Endoscope tip components, endoscopes

Abstract

The present application relates to a tip assembly of an endoscope and an endoscope. The imaging module includes: a circuit board structure, including a flexible circuit board and a plurality of hard board units, the hard board unit and the flexible circuit board are arranged in a plate thickness direction, and the plurality of hard board units are arranged at intervals from each other along the extension direction of the flexible circuit board; a camera device, arranged on the circuit board structure, and a corresponding hard board unit is provided at a position corresponding to the camera device on the circuit board structure; an illumination device, arranged on the circuit board structure, and a corresponding hard board unit is provided at a position corresponding to the illumination device on the circuit board structure; and electronic components, electrically connected to the circuit board structure, and a corresponding hard board unit is provided at a position corresponding to the electronic components on the circuit board structure. The solder joints of the corresponding positions of the camera device, the illumination device, and the electronic components on the circuit board structure are not easily deformed or detached, and the structure is compactly arranged, so it is convenient to arrange more electronic components in the narrow space in the tip assembly.

Description

Technical Field

[0001] The present application relates to the technical field of medical devices, and in particular to a tip assembly of an endoscope and an endoscope. Background Art

[0002] In medical endoscopes, the front-end components usually include camera devices and lighting devices, which are connected to other circuits through circuit boards. In order to obtain better image quality, the image accuracy requirements of the camera device are getting higher and higher, and the image transmission circuits and the use of various electronic components are becoming more and more complicated.

[0003] In the traditional design of advanced components, rigid circuit boards are used. The space in the advanced components is small, and the rigid circuit boards cannot effectively utilize the space to place more electronic components. Some advanced component designs use flexible circuit boards, which are prone to deformation of solder joints and fall off when subjected to stress. Summary of the invention

[0004] Based on this, it is necessary to provide an endoscope's leading-edge component and an endoscope to address the technical problems in that the leading-edge components in the prior art cannot effectively utilize space to place more electronic components when using hard circuit boards, and easily cause solder joints to deform and fall off under stress when using flexible circuit boards.

[0005] An embodiment of the present application provides an imaging module, the imaging module comprising:

[0006] A circuit board structure, comprising a flexible circuit board and a plurality of hard board units, wherein the hard board unit is arranged in affixed relation with the flexible circuit board along a board thickness direction, and the plurality of hard board units are arranged spaced apart from each other along an extension direction of the flexible circuit board;

[0007] A camera device is arranged on the circuit board structure, and a position on the circuit board structure corresponding to the camera device has a corresponding hard board unit;

[0008] an illuminating device, arranged on the circuit board structure, wherein a position on the circuit board structure corresponding to the illuminating device has a corresponding hard board unit; and

[0009] The electronic components are electrically connected to the circuit board structure, and the positions on the circuit board structure corresponding to the electronic components are provided with corresponding hard board units.

[0010] In one embodiment, the hard board unit corresponding to the position of the circuit board structure corresponding to the camera device is a first hard board unit; and the camera device and the lighting device are located on the same side of the first hard board unit.

[0011] In one embodiment, the hard board unit corresponding to the position of the circuit board structure corresponding to the lighting device is a second hard board unit; the second hard board unit is arranged in parallel with the first hard board unit; the second hard board unit and the first hard board unit are perpendicular to the part of the flexible circuit board between the second hard board unit and the first hard board unit;

[0012] Alternatively, the hard board unit at the position on the circuit board structure corresponding to the camera device and the hard board unit at the position on the circuit board structure corresponding to the lighting device are the same hard board unit.

[0013] In one embodiment, there are two lighting devices, and the two second hard board units are arranged in a one-to-one correspondence with the two lighting devices; the two lighting devices are respectively located on both sides of the camera device along the second direction; the portion of the flexible circuit board between the second hard board unit and the first hard board unit is located on one side of the first hard board unit along the third direction, the first direction, the second direction, and the third direction are perpendicular to each other, and the first direction is the thickness direction of the first hard board unit.

[0014] In one embodiment, the hard board unit corresponding to the position of the circuit board structure corresponding to the camera device is a first hard board unit; the hard board unit corresponding to the position of the electronic component on the circuit board structure is a third hard board unit; the third hard board unit is located on a side of the first hard board unit facing away from the camera device;

[0015] The number of the third hard plate unit is one; or the number of the third hard plate units is at least two, and two adjacent third hard plate units are arranged in parallel and opposite to each other.

[0016] In one embodiment, the third hard board unit adjacent to the first hard board unit is perpendicular to the first hard board unit.

