High-temperature-resistant and high-humidity-resistant anisotropic conductive adhesive film and preparation method thereof
By using materials such as glycidyl tertiary carbonate modified polymers, the glass transition temperature and mechanical properties of the heterosquamous conductive adhesive film are improved, and the problem of insufficient adaptability in high-temperature and high-humidity environments is solved, and more stable signal transmission is achieved and mechanical properties.
Patent Information
- Application Number
- CN202411011136.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2024-12-06
AI Technical Summary
The existing heterosqualitative conductive adhesive films are insufficiently adaptable in high temperature and high humidity environments, resulting in poor mechanical properties and unstable signal transmission.
Using glycidyl tertiary carbonate modified polymer, thermoplastic resin, thermosetting resin, conductive particles and fillers, the glass transition temperature and mechanical properties of the adhesive film are improved through specific formulations and preparation methods, and the glass transition temperature and mechanical properties of the adhesive film are enhanced to enhance its high temperature and high temperature. Stability and elongation under wet.
It significantly improves the thermal stability, moisture resistance and mechanical properties of heterosquare conductive adhesive film, ensures good physical and chemical properties maintained in complex environments, avoids moisture penetration and freezing effects, and provides a more reliable signal transmission solution. plan.
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Figure BDA0004964391580000101
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of conductive adhesive films, and relates to an anisotropic conductive adhesive film resistant to high temperature and high humidity and a preparation method thereof. Background Art
[0002] With the rapid development of science and technology, the popularity and intelligence of electronic products have become a major symbol of modern society. As a key component in electronic devices, the performance of liquid crystal display (LCD) directly affects the user experience and the overall quality of the device. In LCD and other display technologies, anisotropic conductive film (ACF) plays a vital role. ACF is a special material that integrates insulation, conductivity and bonding functions. Its unique property is that it can achieve precise conductive connection in the vertical direction while maintaining insulation in the horizontal direction. This feature is crucial to ensure the safe operation of the internal circuit of the display. The application of ACF makes signal transmission stable and efficient while avoiding the risk of short circuit.
[0003] ACF is mainly composed of conductive particles and adhesives. Conductive particles are usually composed of metal or metal-coated polymer particles. During the thermocompression bonding process, the conductive particles are compressed in the vertical direction to form a conductive channel, thereby establishing an electrical connection between two electronic components. As another core component of ACF, adhesive plays a vital role. It fixes the conductive particles in place, ensuring that they can form a stable conductive bridge after thermocompression bonding, giving ACF the necessary mechanical strength to enable it to maintain the stability and durability of the connection in a complex working environment; adhesives usually include thermoplastic elastomers and thermosetting elastomers.
[0004] The ACF film prepared by the current ACF formula has certain deficiencies in its adaptability to high temperature and high humidity. The conventional improvement measure is to add a prepolymer with a high glass transition temperature (Tg) to obtain a high Tg ACF film, but too much high Tg ACF is not conducive to the practicality of ACF, and its nature is brittle and its mechanical properties are poor. Summary of the invention
[0005] In order to solve the above problems existing in the prior art, the object of the present invention is to provide an anisotropic conductive adhesive film resistant to high temperature and high humidity and a preparation method thereof.
[0006] One object of the present invention is achieved by the following technical solutions:
[0007] A high temperature and high humidity resistant anisotropic conductive adhesive film, the raw materials of which are measured by weight: 5-15 parts of tert-butyl glycidyl carbonate (E10P) modified polymer, 30-40 parts of thermoplastic resin, 20-30 parts of thermosetting resin, 1-7 parts of conductive particles, 8-30 parts of filler, and 1-5 parts of initiator.
[0008] Preferably, the raw materials of the tert-butyl glycidyl carbonate modified polymer include:
[0009] 20-30 parts of tert-butyl glycidyl carbonate, 6.3-9.5 parts of hydroxypivalic acid neopentyl glycol monoester, 5-10 parts of isocyanuric acid diacrylate, 9.7-14.6 parts of ditrimethylolpropane tetraacrylate, and 0.1-1 part of peroxide initiator.
[0010] Preferably, the preparation method of the tert-butyl glycidyl carbonate modified polymer comprises the following steps:
[0011] Tert-butyl glycidyl carbonate is added into a reaction kettle, and after heating, a mixture of hydroxypivalic acid neopentyl glycol monoester, isocyanuric acid diacrylate, ditrimethylolpropane tetraacrylate and peroxide initiator is added dropwise. After the addition is completed, the temperature is maintained for reaction to obtain a tert-butyl glycidyl carbonate modified polymer.
