Real-time status monitoring and analysis method, system and electronic equipment for solder paste printer

Abstract

The present invention relates to a real-time state monitoring and analysis method, system and electronic equipment of a solder paste printer, belonging to the technical field of solder paste printer control. The present invention obtains content data information of credible sensor data, and constructs a solder paste printer data tracking model according to the content data information of the credible sensor data, tracks the real-time state of the solder paste printer through the solder paste printer data tracking model, thereby obtaining the real-time state information of the solder paste printer through tracking, and performs real-time warning based on the real-time state information of the solder paste printer. The present invention makes the construction of the solder paste printer Internet of Things monitoring platform more reasonable by adjusting the parameters of the solder paste printer Internet of Things monitoring platform, improves the rationality of data collection, and then more accurately tracks and evaluates the real-time state of the solder paste printer, reduces the generation of defective products, promptly discovers abnormal data, and reduces production costs.

Description

Technical Field

[0001] The present invention relates to the field of solder paste printer control technology, and in particular to a real-time status monitoring and analysis method, system and electronic equipment of a solder paste printer. Background Art

[0002] Under the general trend of green manufacturing and intelligent manufacturing, electronic manufacturing enterprises have adapted to market demand, upgraded and renovated their workshops, built dust-free workshops and automatic production lines, in order to achieve automated, networked, and intelligent production, and gradually transform the labor-intensive electronic manufacturing industry into a capital- and technology-intensive one, thereby improving the core competitiveness of enterprises. Under this development situation, whether it is the construction of automated production lines or the realization of networked and intelligent production, a large amount of advanced electronic manufacturing equipment is required, such as fully automatic solder paste printers, fully automatic placement machines, and fully automatic plug-in machines. Among them, the solder paste printer is the key equipment for the surface mount production line to successfully complete the first process, and has a significant impact on subsequent processing and the quality of finished products, and needs to be paid special attention to. The impact of the solder paste printer on subsequent processing and the quality of finished products is mainly reflected in the performance of the solder paste printer, which is the basis for the solder paste printer to participate in production activities. According to the performance of the solder paste printer, the production and processing of the solder paste printer can be roughly divided into four parts: the first part is the performance degradation process of the solder paste printer, which reflects the phenomenon that the performance such as printing quality, reliability, and production efficiency gradually decreases as the processing process proceeds; the second part is state detection, which reflects the level of state detection capability and is the embodiment of the degree of automation and intelligence of the solder paste printer; the third part is maintenance decision-making, which reflects the pros and cons of the maintainability of the solder paste printer; the fourth part is production performance evaluation, which is a quantitative analysis of the processing capability of the solder paste printer. During the production and processing of the solder paste printer, if its performance is relatively high, it can not only ensure the printing quality of the workpiece, but also improve the timeliness and accuracy of state detection, effectively monitor the level of performance degradation, optimize maintenance decisions, and improve production efficiency. However, when the state of the solder paste printer does not meet expectations, it will cause the printing parameters of the printed part to not meet expectations, resulting in defective products and increasing production costs. Summary of the invention

[0003] The present invention overcomes the deficiencies of the prior art and provides a real-time status monitoring and analysis method, system and electronic equipment for a solder paste printer.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] A first aspect of the present invention provides a real-time status monitoring and analysis method for a solder paste printer, comprising the following steps:

[0006] Install a number of sensors in each solder paste printer, build a solder paste printer Internet of Things monitoring platform, and obtain the data throughput when the solder paste printer Internet of Things monitoring platform transmits data with each solder paste printer within a preset time;

[0007] Acquire credible sensor data or untrustworthy sensor data by evaluating the data throughput when the solder paste printer Internet of Things monitoring platform transmits data with each solder paste printer within the preset time;

[0008] Acquire content data information of the trusted sensor data, and construct a solder paste printer data tracking model according to the content data information of the trusted sensor data, and track the real-time status of the solder paste printer through the solder paste printer data tracking model;

[0009] The real-time status information of the solder paste printer is obtained by tracking, and a real-time warning is issued based on the real-time status information of the solder paste printer.

