Automatic degumming equipment for polycrystalline silicon wafer production

Abstract

The invention discloses automatic degumming equipment for polycrystalline silicon wafer production. The automatic degumming equipment comprises a hollow base, the control box is fixedly connected to the top of the base; the motor is fixedly connected to the top of the control box, and an output shaft of the motor extends into the control box and is fixedly connected with a gear; according to the polycrystalline silicon wafer heating device, a polycrystalline silicon wafer is placed on a supporting plate, at the moment, a motor is controlled to work, the motor can guide a positioning plate to fix the polycrystalline silicon wafer and guide a driving plate to be matched with a first electric push rod, and at the moment, the first electric push rod works to guide a heater to heat the polycrystalline silicon wafer; and meanwhile, a second electric push rod is controlled to work, the second electric push rod can push a scraping plate to move rightwards, make contact with the bottom of the polycrystalline silicon wafer and conduct glue scraping, meanwhile, a pressing plate is pressed to descend, at the moment, the pressing plate can adjust a removing plate to make contact with the surface of the scraping plate, the scraped glue can be removed out of the base, and work is convenient.

Description

Technical Field

[0001] The invention relates to the technical field of polycrystalline silicon wafer production, and in particular to automatic degumming equipment for polycrystalline silicon wafer production. Background Art

[0002] In the prior art, polycrystalline silicon wafers are a form of single-element silicon. When molten single-element silicon solidifies under supercooling conditions, silicon atoms are arranged into many crystal nuclei in the form of diamond lattices. If these crystal nuclei grow into grains with different crystal plane orientations, these grains will combine and crystallize into polycrystalline silicon.

[0003] In the prior art, during the production process of polycrystalline silicon wafers, the glue at the bottom needs to be debonded. During the debonding process, the polycrystalline silicon wafers have poor stability, lack of positioning, and poor automation, which is not conducive to work.

[0004] Therefore, the present application proposes an automatic degumming device for the production of polycrystalline silicon wafers to solve the above-mentioned problems. Summary of the invention

[0005] Based on the technical problems existing in the background technology, the present invention proposes an automatic degumming device for producing polycrystalline silicon wafers.

[0006] The present invention provides an automatic debonding device for producing polycrystalline silicon wafers, comprising a base with a hollow interior;

[0007] A control box, the control box is fixedly connected to the top of the base;

[0008] A motor, wherein the motor is fixedly connected to the top of the control box, and an output shaft of the motor extends into the control box and is fixedly connected to a gear;

[0009] A support frame, wherein the support frame is fixedly connected to the base, and a hollow support plate is fixedly connected to the top of the support frame;

[0010] A No. 1 electric push rod, the No. 1 electric push rod is fixedly connected to the top inner wall of the base;

[0011] A support plate with a hollow interior, wherein the support plate is fixedly connected in the control box;

[0012] An auxiliary plate, the auxiliary plate being slidably connected to the top inner wall of the base;

[0013] The positioning mechanism and the control mechanism cooperate with each other.

[0014] Preferably, a No. 2 electric push rod is fixedly connected to the top of the support frame, and a scraper is fixedly connected to the output end of the No. 2 electric push rod, and a cross plate is fixedly connected to the right side of the scraper.

[0015] Furthermore, by setting up a No. 2 electric push rod, the No. 2 electric push rod works to facilitate the control of the scraper to move, and at the same time the cross plate contacts the glue at the bottom of the polysilicon wafer, which can assist in debonding.

[0016] Preferably, a pressure plate is slidably connected to the inner wall of the rear side of the base, and a rejection plate is rotatably connected to the right side of the pressure plate, a No. 5 spring is fixedly connected to the bottom of the pressure plate, and one end of the No. 5 spring is fixedly connected to the top of the control box.

[0017] Furthermore, by controlling the pressure plate to descend, the pressure plate can synchronously drive the rejection plate to contact the top of the scraper. At this time, the rejection plate rotates with the movement of the pressure plate, which facilitates the scraping of the glue on the scraper surface.

[0018] Preferably, a telescopic tube is fixedly connected to the inner wall of the bottom of the base, and a heater is fixedly connected to the top of the inner tube of the telescopic tube.

[0019] Furthermore, by providing the telescopic tube, the telescopic tube plays an effect of assisting the heater in moving.