[0012] Preferably, the dropping speed is 1 to 10 ml / min.
[0013] Preferably, the reaction is maintained at 120-160° C. for 0.5-3 h.
[0014] Preferably, the thermoplastic resin includes, but is not limited to, one or more of polyethylene, polypropylene, ethylene-propylene copolymer, polyvinyl chloride, polystyrene, polycarbonate, polyamide, and polymethyl methacrylate.
[0015] Preferably, the thermosetting resin includes one or more of epoxy resin, phenolic resin, polyurethane acrylate, epoxy acrylate resin, amine-modified bismaleimide resin, and unsaturated polyamide resin.
[0016] More preferably, the thermosetting resin is epoxy resin.
[0017] Preferably, the epoxy resin includes one or more of glycidyl ether epoxy resin (such as bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenolic resin, etc.), glycidyl amine epoxy resin, and glycidyl ester epoxy resin.
[0018] Preferably, the conductive particles are a core-shell structure composition with a polymer as the core and a metal layer as the shell. The polymer can be listed as one or more of polymethyl methacrylate, polyaniline, polystyrene, polyacrylamide, polyvinyl chloride, and polyacrylonitrile, and the metal layer can be listed as one or more of nickel layer, gold layer, copper layer, and cobalt layer.
[0019] More preferably, the particle size of the conductive particles is 0.5 to 20 μm, and further preferably 1 to 8 μm.
[0020] Preferably, the filler is one or more of silicon dioxide, titanium dioxide, aluminum oxide, zirconium oxide, and magnesium oxide.
[0021] Preferably, the initiator is a thermal initiator.
[0022] Preferably, the thermal initiator comprises one or more of a peroxide initiator, an azo initiator, and a redox initiator system.
[0023] Peroxide initiators can be listed as one or more of dibenzoyl peroxide, diisopropylbenzene hydroperoxide, diisopropylbenzene peroxide, tert-butyl hydroperoxide, and di-tert-butyl peroxide. Azo initiators can be listed as azobisisobutyronitrile and azobisisoheptylnitrile. Redox initiator systems are systems composed of oxidants and reductants, oxidants can be listed as persulfates, peroxides, dichromates, etc., and reductants can be listed as sulfites, iron salts, ascorbic acid, etc.
[0024] Preferably, the raw materials also include 1 to 15 parts of other additives. There is no particular limitation on other additives, and any additive that can be used to modify the function of the anisotropic conductive adhesive film can be used, such as colorants, adhesion promoters, antioxidants, defoaming agents, and the like.
[0025] Another object of the present invention is achieved by the following technical solutions:
[0026] A method for preparing a high temperature and high humidity resistant anisotropic conductive adhesive film comprises the following steps:
[0027] The tert-butyl glycidyl carbonate modified polymer, thermoplastic resin, thermosetting resin and solvent are uniformly mixed, and then fillers are added and mixed, and finally conductive particles and initiators are added and stirred to prepare a coating liquid, and the anisotropic conductive adhesive film is obtained after coating and drying.
[0028] Add other additives as needed, and add them together with the filler.
[0029] Preferably, the solvent can be listed as benzene solvents (toluene, benzene, etc.), ketone solvents (methyl ethyl ketone, acetone, etc.), alcohol solvents (ethanol, isopropanol, etc.), ester solvents (ethyl acetate, butyl acetate, etc.), etc.
[0030] Preferably, the mixing temperature of the raw materials is 10-40°C.
[0031] Preferably, the drying temperature is 60 to 90° C., and the drying time is 1 to 10 minutes.
[0032] Compared with the prior art, the present invention has the following beneficial effects:
[0033] 1. The combination of three acrylates with different Tg and special ingredients, namely, hydroxypivalic acid neopentyl glycol monoester, isocyanuric acid diacrylate, and ditrimethylolpropane tetraacrylate, can significantly improve the overall glass transition temperature of ACF by cross-linking reaction and increasing the cross-linking density in the presence of an initiator, thereby improving the thermal stability and moisture resistance of ACF and improving the reliability performance of ACF after bonding.
[0034] 2. The reaction of tert-butyl glycidyl carbonate (E10P) with three different Tg acrylates produces a polymer that gives the ACF film better mechanical properties, especially a significant improvement in elongation. This not only solves the brittleness problem of traditional ACF films due to high Tg, but also ensures the adaptability of the ACF film on complex or irregular surfaces, and maintains good physical and chemical properties even under high temperature conditions.
