Clay adhesive force measuring device of shield cutter head under multi-factor action

Abstract

The invention discloses a clay adhesive force measuring device of a shield cutter head under the action of multiple factors, and relates to the field of shield construction tunneling equipment, the clay adhesive force measuring device comprises a device body, an electroosmosis unit, a chemical improvement unit, a temperature control unit and an adhesive force measuring unit, the device body comprises a horizontal base plate and a device shell placed on the horizontal base plate, and the device shell is used for measuring the clay adhesive force of the shield cutter head; the electroosmosis unit is used for simulating the influence of a pulse signal current value on the adhesive force of cohesive soil; the chemical improvement unit is used for adding a chemical reagent into the cohesive soil to change the adhesion characteristic of the cohesive soil; the temperature control unit is used for controlling the temperature of the cohesive soil; and the adhesive force measuring unit is used for compacting the cohesive soil and measuring the adhesive force between the cohesive soil and the horizontal base plate. The device comprehensively considers a plurality of factors, such as pulse signals, voltage, temperature, chemical reagents and the like, which influence the clay viscosity, and breaks through the limitation of traditional single-factor judgment; the method has flexibility and diversity, and an innovative solution is provided for accurately measuring the adhesion force of the clay.

Description

Technical Field

[0001] The invention belongs to the field of shield construction excavation equipment, and in particular relates to a device for measuring the clay adhesion of a shield cutter head under the action of multiple factors. Background Art

[0002] During the construction and excavation of the shield machine, the clay on the cutter disc is very sticky and easily solidifies into mud cakes. The mud cakes block the cutter disc outlet and adhere to the cutter disc head, making it impossible for the soil cut by the cutter disc to be discharged through the outlet and causing the cutter disc head to be unable to rotate. When encountering the problem of mud cake on the cutter disc, the clay needs to be improved so that the viscosity between the clay and the cutter disc is greatly reduced, so that the cutter disc can rotate normally.

[0003] In the prior art, the main technical means to deal with this problem is to spray chemical improvers, including dispersants, foaming agents, etc., on clay soil to reduce the viscosity between clay soils, so that they do not stick together in large pieces and are discharged normally. The chemical improvement method may cause problems such as reagent inactivation and mismatch when encountering certain strata, because its optimal effect is related to factors such as temperature, usage amount, and usage time, which are difficult to control. The current research trend is electrical improvement, that is, electrical osmosis of clay, so that the water in the clay migrates from the anode to the cathode in a directional manner. The cathode is the surface of the cutter disc, and a thick water film will form on the clay soil and the cathode surface, causing the viscosity between them to be greatly reduced, thereby achieving the effect of clay detaching from the cutter disc. However, the limitation of this method is that it requires a high water content in the clay soil. Therefore, at this stage, there is also a means of using a combination of electrical and chemical methods, using both improvers and electrical methods for clay soil, and allocating appropriate proportions to each of them to achieve the best clay soil shedding effect, the lowest power consumption, and the least capital investment. At the same time, the effect of the electrical method is related to the voltage, power-on time, and pulse signal, and the effects of the electrical and chemical methods are both related to temperature.

[0004] At present, the laboratory equipment for measuring clay adhesion is single and can only measure the influence of one factor on clay adhesion. It is unable to comprehensively consider multiple factors such as temperature, chemical reagents, voltage, pulse signals, etc. Simply considering one or several factors does not meet the actual needs of the project. Summary of the invention

[0005] The purpose of the present invention is to provide a device for measuring the clay adhesion of a shield cutter head under the action of multiple factors, which is used to measure the size of the clay adhesion under the combined action of temperature, chemical reagents, voltage, and pulse signals. This device can consider the existence of these factors at the same time, solving the problem that traditional devices can only consider a certain factor alone.

