Laser chip splitting method and system based on semiconductor refrigeration chip

Abstract

The present invention relates to the technical fields of laser rapid prototyping equipment, control systems, signal transmission, etc., and provides a laser splitting method and system based on semiconductor refrigeration sheets. A required closed shape is engraved on a glass panel by a laser engraving machine, and the glass panel with the closed shape is transported to a panel transmission mechanism of the splitting machine. The glass panel with the closed shape is transmitted to a cooling and heating splitting station of the splitting machine by the panel transmission mechanism. A semiconductor refrigeration sheet cooling device arranged at the cooling and heating splitting station is controlled to cool the inner area of ​​a cutting track, and a heating plate heating device arranged at the cooling and heating splitting station is controlled to heat the outer area of ​​the cutting track at the same time, or the inner area and the outer area of ​​the cutting track are heated at the same time, so that the cracks of the peripheral cutting track of the closed shape are connected, thereby reducing the splitting cost of the glass panel and improving the splitting efficiency.

Description

Technical Field

[0001] The present invention relates to the technical fields of laser rapid prototyping equipment, control systems, signal transmission, and the like, and in particular to a laser chip splitting method and system based on a semiconductor refrigeration sheet. Background Art

[0002] In the production process of glass panels, it is often necessary to cut the glass panels. For example, a required closed shape such as a rectangle, circle or triangle is cut on the glass panel. After the glass is laser cut into the required closed shape, the glass panel needs to be heated and cooled to form a wider crack along the cutting track, so that thicker glass can be cut under the action of the subsequent mechanical external force. In the prior art, heating is mainly performed by a laser beam heating device, and the device cost is too high; cooling is mainly performed by blowing cold air or nitrogen, and the cooling cost is too high and the efficiency is low.

[0003] In summary, the existing glass panel cracking process has technical problems such as high cost and low efficiency. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the present invention provides a laser cracking method and system based on semiconductor refrigeration sheets to reduce the cracking cost of glass panels and improve the cracking efficiency.

[0005] In a first aspect, the present invention provides a laser cracking method based on a semiconductor refrigeration sheet, comprising:

[0006] A desired closed shape is engraved on the glass panel by a laser engraving machine, and the peripheral cutting track of the closed shape divides the glass panel into an inner area of ​​the cutting track and an outer area of ​​the cutting track;

[0007] The glass panel having the closed shape is transported to a panel conveying mechanism of a splitting machine, and the glass panel having the closed shape is transported to a cooling and heating splitting station of the splitting machine through the panel conveying mechanism;

[0008] The semiconductor refrigeration plate cooling device arranged at the refrigeration and heating splitting station is controlled to cool the inner area of ​​the cutting track, and the heating plate heating device arranged at the refrigeration and heating splitting station is controlled to heat the outer area of ​​the cutting track at the same time, or the inner area of ​​the cutting track and the outer area of ​​the cutting track are heated at the same time, so that the cracks of the peripheral cutting track of the closed shape are penetrated.

[0009] In a second aspect, the present invention provides a laser chip splitting system based on a semiconductor refrigeration sheet, comprising:

[0010] A control system for running the above-mentioned laser chip splitting method based on semiconductor refrigeration sheet;

[0011] A laser engraving machine is connected and communicated with the control system and works under the control of the control system;

[0012] The chip splitter is connected and communicated with the control system and works under the control of the control system.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The present invention provides a laser cracking method and system based on semiconductor cooling sheets, wherein a desired closed shape is engraved on a glass panel by a laser engraving machine, and a peripheral cutting track of the closed shape separates the glass panel into an inner area of ​​the cutting track and an outer area of ​​the cutting track.