[0035] 3. E10P has a large number of hydrophobic groups, which can play a protective role in high humidity environments, reduce the penetration of moisture into the ACF film, and avoid performance degradation caused by moisture. This feature ensures the continued reliability and stability of the ACF film in harsh environments.
[0036] 4. The use of E10P reduces the freezing effect of ACF film under high temperature conditions, that is, it prevents the film from becoming too hard or losing its viscosity at high temperatures, thereby maintaining good electrical properties.
[0037] In summary, the present invention greatly improves the thermal stability and moisture resistance of the ACF film through E10P-modified hydroxypivalic acid neopentyl glycol monoester, isocyanuric acid diacrylate, and ditrimethylolpropane tetraacrylate, while improving the mechanical and electrical properties, providing a more reliable and durable signal transmission solution for electronic devices. DETAILED DESCRIPTION
[0038] The technical scheme of the present invention is further described below by specific embodiments. It should be understood that the specific embodiments described herein are only used to help understand the present invention and are not intended to be used for specific limitations of the present invention. Unless otherwise specified, the raw materials used in the embodiments of the present invention are all commonly used raw materials in the art, and the methods used in the embodiments are all conventional methods in the art.
[0039] Conductive particles: nickel-plated polystyrene microspheres, average particle size 5 μm, Zhenjiang Aibang Ni-500;
[0040] Tert-butyl glycidyl carbonate: purchased from Nanjing Dongde Chemical Technology Co., Ltd., CAS No.: 26761-45-5;
[0041] Neopentyl glycol hydroxypivalate: Tg is about 111°C, purchased from Nanjing Oriental Pearl Industry and Trade Co., Ltd.;
[0042] Isocyanuric acid diacrylate: Tg is about 166°C, purchased from Shanghai Guangyi Chemical Co., Ltd.;
[0043] Ditrimethylolpropane tetraacrylate: Tg>250°C, purchased from Shanghai MacLean Biochemical Technology Co., Ltd.
[0044] Example 1
[0045] The raw materials of the anisotropic conductive film of this embodiment are: 10 parts of versatile glycidyl carbonate (E10P) modified polymer, 35 parts of polyethylene, 25 parts of epoxy resin (E54), 5 parts of conductive particles, 13 parts of silicon dioxide, 10 parts of titanium dioxide, and 2 parts of dibenzoyl peroxide.
[0046] The preparation method of the anisotropic conductive adhesive film of this embodiment is as follows:
[0047] E10P modified polymer, polyethylene, epoxy resin and 5 parts of methyl ethyl ketone were mixed uniformly at 25°C, and then silicon dioxide and titanium dioxide were added and mixed. Finally, conductive particles and initiator dibenzoyl peroxide were added and stirred to prepare a coating solution. After coating and drying (70°C, 3min), the anisotropic conductive adhesive film was obtained.
[0048] The preparation method of the tert-butyl glycidyl carbonate modified polymer comprises the following steps:
[0049] 25 parts of tert-butyl carbonate glycidyl ester were added into the reaction kettle. After the temperature was raised to 140°C, a mixture of 8 parts of hydroxypivalic acid neopentyl glycol monoester, 7 parts of isocyanuric acid diacrylate, 12 parts of ditrimethylolpropane tetraacrylate and 0.5 parts of di-tert-butyl peroxide was added dropwise (the dropping speed was 3 ml / min). After the dropping was completed, the temperature was maintained at 140°C for reaction for 1 hour to obtain tert-butyl carbonate glycidyl ester modified polymer.
[0050] Example 2
[0051] The raw materials of the anisotropic conductive film of this embodiment are: 7 parts of versatile glycidyl carbonate (E10P) modified polymer, 38 parts of polyethylene, 23 parts of epoxy resin (E54), 4 parts of conductive particles, 11 parts of titanium dioxide, 10 parts of aluminum oxide, 2 parts of diisopropylbenzene hydroperoxide, and 5 parts of BYK-019.
[0052] The preparation method of the anisotropic conductive adhesive film of this embodiment is as follows:
[0053] E10P modified polymer, polyethylene, epoxy resin and 6 parts of methyl ethyl ketone were mixed evenly at 25°C, then aluminum oxide and titanium dioxide were added and mixed, and finally conductive particles and initiator diisopropylbenzene hydroperoxide were added and stirred to prepare a coating solution. After coating and drying (75°C, 3min), the anisotropic conductive adhesive film was obtained.
