A patch-type PCB board heat dissipation structure

Abstract

The present invention relates to the technical field of PCB board heat dissipation, and in particular to a patch type PCB board heat dissipation structure, which includes a heat sink. The heat sink is arranged on the main body of the PCB board. The heat sink is made of a metal material with strong thermal conductivity and is in contact with the heating elements on the surface of the main body of the PCB board. The heat sink is designed in a U shape as a whole. The heat sink includes a first substrate, and four first extension sleeves are arranged on the outer side of the first substrate. Each first extension sleeve can move along the outer side of the first substrate. In the present invention, by adding a U-shaped heat sink to the heating elements of the PCB board, the heat dissipation efficiency is significantly improved and the occupied space is reduced. The U-shaped design not only increases the heat dissipation area, but also quickly conducts heat through the metal material with strong thermal conductivity, effectively solving the technical problems of low heat dissipation efficiency and large occupied space in the traditional heat dissipation method, making the installation of the PCB board more convenient, and at the same time reducing the overall cost.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board heat dissipation, and specifically to a patch type PCB board heat dissipation structure. Background Art

[0002] With the rapid development of electronic technology, patch type PCB boards have been widely used in various electronic devices due to their advantages such as high integration, small size, and light weight. However, high integration also means a dense layout of heat generating components on the PCB board, making the heat dissipation problem a key factor restricting the performance stability of electronic devices.

[0003] Currently, there are various heat dissipation methods for PCB boards, but they generally have problems such as low heat dissipation efficiency, large occupied space, or high cost. Traditional heat dissipation structures, such as directly pasting a large area of heat sinks on the surface of the PCB board, although they can effectively dissipate heat, significantly increase the volume and weight of the device, resulting in a great impact on the installation space of the PCB board, and do not conform to the development trend of modern electronic devices towards being thinner and lighter. And some solutions using complex heat dissipation technologies, such as liquid cooling and adding fans, cannot be applied to all PCB boards due to high cost, complex maintenance, and high failure rate. Summary of the Invention

[0004] The purpose of the present invention is to provide a patch type PCB board heat dissipation structure to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions:

[0006] A patch type PCB board heat dissipation structure, comprising

[0007] A heat sink, the heat sink is arranged on the main body of the PCB board, the heat sink is made of a metal material with strong thermal conductivity and is in contact with the heat generating components on the surface of the PCB board main body. The heat sink is designed in an overall U shape. The heat sink includes a first substrate, and a first extension sleeve is arranged on the outer side of the first substrate. The number of the first extension sleeves is four, and each first extension sleeve can move along the outer side of the first substrate. The top of the first extension sleeve is movably connected with a side plate;

[0008] A first adjustment mechanism is arranged inside the first substrate and is used to control the first extension sleeve to move along both sides of the first substrate. The first adjustment mechanism includes a first gear, and a first knob is arranged on the top of the first gear. The top end of the first knob protrudes from the top surface of the first substrate;

[0009] The second adjusting mechanism, which is also arranged inside the first substrate, is used to control the movement of the first expansion sleeve along both ends of the first substrate. The second adjusting mechanism includes a second gear, and a second knob is arranged at the bottom of the second gear. A first hole is formed at the bottom of the first substrate, and the second gear is located in this hole.

[0010] Preferably, the heat sink includes a heat dissipation surface and a heat absorption surface, and the surface in contact with the heating elements on the PCB board main body is the heat absorption surface, and the rest of the surfaces are heat dissipation surfaces. A number of micro-channels are formed on the heat dissipation surface. The surface area of the micro-channels is small and dense. Through the micro-channels, the contact area between the air and the heat dissipation surface of the PCB board main body can be increased.

[0011] Preferably, a heat pipe is further arranged inside the heat sink. The two ends of the heat pipe are respectively a heat receiving end and a cold end. Ethanol is filled inside the heat pipe as a working medium. The heat receiving end of the heat pipe is in direct contact with the heat absorption surface of the heat sink, and the cold end of the heat pipe is in direct contact with the heat dissipation surface of the heat sink.