[0017] In one embodiment, the first hard board unit, the third hard board unit adjacent thereto, and the portion of the flexible circuit board therebetween include a first section, a second section, and a third section connected in sequence, wherein the first section extends along a first direction relative to the first hard board unit in a direction away from the camera device; the second section and the third section are both located on a side of the first hard board unit away from the camera device; the second section extends in a direction parallel to the first hard board unit, and the third section extends along the first direction, and the first direction is the thickness direction of the first hard board unit.

[0018] In one embodiment, a single rigid board unit includes a first rigid layer and a second rigid layer, and the first rigid layer and the second rigid layer are respectively located on different sides of the flexible circuit board.

[0019] In one embodiment, a single rigid board unit includes a first rigid layer, the first rigid layer is located on one side of the flexible circuit board, and the first rigid layer is an insulating layer.

[0020] In one embodiment, a single rigid board unit includes a second rigid layer, and the second rigid layer is located on one side of the flexible circuit board and is electrically connected to the flexible circuit board.

[0021] An embodiment of the present application provides a front-end component, including an imaging module according to any one of the above embodiments.

[0022] An embodiment of the present application provides an endoscope, comprising a tip assembly according to the above embodiment.

[0023] The imaging module, the front end assembly, the endoscope, and the camera device are arranged on the circuit board structure, and the position of the circuit board structure corresponding to the camera device has a corresponding hard board unit. The lighting device is arranged on the circuit board structure, and the position of the circuit board structure corresponding to the lighting device has a corresponding hard board unit. The electronic components are arranged on the circuit board structure, and the positions of the circuit board structure corresponding to the electronic components have corresponding hard board units. In this way, through the support of the corresponding hard board units of the camera device, the lighting device, and the electronic components, the solder joints of the corresponding positions of the camera device, the lighting device, and the electronic components on the circuit board structure are not easy to deform, so that the camera device, the lighting device, and the electronic components are not easy to fall off. Moreover, the relative positions of two adjacent hard board units can be adjusted by the deformation of the part of the flexible circuit board between the two, so that the relative positions of the electronic components, the camera device, and the lighting device can be adjusted, so that the electronic components, the camera device, the lighting device, and the corresponding hard board units are arranged compactly, thereby facilitating the use of the narrow space in the front end assembly to arrange more electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic structural diagram of a circuit board structure of an imaging module according to an embodiment when it is in a flattened state.

[0025] Figure 2 4 is a schematic structural diagram of an imaging module when the second rigid board unit is parallel to and opposite to the first rigid board unit according to an embodiment.

[0026] Figure 3 Schematic diagram of the structure of a mounting bracket according to an embodiment.

[0027] Figure 4 for Figure 3A schematic diagram of another viewing angle of the mounting bracket shown.

[0028] Figure 5 It is a schematic diagram of an imaging module of an embodiment when it is about to be installed in a mounting bracket.

[0029] Figure 6 for Figure 5 Schematic diagram of the first hard board unit of the imaging module after entering the limiting groove of the mounting bracket.

[0030] Figure 7 for Figure 6 Schematic diagram of placing the second hard board unit of the imaging module and the lighting device on the placement table of the mounting bracket.

[0031] Figure 8 for Figure 6 Schematic diagram of the third hard board unit of the imaging module being placed in the concave cavity of the mounting bracket.

[0032] Fig. 9 FIG. 4 is a schematic structural diagram of an imaging module according to another embodiment.

[0033] Fig.10 for Fig. 9 Side view of.

[0034] Z, first direction; X, second direction; Y, third direction;

[0035] 100. Imaging module;

[0036] 111, flexible circuit board; 1111, first flexible part; 1112, second flexible part; 1112a, first section; 1112b, second section; 1112c, third section; 1113, third flexible part; 112, hard board unit; 112a, first hard board unit; 112b, second hard board unit; 112c, third hard board unit; 1121, first hard layer; 1122, second hard layer;

[0037] 120. Camera device;

[0038] 130. Lighting device; 131. Heightening block;

[0039] 140. Electronic components;

[0040] 150. Signal transmission line;

[0041] 200, mounting bracket; 201, concave cavity; 202, limiting groove;

[0042] 210, first side plate; 220, second side plate; 221, avoidance groove; 230, third side plate; 240, support plate; 241, notch;

[0043] 250, baffle; 251, first stop portion; 252, second stop portion; 253, avoidance space;

[0044] 260, placement table; 261, placement slot; 262, placement opening;

[0045] 271, first limiting portion; 272, second limiting portion;

[0046] 280. Circumferential boss. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0049] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0050] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0051] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0053] Please refer to Figure 1 , Figure 2 and Figure 5 An embodiment of the present application provides an imaging module 100 , which includes: a circuit board structure, a camera device 120 , a lighting device 130 and electronic components 140 .