[0020] Preferably, the control mechanism includes a rack, a control plate, an extension plate, a matching plate, a pull plate, a movable plate, a positioning plate and a guide column, the rack being slidably connected to the top of the support plate, and the rack is meshed with the gear*, the control plate being slidably connected to the top of the support plate, the extension plate being fixedly connected to the bottom of the control plate, and the bottom of the extension plate extends into the base, the matching plate being fixedly connected to the left side of the extension plate, the pull plate being rotatably connected to the front side of the matching plate, the movable plate being slidably connected to the left inner wall of the control box, and the right side of the movable plate extends out of the control box, the front side of the movable plate is rotatably connected to the top of the pull plate, the positioning plate is fixedly connected to the top of the movable plate, and the bottom of the positioning plate extends into the base, the guide column is rotatably connected to the top inner wall of the base, the left side of the extension plate is fixedly connected with a guide belt, and one end of the guide belt is fixedly connected to the left side of the auxiliary plate, and the guide belt contacts the outer wall of the guide column.

[0021] Furthermore, a control mechanism is set up, and the control mechanism moves by controlling the rack. At this time, the rack can assist the control plate to move to the right, and at the same time, the control plate synchronously drives the extension plate and the matching plate to move. At this time, the movement of the matching plate can pull the pulling plate down, and then pull the moving plate down. The descent of the moving plate can synchronize the descent of the positioning plate to fix the polysilicon wafer.

[0022] Preferably, the top of the support plate is rotatably connected to two rotating columns, and the outer walls of the rotating columns are sleeved with the same control belt, and the outer wall of the control belt is fixedly connected to the front side of the rack and the rear side of the control plate.

[0023] Furthermore, when the rack moves, the rack can drive the control belt to rotate, and the rotation of the control belt can synchronously drive the control plate to move to the right.

[0024] Preferably, a No. 1 spring is fixedly connected to the right side of the extension plate, and one end of the No. 1 spring is fixedly connected to the right inner wall of the control box, and a No. 2 spring is fixedly connected to the bottom of the positioning plate, and one end of the No. 2 spring is fixedly connected to the top of the base.

[0025] Furthermore, by setting a No. 1 spring, the No. 1 spring can push the extension plate to return to its original position through its own elastic force, and by setting a No. 2 spring, the No. 2 spring can assist the positioning plate in rising and returning to its original position.

[0026] Preferably, the control mechanism includes a support ring, a hollow plate, a driving plate, a contact plate, a trapezoidal plate, a connecting plate and a control ring, the support ring is fixedly connected to the left inner wall of the base, the hollow plate is slidably connected in the support ring, the driving plate is slidably connected in the hollow plate, the contact plate is fixedly connected to the top of the driving plate, the trapezoidal plate is slidably connected to the bottom inner wall of the base, the connecting plate is rotatably connected to the front side of the trapezoidal plate, the control ring is fixedly sleeved on the outer wall of the outer tube of the telescopic tube, and the right side of the control ring is slidably connected to the right inner wall of the base, and the front side of the control ring is rotatably connected to the top of the connecting plate.

[0027] Furthermore, the control mechanism controls the driving plate to descend, and the driving plate can synchronously drive the hollow plate to descend. The movement of the hollow plate facilitates the auxiliary trapezoidal plate to move to the right, thereby pushing the connecting plate to move. At this time, the movement of the connecting plate is convenient for controlling the movement of the telescopic tube through the control ring.

[0028] Preferably, a No. 3 spring is fixedly connected to the right side of the driving plate, and one end of the No. 3 spring is fixedly connected to the right inner wall of the hollow plate, and a No. 4 spring is fixedly connected to the bottom of the control ring, and one end of the No. 4 spring is fixedly connected to the bottom inner wall of the base.

[0029] Furthermore, by setting a No. 3 spring, the No. 3 spring can pull the driving plate to return to its original position, and by setting a No. 4 spring, the No. 4 spring can pull the control ring to descend and return to its original position through its own elastic force.

[0030] Preferably, a rotating wheel is rotatably connected to the bottom of the hollow plate, and the rotating wheel is in active contact with the inclined surface of the trapezoidal plate.

[0031] Furthermore, when the hollow plate descends, the hollow plate drives the rotating wheel to contact the inclined surface of the trapezoidal plate, so as to facilitate the control of the trapezoidal plate to move to the right.

