Contactor alignment kit

The contactor alignment kit ensures consistent alignment between IC handlers and sockets, addressing the inefficiencies of manual alignment and improving yield and productivity in IC package testing.

CN119104865APending Publication Date: 2024-12-10TEXAS INSTRUMENTS INC
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Patent Information

Application Number
CN202310667062.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-06-07
Publication Date
2024-12-10

AI Technical Summary

Technical Problem

The manual alignment of integrated circuit (IC) packages with contactor test points during testing is time-consuming and prone to non-standardized open/short circuit failures, leading to reduced productivity and yield inconsistencies across different IC handlers.

Method used

A contactor alignment kit is mounted on the contactor module, forming a fixed relationship between the IC handler and the IC socket, eliminating the need for manual alignment and ensuring consistent positioning during testing.

Benefits of technology

Reduces test time and improves overall yield by maintaining a standardized alignment, minimizing open/short circuit failures and enhancing productivity.

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Abstract

The invention discloses a contactor alignment kit. An apparatus for a contactor module includes a body having a surface shaped to contact a first surface of a turret platform and a first arm extending from the body in a first direction, the first arm shaped to contact a second surface of the turret platform. The apparatus also includes a second arm extending from the body in the first direction, the second arm shaped to contact a third surface of the turret platform. The second and third surfaces of the turret platform are opposite surfaces, and the first surface of the turret platform extends between the second and third surfaces of the turret platform. The apparatus also includes a tube extending in a second direction from the body, the tube shaped to receive a guide pin of the contactor module.
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Description

Technical Field

[0001] The present description relates to integrated circuit (IC) package testing, and more particularly to systems and methods for aligning an integrated circuit (IC) package with a contactor module for IC package testing. Background Art

[0002] There are different integrated circuit (IC) package types available in the market, coming from different technologies and developed over the past few decades. Based on the final application, these IC packages need to be tested. IC handlers (e.g., turret handlers) perform final testing on IC packages. This final testing is usually performed under ambient, cold or hot conditions by a combination of several test methods using visual and electrical contact. As IC packages become more and more complex, smaller, and more and more difficult to handle, final testing becomes more and more challenging. In fact, smaller chips do not translate into faster test times. As chip complexity increases, test times also increase, resulting in an increase in the total product cost of the IC. The rising cost of testing semiconductor devices is now one of the main challenges facing manufacturers. Summary of the invention

[0003] The first example relates to a device for a contactor module. The device includes a body having a surface shaped to contact a first surface of a turret platform and a first arm extending from the body in a first direction, the first arm being shaped to contact a second surface of the turret platform. The device further includes a second arm extending from the body in the first direction, the second arm being shaped to contact a third surface of the turret platform. The second surface and the third surface of the turret platform are opposite surfaces, and the first surface of the turret platform extends between the second surface and the third surface of the turret platform. The device also includes a tube extending from the body in the second direction, the tube being shaped to receive a guide pin of the contactor module.

[0004] A second example relates to a method for testing an integrated circuit (IC) package. The method includes placing an apparatus on a contactor module. The apparatus includes: a body; arms extending from the body in a first direction, wherein the arms and the body are shaped to provide a slot for a turret platform; and tubes extending from the body in a second direction, wherein the tubes surround guide pins of the contactor module. The method further includes: positioning the contactor module so that a portion of the turret platform fills the slot; and inserting the IC package into an IC socket on the contactor module by a pick arm coupled to the turret platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1A An exemplary contactor module arrangement is shown.

[0006] Figure 1B Shows Figure 1AAnother view of the contactor module in Figure 1.

[0007] Figure 2A and Figure 2B Various views of an exemplary contactor alignment kit are shown.

[0008] Figure 3A and Figure 3B Various views of another exemplary contactor alignment kit are shown.

[0009] Figure 4A One view of an exemplary contactor module arrangement is shown.

[0010] Figure 4B Another view of an exemplary contactor module arrangement is shown.

[0011] Figure 5A and Figure 5B Different views of an exemplary integrated circuit (IC) testing arrangement are shown.

[0012] Figure 6 A diagram showing another exemplary IC testing arrangement is shown.

[0013] Figure 7 A flow chart of an exemplary method for testing an integrated circuit (IC) package is shown. DETAILED DESCRIPTION

[0014] The present specification relates to the testing of integrated circuit (IC) packages. The testing of IC packages is facilitated by using a contactor module. Specifically, the IC package to be tested is picked up by an IC handler and pressed on a contactor test point (e.g., an IC socket) of a contactor module to perform IC package testing. The IC handler includes one or more pick arms for picking up the IC package and placing the IC package on the contactor test point. The IC package needs to be aligned with the contactor test point to avoid non-real open / short rejection of the IC package.

