25, and a storage portion 40 is formed at the boundary portion between the inner peripheral surface of the second opening 25 and the plate surface of the second plate 22 on the side of the third plate 23. Thus, the remaining solder 17 can be stored using the boundary portion between the inner peripheral surface of the second opening 25 and the plate surface of the second plate 22, thereby suppressing the solder 17 from reaching the refrigerant pipe 12.

[0172] As Figure 9 shown in the above embodiment, it includes: a third plate (e.g., the intermediate plate 23) that coincides with the side of the second plate 22 opposite to the first plate 21; and a copper-containing solder 17 that joins the opposite surfaces of the second plate 22 and the third plate 23 to each other. A second opening (e.g., the opening 25) that communicates with the refrigerant pipe 12 and forms a flow path 15 is formed in the third plate 23. When viewed from the lamination direction of the first plate 21 and the second plate 22, the second opening 25 is disposed inside the opening 24, and a storage portion 40 is formed at the boundary portion between the inner peripheral surface of the opening 24 and the plate surface of the third plate 23 on the side of the second plate 22. Thus, the remaining solder 17 can be stored using the boundary portion between the inner peripheral surface of the opening 24 and the plate surface of the third plate 23, thereby suppressing the solder 17 from reaching the refrigerant pipe 12.

[0173] As Figure 6 , Figure 11 and Figure 12 shown in the above embodiment, the storage portion 41 includes: insertion holes 18, 19 formed in the first plate 21 and opening on the plate surface of the first plate 21 on the side of the second plate 22; and insertion members 14 inserted into the insertion holes 18, 19 with a gap therebetween. Thus, the remaining solder 17 can be stored using the gap between the insertion holes 18, 19 and the insertion members 14, thereby suppressing the solder 17 from reaching the refrigerant pipe 12.

[0174] As Figure 6 and Figure 11 shown in the above embodiment, in the lamination direction of the first plate 21 and the second plate 22, the first plate 21 is disposed at the end of the refrigerant flow path module 10, and the insertion holes 18 open on the plate surface of the first plate 21 on the side opposite to the second plate 22. Thus, the remaining solder 17 can be discharged from the gap (the storage portion 41) between the insertion holes 18 and the insertion members 14 to the outside of the refrigerant flow path module 10.

[0175] As Figure 13 andFigure 14 As shown, in the above-described embodiment, the refrigerant pipe 12 is inserted into the hole 26 formed in the first plate 21, and the opening 24 that communicates with the refrigerant pipe 12 and constitutes the flow path 15 is formed in the second plate 22. A chamfered portion 22c is formed at the boundary between the inner peripheral surface of the opening 24 in the second plate 22 and the plate surface of the second plate 22 on the first plate 21 side. The storage portion 72 includes the chamfered portion 22c. Thus, the space formed by the chamfered portion 22c can be used to store the remaining solder 17, thereby suppressing the solder 17 from reaching the refrigerant pipe 12.

[0176] As Figure 13 and Figure 14 shown, in the above-described embodiment, it includes: a third plate 23 that coincides with the side of the second plate 22 opposite to the first plate 21; and a copper-containing solder 17 that joins the opposing surfaces of the second plate 22 and the third plate 23. A second opening 25 that communicates with the refrigerant pipe 12 and constitutes the flow path 15 is formed in the third plate 23. A second chamfered portion 23c, 22e is formed at the boundary between the inner peripheral surface of the second opening 25 in the third plate 23 and the plate surface of the third plate 23 on the second plate 22 side, or at the boundary between the inner peripheral surface of the first opening 24 in the second plate 22 and the plate surface of the second plate 22 on the third plate 23 side. The storage portion 72 includes the second chamfered portion 23c, 22e. Thus, the space formed by the second chamfered portion 23c, 22e can be used to store the remaining solder 17 that overflows from between the second plate 22 and the third plate 23, thereby suppressing the solder 17 from reaching the refrigerant pipe 12.

[0177] As Figure 15 and Figure 16 shown, in the above-described embodiment, a third chamfered portion 22g, 21h is formed at the boundary between the outer peripheral surface of the second plate 22 and the plate surface of the second plate 22 on the first plate 21 side, or at the boundary between the outer peripheral surface of the first plate 21 and the plate surface of the first plate 21 on the second plate 22 side. The storage portion 74 includes the third chamfered portion 22g, 21h. Thus, the space formed by the third chamfered portion 22g, 21h can be used to store the remaining solder 17 that overflows from between the first plate 21 and the second plate 22, thereby suppressing the solder 17 from reaching the refrigerant pipe 12 from the first opening 24.

