Ultra-high frequency quartz wafer polishing machine and polishing method

Abstract

The invention relates to the technical field of polishing, and discloses an ultra-high frequency quartz wafer polishing machine, comprising a workbench and an intermediate gear, wherein a working hole is provided at the upper end of the workbench, a lower polishing mechanism is arranged inside the workbench, an upper polishing mechanism is arranged at the upper end of the workbench, a plurality of jacks are arranged in an array along a circumferential direction on the end face of the intermediate gear, the thickness of the intermediate gear is less than the thickness of the quartz wafer, the lower polishing mechanism and the upper polishing mechanism both comprise polishing components, the polishing components comprise a rotating column coaxial with the working hole and a motor for driving the rotating column to rotate, a fixed disk is coaxially arranged at one end of the rotating column facing the working hole, an adsorption disk is coaxially arranged at one end of the fixed disk facing the working hole, and a polishing disk is detachably mounted coaxially at one end of the adsorption disk facing the working hole.

Description

Technical Field

[0001] The invention relates to the technical field of polishing, and in particular to an ultra-high frequency quartz wafer polishing machine and a polishing method. Background Art

[0002] With the rapid development of the electronics industry, the demand for quartz wafers, which are the core of the electronics industry, is increasing. When producing quartz wafers, it is necessary to use a polishing device to polish and grind the surface of the quartz wafer to improve the flatness of the quartz wafer for subsequent photolithography. The existing polishing method is mainly a chemical mechanical polishing method, which uses a polishing liquid to chemically corrode and mechanically grind the surface of the quartz wafer at the same time. It has the advantages of both chemical polishing and mechanical polishing. It is a polishing method commonly used in the modern semiconductor industry. Generally, the quartz wafer is fixed on the lower working disk, and the upper and lower working disks are relatively rotated. At the same time, the polishing liquid contacts the surface of the quartz wafer to cause a corrosion reaction, so that the surface of the quartz wafer is corroded and softened, and a large amount of solid abrasives in the polishing liquid help mechanical grinding to remove the corroded surface of the quartz wafer, so as to achieve the polishing of the quartz wafer. However, this method still has some shortcomings. For example, in the prior art, a counterweight is generally applied to the upper working disk to cooperate with the rotating action to achieve mechanical grinding of the quartz wafer. This method cannot adjust the grinding pressure of the quartz wafer in real time during the polishing process, and needs to be improved.

[0003] Based on the above, the present invention proposes an ultra-high frequency quartz wafer polishing machine and a polishing method. Summary of the invention

[0004] In order to solve the problems mentioned in the above background, the present invention provides an ultra-high frequency quartz wafer polishing machine and a polishing method.

[0005] In order to achieve the above technical objectives, the technical solution adopted by the present invention is as follows.

[0006] An ultra-high frequency quartz wafer polishing machine comprises a workbench and an intermediate gear, a working hole is opened at the upper end of the workbench, a lower polishing mechanism is arranged inside the workbench, an upper polishing mechanism is arranged at the upper end of the workbench, a plurality of jacks are arranged in an array along the circumferential direction on the end face of the intermediate gear, the thickness of the intermediate gear is less than the thickness of the quartz wafer, and both the lower polishing mechanism and the upper polishing mechanism comprise polishing components;

[0007] The polishing component includes a rotating column coaxial with the working hole and a motor for driving the rotating column to rotate. A fixed disk is coaxially arranged at one end of the rotating column facing the working hole, an adsorption disk is coaxially arranged at one end of the fixed disk facing the working hole, and a polishing disk is detachably installed coaxially at one end of the adsorption disk facing the working hole.

[0008] Furthermore, a partition is provided inside the rotating column, which divides the internal area of ​​the rotating column into an upper area and a lower area that are not connected to each other. The lower area is located on the side of the upper area facing the working hole. A rotating cover is rotatably installed at the end of the rotating column away from the working hole. A side joint and a core joint are provided at the end of the rotating cover. A core hole is opened on the partition, the side joint is connected to the upper area, the core joint and the core hole are connected by a core tube, the end of the side joint is connected to a negative pressure pump, and the end of the core joint is connected to a water pump.

