A semiconductor ion implantation machine wafer precision positioning device

Abstract

The present invention discloses a semiconductor ion implanter wafer precision positioning device, comprising an implanter body, a support frame, a clamping mechanism, a feeding mechanism and a conveying mechanism, wherein the support frame is fixedly arranged on one side of the implanter body, a slide rail is provided on the support frame, the clamping mechanism is slidably arranged in the slide rail, the feeding mechanism is slidably arranged above the clamping mechanism, the conveying mechanism is arranged on both sides of the clamping mechanism for conveying wafers, the clamping mechanism comprises a turntable 1, a turntable 2, a support seat and a rotating shaft, wherein the turntable 1 is slidably arranged on the support frame, the rotating shaft is rotatably arranged on the turntable 1, a motor 1 for driving the rotating shaft to rotate is fixedly arranged on the turntable 1, the turntable 2 is rotatably arranged on the rotating shaft, the support seat is fixedly connected to the rotating shaft, and a plurality of telescopic rods 1 for supporting wafers are arranged in an annular shape on the turntable 2.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor ion implantation machine wafer precision positioning device. Background Art

[0002] Ion implantation is a method of introducing a controlled amount of impurities into a substrate to change its electrical properties. It is widely used in the modern silicon wafer manufacturing process. Its most important use is to dope semiconductors to change the carrier concentration and conductivity type of the semiconductor. In the ion implantation process of the wafer, an ion implanter is required to process the wafer. During this process, the wafer needs to be stably clamped and rotated. The existing wafer positioning equipment cannot adjust the position and direction of the wafer according to the processing requirements after clamping and positioning the wafer.

[0003] The existing Chinese patent with publication number CN116387223B discloses a wafer notch positioning structure for an ion implanter, which can stably clamp wafers of different specifications through a placement component, a placement plate and a pressing component, and is provided with a first motor, a first rotating shaft, a first telescopic rod and a first support plate, so that the position adjustment of the placement component and the placement plate is more convenient, and the position of the wafer in the ion implanter is changed by a driving device, thereby facilitating the ion implanter to effectively process wafers of different sizes.

[0004] Although the above patent can stably clamp and process wafers of different sizes, it does not have a loading function and requires manual clamping during processing, which is inefficient. In addition, during the ion implantation process, the wafer position cannot be adjusted autonomously, that is, the wafer cannot be accurately positioned. The position of the wafer needs to be adjusted manually, which greatly reduces the efficiency of ion implantation. In addition, the placement plate and the pressing assembly clamp the wafer directly on the upper and lower surfaces of the wafer, mainly relying on friction to clamp the wafer. This method can easily damage the wafer surface during the wafer transportation process, and the wafer needs to be adjusted multiple times during the ion implantation process, resulting in low processing efficiency.

[0005] Therefore, it is necessary to provide a semiconductor ion implantation machine wafer precision positioning device to solve the problems raised in the above background technology. Summary of the invention

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor ion implanter wafer precision positioning device, comprising an implanter body, a support frame, a clamping mechanism, a loading mechanism and a conveying mechanism, wherein the support frame is fixedly arranged on one side of the implanter body, a slide rail is provided on the support frame, the clamping mechanism is slidably arranged in the slide rail, the loading mechanism is slidably arranged above the clamping mechanism, and the conveying mechanism is arranged on both sides of the clamping mechanism for conveying wafers;

[0007] The clamping mechanism includes a turntable 1, a turntable 2, a support seat and a rotating shaft, wherein the turntable 1 is slidably arranged on the support frame, the rotating shaft is rotatably arranged on the turntable 1, a motor 1 for driving the rotating shaft to rotate is fixedly arranged on the turntable 1, the turntable 2 is rotatably arranged on the rotating shaft, the support seat is fixedly connected to the rotating shaft, and a plurality of telescopic rods 1 for supporting the wafer are arranged in a ring shape on the turntable 2, and the output end of the telescopic rod 1 is wrapped with a buffer pad.

[0008] Further, as a preference, a support plate is fixedly provided at the bottom of the support frame, and a slide groove is provided on the support plate;

[0009] A transmission shaft is fixedly connected to the bottom of the turntable, a transmission ring is rotatably arranged on the transmission shaft, a slide plate is fixedly arranged on the transmission ring, and the slide plate is inserted into the slide groove and slides along the slide groove;

[0010] The output end of the transmission shaft is provided with a driving ring, and a gear ring 1 is provided inside the driving ring;

[0011] A second motor is slidably arranged on the slide, a second telescopic rod is arranged between the second motor and the slide, and a first gear is arranged at the output end of the second motor;

[0012] A rack is fixedly arranged on the support plate, and the gear 1 is meshed with the gear ring 1 or the rack through the sliding of the motor 2.