[0015] In the current embodiment, in order to achieve the correct alignment of the IC package with the contactor test point, the technician needs to manually test the pick-up head stroke position of the pick-up arm of the IC handler each time the IC package needs to be placed on the contactor test point, and test the result using some IC packages. In addition, the placement of the IC package on the contactor module requires manual observation by the technician (for example, using a magnifying glass) to ensure that the IC package is in correct contact with the contactor test point. This manual alignment is very time-consuming, which will reduce productivity and therefore reduce output. In addition, if the manual alignment is not done well, a large number of open / short circuit performance (OS%) will be observed, affecting the overall yield. In addition, it cannot be guaranteed that exactly the same alignment standards are made on different IC handlers, so non-standardized OS% differences are observed on different IC handlers.

[0016] In order to overcome the above problems, a device for a contactor module is described herein. The device includes a contactor alignment kit, which includes a slot for an IC handler. The contactor alignment kit is mounted / embedded on the contactor module. During IC package testing, the contactor module is positioned so that a portion of the IC handler fills the slot of the contactor alignment kit. The positioning of the contactor module (together with the contactor alignment kit) enables the IC handler and the IC socket of the contactor module to maintain a fixed relationship during IC package testing. The fixed relationship between the IC handler and the IC socket eliminates the need for manual alignment of the IC handler with the IC socket (or contactor test point), thereby reducing test time and improving overall yield. In addition, the use of the contactor alignment kit avoids the problem of non-standardized differences in OS% on different IC handlers.

[0017] Figure 1A An exemplary contactor module arrangement 100 is shown. In some examples, the contactor module arrangement 100 is used to test an integrated circuit (IC) package. In various examples, the IC package is a quad flat no-lead (QFN) package, a double flat no-lead (DFN) package, etc. However, other embodiments of the IC package are also considered to be within the scope of the present disclosure. The contactor module arrangement 100 includes a contactor module 102 and a contactor alignment kit 104. The contactor alignment kit 104 is mounted / embedded on the contactor module 102. The contactor module 102 includes a contactor platform 107 (or a hybrid contactor) and an IC socket 106, and the IC package (IC package) is placed at the IC socket to perform IC package testing. The IC socket 106 is close to the center of the contactor platform 107.

[0018] The contactor alignment kit 104 includes a body 110, an upper arm 112, and a lower arm 114, which are shaped to form a slot 108 to accommodate a portion of a turret platform 113. The turret platform 113 is part of a turret handler, which is a type of IC handler. The turret handler includes a turret platform 113 and a pick-up arm (not shown here) coupled to the turret platform 113. The pick-up arm is configured to pick up an IC package and place the IC package on the IC socket 106. The turret platform 113 includes a first surface 120, a second surface 122, and a third surface 124, wherein the second surface 122 and the third surface 124 are opposite surfaces, and the first surface 120 of the turret platform 113 extends between the second surface 122 and the third surface 124 of the turret platform 113. Although the contactor alignment kit 104 is shown in this example to accommodate a turret platform 113 associated with a turret handler, in other examples, the contactor alignment kit 104 may be configured to accommodate parts / platforms associated with other types of IC handlers.

[0019] The body 110 of the contactor alignment kit 104 has a surface shaped to contact a first surface 120 of a turret platform 113. The upper arm 112 of the contactor alignment kit 104 extends from the body 110 in a first direction, and the upper arm 112 is shaped to contact a second surface 122 of the turret platform 113. The lower arm 114 of the contactor alignment kit 104 extends from the body 110 in a first direction, and the lower arm 114 is shaped to contact a third surface 124 of the turret platform 113. The contactor alignment kit 104 further includes a tube extending from the body 110 in a second direction, such as a first tube 116 and a second tube 118 spaced apart. In some examples, the first direction and the second direction are perpendicular to each other. However, in other examples, the relative angle between the first direction and the second direction may be different. As in Figure 1B As can be seen in FIG. 1 , the first tube 116 and the second tube 118 are shaped to receive guide pins of the contactor module 102 .

