A pinless integrated semiconductor circuit

Abstract

The present invention relates to the field of circuit technology, and provides a pinless integrated semiconductor circuit, which includes: an electric control board, on which two rows of antenna connection parts are arranged, each row of antenna connection parts includes a plurality of antennas, and the antennas include protruding heads and slots formed by the protruding heads being recessed inward; a circuit board, on which a plurality of antenna mounting holes corresponding to the plurality of antenna connection parts and a plurality of fins respectively located in the plurality of antenna mounting holes are arranged, and the circuit board is installed in the plurality of slots through the plurality of fins. The pinless integrated semiconductor circuit in the present invention realizes the integration of the circuit board and the electric control board by means of a pinless setting, which not only avoids the stress generated by the pin welding tolerance during the plastic sealing when connecting two circuit modules through pins, resulting in the delamination of the insulating layer at the pin welding place, but also avoids the influence of human body static electricity on the internal chip, reduces its production cost, and improves production efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of circuits, and in particular to a pinless integrated semiconductor circuit. Background Art

[0002] Semiconductor circuits are also called modular intelligent power modules (MIPMs). They not only integrate power switching devices and drive circuits, but also have built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send detection signals to the CPU or DSP for interrupt processing. They are composed of high-speed, low-power consumption tube cores, optimized gate-level drive circuits, and fast protection circuits. Even if a load accident or improper use occurs, the IPM itself will not be damaged. It generally uses IGBT as a power switching element, and has an integrated structure with a built-in current sensor and drive circuit.

[0003] The semiconductor circuit needs to assemble the inverter circuit composed of low-voltage control circuits such as IC drive control circuit, IPM sampling amplifier circuit and PFC current protection circuit and high-voltage semiconductor circuit on the same circuit board. However, the semiconductor circuit boards of the existing technology can only integrate a single circuit module. Even if multiple circuit modules are integrated, they are only connected through the pins on the two circuit modules. This integration method is prone to stress generated by the pin welding tolerance during plastic sealing, which may cause delamination of the insulation layer at the pin welding point. In addition, due to the setting of the pins, the static electricity of the human body will affect the internal chip (static breakdown), reducing production efficiency. In addition, in order to prevent the generation of static electricity, the integrated semiconductor circuit needs to be specially packaged with anti-static packaging, and the setting of the pins also requires the purchase of pin cutting equipment, resulting in a high production cost. Summary of the invention

[0004] The present invention provides a pinless integrated semiconductor circuit, aiming to solve the problem that the way of integrating multiple circuit modules in the semiconductor circuit in the prior art is easy to cause delamination of the insulation layer at the pin welding place due to the stress generated by the pin welding tolerance during plastic sealing, and the static electricity of the human body affects the internal chip due to the setting of the pin, thereby increasing the production cost of the semiconductor circuit and reducing the production efficiency.

[0005] An embodiment of the present invention provides a pinless integrated semiconductor circuit, comprising:

[0006] An electric control board, wherein two rows of antenna connection parts are arranged opposite to each other and spaced apart, each row of antenna connection parts comprises a plurality of antennas arranged spaced apart, and each antenna comprises a protruding head arranged on the electric control board and a slot formed by a side of the protruding head away from the electric control board and recessed inwardly;

[0007] A circuit board is provided with a plurality of antenna mounting holes corresponding one-to-one to the plurality of antenna connecting parts and a plurality of fins respectively located in the plurality of antenna mounting holes. The circuit board is installed in the plurality of card slots through the plurality of fins and is electrically connected to the circuit board.

[0008] Preferably, the fin includes a bottom plate in a flat plate shape and arranged on the circuit board, and two spring plates which are bent and extended from opposite ends of the bottom plate to form an S shape, and the two spring plates are arranged at intervals.

[0009] Preferably, the bottom plate is provided with a plurality of welding holes passing therethrough at intervals.

[0010] Preferably, two antenna bases that are opposite and spaced apart are provided on the electric control board, and the two rows of antenna connecting parts are respectively provided on the two antenna bases.

[0011] Preferably, the circuit board comprises:

[0012] Metal substrate;

[0013] An insulating layer, the insulating layer being disposed on one side of the metal substrate;

[0014] A circuit wiring layer, wherein the circuit wiring layer is arranged on a side of the insulating layer away from the metal substrate, and the plurality of fins are arranged on a side of the circuit wiring layer away from the metal substrate;

[0015] A plurality of components, wherein the plurality of components are arranged at intervals on a side of the circuit wiring layer away from the insulating layer, and the plurality of components and the components and the circuit wiring layer are electrically connected to each other;

[0016] A package body, the package body covers the metal substrate and the plurality of components, and the plurality of antenna mounting holes extend through the package body to the circuit wiring layer.