[0013] Further, as a preference, a plurality of straight grooves are circumferentially provided on the support seat, a clamping block is slidably provided in the straight groove, and a clamping rod is fixedly provided at the bottom of the clamping block;

[0014] The second rotating disk is provided with a plurality of arc-shaped grooves, and the clamping rod passes through the straight grooves, is clamped into the arc-shaped grooves and slides along the arc-shaped grooves;

[0015] A protrusion is slidably arranged on the top of the clamping block, and a spring is arranged between the protrusion and the clamping block.

[0016] Further, preferably, a slot is provided on the rotating shaft, a gear 2 is rotatably arranged in the slot, a gear ring 2 is arranged on the inner side of the turntable 2, the gear 2 is meshed with the gear ring 2, and a motor 3 for driving the gear 2 is embedded in the rotating shaft.

[0017] Further, as a preference, the feeding mechanism includes a bracket, a slide and a support rod, wherein the bracket is rotatably arranged on the turntable 1, a slide rod and a screw rod are respectively arranged at both ends of the bracket, the slide is slidably arranged on the bracket through the slide rod, the slide is also provided with a thread cooperating with the screw rod, two support rods are arranged on the slide for sliding in opposite directions, a clamp rod 1 and a clamp rod 2 are arranged on the support rod for sliding in opposite directions, and a clamping table is arranged at the bottom of the clamp rod 1 and the clamp rod 2.

[0018] Further, as a preference, a bidirectional lead screw is rotatably arranged in the slide seat, and threaded rings cooperating with screws on both sides of the bidirectional lead screw are respectively fixedly arranged on the two support rods, and the bidirectional lead screw is driven by motor four.

[0019] Further, as a preference, a first hydraulic chamber and a second hydraulic chamber are provided in the support rod, a hydraulic rod is fixedly provided at the input end of the clamp rod 1, and the hydraulic rod slides in a sealed manner along the first hydraulic chamber;

[0020] The second hydraulic chamber is an annular hydraulic chamber, and a hydraulic ring rod is fixedly provided at the output end of the second clamp rod, and the hydraulic ring rod slides along the second hydraulic chamber in a sealed manner.

[0021] Further, as a preference, the conveying mechanism includes a conveyor belt and a placement plate, wherein a plurality of placement plates are fixedly arranged on the conveyor belt, the placement plates are circular, a plurality of bosses are fixedly arranged in a ring shape on the placement plate, the surfaces of the bosses are wrapped with anti-slip pads, and a plurality of anti-slip rods are obliquely arranged on the outer side of the placement plate.

[0022] Compared with the prior art, the present invention provides a semiconductor ion implantation machine wafer precision positioning device, which has the following beneficial effects:

[0023] The present invention is equipped with a turntable 2, a support seat and a clamping block. The support seat is rotated to make the clamping block slide along the turntable 2 and effectively clamp the wafers of different specifications. A protrusion is set on the clamping block through spring sliding, so that the protrusion has a buffering effect when contacting the wafer, thereby preventing the wafer from being damaged. The turntable 1 is equipped with a design of a gear 1, a driving ring, a rack and a motor 2, so that the motor 2 can selectively engage with the driving ring or the rack by sliding up and down, thereby driving the turntable 1 to rotate or driving the turntable 1 to slide along the support frame, further changing the position of the wafer in the ion implanter, so that wafers of different specifications can be effectively processed. In addition, the turntable 2 and the support seat can rotate together through the rotating shaft drive, so that the wafer can rotate after clamping, so that the wafer can be adjusted in position according to the processing requirements in the ion implanter, effectively improving the processing efficiency, and a loading mechanism is set on the turntable 1, and the loading mechanism can be used to automatically load and unload the wafer, and the wafer is transported and collected by the conveying mechanism to realize continuous processing of the wafer, further improving the processing efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the connection between the turntable 1 and the support frame in the present invention;

[0026] Figure 3 It is a structural schematic diagram of the clamping mechanism in the present invention;

[0027] Figure 4 It is a schematic diagram of the driving structure of the second turntable and the support base in the present invention;

