Computer heat dissipation device and computer

Abstract

The present invention provides a computer heat dissipation device and a computer, which relates to the field of computer heat dissipation technology, and includes a wind source, a heat dissipation assembly and a cleaning assembly. The heat dissipation assembly includes a contact body and a plurality of heat dissipation fins, and the plurality of heat dissipation fins are evenly spaced along the circumference of the contact body and the heat dissipation fins extend radially along the contact body. The cleaning assembly includes a first driving member, a first mounting plate, a second driving member, a second mounting plate, a dust sweeping rod, a mounting ring and a plurality of cleaning sheets, the first driving member is mounted on the wind source, the first driving member is connected to the first mounting plate, the second driving member is mounted on the first mounting plate, the second driving member is connected to the second mounting plate, the dust sweeping rod is connected to the second mounting plate, the mounting ring is connected to the first mounting plate, and a plurality of cleaning sheets are arranged in the mounting ring, and the plurality of cleaning sheets are respectively used to contact a plurality of heat dissipation fins. The computer heat dissipation device of the present invention can not only quickly and conveniently perform dust cleaning operations, but also has high dust cleaning efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of computer heat dissipation, and in particular to a computer heat dissipation device and a computer. Background Art

[0002] At present, in the related technology, a large number of electronic components are used in computers, and these electronic components will generate a large amount of heat during operation. For this heat, the heat is generally conducted through the contact between the heat sink and the surface of the heat generating part, and then the heat is transferred to the outside of the computer through various means. For example, for the electronic components set in the computer, heat dissipation is generally achieved by using a cooling fan and a heat sink. Specifically, the heat sink is attached to the heat generating area of ​​the electronic component, and then the heat sink is blown by the cooling fan to carry the heat out of the computer with the help of air.

[0003] However, due to the narrow space inside the computer, floc-like dust often adheres to the surface of the heat sink, and the attached floc-like dust will aggravate the accumulation of ordinary dust. After the computer has been used for a long time, a large amount of dust will accumulate on the heat sink. The accumulated dust will affect the contact between the heat sink and the air, and reduce the heat dissipation efficiency of the heat sink.

[0004] This will lead to the following problem: To ensure the heat dissipation effect, it is often necessary to clean the dust on the heat sink, but due to the narrow space inside the computer, it is likely to involve the disassembly of components, and then manual cleaning after the components are disassembled. This is not only time-consuming and labor-intensive, and the cleaning efficiency is low, but it may also cause damage or destruction to related components. Summary of the invention

[0005] In order to solve the technical problems in the related art, the present invention provides a computer heat dissipation device and a computer. With the computer heat dissipation device of the present invention, when the heat sink needs to be cleaned, there is no need to disassemble the parts and manually clean the heat sink, which can not only quickly and conveniently clean the heat sink, but also has high cleaning efficiency.

[0006] In order to achieve the above object, the technical solution adopted by the present invention includes:

[0007] According to a first aspect of the present invention, there is provided a computer heat dissipation device for dissipating heat from electronic components inside a computer, comprising:

[0008] Wind source parts,

[0009] A heat dissipation component is arranged below the wind source component, the heat dissipation component comprises a contact body and a plurality of heat dissipation fins arranged outside the contact body, the plurality of heat dissipation fins are arranged evenly spaced along the circumference of the contact body, and each of the heat dissipation fins extends along the radial direction of the contact body;