[0017] Preferably, the circuit board further comprises a green oil layer which is arranged on the circuit wiring layer to avoid all the components.

[0018] Preferably, the plurality of components include at least chip resistors and chip capacitors that are spaced apart and arranged on the circuit wiring layer.

[0019] Preferably, the circuit board further comprises a plurality of heat sinks spaced apart on the circuit wiring layer, and some of the components are respectively arranged on the plurality of heat sinks.

[0020] Preferably, electrical connections are achieved between multiple components and between components and circuit wiring layers by binding metal wires.

[0021] Compared with the prior art, the pinless integrated semiconductor circuit in the present invention is achieved by arranging two rows of antenna connection parts that are opposite and spaced apart on the electronic control board, and defining each row of antenna connection parts to include a plurality of antennae arranged at intervals, and arranging a plurality of antenna mounting holes connected to the plurality of antenna connection parts on the circuit board, and making the circuit board mounted on the plurality of antenna connection parts through the plurality of antenna mounting holes and electrically connected to the circuit board, thereby realizing the integration of the circuit board and the electronic control board in a pinless manner, which not only avoids the stress generated by the pin welding tolerance during plastic sealing when connecting two circuit modules through pins, but also avoids the influence of human body static electricity on the internal chip, reduces its production cost, and improves production efficiency, and at the same time, the circuit board can be more firmly mounted on the electronic control board through the cooperation of the fin and the card slot. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings:

[0023] Figure 1 is a schematic diagram of a three-dimensional structure of a pinless integrated semiconductor circuit provided by an embodiment of the present invention;

[0024] Figure 2 It is a three-dimensional structural schematic diagram of an electric control board in a pinless integrated semiconductor circuit provided by an embodiment of the present invention;

[0025] Figure 3 It is a schematic diagram of the side structure of an electric control board in a pinless integrated semiconductor circuit provided by an embodiment of the present invention;

[0026] Figure 4 is a cross-sectional view of a circuit board in a pinless integrated semiconductor circuit provided by an embodiment of the present invention;

[0027] Figure 5 It is a schematic structural diagram of a fin in a pinless integrated semiconductor circuit provided by an embodiment of the present invention.

[0028] Among them, 10, electronic control board; 11, antenna; 111, protruding head; 112, card slot; 12, antenna base; 20, circuit board; 21, antenna mounting hole; 22, fin; 221, bottom film; 222, spring; 223, welding hole; 23, metal substrate; 24, insulation layer; 25, circuit wiring layer; 26, components; 261, chip resistor; 262, chip capacitor; 27, package body; 28, green oil layer; 29, heat sink; 210, binding metal wire. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0030] The embodiment of the present invention provides a pinless integrated semiconductor circuit, Figures 1 to 5 As shown, it includes an electric control board 10 and a circuit board 20 .

[0031] The electric control panel 10 serves as the control center of the entire terminal electrical appliance.

[0032] Specifically, two rows of antenna connecting parts that are opposite and spaced apart are provided on the electric control board 10, and each row of antenna connecting parts includes a plurality of antennas 11 that are spaced apart, and the antenna 11 includes a protruding head 111 provided on the electric control board 10 and a card slot 112 formed by a side of the protruding head 111 that is recessed inwardly away from the electric control board 10; a plurality of antenna mounting holes 21 corresponding to the plurality of antenna connecting parts and a plurality of fins 22 respectively located in the plurality of antenna mounting holes 21 are provided on the circuit board 20, and the circuit board 20 is installed in the plurality of card slots 112 through the plurality of fins 22 and is electrically connected to the circuit board 20.

[0033] Among them, the material of the antenna 11 and the fin 22 is C194 (-1 / 2H), chemical composition: Cu≧97.0%, Fe=2.4%, P=0.03%, Zn= 0.12%; or KFC (-1 / 2H), chemical composition: Cu≧99.6%, Fe=0.1% or 0.05%~0.15%, P=0.03% or 0.025%~0.04%; a copper sheet with a thickness of 0.5mm is stamped by machining to form the required shape, and then the surface is first plated with nickel with a thickness of 0.1-0.5um, and then plated with tin with a thickness of 2-5um.

