Intelligent IC card and authentication system based on fingerprint recognition

Abstract

The present application proposes a smart IC card and authentication system based on fingerprint recognition. The fingerprint module is packaged using flip chip technology, and the thickness of the fingerprint module is small, which can meet the small thickness design index when the metal contact point between the fingerprint module and the smart IC card is stacked, which is suitable for thinner smart IC cards.

Description

Technical Field

[0001] The present application relates to the technical field of smart IC (Integrated Circuit) cards, and in particular to a smart IC card and an authentication system based on fingerprint recognition. Background Art

[0002] Smart IC cards with fingerprint recognition function collect user fingerprints through an integrated fingerprint module and perform fingerprint comparison to realize user identity authentication, also known as the first level of authentication. After passing the first level of authentication, the account information is read through the metal contact points of the smart IC card to perform password reading and verification (which can be called the second level of authentication), account information interaction, etc.

[0003] Take a bank IC card with fingerprint recognition function as an example. Figure 1 As shown, the bank IC card 100 includes a fingerprint module 110 and a chip 120 packaged in a card body 130. The metal contact points 121 of the fingerprint module 110 and the chip 120 are located in two different areas. The metal contact points 121 of the chip 120 are the metal contact points 121 of the bank IC card 100 and are used to contact the metal contact points of a card reader (such as a POS machine, an ATM machine) to read account information. The fingerprint module 110 is usually packaged using a positive packaging technology, such as Figure 2 and Figure 3 As shown, the fingerprint module 110 includes a circuit board 111 and a fingerprint sensor 112. The fingerprint sensor 112 is arranged on the first board surface 111a of the circuit board 111. The metal contact points 113 of the fingerprint sensor 112 and the metal contact points 114 of the circuit board 111 are oriented in the same direction, that is, they are both arranged to face away from the circuit board 111, and each metal contact point 113 is electrically connected to each metal contact point 114 through a wire 115 in a one-to-one correspondence. The second board surface 111b of the circuit board 111 is provided with a plurality of metal contact points 118. The second board surface 111b and the first board surface 111a are arranged opposite to each other along the thickness direction of the circuit board 111. The metal contact point 118 is used to electrically connect with the metal contact point 121 of the bank IC card 100. The plastic encapsulation layer 116 encapsulates the portion of the fingerprint sensor 112 other than the fingerprint collection surface 117 on the circuit board 111. While the plastic encapsulation layer 116 protects the fragile wire 115, since the plastic encapsulation layer 116 must cover the highest point of the wire 115, the thickness of the plastic encapsulation layer 116 is relatively large, which will cause the fingerprint module 110 to be thicker at the electrical connection between the metal contact point 113 and the metal contact point 114, that is, the thickness of the entire fingerprint module 110 is relatively large, which poses a greater limitation when it is suitable for thinner bank IC cards 100.

[0004] The applicant has recently developed and patented a product with the following appearance: Figure 4 The smart IC card shown in the figure concentrates the fingerprint module and the multiple metal contact points 40 of the smart IC card in the area where the groove 10 is set in the card body 1. The fingerprint module is also packaged using the above-mentioned front-mounted technology. The fingerprint module exposes the fingerprint collection surface 210 through the notch of the groove 10, which can improve the integration of the smart IC card. However, in the smart IC card, along the thickness direction of the card body 1, each metal contact point 40 protrudes from the fingerprint collection surface 210, that is, the metal contact points 40 of the fingerprint module and the bank IC card are stacked. The stacking arrangement will originally occupy a large thickness space. In addition, the fingerprint module is still packaged using the front-mounted technology, resulting in a large thickness of the developed smart IC card, which is difficult to meet the expected thickness design index.

[0005] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Summary of the invention

[0006] In view of this, the present application provides a smart IC card and authentication system based on fingerprint recognition, which can improve the problem of the large thickness of the fingerprint module and can be suitable for thinner smart IC cards, especially for scenarios where the metal contact points of the fingerprint module and the smart IC card are stacked.