[0020] During IC package testing, the contactor module 102 is positioned so that a portion of the turret platform 113 fills the slot 108 of the contactor alignment kit 104. In some examples, the contactor module 102 is positioned so that the turret platform 113 extends to the surface of the body 110. In some examples, the arrangement in which a portion of the turret platform 113 extends in the slot 108 facilitates maintaining a fixed relationship between the turret platform 113 (including the pick arm associated therewith) and the IC socket 106 of the contactor module 102. This fixed relationship between the turret platform 100 / pick arm and the IC socket 106 eliminates the need for manual alignment of the pick arm with the IC socket 106, thereby reducing test time and improving overall yield.

[0021] To illustrate the guide pins of the contactor module 102, Figure 1B Shows Figure 1A Another view of the contactor module 102 in FIG. Figure 1B The contactor module 102 includes a first guide pin 126 and a second guide pin 128, on which are mounted Figure 1A The first tube 116 and the second tube 118 are provided. The first tube 116 surrounds the first guide pin 126 and the second tube 118 surrounds the second guide pin 128. In some examples, the contactor alignment kit 104 is a fixture, or more specifically, a device for mechanically maintaining the correct positional relationship between a workpiece (e.g., IC socket 106) and a tool (e.g., turret platform 113 and pick arm). In some examples, the slot 108 is a mortise, or more specifically, a slot that matches some other part (e.g., turret platform 113). In some examples, as in Figure 2A and Figure 2B As can be seen in FIG. 1 , the upper arm 112 and the lower arm 114 of the contactor alignment kit 104 comprise a single arm. However, in other examples, such as in Figure 3A and Figure 3B As can be seen in FIG. 1 , the upper arm 112 and the lower arm 114 of the contact alignment kit 104 include two arms separated by a gap including a certain distance.

[0022] Figure 2A and Figure 2B Various views of an exemplary contactor alignment kit 200 are shown. Figure 2A and Figure 2B The same reference numerals are used to describe the same structures. The contactor alignment kit 200 includes Figure 1A An exemplary embodiment of the contactor alignment kit 104 in FIG. Figure 1A The contact module arrangement 100 in FIG. 1 is used to describe the contact alignment kit 200. The contact alignment kit 200 includes a body 202, a first arm 204, and a second arm 206, which are formed to form a slot 208 to accommodate a turret platform (e.g., Figure 1A The first arm 204 and the second arm 206 have a wedge-shaped design. However, in different examples, the first arm 204 and the second arm 206 can be implemented in other shapes.

[0023] The body 202 has a first surface (eg, Figure 1A The first arm 204 extends from the body 202 in a first direction, and the first arm 204 is formed to contact a second surface of the turret platform (e.g., Figure 1AThe second arm 206 extends from the body 202 in the first direction, and the second arm 206 is formed to contact a third surface of the turret platform (e.g., Figure 1A The first arm 204 is positioned above the second arm 206. The distance between the first arm 204 and the second arm 206 is equal to the height of the first surface of the turret platform. Figure 1A The upper arm 112 shown in FIG. 1 and the second arm 206 constitute Figure 1A The contactor alignment kit 200 further includes a first tube 210 (eg, Figure 1A The first tube 116 and the second tube 212 (eg, Figure 1A In some examples, the first direction and the second direction are perpendicular. Figure 1A All features of the Contactor Alignment Kit 104 also apply to Figure 2A and Figure 2B The contactor alignment kit 200 is not specifically explained here.

[0024] Figure 3A and Figure 3B Different views of another exemplary contact alignment kit 300 are shown. Figure 3A and Figure 3B The same reference numerals are used to describe the same structures. The contactor alignment kit 300 can be used to implement Figure 1A Therefore, reference is made to the contactor alignment kit 104 in this document. Figure 1A The contactor module arrangement 100 in FIG. 1 is used to describe the contactor alignment kit 300. The contactor alignment kit 300 includes a body 302, a first arm 304, a second arm 306, a third arm 308, and a fourth arm 310, which are formed to form a slot 312 to accommodate a turret platform (e.g., Figure 1A The first arm 304 and the third arm 308 are arranged together to form a U-shaped design. Similarly, the second arm 306 and the fourth arm 310 are arranged together to form a U-shaped design. However, other designs for these arms other than the U-shaped design are also possible.

