Chip cooling device

Abstract

The present invention relates to the field of chip heat dissipation technology, and in particular to a chip heat dissipation device, comprising a base, wherein two relatively distributed side walls of the base are each provided with a plurality of vents, the inner wall of the base is rotatably connected with symmetrically distributed rotating rods, the ends of the rotating rods are each fixed with fan blades, the interior of the placement groove is provided with symmetrically distributed brush plates for cleaning the bottom of the chip, the brush plates are connected by fixed rods, and one of the brush plates is connected to the rotating rod via a transmission mechanism; when the present invention dissipates heat for the chip, the fan blades are driven to rotate by the rotating rod, and the rotation of the fan blades promotes air flow, thereby ensuring the heat dissipation effect of the chip, and the rotating rod can also drive the brush plate to reciprocate at the bottom of the chip while rotating, thereby cleaning the bottom of the chip, and the cleaned dust is directly discharged from the vents along the airflow, thereby avoiding the influence of dust on the heat dissipation of the chip and improving the heat dissipation effect of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation devices, in particular to a chip heat dissipation device. Background Art

[0002] Chip is a general term for semiconductor component products. Chips are widely used in many devices such as automobiles and computers, enabling the devices to perform complex and diverse data processing. Chips usually generate a lot of heat during use, and a chip heat sink is needed to cool the chip.

[0003] In the prior art, when cooling a chip, air convection is mostly used to remove the heat from the chip surface to achieve a cooling effect. However, this cooling method causes the chip to be in contact with the outside world for a long time, and dust in the air is easily adsorbed on the chip surface, affecting the cooling effect of the chip and reducing the service life of the chip. Summary of the invention

[0004] The object of the present invention is to provide a chip heat dissipation device to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A chip heat dissipation device comprises a base, wherein two relatively distributed side walls of the base are each provided with a plurality of vents, a placement groove is provided on the top of the base, the placement groove is communicated with the interior of the base, wherein a step for supporting the chip is provided on the inner wall of the placement groove, a symmetrically distributed rotating rod is rotatably connected to the inner wall of the base, the rotating rod is connected to a rotating mechanism, the rotating mechanism is used to drive the rotating rod to rotate synchronously, fan blades are fixed to the ends of the rotating rods, symmetrically distributed brush plates for cleaning the bottom of the chip are provided inside the placement groove, the brush plates are connected by a fixing rod, one of the brush plates is connected to the rotating rod by a transmission mechanism, the transmission mechanism is used to drive the brush plate to reciprocate, and the other brush plate is connected to a self-locking mechanism, the self-locking mechanism is used to fix the brush plate, so that the transmission mechanism cannot drive the brush plate to reciprocate.

[0007] Preferably: the rotating mechanism includes a motor fixed to the outside of the base, wherein one of the rotating rods passes through the side wall of the base and is fixedly connected to the output end of the motor, and pulleys are fixed to the outside of the rotating rods, and the pulleys are connected by belt transmission.

[0008] Preferably: the transmission mechanism includes a push plate arranged inside the base, the push plate is fixed with symmetrically distributed sliding rods, the sliding rods pass through the base and extend into the placement groove and are fixedly connected to one of the brush plates, the side wall of the push plate is fixed with symmetrically distributed first elastic components, the other end of the first elastic component is fixedly connected to the inner wall of the base, the rotating rod is connected with an extrusion assembly, and the extrusion assembly is used to extrude the push plate.

[0009] Preferably: the extrusion assembly includes a first bevel gear fixed to the outside of the rotating rod, the first bevel gear is meshed with a second bevel gear, the second bevel gear is fixed with a transmission rod, the transmission rod is rotatably connected to the top of the base, and an extrusion plate for extruding the push plate is fixed to the outside of the transmission rod.

[0010] Preferably: the self-locking mechanism includes a slide plate fixedly connected to the brush plate, the slide plate passes through the side wall of the base and is slidably connected to the side wall of the base, a slide groove is provided inside the side wall of the base, a card block is slidably connected inside the slide groove, one end of the card block is connected to the side wall of the slide plate, and the other end of the card block is fixedly connected to the inner wall of the card groove through a second elastic component, and a card groove adapted to the card block is provided on the surface of the slide plate, wherein the card block is connected to a traction assembly, and the traction assembly is used to pull the card block so that the card block cannot enter the inside of the card groove.

[0011] Preferably: the traction assembly includes a wire groove arranged on the inner wall of the slide groove, the wire groove passes through the base, the block is fixed with a traction rope, the traction rope passes through the inside of the wire groove, the end of the traction rope is fixed with a fixing column, and the outer wall of the base is provided with a fixing groove adapted to the fixing column.