[0015] The glass panel with the closed shape is transported to the panel transmission mechanism of the splitting machine, and the glass panel with the closed shape is transmitted to the cooling and heating splitting station of the splitting machine through the panel transmission mechanism, and the semiconductor refrigeration plate cooling device arranged at the cooling and heating splitting station is controlled to cool the inner area of ​​the cutting track, and the heating plate heating device arranged at the cooling and heating splitting station is controlled to heat the outer area of ​​the cutting track at the same time, or the inner area and the outer area of ​​the cutting track are heated at the same time, so that the cracks of the peripheral cutting track of the closed shape are connected, thereby reducing the splitting cost of the glass panel and improving the splitting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their description are used to explain the present invention and do not constitute an improper limitation of the present invention. Some specific embodiments of the present invention will be described in detail in an exemplary and non-restrictive manner with reference to the drawings. The same reference numerals in the drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the drawings:

[0017] Figure 1 It is a flow chart of a laser splitting method based on a semiconductor refrigeration sheet according to an embodiment of the present invention;

[0018] Figure 2 It is a structural schematic diagram of a chip splitting machine according to an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of a semiconductor refrigeration plate cooling device according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic structural diagram of a heating device for a heating plate according to an embodiment of the present invention;

[0021] Figure 5 is another structural schematic diagram of the heating device of the heating plate according to the embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of the structure of a laser engraving machine according to an embodiment of the present invention;

[0023] Figure 7 This is a structural schematic diagram of a linear belt mechanism embodied in a laser engraving machine according to an embodiment of the present invention;

[0024] Figure 8 This is a structural schematic diagram of a positioning clamping mechanism of a laser engraving machine according to an embodiment of the present invention;

[0025] Fig. 9 This is a structural schematic diagram of a positioning mechanism of a laser engraving machine according to an embodiment of the present invention;

[0026] Fig.10 It is a structural schematic diagram of a laser engraving device embodied in a laser engraving machine according to an embodiment of the present invention;

[0027] Fig.11 It is a schematic diagram of the architecture of a laser chip splitting system based on a semiconductor refrigeration sheet according to an embodiment of the present invention.

[0028] Description of reference numerals:

[0029] 1. Laser engraving machine; 10. Linear conveyor belt mechanism; 100. First conveyor belt; 101. Second conveyor belt; 102. Shaft mechanism; 103. Motor belt mechanism; 104. Alignment clamping mechanism; 1040. First slide rail; 1041. Second slide rail; 1042. First side alignment fixture; 1043. Second side alignment fixture; 1044. Clamping alignment drive mechanism; 105. Support foot; 11. Machine platform; 12. Alignment mechanism; 1 20. Push-pull drive mechanism; 121. Lifting drive mechanism; 122. Alignment plate mechanism; 1220. Alignment plate; 13. Laser engraving device; 130. Moving assembly; 1300. Z-axis assembly; 1301. X-axis assembly; 1302. Y-axis assembly; 1303. Gantry; 131. Laser engraving assembly; 1310. Laser; 1311. Galvanometer; 1312. Support plate; 1313. Support block; 1314. Laser channel;

[0030] 2. Water cooling machine;

[0031] 3. Splitting machine; 30. Chassis; 31. Panel transmission mechanism; 310. First linear belt mechanism; 311. Second linear conveyor belt mechanism; 32. Cylinder lifting baffle; 33. Heating plate heating device; 330. Heating plate; 3300. First transverse heating plate; 3301. Second transverse heating plate; 3302. First longitudinal heating plate; 3303. Second longitudinal heating plate; 331. Adjustment guide rail; 3310. First longitudinal guide rail; 3311. Second longitudinal guide rail; 3312. First transverse guide rail; 3313. Second transverse guide rail; 34. Semiconductor refrigeration plate cooling device; 340. Refrigeration box; 341. Semiconductor refrigeration plate fixture; 342. Support column; 343. Cylinder mounting plate; 344. Boosting cylinder; 345. Linear bearing;

[0032] 4. Control system;

[0033] 5. Glass panel. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only an embodiment of a part of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of the present invention.

[0035] Embodiment 1

[0036] See also Figure 1-Figure 11 This embodiment provides a laser cracking method based on a semiconductor refrigeration sheet, including step S101, step S102 and step S103.