[0009] Furthermore, a plurality of air grooves are arranged in an array along the circumferential direction on the end face of the adsorption plate facing away from the working hole, a plurality of air holes are arranged in an array along the length direction of each air groove at the bottom of the groove, a connecting hole 1 connected to the air groove is arranged on the end face of the fixed plate, and the connecting hole 1 is connected to the upper area through an air pipe, and a plurality of connecting holes 1 and the air pipe are arranged correspondingly.

[0010] Furthermore, the end surface of the adsorption disk is provided with a plurality of liquid holes 1 in an array along the circumferential direction, the liquid hole 1 is located between two adjacent gas grooves, a positioning protrusion extends from the opening of the liquid hole 1 toward the working hole, and the end surface of the polishing disk away from the working hole is provided with a liquid groove 1 corresponding to the positioning protrusion, and a plurality of liquid grooves 1 are provided correspondingly;

[0011] The end surface of the polishing disc facing the working hole is provided with a second liquid tank corresponding to the first liquid tank, and the first liquid tank and the second liquid tank are connected through the second liquid hole;

[0012] The end surface of the fixed disk is provided with a connecting hole 2 which is communicated with the liquid hole 1, and the connecting hole 2 is connected to the lower area through a liquid pipe.

[0013] Furthermore, the rotating column and motor of the polishing component of the lower polishing mechanism are installed in the workbench, the polishing disc is located in the working hole, a cam shaft extends coaxially from the upper end of the rotating column, a driving gear is installed on the outside of the cam shaft, and an inner gear ring coaxial with the working hole is provided on the upper end surface of the workbench.

[0014] Furthermore, the upper polishing mechanism includes a lifting frame arranged in a lifting manner and a linear module for driving the lifting frame to move. The rotating column and the motor of the polishing component of the upper polishing mechanism are installed on the lifting frame. A sleeve is installed on the lifting frame. The rotating column is sleeved in the sleeve. The power transmission component arranged between the motor and the rotating column is a belt drive. A counterweight component is arranged between the lifting frame and the rotating column.

[0015] Furthermore, the counterweight component includes a fixed sleeve arranged outside the rotating column and a cross frame hingedly connected to the lifting frame. A connecting rod is hingedly arranged between the cross frame and the fixed sleeve. A slide is slidably installed on the cross frame along the length direction. The slide is driven to move by the linear module 2, and a counterweight plate is arranged on the slide.

[0016] Furthermore, a limiting ring located above the fixing sleeve is arranged outside the rotating column, and a spring located between the limiting ring and the fixing sleeve is arranged outside the rotating column.

[0017] Furthermore, the fixing sleeve is arranged on the outside of the rotating column, a supporting ring for supporting the fixing sleeve is arranged on the outside of the rotating column, and a pressure sensor is arranged between the supporting ring and the fixing sleeve.

[0018] A polishing method for an ultra-high frequency quartz wafer polishing machine:

[0019] Step 1: insert the quartz wafer into the socket on the intermediate gear, place the intermediate gear between the inner gear ring and the driving gear, and the intermediate gear is meshed with the inner gear ring or the driving gear, and the lower end surface of the quartz wafer is in contact with the polishing plate of the lower polishing mechanism;

[0020] Step 2: The linear module 1 drives the lifting frame to move downward, and moves the polishing member of the upper polishing mechanism downward together, so that the polishing plate of the upper polishing mechanism contacts the upper end surface of the quartz wafer;

[0021] Step 3: The slide is driven to move by the linear module 2, and based on the lever principle, the pressure applied by the weight component to the polishing component of the upper polishing mechanism is changed to reach a set value, which is the polishing pressure applied to the quartz wafer;

[0022] Step 4: The motor of the lower polishing mechanism is started, driving the rotating column to rotate, thereby driving the driving gear to rotate, so that the intermediate gear rotates around its own axis while revolving around the axis of the cam. The intermediate gear will rotate with the quartz wafer. During the rotation, the upper and lower end faces of the quartz wafer rotate relative to the two polishing discs respectively. At the same time, the polishing liquid can flow into the liquid tank 2 through the core joint, core tube, lower area, liquid tube, liquid hole 1, liquid tank 1, liquid hole 2 in sequence, and flow out to contact the quartz wafer. The rotating action cooperates with the polishing liquid to achieve the polishing of the quartz wafer.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] This solution can realize the polishing of quartz wafers. During the polishing process:

