A high-temperature resistant aluminum electrolytic capacitor

Abstract

The present invention relates to the technical field of capacitors, and particularly relates to a high-temperature-resistant aluminum electrolytic capacitor, which includes an aluminum shell body, a core package, pins, a heat dissipation component, and a heat dissipation cavity. The core package is arranged inside the aluminum shell body, the pins are connected to the core package, the heat dissipation component includes a heat dissipation shell, a plurality of semiconductor refrigeration chips, a first connector, a second connector, a support frame, and a heat dissipation fin. The support frame is arranged on the outer side of the aluminum shell body, the heat dissipation shell is fixed on the support frame, the semiconductor refrigeration chip has a first terminal and a second terminal, the first connector is connected to a plurality of first terminals, the second connector is connected to a plurality of second terminals, the heat dissipation fin is arranged on the heat dissipation shell, and the heat dissipation cavity is arranged on the top of the core package. Therefore, the high-temperature-resistant aluminum electrolytic capacitor of the present invention can maintain stable electrical performance and extend the service life even in an extremely high-temperature environment.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitors, and particularly to a high-temperature resistant aluminum electrolytic capacitor. Background Art

[0002] An aluminum electrolytic capacitor is an energy storage component widely used in electronic devices. Its core feature is the use of aluminum foil as the anode, which is oxidized to form an extremely thin aluminum oxide insulating layer. The cathode usually uses porous paper or sponge-like material impregnated with electrolyte. This structure enables the aluminum electrolytic capacitor to achieve a relatively high capacitance value in a relatively small volume, while having good high-frequency characteristics, being able to effectively filter, smooth voltage fluctuations, store energy, and couple signals. It plays an indispensable role in fields such as power supply, audio equipment, computer hardware, and automotive electronic systems. Although its operating temperature range and lifespan are affected by the properties of the electrolyte, through continuous technological innovation, such as the development of solid aluminum electrolytic capacitors, its application range is gradually expanding and its performance stability is being improved, becoming a crucial part of modern electronic technology.

[0003] Some of the existing capacitors operate under high-temperature conditions. At this time, insufficient heat dissipation efficiency will affect the operating state of the capacitor. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-temperature resistant aluminum electrolytic capacitor, aiming to improve the heat dissipation efficiency, so that stable electrical performance can be maintained even in an extremely high-temperature environment, and the service life can be extended.

[0005] To achieve the above purpose, the present invention provides a high-temperature resistant aluminum electrolytic capacitor, including an aluminum shell body, a core package, pins, a heat dissipation component, and a heat dissipation cavity. The core package is arranged inside the aluminum shell body, the pins are connected to the core package, the heat dissipation component includes a heat dissipation shell, a plurality of semiconductor refrigeration chips, a first connector, a second connector, a support frame, and heat dissipation fins. The support frame is arranged outside the aluminum shell body, the heat dissipation shell is fixed on the support frame. The semiconductor refrigeration chip has a first terminal and a second terminal. The first connector is connected to a plurality of the first terminals, the second connector is connected to a plurality of the second terminals, the heat dissipation fins are arranged on the heat dissipation shell, and the heat dissipation cavity is arranged on the top of the core package.

[0006] Wherein, an alloy layer is coated on the exposed end face of the pin.

[0007] Wherein, the first connector includes a connection ring and a conductive terminal. The connection ring is connected to a plurality of the first terminals, and the conductive terminal is connected to the connection ring.

[0008] Among them, the support frame includes a support frame body and a buckle. The buckle is fixedly connected to the support frame body and is located on one side of the support frame body.

[0009] Among them, the heat dissipation component further includes a heat conduction strip. The heat conduction strip is connected to the heat sink and is located outside the heat sink.

[0010] Among them, the heat dissipation component further includes a heat conduction medium layer. The heat conduction medium layer is filled between the heat dissipation shell and the semiconductor refrigeration sheet.

[0011] Among them, the heat dissipation component further includes a sealing ring. The sealing ring is fixedly connected to the support frame body and is located at the bottom of the support frame body.

[0012] Among them, the heat dissipation cavity includes an expandable bottom mold and an expandable top mold. The expandable bottom mold is arranged on the top of the core package, and the expandable top mold is arranged on the top of the expandable bottom mold. A low-boiling-point liquid is arranged in the expandable bottom mold, and a coolant is arranged between the expandable bottom film and the expandable top film.