[0028] Figure 5 It is a structural schematic diagram of the feeding mechanism in the present invention;

[0029] Figure 6 It is a schematic diagram of the structure of the support rod, the first clamping rod and the second clamping rod in the present invention;

[0030] Figure 7 It is a schematic diagram of the structure of placing the plate in the present invention;

[0031] In the figure: 1, injection machine body; 2, support frame; 21, slide rail; 22, support plate; 221, rack; 3, clamping mechanism; 31, turntable 1; 311, transmission shaft; 312, slide plate; 313, drive ring; 314, gear 1; 32, turntable 2; 321, arc groove; 322, gear ring 2; 33, support seat; 331, straight groove; 34, rotating shaft; 341, notch; 342, gear 2; 35, telescopic rod 1; 36, block; 36 1. Clamping rod; 362. Bump; 4. Feeding mechanism; 41. Bracket; 411. Sliding rod; 412. Screw rod; 42. Sliding seat; 421. Bidirectional screw; 43. Support rod; 431. Threaded ring; 432. First hydraulic chamber; 433. Second hydraulic chamber; 44. Clamping rod one; 441. Hydraulic rod; 45. Clamping rod two; 451. Hydraulic ring rod; 5. Conveying mechanism; 51. Conveyor belt; 52. Placement plate; 521. Boss; 522. Anti-slip rod. DETAILED DESCRIPTION

[0032] Example: See Figures 1 to 7 In an embodiment of the present invention, a semiconductor ion implanter wafer precision positioning device comprises an implanter body 1, a support frame 2, a clamping mechanism 3, a loading mechanism 4 and a conveying mechanism 5, wherein the support frame 2 is fixedly arranged on one side of the implanter body 1, a slide rail 21 is provided on the support frame 2, the clamping mechanism 3 is slidably arranged in the slide rail 21, the loading mechanism 4 is slidably arranged above the clamping mechanism 3, and the conveying mechanism 5 is arranged on both sides of the clamping mechanism 3 for conveying wafers;

[0033] The clamping mechanism 3 includes a turntable 1 31, a turntable 2 32, a support seat 33 and a rotating shaft 34, wherein the turntable 1 31 is slidably arranged on the support frame 2, the rotating shaft 34 is rotatably arranged on the turntable 1 31, a motor 1 for driving the rotating shaft 34 to rotate is fixedly arranged on the turntable 1 31, the turntable 2 32 is rotatably arranged on the rotating shaft 34, the support seat 33 is fixedly connected to the rotating shaft 34, and a plurality of telescopic rods 1 35 for supporting wafers are arranged in a ring shape on the turntable 2 32, and the output ends of the telescopic rods 1 35 are wrapped with buffer pads.

[0034] During implementation, the wafer is placed on the placement plate 52, and the wafer is transferred to the side of the support frame 2 by the conveyor belt 51, and then the wafer is clamped and transported to the support seat 33 by the loading mechanism 4, and before placement, the telescopic rod 1 35 is preferably extended to pre-support the wafer, so that the clamping rod 1 44 and the clamping rod 2 45 can place the wafer conveniently, and then the motor 3 is used to drive the turntable 2 32 to rotate so that the clamping block 36 slides along the straight groove 331 under the action of the arc groove 321, thereby stably clamping the wafer, and then the motor 2 is used to drive the turntable 1 31 to slide along the support frame 2, so that the wafer is transported to the implantation machine body 1, and the turntable 1 31 is rotated to adjust the position of the wafer, and then the wafer is implanted. Ion implantation processing is performed, and during the processing, the motor 1 is used to drive the shaft 34 to rotate and drive the turntable 2 32 and the support seat 33 to rotate, thereby adjusting the orientation of the chip, accurately positioning and processing the chip, and then after the processing is completed, the turntable 1 31 is rotated to transfer the processed chip out of the implantation machine body 1, and the unprocessed chip is transferred into the implantation machine body 1 for processing, and the position of the chip is readjusted according to the chip specifications, and then the loading mechanism 4 is used to transport the processed chip to the conveying mechanism 5 on the other side of the support frame 2, and the vacant chip is refilled on the vacant support seat 33, thereby performing continuous and accurate ion implantation processing, effectively improving the ion implantation efficiency of the chip.

