A method and device for identifying and recycling waste circuit board components

Abstract

The present invention discloses a method and device for identifying and recycling components of waste circuit boards, which belongs to the field of circuit board recycling, wherein the method comprises: S100, transmitting the circuit board to be recycled to a predetermined position through a transmission module, taking an image of the circuit board to be recycled through a camera module and sending it to a background system; S200, the background system analyzes the received image of the circuit board to be recycled to obtain the type and position of the components; S300, the background system determines a recycling strategy according to the type and position of the components, and determines the path planning information of a heating module, a suction module and a transmission module according to the recycling strategy; S400, according to the path planning information, the heating module moves to the position of the pin of the component to be recycled of the circuit board to be recycled to heat and melt the solder at the pin, and the suction module moves to the top of the component to be recycled to suck and recycle the component to be recycled. The present invention can realize the automatic identification and recycling of waste circuit board components.

Description

Technical Field

[0001] The present invention relates to the field of image processing, and in particular to a method and a device for identifying and recycling components of waste circuit boards. Background Art

[0002] Circuit boards provide electrical connections for electronic components. When recycling and reprocessing circuit boards, it is necessary to recycle the components on the PCB and clean the tin spots on the surface of the PCB. However, the current recycling process is very complicated and mostly manual, which requires a lot of manpower.

[0003] Existing methods for recycling circuit boards include directly heating the circuit board to melt all the solder on the circuit board, then removing the components and sucking away the molten solder, or heating the solder joints one by one with a solder pen, removing the components one by one and removing the molten solder. The former may damage components with low heat resistance when directly heating the circuit board, and the latter recycling method is inefficient. Now there is an urgent need for a method for identifying and recycling components of waste circuit boards to overcome the shortcomings of the above recycling methods and improve the recycling efficiency of circuit boards. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method and device for identifying and recycling components of waste circuit boards, which can improve the recycling efficiency of circuit boards.

[0005] On the one hand, an embodiment of the present invention provides a method for identifying and recycling components of waste circuit boards, comprising the following steps: S100, a circuit board to be recycled is transported to a predetermined position by a transport module, and an image of the circuit board to be recycled is captured by a camera module and sent to a background system; S200, the background system analyzes the received image of the circuit board to be recycled to obtain the type and position of the components; S300, the background system determines a recycling strategy according to the type and position of the components, and determines path planning information of a heating module, a suction module and a transport module according to the recycling strategy; the heating module comprises: a first heating module, which is used to move to the position of the pin of the component to be recycled according to the path planning information to heat and melt the solder at the pin; a second heating module, which comprises a camera assembly and A solder pen is used to move to the position of the components to be recycled according to the path planning information, obtain images and identify solder joints through a camera component, and melt the solder at the solder joints through the solder pen; the recycling strategy includes generating path planning information of a first heating module according to the position of the first category of components, and generating path planning information of a second heating module according to the position of the second category of components; the heat resistance temperature of the first category of components is higher than the melting point of the solder, and the heat resistance temperature of the second category of components is less than or equal to the melting point of the solder; S400, according to the path planning information, the heating module moves to the position of the pins of the components to be recycled on the circuit board to be recycled to heat and melt the solder at the pins, and the suction module moves to the top of the components to be recycled to suck and recycle the components to be recycled.

[0006] According to some embodiments of the present invention, step S200 includes: S210, inputting the image of the circuit board to be recycled into a YOLO target recognition model to obtain a number of prediction boxes and corresponding component types, and obtaining the component position according to the prediction box.

[0007] According to some embodiments of the present invention, the step S300 includes: S310, dividing each type of component into a first type of component and a second type of component according to the heat resistance temperature of each type of component and the melting point of the solder; wherein the heat resistance temperature of the first type of component is higher than the melting point of the solder, and the heat resistance temperature of the second type of component is less than or equal to the melting point of the solder; S320, traversing the component positions and the corresponding component types, when the component type is a first type of component, adding the current component position to the first set, and when the component type is a second type of component, adding the current component position to the second set; S330, generating first path planning information and second path planning information according to all component positions of the first set and the second set, the first path planning information being used as the path planning information of the first heating module, and the second path planning information being used as the path planning information of the first heating module.