[0054] The circuit board structure includes a flexible circuit board 111 and a plurality of hard board units 112. The hard board units 112 are arranged in a laminated manner with the flexible circuit board 111 along the board thickness direction. The plurality of hard board units 112 are arranged at intervals from each other along the extension direction of the flexible circuit board 111. Figure 1 and Figure 2 As shown, in the embodiment of the present application, the flexible circuit board 111 is a whole piece structure. Therefore, along the extension direction of the flexible circuit board 111, there is a portion of the flexible circuit board 111 between any two adjacent hard board units 112. In this way, the relative positions of the two adjacent hard board units 112 can be adjusted by the deformation of the portion of the flexible circuit board 111 between the two.

[0055] The camera device 120 is arranged on the circuit board structure, and a corresponding hard board unit 112 is provided at a position on the circuit board structure corresponding to the camera device 120. The lighting device 130 is arranged on the circuit board structure, and a corresponding hard board unit 112 is provided at a position on the circuit board structure corresponding to the lighting device 130. The electronic components 140 are arranged on the circuit board structure, and a corresponding hard board unit 112 is provided at a position on the circuit board structure corresponding to the electronic components 140.

[0056] In the imaging module 100 described above, the camera device 120 is arranged on the circuit board structure, and a corresponding hard board unit 112 is provided at a position on the circuit board structure corresponding to the camera device 120. The lighting device 130 is arranged on the circuit board structure, and a corresponding hard board unit 112 is provided at a position on the circuit board structure corresponding to the lighting device 130. The electronic components 140 are arranged on the circuit board structure, and a corresponding hard board unit 112 is provided at a position on the circuit board structure corresponding to the electronic components 140. In this way, through the support of the corresponding hard board units 112 of the camera device 120, the lighting device 130, and the electronic components 140, the solder joints of the camera device 120, the lighting device 130, and the electronic components 140 at the corresponding positions on the circuit board structure are not easily deformed, so that the camera device 120, the lighting device 130, and the electronic components 140 are not easily dropped off. Moreover, the relative positions of two adjacent hard board units 112 can be adjusted by deforming part of the flexible circuit board 111 therebetween, thereby being able to adjust the relative positions of the electronic components 140, the camera device 120, and the lighting device 130, so that the electronic components 140, the camera device 120, the lighting device 130 and their respective corresponding hard board units 112 can be arranged compactly, thereby making it convenient to utilize the narrow space in the front-end components to arrange more electronic components.

[0057] Moreover, when assembling the imaging module 100 into the front-end component, the imaging module 100 can be assembled into a whole first, and then the positions and angles of the electronic components 140, the camera device 120, and the lighting device 130 can be adjusted by deforming a portion of the flexible circuit board 111 between two adjacent hard board units 112, and the various components of the imaging module 100 can be assembled into the front-end shell to facilitate assembly.

[0058] Please combine Figure 7 and Figure 8 In some embodiments, the hard board unit 112 corresponding to the position of the camera device 120 on the circuit board structure is the first hard board unit 112a. The camera device 120 and the lighting device 130 are located on the same side of the first hard board unit 112a. When the imaging module 100 is assembled into the front end housing, the board thickness direction of the first hard board unit 112a is the length direction of the front end assembly. In this way, the camera device 120 and the lighting device 130 can be arranged on one side of the first hard board unit 112a along the board thickness direction, and the structure is compact.

[0059] Combination Figure 1 and Figure 2In some embodiments, the rigid board unit 112 corresponding to the position of the illuminating device 130 on the circuit board structure is a second rigid board unit 112b. The portion of the flexible circuit board 111 between the second rigid board unit 112b and the first rigid board unit 112a is defined as a first flexible portion 1111. The second rigid board unit 112b and the first rigid board unit 112a are perpendicular to the first flexible portion 1111.

[0060] Specifically, the first flexible portion 1111 is bent relative to the first rigid plate unit 112a along the first direction Z so that the first flexible portion 1111 is perpendicular to the first rigid plate unit 112a. Figure 5 , Figure 6 and then the second hard plate unit 112b relative to the first flexible portion 1111 along the third direction Y bend, so that the second hard plate unit 112b is perpendicular to the first flexible portion 1111, ie Figure 2 , Figure 7 In this way, the second hard plate unit 112b can be arranged parallel to and opposite to the first hard plate unit 112a. The camera device 120 and the lighting device 130 are both arranged on the same side of the first hard plate unit 112a, that is, Figure 7 In this embodiment, the lighting device 130 and the camera device 120 are located on different sides of the flexible circuit board 111 in the thickness direction, so that after the bending process of the first flexible portion 1111, the lighting area of ​​the lighting device 130 is not blocked by the second hard board unit 112b.

