A method for processing a spray plate

Abstract

The present application provides a spray disc processing method, which belongs to the technical field of spray disc processing; it comprises the following steps: the processing method comprises the following steps: controlling an electrode to move along a first direction; obtaining a moving distance of the electrode in the first direction; switching a processing state of a processing device according to a moving distance of the electrode in the first direction; when the moving distance is within a first range, placing the processing device in a first state; when the moving distance is within a second range, switching the processing device to a second state; when the processing device is in the first state, controlling the electrode to rotate; when the processing device is in the first state, controlling the electrode to move along a preset trajectory while rotating; the technical problem of low processing efficiency of the spray disc is solved, and the technical effect of improving the processing efficiency of the spray disc is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of spray disc processing, and in particular to a spray disc processing method. Background Art

[0002] As one of the three core equipment in semiconductor manufacturing, thin film deposition equipment is the basis of almost all subsequent processes. The thin film deposition process generally refers to the deposition of a functional thin film on a silicon wafer substrate. This process often involves the introduction of reaction gases, and the uniformity of the gas introduction will directly affect the growth quality of the thin film. The spray plate is a surface-type reaction source gas introduction device in the thin film deposition process. It is one of the key core components of semiconductor thin film deposition equipment and directly affects the reliability and stability of the equipment.

[0003] The spray head, as the main component of the spray disc, has a vital impact on its performance. At present, the method commonly used to prepare the spray head is precision micro-hole processing. Generally, a vertical or horizontal processing machine is used to punch holes in the raw material through a micro-hole drill with a diameter of 0.3-3mm. The efficiency of precision micro-hole processing of a single spray hole is very low. It usually takes more than 50 hours to complete the processing of a spray disc, and the processing cannot be interrupted. Therefore, the processing efficiency of the existing spray disc is too low.

[0004] Therefore, the problem of the prior art is that the processing efficiency of the spray disc is too low. Summary of the invention

[0005] The present application provides a spray disc processing method, which solves the technical problem of low processing efficiency of the spray disc and adopts the following technical solution: the processing equipment adopted by the processing method includes: a driving device, the driving device includes a plurality of clamping members, the clamping members have rotational freedom along the axis and movement freedom along a preset trajectory; an electrode, the electrode is detachably connected to the clamping member; the processing method includes the following steps: controlling the electrode to move along a first direction; obtaining the movement distance of the electrode in the first direction; switching the processing state of the processing equipment according to the movement distance of the electrode in the first direction; when the movement distance is within a first range, placing the processing equipment in a first state and switching the processing equipment to a second state when the movement distance is within a second range; when the processing equipment is in the first state, controlling the electrode to rotate; when the processing equipment is in the first state, controlling the electrode to move along the preset trajectory while rotating.

[0006] Preferably, the processing equipment used in the processing method also includes a liquid supply device, which is electrically connected to the driving device, and the electrode includes a plurality of liquid outlet channels passing through the electrode; wherein the liquid outlets of the plurality of liquid outlet channels are respectively located on the bottom surface and the circumferential surface of the electrode; the liquid supply device is connected to the plurality of liquid outlet channels, and the liquid supply device is used to control the output state of the working fluid in the liquid outlet channel; the processing method also includes the following steps: obtaining the processing state of the processing equipment; adjusting the opening and closing states of different liquid outlet channels on the electrode according to the processing state of the processing equipment; when the processing equipment is in the first state, the liquid outlet channel with the outlet located on the bottom of the electrode is controlled to remain open; when the processing equipment is in the second state, the liquid outlet channel with the outlet located on the circumferential surface of the electrode is controlled to open.

[0007] Preferably, when the processing device is in the second state, the processing method further comprises the following steps: obtaining preset thresholds P1 and P2; obtaining the maximum distance d between the electrode periphery and the inner diameter of the micropore; max and the minimum distance d min , and the difference between the two d h ; If P1<d h ≤P2, it is judged that the electrode processing is normal; if d h >P2, or d h ≤P, it is judged that the electrode is in an abnormal processing state.

[0008] Preferably, the processing abnormal state includes a first abnormal state and a second abnormal state; if d h >P2, it is determined that the electrode is in the first abnormal state; if d h ≤P1, it is judged that the electrode is in the second abnormal state.

[0009] Preferably, the processing method further comprises the following steps: when the electrode is in a first abnormal state, reducing the flow rate of the working fluid in the liquid outlet channel; when the electrode is in a second abnormal state, increasing the flow rate of the working fluid in the liquid outlet channel.

[0010] Preferably, the control electrode is processed simultaneously on the surface of the spray disk, comprising the following steps: obtaining a temperature distribution gradient map of the spray disk surface; and controlling and adjusting the working fluid state according to the temperature distribution gradient map to keep the temperature of the spray disk consistent.

[0011] Preferably, the processing method of the spray plate further includes: dividing the surface of the spray plate into regions according to the temperature distribution gradient diagram; adjusting the sizes of preset thresholds P1 and P2 in different regions; and adjusting the flow rate of the working fluid in the liquid outlet channel based on the preset thresholds P1 and P2.

[0012] Preferably, the spray disk processing method further includes the following steps: controlling multiple electrodes to process the spray disk surface simultaneously; arranging multiple electrodes symmetrically along the center of the spray disk; arranging the symmetrically arranged electrodes into the same group; and controlling the electrodes in the same group to move in opposite directions.

[0013] Preferably, the liquid supply device used in the processing method also includes an external liquid flushing component, and the nozzle of the external liquid flushing component is set toward the electrode; controlling the output state of the external liquid flushing component also includes the following steps: switching to the external liquid flushing component according to the processing situation; controlling the external liquid flushing component to align the electrode for spraying to return the electrode to the center.