[0037] S101, engraving a desired closed shape on a glass panel by a laser engraving machine, wherein a peripheral cutting track of the closed shape divides the glass panel into an inner area of ​​the cutting track and an outer area of ​​the cutting track;

[0038] S102, transporting the glass panel having the closed shape to a panel conveying mechanism of a splitting machine, and conveying the glass panel having the closed shape to a cooling and heating splitting station of the splitting machine through the panel conveying mechanism;

[0039] S103, control the semiconductor refrigeration plate cooling device set at the cooling and heating splitting station to cool the inner area of ​​the cutting track, and simultaneously control the heating plate heating device set at the cooling and heating splitting station to heat the outer area of ​​the cutting track, or heat the inner area of ​​the cutting track and the outer area of ​​the cutting track at the same time, so as to make the cracks of the closed-shaped peripheral cutting track penetrate.

[0040] It should be noted that, in the present embodiment, a desired closed shape is engraved on the glass panel by a laser engraving machine, and the peripheral cutting track of the closed shape divides the glass panel into an inner area of ​​the cutting track and an outer area of ​​the cutting track, and the glass panel having the closed shape is transported to the panel transmission mechanism of the splitting machine, and the glass panel having the closed shape is transmitted to the cooling and heating splitting station of the splitting machine by the panel transmission mechanism, and the semiconductor refrigeration plate cooling device arranged at the cooling and heating splitting station is controlled to cool the inner area of ​​the cutting track, and at the same time, the heating plate heating device arranged at the cooling and heating splitting station is controlled to heat the outer area of ​​the cutting track, or the inner area of ​​the cutting track and the outer area of ​​the cutting track are heated simultaneously, so that the cracks of the peripheral cutting track of the closed shape are connected, thereby reducing the splitting cost of the glass panel and improving the splitting efficiency.