[0061] like Fig. 9 and Fig.10 As shown, in other embodiments, the hard board unit 112 at the position corresponding to the camera device 120 on the circuit board structure and the hard board unit 112 at the position corresponding to the lighting device 130 on the circuit board structure are the same hard board unit 112 (i.e., the first hard board unit 112a). In this way, the camera device 120 and the lighting device 130 can also be arranged on the same side of the first hard board unit 112a. Fig. 9 As shown, in order to better illuminate the camera device 120, in some embodiments, a pad 131 is provided between the lighting device 130 and the first hard plate unit 112a, so that the lighting device 130 is closer to the end of the camera device 120 away from the first hard plate unit 112a, thereby achieving a good lighting effect.

[0062] Please combine Figure 2 , Figure 7In one embodiment, there are two lighting devices 130, and the two second hard plate units 112b are arranged in a one-to-one correspondence with the two lighting devices 130. The two lighting devices 130 are respectively located on both sides of the camera device 120 along the second direction X. The first flexible portion 1111 is located on one side of the first hard plate unit 112a along the third direction Y. The first direction Z, the second direction X, and the third direction Y are perpendicular to each other, and the first direction Z is the plate thickness direction.

[0063] The two lighting devices 130 are arranged at intervals along the second direction X. Thus, after the bending process of the first flexible portion 1111, the camera device 120 is located in the interval area between the two lighting devices 130 (two second hard plate units 112b), and the first flexible portion 1111 is located on one side of the first hard plate unit 112a along the third direction Y. Thus, the two lighting devices 130 and the camera device 120 are compact in structure, and the two lighting devices 130 on both sides of the camera device 120 can fully and effectively illuminate the camera device 120.

[0064] Please combine Figure 1 , Figure 2 , Figure 8 In one embodiment, the hard board unit 112 corresponding to the position of the camera device 120 on the circuit board structure is the first hard board unit 112a. The hard board unit 112 corresponding to the position of the electronic component 140 on the circuit board structure is the third hard board unit 112c. The third hard board unit 112c is located on the side of the first hard board unit 112a facing away from the camera device 120. It should be noted that the number of the third hard board units 112c can be one or at least two. The part of the flexible circuit board 111 between the third hard board unit 112c (i.e., the third hard board unit 112c adjacent to the first hard board unit 112a) and the first hard board unit 112a is defined as the second flexible portion 1112.

[0065] Specifically, by bending the second flexible portion 1112 to the side of the first rigid board unit 112a away from the camera device 120, the third rigid board unit 112c and the electronic components 140 thereon can be folded to the side of the first rigid board unit 112a away from the camera device 120. Thus, the electronic components 140 can be arranged on the side of the first rigid board unit 112a away from the camera device 120 along the board thickness direction, and the structure is compact, which is conducive to fully utilizing the narrow space in the front-end assembly to arrange more electronic components 140 when the imaging module 100 is assembled into the front-end housing.

[0066] In one embodiment, when the imaging module 100 is assembled into the front end housing, the thickness direction of the first hard board unit 112a is the length direction of the front end assembly. The third hard board unit 112c adjacent to the first hard board unit 112a is perpendicular to the first hard board unit 112a. In this way, the size of the third hard board unit 112c can be fully expanded along the thickness direction of the first hard board unit 112a, which is conducive to arranging more electronic components 140 on the third hard board unit 112c.

[0067] Please combine Figure 1 , Figure 2 , Figure 8 In one embodiment, when the number of the third rigid board units 112c is at least two, the portion of the flexible circuit board 111 between two adjacent third rigid board units 112c is defined as a third flexible portion 1113. By bending the third flexible portion 1113, the adjacent third rigid board units 112c can be arranged in parallel and opposite to each other, that is, the two third rigid board units 112c are stacked, so that the adjacent third rigid board units 112c are arranged compactly, saving space, and facilitating the arrangement of more electronic components 140.

[0068] exist Figure 8 In the illustrated embodiment, the number of the third hard plate units 112c is two. In other embodiments, the number of the third hard plate units 112c is not limited to two, but may be more.

[0069] Please refer to Figure 2 , Figure 8 In one embodiment, a signal transmission line 150 is provided at the output end of the circuit board structure. The signal transmission line 150 is used to connect to the host of the endoscope. A third hard board unit 112c is also provided at a position corresponding to the signal transmission line 150 on the circuit board structure. In other words, the third hard board unit 112c at the output end of the circuit board structure can be used to support both the electronic components 140 and the signal transmission line 150.