[0025] 1. It can polish both ends of the quartz wafer at the same time, and the polishing efficiency is improved;

[0026] 2. The polishing pressure on the quartz wafer can be achieved through the counterweight component. The polishing pressure is adjustable and monitored in real time by the pressure sensor and displayed on the display screen;

[0027] Furthermore, the weight component adjusts the polishing pressure applied to the quartz wafer by changing the position of the slide seat, that is, during the polishing process, the polishing pressure can be adjusted in real time according to the polishing progress requirements;

[0028] 3 The polishing disc is detachably mounted on the adsorption disc by means of negative pressure adsorption. Therefore, as long as the assembly accuracy of the components other than the polishing disc is no problem, the polishing disc is arranged horizontally as a whole. Compared with the common screw and bolt fixing method in the prior art, the screw and bolt fixing needs to take into account that the screw and bolt cannot be screwed crookedly, otherwise it is easy to cause errors in the horizontality of the polishing disc, thereby affecting the accuracy of the subsequent polishing structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the present invention;

[0030] Figure 2 is a schematic diagram of an upper polishing mechanism and a lower polishing mechanism;

[0031] Figure 3 is a schematic diagram of the lower polishing mechanism;

[0032] Figure 4 is a schematic diagram of the upper polishing mechanism;

[0033] Figure 5 is a schematic diagram of a counterweight component;

[0034] Figure 6 is a schematic diagram of a polishing component;

[0035] Figure 7 is a cross-sectional view of a polishing component;

[0036] Figure 8 Disassembly of fixed disc, adsorption disc and polishing disc Figure 1 ;

[0037] Fig. 9 Disassembly of fixed disc, adsorption disc and polishing disc Figure 2 ;

[0038] Fig.10 Schematic diagram of the intermediate gear.

[0039] The reference numerals in the accompanying drawings are:

[0040] 100, workbench; 200, upper polishing mechanism; 201, linear module 1; 202, lifting frame; 203, counterweight component; 2031, fixed sleeve; 2032, cross frame; 2033, connecting rod; 2034, linear module 2; 2035, slide seat; 2036, counterweight plate; 204, spring; 300, lower polishing mechanism; 301, driving gear; 302, intermediate gear; 3021, jack; 303, inner gear ring; 40 0. Polishing component; 401. Motor; 402. Power transmission component; 403. Rotating column; 404. Partition; 405. Core tube; 406. Side joint; 407. Core joint; 408. Air pipe; 409. Liquid pipe; 410. Fixed disk; 411. Adsorption disk; 4111. Liquid hole one; 4112. Air groove; 4113. Air hole; 412. Polishing disk; 4121. Liquid groove one; 4122. Liquid hole two; 4123. Liquid groove two. DETAILED DESCRIPTION

[0041] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0042] In this figure, a refers to a quartz wafer.

[0043] Reference Figure 1-Figure 10 A ultra-high frequency quartz wafer polishing machine includes a workbench 100, a working hole is opened at the upper end of the workbench 100, a lower polishing mechanism 300 is arranged inside the workbench 100, and an upper polishing mechanism 200 is arranged at the upper end of the workbench 100, and the two cooperate to achieve polishing of the upper and lower surfaces of the quartz wafer. In addition, it also includes an intermediate gear 302 for placing the quartz wafer to be polished. Further, refer to Fig.10 The end surface of the intermediate gear 302 is provided with a plurality of insertion holes 3021 in an array along the circumferential direction. The thickness of the intermediate gear 302 is less than the thickness of the quartz wafer. When in use, the quartz wafer can be directly inserted into the intermediate gear 302 .

[0044] Reference Figure 3 and Figure 4 , the lower polishing mechanism 300 and the upper polishing mechanism 200 both include a polishing member 400 .