[0010] A cleaning assembly is arranged between the wind source component and the heat dissipation component, the cleaning assembly comprises a first driving component, a first mounting plate, a second driving component, a second mounting plate, a dust sweeping rod, a mounting ring and a plurality of cleaning sheets, the first driving component is installed on a side of the wind source component close to the heat dissipation component, the output end of the first driving component is connected to the first mounting plate, so as to drive the first mounting plate to approach or move away from the heat dissipation component, the second driving component is installed on a side of the first mounting plate away from the first driving component, the output end of the second driving component is connected to the second mounting plate, so as to drive the second mounting plate to rotate, the second mounting plate is arranged coaxially with the contact body, and in the direction from the second mounting plate to the contact body, the projection of the second mounting plate falls within the projection of the contact body, the dust sweeping rod is arranged along the radial direction of the contact body and connected to the second mounting plate, the mounting ring is sleeved outside the heat dissipation component and connected to the first mounting plate, a plurality of the cleaning sheets are arranged in the mounting ring at even intervals along the circumference of the mounting ring, and the plurality of the cleaning sheets are respectively used to contact a plurality of the heat dissipation fins;

[0011] The computer cooling device includes a standby state and a cleaning state. In the standby state, the mounting ring is sleeved on the outer side of the bottom of the cooling component. In the cleaning state, the first driving member first drives the first mounting plate to move away from the cooling component, thereby driving a plurality of the cleaning sheets to contact the surfaces of a plurality of the cooling fins respectively to remove dust attached to the cooling fins. Subsequently, the first driving member drives the first mounting plate to move toward the cooling component, thereby driving the mounting ring to return to its original position. At the same time, the second driving member drives the dust sweeping rod to rotate against the top of the cooling fin.

[0012] Optionally, the dust-sweeping rod is provided in plurality, the plurality of dust-sweeping rods are evenly spaced along the circumference of the second mounting plate and each of the dust-sweeping rods extends along the radial direction of the second mounting plate.

[0013] Optionally, one end of the dust sweeping rod away from the second mounting plate is flush with one end of the heat dissipating fin away from the contact body.

[0014] Optionally, a cleaning sheet is arranged between each two adjacent heat dissipation fins, and the cleaning sheet is formed into a V-shaped structure. The cleaning sheet includes a first sheet body and a second sheet body connected to each other at an angle, and the first sheet body and the second sheet body are respectively used to contact the mutually close sides of each two adjacent heat dissipation fins, and the end of the cleaning sheet away from the contact body is connected to the inner wall of the mounting ring.

[0015] Optionally, an angle β between the first sheet and the second sheet satisfies: 3°≤β≤10°.

[0016] Optionally, the contact body includes a first part and a second part that are coaxially connected; the first part is close to the wind source component, and the end face of the first part away from the second part is flush with the top surface of the heat sink fin, and the end face of the first part close to the second part is flush with the ground of the heat sink fin, and in the standby state, the second mounting plate abuts against the first part; the second part is used for thermal contact with electronic components inside the computer.

[0017] Optionally, the computer cooling device also includes a connecting assembly, which includes a connecting ring, a plurality of first connecting rods, and a plurality of second connecting rods. The middle portion of the outer wall of the second portion is recessed inward to form an annular connecting groove, and the connecting ring is installed in the annular connecting groove. The plurality of first connecting rods are evenly spaced along the circumference of the connecting ring and each of the first connecting rods extends radially along the connecting ring. In addition, one end of the plurality of first connecting rods is connected to the outer wall of the connecting ring, and the other ends of the plurality of first connecting rods are respectively connected to the plurality of second connecting rods, and one end of the second connecting rod away from the first connecting rod is connected to the wind source component.

[0018] Optionally, an installation through hole is formed at one end of the first connecting rod away from the connecting ring for installation inside a computer.

[0019] Optionally, the first connecting rod is detachably connected to the second connecting rod, and the second connecting rod is detachably connected to the wind source component.

[0020] According to the second aspect of the present application, a computer is also provided, comprising the computer heat dissipation device described in any technical solution of the first aspect of the present application.

[0021] Beneficial effects:

[0022] 1. Through the above technical solution, when it is necessary to clean the heat sink fins, it can be done directly through the computer heat sink device provided by the present application, without the need to disassemble the parts, which can effectively reduce the difficulty and time of cleaning, and effectively avoid the possibility of damage or destruction of related parts. At the same time, when cleaning is required, the computer heat sink device of the present application can quickly and effectively realize the cleaning operation of the heat sink fins. Compared with the technical solution of manual cleaning after disassembling the parts in the existing related technology, it can effectively improve the cleaning efficiency and reduce the difficulty of cleaning.

