Processing method of flexible electrode

Abstract

The invention discloses a processing method of a flexible electrode, the flexible electrode comprises a flexible substrate and at least one conductive phase, the conductive phase is divided into a plurality of sub conductive phases, and the processing method comprises the following steps: selecting the flexible substrate according to the flexible electrode to be processed and formed; classifying the multiple sections of sub-conductive phases according to the preset characteristics corresponding to each section of sub-conductive phase; and according to the preset characteristics, processing each sub-conductive phase on the flexible substrate in sequence by adopting a corresponding preset processing mode to obtain the conductive phase. Therefore, the electrode performance of the flexible electrode can be improved.

Description

Technical Field

[0001] The present disclosure generally relates to the field of electrode preparation technology, and specifically relates to a processing method for a flexible electrode. Background Art

[0002] Flexible electrodes refer to conductive electrodes made on flexible materials or ductile plastics or thin metal substrates. Flexible electrodes can be bent, stretched, and deformed to a certain extent, and they can still stably transmit electrical energy in the deformed state. With the rapid development of biotechnology today, flexible electrodes play an important role in wearable devices that measure central nervous system currents, cardiac currents, or biological fluid signals. These flexible electrodes implanted in the brain, heart, or subcutaneously need to have not only a certain degree of flexibility but also a certain degree of biocompatibility.

[0003] Generally speaking, a flexible electrode includes a conductive phase and a flexible substrate, and the conductive phase is processed on the flexible substrate to form a flexible electrode. The current processing methods of flexible electrodes mainly include micro-electro-mechanical system (MEMS) processing technology, screen printing, inkjet printing and other technologies. For example, the MEMS processing technology usually uses silicon-based materials as the substrate, flexible polymers as the substrate, and metals as electrodes to form flexible electrodes; screen printing usually prints the conductive phase on processed sheets of polyethylene terephthalate (PET), polycarbonate (PC), polyimide (PI) and other plastic materials to form flexible electrodes.

[0004] At present, flexible electrodes are basically processed by a single technology, and the electrode performance of flexible electrodes processed by a single technology is relatively low. For example, the Chinese invention patent with patent application number CN200710046237.3 and invention name "A method for preparing an implantable double-sided flexible microarray electrode" mentioned the use of MEMS processing technology to make stimulation electrodes for brain-computer interfaces; another example is Abbott, a company that produces continuous blood glucose monitoring systems, whose instant sensing products use screen printing technology to make implantable electrodes. Summary of the invention

[0005] The present disclosure is proposed in view of the above-mentioned situation, and its object is to provide a method for processing a flexible electrode that can improve the performance of the electrode.

[0006] To this end, the present disclosure provides a processing method for a flexible electrode, wherein the flexible electrode comprises a flexible substrate and at least one conductive phase, wherein the conductive phase is divided into multiple sub-conductive phases, and the processing method comprises: selecting the flexible substrate according to the flexible electrode to be processed and formed; classifying the multiple sub-conductive phases according to corresponding preset features of each sub-conductive phase; and processing each sub-conductive phase on the flexible substrate in sequence according to the preset features using a corresponding preset processing method to obtain the conductive phase.

[0007] In the present disclosure, since the conductive phase of the flexible electrode to be processed and formed needs to have different characteristics in different parts, the conductive phase of the flexible electrode is divided into multiple sub-conductive phases, and each sub-conductive phase is processed by a corresponding processing method according to the corresponding characteristics of each sub-conductive phase, which can make the characteristics of each sub-conductive phase more significant, thereby improving the electrode performance of the flexible electrode.

[0008] In addition, in the processing method of the flexible electrode involved in the present disclosure, optionally, the flexible electrode is a continuous blood glucose test electrode, the conductive phase of the continuous blood glucose test electrode is a working electrode, a reference electrode or a counter electrode, and the flexible substrate of the continuous blood glucose test electrode is one of polyethylene terephthalate, polycarbonate or polyimide. In this case, the polyethylene terephthalate material has good compatibility with biological tissues and can reduce the occurrence of allergic reactions or other side effects on the skin; the polycarbonate material has a smooth surface and can effectively reduce the growth of bacteria; the polyimide material is stable in a wide temperature range and can extend the life of the continuous blood glucose test electrode.

[0009] In addition, in the processing method of the flexible electrode involved in the present disclosure, optionally, the preset feature is bending, and after selecting one of the polyethylene terephthalate, the polycarbonate or the polyimide as the flexible substrate of the continuous blood glucose test electrode, each conductive phase of the continuous blood glucose test electrode is divided into two sub-conductive phases, and the two sub-conductive phases are classified according to the preset feature. In this case, it is helpful to select a suitable processing method to process the two sub-conductive phases of the continuous blood glucose test electrode.