[0008] According to some embodiments of the present invention, step S200 includes: S220, converting the grayscale value of the image of the recycled circuit board and setting the grayscale value of the pixel in the prediction box to the grayscale value corresponding to the background color of the circuit board in the image, and performing contrast enhancement processing to obtain a preprocessed image; S230, denoising the preprocessed image based on a median filtering algorithm to obtain a denoised image; S240, threshold segmenting the denoised image based on an adaptive threshold segmentation algorithm to obtain a segmented image; S250, filling holes in the segmented image, marking the target, and calculating the number of target pixels; S260, if the target number of pixels exceeds the threshold, performing target recognition based on a defect recognition model and outputting the defect type; the circuit board defect types include scratches on the board surface and stains on the board surface; the defect recognition model is a defect recognition model trained based on defective circuit board images.

[0009] According to some embodiments of the present invention, the step S300 includes: S340, determining whether the current circuit board is recyclable or needs to be cleaned according to the circuit board defect information.

[0010] According to some embodiments of the present invention, the method further includes: S500, a conveying module conveys the circuit boards to be recycled after the components are recycled to a first position, a second position or a third position according to the recycling strategy, wherein the first position is used to store recyclable circuit boards that do not require cleaning, the second position is used to store recyclable circuit boards that require cleaning, and the third position is used to store non-recyclable circuit boards.

[0011] According to some embodiments of the present invention, the step S300 includes: S350, obtaining the heating and melting completion time corresponding to the position of each component of the first set according to the first path planning information, the moving speed of the first heating module and the heating and melting operation time of the first heating module; S360, obtaining the heating and melting completion time corresponding to the position of each component of the second set according to the second path planning information, the moving speed of the second heating module and the solder point positioning time and solder pen operation time of the second heating module; S370, generating the path planning information of the absorption module according to all component positions of the first set and the second set and the corresponding heating and melting completion time.

[0012] According to some embodiments of the present invention, the step S400 includes: S410, after the suction module completes the suction recovery operation, the molten solder is removed by the molten solder removal module.

[0013] The embodiments of the present invention achieve at least the following beneficial effects: the embodiments of the present invention achieve automatic recycling of components and circuit boards by analyzing the image of the circuit board to be recycled to obtain the component type and component position; generate path planning information of the heating module, the suction module and the transmission module according to the component type and position, realize automatic positioning and recycling of components and can realize the shortest path planning of the modules, thereby improving recycling efficiency; realize two different methods of component recycling through different types of heating modules, and realize recycling of components with lower heat resistance through solder pen method to avoid damage to the components, and realize recycling of components with higher heat resistance through direct heating of the components to melt the solder at the pins, thereby saving the pin positioning operation and improving recycling efficiency.

[0014] On the other hand, an embodiment of the present invention provides a waste circuit board component identification and recycling device for executing the method described above, including: a conveying module, used to convey the circuit board to be recycled to a predetermined position; a camera module, used to take an image of the circuit board to be recycled and send it to a background system; a heating module, used to move to the position of the pins of the components to be recycled on the circuit board to be recycled according to path planning information to heat and melt the solder at the pins; a suction module, used to move to the top of the components to be recycled according to path planning information to suck and recycle the components to be recycled; a background system, used to analyze the received image of the circuit board to be recycled to obtain the component type and component position; determine the recycling strategy according to the component type and component position, and determine the path planning information of the heating module, the suction module and the conveying module according to the recycling strategy.