[0178] Above, the embodiments have been described, but it should be understood that various changes in form and details can be made without departing from the gist and scope of the claims.

[0179] For example, the number of plates constituting the module body is not limited to the above-described embodiment, as long as it includes at least two plates (the first plate and the second plate).

[0180] Reference Signs

[0181] 12 Connector pipe (refrigerant pipe);

[0182] 14 Insertion member;

[0183] 15 Flow path;

[0184] 17 Solder;

[0185] 18 Insertion hole;

[0186] 19 Insertion hole;

[0187] 21 End plate (first plate);

[0188] 21h Chamfered portion (third chamfered portion);

[0189] 22 Intermediate plate (second plate);

[0190] 22c Chamfered portion (first chamfered portion);

[0191] 22e Chamfered portion (second chamfered portion);

[0192] 22g Chamfered portion (third chamfered portion);

[0193] 23 Intermediate plate (third plate);

[0194] 23c Chamfered portion (second chamfered portion);

[0195] 24 Opening;

[0196] 25 Second opening;

[0197] 26 Mounting hole;

[0198] 27 Groove;

[0199] 40 Storage portion;

[0200] 41 Storage portion;

[0201] 42 Storage portion;

[0202] 43 Storage portion;

[0203] 72 Storage portion;

[0204] 74 Storage portion.

Claims

1. A refrigerant flow path module having a refrigerant flow path (15) formed therein, characterized in that, Comprising: A first plate (21); A second plate (22) that coincides with the first plate (21); A copper-containing refrigerant pipe (12) installed on the first plate (21); A copper-containing solder (17) that joins the opposing surfaces of the first plate (21) and the second plate (22) to each other; and A storage portion (40) that stores the remaining solder (17), The refrigerant pipe (12) is inserted into a hole (26) formed in the first plate (21), An opening (24) that communicates with the refrigerant pipe (12) and constitutes the flow path (15) is formed in the second plate (22), When viewed from the stacking direction of the first plate (21) and the second plate (22), the hole (26) is disposed inside the opening (24), The storage portion (40) is formed at the boundary portion between the inner peripheral surface of the opening (24) and the plate surface of the first plate (21) that is close to the second plate (22) and joined to the second plate (22).

2. A refrigerant flow path module having a refrigerant flow path (15) formed therein, characterized in that, Comprising: A first plate (21); A second plate (22) that coincides with the first plate (21); A copper-containing refrigerant pipe (12) installed on the first plate (21); A copper-containing solder (17) that joins the opposing surfaces of the first plate (21) and the second plate (22) to each other; and A storage portion (40) that stores the remaining solder (17), The refrigerant pipe (12) is inserted into a hole (26) formed in the first plate (21), An opening (24) that communicates with the refrigerant pipe (12) and constitutes the flow path (15) is formed in the second plate (22), When viewed from the stacking direction of the first plate (21) and the second plate (22), the hole (26) is disposed inside the opening (24), The storage portion (40) is formed at the boundary portion between the inner peripheral surface of the opening (24) and the plate surface of the first plate (21) that is close to the second plate (22). The refrigerant flow path module includes: a third plate (23) that coincides with the side of the second plate (22) opposite to the first plate (21); And a copper-containing solder (17) that joins the opposing surfaces of the second plate (22) and the third plate (23) to each other, A second opening (25) that communicates with the refrigerant pipe (12) and constitutes the flow path (15) is formed in the third plate (23), When viewed from the stacking direction of the first plate (21) and the second plate (22), the opening (24) is disposed inside the second opening (25), The storage portion (40) is further formed at the boundary portion between the inner peripheral surface of the second opening (25) and the plate surface of the second plate (22) that is close to the third plate (23).

3. A refrigerant flow path module, inside which a refrigerant flow path (15) is formed, characterized in that, Comprising: A first plate (21); A second plate (22) that coincides with the first plate (21); A copper-containing refrigerant pipe (12) installed on the first plate (21); A copper-containing solder (17) that joins the opposing surfaces of the first plate (21) and the second plate (22) to each other; and A storage part (40) that stores the remaining solder (17). The refrigerant pipe (12) is inserted into a hole (26) formed in the first plate (21). An opening (24) that communicates with the refrigerant pipe (12) and forms the flow path (15) is formed in the second plate (22). When viewed in the stacking direction of the first plate (21) and the second plate (22), the hole (26) is disposed inside the opening (24). The storage part (40) is formed at the boundary portion between the inner peripheral surface of the opening (24) and the plate surface of the first plate (21) on the side close to the second plate (22). The refrigerant flow path module further includes: a third plate (23) that overlaps the side of the second plate (22) opposite to the first plate (21). And a copper-containing solder (17) that joins the opposing surfaces of the second plate (22) and the third plate (23) to each other. A second opening (25) that communicates with the refrigerant pipe (12) and forms the flow path (15) is formed in the third plate (23). When viewed in the stacking direction of the first plate (21) and the second plate (22), the second opening (25) is disposed inside the opening (24). The storage part (40) is further formed at the boundary portion between the inner peripheral surface of the opening (24) and the plate surface of the third plate (23) on the side close to the second plate (22).