[0010] Furthermore, in this method, a number of sensors are installed in each solder paste printer to construct a solder paste printer Internet of Things monitoring platform, specifically:

[0011] Install several sensors and arrange communication equipment in each solder paste printer, build a solder paste printer IoT monitoring platform, initialize the information collection interval within a unit time, and set the upper threshold of the information collection amount of the solder paste printer IoT monitoring platform;

[0012] Obtain the number of sensors and the amount of information transmitted by the sensors when transmitting information once, and calculate the total amount of information collected when the sensors communicate with the solder paste printer Internet of Things monitoring platform based on the amount of information transmitted by the sensors when transmitting information once, the number of sensors, and the information collection interval within a unit time;

[0013] When the total amount of information collected when the sensor communicates with the solder paste printer Internet of Things monitoring platform is greater than the upper threshold of the amount of information collected by the solder paste printer Internet of Things monitoring platform, readjust the information collection interval within the unit time;

[0014] When the total amount of information collected when the sensor communicates with the solder paste printer Internet of Things monitoring platform is not greater than the upper threshold of the information collection amount of the solder paste printer Internet of Things monitoring platform, the information collection interval within the unit time is output, and the construction of the solder paste printer Internet of Things monitoring platform is completed.

[0015] Furthermore, in the present method, by evaluating the data throughput when the solder paste printer IoT monitoring platform transmits data with each solder paste printer within the preset time, credible sensor data or untrustworthy sensor data is obtained, specifically:

[0016] Setting a data throughput threshold, and determining whether the data throughput during data transmission between the solder paste printer IoT monitoring platform and each solder paste printer within the preset time is greater than the data throughput threshold;

[0017] When the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within the preset time is greater than the data throughput threshold, the data collected during the corresponding period is used as credible sensor data;

[0018] When the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within the preset time is not greater than the data throughput threshold, the data collected during the corresponding period is regarded as unreliable sensor data;

[0019] The untrustworthy sensor data are discarded, and the credible sensor data are output.

[0020] Furthermore, in this method, the content data information of the trusted sensor data is obtained, and a solder paste printer data tracking model is constructed according to the content data information of the trusted sensor data, specifically:

[0021] A solder paste printer data tracking model is constructed based on a multi-layer perceptual neural network, and each type of data in the content data information of the trusted sensor data is used as a node, and the nodes are connected through wireless description relationships to form a topological structure diagram;

[0022] Set the learning rate, the mean square error of the stopping condition, the maximum number of training neurons, and the sine function as the activation function as training parameters;

[0023] The topological structure diagram is used as a training item, the training item is input into an input layer, an attention mechanism is introduced into a hidden layer, and attention is focused on nodes in the topological structure diagram through the attention mechanism;

[0024] The solder paste printer data tracking model is trained based on the training parameters, and when the training parameters reach the mean square error of the stop condition, the solder paste printer data tracking model training is completed.

[0025] Furthermore, in this method, real-time status information of the solder paste printer is obtained by tracking, and a real-time warning is performed based on the real-time status information of the solder paste printer, specifically:

[0026] By tracking and acquiring the real-time status information of the solder paste printer and setting the real-time status threshold range of the solder paste printer, it is determined whether the real-time status information of the solder paste printer is within the real-time status threshold range of the solder paste printer;

[0027] When the real-time status information of the solder paste printer is within the real-time status threshold range of the solder paste printer, normal status information is generated, and the normal status information is displayed in a preset manner;

[0028] When the real-time status information of the solder paste printer is not within the real-time status threshold range of the solder paste printer, abnormal status information is generated, and the location of the solder paste printer corresponding to the abnormal status information is obtained;

[0029] A real-time warning is issued according to the location of the solder paste printer corresponding to the abnormal status information, and displayed in a preset manner.

[0030] Furthermore, in this method, the real-time status monitoring and analysis method of the solder paste printer further includes:

[0031] Obtain the solder paste printer corresponding to the abnormal status information, count the solder paste printers corresponding to the abnormal status information, classify them according to the type of abnormal condition, and obtain the abnormal condition type of each solder paste printer;

[0032] By sorting the maintenance priority of the abnormal situation types of the solder paste printer, obtaining the maintenance priority sorting result, and obtaining the real-time status information of the maintenance staff;

[0033] According to the real-time status information of the maintenance staff, optimized maintenance allocation is performed according to the maintenance priority sorting result, and a priority maintenance allocation result is generated and displayed in a preset manner.