[0054] The preparation method of the tert-butyl glycidyl carbonate modified polymer comprises the following steps:
[0055] 28 parts of tert-butyl carbonate glycidyl ester were added into the reaction kettle. After the temperature was raised to 150°C, a mixture of 9 parts of hydroxypivalic acid neopentyl glycol monoester, 8 parts of isocyanuric acid diacrylate, 11 parts of ditrimethylolpropane tetraacrylate and 0.4 parts of di-tert-butyl peroxide was added dropwise (the dropping speed was 2 ml / min). After the addition was completed, the temperature was maintained at 150°C for 2 hours to obtain a tert-butyl carbonate modified polymer.
[0056] Example 3
[0057] The raw materials of the anisotropic conductive film of this embodiment are: 14 parts of versatile glycidyl carbonate (E10P) modified polymer, 32 parts of polyethylene, 28 parts of epoxy resin (E54), 7 parts of conductive particles, 15 parts of titanium dioxide, and 4 parts of dibenzoyl peroxide.
[0058] The preparation method of the anisotropic conductive adhesive film of this embodiment is as follows:
[0059] E10P modified polymer, polyethylene, epoxy resin and 6 parts of methyl ethyl ketone were mixed uniformly at 25°C, titanium dioxide was then added and mixed, and finally conductive particles and initiator dibenzoyl peroxide were added and stirred to prepare a coating solution. After coating and drying (75°C, 5 minutes), the anisotropic conductive adhesive film was obtained.
[0060] The preparation method of the tert-butyl glycidyl carbonate modified polymer comprises the following steps:
[0061] 22 parts of tert-butyl carbonate glycidyl ester were added into the reaction kettle. After the temperature was raised to 155°C, a mixture of 7 parts of hydroxypivalic acid neopentyl glycol monoester, 6 parts of isocyanuric acid diacrylate, 14 parts of ditrimethylolpropane tetraacrylate and 0.6 parts of di-tert-butyl peroxide was added dropwise (the dropping speed was 4 ml / min). After the addition was completed, the temperature was maintained at 155°C for 1.5 hours to obtain a tert-butyl carbonate modified polymer.
[0062] Comparative Example 1
[0063] The difference between Comparative Example 1 and Example 1 is that E10P is not added in the preparation method of the modified polymer. The other steps are the same as those in Example 1. The specific preparation method is as follows:
[0064] The preparation method of the anisotropic conductive adhesive film of Comparative Example 1 is:
[0065] At 25°C, 10 parts of modified polymer, 35 parts of polyethylene, 25 parts of epoxy resin (E54), and 5 parts of methyl ethyl ketone were mixed evenly, and then 13 parts of silicon dioxide and 10 parts of titanium dioxide were added and mixed. Finally, 5 parts of conductive particles and 2 parts of initiator dibenzoyl peroxide were added and stirred to prepare a coating liquid. After coating and drying (70°C, 3 minutes), the anisotropic conductive adhesive film was obtained.
[0066] Wherein, the preparation method of the modified polymer comprises the following steps:
[0067] After the temperature is raised to 140°C, a mixture of 8 parts of hydroxypivalic acid neopentyl glycol monoester, 7 parts of isocyanuric acid diacrylate, 12 parts of ditrimethylolpropane tetraacrylate and 0.5 parts of di-tert-butyl peroxide is added dropwise (the dropping speed is 3 ml / min). After the addition is completed, the temperature is maintained at 140°C for 1 hour to obtain a modified polymer.
[0068] Comparative Example 2
[0069] The difference between Comparative Example 2 and Example 1 is that in the preparation method of the tert-butyl glycidyl carbonate modified polymer, hydroxypivalic acid neopentyl glycol monoester replaces isocyanuric acid diacrylate and ditrimethylolpropane tetraacrylate, and the rest is the same as Example 1. The specific preparation method is as follows:
[0070] The preparation method of the anisotropic conductive adhesive film of Comparative Example 2 is:
[0071] At 25°C, 10 parts of modified polymer, 35 parts of polyethylene, 25 parts of epoxy resin (E54), and 5 parts of methyl ethyl ketone were mixed evenly, and then 13 parts of silicon dioxide and 10 parts of titanium dioxide were added and mixed. Finally, 5 parts of conductive particles and 2 parts of initiator dibenzoyl peroxide were added and stirred to prepare a coating liquid. After coating and drying (70°C, 3 minutes), the anisotropic conductive adhesive film was obtained.
