A high density microwave cluster assembly

Abstract

The application relates to the field of radio frequency and microwave technology, in particular to a high-density microwave cluster assembly which comprises a base provided with a substrate groove, cluster connectors arranged on opposite sides of the base, a PCB array arranged in the substrate groove, the PCB array being provided with spaced-apart PCB reference grounds, a top cover, one side of the top cover close to the PCB array being provided with an isolation wall corresponding to the PCB reference grounds, and a conductive material filling layer being arranged between the isolation wall and the PCB reference grounds. The cluster connectors of the application share an outer conductor to reduce the size of the outer shell, and the thinner connector insertion plate of the cluster connectors is fixed to the base to reduce the overall thickness of the device, and the PCB array reduces the size of the base support structure to realize high density of the microwave cluster assembly; the isolation wall is arranged on the top cover, the exposed PCB reference grounds are arranged on the top of the PCB, and the conductive material filling layer is arranged between the isolation wall and the PCB reference grounds, so that the channel crosstalk can be effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of radio frequency and microwave technology, and particularly relates to a high-density microwave cluster assembly. BACKGROUND

[0002] In superconducting quantum computing, microwave components such as filters and attenuators are needed to manipulate and read bits. As the scale of quantum computing rapidly expands, the number of microwave components required rapidly increases, and the internal space of the dilution refrigerator gradually becomes crowded. To solve this problem, the integration of components in the system needs to be improved. One widely used method is to use a cluster structure, which combines multiple functionally identical components into a compact whole to reduce the physical space occupied.

[0003] A large part of the integration bottleneck of existing cluster microwave assemblies comes from the connectors, which are used to connect microwave assemblies in different temperature zones of the dilution refrigerator. To ensure maximum compatibility, the connector is usually a separate standard structure, with one end being a female structure that can be inserted into a commercial cable with a male head. The female head also needs a certain thickness of the shell to ensure sufficient mechanical strength. This structure also limits the integration of related cluster assemblies, and the pitch of the channel array of the cluster assembly cannot be less than the size of the shell. In addition, to maximize integration, the PCB of the cluster assembly is preferably in an array structure, but the channel isolation of this array structure is poor and cannot support long coherence time and high-fidelity operations of quantum bits.

[0004] Therefore, the prior art still needs to be improved and developed. SUMMARY

[0005] In view of the deficiencies of the prior art described above, the purpose of the present application is to provide a high-density microwave cluster assembly, which aims to solve the problems of poor channel isolation and low integration of existing cluster assemblies.

[0006] The technical scheme of the present application is as follows:

[0007] A high-density microwave cluster assembly comprises:

[0008] a base provided with a substrate groove;

[0009] a cluster connector arranged on opposite sides of the base;

[0010] a PCB array arranged in the substrate groove, the PCB array being provided with a plurality of PCB reference grounds arranged at intervals;

[0011] a top cover, one side of the top cover close to the PCB array being provided with an isolation wall corresponding to the PCB reference ground, and a conductive material filling layer being arranged between the isolation wall and the PCB reference ground.

[0012] The high-density microwave cluster assembly, wherein the base comprises a base plate, connector insertion slots arranged on opposite sides of the base plate, and a fixing member arranged on one side of the base plate and used for fixing the high-density microwave cluster assembly to a carrier.

[0013] The high-density microwave cluster assembly, wherein the connector insertion slots are provided with through holes on the side close to the substrate groove.

[0014] The high-density microwave cluster assembly, wherein the fixing member is sleeved on one of the connector insertion slots, and the fixing member is provided with an opening on the side away from the base plate; the fixing member is provided with a plurality of first fixing holes.

[0015] The high-density microwave cluster assembly, wherein the PCB array is provided with a welding area on the side close to the base plate; the PCB array and the base plate are fixed by welding the welding area.

[0016] The high-density microwave cluster assembly, wherein the cluster connector comprises a connector insertion plate matched with the connector insertion slots, and a connector tail plate arranged on the side of the connector insertion plate away from the substrate groove; the connector tail plate is provided with a plurality of connector interfaces on the side away from the connector insertion plate; the connector insertion plate is provided with connector pins corresponding to the connector interfaces on the side away from the connector tail plate.

[0017] The high-density microwave cluster assembly, wherein the thickness of the connector tail plate is greater than the thickness of the connector insertion plate; the connector insertion plate is provided with at least two connector fixing holes.

[0018] The high-density microwave cluster assembly, wherein the connector pins and the PCB array are fixed by welding.

[0019] The high-density microwave cluster assembly, wherein the PCB reference ground is arranged between adjacent array elements of the PCB array; the isolation wall is formed by extending from the side of the top cover close to the PCB array.