[0007] The present application provides a smart IC card based on fingerprint recognition, comprising:

[0008] The card body is provided with a groove, and the notch of the groove is located on the first card surface of the card body;

[0009] A fingerprint module is packaged in the card body, the fingerprint module includes a first circuit board and a fingerprint sensor, the first circuit board is provided with a first window and a first metal contact point, the first metal contact point is provided on the first board surface of the first circuit board, the fingerprint sensor is provided with a fingerprint collection surface and a plurality of second metal contact points provided on the same side outside the fingerprint collection surface, the second metal contact points face the first metal contact points and are electrically connected one by one, the fingerprint collection surface is exposed to the second board surface of the first circuit board through the first window, the second board surface is arranged opposite to the first board surface, and the first circuit board is provided with a plurality of third metal contact points on the second board surface;

[0010] A second circuit board, which is packaged in the card body and is provided with a chip, the first circuit board is electrically connected to the second circuit board, and the first board surface of the first circuit board faces the second circuit board;

[0011] A contact module is encapsulated in the card body and includes a plurality of fourth metal contact points electrically connected to the second circuit board, each of which is exposed to the first card surface of the card body, and the plurality of fourth metal contact points are respectively arranged adjacent to two opposite sides of the groove; the third metal contact point is electrically connected to the fourth metal contact point in a one-to-one correspondence, the fingerprint collection surface is exposed to the first card surface through the notch of the groove, and each of the fourth metal contact points protrudes from the fingerprint collection surface.

[0012] Optionally, solder paste or conductive glue is used to achieve electrical connection between the second metal contact point and the first metal contact point, and between the third metal contact point and the fourth metal contact point.

[0013] Optionally, the fingerprint module further includes a plastic packaging layer, which is disposed on a side of the fingerprint sensor facing away from the fingerprint collection surface and packages the fingerprint sensor on the first board surface of the first circuit board.

[0014] Optionally, the fingerprint collection surface is flush with the second board surface of the first circuit board; or, the fingerprint collection surface protrudes from the second board surface of the first circuit board and is lower than the first card surface of the card body.

[0015] Optionally, along a direction perpendicular to the first circuit board, the fingerprint collection surface and the orthographic projection of the first window overlap.

[0016] Optionally, along a direction perpendicular to the first circuit board, the orthographic projection of the first window is a rectangle, the third metal contact point is arranged adjacent to the first window side and the second window side of the first window, the multiple second metal contact points are arranged adjacent to the third window side of the first window, the first window side and the second window side are arranged opposite to each other and vertically connected to the third window side.

[0017] Optionally, along a direction perpendicular to the first circuit board, the first window is aligned with the groove.

[0018] Optionally, the contact module also includes a substrate, the substrate is provided with a second window, the second window at least partially overlaps with the notch of the groove, the fingerprint collection surface is exposed through the second window, and each of the fourth metal contact points passes through the substrate to be exposed to two opposite surfaces of the substrate.

[0019] Optionally, the substrate is a flexible substrate.

[0020] The present application provides an authentication system, comprising a card reader device, and a smart IC card based on fingerprint recognition as described in any one of the above items; the card reader device is provided with a fifth metal contact point, a card slot and a third window, the card slot is used to allow the smart IC card to be inserted into the card reader device until the fingerprint collection surface is located in the card reader device and is fully exposed through the third window, and the fifth metal contact point is in one-to-one contact with the fourth metal contact point of the smart IC card.

[0021] As described above, in the smart IC card of the present application, the fingerprint module includes a first circuit board and a fingerprint sensor, the first circuit board is provided with a first window and a first metal contact point, the fingerprint collection surface of the fingerprint sensor and a plurality of second metal contact points are arranged on the same side, the second metal contact points face the first metal contact points of the first circuit board and are electrically connected one by one, and the fingerprint collection surface is exposed through the first window. Here, the fingerprint module is equivalent to using a flip-chip technology, and the thickness of the fingerprint module is relatively small, which can meet the small thickness design index when the metal contact points of the fingerprint module and the smart IC card are stacked, which is conducive to being suitable for thinner smart IC cards. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the front structure of an existing bank IC card with fingerprint recognition function;

[0023] Figure 2 yes Figure 1 The structural assembly diagram of the fingerprint module of the bank IC card shown;

[0024] Figure 3 yes Figure 2 A schematic cross-sectional view of the fingerprint module along the thickness direction is shown;

[0025] Figure 4 It is a schematic diagram of the front structure of the smart IC card of the first embodiment of the present application;

[0026] Figure 5 yes Figure 4 The back structural diagram of an embodiment of a smart IC card shown;

[0027] Figure 6 yes Figure 4 The local structure cross-sectional view of the smart IC card along the thickness direction is shown;