[0032] The beneficial effects of the present invention are:

[0033] 1. By placing the polysilicon wafer on the pallet, the motor is controlled to work at this time. The output shaft of the motor rotates to synchronously control the gear to rotate. When the gear rotates, the gear can control the rack to move to the left through the tooth pattern. When the rack moves, the rack can drive the control belt to rotate. With the rotation of the control belt, the control belt can synchronously drive the control plate to move to the right. At this time, the control plate can synchronously drive the extension plate to move. When the extension plate moves, the extension plate can drive the matching plate to move synchronously. With the movement of the matching plate, the matching plate can pull the pull plate to move. At this time, the movement of the pull plate can pull the moving plate to drop. With the movement of the moving plate, the moving plate can synchronously control the positioning plate to drop. With the movement of the positioning plate, the positioning plate contacts the polysilicon wafer on the top of the pallet to fix the polysilicon wafer.

[0034] 2. As the extension plate moves, the extension plate can synchronously pull the guide belt to move, and the guide belt can synchronously pull the auxiliary plate to move to the left. When the auxiliary plate moves, the auxiliary plate can contact the contact plate. At this time, the driving plate can be controlled by the contact plate to move, and then move to the bottom of the No. 1 electric push rod. At this time, the No. 1 electric push rod is controlled to work, and the No. 1 electric push rod can push the driving plate to descend, and then the hollow plate can be synchronously controlled to descend. When the hollow plate descends, the hollow plate can control the rotating wheel to descend, and the descending rotating wheel can contact the inclined surface of the trapezoidal plate, thereby controlling the trapezoidal plate to move to the right;

[0035] 3. When the trapezoidal plate moves, the trapezoidal plate can push the connecting plate to rise. At this time, the rising of the connecting plate can control the outer tube of the telescopic tube to move synchronously. At this time, the telescopic tube can drive the heater to move to the bottom of the polycrystalline silicon wafer to heat the glue at the bottom of the polycrystalline silicon wafer. When the heating is completed, by controlling the No. 2 electric push rod to work, the No. 2 electric push rod can push the scraper to move to the right, contact the bottom of the polycrystalline silicon wafer, scrape the glue, and press the pressure plate to descend at the same time. At this time, the pressure plate can mobilize the rejection plate to contact the surface of the scraper, and the scraped glue can be removed to the outside of the base, which is convenient for work.

[0036] Beneficial effect: By placing the polysilicon wafer on the pallet, the motor is controlled to work at this time. The motor can guide the positioning plate to fix the polysilicon wafer, and at the same time guide the driving plate to cooperate with the No. 1 electric push rod. At this time, the No. 1 electric push rod is working, which can guide the heater to heat the polysilicon wafer. At the same time, the No. 2 electric push rod is controlled to work, and the No. 2 electric push rod can push the scraper to move to the right, contact the bottom of the polysilicon wafer, scrape the glue, and press the pressure plate to go down at the same time. At this time, the pressure plate can mobilize the rejection plate to contact the surface of the scraper, and the scraped glue can be removed to the outside of the base, which is convenient for work. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a structural cross-sectional view of an automatic debonding device for producing polycrystalline silicon wafers proposed by the present invention;

[0038] Figure 2 A top view of the structure of a rack, a rotating column, a control belt and a control panel of an automatic debonding device for polycrystalline silicon wafer production proposed by the present invention;

[0039] Figure 3 This is an enlarged structural diagram of structure A of an automatic debonding device for producing polycrystalline silicon wafers proposed by the present invention;

[0040] Figure 4 This is an enlarged structural diagram of structure B of an automatic debonding device for producing polycrystalline silicon wafers proposed by the present invention;

[0041] Figure 5 This is an enlarged view of the structure C of an automatic debonding device for producing polycrystalline silicon wafers proposed by the present invention;

[0042] Figure 6 A three-dimensional diagram of the structure of a support ring, a hollow plate, a driving plate and a contact plate of an automatic debonding device for producing polycrystalline silicon wafers proposed by the present invention;

[0043] Figure 7 A three-dimensional structural diagram of a control board, an extension board, a matching board, a pulling board and a moving board of an automatic debonding device for polycrystalline silicon wafer production proposed by the present invention;

[0044] Figure 8 A three-dimensional structural diagram of a trapezoidal plate, a connecting plate and a control ring of an automatic debonding device for producing polycrystalline silicon wafers proposed by the present invention;

[0045] Fig. 9 A three-dimensional diagram of the structure of a support plate of an automatic debonding device for producing polycrystalline silicon wafers proposed by the present invention;

[0046] Fig.10 This is a three-dimensional structural diagram of a moving plate and a positioning plate of an automatic debonding device for producing polycrystalline silicon wafers proposed by the present invention.