4. A refrigerant flow path module having a refrigerant flow path (15) formed therein, characterized in that, Comprising: A first plate (21); A second plate (22) that overlaps the first plate (21); A copper-containing refrigerant pipe (12) mounted on the first plate (21); A copper-containing solder (17) that joins the opposing surfaces of the first plate (21) and the second plate (22) to each other; And A storage part (41) that stores the remaining solder (17). The storage part (41) includes: insertion holes (18, 19) that are formed in the first plate (21) and open on the plate surface of the first plate (21) on the side close to the second plate (22); and an insertion member (14) that is inserted into the insertion holes (18, 19) with a gap therebetween.

5. The refrigerant flow path module according to claim 4, wherein In the stacking direction of the first plate (21) and the second plate (22), the first plate (21) is disposed at the end of the refrigerant flow path module (10). The insertion hole (18) opens on the plate surface of the first plate (21) on the side opposite to the second plate (22).

6. A refrigerant flow path module having a refrigerant flow path (15) formed therein, characterized in that, Comprising: A first plate (21); A second plate (22) that overlaps the first plate (21); A copper-containing refrigerant pipe (12) mounted on the first plate (21); A copper-containing solder (17) that joins the opposing surfaces of the first plate (21) and the second plate (22) to each other; and A storage part (72) that stores the remaining solder (17). The refrigerant pipe (12) is inserted into a hole (26) formed in the first plate (21). An opening (24) that communicates with the refrigerant pipe (12) and forms the flow path (15) is formed in the second plate (22). A chamfered portion (22c) is formed at the boundary between the inner peripheral surface of the opening (24) of the second plate (22) and the plate surface of the second plate (22) that is close to the first plate (21) and joined to the first plate (21). The storage portion (72) includes the chamfered portion (22c).

7. The refrigerant flow path module according to claim 6, wherein the refrigerant flow path module includes: a third plate (23) that overlaps the side of the second plate (22) opposite to the first plate (21); and a copper-containing solder (17) that joins the opposing surfaces of the second plate (22) and the third plate (23) to each other. A second opening (25) that communicates with the refrigerant pipe (12) and forms the flow path (15) is formed in the third plate (23). A second chamfered portion (22e, 23c) is formed at the boundary between the inner peripheral surface of the second opening (25) of the third plate (23) and the plate surface of the third plate (23) that is close to the second plate (22), or at the boundary between the inner peripheral surface of the opening (24) of the second plate (22) and the plate surface of the second plate (22) that is close to the third plate (23). The storage portion (72) further includes the second chamfered portion (22e, 23c).

8. A refrigerant flow path module having a refrigerant flow path (15) formed therein, characterized in that, including:[[]] a first plate (21); a second plate (22) that overlaps the first plate (21); a copper-containing refrigerant pipe (12) installed on the first plate (21); a copper-containing solder (17) that joins the opposing surfaces of the first plate (21) and the second plate (22) to each other; and a storage portion (74) that stores the remaining solder (17), a third chamfered portion (22g, 21h) is formed at the boundary between the outer peripheral surface of the second plate (22) and the plate surface of the second plate (22) that is close to the first plate (21) and joined to the first plate (21), or at the boundary between the outer peripheral surface of the first plate (21) and the plate surface of the first plate (21) that is close to the second plate (22) and joined to the second plate (22). The storage portion (74) includes the third chamfered portion (22g, 21h).

9. The refrigerant flow path module according to any one of claims 1 to 3, 6, and 7, wherein the refrigerant flow path module includes a storage portion (43) that stores the remaining solder (17), the storage portion (43) is constituted by a groove (27) that is configured to extend radially outward from the hole (26) and is formed in a portion of the plate surface of the first plate (21) that is close to the second plate (22) and faces the flow path (15).

10. An air conditioner, wherein the air conditioner includes the refrigerant flow path module according to any one of claims 1 to 9.

Images