[0034] A second aspect of the present invention provides a real-time status monitoring and analysis system for a solder paste printer, comprising a memory and a processor, wherein the memory comprises a real-time status monitoring and analysis method program for a solder paste printer, and when the real-time status monitoring and analysis method program for a solder paste printer is executed by the processor, the steps of any one of the real-time status monitoring and analysis methods for a solder paste printer are implemented.

[0035] A third aspect of the present invention provides an electronic device, comprising:

[0036] A data throughput acquisition module is used to install a number of sensors in each solder paste printer, construct an IoT monitoring platform for the solder paste printer, and obtain the data throughput when the IoT monitoring platform for the solder paste printer transmits data to each solder paste printer within a preset time;

[0037] A trusted data analysis and acquisition module, which acquires trusted sensor data or untrusted sensor data by evaluating the data throughput when the solder paste printer IoT monitoring platform transmits data with each solder paste printer within the preset time;

[0038] A state tracking module, which obtains content data information of the trusted sensor data, and constructs a solder paste printer data tracking model according to the content data information of the trusted sensor data, and tracks the real-time state of the solder paste printer through the solder paste printer data tracking model;

[0039] The early warning module obtains the real-time status information of the solder paste printer by tracking, and issues a real-time early warning based on the real-time status information of the solder paste printer.

[0040] A fourth aspect of the present invention provides a computer-readable storage medium, which includes a real-time status monitoring and analysis method program for a solder paste printer. When the real-time status monitoring and analysis method program for a solder paste printer is executed by a processor, the steps of any one of the real-time status monitoring and analysis methods for a solder paste printer are implemented.

[0041] The present invention solves the defects existing in the background technology and has the following beneficial effects:

[0042] The present invention constructs an Internet of Things monitoring platform for solder paste printers by installing a number of sensors in each solder paste printer, and obtains the data throughput when the solder paste printer Internet of Things monitoring platform and each solder paste printer perform data transmission within a preset time, thereby performing data evaluation on the data throughput when the solder paste printer Internet of Things monitoring platform and each solder paste printer perform data transmission within the preset time, obtaining credible sensor data or uncredible sensor data, and further obtaining content data information of the credible sensor data, and constructing a solder paste printer data tracking model according to the content data information of the credible sensor data, and tracking the real-time status of the solder paste printer through the solder paste printer data tracking model, thereby obtaining the real-time status information of the solder paste printer through tracking, and performing real-time early warning based on the real-time status information of the solder paste printer. The present invention evaluates the data throughput when the Internet of Things monitoring platform of the solder paste printer transmits data with each solder paste printer within a preset time, thereby adjusting the parameters of the Internet of Things monitoring platform of the solder paste printer, making the construction of the Internet of Things monitoring platform of the solder paste printer more reasonable, improving the rationality of data collection, and further more accurately tracking and evaluating the real-time status of the solder paste printer, reducing the generation of defective products, timely discovering abnormal data, and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, drawings of other embodiments can be obtained based on these drawings without paying creative work.

[0044] Figure 1 An overall flow chart of a real-time status monitoring and analysis method for a solder paste printer is shown;

[0045] Figure 2 A method flow chart showing a method for real-time status monitoring and analysis of a solder paste printer;

[0046] Figure 3 A system block diagram of a real-time status monitoring and analysis system for a solder paste printer is shown;

[0047] Figure 4 A device schematic diagram of an electronic device is shown. DETAILED DESCRIPTION

[0048] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0049] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0050] like Figure 1 As shown, the first aspect of the present invention provides a real-time status monitoring and analysis method for a solder paste printer, comprising the following steps:

[0051] S102: installing a number of sensors in each solder paste printer, constructing an Internet of Things monitoring platform for the solder paste printer, and obtaining data throughput when the Internet of Things monitoring platform for the solder paste printer transmits data to each solder paste printer within a preset time;

[0052] S104: obtaining credible sensor data or uncredible sensor data by evaluating the data throughput when the solder paste printer IoT monitoring platform transmits data with each solder paste printer within a preset time;

[0053] S106: Acquire content data information of the credible sensor data, and construct a solder paste printer data tracking model according to the content data information of the credible sensor data, and track the real-time status of the solder paste printer through the solder paste printer data tracking model;

[0054] S108: Acquire the real-time status information of the solder paste printer by tracking, and issue a real-time warning based on the real-time status information of the solder paste printer.