[0012] Preferably, a first linkage plate is arranged on each side of the first gear. Corresponding surfaces of the two first linkage plates are respectively provided with gear grooves that mesh with the outer edge of the first gear. A second linkage plate is arranged on each side of the second gear. Corresponding surfaces of the two second linkage plates are respectively provided with gear grooves that mesh with the outer edge of the second gear.

[0013] Preferably, transverse activity grooves are formed on both sides of the first substrate. A first heat conducting plate is movably connected to the inner wall of the transverse activity grooves. Longitudinal activity grooves are respectively formed at both ends of the first substrate. A second heat conducting plate is movably connected to the inner wall of the longitudinal activity grooves. One side of the first heat conducting plate is in contact with the inner cavity of the first expansion sleeve, and the other side is fixedly connected to one end of the first linkage plate. One side of the second heat conducting plate is in contact with the inner cavity of the first expansion sleeve, and the other side is fixedly connected to one end of the second linkage plate.

[0014] Preferably, an installation groove is formed at the bottom of the heat sink for accommodating and fixing the heating elements. The size of the installation groove can be adjusted by adjusting the distance between the first expansion sleeves.

[0015] Preferably, a heat dissipation seat is further arranged on the surface of the PCB board main body. The heat dissipation seat is in contact with the heating elements on the surface of the PCB board main body. The heat dissipation seat includes a second base. A second expansion sleeve is arranged on the outside of the second base. The number of the second expansion sleeves is four and they can move along the outside of the second expansion sleeve. A resilient seat is arranged on the top of the second base. A plurality of positioning grooves are formed at the top of the inner cavity of the second expansion sleeve. An operation groove is formed in the top wall of the positioning groove. A pressing plate is arranged on the inner wall of the operation groove and protrudes from the top surface of the second expansion sleeve.

[0016] Preferably, a spring is provided on the inner wall of the elastic seat, and the two sides of the top of the elastic seat and the two sides of the inner wall of the positioning groove are provided with bevels that are adapted to each other.

[0017] Preferably, the first adjusting mechanism, the second adjusting mechanism, the elastic seat, and the pressing plate are made of a metal material with strong thermal conductivity.

[0018] Preferably, welding feet are provided on both sides of the heat sink, and the welding feet are firmly welded to the designated position of the PCB board through surface mount technology, so as to ensure that the bottom of the heat sink can be in close and stable contact with the heat generating part of the PCB board.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] 1. In the present invention, by adding a U-shaped heat sink to the heat generating element of the PCB board, the heat dissipation efficiency is significantly improved and the occupied space is reduced. The U-shaped design not only increases the heat dissipation area, but also quickly conducts heat through a metal material with strong thermal conductivity, effectively solving the technical problems of low heat dissipation efficiency and large occupied space in traditional heat dissipation methods, making the installation of the PCB board more convenient, while reducing the overall cost, meeting the development trend of the patch-type PCB board to be thinner, lighter and more efficient;

[0021] 2. In the present invention, according to the heat dissipation requirements of the PCB board, the heat sink is designed to be telescopic. In a working environment with low energy consumption and small heat dissipation requirements, the heat sink can be retracted to make the overall occupied space of the PCB board smaller and save installation space. When the heat dissipation demand of the PCB board is large, the heat sink can be expanded to greatly increase the heat dissipation area, so as to adapt to the heat dissipation requirements under different working loads;

[0022] 3. In the present invention, a microchannel structure and heat pipes are integrated inside the heat sink. The microchannels greatly increase the contact area between the air and the heat dissipation plate, enabling heat to be more quickly dispersed and transferred. The high-efficiency heat conduction performance of the heat pipes further accelerates the transfer and diffusion of heat inside the heat sink, significantly improving the heat dissipation efficiency, so that the heat generating elements on the PCB board can maintain stable performance under higher working loads. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 is a schematic diagram of the structure of the microchannels on the heat sink in the present invention;

[0025] Figure 3 is a schematic diagram of the structure of the heat pipes on the heat sink in the present invention;

[0026] Figure 4 is the present inventionFigure 1 Schematic diagram of the bottom structure of the middle heat sink;