[0072] Wherein, the preparation method of the modified polymer comprises the following steps:
[0073] 25 parts of tert-butyl carbonate were added into the reaction kettle. After the temperature was raised to 140°C, a mixture of 27 parts of hydroxypivalic acid neopentyl glycol monoester and 0.5 parts of di-tert-butyl peroxide was added dropwise (the dropping speed was 3 ml / min). After the dropping was completed, the temperature was maintained at 140°C for 1 hour to obtain a modified polymer.
[0074] Comparative Example 3
[0075] The difference between Comparative Example 3 and Example 1 is that in the preparation method of the tert-butyl glycidyl carbonate modified polymer, isocyanuric acid diacrylate replaces hydroxypivalic acid neopentyl glycol monoester and ditrimethylolpropane tetraacrylate, and the rest is the same as Example 1. The specific preparation method is as follows:
[0076] The preparation method of the anisotropic conductive adhesive film of Comparative Example 3 is:
[0077] At 25°C, 10 parts of modified polymer, 35 parts of polyethylene, 25 parts of epoxy resin (E54), and 5 parts of methyl ethyl ketone were mixed evenly, and then 13 parts of silicon dioxide and 10 parts of titanium dioxide were added and mixed. Finally, 5 parts of conductive particles and 2 parts of initiator dibenzoyl peroxide were added and stirred to prepare a coating liquid. After coating and drying (70°C, 3 minutes), the anisotropic conductive adhesive film was obtained.
[0078] Wherein, the preparation method of the modified polymer comprises the following steps:
[0079] Add 25 parts of tert-butyl carbonate into the reaction kettle, heat it to 140°C, and then add dropwise (dropping speed is 3 ml / min) a mixture of 27 parts of isocyanuric acid diacrylate and 0.5 parts of di-tert-butyl peroxide. After the dropwise addition is completed, keep the temperature at 140°C for 1 hour to obtain a modified polymer.
[0080] Comparative Example 4
[0081] The difference between Comparative Example 4 and Example 1 is that in the preparation method of the tert-butyl glycidyl carbonate modified polymer, ditrimethylolpropane tetraacrylate replaces hydroxypivalic acid neopentyl glycol monoester and isocyanuric acid diacrylate, and the rest is the same as Example 1. The specific preparation method is as follows:
[0082] The preparation method of the anisotropic conductive adhesive film of Comparative Example 4 is as follows:
[0083] At 25°C, 10 parts of modified polymer, 35 parts of polyethylene, 25 parts of epoxy resin (E54), and 5 parts of methyl ethyl ketone are evenly mixed, and then 13 parts of silicon dioxide and 10 parts of titanium dioxide are added and mixed. Finally, 5 parts of conductive particles and 2 parts of initiator dibenzoyl peroxide are added and stirred to prepare a coating liquid. After coating and drying (70°C, 3min), the anisotropic conductive adhesive film is obtained.
[0084] Wherein, the preparation method of the modified polymer comprises the following steps:
[0085] 25 parts of tert-butyl carbonate were added into the reaction kettle. After the temperature was raised to 140°C, a mixture of 27 parts of ditrimethylolpropane tetraacrylate and 0.5 parts of di-tert-butyl peroxide was added dropwise (the dropping speed was 3 ml / min). After the dropping was completed, the temperature was maintained at 140°C for 1 hour to obtain a modified polymer.
[0086] Comparative Example 5
[0087] The difference between Comparative Example 5 and Example 1 is that the tert-butyl glycidyl carbonate in Comparative Example 5 is reacted with ditrimethylolpropane tetraacrylate and hydroxypivalic acid neopentyl glycol monoester, and the rest is the same as Example 1. The specific preparation method is as follows:
[0088] The preparation method of the anisotropic conductive adhesive film of Comparative Example 5 is as follows:
[0089] At 25°C, 10 parts of modified polymer, 35 parts of polyethylene, 25 parts of epoxy resin (E54), and 5 parts of methyl ethyl ketone were mixed evenly, and then 13 parts of silicon dioxide and 10 parts of titanium dioxide were added and mixed. Finally, 5 parts of conductive particles and 2 parts of initiator dibenzoyl peroxide were added and stirred to prepare a coating liquid. After coating and drying (70°C, 3 minutes), the anisotropic conductive adhesive film was obtained.