[0023] 2. Other beneficial effects or advantages of the present invention will be described in detail in conjunction with the specific structure in the specific implementation manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative labor. In addition, it should be understood that the proportional relationship of the various components in the drawings of this specification does not represent the proportional relationship in the actual material selection and design, which is only a schematic diagram of the structure or position, where:

[0025] Figure 1 is a three-dimensional structural schematic diagram of a computer heat dissipation device provided by an exemplary embodiment of the present invention from one viewing angle;

[0026] Figure 2 is a schematic diagram of a three-dimensional structure of a computer heat dissipation device provided by an exemplary embodiment of the present invention from another perspective;

[0027] Figure 3 is a schematic diagram of a three-dimensional structure of a heat dissipation assembly provided by an exemplary embodiment of the present invention from one perspective;

[0028] Figure 4 is a schematic diagram of a three-dimensional structure of a heat dissipation assembly provided by an exemplary embodiment of the present invention from another perspective;

[0029] Figure 5 is a schematic diagram of a three-dimensional structure of a cleaning component provided by an exemplary embodiment of the present invention;

[0030] Figure 6 is a schematic diagram of a connection structure between a mounting ring and a cleaning sheet provided by an exemplary embodiment of the present invention;

[0031] Figure 7 It is a three-dimensional structural schematic diagram of a connecting assembly according to an exemplary embodiment of the present invention, wherein a contact body, a wind source component and a part of a cleaning assembly are also shown.

[0032] Description of the reference numerals in the accompanying drawings:

[0033] 100-computer cooling device; 1-wind source; 2-heat dissipation assembly; 21-contact body; 211-first part; 212-second part; 2121-annular connecting groove; 22-heat dissipation fins; 3-cleaning assembly; 31-first driving member; 32-first mounting plate; 33-second driving member; 34-second mounting plate; 35-dust sweeping rod; 36-mounting ring; 37-cleaning sheet; 371-first sheet body; 372-second sheet body; 4-connecting assembly; 41-connecting ring; 42-first connecting rod; 421-mounting through hole; 43-second connecting rod. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be noted that the terms used, such as "top surface" and "bottom surface", refer to the side of the computer heat dissipation device of the present invention close to the electronic components when in use, and the side away from the electronic components is the top surface; the terms used, such as "first" and "second", are only used to distinguish the expressions, and do not indicate or imply that they have a difference in importance or order; the terms used, such as "inside" and "outside", refer to the inside and outside of a specific contour. The use of the above terms is only to facilitate a clear and simple description of the technical solution of the present invention, and cannot be understood as a limitation of the present invention.

[0037] The technical solution of the present invention is described in detail below with reference to the accompanying drawings.

[0038] Example 1

[0039] like Figures 1 to 7 As shown, according to the first aspect of the present invention, this embodiment provides a computer heat dissipation device 100, which is used for dissipating heat from electronic components inside a computer, and includes a wind source 1, a heat dissipation assembly 2, and a cleaning assembly 3. The heat dissipation assembly 2 is arranged below the wind source 1, and the heat dissipation assembly 2 includes a contact body 21 and a plurality of heat dissipation fins 22 arranged outside the contact body 21, and the plurality of heat dissipation fins 22 are evenly spaced along the circumference of the contact body 21, and each heat dissipation fin 22 extends along the radial direction of the contact body 21.