[0041] In step S101, when engraving the required closed shape, the product transmission mechanism of the laser engraving machine is controlled to transmit the glass panel to the laser engraving station, and the laser engraving device of the laser engraving machine is controlled to laser engrave the glass panel at the laser engraving station with a preset laser engraving path. During the laser engraving process, the water cooler 2 set on one side of the laser engraving machine is controlled to circulate and cool the laser engraving device, so that the laser engraving device is kept within a safe temperature range for laser engraving, so as to form the required closed shape on the glass panel. In some preferred embodiments, the product transmission mechanism adopts a linear conveyor belt mechanism 10, and the linear conveyor belt mechanism 10 is arranged on the machine table 11 of the laser engraving machine 1; during the transmission process of the linear conveyor belt mechanism 10, the glass panel 5 is placed flat on the conveyor belt of the linear conveyor belt mechanism 10, and is transmitted to the laser engraving station through the conveyor belt. Furthermore, the laser engraving station is provided with an in-position sensor and an alignment mechanism 12; the alignment mechanism 12 is located in the product transmission direction of the linear conveyor mechanism 10, and has an alignment plate surface 1220 perpendicular to the product transmission direction; when the in-position sensor detects that the glass panel 5 is in position, the glass panel 5 is controlled to collide and align with the alignment mechanism 12, so that the collision surface of the glass panel 5 remains parallel to the alignment plate surface 1220. Specifically, the laser engraving station is arranged on the conveyor belt of the linear conveyor mechanism 10, and the in-position sensor and the alignment mechanism 12 are arranged on the linear conveyor mechanism 10. It should be noted that due to reasons such as feeding errors, when the glass panel reaches the laser engraving station, different degrees of transmission deviation may occur, affecting the accuracy of laser engraving. In this embodiment, the alignment mechanism is located in the product transmission direction of the linear conveyor mechanism, and has an alignment plate surface perpendicular to the product transmission direction. When the in-place sensor detects that the glass panel is in place, the glass panel is controlled to collide and align with the alignment mechanism so that the collision surface of the glass panel remains parallel to the alignment plate surface, thereby correcting the transmission deviation and improving the accuracy and quality of engraving.The linear conveyor mechanism 10 includes a first conveyor belt 100 and a second conveyor belt 101 which are spaced apart from each other, a rotating shaft mechanism 102 which is located between the first conveyor belt 100 and the second conveyor belt 101 and connects the first conveyor belt 100 and the second conveyor belt 101, a motor belt mechanism 103 which is connected to the rotating shaft mechanism 102 and drives the rotating shaft mechanism 102 to rotate, and an alignment clamping mechanism 104 which is arranged on the machine table 11 of the laser engraving machine 1; the first conveyor belt 100 and the second conveyor belt 101 are supported on the machine table 11 by a plurality of supporting legs 105, and the motor belt mechanism 103 is arranged on the machine table 11; when the rotating shaft mechanism 102 rotates, it drives the first conveyor belt 100 and the second conveyor belt 101 to move, so as to transmit the glass panel 5 to the laser engraving station for collision and alignment with the alignment mechanism 12, and correct the transmission deviation, and after the collision and alignment, the alignment clamping mechanism 104 clamps the glass panel 5 after the transmission deviation is corrected for lateral alignment. It should be noted that, in this embodiment, the alignment clamping mechanism in the linear conveyor mechanism cooperates with the alignment mechanism to realize the first collision alignment in the product transmission direction and the second clamping alignment on both sides of the product, thereby further improving the precision and quality of engraving. Among them, the first collision alignment is reflected in that when the glass panel is in place, the glass panel collides and aligns with the alignment mechanism so that the collision surface of the glass panel remains parallel to the alignment plate surface 1220, thereby correcting the transmission offset. The second clamping alignment on both sides of the product is reflected in that the alignment clamping mechanism 104 in the linear conveyor mechanism 10 clamps the glass panel 5 after the transmission offset correction for lateral alignment. The two consecutive alignments allow the glass panel 5 to be accurately parked at the laser engraving station, further improving the engraving precision and quality during laser engraving. Further, the alignment clamping mechanism 104 includes a first slide rail 1040 and a second slide rail 1041 arranged in parallel and at intervals on the machine table 11, a first side alignment fixture 1042 and a second side alignment fixture 1043 respectively connected to the first slide rail 1040 and the second slide rail 1041 in a sliding manner, and a clamping alignment driving mechanism 1044 connecting the first side alignment fixture 1042 and the second side alignment fixture 1043; the first slide rail 1040 and the second slide rail 1041 are located between the first conveyor belt 100 and the second conveyor belt 100. 01 and are perpendicular to the first conveyor belt 100 and the second conveyor belt 101, the clamping and alignment driving mechanism 1044 is arranged on the machine platform 11 and is located below the first conveyor belt 100 and the second conveyor belt 101; the first side alignment clamp 1042 and the second side alignment clamp 1043 are located on both sides of the first conveyor belt 100 and the second conveyor belt 101, and are driven by the clamping and alignment driving mechanism 1044 to simultaneously move toward the two sides of the glass panel 5 to align and clamp the glass panel 5.It should be noted that, in this embodiment, the first slide rail 1040 and the second slide rail 1041 are located below the first conveyor belt 100 and the second conveyor belt 101 and are perpendicular to the first conveyor belt 100 and the second conveyor belt 101, and the clamping alignment drive mechanism 1044 is arranged on the machine platform 11 and is located below the first conveyor belt 100 and the second conveyor belt 101, so as to make full use of the height space formed by the first conveyor belt 100 and the second conveyor belt 101 on the machine platform 11, and the first side alignment fixture 1042 and the second side alignment fixture 1044 are arranged on the machine platform 11. The edge alignment clamp 1043 is located on both sides of the first conveyor belt 100 and the second conveyor belt 101, and is driven by the clamping and alignment driving mechanism 1044 to simultaneously move toward the two side edges of the glass panel 5 to align and clamp the glass panel 5, thereby making full use of the space on both sides of the first conveyor belt 100 and the second conveyor belt 101 on the machine platform 11, which can not only realize the clamping and alignment of the glass panel 5, but also make the structure of the laser engraving machine 1 more compact and smaller in size, thereby improving the convenience of equipment management, reducing equipment space occupancy, and reducing equipment costs. Furthermore, the alignment mechanism 12 includes a push-pull drive mechanism 120, a lifting drive mechanism 121 and an alignment plate mechanism 122 located between the first conveyor belt 100 and the second conveyor belt 101; the push-pull drive mechanism 120 is connected to the lifting drive mechanism 121, and the lifting drive mechanism 121 is connected to the alignment plate mechanism 122; when the in-place sensor detects that the glass panel 5 is in place, the lifting drive mechanism 121 drives the alignment plate mechanism 122 to rise to one side of the glass panel 5, and the push-pull drive mechanism 120 drives the lifting drive mechanism 121 and the alignment plate mechanism 122 to move toward the glass panel 5 together, so that the alignment plate surface 1220 of the alignment plate surface mechanism 122 collides and aligns with the glass panel 5, so that the collision surface of the glass panel 5 remains parallel to the alignment plate surface 1220. It should be noted that, in the present embodiment, the push-pull drive mechanism 120, the lifting drive mechanism 121 and the alignment plate mechanism 122 are located between the first conveyor belt 100 and the second conveyor belt 101, which not only can easily realize the collision alignment of the alignment mechanism 12 and the glass panel 5 in the product transmission direction, but also can make full use of the height space formed by the first conveyor belt 100 and the second conveyor belt 101 on the machine platform 11, so that the structure of the laser engraving machine 1 is more compact and the volume is smaller, which improves the convenience of equipment management, reduces the space occupied by the equipment, and reduces the equipment cost.In some preferred embodiments, the laser engraving device 13 includes a moving component 130 and a laser engraving component 131, the laser engraving component 131 is connected to the moving component 130, and the moving component 130 is arranged on the machine table 11 of the laser engraving machine 1; the moving component 130 drives the laser engraving component 131 to laser engrave the glass panel 5 at the laser engraving station according to the laser engraving path. Furthermore, the moving component 130 includes a Z-axis component 1300, an X-axis component 1301, a Y-axis component 1302 and a gantry 1303; the Z-axis component 1300 is connected to the laser engraving component 131, driving the laser engraving component 131 to move up and down for focusing; the Z-axis component 1300 and the laser engraving component 131 are arranged on the X-axis component 1301, and the X-axis component 1301 drives the Z-axis component 1300 and the laser engraving component 131 to move left and right; the X-axis component 1301 is arranged on the gantry 1303, and the Y-axis component 1302 drives the gantry 1303 to move forward and backward as a whole. Further, the laser engraving assembly 131 includes a laser 1310 and a galvanometer 1311; the laser 1310 is connected to the X-axis assembly 1301 and the Z-axis assembly 1300 through a support plate 1312, the galvanometer 1311 is connected to the Z-axis assembly 1300 through a support block 1313, and the laser 1310 is connected to the galvanometer 1311 through a laser channel 1314; the Z-axis assembly 1300 drives the galvanometer 1311 to move up and down for focusing; the X-axis assembly 1301 drives the Z-axis component and the laser 1310 to move left and right. It should be noted that in laser engraving, the focal position of the laser is crucial to the engraving effect. By setting the Z-axis assembly 1300, the laser engraving assembly 131 can be moved up and down, thereby adjusting the focus of the laser. This is crucial to ensure that the laser energy acts accurately on the glass surface to be processed and avoid focus offset resulting in unsatisfactory engraving effect or processing failure. The X-axis assembly 1301 drives the laser engraving assembly 131 to move left and right, which can solve the problem of lateral coverage of the engraving range. This allows the laser engraving assembly 131 to traverse the entire surface of the glass to be processed horizontally, ensuring that the engraved pattern can cover every designated area. The Y-axis assembly 1302 drives the gantry 1303 to move forward and backward as a whole, further expanding the working range of the laser engraving head. Through the combined movement of front and back, left and right, the synergy of the Y-axis and the X-axis enables the laser engraving device 13 to accurately control the engraving path within a large range, achieving full coverage engraving of larger glass panels. In addition, the gantry 1303 provides stable mechanical structural support to ensure that the laser engraving assembly 131 can move smoothly throughout the entire workstation during the engraving process. Its structure ensures the accuracy and stability of the laser engraving process, avoiding engraving deviations due to unstable mechanical structure or vibration.In addition, the laser 1310 and the galvanometer 1311 are combined to emit and control the path of the laser, wherein the galvanometer 1311 is used to finely control the reflection angle and direction of the laser beam. Through the precise control of the galvanometer 1311, the laser beam can quickly change direction within a large range and finely carve the required closed shape, pattern and text. The combination of the galvanometer 1311 and the Z-axis assembly 1300 enables it to have the ability of automatic focusing, thereby improving the accuracy of processing.

