A light emitting device encapsulating an LED chip and an IC chip

Abstract

The present invention discloses a light-emitting device encapsulated with an LED chip and an IC chip, and relates to the technical field of LED lamps. The frame comprises a light-emitting device, and the inner bottom wall of the light-emitting device is fixedly connected with a connecting electric board, and the upper surface of the connecting electric board is respectively fixedly connected with the LED chip and the IC chip. This light-emitting device encapsulated with the LED chip and the IC chip can automatically lift the LED chip and the IC chip by setting a maintenance lifting unit, thereby reducing the time for manual search and positioning of the LED chip and the IC chip, so that maintenance personnel can quickly find the LED chip and the IC chip that need to be replaced and directly operate them, thereby greatly shortening the maintenance time. At the same time, there is no need to tediously disassemble surrounding components, and the LED chip and the IC chip can be quickly and accurately contacted, saving time and energy wasted due to disassembly, and reducing the possibility of chip breakage or pin bending due to uneven human force or improper operation.

Description

Technical Field

[0001] The invention relates to the technical field of LED lamps, in particular to a light emitting device encapsulated with an LED chip and an IC chip. Background Art

[0002] A light-emitting device encapsulated with an LED chip and an IC chip is a product that highly integrates light-emitting and control functions. The LED chip and the IC chip are encapsulated in a relatively small space, making the entire device compact and easy to use in various limited spaces. The IC chip can accurately adjust the light-emitting characteristics of the LED chip, including brightness, color, flashing frequency, etc. It is widely used in smart lamps, various display screens, vehicle headlights, and interior atmosphere lights.

[0003] When the light-emitting device is in use, the LED chip and the IC chip can meet the diversity of the light when in use. When the light-emitting device is in use, the IC chip and the LED chip are generally packaged first, and then the packaged IC chip and the LED chip are installed on the LED lead frame or the packaged IC chip and the LED chip are wrapped in the lead frame with packaging glue to form the LED chip and the IC chip with the light-emitting device. However, when in use, once the LED chip and the IC chip inside the light-emitting device fail, it is difficult to replace a damaged component alone due to the high integration and packaging of the chip, and since the chip is packaged inside, it is easy to touch other components during replacement, and usually the entire chip needs to be replaced, which increases the maintenance cost and is inconvenient to maintain and replace the IC chip and the LED chip of the light-emitting device.

[0004] Combining the above problems, we will find that it is difficult to avoid the above problems at the same time when using a light-emitting device encapsulated with an LED chip and an IC chip, and even if it can be solved, it needs to be solved with the cooperation of external tools, which makes it impossible to achieve the desired effect. Therefore, we propose a light-emitting device encapsulated with an LED chip and an IC chip. Summary of the invention

[0005] The object of the present invention is to provide a light emitting device encapsulated with an LED chip and an IC chip to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a light emitting device encapsulated with an LED chip and an IC chip, comprising a frame, the frame comprising a light emitting device, an inner bottom wall of the light emitting device is fixedly connected with a connecting electric board, an upper surface of the connecting electric board is respectively fixedly connected with the LED chip and the IC chip, and a maintenance-friendly structure is arranged inside the light emitting device;

[0007] The maintenance-friendly structure includes a maintenance lifting unit, which is located inside the light-emitting device and the connecting electrical board, and is used to adjust the chip position;

[0008] The maintenance-friendly structure further includes a maintenance and fixing auxiliary unit, which is located inside the light-emitting device and is used to fix the chip;

[0009] A movable adjustment mechanism is arranged on the right side of the maintenance-friendly structure. The movable adjustment mechanism is used in conjunction with the maintenance and fixing auxiliary unit, and is used to adjust the fixing position.