[0040] The cleaning component 3 is arranged between the wind source component 1 and the heat dissipation component 2, and the cleaning component 3 includes a first driving component 31, a first mounting plate 32, a second driving component 33, a second mounting plate 34, a dust sweeping rod 35, a mounting ring 36 and a plurality of cleaning sheets 37. The first driving component 31 is installed on the side of the wind source component 1 close to the heat dissipation component 2, and the output end of the first driving component 31 is connected to the first mounting plate 32 to drive the first mounting plate 32 to approach or move away from the heat dissipation component 2. The second driving component 33 is installed on the side of the first mounting plate 32 away from the first driving component 31, and the output end of the second driving component 33 is connected to the second mounting plate 34 is connected to drive the second mounting plate 34 to rotate, the second mounting plate 34 is coaxially arranged with the contact body 21, and in the direction from the second mounting plate 34 to the contact body 21, the projection of the second mounting plate 34 falls within the projection of the contact body 21, the dust sweeping rod 35 is arranged along the radial direction of the contact body 21 and connected to the second mounting plate 34, the mounting ring 36 is sleeved outside the heat dissipation component 2 and connected to the first mounting plate 32, a plurality of cleaning sheets 37 are evenly spaced and arranged in the mounting ring 36 along the circumference of the mounting ring 36, and the plurality of cleaning sheets 37 are respectively used to contact a plurality of heat dissipation fins 22;

[0041] The computer cooling device 100 includes a standby state and a cleaning state. In the standby state, the mounting ring 36 is sleeved on the bottom outer side of the heat dissipation component 2; in the cleaning state, the first driving member 31 first drives the first mounting plate 32 to move away from the heat dissipation component 2, thereby driving a plurality of cleaning sheets 37 to contact the surfaces of a plurality of heat dissipation fins 22 respectively to remove dust attached to the heat dissipation fins 22, and then the first driving member 31 drives the first mounting plate 32 to move toward the heat dissipation component 2, thereby driving the mounting ring 36 to return to its original position, and at the same time, the second driving member 33 drives the dust sweeping rod 35 to press against the top of the heat dissipation fin 22 and rotate.

[0042] To facilitate understanding by relevant technical personnel, the dust cleaning process of the above implementation mode is first described below.

[0043] Before cleaning, the computer cooling device 100 is in a standby state (eg Figure 1 As shown), at this time, the air blown by the wind source element 1 to the heat dissipation fins 22 directly contacts the heat dissipation fins 22, and then passes through the gaps between the heat dissipation fins 22 to take away the heat on the heat dissipation fins 22.

[0044] When dust cleaning is required, the first driving member 31 can be started. The first driving member 31 first drives the first mounting plate 32 to move in a direction away from the heat dissipation component 2, and the mounting ring 36 connected to the first mounting plate 32 will move accordingly. Since the cleaning sheet 37 arranged in the mounting ring 36 is in contact with the surface of the heat dissipation fin 22, most of the flocculent dust attached to the heat dissipation fin 22 can be pushed to the top of the heat dissipation fin 22 (a small part of the flocculent dust will fall off directly under the action of the flowing air, and ordinary dust will generally fall off directly). Subsequently, the first driving member 31 is reversed to drive the first mounting plate 32 to move in the direction of the heat dissipation component 2 until it returns to its original position. At this time, the second driving member 33 is started. The second driving member 33 drives the second mounting plate 34 to rotate, and the dust sweeping rod 35 connected to the second mounting plate 34 rotates accordingly to disturb the flocculent dust pushed to the top of the heat dissipation fin 22. In addition, the flowing air applied by the wind source member 1 will cause the flocculent dust located at the top of the heat dissipation fin 22 to become unstable and be carried by the air, thereby realizing the dust cleaning operation of the heat dissipation fin 22.

[0045] Through the above technical solution, when the heat sink fins 22 need to be cleaned, it can be directly performed through the computer heat sink 100 provided by the present application, without the need to disassemble the parts, which can effectively reduce the difficulty and time of cleaning, and effectively avoid the possibility of damage or destruction of related parts. At the same time, when cleaning is required, the computer heat sink 100 of the present application can quickly and effectively realize the cleaning operation of the heat sink fins 22, which can effectively improve the cleaning efficiency and reduce the difficulty of cleaning compared to the technical solution of manually cleaning after disassembling the parts in the existing related technology.