[0025] The body 302 has a first surface (eg, Figure 1A The first arm 304 and the third arm 308 extend from the body 302 in a first direction, and the first arm 304 and the third arm 308 are formed to contact a second surface of the turret platform (e.g., Figure 1AThe second arm 306 and the fourth arm 310 extend from the body 302 in the first direction, and the second arm 306 and the fourth arm 310 are formed to contact the third surface 122 of the turret platform 113 (e.g., Figure 1A The first arm 304 is positioned above the second arm 306. The distance between the first arm 304 and the second arm 306 is equal to the distance between the turret platform (e.g., Figure 1A The first surface of the turret platform 113 (eg, Figure 1A Similarly, the third arm 308 is positioned above the fourth arm 310. The distance between the third arm 308 and the fourth arm 310 is equal to the height of the first surface of the turret platform.

[0026] The first arm 304 and the third arm 308 have lower surfaces on a first plane, and the first arm 304 and the third arm 308 are separated by a gap having a first distance. Similarly, the second arm 306 and the fourth arm 310 have upper surfaces on a second plane, and the second arm 306 and the fourth arm 310 are separated by a gap having a second distance. In some examples, the first distance and the second distance are the same. In this example, the first arm 304 and the third arm 308 together constitute Figure 1A The upper arm 112 shown in FIG. 1 and the second arm 306 and the fourth arm 310 together constitute Figure 1A The contactor alignment kit 300 further includes a first tube 314 (eg, Figure 1A The first tube 116 in the embodiment and the second tube 316 (e.g., Figure 1A In some examples, the first direction and the second direction are perpendicular. Although not explicitly explained, it is applicable to Figure 1A All features of the Contactor Alignment Kit 104 also apply to Figure 3A and Figure 3B Contactor Alignment Kit 300 in.

[0027] Figure 4A 4 shows a view of an exemplary contactor module arrangement 400. The contactor module arrangement 400 includes a contactor module 402 and a contactor alignment kit 404. The contactor alignment kit 404 includes a slot 403. The contactor alignment kit 404 is embedded / mounted on the contactor module 402. The contactor alignment kit 404 is similar to Figure 3A and Figure 3B Contactor Alignment Kit 300 in. Figure 4B Another view of an exemplary contactor module arrangement 400 is shown. Figure 4A and Figure 4B The contactor module arrangements in the FIGURE 1 use the same numbering to describe the same structure. Figure 4B Also shown is an exemplary turret handler 406 including a turret platform 408 and a pick arm 410. Although there are multiple pick arms, for simplicity only one pick arm is numbered herein (eg, pick arm 410).

[0028] Figure 5A and Figure 5B Different views of an exemplary integrated circuit (IC) test arrangement 500 are shown. Figure 5A and Figure 5B The same reference numerals are used to describe the same structures in the IC test arrangement 500. The IC test arrangement 500 includes a contactor module arrangement 502 and a turret handler 508. The contactor module arrangement 502 is similar to Figure 4A and Figure 4B The contactor module arrangement 400 in FIG. 5 is similar to the turret handler 508. Figure 4B 4. The contactor module arrangement 502 includes a contactor module 504 and a contactor alignment kit 506. The contactor alignment kit 506 is embedded / mounted on the contactor module 504. The turret handler 508 includes a turret platform 510 and a pick arm 512. Although there are multiple pick arms, for simplicity, only one pick arm is numbered here (e.g., pick arm 512). To facilitate IC package testing, in some examples, the contactor module 504 is positioned so that the turret platform 510 fills the slot of the contactor alignment kit 506. In some examples, the turret platform 510 extends to the surface of the body of the contactor alignment kit 506 in the slot.

[0029] To better illustrate how to use the pick arm to insert / place the IC package into the IC socket for IC package testing, Figure 6 A view of another exemplary IC testing arrangement 600 is shown, which includes a contactor module 602 and a pick arm 604 coupled to a turret platform 606. The pick arm 604 is configured to insert / place an IC package onto an IC socket 608. The contactor alignment kit is not shown mounted / embedded onto the contactor module 602 to facilitate better viewing of the pick arm 604. However, it should be understood that the contactor alignment kit (e.g., Figure 5A and Figure 5B The contactor alignment kit 506 in FIG. 6 is part of the IC test arrangement 600 and will be mounted / embedded onto the contactor module 602 during IC package testing to hold the turret platform 606 in the slot associated with the contactor alignment kit.