[0010] Preferably, the maintenance lifting unit includes two slide slot columns, the two slide slot columns are located inside the light emitting device and the connecting electrical board, the inner walls of the light emitting device and the connecting electrical board are jointly provided with a mounting hole, the bottom surface of each slide slot column is fixedly connected to the inner bottom wall of the mounting hole, the interior of each slide slot column is slidably connected to a sliding column, the inner wall of each sliding column is fixedly connected to a first telescopic spring, the interior of each sliding column is slidably connected to a limit pin, the ends of the two limit pins that are close to each other are fixedly connected to the ends of the two first telescopic springs that are far away from each other, and each The bottom end of the sliding column is fixedly connected with a second telescopic spring, the bottom end of each of the second telescopic springs is fixedly connected to the inner bottom wall of the slide slot column, the outer surface of each of the limit pins is in contact with the inner wall of the slide slot column, the interior of the light emitting device is slidably connected with two movable plates, the interior of the connecting electrical plate is slidably connected with a conduction rod, the outer surface of each movable plate is in contact with the inner wall of the conduction rod, the ends of the two conduction rods that are close to each other are in contact with the ends of the two limit pins that are away from each other, and the front and back sides of the connecting electrical plate are fixedly connected with two third telescopic springs.

[0011] Preferably, the inner bottom wall of each mounting hole is fixedly connected to a support frame, and the inner wall of each support frame is in contact with the outer surface of the conduction rod.

[0012] Preferably, one end of each group of the third telescopic springs that is away from each other is fixedly connected to two connecting plates, and one side of each group of the connecting plates that is close to each other is fixedly connected to the outer surface of the conduction rod.

[0013] Preferably, the maintenance and fixing auxiliary unit includes two fixing frames, both of which are located above the connecting electrical board, the right side surface of each of the fixing frames is fixedly connected to a rotating frame, the interior of each of the fixing frames is slidably connected to two groups of guide columns, the bottom end of each group of guide columns is fixedly connected to a slide plate, the inner wall of each of the fixing frames is threadedly connected to a threaded rod, the bottom end of each of the threaded rods is fixedly connected to a first rotating bearing, the bottom surface of each of the outer rings of the first rotating bearings is fixedly connected to the upper surface of the slide plate, and the interior of each of the slide plates is slidably connected to two sliding plates.

[0014] Preferably, the upper surface of each threaded rod is fixedly connected to a rotating ring, and the outer surface of each rotating ring is provided with anti-slip openings arranged at equal distances.

[0015] Preferably, the bottom surface of each sliding plate is fixedly connected to two connecting blocks, and the bottom surface of each connecting block is fixedly connected to a protective pad.

[0016] Preferably, the movable adjustment mechanism includes two sliding slot frames, the bottom surfaces of the two sliding slot frames are in contact with the upper surface of the connecting electric board, the interior of each sliding slot frame is slidably connected with a lead screw nut block, the inner wall of each sliding slot frame is rotatably connected with a lead lever, the outer surface of each lead lever is threadedly connected to the inner wall of the lead screw nut block, the upper surface of each lead screw nut block is fixedly connected with a threaded tube, the interior of each threaded tube is threadedly connected with a threaded column, the outer surface of each threaded column is fixedly connected with a second rotating bearing, the outer surface of each outer ring of the second rotating bearing is fixedly connected with a telescopic slot plate, the interior of each telescopic slot plate is slidably connected with a telescopic plate, and the inner wall of each telescopic plate is rotatably connected to the outer surface of the rotating frame.

[0017] Preferably, two groups of fixed pins are arranged above each of the sliding slot frames, and the bottom end of each group of fixed pins passes through the sliding slot frame and extends to the inside of the connection board.

[0018] Preferably, the top end of each threaded column is fixedly connected to a twisting column, and the upper surface of each twisting column is provided with a twisting hole.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention can automatically lift the LED chip and the IC chip by setting a maintenance lifting unit, so that the LED chip and the IC chip can be easily replaced and maintained, reducing the time for manual search and positioning of the LED chip and the IC chip. The maintenance personnel can quickly find the LED chip and the IC chip that need to be replaced and directly operate, thereby greatly shortening the maintenance time. At the same time, there is no need to tediously disassemble the surrounding components, and the LED chip and the IC chip can be quickly and accurately contacted, saving time and energy wasted due to disassembly, and reducing the possibility of chip breakage or pin bending due to uneven human force or improper operation, avoiding accidental contact and damage to the chip and the surrounding circuits caused by manual operation.