[0014] The present application also provides an electrospark machining device, comprising: a driving device and a liquid supply device, the driving device comprising: an electrode and a clamping member, the electrode is used for electrospark machining microholes, the clamping member is detachably connected to the electrode, the clamping member is used to clamp the electrode, the clamping member has rotational freedom, and the clamping member can be shaken in a first plane; the liquid supply device is communicatively connected to the driving device, and the liquid supply device is used to control the output state of the working fluid.

[0015] Preferably, the electrode also includes a plurality of liquid outlet channels running through the electrode, the liquid outlet channels are connected to the liquid supply device, and the liquid outlet channels include: a liquid inlet and a liquid outlet, the liquid inlet is located on the first end face of the electrode body; the liquid outlet is located on the second end face or side face of the electrode body.

[0016] In summary, the present application includes at least one of the following beneficial technical effects:

[0017] 1. The present application provides a spray disk processing method, which is suitable for the situation where multiple electrodes are used simultaneously to process micropores on the surface of the spray disk. When processing, the processing state of the processing equipment is first changed in real time according to the processing situation. The processing equipment includes a first state and a second state, so that the electrode in the first state rotates in the micropore, and the electrode in the second state can be circularly shaken while rotating in the micropore. Different processing methods are selected according to the processing situation, so that the electrode is switched between linear processing and shaking processing, and the liquid supply device is cooperated to control the liquid outlet state, so that the shape of the electrode during processing in the micropore can also be controlled, ensuring that the electrode can always maintain a stable and processing-friendly distance from the micropore wall during processing. The combination of the above processing methods can greatly reduce the processing time of the micropores on the surface of the spray disk and improve the efficiency of the micropore processing of the spray disk.

[0018] 2. The present application provides a spray plate processing method, which can change the position of the electrode in the micropore by changing the flow rate of the working fluid. There is no need to set up an additional control device to control the shaking path of the electrode. This solves the problem that the electrode movement path is not easy to adjust during shaking processing in the micropore due to its large diameter-to-depth ratio. This effectively solves the problem of electrode movement path deviation, improves the processing quality of the micropore while ensuring processing efficiency.

[0019] 3. The present application provides a method for processing a spray plate, which adopts electric spark machining equipment for processing, thereby avoiding the risk of tool breakage that may occur during mechanical processing. At the same time, electrode processing also avoids the hole mouth burrs that may occur with mechanical processing (especially the internal burrs of multi-step holes, which are extremely difficult to remove), thereby improving the production efficiency and production quality of the spray plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of a processing device provided in one embodiment of the present invention;

[0021] Figure 2 A schematic diagram of the movement of a spray plate processing device in a second state provided in one embodiment of the present invention;

[0022] Figure 3 A schematic flow chart of a method for processing a spray plate provided in one embodiment of the present invention;

[0023] Figure 4 A schematic diagram of a flow chart for controlling the state of a processing device provided in one embodiment of the invention;

[0024] Figure 5 It is a schematic diagram of a flow chart of controlling the state of the liquid outlet channel in the second state provided in one embodiment of the present invention.

[0025] Reference numerals:

[0026] 100, electrode; 110, liquid outlet channel; 200, driving device; 210, clamping member; 300, liquid supply device; 400, spray plate; 410, micropore. DETAILED DESCRIPTION

[0027] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0028] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] In the prior art, the spray head, as the main component of the spray plate 400, has a crucial impact on its performance. The method commonly used to prepare the spray head is precision micro-hole 410 processing, using a vertical or horizontal processing machine tool to drill holes in the raw material through a micro-hole 410 drill with a diameter of 0.3-3mm; in the prior art, during the processing of the spray plate 400, it is often necessary to machine thousands of micro-holes 410 on the surface of the spray plate 400, and the quality requirements for a single micro-hole 410 are also very high. Depending on the drilling depth and the drilling process, the drilling time of a first-order hole varies from 10 to 60 seconds, and the spray head is often The number of holes reaches thousands. Taking 3,000 holes as an example, the drilling time alone is 30-54 hours, and a dedicated person is required to operate and observe during the drilling period. At the same time, since the mechanical processing uses a mechanical drill bit with an extremely small diameter, there is a risk that the mechanical drill bit will break. Once it breaks, the entire spray plate 400 will be scrapped, making the entire processing process a waste. At the same time, if the micro-holes 410 of the spray head are processed by machining, they are often accompanied by burrs on the hole mouth (especially the internal burrs of multi-step holes are difficult to remove). The combination of the above factors leads to too low production efficiency of a single spray plate 400.

[0030] In order to solve the problem of low efficiency, existing spray plate 400 manufacturers have made many attempts, such as changing the processing method, optimizing the processing process, etc. However, under the premise of ensuring accuracy, no method that can significantly improve efficiency has been developed.

[0031] Some manufacturers have also tried to use electric sparks to process the surface of the spray plate 400. However, when a single electrode 100 is used for processing in the prior art, its efficiency is not faster than that of a single mechanical cutting device. At the same time, it should be taken into account that during the processing of the micropores 410 on the surface of the spray plate 400, the accuracy and speed of the electrode 100 during processing are related to the distance between the electrode 100 and the hole wall. The larger the distance between the outer wall of the electrode 100 and the inner wall of the micropore 410, the faster the processing speed of the electrode 100 and the lower the processing accuracy; the smaller the distance between the outer wall of the electrode 100 and the inner wall of the micropore 410, the slower the processing speed of the electrode 100 and the higher the processing accuracy.