[0010] In addition, in the processing method of the flexible electrode involved in the present disclosure, optionally, after the two sections of the sub-conductive phases of the working electrode, the reference electrode or the counter electrode are classified according to the preset characteristics, an activation layer containing a laser activator is made on the front and back sides of the flexible substrate of the continuous blood glucose test electrode using inkjet printing or extrusion molding technology. In this case, the activation layer can cover the surface of the flexible substrate of the continuous blood glucose test electrode, which is beneficial to improve the service life of the continuous blood glucose test electrode and can improve the conductivity of the continuous blood glucose test electrode. At the same time, the activation layer can improve the smoothness and stability of the surface of the flexible substrate of the continuous blood glucose test electrode and can facilitate the subsequent use of a laser mechanism to make a sub-conductive phase of a predetermined pattern.

[0011] In addition, in the processing method of the flexible electrode involved in the present disclosure, optionally, after the activation layer is made, a laser machine is used to carve out the first sub-conductive phase of the working electrode or the reference electrode in the activation layer on the front side of the flexible substrate of the continuous blood glucose test electrode, and then the laser machine is used to carve out the first sub-conductive phase of the counter electrode in the activation layer on the back side of the flexible substrate of the continuous blood glucose test electrode; and the second sub-conductive phase of the continuous blood glucose test electrode is processed by screen printing. In this case, since the first sub-conductive phase of the continuous blood glucose test electrode needs to be bent, compared with the method of printing carbon paste, the sub-conductive phase made by a laser machine can reduce the cracking of the first sub-conductive phase of the continuous blood glucose test electrode after bending; and the second sub-conductive phase of the continuous blood glucose test electrode does not need to be bent, and the processing method of screen printing can reduce the processing cost.

[0012] In addition, in the processing method of the flexible electrode involved in the present disclosure, optionally, the flexible electrode is a flexible stimulation electrode, the conductive phase of the flexible stimulation electrode is a plurality of stimulation electrodes, and the flexible substrate of the flexible stimulation electrode is a double-polished silicon wafer. In this case, the double-polished silicon wafer has good conductivity and relatively stable electrical characteristics, which can be conducive to the manufacture of flexible stimulation electrodes.

[0013] In addition, in the processing method of the flexible electrode involved in the present disclosure, optionally, the preset feature is that it has both biocompatibility and flexibility or the conductivity is greater than 1400 micro-Siemens per centimeter. After selecting the double-polished silicon wafer as the flexible substrate of the flexible stimulation electrode, each conductive phase of the flexible stimulation electrode is divided into two sub-conductive phases, and the two sub-conductive phases are classified according to the preset feature. In this case, it is helpful to select a suitable processing method to process the two sub-conductive phases of the flexible stimulation electrode.

[0014] In addition, in the processing method of the flexible electrode involved in the present disclosure, optionally, after the two sub-conductive phases are classified according to the preset characteristics, the first sub-conductive phase of the flexible stimulation electrode is processed by micro-electromechanical processing; and the second sub-conductive phase of the flexible stimulation electrode is processed by inkjet printing. In this case, the micro-electromechanical processing can produce high-precision and flexible sub-conductive phases, and the produced sub-conductive phases have thinner lines and can have good biocompatibility; the inkjet printing process is simple, and the inkjet printing can produce sub-conductive phases with larger patterns and good conductivity to the external circuit.

[0015] In addition, in the processing method of the flexible electrode involved in the present disclosure, optionally, the sub-conductive phases are electrically connected by partially overlapping and connecting. In this case, the conductivity between the sub-conductive phases processed by different processing methods at the connection can be improved, thereby enabling the conductive phase of the flexible electrode to have good conductivity.

[0016] In addition, in the processing method of the flexible electrode involved in the present disclosure, optionally, the preset processing method is a micro-electromechanical processing process, screen printing, inkjet printing, electroplating, mold interconnection equipment process or laser direct forming process. In this case, according to the corresponding preset characteristics of each sub-conductive phase, the corresponding processing method can be selected to adapt to the characteristics of each sub-conductive phase, thereby obtaining a flexible electrode with higher electrode performance.

[0017] According to the present disclosure, a method for processing a flexible electrode capable of improving electrode performance is provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present disclosure will now be explained in further detail by way of example only with reference to the accompanying drawings, in which:

[0019] Figure 1 is a flow chart showing a method for processing a flexible electrode according to an example of the present disclosure.

