A high power diode assembly

Abstract

The present invention relates to the field of diode technology, and in particular, provides a high-power diode assembly, including a substrate, one end of the substrate is connected with a pin, the fixing part is bent downward in a direction exceeding the bottom surface of the substrate, so that a drop space is formed between the bottom surface of the substrate and the top surface of the fixing part, the bottom surface of the substrate is provided with an upward-sunken heat dissipation cavity, a first intercommunication notch is provided between the heat dissipation cavity and the top of the fixing part, and a first-level heat dissipation channel is formed between the bottom of the substrate and the top of the fixing part through the first notch; a second notch is provided on the end of the substrate connected with the pin, and since the pin is welded on a PCB board, or welded on other components on the PCB board, an inert agent is used to form a flame retardant effect between the pin and the substrate. One is to avoid the substrate from being burned due to the induced heat of the PCB, and the other is to avoid the PCB from being burned due to the induced heat of the substrate itself.

Description

Technical Field

[0001] The invention relates to the technical field of diodes, and in particular to a high-power diode component. Background Art

[0002] A Schottky diode is a type of high-power diode, which consists of a substrate, a pin connected to one end of the substrate, and a fixed part connected to the other end of the substrate. The fixed part has a fixing hole. When this type of diode is used in an application scenario, a screw is driven into the fixing hole to fix it through the fixing hole.

[0003] When the Schottky diode is installed in the scene through the fixing hole, the bottom surface of its substrate is in direct contact with the PCB board. The high-temperature heat generated during high-power operation is concentrated between the substrate and the PCB. The heat accumulates in a short time and the heat dissipation is poor. When the line fails, the heat will rise sharply, which will cause the risk of burning between the pins and the substrate. Summary of the invention

[0004] In order to solve the above problem and make the pin part of the diode have a flame retardant function, the present invention provides a high-power diode component, including a substrate, one end of the substrate is connected to a pin, the other end of the substrate is provided with a fixing part, the fixing part is bent downward in a direction exceeding the bottom surface of the substrate, so that a drop space is formed between the bottom surface of the substrate and the top surface of the fixing part, the bottom surface of the substrate is provided with an upward-sunken heat dissipation cavity, a first notch that communicates with each other is opened between the heat dissipation cavity and the top of the fixing part, and a primary heat dissipation channel is formed between the bottom of the substrate and the top of the fixing part through the first notch;

[0005] A second notch is provided on one end of the substrate connected to the pin, the second notch is located above the pin, and a secondary heat dissipation channel is formed between the bottom of the substrate and the top of the pin through the second notch;

[0006] The base is provided with a lift-off piece, one end of the lift-off piece is close to the second notch, the other end of the lift-off piece passes through the first notch to reach the top of the fixing part, a first locking hole is provided on the fixing part, a plastic sleeve is embedded in the first locking hole, one end of the lift-off piece reaching the top of the fixing part horizontally contacts the top end of the plastic sleeve and is provided with a second locking hole, and the second locking hole, the plastic sleeve and the first locking hole are connected up and down on the same axis;

[0007] A plastic tube is fixed on the top surface of one end of the lift-off piece close to the second notch, the bottom part of the plastic tube is a corrugated section, the top part is a non-corrugated section, the plastic tube is filled with an inert agent, and a spray hole is provided on the non-corrugated section of the plastic tube. When the end of the lift-off piece located on the plastic sleeve deflects downward, the end of the lift-off piece on which the plastic tube is installed deflects upward. The spray hole is a plastic hole. The spray hole automatically opens when the plastic tube is compressed and deformed, and the inert agent is sprayed into the second notch through the spray hole, and then flows from the second notch to the pin;

[0008] The bottom end of the plastic sleeve is flush with the bottom surface of the fixing portion.

[0009] As a further preferred embodiment, the part of the lift piece located in the first slot is provided with a bending portion, which tilts upward toward one end of the plastic sleeve and then extends horizontally on the plastic sleeve, and the other end of the bending portion tilts downward and extends horizontally to the second slot for installing the plastic tube.

[0010] As a further preference, both upper and lower ends of the plastic tube are sealed, the plastic tube is a colloid cystic tube, the inert agent is injected into the plastic tube at one time and is fully sealed in the plastic tube, when the plastic tube is in its original state, the spray hole is closed, and when the plastic tube is compressed and shortened, the spray hole is opened.

[0011] As further preferred, a carrier plate is provided on the bottom side of the base, the carrier plate is parallel to the bottom side of the lift piece, and a spring is connected between the carrier plate and the lift piece.

[0012] As further preferred, one end of the carrier plate extends close to the pin, and the other end of the carrier plate extends close to the bending portion.