[0032] Please refer to Figure 1-2 The present application also discloses a processing device used in the processing method, including: an electrode 100 and a driving device 200, wherein the electrode 100 is used for electrospark machining of a micro hole 410; the driving device 200 includes a clamping member 210, wherein the clamping member 210 is detachably connected to the electrode 100, and the clamping member 210 has a rotational freedom of rotation along an axis and a movement freedom of movement along a preset trajectory, and the clamping member 210 is used to clamp the electrode 100 and drive the electrode 100 to shake in a first plane, specifically:

[0033] In one embodiment, the electrode 100 is preferably a tungsten wire electrode. Since the spray plate 400 is used in the production of semiconductor equipment, the use of materials that may contaminate the spray plate 400, such as copper electrode 100, should be avoided. The electrode 100 of the present application is provided with a plurality of liquid outlet channels 110 that penetrate the body of the electrode 100. The liquid outlet channels 110 are used for discharging high-pressure liquid. The outlets of the liquid outlet channels 110 are respectively located at the bottom and the circumferential surface of the electrode 100 body. The liquid outlets distributed on the circumferential surface are located at one end close to the bottom of the electrode 100. There is a certain angle between the working liquid discharged through the liquid outlet channel 110 and the length direction of the electrode 100, and the size of the angle depends on specific needs.

[0034] In order to solve the above problems, the present application provides a spray plate processing method, which uses the aforementioned processing equipment, please refer to Figure 3 , including the following steps: controlling the electrode 100 to move along a first direction; obtaining the moving distance of the electrode 100 in the first direction; switching the processing state of the processing equipment according to the moving distance of the electrode 100 in the first direction; when the moving distance is within a first range, placing the processing equipment in a first state, and when the moving distance is within a second range, switching the processing equipment to a second state, specifically:

[0035] S101, control the electrode 100 to move along a first direction. The spray disk processing method used in the present application is a process for simultaneously processing multiple spray disks 400. When processing the micropores 410 on the surface of the spray disk 400, firstly, control the multiple electrodes 100 to enter the surface micropores 410 at the same time. The process of simultaneously processing multiple electric spark electrodes 100 can greatly shorten the time required for surface processing of the spray disk 400, and greatly improve the processing efficiency. In one embodiment, when processing, the first direction is the axial direction of the spray disk 400, and the required micropores 410 are processed at the specified position on the surface of the spray disk 400 through the action of the electric spark between the electrode 100 and the spray disk 400. The depth and size of the micropores 410 are related to the conditions of the processing setting. In one embodiment, the electrode 100 has a diameter of 0.3-3 mm and is made of tungsten wire (copper-containing electrodes 100 are prohibited). The rotation speed of the electrode 100 is 1-20 r / min, the feed speed is 5-20 mm / min, and the electrode 100 maintains a rotary motion to ensure uniform punching. The clamping member 210 is connected to the electrode 100 by a flexible clamping or multi-point clamping method, which can ensure that the electrode 100 rotates around its axis as much as possible without damaging the electrode 100, so as to ensure the accuracy of microhole 410 processing as much as possible.

[0036] S102, in the present application, by configuring a high-precision information acquisition device, such as a displacement sensing unit for acquiring the moving distance of the clamping member 210, the moving distance information of the electrode 100 in the first direction during the processing can be acquired, and then the moving distance information is transmitted to the judgment unit.

[0037] S103, the judgment unit controls the processing equipment to switch different processing states according to the moving distance of the electrode 100 in the first direction. In the present application, a first range and a second range are divided according to the depth of the micropore 410, the first range is from zero to the depth of the micropore 410, and the second range is greater than the depth of the micropore 410. The moving distance of the electrode 100 in the first direction is the distance that the electrode 100 has moved in the first direction from the initial point, which is a cumulative value.

[0038] S104, based on the moving distance of the electrode 100 in the first direction, when the electrode 100 has not been processed to the specified depth, that is, when the moving distance is in the first range, the contour of the microhole 410 can be processed most quickly through large-spacing rapid processing. The rapid processing process is the first state of the processing equipment. The first range is set because the first state of the processing equipment is to perform preliminary processing on the microhole 410. The preliminary processing is to obtain the approximate shape of the microhole 410. Therefore, it is only necessary to quickly process the microhole 410 to the specified depth.

[0039] S105 , according to the moving distance of the electrode 100 in the first direction, when the electrode 100 is processed to a specified depth in the microhole 410 , that is, when the moving distance is in the second range, the first state of rough processing is switched to the second state of fine processing.

[0040] In one embodiment, the information acquisition device includes a camera and a distance sensor. The camera can take pictures of the processing part and obtain real-time image data of the processing micropore 410; the distance sensor can obtain the moving distance of the electrode 100 in the first direction, and judge the depth of the hole by the moving distance; the image of the micropore 410 on the surface of the spray plate 400 is obtained by a high-precision image acquisition device. The image acquisition device uses a CCD camera and other equipment, and can complete the shooting of the surface of the spray plate 400 with a professional light source, and then the captured picture is transmitted to the judgment unit. The judgment unit processes the image data of the micropore 410 to obtain multiple feature data, and obtains the feature data of the micropore 410; the feature data includes but is not limited to: when the electrode 100 is at the center of the micropore 410, the real-time aperture of the micropore 410, the diameter of the electrode 100, and the distance between the inner wall of the micropore 410 and the outer wall of the electrode 100; when the electrode 100 is at the center of the micropore 410, the distance between the inner wall of the micropore 410 and the outer wall of the electrode 100 at multiple different positions, including the maximum distance, the minimum distance, the average distance, etc.

[0041] For further information, please refer to Figure 4 The processing method further includes the following steps: when the processing device is in the first state, controlling the electrode 100 to rotate; when the processing device is in the first state, controlling the electrode 100 to move along a preset trajectory while rotating, specifically:

[0042] The processing equipment in the present application includes a first state and a second state. In the first state, the electrode 100 rotates under the drive of the driving device 200 and moves along the first direction while rotating. Due to the electric spark effect of the electrode 100, the electrode 100 can process the micropores 410 on the surface of the spray plate 400; in the second state, the electrode 100 can shake along a specific track driven by the driving device 200 on the basis of self-rotation. The shaking track is preferably the same as the contour of the micropore 410 and concentric with the micropore 410. Specifically:

[0043] S201, when the processing equipment is in the first state, the electrode 100 is controlled to be in the center of the micropore 410. The first state is a rapid processing state. At this time, in order to maximize the processing speed, it is necessary to maximize the distance between the outer wall of the electrode 100 and the inner wall of the micropore 410. Therefore, it is preferred to set the electrode 100 in the center of the micropore 410 while maintaining the rotation of the electrode 100. At this time, due to the characteristics of motor processing, the electrode 100 is relatively far away from the hole wall of the micropore 410, so the processing speed is fast, but the hole wall processing accuracy does not meet the final requirements. The first state serves as a rough processing process in the processing of the micropore 410.