[0013] A high-temperature resistant aluminum electrolytic capacitor of the present invention. The aluminum shell body serves as the external structure of the entire capacitor and is made of high-strength aluminum alloy material, which not only provides strong physical protection but also has good thermal conductivity, contributing to the rapid dissipation of heat. The core package is tightly sealed inside the aluminum shell body and is formed by alternately laminating multiple electrolyte films and metal foils, ensuring the high-capacity and low-loss characteristics of the capacitor. The pins form a reliable electrical connection with the core package, facilitating the integration with other circuit components. The support frame of the heat dissipation component is firmly installed on the outside of the aluminum shell body, playing a role of bearing and positioning. The heat dissipation shell is tightly fixed on the support frame, forming a closed heat exchange space. The semiconductor refrigeration sheet is the core of the heat dissipation component. Each sheet is equipped with a first terminal and a second terminal, and is connected to the positive and negative poles of the power supply through the first connector and the second connector respectively. When current passes through, the semiconductor refrigeration sheet generates a temperature difference effect, absorbing heat on one side and releasing heat on the other side, thereby effectively extracting heat from the core package. The heat sinks are evenly distributed on the outer surface of the heat dissipation shell, increasing the heat dissipation area and accelerating the transfer of heat to the external environment, further improving the heat dissipation efficiency. The heat dissipation cavity is located on the top of the core package, achieving efficient heat management. This unique heat dissipation mechanism enables the high-temperature resistant aluminum electrolytic capacitor of the present invention to maintain stable electrical performance even in extremely high-temperature environments and extend its service life. Description of the Drawings

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0015] Figure 1 It is a structural diagram of a high-temperature resistant aluminum electrolytic capacitor according to the first embodiment of the present invention.

[0016] Figure 2 It is a right-side structural diagram of a high-temperature resistant aluminum electrolytic capacitor according to the first embodiment of the present invention.

[0017] Figure 3 It is a sectional structural diagram of a high-temperature resistant aluminum electrolytic capacitor according to the first embodiment of the present invention.

[0018] Figure 4 It is a structural diagram of a high-temperature resistant aluminum electrolytic capacitor according to the second embodiment of the present invention.

[0019] Figure 5 It is a right-side structural diagram of a high-temperature resistant aluminum electrolytic capacitor according to the second embodiment of the present invention.

[0020] Figure 6 It is a sectional structural diagram of a high-temperature resistant aluminum electrolytic capacitor according to the second embodiment of the present invention.

[0021] Aluminum shell body 101, core package 102, pin 103, heat dissipation component 104, heat dissipation cavity 105, heat dissipation shell 106, semiconductor refrigeration sheet 107, first connector 108, second connector 109, support frame 110, heat dissipation fin 111, first terminal 112, second terminal 113, connection ring 201, conductive terminal 202, support frame body 203, buckle 204, heat conduction strip 205, heat conduction medium layer 206, sealing ring 207, expandable bottom mold 208, expandable top mold 209, scratch-resistant layer 210. Detailed implementation manners

[0022] The following will describe in detail the embodiments of the present invention. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation of the present invention.

[0023] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, in the description of the present invention, the meaning of "a plurality of" is two or more unless otherwise specifically defined.

[0024] First Embodiment

[0025] Please refer to Figures 1 to 3 , the present invention provides a high-temperature resistant aluminum electrolytic capacitor, which includes an aluminum shell body 101, a core package 102, pins 103, a heat dissipation component 104 and a heat dissipation cavity 105. The core package 102 is arranged inside the aluminum shell body 101, the pins 103 are connected to the core package 102, the heat dissipation component 104 includes a heat dissipation shell 106, a plurality of semiconductor refrigeration chips 107, a first connector 108, a second connector 109, a support frame 110 and heat dissipation fins 111. The support frame 110 is arranged outside the aluminum shell body 101, the heat dissipation shell 106 is fixed on the support frame 110. The semiconductor refrigeration chip has a first terminal 112 and a second terminal 113. The first connector 108 is connected to a plurality of the first terminals 112, the second connector 109 is connected to a plurality of the second terminals 113. The heat dissipation fins 111 are arranged on the heat dissipation shell 106, and the heat dissipation cavity 105 is arranged on the top of the core package 102.