[0013] As further preferred, the warping piece is a copper piece.

[0014] As further preferred, the second notch is an oblique notch, and the inclination direction of the second notch is inclined downward toward the pin.

[0015] As a further preferred embodiment, one end of the pin connected to the substrate is sleeved with a sleeve, and a mesh is opened on one side of the top of the sleeve. The inert agent sprayed from the second slot flows into the sleeve through the mesh, flows from one end of the mesh to the top surface of the pin, and flows from the other side of the sleeve to the other side of the pin, so that the pin is completely flame retardant.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The bottom of the Schottky diode is provided with a heat dissipation cavity and notches on both sides. When the Schottky diode is heated, it not only uses the heat dissipation cavity but also uses the notches on both sides to dissipate heat. The heat released into the heat dissipation cavity evaporates directly outward through the exposed bottom and evaporates directly to the side through the first notch. In addition, the heat is also transferred to the warp. The warp transfers heat and releases it better toward the fixed part.

[0018] 2. A plastic tube is set in the heat dissipation cavity, and the plastic tube is filled with an inert agent. If the heat is higher due to a Schottky diode failure or a circuit failure, the heat fed back to the warp will also be higher. At this time, the warp continues to heat up and transfers the high temperature to the plastic tube and the plastic sleeve. When the plastic sleeve is heated and plastically deformed, it will be compressed and shortened. When the top of the plastic sleeve is compressed and shortened due to plastic deformation, the right end of the warp will deflect downward, and the left end of the warp will deflect upward. The plastic tube is squeezed upward by the left end of the warp, and the plastic tube Air pressure is formed inside the plastic tube. As the bottom end of the plastic tube is continuously compressed upward, the air pressure increases, and the spray hole set on the non-corrugated section at the top of the plastic tube opens. The inert agent in the plastic tube is sprayed into the second notch through the spray hole. Since the second notch is located above the pin and tilted downward toward the direction of the pin, the inert agent flows to the pin through the second notch. Since the pin is welded on the PCB board, or welded on other components on the PCB board, the inert agent is used to form a flame retardant effect between the pin and the substrate. One is to avoid the induced heat of the PCB causing the substrate to burn, and the other is to avoid the induced heat of the substrate itself causing the PCB to burn. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of a high-power diode assembly provided in an embodiment of the present invention;

[0020] Figure 2 A high-power diode assembly provided in an embodiment of the present invention comprises Figure 1 The schematic diagram from the upward perspective is introduced;

[0021] Figure 3 A high-power diode assembly provided in an embodiment of the present invention comprises Figure 1 The main view plane diagram is derived;

[0022] Figure 4 A high-power diode assembly provided in an embodiment of the present invention comprises Figure 3 The main view plane diagram after the section is drawn;

[0023] Figure 5 A schematic diagram of the internal structure of a high-power diode component provided by an embodiment of the present invention when the external substrate is removed;

[0024] Figure 6 A schematic diagram showing the relationship between a sleeve and a pin in a high-power diode assembly provided by an embodiment of the present invention when viewed from a cross-sectional perspective.

[0025] In the figure: 1. base; 2. pin; 3. fixing part; 4. drop space; 5. heat dissipation cavity; 6. first notch; 7. second notch; 8. warping piece; 9. first locking hole; 10. plastic sleeve; 11. second locking hole; 12. plastic tube; 13. spray hole; 14. bending part; 15. carrier plate; 16. spring; 17. sleeve; 18. mesh. DETAILED DESCRIPTION

[0026] The above and other embodiments and advantages of the present invention are described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments.

[0027] In one embodiment, Figure 1-Figure 6 As shown:

[0028] The present embodiment provides a high-power diode component, including a substrate 1, one end of the substrate 1 is connected to a pin 2, the other end of the substrate 1 is provided with a fixing portion 3, the fixing portion 3 is bent downward in a direction exceeding the bottom surface of the substrate 1, so that a drop space 4 is formed between the bottom surface of the substrate 1 and the top surface of the fixing portion 3, the bottom surface of the substrate 1 is provided with an upward-sunken heat dissipation cavity 5, a first notch 6 communicating with the heat dissipation cavity 5 and the top of the fixing portion 3 is opened, and a primary heat dissipation channel is formed between the bottom of the substrate 1 and the top of the fixing portion 3 through the first notch 6; the Schottky diode is a kind of high-power diode, and the structure of the present invention is applied, so that when it is installed on a PCB board, the fixing portion 3 is the installation end, and the bottom surface of the fixing portion 3 is tightly attached to the PCB board after being fixed, and the bottom of the heat dissipation cavity 5 forms a space with the PCB board because the fixing portion 3 is bent downward and extended horizontally, so that the bottom of the Schottky diode is connected to the external gas through the heat dissipation cavity 5, so that when the Schottky diode is powered on and used, the heat generated can be released downward over a large area, avoiding heat overload and improving the service life.