[0027] Figure 5 For the present invention Figure 1 Schematic diagram of the overall structure of the PCB board main body in the present invention;

[0028] Figure 6 For the present invention Figure 5 Exploded schematic diagram of the overall structure of the first substrate in the present invention;

[0029] Figure 7 For the present invention Figure 6 Schematic diagram of the overall structure of the first adjustment mechanism and the second adjustment mechanism in the present invention

[0030] Figure 8 Schematic diagram of the overall structure of the second embodiment of the present invention;

[0031] Figure 9 For the present invention Figure 8 Cross-sectional view of the connection between the second base and the second extension sleeve in the present invention;

[0032] In the figure: 1. PCB board main body; 2. Heat sink; 21. Microchannel; 22. Heat pipe; 23. Installation groove; 24. First extension sleeve; 25. First substrate; 251. Horizontal movement groove; 252. First heat conduction plate; 253. Vertical movement groove; 254. Second heat conduction plate; 26. Side plate; 27. First adjustment mechanism; 271. First gear; 272. First linkage plate; 273. First knob; 28. Second adjustment mechanism; 281. Second gear; 282. Second linkage plate; 283. Second knob; 3. Heat dissipation base; 31. Second base; 32. Second extension sleeve; 321. Positioning groove; 322. Operation groove; 323. Pressing plate; 33. Elastic seat; 331. Spring. Detailed implementation manners

[0033] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the scope of protection of the present application.

[0034] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the accompanying drawings of the specification and specific implementation manners.

[0035] Embodiment 1:

[0036] Please refer to Figure 1-7 , the present invention provides a technical solution:

[0037] A patch-type PCB board heat dissipation structure, comprising

[0038] a heat sink 2, which is arranged on the PCB board main body 1. The heat sink 2 is made of a metal material with strong thermal conductivity and is in contact with the heat-generating components on the surface of the PCB board main body 1. The heat sink 2 is integrally designed in a U shape. The heat sink 2 includes a first substrate 25, and a first extension sleeve 24 is arranged on the outer side of the first substrate 25. The number of the first extension sleeves 24 is four, and each first extension sleeve 24 can move along the outer side of the first substrate 25. The top of the first extension sleeve 24 is movably connected to a side plate 26;

[0039] a first adjusting mechanism 27, which is arranged inside the first substrate 25 and is used to control the first extension sleeve 24 to move along both sides of the first substrate 25. The first adjusting mechanism 27 includes a first gear 271, and a first knob 273 is arranged on the top of the first gear 271. The top end of the first knob 273 protrudes from the top surface of the first substrate 25;

[0040] a second adjusting mechanism 28, which is also arranged inside the first substrate 25 and is used to control the first extension sleeve 24 to move along both ends of the first substrate 25. The second adjusting mechanism 28 includes a second gear 281, and a second knob 283 is arranged at the bottom of the second gear 281. A first hole is opened at the bottom of the first substrate 25, and the second knob 283 is located in the hole of the first substrate 25.

[0041] In this embodiment, please refer to Figure 2 ., the heat sink 2 includes a heat dissipation surface and a heat absorption surface, and the contact surface with the heat-generating components on the PCB board main body 1 is the heat absorption surface, and the rest of the surfaces are heat dissipation surfaces. A number of micro-channels 21 are opened on the heat dissipation surface. The surface area of the micro-channels 21 is tiny and dense. Through the micro-channels 21, the contact area between the air and the heat dissipation surface of the PCB board main body 1 can be increased. In this embodiment, by arranging the micro-channels 21 on the heat dissipation surface of the heat sink 2, the heat dissipation performance is optimized, so that the heat can be transferred from the heat-generating components to the air more quickly, effectively reducing the temperature of the PCB board and the heat-generating components thereon, and ensuring the stability and reliability of the device under high-load operation.