[0044] S202, when the processing equipment is in the second state, the electrode 100 is controlled to shake in the micropore 410, and the shaking profile is the same as the profile of the micropore 410. The processing equipment is controlled to be in the second state, and the second state is the shaking state. The second driving component drives the electrode 100 to shake. Shaking refers to moving along a circular track in the micropore 410. The moving circular track and the micropore 410 are concentric circles. When the shaking process is adopted, the electrode 100 moves along a circular track in the micropore 410. Compared with the process in the first state, the distance between the electrode 100 and the wall of the micropore 410 is reduced. In the second state, the processing efficiency of the electrode 100 is low, but the processing accuracy is high, which is used as the finishing process in the processing of the spray plate 400; by setting the first state of rough processing and the second state of finishing processing, the combination of the two can improve the efficiency while ensuring the processing accuracy, so that the spray plate 400 processing process using this method can greatly reduce the time required for electric spark processing.

[0045] In one embodiment, the driving device 200 includes a first driving component with extremely high precision, a second driving component and a rotating spindle; the spindle has a rotational freedom and is connected to the clamp 210, and can drive the clamp 210 and the electrode 100 connected to the clamp 210 to rotate; the first driving component includes a first moving end, the first moving end is connected to the spindle, and the first moving end has a moving freedom in a first direction, so the first driving component can drive the spindle to move in the first direction; the second driving component has a second moving end, the second moving end has a moving freedom in multiple directions, and can shake along a preset circular trajectory in a first plane, and the second moving end is connected to the first moving component or the spindle, and can drive the spindle to shake along a preset circular trajectory in the first plane. In this embodiment, the driving device 200 can switch between a first state and a second state, in the first state, only the first driving component is used, and in the second state, the first driving component and the second driving component are started at the same time.

[0046] During the shaking process, the working fluid of the micropore 410 in the prior art does not change accordingly, which results in that during the processing, when the position of the electrode 100 and the wall of the micropore 410 is reduced, the corresponding flushing fluid does not change, making the fluid flow state at the position with a smaller gap different from the fluid flow state at the position with a larger gap. Since the fluid state will also affect the processing effect of the micropore 410, this will lead to consistency problems in the processing of the micropore 410. At the same time, the force of the fluid may also cause the shape of the electrode 100 to change, so that the electrode 100 may be deflected in the micropore 410.

[0047] The processing state is judged according to the obtained characteristic data, and the distance between the inner wall of the micropore 410 and the outer wall of the electrode 100 is judged according to the real-time aperture of the micropore 410, the diameter of the electrode 100 and the position of the electrode 100 in the micropore 410. This distance is the electrode reduction amount. The processing situation is judged according to the electrode reduction amount, and on this basis, the position of the electrode 100 in the micropore 410 is reasonably adjusted so that the electrode 100 is always in the required designated position; at the same time, according to the processing state, the corresponding working fluid is selected, and the working fluid includes an inner working fluid and an outer working fluid. Specifically:

[0048] The working fluid is discharged from the flushing channel in the electrode 100, flows outward from the micropore 410, drives the chip residue to flow out from the micropore 410, and plays the role of the electric spark working fluid. Since the working fluid is a high-pressure liquid, the working fluid will hit the inner wall of the micropore 410 when flowing out of the electrode 100. At this time, the reaction force caused by the impact of the solution will change the state of the electrode 100. The specific flow rate, flow direction and flow rate of the working fluid can be selected according to actual conditions.

[0049] The external flushing liquid is output through an external nozzle, and the working liquid is input from the outside through the external nozzle, and the processing impurities between the electrode 100 and the micropore 410 can be flushed out by the impact effect; however, due to the small gap between the micropore 410 and the electrode 100, the external flushing liquid method may not be able to flush some places, so the use of the external flushing liquid method still exists under certain conditions; in the present application, whether the external flushing liquid is used depends on the size of the maximum spacing between the micropore 410 and the electrode 100. When the maximum spacing exceeds a certain threshold, an external flushing liquid device can be used for flushing, and the liquid outlet angle of the external flushing liquid device can be adjusted, preferably aligned with 1 / 2 to 1 / 3 of the lower half of the micropore 410 to facilitate better flushing.

[0050] Furthermore, the processing equipment includes a liquid supply device 300, which is electrically connected to the driving device 200, and is connected to multiple liquid outlet channels 110. The liquid supply device 300 is used to control the output state of the working liquid in the liquid outlet channel 110. The liquid supply device 300 includes at least one liquid supply port that can be opened and closed, and the liquid supply port is connected to the hollow pipe on the electrode 100. The liquid supply process is realized by opening and closing the liquid supply port. The liquid supply device 300 is communicatively connected to the driving device 200, and the liquid supply state of the liquid supply device 300 can be changed according to the processing state of the driving device 200. The liquid supply state of the liquid supply device 300 includes changing the flow rate, pressure, type and temperature of the liquid supply; the liquid supply device 300 can use a device for supplying a trace amount of liquid, such as a micro pump, and a switch with multiple states can be set at the outlet, such as a multi-way valve, a rotary switch, etc., for controlling the opening and closing of multiple positions.