[0055] It should be noted that the present invention adjusts the parameters of the solder paste printer Internet of Things monitoring platform by evaluating the data throughput when the solder paste printer Internet of Things monitoring platform transmits data with each solder paste printer within a preset time, so that the construction of the solder paste printer Internet of Things monitoring platform is more reasonable, the rationality of data collection is improved, and then the real-time status of the solder paste printer is more accurately tracked and evaluated, the generation of defective products is reduced, abnormal data is discovered in time, and production costs are reduced.

[0056] like Figure 2 As shown, further, in this method, a number of sensors are installed in each solder paste printer to build a solder paste printer Internet of Things monitoring platform, specifically:

[0057] S202: installing a number of sensors and arranging communication equipment in each solder paste printer, constructing an Internet of Things monitoring platform for the solder paste printer, initializing the information collection interval within a unit time, and setting an upper threshold value of the information collection amount of the Internet of Things monitoring platform for the solder paste printer;

[0058] S204: obtaining the number of sensors and the amount of information transmitted by the sensors when transmitting information once, and calculating the total amount of information collected when the sensors communicate with the solder paste printer Internet of Things monitoring platform based on the amount of information transmitted by the sensors when transmitting information once, the number of sensors, and the information collection interval within a unit time;

[0059] S206: when the total amount of information collected when the sensor communicates with the solder paste printer Internet of Things monitoring platform is greater than the upper threshold of the amount of information collected by the solder paste printer Internet of Things monitoring platform, readjust the information collection interval within the unit time;

[0060] S208: When the total amount of information collected when the sensor communicates with the solder paste printer Internet of Things monitoring platform is not greater than the upper threshold of the information collection amount of the solder paste printer Internet of Things monitoring platform, the information collection interval within a unit time is output, and the construction of the solder paste printer Internet of Things monitoring platform is completed.

[0061] It should be noted that sensors include temperature sensors, humidity sensors, image sensors, light spot sensors, displacement sensors, pressure sensors and other data. It is worth mentioning that since the number of servers is limited, the IoT monitoring platform actually has an upper limit on the amount of data collected. This method can further optimize the information collection interval within a unit time according to the number of sensor data (such as a collection interval of 20ms, that is, the number of data collected within 1 second is 50 times), making the data collection of the solder paste printer IoT monitoring platform more reasonable.

[0062] Furthermore, in this method, by evaluating the data throughput when the solder paste printer IoT monitoring platform transmits data with each solder paste printer within a preset time, reliable sensor data or unreliable sensor data is obtained, specifically:

[0063] Set a data throughput threshold, and determine whether the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within a preset time is greater than the data throughput threshold;

[0064] When the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within the preset time is greater than the data throughput threshold, the data collected during the corresponding period is used as the credible sensor data;

[0065] When the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within the preset time is not greater than the data throughput threshold, the data collected during the corresponding period is regarded as unreliable sensor data;

[0066] Untrusted sensor data is discarded and trusted sensor data is output.

[0067] It should be noted that throughput refers to the amount of data successfully transmitted by power network equipment per unit time, wherein the greater the throughput, the more authentic the data is, and vice versa, the data is not within the preset time, and the data is more false. This method can obtain reliable data (such as temperature, humidity, real-time movement displacement of solder paste printers, etc.), making the equipment monitoring of solder paste printers more reasonable.

[0068] Furthermore, in this method, the content data information of the credible sensor data is obtained, and a solder paste printer data tracking model is constructed according to the content data information of the credible sensor data, specifically:

[0069] A data tracking model for solder paste printers is constructed based on a multi-layer perceptual neural network. Each type of data in the content data information of the trusted sensor data is used as a node, and the nodes are connected through wireless description relationships to form a topological structure diagram.

[0070] Set the learning rate, the mean square error of the stopping condition, the maximum number of training neurons, and the sine function as the activation function as training parameters;

[0071] The topological structure graph is used as a training project, the training project is input into the input layer, and the attention mechanism is introduced into the hidden layer, and the attention is focused on the nodes in the topological structure graph through the attention mechanism;

[0072] The solder paste printer data tracking model is trained based on the training parameters. When the training parameters reach the mean square error of the stopping condition, the solder paste printer data tracking model training is completed.