[0034] The antenna mounting hole 21 serves as a connection channel between the circuit board 20 and the external connection substrate pad and the antenna 11 of the electric control board 10 .

[0035] In this embodiment, the fin 22 includes a bottom sheet 221 that is flat and disposed on the circuit board 20, and two spring pieces 222 that are bent and extended from opposite ends of the bottom sheet 221 to form an S shape, and the two spring pieces 222 are disposed at intervals. The arrangement of the spring pieces 222 can make the fin 22 more firmly installed in the slot 112, and can achieve a self-locking effect.

[0036] In this embodiment, the bottom plate 221 is provided with a plurality of welding holes 223 passing therethrough at intervals. This design can improve the welding capability between the fin 22 and the circuit board 20.

[0037] In this embodiment, two antenna bases 12 that are opposite to and spaced apart from each other are disposed on the electric control board 10 , and two rows of antenna connecting portions are disposed on the two antenna bases 12 , respectively.

[0038] The antenna base 12 is used to fix the antenna 11 above the electric control board 10, and at the same time supports the circuit board 20 to prevent the circuit board 20 from directly contacting the electric control board 10, thereby preventing condensed water above the electric control board 10 from penetrating into the internal circuit of the circuit board 20.

[0039] Specifically, the circuit board 20 includes: a metal substrate 23 , an insulating layer 24 , a circuit wiring layer 25 , a plurality of components 26 and a packaging body 27 .

[0040] The circuit board 20 not only integrates the power switch device and the driving circuit, but also has built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send the detection signal to the CPU or DSP for interrupt processing.

[0041] An insulating layer 24 is arranged on one side of the metal substrate 23; a circuit wiring layer 25 is arranged on a side of the insulating layer 24 away from the metal substrate 23, and a plurality of fins 22 are arranged on a side of the circuit wiring layer 25 away from the metal substrate 23; a plurality of components 26 are arranged at intervals on a side of the circuit wiring layer 25 away from the insulating layer 24, and the plurality of components 26 and the components 26 and the circuit wiring layer 25 are electrically connected to each other; a package body 27 covers the metal substrate 23 and the plurality of components 26, and a plurality of antenna mounting holes 21 extend through the package body 27 to the circuit wiring layer 25.

[0042] The metal substrate 23 serves as a carrier of the entire internal circuit of the circuit board 20 and plays a role in heat dissipation for the entire circuit board 20; the insulating layer 24 is used to prevent the circuit wiring layer 25 and the metal substrate 23 from being energized, causing the risk of short circuit or leakage in the internal circuit; the circuit wiring layer 25 is also called the copper foil layer, which is used to form the required circuit by etching; the package body 27 is a powdered molding compound made of epoxy resin as a base resin, high-performance phenolic resin as a curing agent, silicon micropowder as a filler, and a variety of additives. It is extruded into the mold cavity by a heat transfer molding method and the components 26 therein are embedded, and at the same time cross-linked and cured to form a device with a certain external structure.

[0043] In this embodiment, the circuit board 20 further includes a green oil layer 28 disposed on the circuit wiring layer 25 to avoid all components 26 .

[0044] The green oil layer 28 is also called a protective layer, which is used to prevent tinning at places where tinning should not be applied, increase the withstand voltage between circuits, prevent short circuits caused by circuit oxidation or contamination, and protect the circuits.

[0045] In this embodiment, the plurality of components 26 at least include a chip resistor 261 and a chip capacitor 262 which are spaced apart and arranged on the circuit wiring layer 25 .

[0046] The chip resistor 261 is connected to the gate of the IGBT chip in the circuit board 20 to limit the switching speed of the IGBT by limiting the current; the chip capacitor 262 plays the role of filtering, coupling, and bootstrapping in the pinless integrated semiconductor circuit. Of course, according to actual needs, the multiple components 26 also include the chips required to form the circuit board 20.

[0047] In this embodiment, the circuit board 20 further includes a plurality of heat sinks 29 disposed at intervals on the circuit wiring layer 25, and some components 26 are disposed on the plurality of heat sinks 29. The heat sinks 29 and the components 26 disposed on the heat sinks 29 are called semi-finished components, and the components 26 disposed on the heat sinks 29 are high-voltage power components 26 with high heat dissipation requirements.