[0046] The contact body 21 is used to contact the heat generating parts of the electronic components inside the computer so as to conduct the heat generated by the components to the plurality of heat dissipation fins 22 , and then the heat is carried out of the computer through the flowing air generated by the air source 1 .

[0047] In addition, in the direction from the second mounting plate 34 to the contact body 21, the projection of the second mounting plate 34 falls within the projection of the contact body 21, that is, the radial dimension of the second mounting plate 34 is smaller than the radial dimension of the contact body 21, and the second mounting plate 34 is coaxially arranged or approximately coaxially arranged with the contact body 21. In this way, the blocking effect of the second mounting plate 34 on the air flow can be effectively reduced, ensuring that the air fluid can directly act on the heat dissipation fins 22, and the heat dissipation effect can be effectively ensured.

[0048] It can be understood that, first, the thickness of the cleaning sheet 37 of the present application can be selected according to the manufacturing difficulty, manufacturing cost, ventilation effect requirements and the spacing between the heat dissipation fins 22. For example, the thickness of the cleaning sheet 37 can be set to one-fourth to one-tenth of the spacing between the heat dissipation fins 22. In this way, it can not only effectively ensure the cleaning effect of the dust accumulated on the heat dissipation fins 22, but also help to ensure the effect of air passing through the heat dissipation fins 22 during the cleaning process.

[0049] Second, to ensure the cleaning effect, the computer cooling device 100 of the present application can be used to perform cleaning operations repeatedly, that is, repeatedly switch between the standby state and the cleaning state to improve the cleaning effect.

[0050] Third, the first driving member 31 of the present application can be directly installed on the wind source member 1. For example, when there is a motor in the middle of the wind source member 1 and there is no structural obstruction, the first driving member 31 can be directly installed on the motor housing of the wind source member 1. The first driving member 31 of the present application can also be indirectly installed on the wind source member 1, for example, indirectly installed on the housing, motor or related structure of the wind source member 1 through a mounting structure (for example, adding a mounting rod). In addition, the first driving member 31 of the present application can also be independent of the wind source member 1, that is, directly or indirectly installed inside the computer. The present application does not specifically limit the installation method of the first driving member 31.

[0051] Fourthly, the radial dimension of the first mounting plate 32 of the present application should be smaller than or equal to the radial dimension of the contact body 21 to reduce the obstruction to the air fluid and ensure that the air fluid can directly act on the heat dissipation fins 22 to ensure the heat dissipation effect.

[0052] In one embodiment of the present invention, Figure 1 , Figure 5 and Figure 7 As shown, the dust sweeping rod 35 of the present invention can be provided in plurality, and the plurality of dust sweeping rods 35 are evenly spaced along the circumference of the second mounting plate 34 and each dust sweeping rod 35 extends along the radial direction of the second mounting plate 34. The dust sweeping rod 35 provided in this way can effectively increase the sweeping frequency and instability possibility of the flocculent dust pushed to the top of the heat dissipation fin 22, thereby further increasing the possibility that the flocculent dust is blown away from the heat dissipation fin 22 by the flowing air, and further improving the cleaning efficiency and cleaning effect.

[0053] In one embodiment of the present invention, Figure 1 As shown, the end of the dust sweeping rod 35 of the present invention away from the second mounting plate 34 can be flush with the end of the heat sink fin 22 away from the contact body 21. In this way, it can effectively ensure that the dust sweeping rod 35 completely and thoroughly cleans all the flocculent dust on the top of the heat sink fin 22, ensuring the cleaning efficiency and cleaning effect.