[0028] Figure 7 is a schematic structural diagram of a fingerprint module according to an embodiment of the present application;

[0029] Figure 8 yes Figure 7 The local structural cross-sectional view of the fingerprint module along the thickness direction is shown;

[0030] Fig. 9 yes Figure 7 A schematic diagram of the structure of the fingerprint sensor of the fingerprint module shown;

[0031] Fig.10 yes Figure 7 A schematic structural diagram of the first circuit board of the fingerprint module shown on the first board surface;

[0032] Fig.11 yes Figure 7 A schematic structural diagram of the first circuit board of the fingerprint module shown on the second board surface;

[0033] Fig.12 is a schematic structural diagram of a contact module according to an embodiment of the present application;

[0034] Fig.13 yes Fig.12 The contact module shown is Figure 7 The schematic diagram of the fingerprint module after bonding is shown;

[0035] Fig.14 It is a schematic diagram of the local structure when multiple contact modules are spread out;

[0036] Fig.15 is a schematic diagram of the front structure of a smart IC card according to a second embodiment of the present application;

[0037] Fig.16 is a schematic diagram of the front structure of a smart IC card according to a third embodiment of the present application;

[0038] Fig.17 is a schematic diagram of the front structure of a smart IC card according to a fourth embodiment of the present application;

[0039] Fig.18 It is a structural schematic diagram of a smart IC card in an embodiment of the present application when it is inserted into a card reading device.

[0040] Bank IC card 100, fingerprint module 110, circuit board 111, first board surface 111a, second board surface 111b, fingerprint sensor 112, metal contact point 113, metal contact point 114, wire 115, plastic sealing layer 116, fingerprint collection surface 117, chip 120, metal contact point 121, card body 130;

[0041] The first direction is x, the second direction is y, and the third direction is z;

[0042] Card body 1, groove 10;

[0043] Fingerprint module 2, first circuit board 20, fingerprint sensor 21, plastic sealing layer 22, first window 200, first metal contact point 201, first window side 2001, second window side 2002, third window side 2003, first board surface 20a, second board surface 20b, fingerprint collection surface 210, second metal contact point 211, third metal contact point 212;

[0044] A second circuit board 3, a chip 30;

[0045] Contact module 4, fourth metal contact point 40, substrate 41, second window 42;

[0046] Card reading device 7, card slot 70, first window 71, display screen 72. DETAILED DESCRIPTION

[0047] In order to solve the above-mentioned technical problems existing in the prior art, in the smart IC card (hereinafter referred to as "smart IC card") and authentication system based on fingerprint recognition of the present application, the fingerprint module is packaged using flip-chip technology, so that the thickness of the fingerprint module is relatively small, which can be suitable for thinner smart IC cards, especially for scenarios where the metal contact points of the fingerprint module and the smart IC card are stacked. In addition, the stacking setting of the present application is to concentrate the metal contact points of the fingerprint module and the smart IC card in the area where the groove is set on the card body, so as to improve the integration of the smart IC card, and when the smart IC card is inserted into the card reading device, the card reading device (the fifth metal contact point) will contact the fourth metal contact point of the smart IC card to support the smart IC card. The user only needs to press a single finger to complete the fingerprint recognition, which is very convenient to operate.

[0048] The specific expression of parameters such as shape, quantity, size, etc. of any of the fingerprint module, each metal contact point, each circuit board and contact module can be determined according to the adaptability required by the actual scenario.

[0049] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly described below in conjunction with specific embodiments and corresponding drawings. Obviously, the embodiments described below are only part of the embodiments of the present application, not all of the embodiments. In the absence of conflict, the following embodiments and their technical features can be combined with each other and also belong to the technical solutions of the present application.

[0050] In the description of the embodiments of the present application, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", and "counterclockwise" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the technical solutions of the corresponding embodiments, rather than indicating or implying that a device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation on the present application.

[0051] See also Figures 4 to 8 As shown, an example of a smart IC card of the present application includes a card body 1, a fingerprint module 2, a second circuit board 3 and a contact module 4.