[0042] In this embodiment, please refer to Figure 3 ., a heat pipe 22 is further arranged inside the heat sink 2. The two ends of the heat pipe 22 are respectively a heat receiving end and a cold end. Ethanol is filled inside the heat pipe 22 as a working medium. The heat receiving end of the heat pipe 22 is in direct contact with the heat absorption surface of the heat sink 2, and the cold end of the heat pipe 22 is in direct contact with the heat dissipation surface of the heat sink 2. In this embodiment, the heat receiving end of the heat pipe 22 absorbs the heat emitted by the heat-generating components, causing the ethanol to vaporize to form steam. The steam then moves along the inner cavity of the heat pipe 22 towards the heat dissipation surface and pre-condenses on the heat dissipation surface, re-converting into a liquid. Under the action of gravity, it re-flows to the heat receiving end to complete a complete heat cycle.

[0043] In this embodiment, please refer to Figure 7 , a first linkage plate 272 is provided on each side of the first gear 271, and gear grooves that mesh with the outer edge of the first gear 271 are respectively formed on the corresponding surfaces of the two first linkage plates 272. A second linkage plate 282 is provided on each side of the second gear 281, and gear grooves that mesh with the outer edge of the second gear 281 are respectively formed on the corresponding surfaces of the two second linkage plates 282. In this embodiment, by rotating the first gear 271 or the second gear 281, the two first linkage plates 272 or the two second linkage plates 282 can be respectively controlled to move, and by controlling the rotation direction of the first gear 271 or the second gear 281, the two first linkage plates 272 or the two second linkages 282 can be made to move towards each other or away from each other.

[0044] In this embodiment, please refer to Figure 6 , transverse activity grooves 251 are formed on both sides of the first substrate 25, and a first heat conducting plate 252 is movably connected to the inner wall of the transverse activity grooves 251. Longitudinal activity grooves 253 are respectively formed at both ends of the first substrate 25, and a second heat conducting plate 254 is movably connected to the inner wall of the longitudinal activity grooves 253. One side of the first heat conducting plate 252 is in contact with the inner cavity of the first expansion sleeve 24, and the other side is fixedly connected to one end of the first linkage plate 272. One side of the second heat conducting plate 254 is in contact with the inner cavity of the first expansion sleeve 24, and the other side is fixedly connected to one end of the second linkage plate 282. In this embodiment, driven by the first linkage plate 272 or the second linkage plate 282, the first heat conducting plate 252 and the second heat conducting plate 254 cause the first expansion sleeve 24 to move, adjust the distance between the first expansion sleeves 24, and change the overall area of the heat sink 2. At the same time, since the first heat conducting plate 252 and the second heat conducting plate 254 always maintain a large area of contact with the first expansion sleeve 24, the overall heat dissipation effect of the heat sink 2 is prevented from deteriorating due to too small a contact area.

[0045] In this embodiment, please refer to Figure 4 , an installation groove 23 is formed at the bottom of the heat sink 2 for accommodating and fixing the heating element. The size of the installation groove 23 can be adjusted by adjusting the distance between the first expansion sleeves 24. In this embodiment, by providing the first expansion sleeve 24, the heating element can be in direct contact with the first substrate 25, and the first expansion sleeve 24 can be in contact with the outside of the heating element, preventing a height difference from being formed between the heating element and the heat sink 2 after the first expansion sleeve 24 expands. This design enhances the contact area between the heat sink 2 and the heating element and significantly enhances the heat dissipation effect.

[0046] In this embodiment, please refer to Figure 1, solder feet are provided on both sides of the heat sink 2. The solder feet are firmly soldered to the designated positions on the PCB board through surface mount technology, so as to ensure that the bottom of the heat sink 2 can be in close and stable contact with the heat-generating part of the PCB board. In this embodiment, these solder feet are precisely soldered to the designated positions on the PCB board through the advanced surface mount technology SMT. This design not only simplifies the installation process of the heat sink 2 and improves production efficiency, but also ensures that the bottom of the heat sink 2 can be in close and stable contact with the heat-generating part of the PCB board. This close contact greatly reduces the thermal resistance, enabling heat to be transferred from the heat-generating components to the heat sink more efficiently.