[0047] In the figure: 1. base; 2. control box; 3. motor; 4. gear; 5. rack; 6. support plate; 7. rotating column; 8. control belt; 9. control plate; 10. extension plate; 11. spring No. 1; 12. matching plate; 13. pull plate; 14. moving plate; 15. positioning plate; 16. spring No. 2; 17. guide column; 18. guide belt; 19. auxiliary plate; 20. support ring; 21. hollow plate; 22. driving plate; 23. spring No. 3; 24. contact plate; 25. electric push rod No. 1; 26. rotating wheel; 27. trapezoidal plate; 28. connecting plate; 29. ​​control ring; 30. spring No. 4; 31. telescopic tube; 32. heater; 33. support frame; 34. support plate; 35. electric push rod No. 2; 36. scraper; 37. pressure plate; 38. spring No. 5; 39. rejection plate. DETAILED DESCRIPTION

[0048] The present invention will be further explained below in conjunction with specific embodiments.

[0049] Example

[0050] refer to Figure 1-10 , this embodiment provides an automatic debonding device for multi-crystalline silicon wafer production, including a base 1 with a hollow interior;

[0051] A control box 2, which is fixedly connected to the top of the base 1;

[0052] Motor 3, the motor 3 is fixedly connected to the top of the control box 2, and the output shaft of the motor 3 extends into the control box 2 and is fixedly connected to the gear 4;

[0053] A support frame 33, the support frame 33 is fixedly connected in the base 1, and a hollow support plate 34 is fixedly connected to the top of the support frame 33;

[0054] A first electric push rod 25, which is fixedly connected to the top inner wall of the base 1;

[0055] A hollow support plate 6 is fixedly connected to the control box 2;

[0056] An auxiliary plate 19, the auxiliary plate 19 is slidably connected to the top inner wall of the base 1;

[0057] The positioning mechanism and the control mechanism cooperate with each other.

[0058] In this embodiment, a No. 2 electric push rod 35 is fixedly connected to the top of the support frame 33, and a scraper 36 is fixedly connected to the output end of the No. 2 electric push rod 35, and a cross plate is fixedly connected to the right side of the scraper 36. By setting the No. 2 electric push rod 35, the No. 2 electric push rod 35 works, which facilitates the control of the scraper 36 to move. At the same time, the cross plate contacts the glue at the bottom of the polysilicon wafer, which can assist in degumming.

[0059] In this embodiment, a pressure plate 37 is slidably connected to the inner wall of the rear side of the base 1, and a rejection plate 39 is rotatably connected to the right side of the pressure plate 37. A No. 5 spring 38 is fixedly connected to the bottom of the pressure plate 37, and one end of the No. 5 spring 38 is fixedly connected to the top of the control box 2. The pressure plate 37 is controlled to descend. At this time, the pressure plate 37 can synchronously drive the rejection plate 39 to contact the top of the scraper 36. At this time, the rejection plate 39 rotates with the movement of the pressure plate 37, which is convenient for scraping the glue on the surface of the scraper 36.

[0060] In this embodiment, a telescopic tube 31 is fixedly connected to the bottom inner wall of the base 1, and a heater 32 is fixedly connected to the top of the inner tube of the telescopic tube 31. By providing the telescopic tube 31, the telescopic tube 31 plays an effect of assisting the heater 32 to move.