[0006] To achieve the above object, the present invention provides the following solution: a device for measuring the clay adhesion of a shield cutter head under the action of multiple factors, comprising:

[0007] The device body comprises a horizontal pad and a device shell placed on the horizontal pad, wherein clay soil is placed on the horizontal pad, and the device shell is covered outside the clay soil;

[0008] An electro-osmosis unit, comprising a metal electrode wrapped in the horizontal pad, a power amplifier electrically connected to the metal electrode, a signal generator and an oscilloscope, the electro-osmosis unit being used to simulate the effect of the pulse signal current value on the adhesion of clay soil;

[0009] A chemical improvement unit connected to the device housing and used to add chemical reagents to the clay soil to change its adhesion properties;

[0010] A temperature control unit connected to the device housing and used to control the temperature of the clay soil;

[0011] The adhesion force measuring unit comprises a compacting mechanism for compacting clay soil, a driving mechanism for pushing the device housing and the clay soil to horizontally displace on a horizontal pad, and a force sensor for measuring the adhesion force between the clay soil and the horizontal pad.

[0012] The above structure aims to propose a device for measuring the clay adhesion of the shield cutter head under the action of multiple factors. The device comprehensively considers the influence of factors such as electro-osmosis, chemical modification, and temperature control on the clay adhesion. It can use multiple factors alone or in combination to achieve multiple combinations of different factors. The device is easy to build and the adhesion evaluation effect is quantitative. The device allows technicians to adjust the parameters of each unit as needed to adapt to different test conditions and requirements. The device provides an innovative measurement solution for the clay adhesion of the shield cutter head under the action of multiple forces, which helps to solve the problem of clay adhesion in shield construction.

[0013] Preferably, the metal electrode comprises a metal anode bar, a metal cathode bar and an insulating gasket filled between the metal anode bar and the metal cathode bar. Specifically, the metal anode bar, the metal cathode bar and the insulating gasket are wrapped at a position corresponding to the opening of the device shell, and the insulating gasket is filled between the metal anode bar and the metal cathode bar to play an insulating role.

[0014] Preferably, the metal anode strip is electrically connected to the positive pole of the power amplifier, and the metal cathode strip is electrically connected to the negative pole of the power amplifier; the signal generator is connected to the power amplifier through a wire; the positive pole of the power amplifier is connected to the positive pole of the oscilloscope, and the negative pole is connected to the negative pole of the oscilloscope. The above components are used to simulate the influence of the pulse signal current value on the clay adhesion.

[0015] Preferably, the chemical modification unit comprises a reagent box, the reagent box is connected to the device housing through a connecting pipe, one end of the connecting pipe enters the device housing and is connected to a spray head, and a valve is provided on the connecting pipe. The chemical modification unit can spray chemical reagents into the clay soil to change the adhesion properties of the clay soil.

[0016] Preferably, the temperature control unit comprises a heating plate fixed around the inner wall of the device housing and an adjustable temperature control module connected to the heating plate. The adjustable temperature control module is used to provide heat to the heating plate, thereby controlling the temperature of the clay soil to study the effect of temperature on the adhesion of the clay soil.

[0017] Preferably, the compaction mechanism comprises a plastic pressing plate, a hydraulic column and a pressure box, wherein the hydraulic column penetrates the top wall of the device housing, and one end of the hydraulic column entering the device housing is fixedly connected to the plastic pressing plate, and the other end is connected to the pressure box. The pressure mechanism applies pressure to the clay soil through the cooperation of the pressure box, the hydraulic column and the plastic pressing plate, so that the clay soil is fully in contact with and bonded to the interface of the metal anode strip and the metal cathode strip, thereby preventing the occurrence of local poor bonding that affects the measurement effect of the adhesion force.

[0018] Preferably, the device further comprises a main control unit, and the main control unit is electrically connected to the electro-osmosis unit, the chemical modification unit, the temperature control unit, and the adhesion measurement unit.

[0019] Preferably, the device body is a plastic shell, which is light in weight and has insulating properties.