[0047] Working principle of this embodiment: Step 1, when the PCB board is working, its heat-generating components such as the core chip will generate a large amount of heat. By integrating the heat sink 2 on the heat-generating components, using highly thermally conductive metal materials such as copper and aluminum, the heat generated by the heat-generating components is quickly conducted to the heat sink 2. Moreover, the heat sink 2 is designed in a U shape, increasing the convection area with air. When the surface temperature of the heat sink 2 rises, the surrounding cold air is heated and rises, forming natural convection. The special shape of the U-shaped heat sink 2 can guide the air flow, forming a more complex convection pattern, accelerating the heat dissipation process. And by rotating the first knob 273 to drive the first gear 271 to rotate, since the outer edge of the first gear 271 meshes with the corresponding surfaces of the two first linkage plates 272 respectively, the reciprocating movement of the two first linkage plates 272 can be controlled by controlling the rotation direction of the first gear 271. The first heat conducting plate 252 is pushed by the first linkage plate 272 to move outward along the inner wall of the transverse movement groove 251, so that the distance between the first extension sleeves 24 on both sides of the first substrate 25 gradually becomes larger through the first heat conducting plate 252, thus widening the overall width of the heat sink 2. According to the above principle, by rotating the second knob 283, the second linkage plate 282 can be made to push the first extension sleeves 24 at both ends of the first substrate 25 to move outward, making the overall length of the heat sink 2 longer. By moving the side plate 26 externally, the overall height of the heat sink 2 can be increased. When the heat dissipation requirement of the PCB board increases, the length, width, and height of the heat sink 2 can be adjusted separately or simultaneously according to the installation space and heat dissipation requirement to enhance the heat dissipation area of the heat sink 2 and improve the heat dissipation effect;

[0048] Step 2: By providing a large number of tiny and dense micro-channels 21 inside the heat sink 2, the contact area between the air and the heat sink 2 is greatly increased, significantly increasing the heat exchange area between the heat sink 2 and the air, thereby improving the heat absorption and transfer efficiency. At the same time, due to the presence of the micro-channels 21, air will enter the micro-channels 21, greatly shortening the path for the heat dissipated by the heating element to be transferred to the air. The shorter path reduces the thermal resistance, enabling the heat to be absorbed by the air more quickly. Additionally, by providing heat pipes 22 inside the heat sink 2, since ethanol is provided inside the heat pipes 22 and the heated end of the heat pipe 22 is in contact with the heating element, the heat is absorbed and vaporized by the working fluid, forming steam that moves along the pipe towards the heat dissipation surface of the heat sink 2. The steam condenses upon encountering the cold surface, releasing latent heat and reverting back to a liquid, and then returns to the heated end under the action of gravity to complete a cycle. During this process, the heat is transferred from the heated end to the cold end at an extremely fast speed, achieving efficient heat conduction. The heat sink 2 can quickly disperse the heat from the heat-concentrated area to the entire heat sink 2, making the temperature distribution on the surface of the heat sink 2 more uniform. This uniform heat dissipation helps to reduce local overheating phenomena and protects the heating element from high-temperature damage.

[0049] Embodiment 2:

[0050] In this embodiment, please refer to Figure 8-9 , a heat dissipation base 3 is further provided on the surface of the PCB board main body 1. The heat dissipation base 3 is in contact with the heating element on the surface of the PCB board main body 1. The heat dissipation base 3 includes a second base 31. A second extension sleeve 32 is provided on the outer side of the second base 31. The number of the second extension sleeves 32 is four and they can move along the outer side of the second extension sleeve 32. A resilient seat 33 is provided on the top of the second base 31. A plurality of positioning grooves 321 are opened at the top of the inner cavity of the second extension sleeve 32. An operation groove 322 is opened on the top wall of the positioning groove 321. A pressing plate 323 is provided on the inner wall of the operation groove 322, and the pressing plate 323 protrudes from the top surface of the second extension sleeve 32. In this embodiment, the resilient seat 33 is inserted into the positioning groove 321 to keep the position of the second extension sleeve 32 fixed on the outer side of the second base 31. By pressing the pressing plate 323, the resilient seat 33 is disengaged from the inner cavity of the operation groove 322, and the position of the second extension sleeve 32 can be moved, thereby expanding the overall area of the heat dissipation base 3 and improving the overall heat dissipation effect of the heat dissipation base 3.