[0061] In this embodiment, the control mechanism includes a rack 5, a control plate 9, an extension plate 10, a matching plate 12, a pull plate 13, a movable plate 14, a positioning plate 15 and a guide column 17. The rack 5 is slidably connected to the top of the support plate 6, and the rack 5 is meshed with the gear *4. The control plate 9 is slidably connected to the top of the support plate 6. The extension plate 10 is fixedly connected to the bottom of the control plate 9, and the bottom of the extension plate 10 extends into the base 1. The matching plate 12 is fixedly connected to the left side of the extension plate 10. The pull plate 13 is rotatably connected to the front side of the matching plate 12. The movable plate 14 is slidably connected to the left inner wall of the control box 2, and the right side of the movable plate 14 extends to the outside of the control box 2. The front side of the movable plate 14 is rotatably connected to the top of the pull plate 13. The positioning plate 15 is fixedly connected At the top of the movable plate 14, and the bottom of the positioning plate 15 extends into the base 1, the guide column 17 is rotatably connected to the top inner wall of the base 1, and a guide belt 18 is fixedly connected to the left side of the extension plate 10, and one end of the guide belt 18 is fixedly connected to the left side of the auxiliary plate 19, and the guide belt 18 contacts the outer wall of the guide column 17. By setting a control mechanism, the control mechanism moves by controlling the rack 5. At this time, the rack 5 can assist the control plate 9 to move to the right, and at the same time, the control plate 9 synchronously drives the extension plate 10 and the matching plate 12 to move. At this time, the movement of the matching plate 12 can pull the pulling plate 13 to descend, and then pull the movable plate 14 to descend. The descent of the movable plate 14 can synchronize the descent of the positioning plate 15 to fix the polysilicon wafer.

[0062] In this embodiment, the top of the support plate 6 is rotatably connected to two rotating columns 7, and the outer wall of the rotating column 7 is sleeved with the same control belt 8, the outer wall of the control belt 8 is fixedly connected to the front side of the rack 5 and the rear side of the control plate 9, when the rack 5 moves, the rack 5 can drive the control belt 8 to rotate, and at this time, the rotation of the control belt 8 can synchronously drive the control plate 9 to move to the right.

[0063] In this embodiment, a No. 1 spring 11 is fixedly connected to the right side of the extension plate 10, and one end of the No. 1 spring 11 is fixedly connected to the right inner wall of the control box 2, and a No. 2 spring 16 is fixedly connected to the bottom of the positioning plate 15, and one end of the No. 2 spring 16 is fixedly connected to the top of the base 1. By setting the No. 1 spring 11, the No. 1 spring 11 can push the extension plate 10 to return to its position through its own elastic force, and by setting the No. 2 spring 16, the No. 2 spring 16 can assist the positioning plate 15 to rise and return to its position.

[0064] In this embodiment, the control mechanism includes a support ring 20, a hollow plate 21, a driving plate 22, a contact plate 24, a trapezoidal plate 27, a connecting plate 28 and a control ring 29. The support ring 20 is fixedly connected to the left inner wall of the base 1, the hollow plate 21 is slidably connected in the support ring 20, the driving plate 22 is slidably connected in the hollow plate 21, the contact plate 24 is fixedly connected to the top of the driving plate 22, the trapezoidal plate 27 is slidably connected to the bottom inner wall of the base 1, the connecting plate 28 is rotatably connected to the front side of the trapezoidal plate 27, and the control ring 29 The fixed sleeve is arranged on the outer wall of the outer tube of the telescopic tube 31, and the right side of the control ring 29 is slidably connected to the right inner wall of the base 1, and the front side of the control ring 29 is rotatably connected to the top of the connecting plate 28. The control mechanism controls the driving plate 22 to descend, and at this time, the driving plate 22 can synchronously drive the hollow plate 21 to descend. The movement of the hollow plate 21 facilitates the auxiliary trapezoidal plate 27 to move to the right, thereby pushing the connecting plate 28 to move. At this time, the connecting plate 28 moves through the control ring 29 to facilitate the control of the movement of the telescopic tube 31.

[0065] In this embodiment, a No. 3 spring 23 is fixedly connected to the right side of the driving plate 22, and one end of the No. 3 spring 23 is fixedly connected to the right inner wall of the hollow plate 21, and a No. 4 spring 30 is fixedly connected to the bottom of the control ring 29, and one end of the No. 4 spring 30 is fixedly connected to the bottom inner wall of the base 1. By setting the No. 3 spring 23, the No. 3 spring 23 has the effect of pulling the driving plate 22 to return to its original position. By setting the No. 4 spring 30, the No. 4 spring 30 can pull the control ring 29 to descend and return to its original position through its own elastic force.

[0066] In this embodiment, the bottom of the hollow plate 21 is rotatably connected to a rotating wheel 26, and the rotating wheel 26 is in active contact with the inclined surface of the trapezoidal plate 27. When the hollow plate 21 descends, the hollow plate 21 drives the rotating wheel 26 to contact the inclined surface of the trapezoidal plate 27, thereby conveniently controlling the trapezoidal plate 27 to move to the right.