[0045] Reference Figure 6-Figure 10 The polishing component 400 includes a rotating column 403 coaxial with the working hole and a motor 401 for driving the rotating column 403 to rotate. Furthermore, the motor 401 and the rotating column 403 are connected to each other by a power transmission member 402.

[0046] A partition 404 is provided inside the rotating column 403 , and the partition 404 divides the inner area of ​​the rotating column 403 into an upper area and a lower area which are not connected to each other, and the lower area is located on a side of the upper area facing the working hole.

[0047] A rotating cover is rotatably installed at one end of the rotating column 403 away from the working hole, and a side joint 406 and a core joint 407 are provided at the end of the rotating cover. A core hole is opened on the partition 404, wherein the side joint 406 is connected to the upper area, and the core joint 407 is connected to the core hole through the core tube 405, that is, the core joint 407 is connected to the lower area. In addition, the side joint 406 is connected to the negative pressure pump, and the core joint 407 is connected to the water pump, which are used to inject polishing liquid into the lower area.

[0048] A fixed disk 410 is coaxially arranged at one end of the rotating column 403 facing the working hole, an adsorption disk 411 is coaxially arranged at one end of the fixed disk 410 facing the working hole, and a polishing disk 412 is detachably installed coaxially at one end of the adsorption disk 411 facing the working hole, and the detachable method is negative pressure adsorption.

[0049] Further, see Figure 7-Figure 9 The end face of the adsorption plate 411 facing away from the working hole is provided with a plurality of air grooves 4112 in an array along the circumferential direction, and the bottom of each air groove 4112 is provided with a plurality of air holes 4113 in an array along the length direction of the groove. The end face of the fixed plate 410 is provided with a connecting hole 1 connected to the air groove 4112, and the connecting hole 1 is connected to the upper area through the air pipe 408, and a plurality of connecting holes 1 and the air pipe 408 are provided correspondingly. When the negative pressure pump is started, the air is sucked away by the negative pressure pump through the air hole 4113, the air groove 4112, the connecting hole 1, the air pipe 408, the upper area and the side joint 406 in turn, and a negative pressure is formed at the air hole 4113, and the negative pressure can realize the adsorption and fixation of the polishing plate 412. When the negative pressure pump stops running, the adsorption and fixation are released.

[0050] Further, see Figure 7-Figure 9 The end face of the adsorption plate 411 is provided with a plurality of liquid holes 4111 in an array along the circumferential direction, and the liquid hole 4111 is located between two adjacent air grooves 4112, a positioning protrusion extends from the liquid hole 4111 toward the orifice of the working hole, and the end face of the polishing plate 412 away from the working hole is provided with a liquid groove 4121 corresponding to the positioning protrusion, and a plurality of liquid grooves 4121 are provided correspondingly; the cooperation between the positioning protrusion and the liquid groove 4121 can play a positioning role, and when the polishing plate 412 is installed on the adsorption plate 411, the liquid groove 4121 can be connected with the liquid hole 4111, and the orifice of the air hole 4113 fits with the end face of the polishing plate 412 away from the working hole.

[0051] A second liquid groove 4123 corresponding to the first liquid groove 4121 is disposed on the end surface of the polishing plate 412 facing the working hole, and the first liquid groove 4121 and the second liquid groove 4123 are connected via the second liquid hole 4122 .

[0052] The end surface of the fixed disk 410 is provided with a connecting hole 2 which is connected to the liquid hole 1 4111, and the connecting hole 2 is connected to the lower area through the liquid pipe 409; when the water pump is started, the polishing liquid can flow into the liquid tank 2 4123 through the core joint 407, the core tube 405, the lower area, the liquid pipe 409, the liquid hole 1 4111, the liquid tank 1 4121, and the liquid hole 2 4122 in sequence, and flow out to the outside.