[0026] In this embodiment, the aluminum shell body 101 serves as the external structure of the entire capacitor. Made of high-strength aluminum alloy material, it not only provides strong physical protection but also has good thermal conductivity, which helps to quickly dissipate heat. The core package 102 is tightly encapsulated within the aluminum shell body 101 and is formed by alternatingly laminating multiple electrolyte films and metal foils, ensuring the high-capacity and low-loss characteristics of the capacitor. The pins 103 form a reliable electrical connection with the core package 102, facilitating integration with other circuit components. The support frame 110 of the heat dissipation component 104 is firmly installed on the outer side of the aluminum shell body 101, playing a role in load-bearing and positioning. The heat dissipation shell 106 is tightly fixed on the support frame 110, forming a closed heat exchange space. The semiconductor refrigeration sheet 107 is the core of the heat dissipation component 104. Each sheet is equipped with a first terminal 112 and a second terminal 113, which are respectively connected to the positive and negative poles of the power supply through the first connector 108 and the second connector 109. When current passes through, the semiconductor refrigeration sheet 107 generates a temperature difference effect, absorbing heat on one side and releasing heat on the other side, thereby effectively extracting heat from the core package 102. The heat dissipation fins 111 are evenly distributed on the outer surface of the heat dissipation shell 106, increasing the heat dissipation area and accelerating the transfer of heat to the external environment, further improving the heat dissipation efficiency. The heat dissipation cavity 105 is located at the top of the core package 102, achieving efficient thermal management. This unique heat dissipation mechanism enables the high-temperature aluminum electrolytic capacitor of the present invention to maintain stable electrical performance and extend its service life even in extremely high-temperature environments.

[0027] Second Embodiment

[0028] Please refer to Figures 4 to 6 , based on the first embodiment, the present invention further provides a high-temperature aluminum electrolytic capacitor, and an alloy layer is coated on the exposed end surface of the pin 103.

[0029] The alloy layer coated on the exposed end surface of the pin 103 not only enhances the antioxidant and anti-corrosion capabilities of the pin 103 but also significantly improves its electrical conductivity, ensuring the stable connection between the pin 103 and the external circuit during long-term high-temperature operation of the capacitor.

[0030] The first connector 108 includes a connection ring 201 and a conductive terminal 202. The connection ring 201 is connected to a plurality of the first terminals 112, and the conductive terminal 202 is connected to the connection ring 201.

[0031] The design of the first connector 108 adopts a combination of the connection ring 201 and the conductive terminal 202. Among them, the connection ring 201 is responsible for establishing a firm physical contact with a plurality of first terminals 112, while the conductive terminal 202 further strengthens the strength of the electrical connection, ensuring the high efficiency and continuity of current transmission, and effectively avoiding problems such as connection loosening or increased resistance caused by high temperature.

[0032] The support frame 110 includes a support frame body 203 and a buckle 204. The buckle 204 is fixedly connected to the support frame body 203 and is located on one side of the support frame body 203.

[0033] The structural innovation of the support frame 110 lies in its design that includes the support frame body 203 and the buckle 204. The fixed connection between the buckle 204 and the support frame body 203 not only enhances the rigidity of the overall structure but also facilitates the quick installation and disassembly of the heat dissipation component 104, greatly improving the convenience of maintenance and replacement.

[0034] The heat dissipation component 104 further includes a heat conduction strip 205. The heat conduction strip 205 is connected to the heat sink 111 and is located outside the heat sink 111.

[0035] The newly added heat conduction strip 205 in the heat dissipation component 104 is closely combined with the heat sink 111 and is located outside the heat sink 111, further expanding the heat conduction path and accelerating the heat transfer speed from the semiconductor refrigeration chip 107 to the external environment.

[0036] The heat dissipation component 104 further includes a heat conduction medium layer 206. The heat conduction medium layer 206 is filled between the heat dissipation shell 106 and the semiconductor refrigeration chip 107.

[0037] The introduction of the heat conduction medium layer 206, which is filled between the heat dissipation shell 106 and the semiconductor refrigeration chip 107, effectively improves the interfacial thermal resistance, enhances the heat exchange efficiency, and ensures the optimal working state of the semiconductor refrigeration chip 107.

[0038] The heat dissipation component 104 further includes a sealing ring 207. The sealing ring 207 is fixedly connected to the support frame body 203 and is located at the bottom of the support frame body 203.

[0039] The addition of the sealing ring 207, which is fixedly connected to the support frame body 203 and is located at the bottom, forms a tight sealing effect, prevents the intrusion of external pollutants, protects the internal components from damage, and enhances the overall protection level of the capacitor.