[0073] It should be noted that the architecture of the multi-layer perceptron neural network consists of an input layer, a hidden layer, and an output layer, where the first and last layers are the input and output layers, respectively. In the input layer, the number of nodes corresponds to the number of input features, while the number of nodes in the output layer corresponds to the number of target classes. Neurons are information processing units, which are the basis for the operation of neural networks. For the MLPNN classification algorithm, 30 and 1 nodes were used in the hidden layer and output layer, respectively. The learning rate is set to 0.05, and the mean square error of the stopping condition is 0.0001. The maximum number of training neurons is set to 1000, and the sine function is used as the activation function. Among them, the attention mechanism is used to focus on the nodes in the topological structure diagram to avoid the interference of multi-scale data on model training and improve the tracking accuracy of the model.

[0074] Furthermore, in this method, the real-time status information of the solder paste printer is obtained by tracking, and a real-time warning is performed based on the real-time status information of the solder paste printer, specifically:

[0075] By tracking and acquiring the real-time status information of the solder paste printer, and setting the real-time status threshold range of the solder paste printer, it is determined whether the real-time status information of the solder paste printer is within the real-time status threshold range of the solder paste printer;

[0076] When the real-time status information of the solder paste printer is within the real-time status threshold range of the solder paste printer, normal status information is generated and displayed in a preset manner;

[0077] When the real-time status information of the solder paste printer is not within the real-time status threshold range of the solder paste printer, abnormal status information is generated, and the location of the solder paste printer corresponding to the abnormal status information is obtained;

[0078] A real-time warning is issued based on the location of the solder paste printer corresponding to the abnormal status information, and displayed in a preset manner.

[0079] It should be noted that the real-time status information of the solder paste printer includes printing volume data, temperature data, humidity data, displacement data, etc. When the real-time status information of the solder paste printer is not within the real-time status threshold range of the solder paste printer, it indicates that an abnormality has occurred, and this method can quickly detect the abnormality.

[0080] Furthermore, in this method, the real-time status monitoring and analysis method of the solder paste printer also includes:

[0081] Obtain the solder paste printer corresponding to the abnormal status information, count the solder paste printers corresponding to the abnormal status information, classify them according to the type of abnormal condition, and obtain the abnormal condition type of each solder paste printer;

[0082] By sorting the maintenance priority of the abnormal situation types of the solder paste printer, obtaining the maintenance priority sorting results, and obtaining the real-time status information of the maintenance staff;

[0083] According to the real-time status information of the maintenance staff, the maintenance allocation is optimized according to the maintenance priority sorting results, and the priority maintenance allocation results are generated and displayed in a preset manner.

[0084] It should be noted that this method can improve the rationality of maintenance allocation.

[0085] In addition, the method further comprises:

[0086] Collect data throughput data of communication equipment under standard environmental data (such as setting the standard working environment to 25 degrees Celsius), and collect data throughput data of communication equipment under various environmental data;

[0087] Calculate the ratio of the data throughput data based on the data throughput data of the communication device under the standard environment data and the data throughput data of the communication device under each environment data as the influence coefficient, and count the influence coefficients under each environment data;

[0088] Acquire working environment change data of the current communication device within a preset time, and acquire the influence coefficient of the working environment data of the current communication device according to the working environment change data of the current communication device within the preset time and the influence coefficient under each environment data;

[0089] Based on the influence coefficient of the working environment data of the current communication device and the data throughput, the data throughput prediction data within the preset time is calculated; when the data throughput prediction data within the preset time is lower than the preset data throughput threshold, the working environment of the communication device is adjusted to improve the rationality of data collection, thereby improving the rationality of monitoring the solder paste printer.

[0090] It should be noted that when the communication equipment is in a temperature environment, the communication equipment will run slower, which will affect data transmission and further affect data throughput. This method can improve the rationality of data collection, thereby improving the rationality of monitoring the solder paste printer.