[0012] Preferably, a flow guide seat is fixed to the inner bottom of the base, and the side wall of the flow guide seat is inclined upward toward the direction of the placement groove.

[0013] Compared with the prior art, the invention has the following beneficial effects: when the chip is cooled, the fan blades are driven to rotate by the rotating rod, and the air flow is promoted by the rotation of the fan blades, thereby ensuring the cooling effect of the chip. Moreover, the rotating rod can also drive the brush plate to reciprocate at the bottom of the chip while rotating, thereby cleaning the bottom of the chip. The cleaned dust is directly discharged from the vent along the air flow, thereby avoiding the influence of dust on the cooling of the chip and improving the cooling effect of the chip.

[0014] The present invention pulls out the fixing column from the fixing groove when there is less dust at the bottom of the chip, so that the traction rope no longer pulls the card block, and when the brush plate moves to the extreme position, the card block automatically enters the card groove, thereby fixing the slide plate, so that the brush plate cannot be reset. At this time, no matter how the rotating rod rotates, it cannot drive the brush plate to reciprocate, which can avoid damage to the bottom of the chip caused by the long-term reciprocating motion of the brush plate, effectively protects the chip, and increases the service life of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the external structure of the base in an embodiment of the present invention.

[0016] Figure 2 Schematic diagram of the internal structure of the base in an embodiment of the present invention.

[0017] Figure 3 Schematic diagram of the fan blade connection structure in an embodiment of the present invention.

[0018] Figure 4 It is a cross-sectional view of the card block connection structure in an embodiment of the present invention.

[0019] In the figure: 1-chip; 2-base; 3-rotating mechanism; 31-belt; 32-pulley; 33-motor; 4-transmission mechanism; 41-slide rod; 42-first elastic component; 43-push plate; 44-first bevel gear; 45-second bevel gear; 46-extrusion plate; 47-transmission rod; 5-self-locking mechanism; 51-slide plate; 52-slot; 53-block; 54-second elastic component; 55-slide groove; 56-wire groove; 57-traction rope; 58-fixed column; 59-fixed groove; 6-step; 7-vent; 8-brush plate; 9-fixed rod; 10-placement groove; 11-fan blade; 12-rotating rod; 13-guide seat. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0021] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0022] In one embodiment, see Figure 1 , Figure 2 and Figure 3, a chip heat dissipation device comprises a base 2, and a plurality of vents 7 are provided on two relatively distributed side walls of the base 2, a placement groove 10 is provided on the top of the base 2, and the placement groove 10 is communicated with the inside of the base 2, wherein a step 6 for supporting the chip 1 is provided on the inner wall of the placement groove 10, and a symmetrically distributed rotating rod 12 is rotatably connected to the inner wall of the base 2, and the rotating rod 12 is connected to a rotating mechanism 3, and the rotating mechanism 3 is used to drive the rotating rod 12 to rotate synchronously, and fan blades 11 are fixed to the ends of the rotating rod 12, and brush plates 8 that are symmetrically distributed and clean the bottom of the chip 1 are provided inside the placement groove 10, and the brush plates 8 are connected by fixing rods 9, one of the brush plates 8 is connected to the rotating rod 12 through a transmission mechanism 4, and the transmission mechanism 4 is used to drive the brush plate 8 to reciprocate, and the other brush plate 8 is connected to a self-locking mechanism 5, and the self-locking mechanism 5 is used to fix the brush plate 8, so that the transmission mechanism 4 cannot drive the brush plate 8 to reciprocate.