[0052] For ease of description and understanding, the smart IC card is parallel to the paper surface and is used as a reference. Figures 4 to 6 In the placement orientation shown, the length direction of the smart IC card is called the first direction x, the height direction is called the second direction y, and the thickness direction is called the third direction z. The first direction x, the second direction y and the third direction z are perpendicular to each other and can be regarded as the three coordinate axes of the three-dimensional rectangular coordinate system. It should be understood that the so-called perpendicularity in the whole application does not require that the angle between the two must be 90°, but allows a deviation of, for example, ±10°, that is, the so-called perpendicularity can be understood as the angle between any two directions is 80° to 100°. Similarly, the so-called parallelism in the whole application does not require that the angle between the two must be 0° or 180°, but allows a deviation of, for example, ±10°, that is, the so-called parallelism can be understood as the angle between any two directions is 0° to 10° or 170° to 190°.

[0053] The card body 1 is the main part of the smart IC card. Taking the smart IC card as a bank card as an example, the card body 1 is a sheet-like structure as a whole, and its material includes but is not limited to one or more of PVC (polyvinyl chloride), ABS (acrylonitrile-butadiene-styrene copolymer), and PET (polyethylene terephthalate); PVC, as a plastic material, has good mechanical hardness and corrosion resistance and low cost; ABS has high mechanical strength and durability, which can make the smart IC card have a longer service life; PET has good high temperature resistance, which can make the smart IC card suitable for high temperature environment.

[0054] The card body 1 is provided with a groove 10, the notch (i.e., opening) of the groove 10 is located on the first card surface of the card body 1, and the first card surface can be regarded as the front of the smart IC card. When observed along the line of sight of the third direction z, the orthographic projection (i.e., the shape of the notch) of the groove 10 can be a rounded rectangle or a rectangle. This article takes a rounded rectangle as an example for illustration and description.

[0055] Optionally, along the thickness direction of the card body 1, that is, along the third direction z, the groove 10 does not penetrate the card body 1, and there is still a certain distance between the bottom of the groove 10 and the back of the card body 1. Figure 5 As shown, the back side of the smart IC card can be the same as the traditional structure.

[0056] The fingerprint module 2 is packaged in the card body 1. Figures 7 to 11 As shown, the fingerprint module 2 includes a first circuit board 20 and a fingerprint sensor 21. The first circuit board 20 is provided with a first window 200 and a first metal contact point 201. The first metal contact point 201 is provided on the first board surface 20a of the first circuit board 20. The first board surface 20a and the second board surface 20b are two large surfaces of the first circuit board 20 that are arranged opposite to each other. The fingerprint sensor 21 is provided with a fingerprint collection surface 210 and a plurality of second metal contact points 211. These second metal contact points 211 are arranged on the same side as the fingerprint collection surface 210 and are located outside the area where the fingerprint collection surface 210 is located. In the fingerprint module 2, each second metal contact point 211 faces the corresponding first metal contact point 201 and is electrically connected to each first metal contact point 201 one by one. For example, solder paste or conductive glue can be used to achieve electrical connection. The fingerprint collection surface 210 is exposed to the second board surface 20b of the first circuit board 20 through the first window 200. Optionally, along a direction perpendicular to the first circuit board 20, that is, along a third direction z, the orthographic projections of the fingerprint collection surface 210 and the first window 200 overlap.

[0057] In one example, the fingerprint collection surface 210 is flush with or lower than the second board surface 20b of the first circuit board 20, which is beneficial to reduce the risk of the fingerprint collection surface 210 being scratched by contacting other objects in the fingerprint module 2. In other examples, the fingerprint collection surface 210 may also protrude from the second board surface 20b of the first circuit board 20. Preferably, the height of the fingerprint collection surface 210 protruding from the second board surface 20b can make the fingerprint collection surface 210 lower than the first card surface of the card body 1, which is beneficial to reduce the risk of the fingerprint collection surface 210 being scratched by contacting other objects in the smart IC card.

[0058] The first circuit board 20 is provided with a plurality of third metal contact points 212 on the second board surface 20 b.

[0059] In one example, if Figure 8As shown, the fingerprint module 2 may further include a plastic encapsulation layer 22, which is disposed on the side of the fingerprint sensor 21 facing away from the fingerprint collection surface 210, and the plastic encapsulation layer 22 encapsulates the fingerprint sensor 21 on the first board surface 20a of the first circuit board 20. The material and preparation method of the plastic encapsulation layer 22 can refer to the prior art. By providing the plastic encapsulation layer 22, the present application can enable the fingerprint module 2 to be produced, sold and transported as a single device.