[0020] Preferably, the horizontal pad is marked with a size scale. The horizontal pad is marked with a size scale for the purpose of observing the change in the magnitude of the adhesion force when the clay soil is displaced under the push of the force sensor.

[0021] The present invention discloses the following technical effects:

[0022] The device of the present invention comprehensively considers multiple factors that affect the viscosity of clay, such as pulse signals, voltage, temperature, chemical reagents, etc., breaking the limitation of traditional single factor judgment; it has flexibility and diversity, and multiple influencing factors can be used alone or in combination. Each factor can adjust different values, thereby achieving multiple combinations of different factors, and can provide quantitative adhesion evaluation effects, providing specific guidance for theoretical research and practical applications; each unit of the device is easy to implement and build, and the device cleverly combines electro-osmosis, chemical improvement, temperature control and adhesion measurement technology, providing an innovative solution for accurately measuring clay adhesion, which helps to solve the problem of clay adhesion in shield cutter heads. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a structural schematic diagram of the device of the present invention;

[0025] In the figure: 1. signal generator; 2. power amplifier; 3. oscilloscope; 4. metal anode strip; 5. metal cathode strip; 6. insulating gasket; 7. wire; 8. nozzle; 9. connecting pipe; 10. valve; 11. reagent box; 12. clay; 13. heating plate; 14. plastic pressure plate; 15. hydraulic column; 16. pressure box; 17. force sensor; 18. device housing; 19. horizontal pad; 20. adjustable temperature control module. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] Reference Figure 1 As shown, the present invention provides a device for measuring the clay adhesion of a shield cutter head under the action of multiple factors, the device comprising: a device body composed of a device shell 18 and a horizontal pad 19 located at the bottom of the device shell 18, and an electroosmosis unit, a chemical modification unit, a temperature control unit and an adhesion measurement unit connected to the device body. The device shell 18 of the device is preferably a plastic shell, which is light on the one hand and has insulation properties on the other hand. The bottom of the device shell 18 is open on one side, and the opening is placed downward on the horizontal pad 19. The main body of the horizontal pad 19 is an insulating plate. The position of the horizontal pad 19 corresponding to the opening of the device shell 18 is wrapped with a metal anode strip 4, a metal cathode strip 5 and an insulating gasket 6. The insulating gasket 6 is filled between the metal anode strip 4 and the metal cathode strip 5 to play an insulating role. Clay 12 is placed on the horizontal pad 19 located in the device shell 18. There is sufficient space in the device shell 18 to accommodate clay 12 of different volumes, thereby changing the amount of clay 12.

[0029] The electro-osmosis unit includes the above-mentioned metal anode strip 4, metal cathode strip 5 and insulating gasket 6, and also includes a power amplifier 2, a signal generator 1 and an oscilloscope 3 electrically connected to the metal anode strip 4 and the metal cathode strip 5. The positive and negative terminals of the power amplifier 2 are respectively connected to the metal anode strip 4 and the metal cathode strip 5. The signal generator 1 and the power amplifier 2 are directly connected by a wire 7. The positive pole of the power amplifier 2 is connected to the positive pole of the oscilloscope 3 through the wire 7, and the negative pole of the power amplifier 2 is connected to the negative pole of the oscilloscope 3 through the wire 7. In the above-mentioned electro-osmosis unit, the metal anode strip 4, the metal cathode strip 5 and the insulating gasket 6 are in the same plane, and the power amplifier 2 is connected to simulate the influence of the pulse signal current value on the clay adhesion. Studies have shown that pulse current can reduce energy consumption and shorten the clay shedding time compared with direct current.