[0030] Figure 7 A flow chart of an exemplary method 700 for testing an integrated circuit (IC) package is shown. The method 700 may be used Figure 1AAt 702, a device (e.g., Figure 1A The contactor alignment kit 104 in the embodiment of the present invention is placed on the contactor module (e.g., Figure 1A The device includes a body and arms extending from the body in a first direction, the arms and the body being shaped to provide a turret platform (e.g., Figure 1A In some examples, the device can be implemented as Figure 2A and Figure 2B The contactor alignment kit 200 of claim 1, wherein the arms include a first arm and a second arm, and wherein the first arm is positioned above the second arm. In other examples, the apparatus may be implemented as Figure 3A and Figure 3B The contactor alignment kit 300 of claim 1, wherein the arms further include a third arm and a fourth arm, and wherein the third arm is positioned above the fourth arm. Figure 3A and Figure 3B In the example of the contactor alignment kit 300 in , the first arm and the third arm have a lower surface on a first plane, and the first arm and the third arm are separated by a gap having a first distance. In addition, in such an example, the second arm and the fourth arm have an upper surface on a second plane, and the second arm and the fourth arm are separated by a gap having a second distance.

[0031] The device further includes a tube extending from the body in a second direction, wherein the tubes surround the guide pins of the contactor module. At 704, the contactor module is positioned so that a portion of the turret platform fills the slot. The contactor module is positioned so that the turret platform extends to the surface of the body in the slot. At 706, the IC package is inserted into the IC socket on the contactor module by a pick-up arm coupled to the turret platform. In some examples, the positioning of the contactor module keeps the turret platform and the IC socket of the contactor module in a fixed relationship.

[0032] The described embodiments may be modified and other embodiments are possible within the scope of the claims.

Claims

1. A device for a contactor module, comprising: a body having a surface shaped to contact a first surface of the turret platform; a first arm extending from the body in a first direction, the first arm being shaped to contact a second surface of the turret platform; a second arm extending from the body in the first direction, and the second arm is shaped to contact a third surface of the turret platform, wherein the second surface and the third surface of the turret platform are opposing surfaces, and the first surface of the turret platform extends between the second surface and the third surface of the turret platform; as well as A tube extends from the body in a second direction, the tube being shaped to receive a guide pin of the contactor module.

2. The device of claim 1, wherein the first arm is positioned above the second arm.

3. The apparatus of claim 2, wherein a height of the first surface of the turret platform is equal to a distance between the first arm and the second arm.

4. The device according to claim 1, further comprising: a third arm extending from the body in the first direction, the third arm being shaped to contact the second surface of the turret platform; as well as A fourth arm extends from the body in the first direction, the fourth arm being configured to contact the third surface of the turret platform.

5. The device of claim 4, wherein the third arm is positioned above the fourth arm.

6. The apparatus of claim 5, wherein a height of the first surface of the turret platform is equal to a distance between the third arm and the fourth arm.

7. The device according to claim 4, wherein the first arm and the third arm have lower surfaces on one plane, and wherein the first arm and the third arm are separated by a gap including a certain distance.

8. The device of claim 7, wherein the distance is a first distance and the plane is a first plane, the second arm and the fourth arm have upper surfaces on a second plane, and the second arm and the fourth arm are separated by a gap comprising a second distance.

9. The apparatus of claim 8, wherein the first distance and the second distance are the same.

10. The device of claim 1, wherein the tube comprises first and second spaced-apart tubes. The device of claim 1 , wherein the first direction and the second direction are perpendicular.

12. The device of claim 1, wherein the device is a clamp.

13. A method for testing an integrated circuit (IC) package, the method comprising: A device is mounted on the contactor module, the device comprising: main body; an arm extending from the body in a first direction, the arm and body being shaped to provide a slot for a turret platform; and a tube extending from the body in a second direction, wherein the tube surrounds a guide pin of the contactor module; positioning the contactor module such that a portion of the turret platform fills the slot; and An IC package is inserted into an IC socket on the contactor module by a pick arm coupled to the turret platform.

14. The method of claim 13, wherein the positioning maintains the turret platform and the IC socket of the contactor module in a fixed relationship.

15. The method of claim 13, wherein the contactor module is positioned such that the turret platform extends within the slot to a surface of the body.

16. The method of claim 13, wherein the arm comprises a first arm and a second arm, wherein the first arm is positioned above the second arm.

17. The method of claim 16, wherein the arm further comprises a third arm and a fourth arm, wherein the third arm is positioned above the fourth arm.

18. The method of claim 17, wherein the first arm and the third arm have lower surfaces that are on one plane, and wherein the first arm and the third arm are separated by a gap that includes a certain distance.

19. The method of claim 18, wherein the distance is a first distance and the plane is a first plane, the second arm and the fourth arm have upper surfaces on a second plane, and wherein the second arm and the fourth arm are separated by a gap comprising a second distance.

20. The method of claim 13, wherein the groove is a mortise.