[0042] In step S102, the panel transport mechanism 31 of the splitting machine 3 transports the glass panel 5 to the cooling and heating splitting station of the splitting machine 3. Preferably, the panel transport mechanism 31 comprises a first linear belt mechanism 310 and a second linear conveyor belt mechanism 311 which are arranged in parallel above the chassis 30 at intervals; the first linear belt mechanism 310 and the second linear conveyor belt mechanism 311 transport the glass panel 5 having the closed shape to the cooling and heating splitting station of the splitting machine 3. The chassis 30 is a rectangular box with an opening facing the glass panel 5 having the closed shape, and the rectangular box accommodates glass waste generated when the crack of the peripheral cutting track of the closed shape penetrates. The cooling and heating splitting station is provided with a glass panel in-position sensor and a cylinder lifting baffle 32; the cylinder lifting baffle 32 is located in the glass panel transmission direction of the first linear belt mechanism 310 and the second linear conveyor belt mechanism 311; when the glass panel in-position sensor detects that the glass panel with the closed shape is in position, the glass panel with the closed shape is controlled to collide and align with the cylinder lifting baffle 32, so that the glass panel with the closed shape and the plate surface of the cylinder lifting baffle 32 remain parallel. Specifically, the cooling and heating splitting station is arranged between the first linear belt mechanism 310 and the second linear conveyor belt mechanism 311, and the glass panel in-position sensor and the cylinder lifting baffle 32 are arranged on the side wall of the discharge end of the chassis 30. It should be noted that due to reasons such as loading errors, when the glass panel reaches the cooling and heating splitting station, different degrees of transmission deviation may occur, affecting the accuracy of laser engraving. In this embodiment, when the glass panel in place sensor detects that the glass panel with the closed shape is in place, the glass panel with the closed shape is controlled to collide and align with the cylinder lifting baffle 32, so that the glass panel with the closed shape and the plate surface of the cylinder lifting baffle 32 remain parallel, thereby eliminating transmission deviation and improving the quality of the cracks.