[0015] The embodiments of the present invention achieve at least the following beneficial effects: the embodiments of the present invention achieve automatic recycling of components and circuit boards by analyzing the image of the circuit board to be recycled to obtain the component type and component position; generate path planning information of the heating module, the suction module and the transmission module according to the component type and position, realize automatic positioning and recycling of components and can realize the shortest path planning of the modules, thereby improving recycling efficiency; realize two different methods of component recycling through different types of heating modules, and realize recycling of components with lower heat resistance through solder pen method to avoid damage to the components, and realize recycling of components with higher heat resistance through direct heating of the components to melt the solder at the pins, thereby saving the pin positioning operation and improving recycling efficiency.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 A schematic diagram of a method according to an embodiment of the present invention;

[0019] Figure 2 The present invention is a schematic block diagram of a device according to an embodiment of the present invention.

[0020] Reference numerals:

[0021] Transmission module 100 , camera module 200 , heating module 300 , suction module 400 , and background system 500 . DETAILED DESCRIPTION

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0023] In the description of the present invention, "several" means one or more, "more" means two or more, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0024] The purpose of the embodiment of the present invention is to automatically and efficiently recycle waste circuit boards without damaging electronic components. Therefore, when recycling electronic components, it is necessary to consider whether the way of heating the solder affects the recycling of electronic components. SMT is currently the main method for welding electronic components. It fixes components on circuit boards by welding. However, the high temperature generated during the welding process may cause damage to electronic components. Similarly, the welding heat resistance temperature of electronic components is an important issue that needs to be paid attention to when recycling electronic components. The welding heat resistance temperature of electronic components is not a constant value, but is affected by many factors, such as the material, size, design, etc. of the components. Different types of components may have large differences in their heat resistance temperatures. Most electronic components, including resistors, capacitors, diodes, transistors, etc., usually have a heat resistance temperature below 260°C. For these components, excessively high welding temperatures may cause damage to the internal structure and affect the performance of the components. For some special components, such as inductors, magnetic beads, thermistors, etc., due to the characteristics of their internal materials, their heat resistance temperatures may be lower.

[0025] Reference Figure 2 The embodiment of the present invention provides a waste circuit board component identification and recycling device, comprising:

[0026] The conveying module 100 is used to convey the circuit board to be recycled to a predetermined location.

[0027] The camera module 200 is used to take images of the circuit boards to be recycled and send them to the background system.

[0028] The heating module 300 is used to move to the pin position of the component to be recycled on the circuit board to be recycled according to the path planning information to heat and melt the solder at the pin.

[0029] The suction module 400 is used to move to the top of the components to be recycled according to the path planning information to perform suction and recycling operations on the components to be recycled.

[0030] The backend system 500 is used to analyze the received circuit board image to be recycled to obtain the component type and component location; determine the recycling strategy according to the component type and component location, and determine the path planning information of the heating module, the suction module and the transmission module according to the recycling strategy.

[0031] In some embodiments, the device of the embodiment of the present invention further includes a solder melt removal module, which is used to remove the molten solder after the suction module 400 completes the suction recovery operation.

[0032] Reference Figure 1 Another aspect of the present invention provides a method for identifying and recycling waste circuit board components, comprising the following steps:

[0033] S100, the circuit board to be recycled is transported to a predetermined location through the transport module 100, and the image of the circuit board to be recycled is photographed through the camera module 200 and sent to the background system.

[0034] S200, the backend system 500 analyzes the received image of the circuit board to be recycled to obtain the component type and component location.

[0035] S300 , the background system 500 determines a recycling strategy according to the component type and the component position, and determines the path planning information of the heating module 300 , the suction module 400 and the transmission module 100 according to the recycling strategy.

[0036] S400. According to the path planning information, the heating module 300 moves to the pin position of the component to be recycled on the circuit board to be recycled to heat and melt the solder at the pin, and the suction module 400 moves to the top of the component to be recycled to suck and recycle the component to be recycled.