[0051] In the present application, the distance between the inner wall of the micropore 410 and the outer wall of the electrode 100 is determined according to the real-time aperture of the micropore 410, the diameter of the electrode 100 and the position of the electrode 100 in the micropore 410, and this distance is the electrode reduction. The processing situation is determined according to the electrode reduction, and on this basis, the position of the electrode 100 in the micropore 410 is reasonably adjusted so that the electrode 100 is always in the required designated position; at the same time, according to the processing state, the corresponding working fluid is selected, specifically: the working fluid is discharged from the liquid outlet channel 110 in the electrode 100, flows outward from the micropore 410, drives the chip residue to flow out from the micropore 410, and plays the role of the electric spark working fluid. Since the working fluid is a high-pressure liquid, the working fluid will hit the inner wall of the micropore 410 when it flows out of the electrode 100. At this time, the reaction force caused by the impact of the solution will change the state of the electrode 100. The specific flow rate, flow direction and flow rate of the working fluid can be selected according to the actual situation.

[0052] The specific processing method also includes the following steps: obtaining the processing state of the processing equipment; adjusting the opening and closing states of different liquid outlet channels 110 on the electrode 100 according to the processing state of the processing equipment; when the processing equipment is in the first state, controlling the liquid outlet channel 110 whose outlet is located on the bottom of the electrode 100 to remain open; when the processing equipment is in the second state, controlling the liquid outlet channel 110 whose outlet is located on the circumferential surface of the electrode 100 to open, specifically:

[0053] S301, in the present application, the liquid outlet channel 110 is used for the outflow of the working fluid, and a channel for spark processing is formed between the electrode 100 and the wall of the micropore 410 through the outflowing working fluid. Since the electrode 100 in the present application is provided with a plurality of openings, and the openings are located on the bottom and side walls of the electrode 100, the opening and closing states of different liquid outlet channels 110 are controlled according to different processing equipment, that is, the working fluid is controlled to be sprayed from different outlets to suit different processing conditions.

[0054] S302, in one embodiment, when the processing equipment is in the first state, the electrode 100 runs vertically downward, and the distance between the electrode 100 and the side wall of the micropore 410 is constant. At this time, the processing speed is relatively fast and more impurities are generated. When the working fluid is flushed out from the bottom of the electrode 100, more impurities can be driven out. At the same time, the working fluid flowing out from the bottom can increase the stability of the electrode 100.

[0055] S303, in one embodiment, the processing equipment is in the second state, and the control outlet channel 110 located at the side of the electrode 100 is opened. In the second state, the electrode 100 is in a shaking state, and the electrode 100 needs to be shaken along a circular trajectory in the micropore 410; by opening the liquid outlet channel 110 located at the side of the electrode 100, the working fluid rushes out from the side, so that the electrode 100 can be subjected to the reaction force from the working fluid, so that the electrode 100 can better complete the shaking process; at the same time, since the micropores 410 on the surface of the spray plate 400 are generally micropores 410 with a relatively large diameter and depth, and the micropores 410 of the electrode 100 are filled with flowing working fluid during the electrospark machining process, when the aperture ratio is above 1:20, if at this time The liquid still flows out from the bottom, and the solution in the micropore 410 will form a liquid film, which will block the movement of the electrode 100, making it difficult for the electrode 100 to move in the micropore 410, and the electrode 100 itself has a certain flexibility, which makes it more difficult to overcome this liquid film to complete the circular shaking process; in one embodiment, when the electrode 100 is close to the micropore 410, a minimum distance and a maximum distance will be formed. By properly setting the position and direction of the liquid outlet on the circumferential surface of the electrode 100, and coordinating the shaking and rotation control, the side hole of the electrode 100 is located at the position where the maximum distance is formed during the shaking process, so that the liquid reaction force overcomes the flexibility of the electrode 100 or the liquid film, so that the electrode 100 can be kept vertical as much as possible. Further, since the processing speed of the electrode 100 in the second state is slow, the impurities generated are also less. At this time, even the working fluid flowing out through the side wall can complete the task of removing impurities, and will not affect the processing requirements.

[0056] For further information, please refer to Figure 5 , obtain the preset thresholds P1 and P2; obtain the maximum distance d between the periphery of the electrode 100 and the inner diameter of the micropore 410 max and the minimum distance d min , and the difference between the two d h ; If P1<d h ≤P2, it is judged that the electrode 100 is processed normally; if d h >P2, or d h ≤P1, it is judged that the electrode 100 is in an abnormal processing state, specifically:

[0057] S401, P1 and P2 correspond to two constants respectively, P1 and P2 are selected according to actual conditions, P1 and P2 are preset in the storage unit, and P1 and P2 are obtained after multiple experiments; wherein, P1<P2.

[0058] S402, please refer to Figure 2 , Figure 2 D1 and D2 in the figure correspond to the maximum distance d max and the minimum distance d min , obtain the maximum distance d between the outer periphery of the electrode 100 and the inner diameter of the micropore 410 max and the minimum distance d min , maximum distance d max and the minimum distance d min It is worth noting that the maximum distance and the minimum distance between the outer wall of the electrode 100 and the inner wall of the micropore 410 are obtained by obtaining multiple pictures after the electrode 100 tends to be stable during circular shaking, analyzing the characteristic information in the pictures, and calculating the average distance in multiple pictures, that is, the average maximum distance d can be obtained. max and the minimum distance d min , and at the same time for the maximum distance d max and the minimum distance d min The difference is calculated to get d h , d h =d max -d min .

[0059] S403, if P1<d h ≤P2, it means that the electrode 100 is in a normal processing position. At this time, the electrode 100 meets the preset processing requirements, and it is determined that the processing of the electrode 100 is normal.

[0060] S404, if d h >P2, or d h ≤P1, it is determined that the electrode 100 is in an abnormal processing state, the abnormal state is output, and then a corresponding processing method is selected according to the specific situation.