[0060] like Figure 6 As shown, the second circuit board 3 is encapsulated in the card body 1, and is provided with a chip 30, which can be mounted on the surface of the second circuit board 3 by SMT (Surface Mounted Technology). In actual scenarios, the second circuit board 3 can be completely wrapped by the card body 1 without being exposed, and the second circuit board 3, as the main circuit board of the entire smart IC card, can be a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit) or a combination of the two. In actual scenarios, the fingerprint module 2 can be set on the second circuit board 3, for example, the first circuit board 20 of the fingerprint module 2 is stacked with the second circuit board 3 to achieve electrical connection, and the first board surface 20a of the first circuit board 20 faces the second circuit board 3. The user fingerprint features collected by the fingerprint module 2 are transmitted to the chip 30 through the first circuit board 20 and the second circuit board 3, and the chip 30 performs fingerprint comparison to realize the authentication of the user identity, that is, the first authentication is completed.

[0061] The contact module 4 is encapsulated in the card body 1, and includes a plurality of fourth metal contact points 40 electrically connected to the second circuit board 3, each of which is exposed to the first card surface of the card body 1 and protrudes from the fingerprint collection surface 210. These fourth metal contact points 40 are arranged adjacent to two opposite sides of the groove 10 respectively; the third metal contact points 212 are electrically connected to the fourth metal contact points 40 in a one-to-one correspondence, and the electrical connection can be achieved by using solder paste or conductive glue, for example.

[0062] See also Figure 4 , Figure 6 , Fig.12 and Fig.13As shown, the contact module 4 can be provided with a substrate 41, and the substrate 41 is provided with a second window 42, the second window 42 at least partially overlaps with the notch of the groove 10, the fingerprint collection surface 210 is exposed through the second window 42, and each fourth metal contact point 40 passes through the substrate 41 to be exposed to two opposite surfaces of the substrate 41. Here, in the smart IC card of the present application, one side of each fourth metal contact point 40 is electrically connected to each third metal contact point 212 in a one-to-one correspondence, and the other side of each fourth metal contact point 40 is exposed to the first card surface of the card body 1.

[0063] In an actual scenario, the substrate 41 may be a flexible substrate, such as a flexible circuit board. In this case, in the production process, a plurality of contact modules 4 may be assembled in a reel-to-reel manner before attaching the fingerprint module 2. Fig.14 As shown, a plurality of reel-type contact modules 4 are first spread out (six contact modules 4 are shown in the figure for exemplary display only), and then each fingerprint module 2 is attached to the corresponding contact module 4. Specifically, the second board surface 20b of the first circuit board 20 of the fingerprint module 2 is attached to the substrate 41, and the fingerprint collection surface 210 is aligned with the second window 42 of the substrate 41; then, for each fingerprint module 2 and the corresponding contact module 4, a one-to-one electrical connection is made between the fourth metal contact point 40 and the third metal contact point 212, and finally, the contact modules 4 after the attachment are separated and respectively encapsulated in the corresponding card body 1, so as to obtain a plurality of smart IC cards.

[0064] In one example, the substrate 41 and the second circuit board 3 can be electrically connected through a conductive column, that is, for any conductive column, one end of the conductive column is disposed on the second circuit board 3 and electrically connected to the second circuit board 3, and the other end of the conductive column is electrically connected to the substrate 41, and a wiring is disposed in the substrate 41 so that the fourth metal contact point 40 is electrically connected to the second circuit board 3. The present application is based on the connection method of the conductive column, which has strong anti-bending ability, relatively stable electrical connection, and helps to extend the service life.

[0065] Optionally, the conductive pillar may be a copper pillar.

[0066] Of course, in other examples, the smart IC card can also achieve electrical connection between the substrate 41 and the second circuit board 3 through wires, that is, the smart IC card includes a flexible flat cable encapsulated in the card body 1, one end of the flexible flat cable is connected to the substrate 41, and the other end is connected to the second circuit board 3.

[0067] Combination Figure 4As shown, the fingerprint collection surface 210 of the fingerprint module 2 is exposed to the first card surface of the card body 1 through the notch of the groove 10, and the fingerprint collection surface 210 is used to receive the pressure of the user's finger, so as to collect the fingerprint of the user's finger by contacting the user's finger. In one example, the fingerprint collection surface 210 can be lower than the first card surface of the card body 1, which is conducive to reducing the risk of the fingerprint collection surface 210 being scratched due to contact with other objects. The height difference between the fingerprint collection surface 210 and the first card surface of the card body 1, that is, the distance along the third direction z, can be determined according to the adaptability of actual needs, for example, it can be determined according to the thickness and flexibility of the card body 1, as long as it does not affect the effective collection of fingerprints. In other examples, the fingerprint collection surface 210 can also be flush with the first surface of the card body 1.