[0054] In one embodiment of the present invention, Figure 1 , Figure 5 and Figure 6 As shown, a cleaning sheet 37 is provided between each two adjacent heat dissipation fins 22 of the present invention. The cleaning sheet 37 is formed into a V-shaped structure. The cleaning sheet 37 includes a first sheet body 371 and a second sheet body 372 which are connected to each other at an angle. The first sheet body 371 and the second sheet body 372 are respectively used to contact the side surfaces of each two adjacent heat dissipation fins 22 that are close to each other. The end of the cleaning sheet 37 away from the contact body 21 is connected to the inner wall of the mounting ring 36.

[0055] In this way, a V-shaped cleaning sheet 37 is arranged between each two adjacent heat dissipation fins 22. In this way, the first sheet 371 and the second sheet 372 can ensure the contact with the sides of the two adjacent heat dissipation fins 22 that are close to each other, and can also facilitate the passage of air from the gap between the first sheet 371 and the second sheet 372, so as to avoid the path of air passing through the heat dissipation fins 22 being blocked during the cleaning process, thereby facilitating the maintenance of the normal heat dissipation process of the heat dissipation fins 22.

[0056] In one embodiment of the present invention, the angle β between the first sheet 371 and the second sheet 372 of the present invention satisfies: 3°≤β≤10°. It is understandable that if the angle β is set too large, it means that the greater the arrangement density or arrangement gap of the heat dissipation fins 22, the poorer the heat dissipation effect. If the angle β is set too small, it will hinder the path of air passing through the heat dissipation fins 22. Based on this, the present application limits the setting range of the angle β to 3° to 10°. When β is set to 3°, it can effectively ensure the heat dissipation effect on the basis of ensuring the air passing capacity. When β is set to 10°, it can effectively improve the air passing capacity on the basis of having a certain heat dissipation effect.

[0057] In one embodiment of the present invention, Figures 2 to 4 ,as well as Figure 7 As shown, the contact body 21 of the present invention may include a first part 211 and a second part 212 that are coaxially connected; the first part 211 is close to the wind source part 1, and the end face of the first part 211 away from the second part 212 is flush with the top surface of the heat dissipation fin 22, and the end face of the first part 211 close to the second part 212 is flush with the ground of the heat dissipation fin 22. In the standby state, the second mounting plate 34 abuts against the first part 211; the second part 212 is used for thermal contact with the electronic components inside the computer.

[0058] In this way, the second part 212, as a component in direct contact with the electronic components, is used to transfer heat to the first part 211, and the first part 211 transfers the heat to the plurality of heat dissipation fins 22 evenly and quickly, which can effectively ensure the heat transfer path. At the same time, the second part 212 is arranged relative to the protruding heat dissipation fins 22, so that there is enough space between the movement space of the cleaning component 3 and the electronic components, which can effectively avoid spatial interference between the cleaning component 3 and the electronic components during the cleaning process, which can not only effectively ensure the smooth progress of the cleaning process, but also effectively ensure the normal operation of the electronic components.

[0059] In one embodiment of the present invention, Figure 1 , Figure 2 and Figure 7 As shown, the computer cooling device 100 of the present invention may also include a connecting component 4, which includes a connecting ring 41, a plurality of first connecting rods 42, and a plurality of second connecting rods 43. The middle portion of the outer wall of the second portion 212 is recessed inward to form an annular connecting groove 2121, and the connecting ring 41 is installed in the annular connecting groove 2121. The plurality of first connecting rods 42 are evenly spaced along the circumference of the connecting ring 41 and each first connecting rod 42 extends radially along the connecting ring 41. In addition, one end of the plurality of first connecting rods 42 is connected to the outer wall of the connecting ring 41, and the other ends of the plurality of first connecting rods 42 are respectively connected to the plurality of second connecting rods 43, and the end of the second connecting rod 43 away from the first connecting rod 42 is connected to the wind source member 1.

[0060] In this way, through the above technical solution, first, the second part 212 provided in the present application not only serves as a component for conducting heat, but also serves as an installation structure of the heat dissipation component 2, which can not only realize the reliable installation of the heat dissipation component 2, but also can effectively simplify the structure of the computer heat dissipation device 100 of the present application. In addition, it is also beneficial to reduce the occupied space of the computer heat dissipation device 100 of the present application, so as to facilitate adaptation to the narrow internal space of the computer.