[0070] Please refer to Figure 8 and Fig. 9In some embodiments, the first rigid board unit 112a, the third rigid board unit 112c adjacent thereto, and the portion of the flexible circuit board 111 therebetween (i.e., the second flexible portion 1112) include a first segment 1112a, a second segment 1112b, and a third segment 1112c connected in sequence. The first segment 1112a extends in a direction away from the camera device 120 relative to the first rigid board unit 112a along the first direction Z. The second segment 1112b and the third segment 1112c are both located on the side of the first rigid board unit 112a away from the camera device 120. The second segment 1112b extends in a direction parallel to the first rigid board unit 112a, and the third segment 1112c extends in the first direction Z. It can be seen that, through the first section 1112a, the third hard plate unit 112c is located at the side of the first hard plate unit 112a away from the camera device 120 along the first direction Z; through the second section 1112b, the position of the third hard plate unit 112c is closer to the center of the first hard plate unit 112a along the third direction Y, rather than being located at the edge of the first hard plate unit 112a, so that the imaging module 100 has a more compact structure in the third direction Y. Moreover, it is conducive to arranging more third hard plate units 112c on the side of the first hard plate unit 112a away from the camera device 120 along the first direction Z. Through the third section 1112c with a certain length, the third hard plate unit 112c can be located at a suitable position along the first direction Z.

[0071] Please refer to Figure 2 In one embodiment, a single rigid board unit 112 includes a first rigid layer 1121 and a second rigid layer 1122, and the first rigid layer 1121 and the second rigid layer 1122 are respectively located on different sides of the flexible circuit board 111. Specifically, in this embodiment, the first rigid board unit 112a and the third rigid board unit 112c both include a first rigid layer 1121 and a second rigid layer 1122, so as to better prevent the problem of solder joint deformation and stress falling off.

[0072] In one embodiment, a single hard plate unit 112 includes a first hard layer 1121 but does not include a second hard layer 1122. Figure 2 The first hard layer 1121 is located on one side of the flexible circuit board 111.

[0073] In one embodiment, the single rigid board unit 112 includes the second rigid layer 1122 but does not include the first rigid layer 1121 . The first rigid layer 1121 is located on one side of the flexible circuit board 111 .

[0074] In the above embodiment, the second hard layer 1122 can be electrically connected to the flexible circuit board 111 to facilitate the electronic components 140, the camera device 120, or the lighting device 130 to be electrically connected to the flexible circuit board 111 through the second hard layer 1122, that is, the second hard layer 1122 is located on the side of the flexible circuit board 111 where the electronic components 140, the camera device 120, or the lighting device 130 are provided.

[0075] In the above embodiment, the first hard layer 1121 is an insulating layer. In this case, the first hard layer 1121 is located on the side of the flexible circuit board 111 where the electronic components 140, the camera device 120, and the lighting device 130 are not provided. The first hard layer 1121 can also be electrically connected to the flexible circuit board 111 to achieve a certain circuit connection.

[0076] An embodiment of the present application provides a front-end component, including the imaging module 100 of any one of the above embodiments.

[0077] An embodiment of the present application provides an endoscope, comprising a tip assembly according to the above embodiment.

[0078] Please refer to Figure 3 and Figure 4 An embodiment of the present application provides a mounting bracket 200 of an imaging module, and the mounting bracket 200 includes: a first side plate 210, a second side plate 220, a third side plate 230 and a support plate 240.

[0079] One end of the support plate 240 is connected to one end of the first side plate 210 along the first direction Z, and the two are perpendicular to each other. One end of the support plate 240 and the first side plate 210 along the second direction X are both connected to the second side plate 220, and the other end of the support plate 240 and the first side plate 210 along the second direction X are both connected to the third side plate 230. The first side plate 210, the second side plate 220, the third side plate 230, and the support plate 240 surround a concave cavity 201, and the opening of the concave cavity 201 faces the third direction Y.

[0080] On the side of the support plate 240 facing away from the concave cavity 201 along the first direction Z, the second side plate 220, the third side plate 230 and the support plate 240 form a limiting groove 202, the limiting groove 202 has a first notch, and the direction of the first notch is the same as the opening direction of the concave cavity 201. The first direction Z, the second direction X, and the third direction Y are perpendicular to each other.