[0068] The fourth metal contact point 40 is used to contact the metal contact point of the card reader (referred to as the "fifth metal contact point"), so that the card reader can read the information of the smart IC card and interact with the smart IC card. A portion of the fourth metal contact points 40 is arranged adjacent to the first side of the groove 10, and another portion of the fourth metal contact points 40 is arranged adjacent to the second side of the groove 10. The first side and the second side are arranged oppositely, that is, the fourth metal contact points 40 are distributed on two opposite sides of the groove 10 and are arranged along the extension direction of each side.

[0069] In one example, when the smart IC card is provided with an even number of fourth metal contact points 40, the number of fourth metal contact points 40 arranged adjacent to the first side and the second side can be equal. The total number of fourth metal contact points 40 can be determined according to actual needs; for example, Figure 4 The smart IC card shown is provided with eight fourth metal contact points 40, four fourth metal contact points 40 are provided adjacent to the first side, and four fourth metal contact points 40 are also provided adjacent to the second side; for another example, Fig.15 The smart IC card shown is provided with six fourth metal contact points 40 , three fourth metal contact points 40 are provided adjacent to the first side, and three fourth metal contact points 40 are also provided adjacent to the second side.

[0070] For the case where the smart IC card is provided with an odd number of fourth metal contact points 40, the number of fourth metal contact points 40 arranged adjacent to the first side and the second side can differ by one, or can be equal, but the remaining fourth metal contact point 40 can be arranged adjacent to the third side of the groove 10, which is a side vertically connected to the first side and the second side.

[0071] On any side edge adjacent to the groove 10 , the distances between any adjacent fourth metal contact points 40 may be equal, so as to achieve an equidistant arrangement of the fourth metal contact points 40 .

[0072] like Figure 4 and Fig.15 As shown, along the direction perpendicular to the first surface, that is, along the third direction z, the orthographic projection of the groove 10 is a rectangle; the first side and the second side can be the length sides of the groove 10, and the fourth metal contact points 40 on either side of the groove 10 are arranged in sequence along the first direction x. In other examples, for example Fig.16 and Fig.17 As shown, the first side and the second side can be the width side of the groove 10, and the fourth metal contact points 40 on either side of the groove 10 are arranged in sequence along the second direction y. It should be understood that the arrangement direction of the fourth metal contact points 40 on either side of the groove 10 should be determined according to the arrangement mode of the fifth metal contact points in the card reading device. For example, the arrangement mode of the metal contact points of the two can be the same, and the fourth metal contact points 40 are arranged one by one with the fifth metal contact points.

[0073] It should be understood that the number and arrangement shape of the third metal contact points 212 and the fourth metal contact points 40 are the same, for example, see Figure 7 and Fig.11 As shown, along the third direction z, the orthographic projection of the first window 200 is a rectangle. Optionally, the first window 200 is aligned with the groove 10. The third metal contact point 212 is arranged adjacent to the first window side 2001 and the second window side 2002 of the first window 200, and the first window side 2001 and the second window side 2002 are arranged opposite to each other. Based on this arrangement, the plurality of second metal contact points 211 can be arranged adjacent to the third window side 2003 of the first window 200, and the third window side 2003 is vertically connected to the first window side 2001 and the second window side 2002.

[0074] In the above-mentioned smart IC card of the present application, the fingerprint module 2 is equivalent to using the flip-chip technology, and the thickness of the fingerprint module 2 is relatively small, which is conducive to being suitable for thinner smart IC cards, especially for scenarios where the metal contact points of the fingerprint module 2 and the smart IC card (i.e., the fourth metal contact point 40) are stacked.