[0061] S501, if d h >P2, it means that the electrode 100 is too close to the inner wall of the microhole 410, and it is judged that the processing equipment is in the first abnormal state; when the electrode 100 is too close to the inner wall of the microhole 410, since the minimum distance between the two is too small, the EDM process between the electrode 100 and the hole wall cannot be completed, and the processing time will be increased, reducing the processing efficiency.

[0062] S502, if d h≤P1, it means that the electrode 100 is too far away from the inner wall of the micropore 410 at this time, and it is judged that the processing equipment is in the second abnormal state; when the electrode 100 is too far away from the inner wall of the micropore 410, since the minimum distance between the two is too large, the process of fine processing of the inner wall of the micropore 410 cannot be achieved, so that the polishing of the inner wall of the micropore 410 cannot meet the processing requirements, and therefore the second state is output.

[0063] Furthermore, the processing method also includes the following steps: when the electrode 100 is in a first abnormal state, reducing the flow rate of the working fluid in the liquid outlet channel 110; when the electrode 100 is in a second abnormal state, increasing the flow rate of the working fluid in the liquid outlet channel 110.

[0064] S601, when the electrode 100 is in the first abnormal state, the flow rate of the working fluid in the liquid outlet channel 110 is reduced. When the electrode 100 is in the first state, it means that the electrode 100 is too close to the inner wall of the micropore 410; at this time, the flow rate of the working fluid is reduced, so that the flow rate of the working fluid flowing out of the side of the electrode 100 is reduced, so that the reaction force on the electrode 100 becomes smaller, and the electrode 100 retracts back in the direction away from the inner wall of the micropore 410 when rotating, so that the electrode 100 returns to the specified processing distance.

[0065] S602, when the electrode 100 is in the first abnormal state, the flow rate of the working fluid in the liquid outlet channel 110 is increased. When the electrode 100 is in the second state, it means that the electrode 100 is too far away from the inner wall of the micropore 410. At this time, the flow rate of the working fluid is increased, so that the flow rate of the working fluid flowing out of the side of the electrode 100 increases, so that the reaction force on the electrode 100 becomes larger, and the electrode 100 extends back in the direction away from the inner wall of the micropore 410 when rotating, so that the electrode 100 moves to the specified processing distance.

[0066] In the present application, the position of the electrode 100 in the micropore 410 can be changed by changing the flow rate of the working fluid, and there is no need to set up an additional control device to control the shaking path of the electrode 100. This solves the problem that the moving path of the electrode 100 is not easy to adjust during the shaking processing in the micropore 410 due to its large diameter-to-depth ratio. This effectively solves the problem of the deviation of the moving path of the electrode 100, and improves the processing quality of the micropore 410 while ensuring the processing efficiency.

[0067] Furthermore, the control electrode 100 is processed simultaneously on the surface of the spray plate 400, including the following steps: obtaining a temperature distribution gradient map on the surface of the spray plate 400; controlling and adjusting the working fluid state according to the temperature distribution gradient map to keep the temperature of the spray plate 400 consistent, specifically:

[0068] S701, obtain the temperature distribution gradient diagram of the surface of the spray plate 400. The spray plate 400 is circular, and the micropores 410 are evenly distributed on the surface of the spray plate 400. When the multiple micropores 410 on the surface of the spray plate 400 are processed synchronously, the temperature of the spray plate 400 gradually decreases from the inside to the outside due to temperature transfer. However, the specific temperature distribution gradient diagram needs to be drawn based on the actual measurement values.

[0069] S702, adjust the state of the working fluid according to the drawn distribution gradient diagram, so that the temperature on the spray plate 400 gradually tends to be consistent, thereby ensuring the consistency of the micropore 410 processing; specifically, the processing temperature or processing speed of the working fluid at different positions can be changed. During the processing, the faster the flow rate of the working fluid is, the more heat it takes away in a short time, that is, the faster the temperature drops.

[0070] Furthermore, the manufacturing of the spray plate 400 also includes the following steps: dividing the surface of the spray plate 400 into regions according to the temperature distribution gradient diagram; adjusting the sizes of the preset thresholds P1 and P2 in different regions; and adjusting the flow rate of the working fluid in the liquid outlet channel 110 based on the preset thresholds P1 and P2.

[0071] S801, according to the temperature distribution gradient diagram of the surface of the spray plate 400, based on the average temperature deviation and the temperature reference value, the surface of the spray plate 400 is divided into multiple areas, so that the temperature change values ​​in each adjacent area are substantially the same.

[0072] S802, according to the divided multiple temperature zones, adjust the sizes of the preset thresholds P1 and P2 in different zones. The setting of the thresholds P1 and P2 is based on the surface temperature of the spray plate 400. Different thresholds P1 and P2 can be preset when the surface temperature is different. The thresholds P1 and P2 specifically depend on the aperture of the micropore 410, the diameter of the electrode 100, the flow rate of the internal flushing working fluid and the preset shaking trajectory.

[0073] S803, based on the preset threshold values ​​P1 and P2, the flow rate of the working fluid in the liquid outlet channel 110 is adjusted, and the processing temperature in the micropores 410 in multiple regions is kept consistent by changing the flow rate; specifically, in one embodiment, the spray plate 400 is divided into a first region, a second region, a third region and a fourth region, and a plurality of groups of different threshold values ​​P1 and P2 are set according to the different temperatures of each region. After the corresponding preset threshold values ​​P1 and P2 are determined, the flow rates of the working fluid are adjusted to v1, v2, v3 and v4 respectively, and processing is first performed according to v1, v2, v3 and v4, and then adjustment is performed based on this speed so that the displacement of the electrode 100 is within the required range.

[0074] Furthermore, in the step of performing electrospark micro-hole machining 410 on the surface of the spray plate 400, the rotation speed of the electrode 100 is controlled to be 1-20 r / min, the feed speed is 5-20 mm / min, and the pressure of the working fluid is 1-10 MPa.