[0051] In this embodiment, please refer to Figure 9, a spring 331 is provided on the inner wall of the elastic seat 33. The two sides of the top of the elastic seat 33 and the two sides of the inner wall of the positioning groove 321 are provided with bevels that are adapted to each other. In this embodiment, when the elastic seat 33 is pressed, the elastic seat 33 is deformed and its height decreases, and the spring 331 is squeezed to cause deformation. Since the two sides of the elastic seat 33 and the two sides of the inner wall of the positioning groove 321 are provided with bevels that are adapted to each other, after the height of the elastic seat 33 decreases, the second expansion sleeve 32 can be moved to make the elastic seat 33 disengage from the inner cavity of the positioning groove 321, thereby adjusting the position of the second expansion sleeve 32. When the elastic seat 33 moves to the next positioning groove 321, the pressure is lost, the spring 331 rebounds, the elastic seat 33 deforms back to its original state, is embedded in the positioning groove 321 here, and pushes up the pressing plate 323 to fix the position of the second expansion sleeve 32.

[0052] In this embodiment, please refer to Figure 7-9 , the first adjustment mechanism 27, the second adjustment mechanism 28, the elastic seat 33, and the pressing plate 323 are made of a metal material with strong thermal conductivity. In this embodiment, copper or aluminum materials can be used to ensure that while these components adjust the heat dissipation structure, they can also effectively conduct heat and prevent the overall heat dissipation effect of the heat sink 2 or the heat dissipation base 3 from being affected.

[0053] The working principle of this embodiment: By pressing the pressing plate 323 to move it downward along the inner wall of the operation groove 322, the elastic seat 33 is deformed under pressure, and the spring 331 is compressed. Since the two sides of the elastic seat 33 and the two sides of the inner wall of the positioning groove 321 are provided with bevels that are adapted to each other, the second expansion sleeve 32 is pushed and pulled by an external force, so that the elastic seat 33 disengages from the inner cavity of the positioning groove 321, and the second expansion sleeve 32 can be moved. By moving the second expansion sleeve 32, the overall area of the heat dissipation base 3 can be adjusted. As the second expansion sleeve 32 moves, when the elastic seat 33 moves below the next positioning groove 321 or returns to the initial position, the spring 331 loses pressure and returns to its original state, and the elastic seat 33 rebounds. After the elastic seat 33 rebounds, it returns to its original height, and thus re-enters the inner cavity of the positioning groove 321 to fix the position of the second expansion sleeve 32, so that the area of the heat dissipation base 3 is maintained at the adjusted size. By expanding the area of the heat dissipation base 3, the contact area with the heating element is increased, and the convection area between the heat dissipation base 3 and the air is increased, improving the heat dissipation effect of the heat dissipation base 3. By reducing the area of the heat dissipation base 3, the occupied space becomes smaller, making the installation of the PCB board more flexible.