[0053] Reference Figure 3 , the rotating column 403 of the polishing member 400 of the lower polishing mechanism 300 and the motor 401 are installed in the workbench 100, the polishing disc 412 is located in the working hole, a convex shaft is coaxially extended from the upper end of the rotating column 403, a driving gear 301 is installed on the outside of the convex shaft, and an inner gear ring 303 coaxial with the working hole is provided on the upper end surface of the workbench 100; after the quartz wafer is inserted into the intermediate gear 302, the intermediate gear 302 is placed between the inner gear ring 303 and the driving gear 301, and the intermediate gear 302 is meshed with the inner gear ring 303 or the driving gear 301. This action is the step of putting the quartz wafer into the polishing machine.

[0054] Reference Figure 4 The upper polishing mechanism 200 includes a lifting frame 202 arranged in a lifting manner and a linear module 201 for driving the lifting frame 202 to move.

[0055] The rotating column 403 and the motor 401 of the polishing member 400 of the upper polishing mechanism 200 are both installed on the lifting frame 202, wherein a sleeve is installed on the lifting frame 202, and the rotating column 403 is sleeved in the sleeve. The rotating column 403 can rotate and move along the axial direction. In addition, the movement of the rotating column 403 is for the feed amount during polishing, and therefore, the movement distance is very small, generally only a few millimeters, so the power transmission component 402 can be a belt drive technology, which can continuously supply power to the rotating column 403 when the rotating column 403 moves.

[0056] A counterweight member 203 is provided between the lifting frame 202 and the rotating column 403. Figure 5The counterweight component 203 includes a fixed sleeve 2031 arranged outside the rotating column 403 and a cross frame 2032 hingedly connected to the lifting frame 202. A connecting rod 2033 is hingedly arranged between the cross frame 2032 and the fixed sleeve 2031. The hinge axis at the hinge between the connecting rod 2033 and the fixed sleeve 2031, the hinge axis at the hinge between the connecting rod 2033 and the cross frame 2032, and the hinge axis at the hinge between the cross frame 2032 and the lifting frame 202 are parallel to each other and perpendicular to the axis center line of the rotating column 403.

[0057] A slide 2035 is slidably installed on the cross frame 2032 along the length direction. The slide 2035 is driven to move by the linear module 2034, and a counterweight plate 2036 is arranged on the slide 2035. The sum of the gravity of the cross frame 2032 and the parts arranged on the cross frame 2032 will act on the fixed sleeve 2031 through the connecting rod 2033, that is, act on the polishing member 400 of the upper polishing mechanism 200, so that it has a downward movement tendency.

[0058] In a preferred embodiment, a limiting ring located above the fixed sleeve 2031 is disposed on the outside of the rotating column 403, and a spring 204 located between the limiting ring and the fixed sleeve 2031 is disposed on the outside of the rotating column 403. The spring 204 provides support to the polishing member 400 when not in use.

[0059] In a preferred embodiment, a support ring located below the fixed sleeve 2031 is provided on the outside of the rotating column 403, and the fixed sleeve 2031 is sleeved on the outside of the rotating column 403. The fixed sleeve 2031 and the support ring are in contact with each other, that is, the support ring supports the fixed sleeve 2031. In this way, the force applied to the fixed sleeve 2031 by the counterweight member 203 will act on the support ring, and thus act on the polishing member 400. A pressure sensor is provided between the support ring and the fixed sleeve 2031. The pressure sensor can be used to monitor the force acting on the support ring in real time, that is, the pressure applied to the polishing member 400 can be monitored in real time.

[0060] It should be noted that a clearance groove for avoiding the cam shaft and the driving gear 301 is provided at the bottom of the rotating column 403 of the polishing member 400 of the upper polishing mechanism 200 .

[0061] A polishing method for an ultra-high frequency quartz wafer polishing machine:

[0062] Step 1: After inserting the quartz wafer into the insertion hole 3021 on the intermediate gear 302, the intermediate gear 302 is placed between the inner gear ring 303 and the driving gear 301, and the intermediate gear 302 is meshed with the inner gear ring 303 or the driving gear 301, and the lower end surface of the quartz wafer contacts the polishing plate 412 of the lower polishing mechanism 300;

[0063] Step 2: The linear module 1 201 drives the lifting frame 202 to move downward, and moves the polishing member 400 of the upper polishing mechanism 200 downward together, so that the polishing plate 412 of the upper polishing mechanism 200 contacts the upper end surface of the quartz wafer;

[0064] Step 3: The slide 2035 is driven to move by the second linear module 2034. Based on the lever principle, the pressure applied by the weight component 203 to the polishing component 400 of the upper polishing mechanism 200 is changed. The pressure can be monitored by the pressure sensor and displayed on the display screen. The pressure is the polishing pressure applied to the quartz wafer.