[0023] In this embodiment, when the device is in use, the chip 1 is placed in the placement groove 10 on the top of the base 2, and the chip 1 is supported by the step 6 inside the placement groove 10, wherein the shape of the placement groove 10 is adapted to the shape of the chip 1, and the chip 1 can be "stuck" in the placement groove 10 when in use, thereby ensuring the stability of the chip 1. Since a plurality of vents 7 are provided on the two relatively distributed side walls of the base 2, the vents 7 can play a drainage role, so that the airflow passes through the inside of the base 2. When the airflow passes through the bottom of the chip 1, part of the heat at the bottom of the chip 1 can be taken away, thereby achieving the heat dissipation effect, which can effectively avoid the influence of excessive temperature on the chip 1. When the chip 1 is used for a long time at a high temperature, the rotating rod 12 is driven to rotate by the rotating mechanism 3, and the rotating rod 12 drives the fan blades 11 to rotate. The rotation of the blades 11 can effectively increase the air flow rate, thereby improving the heat dissipation effect of the chip 1, and while the rotating rod 12 rotates, it can also drive the brush plate 8 to reciprocate at the bottom of the chip 1 through the transmission mechanism 4. While the brush plate 8 reciprocates, it can clean the bottom of the chip 1, and the cleaned dust is directly discharged from the vent 7 along the air flow, thereby avoiding the influence of dust on the heat dissipation of the chip 1, and further improving the heat dissipation effect of the chip 1. In addition, when there is less dust at the bottom of the chip 1, the brush plate 8 is fixed by the self-locking mechanism 5. At this time, no matter how the rotating rod 12 rotates, the brush plate 8 cannot be driven to reciprocate through the transmission mechanism 4, which can avoid the damage to the bottom of the chip 1 caused by the long-term reciprocating movement of the brush plate 8, which effectively protects the chip 1 and improves the service life of the chip 1.

[0024] See also Figure 2 and Figure 3The rotating mechanism 3 includes a motor 33 fixed to the outside of the base 2, one of the rotating rods 12 passes through the side wall of the base 2 and is fixedly connected to the output end of the motor 33, and a pulley 32 is fixed to the outside of the rotating rods 12, and the pulleys 32 are connected by a belt 31;

[0025] When the chip 1 is used for a long time and the temperature is high, the motor 33 is started, and the motor 33 drives one of the rotating rods 12 to rotate. On the one hand, the rotating rod 12 drives one of the fan blades 11 to rotate, and on the other hand, the other rotating rod 12 is driven to rotate through the pulley 32 and the belt 31, so that the two fan blades 11 can rotate synchronously, effectively improving the air flow rate and ensuring the heat dissipation effect of the chip 1.

[0026] See also Figure 2 The transmission mechanism 4 includes a push plate 43 arranged inside the base 2, and the push plate 43 is fixed with symmetrically distributed slide rods 41, which penetrate the base 2 and extend into the placement groove 10 and are fixedly connected to one of the brush plates 8. A symmetrically distributed first elastic component 42 is fixed on the side wall of the push plate 43, and the other end of the first elastic component 42 is fixedly connected to the inner wall of the base 2. The rotating rod 12 is connected with an extrusion component, which is used to extrude the push plate 43;

[0027] When the rotating rod 12 rotates, the push plate 43 is squeezed by the squeezing assembly. The push plate 43 drives the brush plate 8 to move at the bottom of the chip 1 through the sliding rod 41, so that the brush plate 8 can clean the bottom of the chip 1. At the same time, the push plate 43 squeezes the first elastic component 42, and the first elastic component 42 is in a compressed state. When the squeezing assembly no longer squeezes the push plate 43, the push plate 43 automatically resets under the action of the first elastic component 42, thereby driving the brush plate 8 to automatically reset. This cycle is repeated, so that the brush plate 8 can reciprocate at the bottom of the chip 1, thereby cleaning the bottom of the chip 1, avoiding the influence of dust on the heat dissipation of the chip 1, and ensuring the heat dissipation effect of the chip 1, wherein the first elastic component 42 can be a spring.

[0028] See also Figure 3 The extrusion assembly includes a first bevel gear 44 fixed to the outside of the rotating rod 12, the first bevel gear 44 is meshed with a second bevel gear 45, the second bevel gear 45 is fixed with a transmission rod 47, the transmission rod 47 is rotatably connected to the top of the base 2, and the outside of the transmission rod 47 is fixed with an extrusion plate 46 for extruding the push plate 43;

[0029] When the rotating rod 12 rotates, it drives the first bevel gear 44 to rotate, and the engagement of the first bevel gear 44 and the second bevel gear 45 drives the transmission rod 47 to rotate, and the transmission rod 47 drives the extrusion plate 46 to rotate, and the extrusion plate 46 squeezes the push plate 43, so that the brush plate 8 can clean the bottom of the chip 1. When the degree of extrusion of the extrusion plate 46 on the push plate 43 is reduced, the push plate 43 is gradually reset under the action of the first elastic component 42, and then the brush plate 8 is gradually reset through the sliding rod 41.