[0020] The high-density microwave cluster assembly, wherein the material of the conductive material filling layer is selected from one or more of solder paste, solder, conductive adhesive, and conductive adhesive tape.

[0021] Beneficial effects: the present application provides a high-density microwave cluster assembly, comprising: a base provided with a substrate groove; a cluster connector arranged on opposite sides of the base; a PCB array arranged in the substrate groove, the PCB array is provided with a plurality of PCB reference grounds arranged at intervals; a top cover, the side of the top cover close to the PCB array is provided with an isolation wall corresponding to the PCB reference ground, and a conductive material filling layer is arranged between the isolation wall and the PCB reference ground. The present application adopts a cluster connector and a PCB array, wherein the cluster connector reduces the size of the shell by sharing the outer conductor of the originally separate multiple connectors, and reduces the overall thickness of the device by fixing the thinner connector insertion plate on the cluster connector to the base, and the PCB array reduces the size of the base support structure. The combination of the base, the cluster connector, the PCB array and the top cover can significantly improve the integration of the cluster assembly and realize high density of the microwave cluster assembly. At the same time, by setting the isolation wall on the top cover, the exposed PCB reference ground on the top of the PCB, and then setting the conductive material filling layer between the isolation wall and the PCB reference ground, the channel crosstalk can be effectively reduced. Moreover, the high-density microwave cluster assembly simplifies the assembly process, greatly reduces the threaded assembly, reduces the assembly steps, and also improves the stability and consistency of the assembly. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is an exploded structure schematic diagram of the high-density microwave cluster assembly of the present application;

[0023] Figure 2 It is a structure schematic diagram of the base and the top cover;

[0024] Figure 3 It is another perspective structure schematic diagram of the base and the top cover;

[0025] Figure 4 It is a structure schematic diagram of the cluster connector;

[0026] Explanation of reference signs: base 10, substrate groove 11, bottom plate 12, top cover first fixing hole 121, connector insertion slot 13, through hole 131, fixing piece 14, assembly fixing hole 141, cluster connector 20, connector insertion plate 21, connector fixing hole 211, connector tail plate 22, connector interface 23, connector pin 24, screw 25, PCB array 30, PCB reference ground 31, top cover 40, isolation wall 41, top cover second fixing hole 42. DETAILED DESCRIPTION

[0027] The present application provides a high-density microwave cluster assembly, in order to make the purpose, technical scheme and effect of the present application more clear and explicit, the present application is further described in detail below. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features.

[0029] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present application belongs. It should also be understood that terms such as those defined in a general dictionary should be understood as having a meaning consistent with that in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as such.

[0030] As Figures 1 to 3 The present application provides a high-density microwave cluster assembly, comprising:

[0031] A base 10 is provided with a substrate groove 11;

[0032] A cluster connector 20 is arranged on opposite sides of the base 10;

[0033] A PCB array 30 is arranged in the substrate groove 11, and the PCB array 30 is provided with a plurality of PCB reference grounds 31 arranged at intervals;

[0034] A top cover 40 is provided with an isolation wall 41 corresponding to the PCB reference ground 31 on one side close to the PCB array 30, and a conductive material filling layer is arranged between the isolation wall 41 and the PCB reference ground 31.

[0035] In the embodiment, the bundle connector and the PCB array are adopted, the bundle connector reduces the size of the shell by sharing the outer conductor of the originally separated multiple connectors, and reduces the overall thickness of the device by fixing the thinner connector insertion plate on the base through the bundle connector, the PCB array reduces the size of the base support structure, and the combination of the base, the bundle connector, the PCB array and the top cover can significantly improve the integration of the bundle assembly and realize the high density of the microwave bundle assembly; meanwhile, the isolation wall is arranged on the top cover, the exposed PCB reference ground is arranged on the top of the PCB, and the conductive material filling layer is arranged between the isolation wall and the PCB reference ground, so that the channel crosstalk can be effectively reduced; and the high-density microwave bundle assembly simplifies the assembly process, greatly reduces the threaded assembly, reduces the assembly steps, and also improves the stability and consistency of the assembly.

[0036] Specifically, the array pitch of the channels can be reduced by using the bundle connector 20 and the PCB array 30, and the integration of the bundle assembly can be effectively improved; in addition, the conductive material filling layer arranged in the gap between the isolation wall 41 and the PCB reference ground 31 can significantly reduce the reflow type crosstalk and improve the channel isolation degree.