[0035] In this embodiment, Figure 1 and Figure 2 A support plate 22 is fixedly provided at the bottom of the support frame 2, and a slide groove is provided on the support plate 22;

[0036] The bottom of the turntable 1 31 is fixedly connected to a transmission shaft 311, a transmission ring is rotatably arranged on the transmission shaft 311, a slide plate 312 is fixedly arranged on the transmission ring, and the slide plate 312 is inserted into the slide groove and slides along the slide groove;

[0037] The output end of the transmission shaft 311 is provided with a driving ring 313, and a gear ring 1 is provided inside the driving ring 313;

[0038] A second motor is slidably disposed on the slide plate 312, a second telescopic rod is disposed between the second motor and the slide plate 312, and a first gear 314 is disposed at the output end of the second motor;

[0039] A rack 221 is fixedly disposed on the support plate 22, and the gear 1 314 is meshed with the gear ring 1 or the rack 221 through the sliding of the motor 2.

[0040] In particular, the transmission ring and the slide plate 312 are arranged so that when the motor 2 drives the turntable 1 31 to rotate, the motor 2 is not affected, that is, the motor 2 can continuously and stably drive the turntable 1 31 to rotate, and under the action of the telescopic rod 2, the motor 2 slides up and down and selectively engages with the driving ring 313 or the rack 221, thereby enabling the self-rotation of the turntable 1 31 and the sliding of the turntable 1 31 along the support frame 2 to be realized through the drive of the motor 2, and then the position of the chip in the implantation machine body 1 is adjusted according to the size of the chip, so as to facilitate the ion implantation machine to process chips of different specifications.

[0041] In this embodiment, Figure 3 The support seat 33 is provided with a plurality of straight grooves 331 in a circumferential shape, a clamping block 36 is slidably arranged in the straight groove 331, and a clamping rod 361 is fixedly arranged at the bottom of the clamping block 36;

[0042] The second rotating disk 32 is provided with a plurality of arc-shaped grooves 321 , and the clamping rod 361 passes through the straight groove 331 and is clamped into the arc-shaped groove 321 and slides along the arc-shaped groove 321 ;

[0043] A protrusion 362 is slidably provided on the top of the block 36 , and a spring is provided between the protrusion 362 and the block 36 .

[0044] During implementation, the turntable 2 32 is rotated so that the clamping block 36 slides along the straight groove 331 under the action of the arc groove 321, thereby changing the clamping range of the clamping block 36, so that the clamping block 36 can effectively clamp wafers of different specifications, and a protrusion 362 is set on the clamping block 36 through spring sliding, so that the protrusion 362 can slide when it contacts the wafer, thereby ensuring that the wafer is stably clamped and buffering protection is provided to prevent the wafer from being damaged.

[0045] In this embodiment, Figure 3 and Figure 4 A slot 341 is provided on the rotating shaft 34, a gear 2 342 is rotatably provided in the slot 341, a gear ring 2 322 is provided inside the rotating disk 2 32, the gear 2 342 meshes with the gear ring 2 322, and a motor 3 for driving the gear 2 342 is embedded in the rotating shaft 34.

[0046] In particular, the motor three that drives the turntable two 32 to rotate is embedded in the shaft 34, so that when the shaft 34 rotates, the turntable two 32 can rotate therewith, and when the motor three drives the turntable two 32 to rotate, the shaft 34 does not rotate, that is, the clamping of the clamping block 36 and the independent driving system are not affected by the overall rotation of the turntable two 32 and the support seat 33, so that the chip can always maintain a stable clamping state when it rotates in the implantation machine body 1 for position adjustment.

[0047] In this embodiment, Figure 5 The feeding mechanism 4 includes a bracket 41, a slide 42 and a support rod 43, wherein the bracket 41 is rotatably arranged on the turntable 31, and a slide rod 411 and a screw rod 412 are respectively arranged at both ends of the bracket 41, and the slide 42 is slidably arranged on the bracket 41 through the slide rod 411, and the slide 42 is also provided with a thread that cooperates with the screw rod 412, and two support rods 43 are arranged on the slide 42 for sliding in opposite directions, and a clamp rod 1 44 and a clamp rod 2 45 are arranged on the support rod 43 for sliding in opposite directions, and a clamping table is arranged at the bottom of the clamp rod 1 44 and the clamp rod 2 45.

[0048] In this embodiment, Figure 5 A bidirectional lead screw 421 is rotatably arranged in the slide seat 42, and threaded rings 431 which cooperate with screws on both sides of the bidirectional lead screw 421 are fixedly arranged on the two support rods 43, respectively. The bidirectional lead screw 421 is driven by a motor 4.