[0065] Step 4: The motor 401 of the lower polishing mechanism 300 is started, driving the rotating column 403 to rotate, thereby driving the driving gear 301 to rotate, so that the intermediate gear 302 rotates around its own axis while revolving around the axis of the cam. The intermediate gear 302 will rotate with the quartz wafer. During this process, the upper and lower end surfaces of the quartz wafer rotate relative to the two polishing discs 412 respectively, thereby achieving the polishing purpose. At the same time, the polishing liquid can flow into the liquid tank 2 4123 through the core joint 407, the core tube 405, the lower area, the liquid tube 409, the liquid hole 1 4111, the liquid tank 1 4121, and the liquid hole 2 4122 in sequence, and flow out to contact the quartz wafer.

[0066] In this solution, the linear module is an existing electric telescopic rod or hydraulic rod or screw linear motion technology, etc., which will not be described in detail.

[0067] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. An ultra-high frequency quartz wafer polishing machine, comprising a workbench (100) and an intermediate gear (302), wherein a working hole is provided at the upper end of the workbench (100), a lower polishing mechanism (300) is provided inside the workbench (100), and an upper polishing mechanism (200) is provided at the upper end of the workbench (100), characterized in that: The end surface of the intermediate gear (302) is provided with a plurality of insertion holes (3021) in an array along the circumferential direction; the thickness of the intermediate gear (302) is less than the thickness of the quartz wafer; and the lower polishing mechanism (300) and the upper polishing mechanism (200) both include a polishing component (400); The polishing component (400) comprises a rotating column (403) coaxial with the working hole and a motor (401) for driving the rotating column (403) to rotate; a fixed disk (410) is coaxially arranged at one end of the rotating column (403) facing the working hole; a suction disk (411) is coaxially arranged at one end of the fixed disk (410) facing the working hole; and a polishing disk (412) is detachably mounted coaxially at one end of the suction disk (411) facing the working hole; A partition (404) is arranged inside the rotating column (403), and the partition (404) divides the internal area of ​​the rotating column (403) into an upper area and a lower area which are not connected to each other, and the lower area is located on the side of the upper area facing the working hole. A rotating cover is rotatably installed at one end of the rotating column (403) away from the working hole, and a side joint (406) and a core joint (407) are arranged at the end of the rotating cover. A core hole is opened on the partition (404), and the side joint (406) is connected to the upper area, and the core joint (407) is connected to the core hole through a core tube (405). The end of the side joint (406) is connected to a negative pressure pump, and the end of the core joint (407) is connected to a water pump. The end surface of the adsorption plate (411) facing away from the working hole is provided with a plurality of air grooves (4112) in an array along the circumferential direction, and the bottom of each air groove (4112) is provided with a plurality of air holes (4113) in an array along the length direction of the groove. The end surface of the fixed plate (410) is provided with a connection hole 1 connected to the air groove (4112), and the connection hole 1 is connected to the upper area via an air pipe (408), and a plurality of connection holes 1 and air pipes (408) are provided correspondingly; The end surface of the adsorption disk (411) is provided with a plurality of liquid holes (4111) in an array along the circumferential direction, the liquid hole (4111) is located between two adjacent gas grooves (4112), a positioning protrusion extends from the liquid hole (4111) toward the opening of the working hole, and the end surface of the polishing disk (412) away from the working hole is provided with a liquid groove (4121) corresponding to the positioning protrusion, and a plurality of liquid grooves (4121) are provided accordingly; A second liquid groove (4123) corresponding to the first liquid groove (4121) is arranged on the end surface of the polishing plate (412) facing the working hole, and the first liquid groove (4121) and the second liquid groove (4123) are connected via the second liquid hole (4122); The end surface of the fixed disk (410) is provided with a second connection hole communicating with the first liquid hole (4111), and the second connection hole is connected to the lower area via a liquid pipe (409); The upper polishing mechanism (200) comprises a lifting frame (202) arranged in a lifting manner and a linear module (201) for driving the lifting frame (202) to move. The rotating column (403) and the motor (401) of the polishing member (400) of the upper polishing mechanism (200) are both mounted on the lifting frame (202). A sleeve is mounted on the lifting frame (202), and the rotating column (403) is sleeved in the sleeve. The power transmission member (402) arranged between the motor (401) and the rotating column (403) is a belt drive. A counterweight member (203) is arranged between the lifting frame (202) and the rotating column (403). The counterweight component (203) comprises a fixed sleeve (2031) arranged outside the rotating column (403) and a cross frame (2032) hingedly connected to the lifting frame (202); a connecting rod (2033) is hingedly arranged between the cross frame (2032) and the fixed sleeve (2031); a slide seat (2035) is slidably installed on the cross frame (2032) along the length direction; the slide seat (2035) is driven to move by the linear module 2 (2034); and a counterweight plate (2036) is arranged on the slide seat (2035).