[0021] 2. The present invention can conveniently fix the LED chip and the IC chip by setting a maintenance and fixing auxiliary unit, ensuring that the LED chip and the IC chip will not be displaced due to factors such as vibration, impact or temperature change during the operation of the equipment. At the same time, when maintenance or upgrading of the LED chip and the IC chip is required, they can be easily disassembled and reinstalled, and faulty LED chips and IC chips can be quickly replaced, shortening the maintenance time.

[0022] 3. The present invention can drive the maintenance and fixing auxiliary unit to move and adjust its position by setting a moving and adjusting mechanism, so that it can be adjusted according to the size and position of the LED chip and the IC chip, thereby improving the convenience of fixing the maintenance and fixing auxiliary unit. When disassembling and maintaining the LED chip and the IC chip, the maintenance and fixing auxiliary unit can be moved to a position away from the LED chip and the IC chip, thereby further improving the convenience of maintenance and replacement of the LED chip and the IC chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 is a cross-sectional view of a light emitting device of the present invention;

[0025] Figure 3 It is a structural schematic diagram of the mounting hole of the present invention;

[0026] Figure 4 It is a structural schematic diagram of the conduction rod of the present invention;

[0027] Figure 5 is a schematic structural diagram of a third telescopic spring of the present invention;

[0028] Figure 6 It is a rear view schematic diagram of the support frame of the present invention;

[0029] Figure 7 It is a structural schematic diagram of the sliding column of the present invention;

[0030] Figure 8 It is a structural schematic diagram of the limit pin of the present invention;

[0031] Fig. 9 The structural schematic diagram of the fixing frame of the present invention is

[0032] Fig.10 It is a structural schematic diagram of the threaded rod of the present invention;

[0033] Fig.11 It is a structural schematic diagram of the sliding plate of the present invention;

[0034] Fig.12 is a bottom view of the protective pad of the present invention;

[0035] Fig.13 It is a structural schematic diagram of the sliding slot frame of the present invention;

[0036] Fig.14 is a schematic structural diagram of a second rotary bearing of the present invention;

[0037] Fig.15 It is a schematic structural diagram of the threaded column of the present invention.

[0038] In the figure: 1, frame; 11, light emitting device; 12, connecting board; 13, LED chip; 14, IC chip; 2, easy maintenance structure; 21, maintenance lifting unit; 2101, slide column; 2102, moving plate; 2103, mounting hole; 2104, sliding column; 2105, conduction rod; 2106, third telescopic spring; 2107, connecting plate; 2108, support frame; 2109, second telescopic spring; 2110, limit pin; 2111, first telescopic spring; 22, maintenance fixing auxiliary unit; 2201, fixing frame; 2202 , slide plate; 2203, first rotating bearing; 2204, threaded rod; 2205, sliding plate; 2206, rotating frame; 2207, rotating ring; 2208, anti-slip mouth; 2209, guide column; 2210, protective pad; 2211, connecting block; 3, movable adjustment mechanism; 301, sliding slot frame; 302, threaded pipe; 303, threaded column; 304, second rotating bearing; 305, twisting column; 306, twisting hole; 307, telescopic slot plate; 308, telescopic plate; 309, wire lever; 310, screw nut block; 311, fixed pin shaft. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] Example 1: Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The present invention provides a technical solution: a light-emitting device encapsulated with an LED chip and an IC chip, comprising a frame 1, the frame 1 comprising a light-emitting device 11, the inner bottom wall of the light-emitting device 11 is fixedly connected with a connecting board 12, the upper surface of the connecting board 12 is respectively fixedly connected with an LED chip 13 and an IC chip 14, and the interior of the light-emitting device 11 is provided with a maintenance-friendly structure 2;

[0041] The maintenance-friendly structure 2 comprises a maintenance lifting unit 21 , which is located inside the light-emitting device 11 and the connecting board 12 , and is used to adjust the chip position.