[0075] See also Figure 4 and Figure 6 As shown, along the thickness direction of the card body 1, that is, along the third direction z, the fingerprint module 2 and the plurality of fourth metal contact points 40 are stacked. The fingerprint module 2 using the flip chip technology in this application can meet the small thickness design index when the fingerprint module 2 and the metal contact points 40 of the smart IC card are stacked. In addition, compared with Figure 1The existing fingerprint module 110 and metal contact points 121 shown are arranged flatly along the surface where the card body 130 is located. The stacking arrangement of the present application can concentrate the fingerprint module 2 and multiple fourth metal contact points 40 of the smart IC card in a smaller area, for example, in an area where the groove 10 is set in the card body 1, which can improve the integration of the smart IC card, help reduce the material cost required for connecting the fingerprint module 2 and multiple fourth metal contact points 40 with the chip 30, and improve the bending resistance of the smart IC card, which helps to extend the service life.

[0076] Also, see Figure 4 , Figure 6 and Fig.18 As shown, Fig.18 7 is a schematic diagram of a state where the smart IC card of the present application is inserted into a card reader 7. The card reader 7 is provided with a fifth metal contact point (not shown), a card slot 70 and a third window 71. The insertion port of the card slot 70 may be located on the side of the card reader 7. The third window 71 is connected to the card slot 70 and is located on the large surface of the card reader 7. The large surface is vertically connected to the side surface. For example, the card reader 7 may be provided with a display screen 72 on a surface. The smart IC card is inserted into the card reader 7 through the opening of the card slot 70 until the fingerprint collection surface 210 is located in the card reader 7 and is completely exposed through the third window 71, and the fifth metal contact point is in one-to-one contact with the fourth metal contact point 40 of the smart IC card.

[0077] When the smart IC card is inserted into the card reader 7, the fifth metal contact point of the card reader 7 contacts the fourth metal contact point 40 of the smart IC card, thereby holding the smart IC card. When collecting fingerprints, the user's single finger presses on the fingerprint collection surface 210 of the fingerprint module 2, and the fingerprint collection surface 210 collects the fingerprint image of the single finger. The fingerprint module 2 transmits the fingerprint image to the chip 30, and the chip 30 analyzes the fingerprint features of the fingerprint image and compares them with the pre-stored fingerprint features. When they are consistent, it is determined that the user identity has passed the authentication, also known as the first authentication, and the first authentication is completed by the smart IC card alone; then, the chip 30 transmits the account information such as the card number of the smart IC card to the fifth metal contact point of the card reader 7 through multiple fourth metal contacts 40, so that the card reader 7 completes the comparison between the password input by the user and the password corresponding to the account information. When they are consistent, it is determined that the password input by the user has passed the second authentication. The present application changes the fingerprint sensing area (i.e., fingerprint collection surface 210) of the smart IC card from the outside of the traditional card reader 7 to the inside of the card reader 7, and uses the card reader 7 to hold the smart IC card to perform fingerprint image collection and recognition. This operation method avoids the need to hold the smart IC card with another finger when pressing with one finger, which can bring great convenience to the user.

[0078] Please continue reading Figure 4 and Figure 6 As shown, the exposed surface of each fourth metal contact point 40 may protrude from the first card surface of the card body 1; along the direction perpendicular to the first card surface of the card body 1, that is, along the third direction z, the fingerprint collection surface 210 of the fingerprint module 2 is arranged opposite to the exposed surface of the fourth metal contact point 40. In other examples, the exposed surface of each fourth metal contact point 40 may be flush with the first card surface of the card body 1, that is, each fourth metal contact point 40 may be embedded in the card body 1; of course, the exposed surface of each fourth metal contact point 40 may also be recessed in the first card surface of the card body 1, which needs to be determined according to the adaptability of the usage scenario.

[0079] An embodiment of the present application also provides an authentication system, which includes a card reader and a smart IC card based on fingerprint recognition, wherein the card reader is provided with a fifth metal contact point, a card slot and a window (which may be referred to as a "third window"). The card slot is used to allow the smart IC card to be inserted into the card reader until the fingerprint collection surface of the smart IC card is located in the card reader and is fully exposed through the third window, and the fifth metal contact point is in one-to-one contact with the fourth metal contact point of the smart IC card.

[0080] The card reader device may be specifically a POS machine, an ATM machine, etc., for example, the card reader device may be Fig.18 In the POS machine shown, the smart IC card can be any of the smart IC cards in the aforementioned examples. Therefore, the authentication system at least has the beneficial effects that can be produced by the smart IC card in the corresponding examples, which will not be repeated here.