2. The ultra-high frequency quartz wafer polishing machine according to claim 1, characterized in that: The rotating column (403) and the motor (401) of the polishing member (400) of the lower polishing mechanism (300) are installed in the workbench (100), the polishing disc (412) is located in the working hole, a convex shaft is coaxially extended from the upper end of the rotating column (403), a driving gear (301) is installed outside the convex shaft, and an inner gear ring (303) coaxial with the working hole is arranged on the upper end surface of the workbench (100).

3. The ultra-high frequency quartz wafer polishing machine according to claim 1, characterized in that: The outside of the rotating column (403) is provided with a limiting ring located above the fixing sleeve (2031), and the outside of the rotating column (403) is provided with a spring (204) located between the limiting ring and the fixing sleeve (2031).

4. The ultra-high frequency quartz wafer polishing machine according to claim 1, characterized in that: The fixing sleeve (2031) is sleeved on the outside of the rotating column (403), and a support ring for supporting the fixing sleeve (2031) is provided on the outside of the rotating column (403), and a pressure sensor is provided between the support ring and the fixing sleeve (2031).

5. The polishing method of an ultra-high frequency quartz wafer polishing machine according to claim 2, characterized in that: The steps include: Step 1: inserting a quartz wafer into the insertion hole (3021) on the intermediate gear (302), placing the intermediate gear (302) between the inner gear ring (303) and the driving gear (301), and meshing the intermediate gear (302) with the inner gear ring (303) or the driving gear (301), and the lower end surface of the quartz wafer contacts the polishing plate (412) of the lower polishing mechanism (300); Step 2: The linear module 1 (201) drives the lifting frame (202) to move downward, and moves the polishing member (400) of the upper polishing mechanism (200) downward together, so that the polishing plate (412) of the upper polishing mechanism (200) contacts the upper end surface of the quartz wafer; Step 3: The slide seat (2035) is driven to move by the linear module 2 (2034), and based on the lever principle, the pressure applied by the weight component (203) to the polishing component (400) of the upper polishing mechanism (200) is changed to reach a set value, which is the polishing pressure applied to the quartz wafer; Step 4: The motor (401) of the lower polishing mechanism (300) is started, driving the rotating column (403) to rotate, thereby driving the driving gear (301) to rotate, so that the intermediate gear (302) rotates around its own axis while revolving around the axis of the cam shaft. The intermediate gear (302) will rotate with the quartz wafer. During the rotation process, the upper and lower end surfaces of the quartz wafer rotate relative to the two polishing discs (412) respectively. At the same time, the polishing liquid can flow into the liquid tank 2 (4123) through the core joint (407), the core tube (405), the lower area, the liquid tube (409), the liquid hole 1 (4111), the liquid tank 1 (4121), and the liquid hole 2 (4122) in sequence, and then flow outward to contact the quartz wafer. The rotating action cooperates with the polishing liquid to achieve polishing of the quartz wafer.

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