[0042] As a further limitation of the present invention for facilitating the maintenance of the structure 2, the maintenance lifting unit 21 includes two slide slot columns 2101, the two slide slot columns 2101 are located inside the light emitting device 11 and the connecting board 12, the inner walls of the light emitting device 11 and the connecting board 12 are jointly provided with a mounting hole 2103, the bottom surface of each slide slot column 2101 is fixedly connected to the inner bottom wall of the mounting hole 2103, the interior of each slide slot column 2101 is slidably connected to a sliding column 2104, the inner wall of each sliding column 2104 is fixedly connected to a first telescopic spring 2111, and each sliding column 2 The interior of 104 is slidably connected to the limit pin 2110, and the ends of the two limit pins 2110 that are close to each other are fixedly connected to the ends of the two first telescopic springs 2111 that are away from each other. The bottom end of each sliding column 2104 is fixedly connected to the second telescopic spring 2109, and the bottom end of each second telescopic spring 2109 is fixedly connected to the inner bottom wall of the slide column 2101. The outer surface of each limit pin 2110 is in contact with the inner wall of the slide column 2101. The interior of the light emitting device 11 is slidably connected to two moving plates 2102, and the interior of the connecting plate 12 is slidably connected to the two moving plates 2102. The LED chip 13 and the IC chip 14 are automatically connected to each other, and the outer surface of each movable plate 2102 is in contact with the inner wall of the conduction rod 2105. The ends of the two conduction rods 2105 that are close to each other are in contact with the ends of the two limit pins 2110 that are away from each other. The front and back of the connecting plate 12 are fixedly connected with two third telescopic springs 2106. By setting the maintenance lifting unit 21, the LED chip 13 and the IC chip 14 can be automatically lifted, so that the LED chip 13 and the IC chip 14 can be easily replaced and maintained, which reduces the manual search and positioning of the LED chip 13 and the IC chip 14. The maintenance personnel can quickly find the LED chip 13 and IC chip 14 that need to be replaced and directly operate them, thereby greatly shortening the maintenance time. At the same time, there is no need to tediously disassemble the surrounding components, and the LED chip 13 and IC chip 14 can be quickly and accurately contacted, saving the time and energy wasted due to disassembly. The automatic lifting process is stable and controllable, reducing the possibility of chip breakage or pin bending due to uneven human force or improper operation, and avoiding accidental contact and damage to the chip and surrounding circuits caused by manual operation;

[0043] The inner bottom wall of each mounting hole 2103 is fixedly connected with a support frame 2108, and the inner wall of each support frame 2108 is in contact with the outer surface of the conduction rod 2105. The support frame 2108 can be fixed in the mounting hole 2103, and the conduction rod 2105 is connected through the support frame 2108, so that the conduction rod 2105 can have stability;

[0044] The ends of each group of third telescopic springs 2106 that are away from each other are fixedly connected to two connecting plates 2107, and the side surfaces of each group of connecting plates 2107 that are close to each other are fixedly connected to the outer surface of the conduction rod 2105. The connecting plates 2107 are fixed on the third telescopic springs 2106 and fixed to the conduction rod 2105, so that the third telescopic springs 2106 can transmit force to the conduction rod 2105.