[0054] The foregoing has shown and described the basic principles, main features and advantages of the present invention. The present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, various changes and improvements will occur to the present invention, and these changes and improvements fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB board heat dissipation structure, wherein the PCB board is a surface-mount PCB board, characterized in that: include A heat sink (2), the heat sink (2) being arranged on the PCB board body (1), the heat sink (2) being made of a metal material with strong thermal conductivity and being in contact with a heating element on the surface of the PCB board body (1), the heat sink (2) being designed in a U-shape as a whole, the heat sink (2) comprising a first substrate (25), a first extension sleeve (24) being arranged on the outer side of the first substrate (25), the number of the first extension sleeves (24) being four, and each first extension sleeve (24) being movable along the outer side of the first substrate (25), and a side plate (26) being movably connected to the top of the first extension sleeve (24); A first adjustment mechanism (27) is arranged inside the first substrate (25) and is used to control the first extension sleeve (24) to move along two opposite sides of the first substrate (25), the first adjustment mechanism (27) comprising a first gear (271), a first knob (273) being arranged on the top of the first gear (271), and a top end of the first knob (273) protruding from a top surface of the first substrate (25); A second adjustment mechanism (28) is also arranged inside the first base plate (25) and is used to control the first extension sleeve (24) to move along the other two opposite sides of the first base plate (25). The second adjustment mechanism (28) comprises a second gear (281). A second knob (283) is arranged at the bottom of the second gear (281). A first hole is provided at the bottom of the first base plate (25); The heat sink (2) comprises a heat dissipation surface and a heat absorption surface, wherein the surface in contact with the heating element on the PCB board body (1) is the heat absorption surface, and the remaining surfaces are heat dissipation surfaces. A number of microchannels (21) are provided on the heat dissipation surface. The surface area of ​​the microchannels (21) is small and dense, and the contact area between air and the heat dissipation surface of the PCB board body (1) can be increased through the microchannels (21); A heat pipe (22) is further provided inside the heat sink (2), the two ends of the heat pipe (22) being a heated end and a cold end respectively, the interior of the heat pipe (22) being filled with ethanol as a working medium, the heated end of the heat pipe (22) being in direct contact with a heat absorbing surface of the heat sink (2), and the cold end of the heat pipe (22) being in direct contact with a heat dissipating surface of the heat sink (2); A heat sink (3) is also provided on the surface of the PCB body (1), the heat sink (3) being in contact with a heating element on the surface of the PCB body (1), the heat sink (3) comprising a second base (31), a second extension sleeve (32) being provided on the outer side of the second base (31), the number of the second extension sleeves (32) being four and being movable along the outer side of the second base (31), an elastic seat (33) being provided on the top of the second base (31), a plurality of positioning grooves (321) being provided on the top of the inner cavity of the second extension sleeve (32), an operating groove (322) being provided on the top wall of the positioning groove (321), a pressing plate (323) being provided on the inner wall of the operating groove (322), and the pressing plate (323) protruding from the top surface of the second extension sleeve (32).

2. A PCB board heat dissipation structure according to claim 1, characterized in that: A first linkage plate (272) is respectively provided on both sides of the first gear (271), and corresponding surfaces of the two first linkage plates (272) are respectively provided with gear grooves that mesh with the outer edge of the first gear (271); a second linkage plate (282) is respectively provided on both sides of the second gear (281), and corresponding surfaces of the two second linkage plates (282) are respectively provided with gear grooves that mesh with the outer edge of the second gear (281).

3. A PCB board heat dissipation structure according to claim 1, characterized in that: The first substrate (25) is provided with transverse movable grooves (251) on two opposite sides, and the inner wall of the transverse movable groove (251) is movably connected to a first heat conducting plate (252). The first substrate (25) is provided with longitudinal movable grooves (253) on two other opposite sides, and the inner wall of the longitudinal movable groove (253) is movably connected to a second heat conducting plate (254). One side of the first heat conducting plate (252) contacts the inner cavity of the first extension sleeve (24), and the other side is fixedly connected to one end of the first linkage plate (272). One side of the second heat conducting plate (254) contacts the inner cavity of the first extension sleeve (24), and the other side is fixedly connected to one end of the second linkage plate (282).

4. The PCB heat dissipation structure according to claim 1, characterized in that: The bottom of the heat sink (2) is provided with a mounting groove (23) for accommodating and fixing the heating element, and the size of the mounting groove (23) can be adjusted by adjusting the spacing between the first extension sleeves (24).

5. The PCB heat dissipation structure according to claim 1, characterized in that: The inner wall of the elastic seat (33) is provided with a spring (331), and the top two sides of the elastic seat (33) and the inner wall two sides of the positioning groove (321) are arranged at mutually matching oblique angles.

6. The PCB heat dissipation structure according to claim 1, characterized in that: The first adjustment mechanism (27), the second adjustment mechanism (28), the elastic seat (33), and the pressing plate (323) are made of a metal material with strong thermal conductivity.

7. The PCB heat dissipation structure according to claim 1, characterized in that: Solder feet are provided on both sides of the heat sink (2), and the solder feet are firmly soldered to designated positions of the PCB board through surface mounting technology, thereby ensuring that the bottom of the heat sink (2) can be closely and stably in contact with the heating part of the PCB board.

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