[0049] In this embodiment, Figure 6 The support rod 43 is provided with a first hydraulic chamber 432 and a second hydraulic chamber 433, and a hydraulic rod 441 is fixedly provided at the input end of the clamp rod 1 44, and the hydraulic rod 441 slides along the first hydraulic chamber 432 in a sealed manner;

[0050] The second hydraulic chamber 433 is an annular hydraulic chamber. A hydraulic ring rod 451 is fixedly provided at the output end of the second clamp rod 45 . The hydraulic ring rod 451 slides along the second hydraulic chamber 433 in a sealed manner.

[0051] During implementation, the overall orientation of the loading mechanism 4 is adjusted by rotating the bracket 41, so that the loading mechanism can take and place the wafers on different clamping mechanisms 3, and then the slide 42 is driven to slide out along the slide rod 411 by rotating the screw rod 412, so that the clamp rod 1 44 and the clamp rod 2 45 are extended to the conveying mechanism 5 and placed, and then according to the size of the wafer, the bidirectional screw 421 is driven by the motor 4 to rotate, so that the two support rods 43 slide towards each other, and at the same time, the clamp rod 1 44 and the clamp rod 2 45 are driven by the first hydraulic chamber 432 and the second hydraulic chamber 433. 4 and the clamping rod 2 45 slide in opposite directions, so that the clamping rod 1 44 and the clamping rod 2 45 effectively clamp the wafer, and stabilize the clamping rod 44 and the clamping rod 2 45 through the clamping table to prevent the wafer from falling during the transportation process, and then the slide 42 is retracted to the top of the clamping mechanism 3 by the screw rod 412, and then the telescopic rod 1 35 is extended to support the wafer and then release the conveying clamping rod 1 44 and the clamping rod 2 45 to complete the loading. On the contrary, when the wafer processing is completed, the wafer is transported from the clamping mechanism 3 to the conveying mechanism 5 through the loading mechanism, so that the processing of the wafer can be carried out continuously, further improving the processing efficiency of the wafer.

[0052] In this embodiment, Figure 7 The conveying mechanism 5 includes a conveyor belt 51 and a placement plate 52, wherein a plurality of placement plates 52 are fixedly arranged on the conveyor belt 51, the placement plate 52 is circular, a plurality of bosses 521 are fixedly arranged in a ring shape on the placement plate 52, the surface of the bosses 521 is wrapped with anti-slip pads, and a plurality of anti-slip rods 522 are obliquely arranged on the outer side of the placement plate 52.

[0053] In particular, a boss 521 is provided on the transmission tray 52, and the first clamping rod 44 and the second clamping rod 45 respectively take and place the wafer, and an anti-slip rod 522 is provided on the outer side of the placement tray 52 to ensure that the wafer will not slide off the placement tray during transportation.

[0054] To sum up, when the present invention is implemented, the clamping mechanism 3 is used to clamp and convey the wafer, the position of the wafer in the implanter body 1 is adjusted by the turntable 1 31, and the wafer is rotated and adjusted by the turntable 2 32 and the support seat 33, so that the implanter body 1 can accurately and effectively implant ions into wafers of different specifications. In addition, a loading mechanism 4 is set on the turntable 1, and the loading mechanism 4 can automatically load and unload the wafer, and transport and collect it through the conveying mechanism 5, so as to further improve the processing efficiency of the wafer.