[0045] The specific implementation of this embodiment is as follows: when the LED chip 13 and the IC chip 14 need to be installed on the connecting board 12, the chips are placed at the designated position, and the LED chip 13 and the IC chip 14 are brought into contact with the sliding column 2104, and force is applied to the LED chip 13 and the IC chip 14, so that the LED chip 13 and the IC chip 14 and the sliding column 2104 press the second telescopic spring 2109 and slide into the inside of the slide column 2101. When the limit pin 2110 contacts the slide column 2101, the limit pin 2110 squeezes the first telescopic spring 2111 and slides into the inside of the slide column 2104. When the limit pin 2110 When it moves to the opening of the slide column 2101, it is subjected to the elastic force of the first telescopic spring 2111, so that the limiting pin 2110 slides to the outside of the slide column 2101 and contacts the conductive rod 2105, thereby limiting the slide column 2104, and at the same time connecting the LED chip 13 and the IC chip 14 to the connecting board 12 for use. When the LED chip 13 and the IC chip 14 are used, they are damaged due to long-term use and immersion of high-temperature dust. If one of them is damaged or needs to be disassembled for maintenance, the LED chip 13 and the IC chip 14 are unsoldered by external special welding equipment, and then the moving plate 2102 is moved downward using a tool. The movement and structure of the moving plate 2102 push the transmission rod 2105 to move, and the movement of the transmission rod 2105 pushes the connecting plate 2107 to squeeze the third telescopic spring 2106. At the same time, the movement of the transmission rod 2105 can push the limit pin 2110 to slide inside the sliding column 2104. When the limit pin 2110 and the slide groove column 2101 are not in contact, the sliding column 2104 is pushed upward by the elastic force of the second telescopic spring 2109, so that the sliding column 2104 lifts the LED chip 13 and the IC chip 14 and moves upward. The second telescopic spring 2109 is fixed to the sliding column 2104 and its own telescopic spring 2109. The long fixed length allows the sliding column 2104 to slide upward in the slide groove column 2101 without sliding out, thereby lifting the LED chip 13 and the IC chip 14 through the upward sliding of the sliding column 2104. Through the lifting of the LED chip 13 and the IC chip 14, the staff can easily find the LED chip 13 and the IC chip 14, and perform maintenance or replacement, thereby reducing the time for manual search and positioning of the LED chip and the IC chip. When the movable plate 2102 is not subjected to force, the elastic force of the third telescopic spring 2106 returns the connecting plate 2107, the conduction rod 2105 and the movable plate 2102 to their original positions.

[0046] Example 2: Please refer to Figure 1 , Figure 2 , Figure 3 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 and Fig.13 The present invention provides a technical solution: a light-emitting device encapsulated with an LED chip and an IC chip. The present invention makes corresponding improvements to the technical problems mentioned in the background technology.

[0047] As a further limitation of the maintenance-facilitating structure 2 of the present invention, the maintenance-facilitating structure 2 further includes a maintenance-fixing auxiliary unit 22, the maintenance-fixing auxiliary unit 22 is located inside the light-emitting device 11, and the maintenance-fixing auxiliary unit 22 is used to fix the chip;

[0048] The maintenance and fixing auxiliary unit 22 includes two fixing frames 2201, both of which are located above the connection board 12, and the right side of each fixing frame 2201 is fixedly connected to a rotating frame 2206, and the interior of each fixing frame 2201 is slidably connected to two groups of guide pillars 2209, and the bottom end of each group of guide pillars 2209 is fixedly connected to a slide plate 2202, and the inner wall of each fixing frame 2201 is threadedly connected to a threaded rod 2204, and the bottom end of each threaded rod 2204 is fixedly connected to a first rotating bearing 2203, and the bottom surface of the outer ring of each first rotating bearing 2203 is connected to the bottom of the outer ring of each first rotating bearing 2203. The upper surface of the slide plate 2202 is fixedly connected, and two slide plates 2205 are slidably connected inside each slide plate 2202. By setting the maintenance fixing auxiliary unit 22, the LED chip 13 and the IC chip 14 can be conveniently fixed to ensure that the LED chip 13 and the IC chip 14 will not be displaced due to factors such as vibration, impact or temperature change during the operation of the equipment. At the same time, when maintenance or upgrading of the LED chip 13 and the IC chip 14 is required, they can be easily disassembled and reinstalled, and the faulty LED chip 13 and IC chip 14 can be quickly replaced, shortening the maintenance time;

[0049] The upper surface of each threaded rod 2204 is fixedly connected with a rotating ring 2207, and the outer surface of each rotating ring 2207 is provided with anti-slip openings 2208 arranged at equal distances. The rotating ring 2207 can facilitate the rotation of the threaded rod 2204, and the anti-slip openings 2208 can prevent slipping during rotation;

[0050] The bottom surface of each sliding plate 2205 is fixedly connected to two connecting blocks 2211, and the bottom surface of each connecting block 2211 is fixedly connected to a protective pad 2210. The connecting blocks 2211 can fix the protective pad 2210 on the sliding plate 2205, and can contact the LED chip 13 and the IC chip 14 through the connecting blocks 2211 and the protective pad 2210, so that the LED chip 13 and the IC chip 14 can be fixed.