[0067] Working principle: In actual operation, the polysilicon wafer is placed on the support plate 34, and the motor 3 is controlled to work. The output shaft of the motor 3 rotates to synchronously control the gear 4 to rotate. When the gear 4 rotates, the gear 4 can control the rack 5 to move to the left through the tooth pattern. When the rack 5 moves, the rack 5 can drive the control belt 8 to rotate. As the control belt 8 rotates, the control belt 8 can synchronously drive the control plate 9 to move to the right. At this time, the control plate 9 can synchronously drive the extension plate 10 to move. When the extension plate 10 moves, the extension plate 10 can drive the matching plate 12 to move synchronously. The matching plate 12 moves step by step. With the movement of the matching plate 12, the matching plate 12 can pull the pulling plate 13 to move. At this time, the movement of the pulling plate 13 can pull the moving plate 14 to move down. With the movement of the moving plate 14, the moving plate 14 can synchronously control the positioning plate 15 to move down. With the movement of the positioning plate 15, the positioning plate 15 contacts the polycrystalline silicon wafer on the top of the supporting plate 34 to fix the polycrystalline silicon wafer. At the same time, with the movement of the extension plate 10, the extension plate 10 can synchronously pull the guide belt 18 to move. At this time, the guide belt 18 can synchronously pull the auxiliary plate 19 to move to the left. When the auxiliary plate 19 moves When the auxiliary plate 19 is in contact with the contact plate 24, the driving plate 22 can be controlled to move by the contact plate 24, and then move to the bottom of the No. 1 electric push rod 25. At this time, the No. 1 electric push rod 25 is controlled to work, and the No. 1 electric push rod 25 can push the driving plate 22 to descend, and then the hollow plate 21 can be synchronously controlled to descend. When the hollow plate 21 descends, the hollow plate 21 can control the rotating wheel 26 to descend, and at the same time, the rotating wheel 26 descends and can contact the inclined surface of the trapezoidal plate 27, thereby controlling the trapezoidal plate 27 to move to the right. When the trapezoidal plate 27 moves, the trapezoidal plate 27 can push The connecting plate 28 rises, and the rising of the connecting plate 28 can control the outer tube of the telescopic tube 31 to move synchronously. At this time, the telescopic tube 31 can drive the heater 32 to move to the bottom of the polycrystalline silicon wafer to heat the glue at the bottom of the polycrystalline silicon wafer. After the heating is completed, by controlling the No. 2 electric push rod 35 to work, the No. 2 electric push rod 35 can push the scraper 36 to move to the right, contact the bottom of the polycrystalline silicon wafer, and scrape the glue. At the same time, the pressure plate 37 is pressed down. At this time, the pressure plate 37 can mobilize the rejection plate 39 to contact the surface of the scraper 36, and the scraped glue can be removed to the outside of the base 1, which is convenient for work.

[0068] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An automatic degumming device for producing polycrystalline silicon wafers, characterized in that: include A base (1) having a hollow interior; A control box (2), wherein the control box (2) is fixedly connected to the top of the base (1); A motor (3), wherein the motor (3) is fixedly connected to the top of the control box (2), and an output shaft of the motor (3) extends into the control box (2) and is fixedly connected to a gear (4); A support frame (33), wherein the support frame (33) is fixedly connected inside the base (1), and a hollow support plate (34) is fixedly connected to the top of the support frame (33); A No. 1 electric push rod (25), wherein the No. 1 electric push rod (25) is fixedly connected to the top inner wall of the base (1); A support plate (6) with a hollow interior, wherein the support plate (6) is fixedly connected inside the control box (2); An auxiliary plate (19), the auxiliary plate (19) being slidably connected to the top inner wall of the base (1); The positioning mechanism and the control mechanism cooperate with each other.

2. The automatic degumming equipment for producing polycrystalline silicon wafers according to claim 1, characterized in that: A No. 2 electric push rod (35) is fixedly connected to the top of the support frame (33), and a scraper (36) is fixedly connected to the output end of the No. 2 electric push rod (35), and a horizontal plate is fixedly connected to the right side of the scraper (36).