[0061] Second, the present application forms a connection relationship between the heat dissipation component 2 and the wind source component 1 through the connection component 4 configured in this way, which can effectively improve the structural integrity and operating stability of the computer heat dissipation device 100 of the present application.

[0062] In one embodiment of the present invention, Figure 1 , Figure 2 and Figure 7 As shown, the first connecting rod 42 of the present invention is provided with a mounting through hole 421 at one end away from the connecting ring 41 for being installed inside a computer.

[0063] In this way, by using the connection assembly 4 arranged in this way, the entire computer cooling device 100 can be reliably and stably installed in a relatively narrow internal space of the computer at one time.

[0064] In one embodiment of the present invention, the first connecting rod 42 and the second connecting rod 43 of the present invention are detachably connected, and the second connecting rod 43 and the wind source element 1 are detachably connected.

[0065] In this way, through the above technical solution, firstly, the first connecting rod 42 and the second connecting rod 43 thus arranged can very conveniently realize the mutual disassembly and assembly of the wind source component 1 and the heat dissipation component 2 of the present application, and can be easily repaired and replaced.

[0066] Second, the first connecting rod 42 set in this way can be completely separated from the wind source component 1 and the heat dissipation component 2, and the relevant technicians can adjust the length of the first connecting rod 42 to adapt to the internal installation space requirements of different computers. For example, if the internal heat dissipation installation space of a certain type of computer is small, while the internal heat dissipation installation space of another type of computer is large, the applicability of the internal heat dissipation installation space of these two types of computers can be achieved by adjusting the length of the first connecting rod 42 (which may also involve adjusting the length of the connecting rod body between the first driving member 31 and the first mounting plate 32). In other words, the first connecting rod 42 set in this way can effectively improve the versatility of the computer heat dissipation device 100 of the present application.

[0067] According to the second aspect of the present application, a computer (not shown) is also provided, comprising the computer heat dissipation device 100 in any technical solution of the first aspect of the present application.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A computer cooling device, characterized in that: Used for heat dissipation of electronic components inside computers, including: Wind source (1), A heat dissipation component (2) is arranged below the wind source component (1), the heat dissipation component (2) comprising a contact body (21) and a plurality of heat dissipation fins (22) arranged outside the contact body (21), the plurality of heat dissipation fins (22) being arranged at even intervals along the circumference of the contact body (21), and each of the heat dissipation fins (22) extending along the radial direction of the contact body (21); A cleaning component (3) is arranged between the wind source component (1) and the heat dissipation component (2), the cleaning component (3) comprising a first driving component (31), a first mounting plate (32), a second driving component (33), a second mounting plate (34), a dust sweeping rod (35), a mounting ring (36) and a plurality of cleaning sheets (37), the first driving component (31) being mounted on a side of the wind source component (1) close to the heat dissipation component (2), the output end of the first driving component (31) being connected to the first mounting plate (32) so as to drive the first mounting plate (32) to move closer to or away from the heat dissipation component (2), the second driving component (33) being mounted on a side of the first mounting plate (32) far from the first driving component (31), the output end of the second driving component (33) being connected to the second mounting plate (34) The contact body (21) is connected to the second mounting plate (34) to drive the second mounting plate (34) to rotate, the second mounting plate (34) is coaxially arranged with the contact body (21), and in the direction from the second mounting plate (34) to the contact body (21), the projection of the second mounting plate (34) falls within the projection of the contact body (21), the dust sweeping rod (35) is arranged along the radial direction of the contact body (21) and connected to the second mounting plate (34), the mounting ring (36) is sleeved outside the heat dissipation component (2) and connected to the first mounting plate (32), a plurality of cleaning sheets (37) are evenly spaced and arranged in the mounting ring (36) along the circumference of the mounting ring (36), and the plurality of cleaning sheets (37) are respectively used to contact a plurality of the heat dissipation fins (22); The computer cooling device comprises a standby state and a cleaning state. In the standby state, the mounting ring (36) is sleeved on the outer side of the bottom of the cooling component (2); in the cleaning state, the first driving member (31) first drives the first mounting plate (32) to move away from the cooling component (2), thereby driving a plurality of the cleaning plates (37) to contact the surfaces of a plurality of the cooling fins (22) respectively to remove dust attached to the cooling fins (22); then, the first driving member (31) drives the first mounting plate (32) to move toward the cooling component (2), thereby driving the mounting ring (36) to return to its original position; at the same time, the second driving member (33) drives the dust sweeping rod (35) to rotate against the top of the cooling fin (22); A cleaning sheet (37) is provided between each two adjacent heat dissipation fins (22), and the cleaning sheet (37) is formed into a V-shaped structure. The cleaning sheet (37) comprises a first sheet body (371) and a second sheet body (372) which are connected to each other at an angle, and the first sheet body (371) and the second sheet body (372) are respectively used to contact the mutually adjacent side surfaces of each two adjacent heat dissipation fins (22), and one end of the cleaning sheet (37) away from the contact body (21) is connected to the inner wall of the mounting ring (36).