[0081] The mounting bracket 200 of the imaging module described above can be used to mount the imaging module 100 of any of the above embodiments. In actual operation, the first hard plate unit 112a can be inserted from the first notch into the limiting groove 202, so that the first hard plate unit 112a is first positioned through the limiting groove 202, and the first hard plate unit 112a is first fixed to the mounting bracket 200 by means of glue dispensing, so that the position of the camera device 120 is also fixed. Since the orientation of the first notch is the same as the orientation of the opening of the cavity 201, the second flexible portion 1112 can be bent so that the third hard plate unit 112c is located on the side of the support plate 240 away from the first hard plate unit 112a along the first direction Z, so that the third hard plate unit 112c can be inserted into the cavity 201, and then the third hard plate unit 112c is fixed to the mounting bracket 200 by means of glue dispensing, etc. In this way, the imaging module 100 can be easily assembled into the mounting bracket 200. Finally, the assembly structure of the mounting bracket 200 and the imaging module 100 is placed in the front shell for fixation, thereby facilitating the assembly and positioning of the components in the imaging module.

[0082] exist Fig. 9 and Fig.10 In the illustrated embodiment, the camera device 120 and the lighting device 130 share the first hard plate unit 112 a , so after the first hard plate unit 112 a and the mounting bracket 200 are positioned, the position of the lighting device 130 is also determined.

[0083] Please refer to Figure 3 and Figure 4 In one embodiment, the mounting bracket 200 further includes a baffle 250, which is fixedly connected to the support plate 240. The baffle 250 and the first side plate 210 are located at the same end of the support plate 240 along the third direction Y, and the baffle 250 protrudes from the support plate 240 in the direction away from the first side plate 210 along the first direction Z. In this way, when the first hard plate unit 112a is inserted from the first notch into the limiting groove 202, the insertion direction is along the third direction Y, and the baffle 250 can stop the first hard plate unit 112a, that is, position the first hard plate unit 112a along the third direction Y, so as to facilitate the determination that the first hard plate unit 112a is inserted into place, so as to fix the first hard plate unit 112a in time.

[0084] Please refer to Figure 3 and Figure 4 In one embodiment, the baffle 250 includes a first stop portion 251 and a second stop portion 252 spaced apart along the second direction X, so that an escape space 253 is left between the first stop portion 251 and the second stop portion 252 .

[0085] Please refer to Figure 1 Combination Figure 2and Figure 7 The first flexible portion 1111 includes a connected narrow section 1111a and a wide section 1111b. The narrow section 1111a is located in the middle of the wide section 1111b along the second direction X, and the width of the wide section 1111b along the second direction X is greater than the width of the narrow section 1111a along the second direction X. The narrow section 1111a is located on one side of the wide section 1111b close to the first hard plate unit 112a.

[0086] In this way, after the first rigid plate unit 112a is inserted into the limiting groove 202, when the first flexible portion 1111 is bent relative to the first rigid plate unit 112a along the first direction Z, the narrow section 1111a can be located in the avoidance space 253, and the wide section 1111b can be located on the side of the first stop portion 251 and the second stop portion 252 away from the first rigid plate unit 112a along the first direction Z. In this way, the first flexible portion 1111 does not interfere with the first stop portion 251 and the second stop portion 252, and the structure is compact.

[0087] Please refer to Figures 3 to 5 In one embodiment, the mounting bracket 200 further includes a placement platform 260, and the placement platforms 260 are respectively provided at one end of the second side plate 220 and the third side plate 230 along the first direction Z, and the placement platforms 260 are located on the side of the support plate 240 that is away from the concave cavity 201 along the first direction Z. In this way, the placement platform 260 can limit the first hard plate unit 112a along the first direction Z, and after the first hard plate unit 112a is inserted into the limiting groove 202, it is prevented from shifting in the direction away from the support plate 240.

[0088] Furthermore, the two lighting devices 130 and the two second hard plate units 112 b can be placed on two placement tables 260 respectively and fixed, thereby providing installation locations for the lighting devices 130 .

[0089] Please refer to Figures 3 to 5 In one embodiment, the placement platform 260 is provided with a placement groove 261, and the placement groove 261 has a placement opening 262 facing the third direction Y, and the direction of the placement opening 262 is opposite to the opening direction of the cavity 201. Figure 6 to Figure 7 When the second hard plate unit 112b is bent along the third direction Y relative to the first flexible portion 1111, the second hard plate unit 112b and the lighting device 130 arranged thereon can enter the placement groove 261 from the placement opening 262, so that the lighting device 130 can be effectively positioned.

[0090] refer to Figure 3 and Figure 4 In one embodiment, a notch 241 recessed along the third direction Y is provided at one end of the support plate 240 away from the first side plate 210 along the third direction Y.

[0091] Specifically, combined with Figure 8 By bending the second flexible portion 1112 so that the third hard plate unit 112c is located on the side of the first hard plate unit 112a facing away from the camera device 120, the groove 241 can be used to accommodate the second flexible portion 1112, thereby avoiding the second flexible portion 1112 from occupying the space outside the support plate 240, further making the structure compact.