3. The automatic degumming equipment for producing polycrystalline silicon wafers according to claim 1, characterized in that: A pressure plate (37) is slidably connected to the inner wall of the rear side of the base (1), and a rejection plate (39) is rotatably connected to the right side of the pressure plate (37). A No. 5 spring (38) is fixedly connected to the bottom of the pressure plate (37), and one end of the No. 5 spring (38) is fixedly connected to the top of the control box (2).

4. The automatic degumming equipment for producing polycrystalline silicon wafers according to claim 1, characterized in that: A telescopic tube (31) is fixedly connected to the inner wall of the bottom of the base (1), and a heater (32) is fixedly connected to the top of the inner tube of the telescopic tube (31).

5. The automatic degumming equipment for producing polycrystalline silicon wafers according to claim 1, characterized in that: The control mechanism comprises a rack (5), a control plate (9), an extension plate (10), a matching plate (12), a pull plate (13), a movable plate (14), a positioning plate (15) and a guide column (17); the rack (5) is slidably connected to the top of the support plate (6), and the rack (5) is meshed with a gear * (4); the control plate (9) is slidably connected to the top of the support plate (6); the extension plate (10) is fixedly connected to the bottom of the control plate (9), and the bottom of the extension plate (10) extends into the base (1); the matching plate (12) is fixedly connected to the left side of the extension plate (10); and the pull plate (13) is rotatably connected to the front side of the matching plate (12). The movable plate (14) is slidably connected to the left inner wall of the control box (2), and the right side of the movable plate (14) extends to the outside of the control box (2), the front side of the movable plate (14) is rotatably connected to the top of the pull plate (13), the positioning plate (15) is fixedly connected to the top of the movable plate (14), and the bottom of the positioning plate (15) extends into the base (1), the guide column (17) is rotatably connected to the top inner wall of the base (1), the left side of the extension plate (10) is fixedly connected to a guide belt (18), and one end of the guide belt (18) is fixedly connected to the left side of the auxiliary plate (19), and the guide belt (18) is in contact with the outer wall of the guide column (17).

6. The automatic degumming equipment for producing polycrystalline silicon wafers according to claim 5, characterized in that: The top of the support plate (6) is rotatably connected to two rotating columns (7), and the outer wall of the rotating column (7) is sleeved with a same control belt (8), and the outer wall of the control belt (8) is fixedly connected to the front side of the rack (5) and the rear side of the control plate (9).

7. The automatic degumming equipment for producing polycrystalline silicon wafers according to claim 5, characterized in that: A No. 1 spring (11) is fixedly connected to the right side of the extension plate (10), and one end of the No. 1 spring (11) is fixedly connected to the right inner wall of the control box (2); a No. 2 spring (16) is fixedly connected to the bottom of the positioning plate (15), and one end of the No. 2 spring (16) is fixedly connected to the top of the base (1).

8. The automatic degumming equipment for producing polycrystalline silicon wafers according to claim 1, characterized in that: The control mechanism comprises a support ring (20), a hollow plate (21), a driving plate (22), a contact plate (24), a trapezoidal plate (27), a connecting plate (28) and a control ring (29); the support ring (20) is fixedly connected to the left inner wall of the base (1); the hollow plate (21) is slidably connected in the support ring (20); the driving plate (22) is slidably connected in the hollow plate (21); the contact plate (24) is fixedly connected to the top of the driving plate (22); the trapezoidal plate (27) is slidably connected to the bottom inner wall of the base (1); the connecting plate (28) is rotatably connected to the front side of the trapezoidal plate (27); the control ring (29) is fixedly sleeved on the outer wall of the outer tube of the telescopic tube (31); the right side of the control ring (29) is slidably connected to the right inner wall of the base (1); and the front side of the control ring (29) is rotatably connected to the top of the connecting plate (28).

9. The automatic degumming equipment for producing polycrystalline silicon wafers according to claim 8, characterized in that: A No. 3 spring (23) is fixedly connected to the right side of the driving plate (22), and one end of the No. 3 spring (23) is fixedly connected to the right inner wall of the hollow plate (21); a No. 4 spring (30) is fixedly connected to the bottom of the control ring (29), and one end of the No. 4 spring (30) is fixedly connected to the bottom inner wall of the base (1).

10. The automatic debonding equipment for producing polycrystalline silicon wafers according to claim 8, characterized in that: The bottom of the hollow plate (21) is rotatably connected to a rotating wheel (26), and the rotating wheel (26) is in active contact with the inclined surface of the trapezoidal plate (27).

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