[0043] In some preferred embodiments, the heating plate heating device 33 includes a heating plate 330 and an adjustment rail 331; the adjustment rail 331 is mounted on the opening surface of the chassis 30, and the heating plate 330 is slidably connected to the adjustment rail 331; when the heating plate 330 slides on the adjustment rail 331, the heating plate 330 is adjusted to a precise position at which the external area of ​​the cutting track is heated, or a precise position at which the internal area of ​​the cutting track and the external area of ​​the cutting track are heated simultaneously. The adjustment guide rail 331 includes a first longitudinal guide rail 3310 and a second longitudinal guide rail 3311 which are arranged in parallel on two opposite opening surfaces of the chassis 30; the main extension direction of the first longitudinal guide rail 3310 and the second longitudinal guide rail 3311 is parallel to the conveyor belt extension direction of the first linear belt mechanism 310 and the second linear conveyor belt mechanism 311; the heating plate 330 includes a first transverse heating plate 3300 and a second transverse heating plate 3301 which are arranged in parallel and spaced apart, the two ends of the first transverse heating plate 3300 are connected to the first longitudinal guide rail 3310 and the second longitudinal guide rail 3311, and the two ends of the second transverse heating plate 3301 are connected to the first longitudinal guide rail 3310 and the second longitudinal guide rail 3311. The adjustment guide rail 331 also includes a first transverse guide rail 3312 and a second transverse guide rail 3313 arranged in parallel on two opposite opening surfaces of the chassis 30; the main extension direction of the first transverse guide rail 3312 and the second transverse guide rail 3313 is perpendicular to the extension direction of the conveyor belts of the first linear belt mechanism 310 and the second linear conveyor belt mechanism 311; the heating plate 330 also includes a first longitudinal heating plate 3302 and a second longitudinal heating plate 3303 arranged in parallel and spaced apart, the two ends of the first longitudinal heating plate 3302 are connected to the first transverse guide rail 3312 and the second transverse guide rail 3313, and the two ends of the second longitudinal heating plate 3303 are connected to the first transverse guide rail 3312 and the second transverse guide rail 3313. It should be noted that, in this embodiment, when the heating plate 330 slides on the adjustment guide rail 331, the exact position at which the heating plate 330 heats the outer area of ​​the cutting track, or the exact position at which the inner area of ​​the cutting track and the outer area of ​​the cutting track are heated at the same time, can be adjusted, thereby meeting the precise heating requirements of different positions on the glass panel and improving the splitting efficiency and quality.