[0037] In some embodiments, as shown in Figure 1 The base 10 includes a bottom plate 12, connector insertion slots 13 arranged on opposite sides of the bottom plate 12, and a fixing member 14 arranged on one side of the bottom plate 12 and used for fixing the high-density microwave bundle assembly on a carrier. The bundle connector 20 is matched with the connector insertion slot 13, and the bundle connector 20 is fixed in the connector insertion slot by insertion. In order to improve the integration of the microwave bundle assembly, one of the connector insertion slots 13 is arranged to be covered by the fixing member 14, and the high density of the microwave bundle assembly can be further realized.

[0038] Specifically, the bottom plate 12 and the connector insertion slot 13 surround the substrate groove 11, and the substrate groove is used for fixing the PCB array.

[0039] In some embodiments, as shown in Figure 2 The connector insertion slot 13 is provided with a through hole 131 on the side close to the substrate groove 11, and the pins on the bundle connector 20 pass through the through hole 131 to enter the substrate groove 11 and connect with the PCB array. The through hole 131 corresponds to the pins on the bundle connector.

[0040] In some embodiments, the fixing member 14 is sleeved in one of the connector insertion slots 13, and the fixing member 14 is provided with an opening on the side away from the bottom plate 12; the fixing member 14 is provided with a plurality of first fixing holes 141. The fixing member 14 is combined with the connector insertion slot 13 in a sleeved manner, which can improve the integration of the assembly, and the opening on the side of the fixing member 14 away from the bottom plate 12 facilitates the disassembly of the cluster connector 20 and the base 10. The first fixing holes 141 can be used to fix the high-density microwave cluster assembly on a carrier by screws or bolts.

[0041] In some embodiments, the PCB array 30 is provided with a welding area on the side close to the bottom plate 12; the PCB array and the bottom plate are fixed by welding the welding area.

[0042] Specifically, one side of the PCB array towards the base 10 comprises an exposed area without a solder resist layer, and the PCB array is welded to the bottom plate 12 by using the exposed area without a solder resist layer. The PCB array is fixed to the base 10 by welding, which improves the stability of the assembly.

[0043] In some embodiments, as shown in Figure 4 The cluster connector 20 comprises a connector insertion plate 21 matched with the connector insertion slot 13, and a connector tail plate 22 arranged on the side of the connector insertion plate 21 away from the substrate groove 11; the side of the connector tail plate 22 away from the connector insertion plate 21 is provided with a plurality of connector interfaces 23, and the side of the connector insertion plate 21 away from the connector tail plate 22 is provided with a plurality of connector pins 24 corresponding to the connector interfaces 23. Specifically, the connector interfaces 23 are matched with male connectors.

[0044] In some embodiments, the thickness of the connector tail plate 22 is greater than the thickness of the connector insertion plate 21; the connector insertion plate 21 is provided with at least two connector fixing holes 211. The cluster connector 20 can be fixed on the base 10 by screws 25 or bolts through the connector fixing holes 211, which improves the stability of the assembly.

[0045] In some embodiments, the connector pins 24 and the PCB array 30 are fixed by welding.

[0046] Specifically, the cluster connector 20 is provided with protruding connector pins 24 on the side of the connector insertion plate 21 away from the connector tail plate 22, and the connector pins 24 are central pins of the cluster connector; the connector pins 24 are welded to the ports of the PCB array.

[0047] In some embodiments, the PCB reference ground is arranged between adjacent array elements of the PCB array; and the isolation wall is formed by extending from a side of the top cover close to the PCB array.

[0048] Specifically, the PCB array is arranged between the top cover 40 and the base 10, and an elongated gap is inevitably formed between the PCB array and the top cover, through which the reflow signal can be transmitted to other channels. By arranging an isolation wall 41 corresponding to the PCB reference ground 31 on a side of the top cover 40 close to the PCB array 30, and by arranging a conductor on the PCB reference ground as a bare surface without a solder resist layer, and by arranging the conductor to abut against the isolation wall 41 through a conductive material filling layer, the channel crosstalk can be effectively reduced.

[0049] In some embodiments, the conductive material filling layer is made of one or more of solder paste, solder, conductive adhesive, and conductive adhesive tape. Specifically, by using one or more of molten solder paste, molten solder, conductive adhesive, and conductive adhesive tape as the conductive material filling layer, the reflow crosstalk can be greatly reduced, and the channel isolation degree can be significantly improved.

[0050] In some embodiments, the base 12 is provided with at least four top cover first fixing holes 121, and the top cover 40 is provided with top cover second fixing holes 42 corresponding to the top cover first fixing holes 121. By using the top cover first fixing holes 121 and the top cover second fixing holes 42, the base 10 and the top cover 40 can be fixed by screwing or bolting, so that the microwave cluster assembly has high stability.