[0075] Furthermore, the micropores 410 on the surface of the spray plate 400 have multiple electrodes 100. According to the different shapes of the micropores 410, the micropores 410 on the surface of the spray plate 400 can be divided into multiple order holes. For example, a single micropore 410 with a constant diameter is a first-order micropore 410, a single micropore 410 with two diameters is a second-order hole, and a single micropore 410 with three diameters is a third-order hole. As the number of orders increases, the processing time and difficulty of the spray plate 400 also increase significantly. In order to solve the problem of the difficulty of processing multi-order holes, the spray plate processing method provided by the present application also includes the following steps, specifically:

[0076] S901, control the spray plate processing equipment to complete the EDM of the first-order hole; control the spray plate processing equipment to complete the processing of the micropores 410 on the surface of the spray plate 400 according to the previous steps, and use the spray plate processing equipment to process a through hole with a diameter that meets the first-order hole.

[0077] S902, based on the first-order hole, adjust the processing mode of the spray plate processing equipment to complete the second-order hole processing, and the diameter of the second-order hole is larger than the diameter of the first-order hole; in some embodiments, the spray plate 400 that has completed the first-order hole processing is maintained to obtain information about the micropores 410 on the surface of the spray plate 400, and then execute the processing method in the aforementioned steps to obtain the processing state of the electrode 100 in the spray plate processing equipment, and adjust the spray plate processing equipment according to the processing state and the preset processing value, so that the electrode 100 in the spray plate processing equipment can process micropores 410 of different diameters, thereby obtaining a spray plate 400 with second-order holes. It can be imagined that not only the processing of second-order holes, but also the processing of similar third-order holes and even more multi-order holes can adopt the above-mentioned method, which can greatly improve the processing efficiency of the spray plate 400; and the secondary processing of the spray plate processing equipment is based on the processing results of the first-order holes of the spray plate 400, and on the basis of the first-order spray plate 400 processing, it can also greatly improve the processing effect of the spray plate 400; at the same time, compared with the mechanical processing method in the prior art, the present application can avoid damage to the microhole 410 itself, thereby reducing the processing difficulty.

[0078] Further, the spray plate 400 is cleaned by the following steps: the spray plate 400 after processing is sequentially cleaned by ultrasonic cleaning with clean water, degreasing cleaning, cold water cleaning, nitric acid cleaning, cold water cleaning, nitric acid cleaning, cold water cleaning, nitrogen drying, hot water cleaning, and nitrogen drying; the above steps are repeated until the cleaning of the spray plate 400 is completed. Specifically:

[0079] In some embodiments, after the spray plate 400 is processed to the outer dimensions and the roughness of the micropores 410 meet the requirements, chemical cleaning is performed to remove the stains and working fluids remaining on the surface during the processing. Different cleaning schemes can be selected according to different materials. The cleaning process used in this embodiment is as follows: ultrasonic cleaning with clean water, degreasing cleaning, cold water cleaning, nitric acid cleaning, cold water cleaning, nitric acid cleaning, cold water cleaning, nitrogen drying, hot water cleaning, nitrogen drying, and the above two steps are repeated 3 times to complete the cleaning of the spray head.

[0080] In one embodiment, the liquid supply device 300 also includes an external flushing liquid component, which outputs through an external nozzle. The working liquid is input from the outside through the external nozzle, and the processing impurities between the electrode 100 and the outer wall of the micropore 410 can be flushed out by the impact effect; however, due to the small gap between the micropore 410 and the electrode 100, the external flushing liquid method may not be able to flush some places, so the use of the external flushing liquid method still exists under certain conditions; in the present application, whether the external flushing liquid is used depends on the size of the maximum spacing between the micropore 410 and the electrode 100. When the maximum spacing exceeds a certain threshold, an external flushing liquid device can be used for flushing, and the liquid outlet angle of the external flushing liquid device can be adjusted, preferably aligned with 1 / 2 to 1 / 3 of the lower half of the micropore 410 to facilitate better flushing.

[0081] The electrode 100 is guided by the guide channel on the mounting seat to ensure that the feeding direction is when the electrode 100 is subjected to electrospark machining. After the high-pressure working fluid flows out from the outlet channel 110, it rushes out from the gap between the workpiece and the electrode 100, taking away the metal debris, carbon black and other electro-erosion products generated during the electrospark process. The flow of the high-pressure working fluid has a cooling effect on the electrode 100 and the workpiece, and can also make the electrode 100 suspended in the hollow of the micropore 410 to avoid contact with the workpiece and cause a short circuit. The working fluid is generally kerosene, saponified liquid and deionized water. The pressure of the working fluid is 1-10MPa. During operation, the electrode 100 and the workpiece are respectively connected to the positive and negative poles of the pulse power supply, and the processing speed and inner hole roughness of the electrospark drilling are controlled by controlling the electrical parameters of the pulse power supply. The processing speed of the micropore 410 under this process can reach 5-20mm / min, the processing accuracy can reach within 0.05mm, and the roughness can reach below Ra0.5. After EDM drilling, only fine finishing or sandblasting of the upper and lower surfaces is required to meet the processing requirements of the parts, and no additional deburring work is required.

[0082] An embodiment of the present application also proposes a readable storage medium, on which one or more computer programs are stored. The one or more computer programs include instructions. When the program or instructions are executed by a processor in a spray disc processing device including multiple application programs, the processor in the spray disc processing device can execute the various processes of the above-mentioned spray disc processing method embodiment.

[0083] Technical effects:

[0084] 1. The present application provides a method for processing a spray plate, including using a plurality of electrodes 100 to simultaneously process micropores 410 on the surface of a spray plate 400, detecting real-time information of the processing of the micropores 410 during the processing, acquiring characteristic data of the micropores 410, and changing the processing state of the processing equipment according to the characteristic data of the micropores 410, selecting different processing methods according to the processing conditions, so that the electrode 100 switches between linear processing and shaking processing, and at the same time cooperates with the liquid supply device 300 to control the liquid discharge state, so that the shape of the electrode 100 during processing in the micropore 410 can also be controlled, ensuring that the electrode 100 can always maintain a stable and processing-friendly distance from the wall of the micropore 410 during processing. The combination of the above processing methods can greatly reduce the processing time of the micropores 410 on the surface of the spray plate 400, and improve the processing efficiency of the micropores 410 of the spray plate 400.