[0081] It should be understood that the card reading device and the smart IC card provided in the embodiments of the present application are complete devices respectively, and also have the corresponding structures of known devices, which will not be described one by one here.

[0082] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. For ordinary technicians in this field, all equivalent structural changes made using the contents of this specification and drawings are also included in the patent protection scope of the present application.

[0083] Although the terms "first, second", etc. are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. In addition, the singular forms "one", "an", and "the" are intended to include plural forms as well. The terms "or" and "and / or" are interpreted as inclusive, or mean any one or any combination. Only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way, an exception to this definition will occur.

Claims

1. A smart IC card based on fingerprint recognition, characterized in that: include: The card body is provided with a groove, and the notch of the groove is located on the first card surface of the card body; A fingerprint module is packaged in the card body, the fingerprint module includes a first circuit board and a fingerprint sensor, the first circuit board is provided with a first window and a first metal contact point, the first metal contact point is provided on the first board surface of the first circuit board, the fingerprint sensor is provided with a fingerprint collection surface and a plurality of second metal contact points provided on the same side outside the fingerprint collection surface, the second metal contact points face the first metal contact points and are electrically connected one by one, the fingerprint collection surface is exposed to the second board surface of the first circuit board through the first window, the second board surface is arranged opposite to the first board surface, and the first circuit board is provided with a plurality of third metal contact points on the second board surface; A second circuit board is packaged in the card body and is provided with a chip, the first circuit board is electrically connected to the second circuit board, and the first board surface of the first circuit board faces the second circuit board; A contact module is encapsulated in the card body and includes a plurality of fourth metal contact points electrically connected to the second circuit board, each of which is exposed to the first card surface of the card body, and the plurality of fourth metal contact points are respectively arranged adjacent to two opposite sides of the groove; the third metal contact point is electrically connected to the fourth metal contact point in a one-to-one correspondence, the fingerprint collection surface is exposed to the first card surface through the notch of the groove, and each of the fourth metal contact points protrudes from the fingerprint collection surface.

2. The smart IC card based on fingerprint recognition according to claim 1 is characterized in that: The second metal contact point and the first metal contact point, and the third metal contact point and the fourth metal contact point are electrically connected by using solder paste or conductive glue.

3. The smart IC card based on fingerprint recognition according to claim 1 is characterized in that: The fingerprint module further includes a plastic packaging layer, which is arranged on a side of the fingerprint sensor facing away from the fingerprint collection surface, and packages the fingerprint sensor on the first board surface of the first circuit board.

4. The smart IC card based on fingerprint recognition according to claim 1 or 3, characterized in that: The fingerprint collection surface is flush with the second board surface of the first circuit board; or, the fingerprint collection surface protrudes from the second board surface of the first circuit board and is lower than the first card surface of the card body.

5. The smart IC card based on fingerprint recognition according to claim 4 is characterized in that: Along a direction perpendicular to the first circuit board, the fingerprint collection surface and the orthographic projection of the first window overlap.

6. The smart IC card based on fingerprint recognition according to claim 1, characterized in that: Along a direction perpendicular to the first circuit board, the orthographic projection of the first window is a rectangle, the third metal contact point is arranged adjacent to the first window side and the second window side of the first window, the multiple second metal contact points are arranged adjacent to the third window side of the first window, the first window side and the second window side are arranged opposite to each other and vertically connected to the third window side.

7. The smart IC card based on fingerprint recognition according to claim 6 is characterized in that: Along a direction perpendicular to the first circuit board, the first opening window is aligned with the groove.

8. The smart IC card based on fingerprint recognition according to claim 1, 6 or 7, characterized in that: The contact module also includes a substrate, which is provided with a second window, the second window at least partially overlaps with the notch of the groove, the fingerprint collection surface is exposed through the second window, and each of the fourth metal contact points passes through the substrate to be exposed to two opposite surfaces of the substrate.

9. The smart IC card based on fingerprint recognition according to claim 8, characterized in that: The substrate is a flexible substrate.

10. An authentication system, characterized in that: A card reader and a smart IC card based on fingerprint recognition as claimed in any one of claims 1 to 9; The card reader device is provided with a fifth metal contact point, a card slot and a third window, wherein the card slot is used to allow the smart IC card to be inserted into the card reader device until the fingerprint collection surface is located in the card reader device and is completely exposed through the third window, and the fifth metal contact point is in one-to-one contact with the fourth metal contact point of the smart IC card.

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