[0030] The chemical modification unit includes a nozzle 8, a connecting pipe 9, a reagent box 11 and a valve 10, wherein one end of the connecting pipe 9 is connected to the reagent box 11, and the other end enters the device housing 18 and is connected to the nozzle 8 at the port. The valve 10 is arranged on the connecting pipe 9, and is used to control the conduction and closure of the connecting pipe 9. It can be closed or opened manually, or an automatic valve can be set and the signal is connected to the main control unit. The reagent box 11 is marked with a scale, and the required reagent can be quantitatively added to the reagent box 11, and the amount of reagent sprayed from the nozzle 8 is controlled by the valve 10. The reagent sprayed from the nozzle 8 enters the adhesion measurement unit.

[0031] The adhesion measurement unit includes a plastic pressing plate 14, a hydraulic column 15, a pressure box 16 and a force sensor 17; the clay 12 is placed on a plane formed by a metal anode strip 4, a metal cathode strip 5 and an insulating gasket 6, the plastic pressing plate 14 is located directly above the clay 12, and is connected to the top wall of a device housing 18 through a hydraulic column 15, the hydraulic column 15 penetrates the device housing 18, one end of the hydraulic column 15 extends into the device housing 18 and is fixedly connected to the plastic pressing plate 14 at the end, and the other end is connected to a pressure box 16 located outside the device housing 18, the pressure box 16 provides hydraulic pressure to the hydraulic column 15, drives the hydraulic column 15 to press downward in the axial direction, and then drives the plastic pressing plate 14 to move downward to compact the clay 12, so that the clay 12 is fully in contact with and bonded to the interface of the metal anode strip 4 and the metal cathode strip 5, to prevent local false bonding from affecting the adhesion measurement effect. The force sensor 17 is arranged outside one side of the device housing 18, and is used to push the device housing 18 to horizontally displace on the horizontal pad 19. It should be understood that there is no fixed connection between the device housing 18 and the horizontal pad 19. The horizontal pad 19 is fixed on the test platform, and the device housing 18 is placed on the horizontal pad 19 without restraint. The resistance encountered by the force sensor 17 when pushing the device housing 18 is the adhesion force between the clay 12 and the horizontal pad 19. The horizontal pad 19 is marked with a size scale, and the purpose is to observe the change in the magnitude of the adhesion force of the clay 12 when the clay 12 is displaced under the push of the force sensor 17. During the measurement, the force sensor 17 is turned on to push the device housing 18 in the horizontal direction, and then push the clay 12, so as to achieve the purpose of measuring the adhesion force of the clay 12.

[0032] The temperature control unit includes a heating plate 13 and an adjustable temperature control module 20. The heating plate 13 is fixed around the inner wall of the device shell 18 to surround the clay 12. The heating plate 13 is temperature-controlled and regulated by the adjustable temperature control module 20. For example, the two can be connected by a circulating heat pipe. The adjustable temperature control module 20 generates heat and transfers the heat to the heating plate 13 through the circulating heat pipe. The heating plate 13 dissipates heat to heat the clay 12.

[0033] It should be understood that in actual applications, the force sensor 17 is driven by a driving mechanism, which may be a structure or mechanical device capable of realizing linear motion function / rotational motion / telescopic motion, and may be, for example, a servo motor, a hydraulic cylinder, an electric cylinder, and the like.

[0034] It should also be understood that each unit of the device, such as the electro-osmosis unit, the chemical modification unit, the temperature control unit and the adhesion measurement unit, is designed with an easy-to-operate interface to simplify the operation process.

[0035] The device for measuring the clay adhesion of the shield cutter head under the action of multiple factors in the embodiment of the present invention cleverly combines electroosmosis, chemical modification, temperature control and adhesion measurement technology, and provides an innovative solution for accurately measuring the clay adhesion. Compared with the prior art, the device of the present invention at least discloses the following beneficial effects:

[0036] 1. Comprehensively considers multiple factors that affect clay viscosity, such as pulse signal, voltage, temperature, chemical reagents, etc., breaking the limitations of traditional single factor judgment.

[0037] 2. Multiple factors can be used alone or in combination, and each factor can be adjusted to different values, which can achieve more combinations of different factors and provide more solutions for the clay bonding problem of shield cutterhead in the future.