[0092] Combination Figure 3 and Figure 4 as well as Figure 8 In one embodiment, a side of the second side plate 220 facing the third side plate 230 is provided with an avoidance groove 221 .

[0093] After the third hard plate unit 112c enters the cavity 201, the spacing width between the second side plate 220 and the third side plate 230 is adapted to the width of the third hard plate unit 112c along the second direction X, thereby effectively positioning the third hard plate unit 112c along the second direction X to prevent it from shaking and deviating.

[0094] However, since the third flexible portion 1113 is bent, two adjacent third hard plate units 112c can be arranged parallel and opposite to each other, the third flexible portion 1113 will be located at the outer edges of the two third hard plate units 112c along the second direction X. In this embodiment, an avoidance groove 221 is provided on a side of the second side plate 220 facing the third side plate 230, and the third flexible portion 1113 in a bent state can be located in the avoidance groove 221, thereby providing an accommodation space for the third flexible portion 1113.

[0095] Combination Figure 3 and Figure 4 as well as Figure 8 In one embodiment, the mounting bracket 200 further includes a first limiting portion 271 and a second limiting portion 272 spaced apart along the second direction X, wherein the first limiting portion 271 is connected to an end of the second side plate 220 away from the support plate 240 and protrudes from the second side plate 220 toward the direction close to the third side plate 230. The second limiting portion 272 is connected to an end of the third side plate 230 away from the support plate 240 and protrudes from the second side plate 220 toward the direction close to the second side plate 220.

[0096] After the third hard plate unit 112c enters the concave cavity 201, the first limiting portion 271 and the second limiting portion 272 can limit the third hard plate unit 112c along the first direction Z, so that the third hard plate unit 112c is located between the support plate 240 and the first limiting portion 271 and the second limiting portion 272. The spacing area between the first limiting portion 271 and the second limiting portion 272 can allow the signal transmission line 150 to pass through.

[0097] Combination Figure 3 and Figure 4 as well as Figure 8 In one embodiment, the mounting bracket 200 further includes a circumferential boss 280, the circumferential boss 280 surrounds an axis in the first direction Z, and the circumferential boss 280 includes a first portion protruding from the outer surface of the first side plate 210, a second portion protruding from the outer surface of the second side plate 220, and a third portion protruding from the outer surface of the third side plate 230. The position of the circumferential boss 280 along the first direction Z does not exceed the side of the support plate 240 that faces away from the concave cavity 201.

[0098] After the assembly structure of the imaging module 100 and the mounting bracket 200 is placed in the front end housing, the assembly structure and the front end housing can be fixed by means of glue injection. By providing the circumferential boss 280, the position of the circumferential boss 280 along the first direction Z does not exceed the side of the support plate 240 facing away from the concave cavity 201, so that the injected glue can be prevented from flowing to the side of the support plate 240 facing away from the concave cavity 201, that is, the glue is prevented from flowing to the camera device 120, thereby protecting the camera device 120.

[0099] Combination Figure 3 and Figure 4 as well as Figure 8 In one embodiment, two circumferential bosses 280 are arranged at intervals along the first direction Z, so as to provide double protection for the camera device 120. The number of the circumferential boss 280 may also be one.

[0100] An embodiment of the present application provides a front-end component, including the mounting bracket 200 of any one of the above embodiments.

[0101] An embodiment of the present application provides an endoscope, comprising a tip assembly according to the above embodiment.