[0090] Wherein, the preparation method of the modified polymer comprises the following steps:
[0091] 25 parts of tert-butyl carbonate were added into the reaction kettle. After the temperature was raised to 140°C, a mixture of 8 parts of hydroxypivalic acid neopentyl glycol monoester, 19 parts of ditrimethylolpropane tetraacrylate and 0.5 parts of di-tert-butyl peroxide was added dropwise (the dropping speed was 3 ml / min). After the dropping was completed, the temperature was maintained at 140°C for 1 hour to obtain a modified polymer.
[0092] Comparative Example 6
[0093] The difference between Comparative Example 6 and Example 1 is that no di-tert-butyl peroxide is added in Comparative Example 6, and the specific preparation method is as follows:
[0094] The preparation method of the anisotropic conductive adhesive film of Comparative Example 6 is:
[0095] 10 parts of polymer, 35 parts of polyethylene, 25 parts of epoxy resin (E54), and 5 parts of methyl ethyl ketone were mixed evenly at 25°C, and then 13 parts of silicon dioxide and 10 parts of titanium dioxide were added and mixed. Finally, 5 parts of conductive particles and 2 parts of initiator dibenzoyl peroxide were added and stirred to prepare a coating liquid. After coating and drying (70°C, 3min), the anisotropic conductive adhesive film was obtained.
[0096] The preparation method of the polymer comprises the following steps:
[0097] 25 parts of tert-butyl glycidyl carbonate were added into the reaction kettle. After the temperature was raised to 140°C, a mixture of 8 parts of hydroxypivalic acid neopentyl glycol monoester, 7 parts of isocyanuric acid diacrylate and 12 parts of ditrimethylolpropane tetraacrylate was added dropwise (the dropping speed was 3 ml / min). After the dropping was completed, the temperature was maintained at 140°C for 1 hour to obtain a polymer.
[0098] The elongation test was performed on the anisotropic conductive adhesive films of Examples 1-3 and Comparative Examples 1-6: After removing the substrate from the anisotropic conductive adhesive film, the film was cut into a conductive adhesive layer of 10 cm*1 cm (length*width), and then one end was fixed and a 15N pulling force was applied to the other end to test its length change. The elongation test results are shown in Table 1.
[0099] The anisotropic conductive adhesive films of Examples 1-3 and Comparative Examples 1-6 were cured using a Bonder device under the conditions of 170°C, 4MPa, and 5s. After bonding, a peel strength tester was used to measure the bonding force (gf / cm) at a peeling angle of 90° and a peeling speed of 50mm / min. A pre-designed electrode with detectable on-resistance was selected on the FPC, and an on-resistance test was performed using a resistance meter. After bonding, the electrodes were aged for 500 hours at 85°C and 85% humidity, and then the on-resistance and bonding force after bonding were measured. The test results are shown in Table 1.
[0100] Table 1 Test results of anisotropic conductive adhesive films of Examples 1-3 and Comparative Examples 1-6
[0101]
[0102] *The higher the bubble score, the fewer bubbles there are and the smaller the bubble volume;
[0103] The ACF prepared in Examples 1-3 has excellent comprehensive properties: high conductivity and bonding strength, resistance to high temperature and humidity, and good mechanical properties, with high elongation. The high elongation enables the ACF to adapt to uneven or slightly undulating surfaces, ensuring reliable electrical connections even under non-ideal conditions.
[0104] Comparison of Example 1 and Comparative Example 1 shows that when the polymer obtained by polymerization without the addition of E10P is mixed with other raw materials, the conductivity, bonding strength, and high temperature and humidity resistance of the prepared ACF are slightly reduced, but the elongation is greatly reduced. This shows that the polymerization product of E10P with hydroxypivalic acid neopentyl glycol monoester, isocyanuric acid diacrylate, and ditrimethylolpropane tetraacrylate can greatly improve the mechanical properties of ACF and effectively solve the problem of low brittleness and difficulty in application of ACF.
[0105] Comparison of Example 1 and Comparative Examples 2-5 shows that when a single acrylate or a product of two acrylates polymerized with E10P is used as a raw material in ACF, the ACF cannot achieve excellent comprehensive performance. Although E10P is added for modification, the final polymer has limited improvement in elongation, and the elongation of Comparative Examples 2-5 is still significantly lower than that of Example 1.