[0051] The specific implementation of this embodiment is as follows: when the LED chip 13 and the IC chip 14 need to be fixed, the LED chip 13 and the IC chip 14 are placed on the mounting hole 2103, and the sliding column 2014 is pressed, and then the fixing frame 2201 is adjusted to a suitable angle for fixing the LED chip 13 and the IC chip 14 by rotating the frame 2206, and then the sliding plate 2205 is extended and retracted in the sliding groove plate 2202 according to the size of the LED chip 13 and the IC chip 14, so that the sliding groove plate 2202 and the sliding plate 2205 are integrally fixed. The size can meet the size of the fixed LED chip 13 and the IC chip 14. When the sliding plate 2205 is adjusted, the threaded rod 2204 is rotated by rotating the ring 2207 in conjunction with the anti-slip opening 2208. When the threaded rod 2204 rotates, the inner and outer rings of the first rotating bearing 2203 rotate. At the same time, the threaded rod 2204 can move downward in the fixed frame 2201 through the rotation and thread of the threaded rod 2204. When the threaded rod 2204 moves, the slide plate 2202 and the sliding plate 2205 are driven to move downward. At the same time, when the slide plate 2202 and the sliding plate 2205 are driven downward, When the plate 2205 moves, the guide column 2209 slides in the fixing frame 2201. At the same time, when the slide plate 2202 and the protective pad 2210 are in contact with the LED chip 13 and the IC chip 14, the threaded rod 2204 is continuously rotated, so that the slide plate 2202 and the sliding plate 2205 cooperate with the protective pad 2210 and the connecting block 2211 to fix the LED chip 13 and the IC chip 14 to the connecting board 12. When the LED chip 13 and the IC chip 14 need to be maintained or replaced, the threaded rod 2204 is reversed. Reversal drives the slide plate 2202, the sliding plate 2205 and the guide column 2209 to move upward, thereby releasing the protection pad 2210 and the connecting block 2211 from limiting the LED chip 13 and the IC chip 14. Only when the protection pad 2210 and the connecting block 2211 release the limiting of the LED chip 13 and the IC chip 14, the sliding column 2104 can be lifted by the second telescopic spring 2109, so that the sliding column 2104 drives the LED chip 13 and the IC chip 14 to lift, thereby improving the convenience of maintaining and replacing the LED chip 13 and the IC chip 14.

[0052] Example 3: Please refer to Figure 1 , Figure 2 , Figure 3 , Fig. 9 , Fig.13 , Fig.14 and Fig.15 The present invention provides a technical solution: a light-emitting device encapsulated with an LED chip and an IC chip. The present invention makes corresponding improvements to the technical problems mentioned in the background technology.

[0053] As a further limitation of the present invention, a mobile adjustment mechanism 3 is provided on the right side of the maintenance structure 2, and the mobile adjustment mechanism 3 is used in conjunction with the maintenance fixing auxiliary unit 22, and the mobile adjustment mechanism 3 is used to adjust the fixing position;

[0054] The movable adjustment mechanism 3 includes two sliding slot frames 301, the bottom surfaces of the two sliding slot frames 301 are in contact with the upper surface of the connecting plate 12, the interior of each sliding slot frame 301 is slidably connected with a lead screw nut block 310, the inner wall of each sliding slot frame 301 is rotatably connected with a lead screw lever 309, the outer surface of each lead screw lever 309 is threadedly connected to the inner wall of the lead screw nut block 310, the upper surface of each lead screw nut block 310 is fixedly connected with a threaded tube 302, the interior of each threaded tube 302 is threadedly connected with a threaded column 303, the outer surface of each threaded column 303 is fixedly connected with a second rotating bearing 304, and the outer surface of the outer ring of each second rotating bearing 304 is fixedly connected There are telescopic slot plates 307, and the interior of each telescopic slot plate 307 is slidably connected with a telescopic plate 308. The inner wall of each telescopic plate 308 is rotatably connected to the outer surface of the rotating frame 2206. By setting a moving adjustment mechanism 3, the maintenance and fixing auxiliary unit 22 can be driven to move and adjust the position, so that it can be adjusted according to the size and position of the LED chip 13 and the IC chip 14, improving the convenience of fixing the maintenance and fixing auxiliary unit 22, and when disassembling and maintaining the LED chip 13 and the IC chip 14, the maintenance and fixing auxiliary unit 22 can be moved to a position away from the LED chip 13 and the IC chip 14, further improving the convenience of maintenance and replacement of the LED chip 13 and the IC chip 14;