[0029] A second notch 7 is provided on one end of the substrate 1 connected to the pin 2, and the second notch 7 is located above the pin 2. The second notch 7 forms a secondary heat dissipation channel between the bottom of the substrate 1 and the top of the pin 2; when the Schottky diode is powered on, the heat generated can be released outward through the second notch 7. Similarly, the heat is also released to the other side through the first notch 6, further avoiding heat overload and further improving the service life.

[0030] In addition, as shown in the figure, a copper lift piece 8 is provided in the base body 1, one end of the lift piece 8 is close to the second notch 7, and the other end of the lift piece 8 passes through the first notch 6 to reach the top of the fixing part 3, and a first locking hole 9 is provided on the fixing part 3, and a plastic sleeve 10 is embedded in the first locking hole 9, and one end of the lift piece 8 reaching the top of the fixing part 3 horizontally contacts the top of the plastic sleeve 10 and is provided with a second locking hole 11, and the second locking hole 11, the plastic sleeve 10 and the first locking hole 9 are connected up and down on the same axis;

[0031] A plastic tube 12 is fixed on the top surface of one end of the lifter 8 close to the second notch 7. The plastic tube 12 is filled with an inert agent. A spray hole 13 is provided at one end of the plastic tube 12 facing the second notch 7. When the end of the lifter 8 located on the plastic sleeve 10 deflects downward, the end of the lifter 8 on which the plastic tube 12 is installed deflects upward. The spray hole 13 is a plastic hole. The spray hole 13 automatically opens when the plastic tube 12 is compressed and deformed, and the inert agent is sprayed into the second notch 7 through the spray hole 13, and then flows from the second notch 7 to the pin 2.

[0032] The bottom end of the plastic sleeve 10 is flush with the bottom surface of the fixing portion 3 .

[0033] When the Schottky diode is installed on the PCB board, the screw is inserted into the second locking hole 11, and the plastic sleeve 10 is inserted from the second locking hole 11. As the screw is continuously tightened on the PCB board, the bottom surface of the fixing portion 3 is locked on the PCB board, and the bottom end of the plastic sleeve 10 is also locked on the PCB board. The pin 2 is soldered on the PCB board, and the bottom end of the substrate 1 is exposed above the PCB board due to the bottom surface of the fixing portion 3. When the Schottky diode is used in the circuit and current is passed through, heat is generated. Part of the heat is dissipated into the heat dissipation cavity 5 and directly evaporated outward due to the exposed bottom of the substrate 1. Part of the heat is evaporated outward from the first notch 6 through a primary heat dissipation channel formed between the bottom of the substrate 1 and the top of the fixing portion 3, thereby preventing the Schottky diode from overheating.

[0034] The plastic tube 12 is a colloid cystic tube, the upper and lower ends of the plastic tube 12 are closed, the bottom part of the plastic tube 12 is a corrugated section, the top part is a non-corrugated section, and the spray hole 13 is opened on the non-corrugated section. The inert agent is injected into the plastic tube 12 once and fully enclosed in the plastic tube 12. When the plastic tube 12 is in its original state, the spray hole 13 is closed, and when the plastic tube 12 is compressed and shortened, the spray hole 13 is opened. The inert agent can also be an inert powder, such as various fire extinguishing media commonly used in fire extinguishers, such as dry powder particles, aerogels, etc.