[0055] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor ion implanter wafer precision positioning device, characterized in that: The invention comprises an implantation machine body (1), a support frame (2), a clamping mechanism (3), a feeding mechanism (4) and a conveying mechanism (5), wherein the support frame (2) is fixedly arranged on one side of the implantation machine body (1), a slide rail (21) is provided on the support frame (2), the clamping mechanism (3) is slidably arranged in the slide rail (21), the feeding mechanism (4) is slidably arranged above the clamping mechanism (3), and the conveying mechanism (5) is arranged on both sides of the clamping mechanism (3) for conveying wafers; The clamping mechanism (3) comprises a turntable (31), a turntable (32), and a support seat (33) which are arranged from bottom to top, wherein the turntable (32) and the support seat (33) are coaxially arranged, wherein the turntable (31) is slidably arranged on the support frame (2), a rotating shaft (34) is rotatably arranged on the turntable (31), a motor (1) for driving the rotating shaft (34) to rotate is fixedly arranged on the turntable (31), the turntable (32) is rotatably arranged on the rotating shaft (34), the support seat (33) is fixedly connected to the rotating shaft (34), a plurality of telescopic rods (35) for supporting wafers are arranged in an annular shape on the turntable (32), and the output ends of the telescopic rods (35) are wrapped with buffer pads; A support plate (22) is fixedly arranged at the bottom of the support frame (2), and a slide groove is provided on the support plate (22); The bottom of the turntable 1 (31) is fixedly connected with a transmission shaft (311), a transmission ring is rotatably arranged on the transmission shaft (311), a slide plate (312) is fixedly arranged on the transmission ring, and the slide plate (312) is inserted into the slide groove and slides along the slide groove; The output end of the transmission shaft (311) is provided with a driving ring (313), and a gear ring 1 is provided inside the driving ring (313); A second motor is slidably disposed on the slide plate (312), a second telescopic rod is disposed between the second motor and the slide plate (312), and a first gear (314) is disposed at the output end of the second motor; A rack (221) is fixedly provided on the support plate (22), and the gear 1 (314) meshes with the gear ring 1 or the rack (221) through the sliding of the motor 2; The support seat (33) is provided with a plurality of straight grooves (331) in a circumferential manner, a clamping block (36) is slidably arranged in the straight groove (331), and a clamping rod (361) is fixedly arranged at the bottom of the clamping block (36); The second rotating disk (32) is provided with a plurality of arc-shaped grooves (321), and the clamping rod (361) passes through the straight groove (331), is clamped into the arc-shaped groove (321), and slides along the arc-shaped groove (321); A protrusion (362) is slidably provided on the top of the clamping block (36), and a spring is provided between the protrusion (362) and the clamping block (36).

2. The semiconductor ion implanter wafer precision positioning device according to claim 1, characterized in that: The rotating shaft (34) is provided with a notch (341), a gear 2 (342) is rotatably arranged in the notch (341), a gear ring 2 (322) is arranged inside the rotating disk 2 (32), the gear 2 (342) is meshed with the gear ring 2 (322), and a motor 3 for driving the gear 2 (342) is embedded in the rotating shaft (34).

3. The semiconductor ion implanter wafer precision positioning device according to claim 1, characterized in that: The feeding mechanism (4) comprises a bracket (41), a slide seat (42) and a support rod (43), wherein the bracket (41) is rotatably arranged on the turntable (31), a slide rod (411) and a screw rod (412) are respectively arranged at both ends of the bracket (41), the slide seat (42) is slidably arranged on the bracket (41) through the slide rod (411), and the slide seat (42) is also provided with a thread that cooperates with the screw rod (412), two support rods (43) are arranged on the slide seat (42) for sliding in opposite directions, and a clamping rod (44) and a clamping rod (45) are arranged on the support rod (43) for sliding in opposite directions, and a clamping table is arranged at the bottom of the clamping rod (44) and the clamping rod (45).

4. The semiconductor ion implanter wafer precision positioning device according to claim 3, characterized in that: A bidirectional lead screw (421) is rotatably arranged in the slide seat (42), and threaded rings (431) that cooperate with screws on both sides of the bidirectional lead screw (421) are fixedly arranged on the two support rods (43), respectively. The bidirectional lead screw (421) is driven by a fourth motor.

5. The semiconductor ion implanter wafer precision positioning device according to claim 3, characterized in that: The support rod (43) is provided with a first hydraulic chamber (432) and a second hydraulic chamber (433); the input end of the clamping rod (44) is fixedly provided with a hydraulic rod (441); the hydraulic rod (441) is sealed and slidable along the first hydraulic chamber (432); The second hydraulic chamber (433) is an annular hydraulic chamber, and a hydraulic ring rod (451) is fixedly provided at the output end of the second clamping rod (45), and the hydraulic ring rod (451) slides in a sealed manner along the second hydraulic chamber (433).

6. The semiconductor ion implanter wafer precision positioning device according to claim 1, characterized in that: The conveying mechanism (5) comprises a conveyor belt (51) and a placement plate (52), wherein a plurality of placement plates (52) are fixedly arranged on the conveyor belt (51), the placement plates (52) are circular, a plurality of bosses (521) are fixedly arranged in an annular shape on the placement plates (52), the surface of the bosses (521) is wrapped with anti-slip pads, and a plurality of anti-slip rods (522) are obliquely arranged on the outer side of the placement plates (52).

Images