[0085] 2. The present application provides a spray plate processing method, which can change the position of the electrode 100 in the micropore 410 by changing the flow rate of the working fluid. There is no need to set up an additional control device to control the shaking path of the electrode 100. This solves the problem that the moving path of the electrode 100 is not easy to adjust during the shaking processing in the micropore 410 due to its large diameter-to-depth ratio. This effectively solves the problem of the deviation of the moving path of the electrode 100, and improves the processing quality of the micropore 410 while ensuring the processing efficiency.

[0086] 3. The present application provides a spray plate processing method, which adopts electric spark machining equipment for processing, thereby avoiding the risk of tool breakage that may occur during mechanical processing. At the same time, the processing also avoids the hole mouth burrs that may occur with mechanical processing (especially the internal burrs of multi-step holes, which are extremely difficult to remove), thereby improving the production efficiency and production quality of the spray plate 400.

[0087] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0088] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A method for processing a spray plate, for processing micropores, characterized in that: The processing equipment used in the processing method includes: a driving device, the driving device includes a plurality of clamping members, the clamping members have a rotational freedom of rotating along an axis and a movement freedom of moving along a preset trajectory; An electrode, wherein the electrode is detachably connected to the clamping member; A liquid supply device, the liquid supply device is electrically connected to the driving device; wherein the electrode comprises a plurality of liquid outlet channels penetrating the electrode, and the liquid outlets of the plurality of liquid outlet channels are respectively located on the bottom surface and the circumferential surface of the electrode; the liquid supply device is in communication with the plurality of liquid outlet channels, and the liquid supply device is used to control the output state of the working liquid in the liquid outlet channels; The processing method comprises the following steps: The control electrode moves along a first direction; the first direction is the axial direction of the spray disk; Acquire the movement distance of the electrode in the first direction; the movement distance of the electrode in the first direction is the distance the electrode moves from the initial point in the first direction, which is a cumulative value; switching a processing state of the processing device according to a moving distance of the electrode in a first direction; When the moving distance is in a first range, the processing device is placed in a first state; the first range is from zero to the depth of the microhole; When the moving distance is in a second range, switching the processing equipment to a second state; the second range is greater than the depth of the microhole; When the processing device is in the first state, the electrode is controlled to rotate; When the processing equipment is in the second state, the electrode can be shaken along a specific track driven by the driving device on the basis of self-rotation, and the shaking track is the same as the contour of the microhole and is concentric with the microhole; Obtain the processing status of the processing equipment; According to the processing state of the processing equipment, the opening and closing states of different liquid outlet channels on the electrode are adjusted accordingly; When the processing device is in the first state, the liquid outlet channel at the bottom of the electrode is controlled to remain open; When the processing equipment is in the second state, the liquid outlet channel located on the circumferential surface of the electrode is controlled to be open; Control the spray plate processing equipment to complete the EDM of the first-order hole; Based on the first-order hole, adjust the spray plate processing equipment, repeat the micro-hole processing steps, and complete the second-order hole processing; Among them, the diameter of the second-order hole is larger than the diameter of the first-order hole.

2. The method for processing a spray plate according to claim 1, characterized in that: When the processing device is in the second state, the processing method further comprises the following steps: Obtain preset thresholds P1 and P2; Get the maximum distance d between the electrode periphery and the inner diameter of the micropore max and the minimum distance d min , and the difference between the two d h ; If P1<d h ≤P2, judging that the electrode processing is normal; If d h >P2, or d h ≤P, it is judged that the electrode is in an abnormal processing state.

3. The method for processing a spray plate according to claim 2, characterized in that: The processing abnormal state includes a first abnormal state and a second abnormal state; If d h >P2, judging that the electrode is in the first abnormal state; If d h ≤P1, it is judged that the electrode is in the second abnormal state.

4. The method for processing a spray plate according to claim 3, characterized in that: The processing method further comprises the following steps: When the electrode is in a first abnormal state, reducing the flow rate of the working fluid in the fluid outlet channel; When the electrode is in the second abnormal state, the flow rate of the working fluid in the fluid outlet channel is increased.

5. The method for processing a spray plate according to claim 3, characterized in that: The control electrode and the spray plate surface are processed simultaneously, including the following steps: Obtain the temperature distribution gradient diagram of the spray plate surface; Control and adjust the working fluid state according to the temperature distribution gradient diagram to keep the temperature of the spray plate consistent.

6. The method for processing a spray plate according to claim 5, characterized in that: The processing method of the spray plate also includes: According to the temperature distribution gradient diagram, the surface of the spray plate is divided into regions; Adjust the size of preset thresholds P1 and P2 in different areas; Based on the preset thresholds P1 and P2, the flow rate of the working fluid in the liquid outlet channel is adjusted.

7. The method for processing a spray plate according to claim 1, characterized in that: The spray plate processing method also includes the following steps: Control multiple electrodes to process the spray plate surface simultaneously; The plurality of electrodes are symmetrically arranged along the center of the spray disk; The symmetrically arranged electrodes are grouped together; Control the movement directions of electrodes in the same group to be opposite.

8. The method for processing a spray plate according to claim 2, characterized in that: The liquid supply device used in the processing method also includes an external liquid flushing component, and the nozzle of the external liquid flushing component is arranged toward the electrode; Controlling the output state of the external flushing component also includes the following steps: Switch to external flushing components according to processing conditions; Control the external flushing liquid assembly to spray towards the electrode to return the electrode to the correct position.

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