[0044] In some preferred embodiments, the semiconductor refrigeration plate cooling device 34 includes a refrigeration box 340 and a semiconductor refrigeration plate fixture 341; the semiconductor refrigeration plate fixture 341 can be movably installed on one side of the refrigeration box 340 to adjust the exact position of cooling the inner area of ​​the cutting track. Furthermore, the semiconductor refrigeration plate cooling device 34 is located above the glass panel on the refrigeration and heating splitting station, and the heating plate heating device 33 is located below the glass panel on the refrigeration and heating splitting station; the semiconductor refrigeration plate cooling device 34 also includes a support column 342, a cylinder mounting plate 343, a booster cylinder 344 and a linear bearing 345; the booster cylinder 344 and the linear bearing 345 are installed on the cylinder mounting plate 343 at intervals, and the support column 342 supports the cylinder mounting plate 343 on the opening surface of the chassis 30; the bottom ends of the booster cylinder 344 and the linear bearing 345 are respectively connected to the upper side of the refrigeration box 340, and the semiconductor refrigeration plate fixture 341 can be movably installed on the lower side of the refrigeration box 340; the booster cylinder 344 drives the refrigeration box 340 to move downward along the linear bearing 345, so that the semiconductor refrigeration plate fixture 341 is pressed down to the inner area of ​​the cutting track for cooling. Furthermore, after the set heating and cooling time, the booster cylinder 344 continues to drive the refrigeration box 340 to move downward along the linear bearing 345, so that the semiconductor refrigeration plate fixture 341 pressed down to the inner area of ​​the cutting track continues to move downward, pressing the waste generated when the cracks of the closed-shaped peripheral cutting track are penetrated into the interior of the chassis 30.

[0045] It should be noted that, in this embodiment, the semiconductor refrigeration plate fixture 341 can be movably mounted on one side of the refrigeration box 340, so as to adjust the exact position of cooling the inner area of ​​the cutting track, thereby improving the accuracy and quality of the split. In addition, since the booster cylinder 344 and the linear bearing 345 are installed on the cylinder mounting plate 343 at intervals, the booster cylinder 344 drives the refrigeration box 340 to move downward along the linear bearing 345, so that the semiconductor refrigeration plate fixture 341 can be smoothly pressed down to the inner area of ​​the cutting track, thereby improving the accuracy and quality of the split. Moreover, after the set heating and cooling time, the booster cylinder 344 continues to drive the refrigeration box 340 to move downward along the linear bearing 345, and can also make the semiconductor refrigeration fixture 341 pressed down to the inner area of ​​the cutting track continue to move downward, and press the waste generated when the cracks of the closed-shaped peripheral cutting track pass through into the interior of the chassis 30. Through the same mechanism, not only downward pressure cooling is achieved, but also waste removal is achieved, which greatly simplifies the structure of the splitting machine 3 and saves costs.

[0046] Embodiment 2

[0047] See also Figure 1-Figure 11 This embodiment provides a laser splitting system based on a semiconductor refrigeration plate, including: a control system 4, which runs the laser splitting method based on a semiconductor refrigeration plate described in any of the above embodiments; a laser engraving machine 1, which is connected to the control system for communication and works under the control of the control system; a splitting machine 3, which is connected to the control system for communication and works under the control of the control system.