[0037] In some embodiments, step S200 of the embodiment of the present invention includes: S210, inputting the image of the circuit board to be recycled into the YOLO target recognition model, obtaining several prediction boxes and corresponding component types, and obtaining the component position according to the prediction box.

[0038] In some embodiments, the heating module 300 includes: a first heating module, which is used to move to the position below the pin of the component to be recycled according to the path planning information to heat and melt the solder at the pin; a second heating module, including a camera assembly and a solder pen, which is used to move to the position above the component to be recycled according to the path planning information, obtain images and identify solder joints through the camera assembly, and melt the solder at the solder joints through the solder pen. The camera assembly of the embodiment of the present invention is connected to the solder pen, and is used to locate the pin position for the solder pen, by obtaining the image of the circuit board below the current position of the solder pen, and by processing the gray value of the image, the solder joint is located according to the gray value corresponding to the solder joint.

[0039] The embodiment of the present invention realizes two ways of recycling components by setting a first heating module and a second heating module. For components with low heat resistance, the pins of the components are located based on the camera assembly, and the solder is heated at the pins based on the solder pen, which avoids heating damage to the components; for components with high heat resistance, the components are directly heated without locating the pins, thereby improving the recycling efficiency.

[0040] In some embodiments, step S300 of the embodiment of the present invention includes:

[0041] S310. Classify each type of component into a first type of component and a second type of component according to the heat resistance temperature of each type of component and the melting point of solder; wherein the heat resistance temperature of the first type of component is higher than the melting point of solder, and the heat resistance temperature of the second type of component is less than or equal to the melting point of solder.

[0042] S320, traverse the component positions and the corresponding component types, when the component type is a first-category component, add the current component position to the first set, when the component type is a second-category component, add the current component position to the second set.

[0043] S330. Generate first path planning information and second path planning information according to the positions of all components of the first set and the second set, the first path planning information being used as the path planning information of the first heating module, and the second path planning information being used as the path planning information of the first heating module.

[0044] In some embodiments, step S200 of the embodiment of the present invention includes:

[0045] S220, converting the grayscale value of the circuit board image to be recycled and setting the grayscale value of the pixel in the prediction frame to the grayscale value corresponding to the circuit board background color in the image, and performing contrast enhancement processing to obtain a preprocessed image.

[0046] S230 , performing denoising on the preprocessed image based on a median filtering algorithm to obtain a denoised image.

[0047] S240 , performing threshold segmentation on the denoised image based on an adaptive threshold segmentation algorithm to obtain a segmented image.

[0048] S250, filling holes in the segmented image, marking the target, and calculating the number of target pixels.

[0049] S260. If the number of target pixels exceeds the threshold, target recognition is performed based on a defect recognition model, and the defect type is output; the circuit board defect types include board scratches and board stains; the defect recognition model is a defect recognition model trained based on defective circuit board images.

[0050] In some embodiments, step S220 in the present invention further includes: obtaining a circuit board surface circuit pixel range, resetting the pixel values ​​of pixels within the pixel range in the circuit board image to be recovered to pixel values ​​corresponding to the circuit board background color. The present invention eliminates interference from the silk-screen circuit on the circuit board surface.

[0051] In some embodiments, step S300 of the embodiment of the present invention includes: S340, determining whether the current circuit board is recyclable or needs to be cleaned according to the circuit board defect information.

[0052] In some embodiments, the method of the embodiment of the present invention also includes: S500, the conveying module 100 conveys the circuit boards to be recycled after the components are recycled to the first position, the second position or the third position according to the recycling strategy, the first position is used to store recyclable circuit boards that do not need to be cleaned, the second position is used to store recyclable circuit boards that need to be cleaned, and the third position is used to store non-recyclable circuit boards.

[0053] In some embodiments, step S300 of the embodiment of the present invention includes:

[0054] S350, obtaining the heating and melting completion time corresponding to each component position of the first set according to the first path planning information, the moving speed of the first heating module and the heating and melting operation time of the first heating module.