[0035] like Figure 4 , Figure 5As shown, in addition, since a lift piece 8 is provided in the heat dissipation cavity 5 and the first notch 6, and the lift piece 8 is a copper sheet, the heat released into the heat dissipation cavity 5 will not only evaporate directly outward through the exposed bottom, and evaporate directly to the side through the first notch 6, but will also be transferred to the lift piece 8. The lift piece 8 transfers heat and releases the heat better toward the fixing portion 3. If the heat is higher due to a Schottky diode failure or a circuit failure, the heat fed back to the lift piece 8 will also be higher. At this time, the lift piece 8 continues to heat up and transfers the high temperature to the plastic tube 12, and also to the plastic sleeve 10. The plastic sleeve 10 is a rubber sleeve , the top of the plastic sleeve 10 exceeds the top surface of the fixing portion 3 and drags on the bottom surface of the lift piece 8, so the plastic sleeve 10 will be compressed and shortened when it is heated and plastically deformed. Since the part of the lift piece 8 located in the first notch 6 is provided with a bending portion 14, the bending portion 14 is inclined upward toward one end of the plastic sleeve 10 and then extends horizontally on the plastic sleeve 10. The other end of the bending portion 14 is inclined downward and extends horizontally to the second notch 7 for installing the plastic tube 12. Therefore, when the top of the plastic sleeve 10 is compressed and shortened due to plastic deformation, the right end of the lift piece 8 will be deflected downward, and the left end of the lift piece 8 will be deflected upward, and the plastic tube 12 will be squeezed upward by the left end of the lift piece 8. The plastic tube 12 is as follows Figure 5 The bellows shown in the figure, therefore, the bottom end of the plastic tube 12 will be compressed upward when subjected to force, and then air pressure will be formed in the plastic tube 12. As the bottom end of the plastic tube 12 is continuously compressed upward, the air pressure will continue to increase, and the spray hole 13 set on the non-corrugated section at the top of the plastic tube 12 will open, and the inert agent in the plastic tube 12 will be sprayed into the second notch 7 through the spray hole 13. Since the second notch 7 is located above the pin 2 and is tilted downward in the direction of the pin 2, the inert agent will flow to the pin 2 through the second notch 7. Since the pin 2 is welded on the PCB board, or welded on other components on the PCB board, the inert agent will be used to form a flame retardant effect between the pin 2 and the substrate 1. First, it is to prevent the substrate 1 from being burned due to the induced heat of the PCB (or the components on the PCB board), and second, it is to prevent the PCB (or the components on the PCB board) from being burned due to the induced heat of the failure of the substrate 1 itself.

[0036] Since the Schottky diode is installed on the PCB board by locking with a screw, the top of the screw provides a clamping force to the lifter 8 when locking. Therefore, when the above situation occurs, when the heat transferred from the right end of the lifter 8 is transferred to the plastic sleeve 10, as long as the plastic sleeve 10 shows a tendency of plastic deformation, the top of the plastic sleeve 10 will be rapidly deformed with the help of the clamping force, the right end of the lifter 8 will be rapidly deflected downward, the left end of the lifter 8 will be rapidly deflected upward, and the plastic tube 12 will rapidly spray the inert agent toward the pin 2. It can be seen that the fixation of the lifter 8 and the installation of the Schottky diode on the PCB board are fixed by the same screw, which is not only convenient for installation, but also can use the locking force of the screw to promote the plastic sleeve 10 to undergo plastic deformation when high temperature occurs.

[0037] In another embodiment, 1 to Figure 5 As shown, a carrier plate 15 is provided on the bottom side of the base body 1 , the carrier plate 15 is parallel to the bottom side of the tilting piece 8 , and a spring 16 is connected between the carrier plate 15 and the tilting piece 8 . After the Schottky diode is installed on the PCB board, under the action of the screw locking, the bottom surface of the fixing part 3 is tightly attached to the PCB board, the bottom end of the plastic sleeve 10 is also tightly attached to the PCB board, and the bottom surface of the carrier board 15 is also tightly attached to the PCB board. In addition, the spring 16 between the carrier board 15 and the lift piece 8 is compressed and shortened. The spring 16 will store elastic force when it is compressed, and the stored elastic force is stored from the top to the bottom surface of the lift piece 8. It can be seen that once the top part of the plastic sleeve 10 is plastically deformed or develops in a plastic trend, in addition to causing the right end of the lift piece 8 to deflect downward under the assisting action of the screw, the spring 16 will also quickly release the elastic force to push the left end of the lift piece 8 to deflect upward. The force of the left end of the lift piece 8 deflecting upward is greater, and the greater thrust presses the plastic tube 12, which is more conducive to the compression and shortening of the bottom part of the plastic tube 12 in a short time, and is conducive to the inert agent in the plastic tube 12 to be sprayed out from the spray hole 13.

[0038] In another embodiment, if Figure 1 , Figure 3 as well as Figure 6 As shown, a sleeve 17 is sleeved on one end of the pin 2 connected to the substrate 1. The sleeve 17 is a hollow structure. Except for the interior of its four sides, which form a space with the four sides of the pin 2, a mesh 18 is opened on one side of the top of the sleeve 17. The inert agent sprayed from the second notch 7 flows into the sleeve 17 through the mesh 18, flows from one end of the mesh 18 to the top surface of the pin 2, and falls on the top surface of the pin 2. The excess inert agent flows from the top surface of the pin 2 to both sides and then flows to the other surfaces of the pin 2, making the pin 2 completely flame retardant.