[0048] The above embodiments are only preferred specific implementation modes of the present invention, and the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention. The protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A laser chip splitting method based on semiconductor refrigeration sheet, characterized in that: include: A desired closed shape is engraved on the glass panel by a laser engraving machine, and the peripheral cutting track of the closed shape divides the glass panel into an inner area of ​​the cutting track and an outer area of ​​the cutting track; The glass panel having the closed shape is transported to a panel conveying mechanism of a splitting machine, and the glass panel having the closed shape is transported to a cooling and heating splitting station of the splitting machine through the panel conveying mechanism; Control the semiconductor refrigeration plate cooling device arranged at the cooling and heating splitting station to cool the inner area of ​​the cutting track, and simultaneously control the heating plate heating device arranged at the cooling and heating splitting station to heat the outer area of ​​the cutting track, or heat the inner area of ​​the cutting track and the outer area of ​​the cutting track at the same time, so that the cracks of the peripheral cutting track of the closed shape are connected; the panel transmission mechanism of the splitting machine includes a first linear conveyor belt mechanism and a second linear conveyor belt mechanism arranged in parallel above the chassis at intervals; the first linear conveyor belt mechanism and the second linear conveyor belt mechanism transmit the glass panel with the closed shape to the cooling and heating splitting station of the splitting machine; the cooling and heating splitting station is provided with a glass panel in-place sensor and a cylinder lifting baffle; the cylinder lifting baffle is located on the glass panel transmission direction of the first linear conveyor belt mechanism and the second linear conveyor belt mechanism; when the glass panel in-place sensor detects that the glass panel with the closed shape is in place, the glass panel with the closed shape is controlled to be moved with the cylinder lifting baffle The plate collision is aligned so that the glass panel with the closed shape remains parallel to the plate surface of the cylinder lifting baffle; the heating plate heating device includes a heating plate and an adjustment guide rail; the adjustment guide rail is mounted on the opening surface of the chassis, and the heating plate and the adjustment guide rail are slidably connected; when the heating plate slides on the adjustment guide rail, the accurate position of the heating plate to heat the outer area of ​​the cutting track, or the accurate position of the inner area of ​​the cutting track and the outer area of ​​the cutting track are adjusted; the adjustment guide rail includes a first longitudinal guide rail and a second longitudinal guide rail arranged in parallel on two opposite opening surfaces of the chassis; the main body extension direction of the first longitudinal guide rail and the second longitudinal guide rail is parallel to the conveyor belt extension direction of the first linear conveyor belt mechanism and the second linear conveyor belt mechanism; the heating plate includes a first transverse heating plate and a second transverse heating plate arranged in parallel and spaced apart, the two ends of the first transverse heating plate are connected to the first longitudinal guide rail and the second longitudinal guide rail, and the two ends of the second transverse heating plate are connected to the first longitudinal guide rail and the second longitudinal guide rail.

2. The laser cracking method based on semiconductor refrigeration sheet according to claim 1, characterized in that: The cabinet is a rectangular box body with an opening facing the glass panel having the closed shape, and the rectangular box body accommodates glass waste generated when cracks in the peripheral cutting track of the closed shape penetrate through.

3. The laser cracking method based on semiconductor refrigeration sheet according to claim 1, characterized in that: The cooling and heating splitting station is arranged between the first linear conveyor belt mechanism and the second linear conveyor belt mechanism, and the glass panel in-position sensor and the cylinder lifting baffle are arranged on the side wall of the discharge end of the chassis.

4. The laser cracking method based on semiconductor refrigeration sheet according to claim 1, characterized in that: The adjustment guide rail also includes a first transverse guide rail and a second transverse guide rail arranged in parallel on two opposite opening surfaces of the chassis; the main body extension direction of the first transverse guide rail and the second transverse guide rail is perpendicular to the conveyor belt extension direction of the first linear conveyor belt mechanism and the second linear conveyor belt mechanism; the heating plate also includes a first longitudinal heating plate and a second longitudinal heating plate arranged in parallel and spaced apart, the two ends of the first longitudinal heating plate are connected to the first transverse guide rail and the second transverse guide rail, and the two ends of the second longitudinal heating plate are connected to the first transverse guide rail and the second transverse guide rail.

5. The laser splitting method based on semiconductor refrigeration sheet according to any one of claims 1 to 4, characterized in that: The semiconductor refrigeration plate cooling device includes a refrigeration box and a semiconductor refrigeration plate fixture; the semiconductor refrigeration plate fixture can be movably installed on one side of the refrigeration box to adjust the exact position of cooling the inner area of ​​the cutting track.

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