[0055] S360, obtaining the heating and melting completion time corresponding to each component position of the second set according to the second path planning information, the moving speed of the second heating module, and the solder point positioning time of the second heating module and the solder pen operation time.

[0056] S370 , generating path planning information of the suction module 400 according to the positions of all components of the first set and the second set and the corresponding heating and melting completion times.

[0057] In some embodiments, step S400 of the embodiment of the present invention includes: S410, after the suction module 400 completes the suction recovery operation, the molten solder is removed by the molten solder removal module.

[0058] Although specific embodiments are described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any of the functions and / or processing capabilities described in conjunction with a particular device or component may be performed by any other device or component. In addition, although various exemplary implementations and architectures have been described according to embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of the present disclosure.

[0059] Some aspects of the present disclosure are described above with reference to the block diagram and flow chart of the system, method, system and / or computer program product according to the exemplary embodiments.It should be understood that the combination of one or more blocks in the block diagram and the flow chart and the blocks in the block diagram and the flow chart can be realized by executing computer executable program instructions respectively.Equally, according to some embodiments, some blocks in the block diagram and the flow chart may not need to be executed in the order shown, or may not need to be executed in full.In addition, additional components and / or operations beyond those components and / or operations shown in the blocks in the block diagram and the flow chart may be present in certain embodiments.

[0060] Therefore, the blocks in the block diagrams and flow charts support the combination of devices for performing the specified functions, the combination of elements or steps for performing the specified functions, and the program instruction devices for performing the specified functions. It should also be understood that each block in the block diagrams and flow charts and the combination of blocks in the block diagrams and flow charts can be implemented by a special-purpose hardware computer system or a combination of special-purpose hardware and computer instructions that performs a specific function, element or step.

[0061] The program modules, applications, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the illustrative methods described herein) to be performed.

[0062] Software components can be encoded with any of various programming languages. An exemplary programming language can be a low-level programming language, such as an assembly language associated with a specific hardware architecture and / or an operating system platform. The software component comprising assembly language instructions may need to be converted to executable machine code by an assembler before being executed by hardware architecture and / or platform. Another exemplary programming language can be a higher-level programming language, which can be transplanted across multiple architectures. The software component comprising a higher-level programming language may need to be converted to an intermediate representation by an interpreter or a compiler before execution. Other examples of programming languages ​​include but are not limited to macro languages, shells or command languages, job control languages, scripting languages, database queries or search languages ​​or report writing languages. In one or more exemplary embodiments, the software component comprising the instruction of one of the above-mentioned programming language examples can be directly executed by an operating system or other software components, without first being converted into another form.

[0063] Software components may be stored as files or other data storage structures. Software components of similar type or related functions may be stored together, such as in a specific directory, folder, or library. Software components may be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0064] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A method for identifying and recycling waste circuit board components, characterized in that: The following steps are involved: S100, the circuit board to be recycled is transported to a predetermined location through a transport module, and an image of the circuit board to be recycled is captured through a camera module and sent to a backend system; S200, the backend system analyzes the received image of the circuit board to be recycled to obtain the component type and component location; S300, the background system determines a recycling strategy according to the component type and component position, and determines path planning information of the heating module, the suction module and the transmission module according to the recycling strategy; The heating module comprises: The first heating module is used to move to the position below the pin of the component to be recycled according to the path planning information to heat and melt the solder at the pin; The second heating module includes a camera component and a solder pen, which is used to move to the position above the component to be recycled according to the path planning information, obtain images and identify solder joints through the camera component, and melt the solder at the solder joints through the solder pen; The recycling strategy includes generating path planning information of a first heating module according to the position of the first type of components, and generating path planning information of a second heating module according to the position of the second type of components; the heat resistance temperature of the first type of components is higher than the melting point of solder, and the heat resistance temperature of the second type of components is less than or equal to the melting point of solder; S400, according to the path planning information, the heating module moves to the pin position of the component to be recycled on the circuit board to be recycled to heat and melt the solder at the pin, and the suction module moves to the top of the component to be recycled to suck and recycle the component to be recycled; The step S200 includes: S210, inputting the image of the circuit board to be recycled into a YOLO target recognition model, obtaining a number of prediction frames and corresponding component types, and obtaining component positions according to the prediction frames; S220, converting the grayscale value of the circuit board image to be recycled and setting the grayscale value of the pixel in the prediction frame to the grayscale value corresponding to the circuit board background color in the image, and performing contrast enhancement processing to obtain a preprocessed image; S230, performing denoising on the preprocessed image based on a median filtering algorithm to obtain a denoised image; S240, performing threshold segmentation on the denoised image based on an adaptive threshold segmentation algorithm to obtain a segmented image; S250, filling holes in the segmented image, marking targets, and calculating the number of target pixels; S260. If the number of target pixels exceeds a threshold, target recognition is performed based on a defect recognition model, and the defect type is output; the circuit board defect types include board scratches and board stains; the defect recognition model is a defect recognition model trained based on defective circuit board images.