[0055] Two sets of fixing pins 311 are arranged above each sliding slot frame 301. The bottom end of each set of fixing pins 311 penetrates the sliding slot frame 301 and extends to the inside of the connecting electric board 12. The fixing pins 311 can penetrate the sliding slot frame 301 and fix it in the connecting electric board 12, so that the sliding slot frame 301 can be fixed for use;

[0056] The top of each threaded column 303 is fixedly connected to a twisting column 305 , and the upper surface of each twisting column 305 is provided with a twisting hole 306 . The twisting column 305 is provided with a twisting hole 306 , and the threaded column 303 can be easily rotated through the twisting hole 306 .

[0057] The specific implementation of this embodiment is as follows: when the LED chip 13 and the IC chip 14 are fixed, the wire lever 309 is rotated forward or reversely according to the size and position of the LED chip 13 and the IC chip 14, and the screw nut block 310 is driven to adjust the position in the sliding slot frame 301 through the rotation and thread of the wire lever 309, and at the same time, the threaded tube 302, the threaded column 303, the second rotating bearing 304, the telescopic slot plate 307 and the telescopic plate 308 are driven to move their positions through the movement of the screw nut block 310, and the rotating frame 2206 and the fixed frame 2201 are driven to adjust their positions through the movement of the telescopic plate 308, so that the fixed frame 2201 can be moved to a position suitable for fixing the LED chip 13 and the IC chip 14, and then the inner and outer rings of the second rotating bearing 304 are rotated to drive the telescopic slot plate 307, the telescopic plate 308, the rotating frame 2206 and the fixed frame 2201 to adjust their angles, so that the fixed frame 2201 can be adjusted according to the size and position of the LED chip 13 and the IC chip 14. The telescopic plate 308 is telescoped in the telescopic slot plate 307 according to the position of the LED chip 13 and the IC chip 14, so that the telescopic plate 308 drives the rotating frame 2206 and the fixed frame 2201 to move their own positions, so that the fixed frame 2201 can adjust its position, and the LED chip 13 and the IC chip 14 are better fixed. The threaded column 303 is rotated by cooperating with the screwing hole 306 and the screwing column 305 through a suitable device. At the same time, when the threaded column 303 rotates, the inner and outer rings of the second rotating bearing 304 rotate, so that the telescopic slot plate 307 will not rotate with it, and through the rotation and thread of the threaded column 303, it can be telescoped in the threaded tube 302, thereby driving the telescopic slot plate 307, the telescopic plate 308, the rotating frame 2206 and the fixed frame 2201 to adjust their positions up and down, and further, the LED chip 13 and the IC chip 14 can be conveniently fixed and released in cooperation with the maintenance and fixing auxiliary unit 22.

[0058] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0059] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A light emitting device encapsulating an LED chip and an IC chip, comprising a frame, characterized in that: The frame includes a light emitting device, the inner bottom wall of the light emitting device is fixedly connected with a connecting board, the upper surface of the connecting board is respectively fixedly connected with an LED chip and an IC chip, and the interior of the light emitting device is provided with a maintenance-friendly structure; The maintenance-friendly structure includes a maintenance lifting unit, which is located inside the light-emitting device and the connecting electrical board, and is used to adjust the chip position; The maintenance-friendly structure further includes a maintenance and fixing auxiliary unit, which is located inside the light-emitting device and is used to fix the chip; A movable adjustment mechanism is provided on the right side of the maintenance-friendly structure, and the movable adjustment mechanism is used in conjunction with the maintenance and fixing auxiliary unit, and the movable adjustment mechanism is used to adjust the fixing position; The maintenance lifting unit comprises two slide slot columns, the bottom surface of each slide slot column is fixedly connected to the inner bottom wall of the mounting hole, and the interior of each slide slot column is slidably connected with a sliding column, and the maintenance fixing auxiliary unit comprises two fixing frames, the two fixing frames are both located above the connecting electric board, the right side surface of each fixing frame is fixedly connected with a rotating frame, the interior of each fixing frame is slidably connected with two groups of guide columns, the bottom end of each group of guide columns is fixedly connected with a slide slot plate, and the interior of each slide slot plate is slidably connected with two sliding plates, and the movable adjustment mechanism comprises two sliding slot frames, and the bottom surfaces of the two sliding slot frames are in contact with the upper surface of the connecting electric board; It also includes a second rotating bearing, the outer surface of each outer ring of the second rotating bearing is fixedly connected with a telescopic slot plate, the interior of each telescopic slot plate is slidably connected with a telescopic plate, and the inner wall of each telescopic plate is rotatably connected to the outer surface of the rotating frame.