[0051] In order to more clearly understand the effect of the high-density microwave cluster assembly, the following examples will be further described: if an SMP connector is used, the maximum inner diameter of the female end is 3.6 mm, and the outer thread specification is M5. In a non-clustered discrete connector, the safe distance of the channel array pitch of the microwave assembly is at least 6 mm. The channel array pitch of the present application is 5.4 mm. Since the clustered connector can share the outer conductor, the channel array pitch can be further reduced to about 4.5 mm. After excluding the necessary space of the shell and the mounting hole, compared with the 6 mm channel array pitch of the discrete type, the 5.4 mm channel array pitch of the present application can increase the number of channels in the one-dimensional direction by 20%, and in the two-dimensional plane by 44%. If the channel array pitch is further reduced to 4.5 mm, the number of channels is expected to increase by 100%.

[0052] In summary, the high-density microwave cluster assembly provided by the application comprises: a base provided with a substrate groove; cluster connectors arranged on opposite sides of the base; a PCB array arranged in the substrate groove, the PCB array being provided with spaced-apart PCB reference grounds; and a top cover, the side of the top cover close to the PCB array being provided with an isolation wall corresponding to the PCB reference grounds, and the isolation wall and the PCB reference grounds being provided with a conductive material filling layer therebetween. The application adopts cluster connectors and a PCB array, wherein the cluster connectors reduce the size of the housing by sharing an outer conductor among multiple originally separate connectors, and reduce the overall thickness of the device by fixing the cluster connectors to the base through a thinner connector insertion plate on the cluster connectors, and the PCB array reduces the size of the base support structure. The combination of the base, the cluster connectors, the PCB array and the top cover can significantly improve the integration of the cluster assembly and achieve high density of the microwave cluster assembly. Meanwhile, by arranging the isolation wall on the top cover, exposing the PCB reference grounds on the top of the PCB, and arranging the conductive material filling layer between the isolation wall and the PCB reference grounds, the channel crosstalk can be effectively reduced. Furthermore, the high-density microwave cluster assembly simplifies the assembly process, greatly reduces threaded assembly, reduces assembly steps, and improves the stability and consistency of the assembly.

[0053] It should be understood that the application is not limited to the above examples, and can be improved or modified according to the above description by those of ordinary skill in the art, and all such improvements and modifications shall fall within the protection scope of the appended claims of the application.

Claims

1. A high density microwave cluster assembly, comprising: The application relates to a high-density microwave cluster assembly. The base is provided with a substrate groove; The cluster connector is arranged on opposite sides of the base; The PCB array is arranged in the substrate groove, and the PCB array is provided with spaced PCB reference grounds; The top cover is provided with an isolation wall corresponding to the PCB reference ground on one side close to the PCB array, and a conductive material filling layer is arranged between the isolation wall and the PCB reference ground; The base comprises a bottom plate, connector insertion grooves arranged on opposite sides of the bottom plate, and a fixing member arranged on one side of the bottom plate and used for fixing the high-density microwave cluster assembly on a carrier; The connector insertion groove is provided with a through hole on one side close to the substrate groove.

2. The high density microwave cluster assembly of claim 1, wherein, The fixing member is sleeved with one of the connector insertion grooves, and the fixing member is provided with an opening on a side away from the bottom plate; the fixing member is provided with a plurality of first fixing holes.

3. The high density microwave cluster assembly of claim 1, wherein, The PCB array is provided with a welding area on one side close to the bottom plate; the PCB array and the bottom plate are fixed by welding the welding area.

4. The high density microwave cluster assembly of claim 1, wherein, The cluster connector comprises a connector insertion plate matched with the connector insertion groove, and a connector tail plate arranged on a side of the connector insertion plate away from the substrate groove; the connector tail plate is provided with a plurality of connector interfaces on a side away from the connector insertion plate; the connector insertion plate is provided with connector pins corresponding to the connector interfaces on a side away from the connector tail plate.

5. The high density microwave cluster assembly of claim 4, wherein, The thickness of the connector tail plate is greater than that of the connector insertion plate; the connector insertion plate is provided with at least two connector fixing holes.

6. The high density microwave cluster assembly of claim 4, wherein, The connector pins and the PCB array are fixed by welding.

7. The high density microwave cluster assembly of claim 1, wherein, The PCB reference ground is arranged between adjacent array elements of the PCB array; the isolation wall is formed by extending from one side of the top cover close to the PCB array.

8. The high density microwave cluster assembly of claim 1, wherein, The material of the conductive material filling layer is selected from one or more of solder paste, solder, conductive glue and conductive adhesive tape.

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