2. The method for identifying and recycling waste circuit board components according to claim 1, characterized in that: The step S300 includes: S310, classifying each type of component into first type components and second type components according to the heat resistance temperature of each type of component and the melting point of solder; S320, traversing component positions and corresponding component types, when the component type is a first-category component, adding the current component position to the first set, and when the component type is a second-category component, adding the current component position to the second set; S330. Generate first path planning information and second path planning information according to the positions of all components in the first set and the second set, wherein the first path planning information is used as the path planning information of the first heating module, and the second path planning information is used as the path planning information of the first heating module.

3. The method for identifying and recycling waste circuit board components according to claim 2, characterized in that: The step S300 includes: S340: Determine whether the current circuit board is recyclable or needs to be cleaned according to the circuit board defect information.

4. The method for identifying and recycling waste circuit board components according to claim 3, characterized in that: The method further comprises: S500. The conveying module conveys the circuit boards to be recycled after the components are recycled to the first position, the second position or the third position according to the recycling strategy. The first position is used to store recyclable circuit boards that do not need to be cleaned, the second position is used to store recyclable circuit boards that need to be cleaned, and the third position is used to store non-recyclable circuit boards.

5. The method for identifying and recycling waste circuit board components according to claim 3, characterized in that: The step S300 includes: S350, obtaining the heating and melting completion time corresponding to each component position of the first set according to the first path planning information, the moving speed of the first heating module and the heating and melting operation time of the first heating module; S360, obtaining the heating and melting completion time corresponding to each component position of the second set according to the second path planning information, the moving speed of the second heating module, the solder joint positioning time of the second heating module, and the solder pen operation time; S370: Generate path planning information for the suction module according to the positions of all components of the first set and the second set and the corresponding heating and melting completion times.

6. The method for identifying and recycling waste circuit board components according to claim 1, characterized in that: The step S400 includes: S410, after the suction module completes the suction recovery operation, the molten solder is removed by the molten solder removal module.

7. A device for identifying and recycling components of waste circuit boards, used to perform the method according to any one of claims 1 to 6, characterized in that: include: A conveying module, used for conveying the circuit board to be recycled to a predetermined location; A camera module is used to take images of the circuit boards to be recycled and send them to the backend system; A heating module is used to move to the pin position of the component to be recycled on the circuit board to be recycled according to the path planning information to heat and melt the solder at the pin; A suction module, used for moving to the top of the components to be recycled according to the path planning information to perform suction and recycling operations on the components to be recycled; The backend system is used to analyze the received circuit board image to be recycled to obtain the component type and component location; determine the recycling strategy according to the component type and component location, and determine the path planning information of the heating module, the suction module and the transmission module according to the recycling strategy.

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