2. A light emitting device encapsulated with an LED chip and an IC chip according to claim 1, characterized in that: The two slide slot columns are both located inside the light emitting device and the connecting electrical board, and the light emitting device and the connecting electrical board are jointly provided with a mounting hole, and the inner wall of each of the sliding columns is fixedly connected to a first telescopic spring, and the interior of each of the sliding columns is slidably connected to a limit pin, and one end of the two limit pins close to each other is fixedly connected to one end of the two first telescopic springs away from each other, and the bottom end of each sliding column is fixedly connected to a second telescopic spring, and the bottom end of each second telescopic spring is fixedly connected to the inner bottom wall of the slide slot column, and the outer surface of each limit pin contacts the inner wall of the slide slot column, the interior of the light emitting device is slidably connected to two moving plates, and the interior of the connecting electrical board is slidably connected to a conduction rod, and the outer surface of each moving plate contacts the inner wall of the conduction rod, and the ends of the two conduction rods close to each other are in contact with one end of the two limit pins away from each other, and the front and back sides of the connecting electrical board are fixedly connected to two third telescopic springs.

3. A light emitting device encapsulated with an LED chip and an IC chip according to claim 2, characterized in that: The inner bottom wall of each mounting hole is fixedly connected with a support frame, and the inner wall of each support frame is in contact with the outer surface of the conduction rod.

4. A light emitting device encapsulated with an LED chip and an IC chip according to claim 2, characterized in that: One end of each group of the third telescopic springs that is away from each other is fixedly connected to two connecting plates, and one side of each group of the connecting plates that is close to each other is fixedly connected to the outer surface of the conduction rod.

5. The light emitting device encapsulated with an LED chip and an IC chip according to claim 1, characterized in that: The inner wall of each fixing frame is threadedly connected with a threaded rod, the bottom end of each threaded rod is fixedly connected with a first rotating bearing, and the bottom surface of the outer ring of each first rotating bearing is fixedly connected with the upper surface of the slide plate.

6. A light emitting device encapsulated with an LED chip and an IC chip according to claim 5, characterized in that: The upper surface of each threaded rod is fixedly connected with a rotating ring, and the outer surface of each rotating ring is provided with anti-slip openings arranged at equal distances.

7. The light emitting device encapsulated with an LED chip and an IC chip according to claim 5, characterized in that: The bottom surface of each sliding plate is fixedly connected to two connecting blocks, and the bottom surface of each connecting block is fixedly connected to a protective pad.

8. The light emitting device encapsulated with an LED chip and an IC chip according to claim 5, characterized in that: The interior of each sliding slot frame is slidably connected to a lead screw nut block, the inner wall of each sliding slot frame is rotatably connected to a lead screw lever, the outer surface of each lead screw lever is threadedly connected to the inner wall of the lead screw nut block, the upper surface of each lead screw nut block is fixedly connected to a threaded tube, and the interior of each threaded tube is threadedly connected to a threaded column.

9. A light emitting device encapsulated with an LED chip and an IC chip according to claim 8, characterized in that: Two groups of fixed pins are arranged above each of the sliding slot frames, and the bottom end of each group of fixed pins passes through the sliding slot frame and extends to the inside of the connection board.

10. The light emitting device encapsulated with an LED chip and an IC chip according to claim 8, characterized in that: The top end of each threaded column is fixedly connected with a twisting column, and the upper surface of each twisting column is provided with a twisting hole.

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