[0091] In addition, the method further comprises:

[0092] Setting a threshold value of an information collection interval within a unit time, obtaining a real-time information collection interval within a unit time, and determining whether the real-time information collection interval within a unit time is greater than the threshold value of the information collection interval within the unit time;

[0093] When the real-time information collection interval within the unit time is not greater than the information collection interval threshold within the unit time, the real-time information collection interval within the unit time is maintained for data collection;

[0094] When the real-time information collection interval within the unit time is greater than the information collection interval threshold within the unit time, the information collection interval difference is calculated according to the real-time information collection interval within the unit time and the information collection interval threshold within the unit time;

[0095] Acquire the real-time number of sensors, the amount of information collected by a single server within a unit time, and the real-time server data, and calculate the excess information collection amount difference based on the information collection interval difference, the real-time number of sensors, the amount of information collected by a single server within a unit time, and the real-time server data;

[0096] The number of servers that need to be added is calculated according to the excess difference in the amount of information collected, and the real-time servers are expanded according to the number of servers that need to be added.

[0097] It should be noted that as the number of sensors increases, the amount of information collected per unit time will increase. This method can further improve the rationality of data collection.

[0098] like Figure 3 As shown, the second aspect of the present invention provides a real-time status monitoring and analysis system 4 for a solder paste printer, comprising a memory 41 and a processor 42. The memory 41 comprises a real-time status monitoring and analysis method program for a solder paste printer. When the real-time status monitoring and analysis method program for a solder paste printer is executed by the processor 42, any step of the real-time status monitoring and analysis method for a solder paste printer is implemented.

[0099] like Figure 4 As shown, the third aspect of the present invention provides an electronic device, including:

[0100] The data throughput acquisition module 10 is responsible for installing a number of sensors in each solder paste printer, constructing a solder paste printer IoT monitoring platform, and obtaining the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within a preset time;

[0101] The trusted data analysis and acquisition module 20 is responsible for obtaining trusted sensor data or untrusted sensor data by evaluating the data throughput when the solder paste printer IoT monitoring platform transmits data with each solder paste printer within a preset time;

[0102] The state tracking module 30 is responsible for obtaining the content data information of the credible sensor data, and constructing a solder paste printer data tracking model according to the content data information of the credible sensor data, and tracking the real-time state of the solder paste printer through the solder paste printer data tracking model;

[0103] The early warning module 40 is responsible for obtaining the real-time status information of the solder paste printer by tracking, and issuing a real-time early warning based on the real-time status information of the solder paste printer.

[0104] Furthermore, in this device, several sensors are installed in each solder paste printer to build a solder paste printer IoT monitoring platform, specifically:

[0105] Install several sensors and arrange communication equipment in each solder paste printer, build a solder paste printer IoT monitoring platform, initialize the information collection interval within a unit time, and set the upper threshold of the information collection amount of the solder paste printer IoT monitoring platform;

[0106] Obtain the number of sensors and the amount of information transmitted by the sensors when transmitting information once, and calculate the total amount of information collected when the sensors communicate with the solder paste printer Internet of Things monitoring platform based on the amount of information transmitted by the sensors when transmitting information once, the number of sensors, and the information collection interval within a unit time;

[0107] When the total amount of information collected when the sensor communicates with the solder paste printer IoT monitoring platform is greater than the upper threshold of the amount of information collected by the solder paste printer IoT monitoring platform, the information collection interval within the unit time is readjusted;

[0108] When the total amount of information collected when the sensor communicates with the solder paste printer Internet of Things monitoring platform is not greater than the upper threshold of the information collection amount of the solder paste printer Internet of Things monitoring platform, the information collection interval within the unit time is output, and the construction of the solder paste printer Internet of Things monitoring platform is completed.

[0109] Furthermore, in this device, by evaluating the data throughput when the solder paste printer IoT monitoring platform transmits data with each solder paste printer within a preset time, reliable sensor data or unreliable sensor data is obtained, specifically:

[0110] Set a data throughput threshold, and determine whether the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within a preset time is greater than the data throughput threshold;

[0111] When the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within the preset time is greater than the data throughput threshold, the data collected during the corresponding period is used as the credible sensor data;

[0112] When the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within the preset time is not greater than the data throughput threshold, the data collected during the corresponding period is regarded as unreliable sensor data;

[0113] Untrusted sensor data is discarded and trusted sensor data is output.

[0114] Furthermore, in this device, the content data information of the trusted sensor data is obtained, and a solder paste printer data tracking model is constructed according to the content data information of the trusted sensor data, specifically:

[0115] A data tracking model for solder paste printers is constructed based on a multi-layer perceptual neural network. Each type of data in the content data information of the trusted sensor data is used as a node, and the nodes are connected through wireless description relationships to form a topological structure diagram.