[0040] The heat dissipation cavity 105 includes an expandable bottom mold 208 and an expandable top mold 209. The expandable bottom mold 208 is disposed on the top of the core package 102, and the expandable top mold 209 is disposed on the top of the expandable bottom mold 208. A low-boiling liquid is provided in the expandable bottom mold 208, and a coolant is provided between the expandable bottom mold and the expandable top mold 209.

[0041] The innovative design of the heat dissipation cavity 105 is a major highlight of the present invention. It includes an expandable bottom mold 208 and an expandable top mold 209, which are internally filled with a low-boiling-point liquid, and a coolant is provided between the expandable bottom mold 208 and the expandable top mold 209. When the temperature increases, the expandable bottom mold 208 expands to drive the coolant close to the semiconductor refrigeration chip 107 for heat dissipation. When the temperature drops, the expandable bottom film returns to its original state, enabling the coolant to continue to contact the top of the core for heat absorption. This design makes full use of the phase change heat characteristics of the liquid, and through the evaporation of the low-boiling-point liquid and the circulation of the coolant, efficient and stable thermal management is achieved. Even under extreme high-temperature conditions, the internal temperature of the capacitor can be maintained within a safe range.

[0042] The heat dissipation cavity 105 further includes an anti-scratch layer 210, and the anti-scratch layer 210 is provided on the expandable top mold 209.

[0043] In order to further improve the durability of the heat dissipation cavity 105, the anti-scratch layer 210 is provided on the expandable top mold 209, effectively preventing external mechanical damage, protecting the integrity and functional stability of the heat dissipation cavity 105, and extending the service life of the capacitor.

[0044] In summary, the high-temperature-resistant aluminum electrolytic capacitor of the present invention not only significantly improves the performance of the capacitor in a high-temperature environment, but also greatly enhances its durability and reliability.

[0045] What is disclosed above is only a preferred embodiment of the present invention. Of course, the scope of the rights of the present invention cannot be limited thereby. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present invention still fall within the scope covered by the invention.

Claims

1. A high-temperature resistant aluminum electrolytic capacitor, characterized in that, it includes an aluminum shell body, a core package, pins, a heat dissipation component and a heat dissipation cavity. The core package is arranged inside the aluminum shell body, the pins are connected to the core package, the heat dissipation component includes a heat dissipation shell, a plurality of semiconductor refrigeration chips, a first connector, a second connector, a support frame and a heat sink. The support frame is arranged outside the aluminum shell body, the heat dissipation shell is fixed on the support frame, the semiconductor refrigeration chip has a first terminal and a second terminal, the first connector is connected to a plurality of the first terminals, the second connector is connected to a plurality of the second terminals, the heat sink is arranged on the heat dissipation shell, and the heat dissipation cavity is arranged on the top of the core package; the heat dissipation cavity includes an expandable bottom mold and an expandable top mold. The expandable bottom mold is arranged on the top of the core package, the expandable top mold is arranged on the top of the expandable bottom mold, a low-boiling liquid is arranged inside the expandable bottom mold, and a coolant is arranged between the expandable bottom film and the expandable top film; when the temperature increases, the expandable bottom mold expands to drive the coolant close to the semiconductor refrigeration chip for heat dissipation, and when the temperature decreases, the expandable bottom film returns to its original state, so that the coolant can continue to contact the top of the core body for heat absorption.

2. The high-temperature resistant aluminum electrolytic capacitor according to claim 1, characterized in that, an alloy layer is coated on the exposed end face of the pin.

3. The high-temperature resistant aluminum electrolytic capacitor according to claim 2, characterized in that, the first connector includes a connecting ring and a conductive terminal. The connecting ring is connected to a plurality of the first terminals, and the conductive terminal is connected to the connecting ring.

4. The high-temperature resistant aluminum electrolytic capacitor according to claim 3, characterized in that, the support frame includes a support frame body and a buckle. The buckle is fixedly connected to the support frame body and is located on one side of the support frame body.

5. The high-temperature resistant aluminum electrolytic capacitor according to claim 4, characterized in that, the heat dissipation component further includes a heat conduction strip. The heat conduction strip is connected to the heat sink and is located outside the heat sink.

6. The high-temperature resistant aluminum electrolytic capacitor according to claim 5, characterized in that, the heat dissipation component further includes a heat conduction medium layer. The heat conduction medium layer is filled between the heat dissipation shell and the semiconductor refrigeration chip.

7. The high-temperature resistant aluminum electrolytic capacitor according to claim 6, characterized in that, the heat dissipation component further includes a sealing ring. The sealing ring is fixedly connected to the support frame body and is located at the bottom of the support frame body.

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