2. The computer heat dissipation device according to claim 1, characterized in that: The dust sweeping rods (35) are provided in plurality, the plurality of dust sweeping rods (35) are evenly spaced along the circumference of the second mounting plate (34), and each dust sweeping rod (35) extends in the radial direction of the second mounting plate (34).

3. The computer heat dissipation device according to claim 1 or 2, characterized in that: One end of the dust sweeping rod (35) away from the second mounting plate (34) is flush with one end of the heat dissipating fin (22) away from the contact body (21).

4. The computer heat dissipation device according to claim 1, characterized in that: The angle β between the first sheet body (371) and the second sheet body (372) satisfies: 3°≤β≤10°.

5. The computer heat dissipation device according to claim 1, characterized in that: The contact body (21) comprises a first part (211) and a second part (212) which are coaxially connected; the first part (211) is close to the wind source element (1); the end surface of the first part (211) away from the second part (212) is flush with the top surface of the heat dissipation fin (22); the end surface of the first part (211) close to the second part (212) is flush with the ground of the heat dissipation fin (22); in the standby state, the second mounting plate (34) abuts against the first part (211); the second part (212) is used for thermal contact with electronic components inside the computer.

6. The computer heat dissipation device according to claim 5, characterized in that: The computer cooling device further comprises a connecting assembly (4), wherein the connecting assembly (4) comprises a connecting ring (41), a plurality of first connecting rods (42), and a plurality of second connecting rods (43); the middle portion of the outer wall of the second portion (212) is recessed inward to form an annular connecting groove (2121); the connecting ring (41) is installed in the annular connecting groove (2121); a plurality of first connecting rods (42) are evenly spaced along the circumference of the connecting ring (41) and each of the first connecting rods (42) extends radially along the connecting ring (41); one end of the plurality of first connecting rods (42) is connected to the outer wall of the connecting ring (41); the other ends of the plurality of first connecting rods (42) are respectively connected to the plurality of second connecting rods (43); and one end of the second connecting rod (43) away from the first connecting rod (42) is connected to the wind source element (1).

7. The computer heat dissipation device according to claim 6, characterized in that: An end of the first connecting rod (42) away from the connecting ring (41) is provided with a mounting through hole (421) for being installed inside a computer.

8. The computer heat dissipation device according to claim 6, characterized in that: The first connecting rod (42) and the second connecting rod (43) are detachably connected, and the second connecting rod (43) and the wind source element (1) are detachably connected.

9. A computer, characterized in that: A computer heat dissipation device comprising any one of claims 1-8.

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