[0106] Comparative Example 6 lacks di-tert-butyl peroxide, which is equivalent to physically mixing the four ingredients E10P, hydroxypivalic acid neopentyl glycol monoester, isocyanuric acid diacrylate and ditrimethylolpropane tetraacrylate. The physical mixture is applied to ACF, and the performance of ACF is significantly lower than that of Example 1.
[0107] The various aspects, embodiments, and features of the present invention should be considered to be illustrative in all aspects and not limiting of the present invention, the scope of which is defined solely by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.
[0108] In the preparation method of the present invention, the order of each step is not limited to the order listed. For those skilled in the art, without creative work, the order of each step is also within the protection scope of the present invention. In addition, two or more steps or actions can be performed simultaneously.
[0109] Finally, it should be noted that the specific embodiments described herein are merely examples of the present invention, and are not intended to limit the implementation methods of the present invention. A person skilled in the art of the present invention may make various modifications or supplements to the specific embodiments described, or replace them in a similar manner. It is not necessary and impossible to provide all examples of all implementation methods here. However, these obvious changes or modifications derived from the essential spirit of the present invention still fall within the scope of protection of the present invention, and interpreting them as any additional limitation is contrary to the spirit of the present invention.
Claims
1. A high temperature and high humidity resistant anisotropic conductive adhesive film, characterized in that: The raw materials include, by weight, 5 to 15 parts of tert-butyl glycidyl carbonate modified polymer, 30 to 40 parts of thermoplastic resin, 20 to 30 parts of thermosetting resin, 1 to 7 parts of conductive particles, 8 to 30 parts of fillers, and 1 to 5 parts of initiators.
2. The anisotropic conductive adhesive film according to claim 1, characterized in that: The raw materials of the tert-butyl glycidyl carbonate modified polymer include: 20-30 parts of tert-butyl glycidyl carbonate, 6.3-9.5 parts of hydroxypivalic acid neopentyl glycol monoester, 5-10 parts of isocyanuric acid diacrylate, 9.7-14.6 parts of ditrimethylolpropane tetraacrylate, and 0.1-1 part of peroxide initiator.
3. The anisotropic conductive adhesive film according to claim 2, characterized in that: The preparation method of the tertiary carbonic acid glycidyl ester modified polymer comprises the following steps: Tert-butyl glycidyl carbonate is added into a reaction kettle, and after heating, a mixture of hydroxypivalic acid neopentyl glycol monoester, isocyanuric acid diacrylate, ditrimethylolpropane tetraacrylate and peroxide initiator is added dropwise. After the addition is completed, the temperature is maintained for reaction to obtain a tert-butyl glycidyl carbonate modified polymer.
4. The anisotropic conductive adhesive film according to claim 3, characterized in that: The dropping speed is 1-10 ml / min.
5. The anisotropic conductive adhesive film according to claim 3, characterized in that: Maintain the reaction at 120-160°C for 0.5-3h.
6. The anisotropic conductive adhesive film according to claim 1, characterized in that: The thermoplastic resin includes one or more of polyethylene, polypropylene, ethylene propylene copolymer, polyvinyl chloride, polystyrene, polycarbonate, polyamide, polymethyl methacrylate; The thermosetting resin includes one or more of epoxy resin, phenolic resin, polyurethane acrylate, epoxy acrylate resin, amine-modified bismaleimide resin, and unsaturated polyamide resin.
7. The anisotropic conductive adhesive film according to claim 1, characterized in that: The conductive particles are core-shell structured composites with a polymer as the core and a metal layer as the shell; The particle size of the conductive particles is 0.5 to 20 μm.
8. The anisotropic conductive adhesive film according to claim 1, characterized in that: The filler is one or more of silicon dioxide, titanium dioxide, aluminum oxide, zirconium oxide and magnesium oxide.
9. The method for preparing a high temperature and high humidity resistant anisotropic conductive adhesive film according to claim 1, characterized in that: The following steps are involved: The tert-butyl glycidyl carbonate modified polymer, thermoplastic resin, thermosetting resin and solvent are uniformly mixed, and then fillers are added and mixed, and finally conductive particles and initiators are added and stirred to prepare a coating liquid, and the anisotropic conductive adhesive film is obtained after coating and drying.
10. The preparation method according to claim 9, characterized in that: The mixing temperature of the raw materials is 10-40°C; the drying temperature is 60-90°C, and the drying time is 1-10 minutes.