[0116] Set the learning rate, the mean square error of the stopping condition, the maximum number of training neurons, and the sine function as the activation function as training parameters;

[0117] The topological structure graph is used as a training project, the training project is input into the input layer, and the attention mechanism is introduced into the hidden layer, and the attention is focused on the nodes in the topological structure graph through the attention mechanism;

[0118] The solder paste printer data tracking model is trained based on the training parameters. When the training parameters reach the mean square error of the stopping condition, the solder paste printer data tracking model training is completed.

[0119] Furthermore, in this device, the real-time status information of the solder paste printer is obtained by tracking, and a real-time warning is performed based on the real-time status information of the solder paste printer, specifically:

[0120] By tracking and acquiring the real-time status information of the solder paste printer, and setting the real-time status threshold range of the solder paste printer, it is determined whether the real-time status information of the solder paste printer is within the real-time status threshold range of the solder paste printer;

[0121] When the real-time status information of the solder paste printer is within the real-time status threshold range of the solder paste printer, normal status information is generated and displayed in a preset manner;

[0122] When the real-time status information of the solder paste printer is not within the real-time status threshold range of the solder paste printer, abnormal status information is generated, and the location of the solder paste printer corresponding to the abnormal status information is obtained;

[0123] A real-time warning is issued based on the location of the solder paste printer corresponding to the abnormal status information, and displayed in a preset manner.

[0124] Furthermore, in the present device, the real-time status monitoring and analysis method of the solder paste printer also includes:

[0125] Obtain the solder paste printer corresponding to the abnormal status information, count the solder paste printers corresponding to the abnormal status information, classify them according to the type of abnormal condition, and obtain the abnormal condition type of each solder paste printer;

[0126] By sorting the maintenance priority of the abnormal situation types of the solder paste printer, obtaining the maintenance priority sorting results, and obtaining the real-time status information of the maintenance staff;

[0127] According to the real-time status information of the maintenance staff, the maintenance allocation is optimized according to the maintenance priority sorting results, and the priority maintenance allocation results are generated and displayed in a preset manner.

[0128] The fourth aspect of the present invention provides a computer-readable storage medium, which includes a real-time status monitoring and analysis method program for a solder paste printer. When the real-time status monitoring and analysis method program for a solder paste printer is executed by a processor, any step of the real-time status monitoring and analysis method for a solder paste printer is implemented.

[0129] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0130] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units; they may be located in one place or distributed on multiple network units; some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0131] In addition, all functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately used as a unit, or two or more units may be integrated into one unit; the above-mentioned integrated units may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0132] A person of ordinary skill in the art can understand that: all or part of the steps of implementing the above method embodiment can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above method embodiment; and the aforementioned storage medium includes: a mobile storage device, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and other media that can store program codes.

[0133] Alternatively, if the above-mentioned integrated unit of the present invention is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present invention can be essentially or partly reflected in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the methods of each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROM, RAM, magnetic disks or optical disks.