[0102] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0103] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A tip assembly of an endoscope, characterized in that: The end assembly of the endoscope includes an imaging module and a mounting bracket; The imaging module includes: a circuit board structure, a camera device, a lighting device and electronic components. The circuit board structure includes a flexible circuit board and a plurality of hard board units, the flexible circuit board is a whole piece structure, the hard board unit is attached to the flexible circuit board along the board thickness direction, and the plurality of hard board units are spaced apart from each other along the extension direction of the flexible circuit board; The camera device is arranged on the circuit board structure, and a corresponding hard board unit is provided at a position on the circuit board structure corresponding to the camera device; The lighting device is arranged on the circuit board structure, and the position on the circuit board structure corresponding to the lighting device has the corresponding hard board unit; The electronic components are electrically connected to the circuit board structure, and the circuit board structure has corresponding hard board units at positions corresponding to the electronic components; Wherein, a single hard board unit comprises a first hard layer and a second hard layer, and the first hard layer and the second hard layer are respectively located on different sides of the flexible circuit board along the board thickness direction; The mounting bracket comprises: a first side plate, a second side plate, a third side plate and a support plate; One end of the support plate is connected to one end of the first side plate along the first direction, and the two are perpendicular to each other; one end of the support plate and the first side plate along the second direction are both connected to the second side plate, and the other ends of the support plate and the first side plate along the second direction are both connected to the third side plate; the first side plate, the second side plate, the third side plate, and the support plate form a concave cavity, and the opening of the concave cavity faces the third direction; On the side of the support plate facing away from the concave cavity along the first direction, the second side plate, the third side plate and the support plate form a limiting groove, the limiting groove has a first notch, and the direction of the first notch is the same as the direction of the opening of the concave cavity; wherein the first direction, the second direction and the third direction are perpendicular to each other; The mounting bracket further comprises a baffle, the baffle being fixedly connected to the support plate, the baffle and the first side plate being located at the same end of the support plate along the third direction, and the baffle protruding from the support plate in a direction away from the first side plate along the first direction; the baffle comprises a first stop portion and a second stop portion spaced apart along the second direction, so that an escape space is left between the first stop portion and the second stop portion; The mounting bracket further includes a placement platform, and the placement platform is respectively provided at one end of the second side plate and the third side plate along the first direction, and the placement platform is located on the side of the support plate along the first direction facing away from the concave cavity; the placement platform is provided with a placement groove, and the placement groove has a placement opening facing the third direction, and the direction of the placement opening is opposite to the direction of the opening of the concave cavity; The hard board unit corresponding to the position of the circuit board structure corresponding to the camera device is a first hard board unit; The rigid board unit corresponding to the position of the circuit board structure corresponding to the lighting device is a second rigid board unit; and the part of the flexible circuit board between the second rigid board unit and the first rigid board unit is defined as a first flexible part; There are two lighting devices, the two hard plate units are arranged in one-to-one correspondence with the two lighting devices, the two lighting devices are respectively located on both sides of the camera device along the second direction, and the first flexible portion is located on one side of the first hard plate unit along the third direction; The hard board unit at the position on the circuit board structure corresponding to the electronic component is a third hard board unit; defining a portion of the flexible circuit board between the third rigid board unit adjacent to the first rigid board and the first rigid board unit as a second flexible portion; The first hard plate unit is inserted into the limiting groove from the first notch; the third hard plate unit can be inserted into the concave cavity by bending the second flexible portion; The baffle stops the first hard plate unit to position the first hard plate unit along the third direction; The first flexible portion includes a connected narrow section and a wide section, wherein the narrow section is located in the middle of the wide section along the second direction, and the narrow section is located on a side of the wide section close to the first hard plate unit; the narrow section is located in the avoidance space, and the wide section is located on a side of the first stop portion and the second stop portion away from the first hard plate unit along the first direction; The two second hard board units and two lighting devices are placed on two placement tables respectively; the second hard board unit is bent toward the third direction relative to the first flexible part, so that the second hard board unit and the lighting device arranged thereon can enter the placement groove through the placement opening.

2. The endoscope tip assembly according to claim 1, characterized in that: The second hard board unit is arranged in parallel with the first hard board unit; the second hard board unit and the first hard board unit are perpendicular to the portion of the flexible circuit board between the second hard board unit and the first hard board unit.

3. The endoscope tip assembly according to claim 1, characterized in that: The number of the third hard plate unit is one.

4. The endoscope tip assembly according to claim 1, characterized in that: The number of the third hard plate units is at least two, and two adjacent third hard plate units are arranged in parallel and opposite to each other.

5. The endoscope tip assembly according to claim 3 or 4, characterized in that: The third hard board unit adjacent to the first hard board unit is perpendicular to the first hard board unit.

6. The endoscope tip assembly according to claim 5, characterized in that: The first hard board unit, the third hard board unit adjacent thereto, and the part of the flexible circuit board therebetween include a first section, a second section, and a third section connected in sequence, wherein the first section extends along a first direction relative to the first hard board unit in a direction away from the camera device; the second section and the third section are both located on a side of the first hard board unit away from the camera device; the second section extends in a direction parallel to the first hard board unit, and the third section extends along the first direction, and the first direction is the thickness direction of the first hard board unit.

7. The endoscope tip assembly according to claim 1, characterized in that: An end of the support plate along the third direction away from the first side plate is provided with a notch recessed along the third direction.

8. The endoscope tip assembly according to claim 1, characterized in that: A side of the second side plate facing the third side plate is provided with an avoidance groove.

9. The endoscope tip assembly according to claim 1, characterized in that: The mounting bracket also includes a first limiting portion and a second limiting portion spaced apart along the second direction, the first limiting portion being connected to an end of the second side plate away from the support plate and protruding from the second side plate toward the third side plate; the second limiting portion being connected to an end of the third side plate away from the support plate and protruding from the second side plate toward the second side plate.

10. An endoscope, characterized in that: The method comprises the tip assembly according to any one of claims 1 to 9.

Images