[0038] 3. The device is easy to implement and build, but the adhesion evaluation effect is quantitative and can provide specific theoretical guidance.

[0039] The details not described in detail in the present invention are all conventional technical means well known to those skilled in the art.

[0040] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A device for measuring the clay adhesion of a shield cutter head under the action of multiple factors, characterized in that: include: The device body comprises a horizontal pad (19) and a device housing (18) placed on the horizontal pad (19), wherein clay soil (12) is placed on the horizontal pad (19), and the device housing (18) covers the clay soil (12); An electro-osmosis unit, comprising a metal electrode wrapped in the horizontal pad (19), a power amplifier (2) electrically connected to the metal electrode, a signal generator (1) and an oscilloscope (3), wherein the electro-osmosis unit is used to simulate the influence of the pulse signal current value on the adhesion of clay soil (12); A chemical modification unit connected to the device housing (18) and used for adding chemical reagents to the clay soil (12) to change its adhesion properties; A temperature control unit connected to the device housing (18) and used to control the temperature of the clay soil (12); The adhesion force measuring unit comprises a compacting mechanism for compacting clay soil (12), a driving mechanism for pushing the device housing (18) and the clay soil (12) to horizontally displace on a horizontal pad (19), and a force sensor (17) for measuring the adhesion force between the clay soil (12) and the horizontal pad (19).

2. The device for measuring the clay adhesion of a shield cutter head under the action of multiple factors according to claim 1 is characterized in that: The metal electrode comprises a metal anode strip (4), a metal cathode strip (5) and an insulating gasket (6) filled between the metal anode strip (4) and the metal cathode strip (5).

3. The device for measuring the clay adhesion of a shield cutter head under the action of multiple factors according to claim 2 is characterized in that: The metal anode strip (4) is electrically connected to the positive electrode of the power amplifier (2), and the metal cathode strip (5) is electrically connected to the negative electrode of the power amplifier (2); the signal generator (1) is connected to the power amplifier (2) via a wire (7); the positive electrode of the power amplifier (2) is connected to the positive electrode of the oscilloscope (3), and the negative electrode is connected to the negative electrode of the oscilloscope (3).

4. The device for measuring the clay adhesion of a shield cutter head under the action of multiple factors according to claim 1 is characterized in that: The chemical improvement unit comprises a reagent box (11), wherein the reagent box (11) is connected to the device housing (18) via a connecting pipe (9), one end of the connecting pipe (9) enters the device housing (18) and is connected to a nozzle (8), and a valve (10) is provided on the connecting pipe (9).

5. The device for measuring the clay adhesion of a shield cutter head under the action of multiple factors according to claim 1 is characterized in that: The temperature control unit comprises a heating plate (13) fixed around the inner wall of the device housing (18) and an adjustable temperature control module (20) connected to the heating plate (13).

6. The device for measuring the clay adhesion of a shield cutter head under the action of multiple factors according to claim 1, characterized in that: The compacting mechanism comprises a plastic pressing plate (14), a hydraulic column (15) and a pressure box (16); the hydraulic column (15) penetrates the top wall of the device housing (18); one end of the hydraulic column (15) entering the device housing (18) is fixedly connected to the plastic pressing plate (14), and the other end is connected to the pressure box (16).

7. The device for measuring the clay adhesion of a shield cutter head under the action of multiple factors according to any one of claims 1 to 6, characterized in that: It also includes a main control unit, which is electrically connected to the electric permeation unit, the chemical modification unit, the temperature control unit, and the adhesion measurement unit.

8. The device for measuring the clay adhesion of a shield cutter head under the action of multiple factors according to claim 1 is characterized in that: The device body is a plastic shell.

9. The device for measuring the clay adhesion of a shield cutter head under the action of multiple factors according to claim 1, characterized in that: The horizontal pad (19) is marked with size scales.

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