[0030] See also Figure 2 and Figure 4 The self-locking mechanism 5 includes a slide plate 51 fixedly connected to the brush plate 8, the slide plate 51 passes through the side wall of the base 2 and is slidably connected to the side wall of the base 2, a slide groove 55 is provided inside the side wall of the base 2, a block 53 is slidably connected inside the slide groove 55, one end of the block 53 is in contact with the side wall of the slide plate 51, and the other end of the block 53 is fixedly connected to the inner wall of the slot 52 through a second elastic component 54, and a slot 52 adapted to the block 53 is provided on the surface of the slide plate 51, wherein the block 53 is connected to a traction assembly, and the traction assembly is used to pull the block 53, so that the block 53 cannot enter the slot 52;

[0031] When the rotating rod 12 rotates, the brush plate 8 is driven to reciprocate through the transmission mechanism 4, and the brush plate 8 drives the slide plate 51 to reciprocate. When there is less dust at the bottom of the chip 1 and no cleaning is required, the traction component no longer pulls the block 53, and when the transmission mechanism 4 drives the brush plate 8 to move to the extreme position, the slot 52 on the side wall of the slide plate 51 is aligned with the slide slot 55, and the block 53 automatically enters the slot 52 under the action of the second elastic component 54, thereby fixing the slide plate 51, so that the brush plate 8 cannot be reset. At this time, no matter how the rotating rod 12 rotates, The brush plate 8 cannot be driven to reciprocate by the transmission mechanism 4, which can avoid the damage to the bottom of the chip 1 caused by the long-term reciprocating movement of the brush plate 8, effectively protects the chip 1, and improves the service life of the chip 1. When the bottom of the chip 1 needs to be cleaned, the block 53 is pulled into the slide groove 55 by the traction assembly, so that the block 53 cannot enter the slot 52. The limit of the block 53 is lost, and the slide plate 51 is automatically reset, so that the transmission mechanism 4 can drive the brush plate 8 to reciprocate, wherein the second elastic component 54 can be a spring.

[0032] See also Figure 4 The traction assembly includes a wire groove 56 arranged on the inner wall of the slide groove 55, the wire groove 56 passes through the base 2, the block 53 is fixed with a traction rope 57, the traction rope 57 passes through the inside of the wire groove 56, the end of the traction rope 57 is fixed with a fixing column 58, and the outer wall of the base 2 is provided with a fixing groove 59 adapted to the fixing column 58;

[0033] When it is necessary to clean the bottom of the chip 1, the fixing column 58 is inserted into the fixing groove 59, wherein the fixing column 58 can be in an "L" shape. During the process of the fixing column 58 being inserted into the fixing groove 59, the block 53 is pulled by the traction rope 57, so that the block 53 is pulled into the slide groove 55, so that the block 53 cannot enter the slot 52. Without the limit of the block 53, the slide plate 51 automatically resets, so that the transmission mechanism 4 can drive the brush plate 8 to reciprocate. When there is less dust at the bottom of the chip 1 and no cleaning is required, the fixing column 58 is pulled out from the fixing groove 59, so that the traction rope 57 no longer pulls the block 53, so that the block 53 can enter the slot 52 under the action of the second elastic component 54.

[0034] See also Figure 2 A flow guide seat 13 is fixed to the bottom of the base 2, and the side wall of the flow guide seat 13 is inclined upward toward the placement groove 10;

[0035] The arrangement of the air guide seat 13 allows the airflow entering the base 2 to move toward the bottom of the chip 1 , thereby ensuring the heat dissipation effect on the chip 1 .