[0048] The heat sink 29 adopts the copper surface silver plating process to achieve better fit between the component 26 and the heat sink 29, so as to improve the heat dissipation capacity.

[0049] In this embodiment, electrical connections are achieved between the multiple components 26 and between the components 26 and the circuit wiring layer 25 through binding metal wires 210 .

[0050] The binding metal wire 210 is generally made of gold, aluminum, copper or the like, and is used to achieve electrical connection between components 26 in the circuit.

[0051] Compared with the prior art, the pinless integrated semiconductor circuit in the present invention is realized by setting two rows of antenna connection parts that are opposite and spaced apart on the electric control board 10, and defining each row of antenna connection parts to include a plurality of antennae 11 that are spaced apart, and setting a plurality of antenna mounting holes 21 connected to the plurality of antenna connection parts on the circuit board 20, and making the circuit board 20 installed on the plurality of antenna connection parts through the plurality of antenna mounting holes 21 and electrically connected to the circuit board 20, thereby realizing the integration of the circuit board 20 and the electric control board 10 in a pinless manner, which not only avoids the stress generated by the pin welding tolerance during the plastic sealing when connecting two circuit modules through pins, but also avoids the influence of human body static electricity on the internal chip, reduces its production cost, and improves production efficiency, and at the same time, the circuit board 20 can be more firmly installed on the electric control board 10 through the cooperation of the fin 22 and the card slot 112.

[0052] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0053] The embodiments of the present invention are described above in conjunction with the accompanying drawings. What is disclosed is only the preferred embodiment of the present invention. However, the present invention is not limited to the above-mentioned specific implementation manner. The above-mentioned specific implementation manner is only illustrative rather than restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms and equivalent changes without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A pinless integrated semiconductor circuit, characterized in that: The pinless integrated semiconductor circuit comprises: An electric control board, wherein two rows of antenna connection parts are arranged opposite to each other and spaced apart, each row of antenna connection parts comprises a plurality of antennas arranged spaced apart, and each antenna comprises a protruding head arranged on the electric control board and a slot formed by a side of the protruding head away from the electric control board and recessed inwardly; A circuit board, wherein the circuit board is provided with a plurality of antenna mounting holes corresponding to the plurality of antenna connecting parts one by one and a plurality of fins respectively located in the plurality of antenna mounting holes, and the circuit board is installed in the plurality of card slots through the plurality of fins and is electrically connected to the circuit board; The fin includes a bottom plate which is in a flat plate shape and is arranged on the circuit board, and two spring plates which are bent and extended from opposite ends of the bottom plate to form an S shape, and the two spring plates are arranged at intervals.

2. The leadless integrated semiconductor circuit according to claim 1, characterized in that: The bottom sheet is provided with a plurality of welding holes passing through it at intervals.

3. The leadless integrated semiconductor circuit according to claim 1, characterized in that: The electric control board is provided with two antenna bases which are opposite to each other and spaced apart from each other, and the two rows of antenna connecting parts are respectively provided on the two antenna bases.

4. The leadless integrated semiconductor circuit according to claim 1, characterized in that: The circuit board comprises: Metal substrate; An insulating layer, the insulating layer being disposed on one side of the metal substrate; A circuit wiring layer, wherein the circuit wiring layer is arranged on a side of the insulating layer away from the metal substrate, and the plurality of fins are arranged on a side of the circuit wiring layer away from the metal substrate; A plurality of components, wherein the plurality of components are arranged at intervals on a side of the circuit wiring layer away from the insulating layer, and the plurality of components and the components and the circuit wiring layer are electrically connected to each other; A package body, the package body covers the metal substrate and the plurality of components, and the plurality of antenna mounting holes extend through the package body to the circuit wiring layer.

5. The leadless integrated semiconductor circuit according to claim 4, characterized in that: The circuit board also includes a green oil layer which is arranged on the circuit wiring layer to avoid all the components.

6. The leadless integrated semiconductor circuit according to claim 4 or 5, characterized in that: The plurality of components at least include chip resistors and chip capacitors that are spaced apart and arranged on the circuit wiring layer.

7. The leadless integrated semiconductor circuit according to claim 4 or 5, characterized in that: The circuit board also includes a plurality of heat sinks spaced apart on the circuit wiring layer, and some of the components are respectively disposed on the plurality of heat sinks.

8. The leadless integrated semiconductor circuit according to claim 4, characterized in that: Electrical connections are achieved between multiple components and between components and circuit wiring layers by binding metal wires.

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