[0134] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A real-time status monitoring and analysis method for a solder paste printer, characterized in that: The following steps are involved: Install a number of sensors in each solder paste printer, build a solder paste printer Internet of Things monitoring platform, and obtain the data throughput when the solder paste printer Internet of Things monitoring platform transmits data with each solder paste printer within a preset time; Acquire credible sensor data or untrustworthy sensor data by evaluating the data throughput when the solder paste printer Internet of Things monitoring platform transmits data with each solder paste printer within the preset time; Acquire content data information of the trusted sensor data, and construct a solder paste printer data tracking model according to the content data information of the trusted sensor data, and track the real-time status of the solder paste printer through the solder paste printer data tracking model; Acquire the real-time status information of the solder paste printer by tracking, and issue a real-time warning based on the real-time status information of the solder paste printer; Several sensors are installed in each solder paste printer to build a solder paste printer IoT monitoring platform, specifically: Install several sensors and arrange communication equipment in each solder paste printer, build a solder paste printer IoT monitoring platform, initialize the information collection interval within a unit time, and set the upper threshold of the information collection amount of the solder paste printer IoT monitoring platform; Obtain the number of sensors and the amount of information transmitted by the sensors when transmitting information once, and calculate the total amount of information collected when the sensors communicate with the solder paste printer Internet of Things monitoring platform based on the amount of information transmitted by the sensors when transmitting information once, the number of sensors, and the information collection interval within a unit time; When the total amount of information collected when the sensor communicates with the solder paste printer Internet of Things monitoring platform is greater than the upper threshold of the amount of information collected by the solder paste printer Internet of Things monitoring platform, readjust the information collection interval within the unit time; When the total amount of information collected when the sensor communicates with the solder paste printer Internet of Things monitoring platform is not greater than the upper threshold of the amount of information collected by the solder paste printer Internet of Things monitoring platform, the information collection interval within the unit time is output, and the construction of the solder paste printer Internet of Things monitoring platform is completed; By evaluating the data throughput when the solder paste printer IoT monitoring platform transmits data with each solder paste printer within the preset time, credible sensor data or untrustworthy sensor data is obtained, specifically: Setting a data throughput threshold, and determining whether the data throughput during data transmission between the solder paste printer IoT monitoring platform and each solder paste printer within the preset time is greater than the data throughput threshold; When the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within the preset time is greater than the data throughput threshold, the data collected during the corresponding period is used as credible sensor data; When the data throughput of the solder paste printer IoT monitoring platform and each solder paste printer during data transmission within the preset time is not greater than the data throughput threshold, the data collected during the corresponding period is regarded as unreliable sensor data; Eliminating the untrusted sensor data and outputting the trusted sensor data; Acquiring the content data information of the trusted sensor data, and building a solder paste printer data tracking model according to the content data information of the trusted sensor data, specifically: A solder paste printer data tracking model is constructed based on a multi-layer perceptual neural network, and each type of data in the content data information of the trusted sensor data is used as a node, and the nodes are connected through wireless description relationships to form a topological structure diagram; Set the learning rate, the mean square error of the stopping condition, the maximum number of training neurons, and the sine function as the activation function as training parameters; The topological structure diagram is used as a training item, the training item is input into an input layer, an attention mechanism is introduced into a hidden layer, and attention is focused on nodes in the topological structure diagram through the attention mechanism; The solder paste printer data tracking model is trained based on the training parameters, and when the training parameters reach the mean square error of the stop condition, the solder paste printer data tracking model training is completed.

2. The real-time status monitoring and analysis method of a solder paste printer according to claim 1, characterized in that: The real-time status information of the solder paste printer is obtained by tracking, and a real-time warning is performed based on the real-time status information of the solder paste printer, specifically: By tracking and acquiring the real-time status information of the solder paste printer and setting the real-time status threshold range of the solder paste printer, it is determined whether the real-time status information of the solder paste printer is within the real-time status threshold range of the solder paste printer; When the real-time status information of the solder paste printer is within the real-time status threshold range of the solder paste printer, normal status information is generated, and the normal status information is displayed in a preset manner; When the real-time status information of the solder paste printer is not within the real-time status threshold range of the solder paste printer, abnormal status information is generated, and the location of the solder paste printer corresponding to the abnormal status information is obtained; A real-time warning is issued according to the location of the solder paste printer corresponding to the abnormal status information, and displayed in a preset manner.

3. The real-time status monitoring and analysis method of a solder paste printer according to claim 1, characterized in that: Also includes: Obtain the solder paste printer corresponding to the abnormal status information, count the solder paste printers corresponding to the abnormal status information, classify them according to the type of abnormal condition, and obtain the abnormal condition type of each solder paste printer; By sorting the maintenance priority of the abnormal situation types of the solder paste printer, obtaining the maintenance priority sorting result, and obtaining the real-time status information of the maintenance staff; According to the real-time status information of the maintenance staff, optimized maintenance allocation is performed according to the maintenance priority sorting result, and a priority maintenance allocation result is generated and displayed in a preset manner.

4. Real-time status monitoring and analysis system of solder paste printer, characterized in that: It comprises a memory and a processor, wherein the memory comprises a real-time status monitoring and analysis method program of a solder paste printer, and when the real-time status monitoring and analysis method program of the solder paste printer is executed by the processor, the steps of the real-time status monitoring and analysis method of the solder paste printer as described in any one of claims 1 to 3 are implemented.

5. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a real-time status monitoring and analysis method program for a solder paste printer. When the real-time status monitoring and analysis method program for a solder paste printer is executed by a processor, the steps of the real-time status monitoring and analysis method for a solder paste printer as described in any one of claims 1-3 are implemented.

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