[0039] The above orientation designations do not represent the specific orientations of the components in this implementation scheme. This implementation scheme is only for the convenience of describing the scheme, and the orientations are described relatively with reference to the figures. In essence, the specific orientations of the components are described according to their actual installation and actual use as well as the customary orientations of technicians in this field. This is hereby explained.

[0040] The specific implementation methods described above further describe the invention purpose, technical solutions, and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the protection scope of the present invention. It is particularly pointed out that for those skilled in the art, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high power diode assembly, characterized in that: The invention comprises a base (1), one end of the base (1) is connected to a pin (2), the other end of the base (1) is provided with a fixing portion (3), the fixing portion (3) is bent downward in a direction exceeding the bottom surface of the base (1), so that a drop space (4) is formed between the bottom surface of the base (1) and the top surface of the fixing portion (3), the bottom surface of the base (1) is provided with an upward-sunken heat dissipation cavity (5), a first notch (6) which is interconnected between the heat dissipation cavity (5) and the top of the fixing portion (3), and a primary heat dissipation channel is formed between the bottom of the base (1) and the top of the fixing portion (3) through the first notch (6); A second notch (7) is provided on one end of the base (1) to which the pin (2) is connected, the second notch (7) being located above the pin (2), and a secondary heat dissipation channel is formed between the bottom of the base (1) and the top of the pin (2) through the second notch (7); The base body (1) is provided with a lift-off piece (8), one end of the lift-off piece (8) is close to the second notch (7), the other end of the lift-off piece (8) passes through the first notch (6) to reach the top of the fixing part (3), a first locking hole (9) is provided on the fixing part (3), a plastic sleeve (10) is embedded in the first locking hole (9), one end of the lift-off piece (8) reaching the top of the fixing part (3) horizontally contacts the top of the plastic sleeve (10) and is provided with a second locking hole (11), the second locking hole (11), the plastic sleeve (10) and the first locking hole (9) are connected vertically and on the same axis; A plastic tube (12) is fixed on the top surface of one end of the lift-up piece (8) close to the second notch (7); the bottom portion of the plastic tube (12) is a corrugated section, and the top portion is a non-corrugated section. The plastic tube (12) is filled with an inert agent, and a spray hole (13) is provided on the non-corrugated section of the plastic tube (12). When one end of the lift-up piece (8) located on the plastic sleeve (10) deflects downward, the end of the lift-up piece (8) on which the plastic tube (12) is installed deflects upward. The spray hole (13) is a plastic hole. When the plastic tube (12) is compressed and deformed, the spray hole (13) automatically opens, and sprays the inert agent into the second notch (7) through the spray hole (13), and then flows from the second notch (7) to the pin (2); The bottom end of the plastic sleeve (10) is flush with the bottom surface of the fixing portion (3).

2. A high power diode assembly according to claim 1, characterized in that: The portion of the lifter (8) located in the first slot (6) is provided with a bending portion (14), the bending portion (14) is inclined upward toward one end of the plastic sleeve (10) and then extends horizontally on the plastic sleeve (10), and the other end of the bending portion (14) is inclined downward and then extends horizontally to the second slot (7) for installing the plastic tube (12).

3. A high power diode assembly according to claim 2, characterized in that: The upper and lower ends of the plastic tube (12) are both sealed. The plastic tube (12) is a colloid cystic tube. The inert agent is injected into the plastic tube (12) at one time and is fully sealed in the plastic tube (12). When the plastic tube (12) is in its original state, the spray hole (13) is closed. When the plastic tube (12) is compressed and shortened, the spray hole (13) is opened.

4. A high power diode assembly according to claim 3, characterized in that: A carrier plate (15) is provided on the bottom side of the base (1), the carrier plate (15) is parallel to the bottom side of the tilting piece (8), and a spring (16) is connected between the carrier plate (15) and the tilting piece (8).

5. A high power diode assembly according to claim 4, characterized in that: One end of the carrier board (15) extends close to the pin (2), and the other end of the carrier board (15) extends close to the bent portion (14).

6. A high power diode assembly according to claim 5, characterized in that: The warping piece (8) is a copper piece.

7. A high power diode assembly according to claim 6, characterized in that: The second notch (7) is an oblique notch, and the inclination direction of the second notch (7) is inclined downwards towards the pin (2).

8. A high power diode assembly according to claim 7, characterized in that: One end of the pin (2) connected to the base (1) is sleeved with a sleeve (17), and a mesh hole (18) is opened on one side of the top of the sleeve (17). The inert agent sprayed from the second notch (7) flows into the sleeve (17) through the mesh hole (18), flows from one end of the mesh hole (18) to the top surface of the pin (2), and flows from the other side of the sleeve (17) to the other side of the pin (2), so that the pin (2) is completely flame retardant.

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