[0036] Working principle: When the device is in use, the chip 1 is placed in the placement groove 10 on the top of the base 2, and the chip 1 is supported by the step 6 inside the placement groove 10. When the chip 1 is used for a long time and the temperature is high, the motor 33 is started, and the motor 33 drives the fan blade 11 to rotate through the rotating rod 12. The rotation of the fan blade 11 can effectively increase the air flow rate, thereby improving the heat dissipation effect of the chip 1, and the rotation of the rotating rod 12 also drives the first bevel gear 44 to rotate, and the meshing of the first bevel gear 44 and the second bevel gear 45 drives the transmission rod 47 to rotate, and the transmission rod 4 7 drives the squeezing plate 46 to rotate, and the squeezing plate 46 squeezes the push plate 43, so that the brush plate 8 can clean the bottom of the chip 1. When the squeezing degree of the squeezing plate 46 on the push plate 43 is reduced, the push plate 43 is gradually reset under the action of the first elastic component 42, and then the brush plate 8 is driven to gradually reset through the sliding rod 41. This cycle is repeated, so that the brush plate 8 can reciprocate at the bottom of the chip 1, thereby cleaning the bottom of the chip 1, avoiding the influence of dust on the heat dissipation of the chip 1, and ensuring the heat dissipation effect of the chip 1. When there is less dust at the bottom of the chip 1, it is not necessary When cleaning, the fixing column 58 is pulled out from the fixing groove 59, so that the traction rope 57 no longer pulls the block 53, and when the brush plate 8 moves to the limit position, the groove 52 on the side wall of the slide plate 51 is aligned with the slide groove 55, and the block 53 automatically enters the groove 52 under the action of the second elastic component 54, thereby fixing the slide plate 51, so that the brush plate 8 cannot be reset. At this time, no matter how the rotating rod 12 rotates, the squeezing plate 46 cannot squeeze the push plate 43, which can avoid the damage to the bottom of the chip 1 caused by the long-term reciprocating motion of the brush plate 8. The chip 1 plays an effective protective role and improves the service life of the chip 1. When the bottom of the chip 1 needs to be cleaned, the fixing column 58 is inserted into the fixing groove 59. During the process of the fixing column 58 being inserted into the fixing groove 59, the block 53 is pulled by the traction rope 57, so that the block 53 is pulled into the slide groove 55, so that the block 53 cannot enter the slot 52. Without the limit of the block 53, the slide plate 51 automatically resets, so that the extrusion plate 46 can squeeze the push plate 43, so that the brush plate 8 can reciprocate to clean the bottom of the chip 1.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip heat dissipation device, comprising a base; characterized in that: The two relatively distributed side walls of the base are provided with a plurality of ventilation holes, the top of the base is provided with a placement groove, the placement groove is communicated with the inside of the base, wherein the inner wall of the placement groove is provided with a step for supporting the chip, the inner wall of the base is rotatably connected with a symmetrically distributed rotating rod, the rotating rod is connected with a rotating mechanism, the rotating mechanism is used to drive the rotating rod to rotate synchronously, the ends of the rotating rods are fixed with fan blades, the inside of the placement groove is provided with a symmetrically distributed brush plate for cleaning the bottom of the chip, the brush plates are connected by a fixing rod, one of the brush plates is connected to the rotating rod by a transmission mechanism, the transmission mechanism is used to drive the brush plate to reciprocate, the other brush plate is connected with a self-locking mechanism, the self-locking mechanism is used to fix the brush plate, so that the transmission mechanism cannot drive the brush plate to reciprocate; The transmission mechanism includes a push plate arranged inside the base, the push plate is fixed with symmetrically distributed sliding rods, the sliding rods penetrate the base and extend into the placement groove and are fixedly connected to one of the brush plates, a symmetrically distributed first elastic component is fixed on the side wall of the push plate, the other end of the first elastic component is fixedly connected to the inner wall of the base, and the rotating rod is connected with an extrusion assembly, which is used to extrude the push plate; The extrusion assembly includes a first bevel gear fixed on the outside of the rotating rod, the first bevel gear is meshed with a second bevel gear, the second bevel gear is fixed with a transmission rod, the transmission rod is rotatably connected to the top of the base, and an extrusion plate for extruding the push plate is fixed on the outside of the transmission rod.

2. A chip heat dissipation device according to claim 1, characterized in that: The rotating mechanism includes a motor fixed on the outside of the base, wherein one of the rotating rods passes through the side wall of the base and is fixedly connected to the output end of the motor, and pulleys are fixed on the outside of the rotating rods, and the pulleys are connected by belt transmission.

3. A chip heat dissipation device according to claim 1, characterized in that: The self-locking mechanism includes a slide plate fixedly connected to the brush plate, the slide plate passes through the side wall of the base and is slidably connected to the side wall of the base, a slide groove is provided inside the side wall of the base, a card block is slidably connected inside the slide groove, one end of the card block is connected to the side wall of the slide plate, and the other end of the card block is fixedly connected to the inner wall of the card groove through a second elastic component, a card groove matched with the card block is provided on the surface of the slide plate, wherein the card block is connected to a traction assembly, and the traction assembly is used to pull the card block so that the card block cannot enter the inside of the card groove.

4. A chip heat dissipation device according to claim 3, characterized in that: The traction assembly includes a wire groove arranged on the inner wall of the slide groove, the wire groove passes through the base, the block is fixed with a traction rope, the traction rope passes through the inside of the wire groove, the end of the traction rope is fixed with a fixing column, and the outer wall of the base is provided with a fixing groove adapted to the fixing column.

5. A chip heat dissipation device according to any one of claims 1 to 4, characterized in that: A flow guide seat is fixed on the inner bottom of the base, and the side wall of the flow guide seat is inclined upward toward the direction of the placement groove.

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