[0020] Figure 2 is a flow chart showing a method for manufacturing a continuous blood glucose monitoring electrode according to an example of the present disclosure.

[0021] Figure 3 1 is a side view showing the continuous blood glucose monitoring electrode according to the example of the present disclosure after processing.

[0022] Figure 4 1 is a flow chart showing the second sub-conductive phase of the continuous blood glucose monitoring electrode produced by screen printing according to an example of the present disclosure.

[0023] Figure 5 is a flow chart showing a method for processing a flexible stimulation electrode according to an example of the present disclosure.

[0024] Figure 6 is a flow chart showing the pre-processing of double-throw silicon wafers involved in the examples of the present disclosure.

[0025] Figure 7 1 is a side view showing the double-polished silicon wafer after pre-processing according to the example of the present disclosure is completed.

[0026] Figure 8 is a flow chart showing the first sub-conductive phase of processing a flexible stimulation electrode involved in the examples of the present disclosure.

[0027] Fig. 9 3 is a side view showing the first conductive phase of the flexible stimulation electrode involved in the example of the present disclosure after processing is completed.

[0028] Fig.10 is a flow chart showing the reprocessing of double-throw silicon wafers involved in an example of the present disclosure.

[0029] Fig.11 1 is a side view showing a double-polished silicon wafer according to an example of the present disclosure before etching.

[0030] Fig.12 is a side view showing the double-polished silicon wafer after reprocessing according to the example of the present disclosure is completed.

[0031] Fig.13 is a side view showing the flexible stimulation electrode involved in the example of the present disclosure after processing.

[0032] Description of reference numerals:

[0033] 10…continuous blood glucose test electrode, 110…flexible substrate of continuous blood glucose test electrode, 1110…activation layer, 120…working electrode, 1210…first sub-conductive phase of working electrode, 1220…second sub-conductive phase of working electrode, 1230…working electrode insulating layer, 130…reference electrode, 1310…first sub-conductive phase of reference electrode, 1320…second sub-conductive phase of reference electrode, 1330…silver-silver chloride reference electrode, 1340…reference electrode insulating layer, 140…counter electrode, 1410…first sub-conductive phase of counter electrode, 1420…counter electrode pad, 1430…counter electrode through hole, 1440…second sub-conductive phase of counter electrode, 1450…counter electrode insulating layer,

[0034] 20…flexible stimulation electrode, 210…double-polished silicon wafer, 2110…composite dielectric film, 220…aluminum film sacrificial layer, 2210…etching window, 230…polyimide base layer, 240…first metal layer, 2410…first protective layer, 250…polyimide base layer, 260…second metal layer, 2610…second protective layer, 270…polyimide insulating layer, 280…hard mask aluminum, 200…array flexible stimulation electrode. DETAILED DESCRIPTION

[0035] Hereinafter, the preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, the same symbols are assigned to the same components, and repeated descriptions are omitted. In addition, the accompanying drawings are only schematic diagrams, and the ratio of the dimensions of the components or the shapes of the components may be different from the actual ones.

[0036] It should be noted that the terms "including" and "having" and any variations thereof in the present disclosure, such as a process, method, system, product or device that includes or has a series of steps or units, are not necessarily limited to those steps or units clearly listed, but may include or have other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0037] In addition, the subheadings and the like involved in the following description of the present disclosure are not intended to limit the content or scope of the present disclosure, but are merely used as a reminder for reading. Such subheadings should neither be understood as being used to divide the content of the article, nor should the content under the subheading be limited to the scope of the subheading.

[0038] The present disclosure relates to a method for processing a flexible electrode, wherein the flexible electrode involved in the present disclosure may refer to an electrode in which a conductive electrode is made on a flexible material, a ductile plastic or a thin metal substrate. More specifically, the flexible electrode involved in the present disclosure may refer to an electrode in which a conductive phase capable of conducting electricity is made on a flexible substrate such as a flexible material, a ductile plastic or a thin metal substrate. In other words, in some examples, the flexible electrode may include a flexible substrate and a conductive phase.

[0039] In some examples, the flexible electrode may include at least one conductive phase. Specifically, the flexible electrode may include two, three or more conductive phases. In this case, the electrode performance of the flexible electrode can be enriched.

[0040] In some examples, the conductive phase can be divided into two or more sub-conductive phases. In this case, the conductive phase can be processed in sections and the flexible electrode can be more adaptable to the scene.

[0041] In some examples, multiple segments of a conductive phase can be distributed on the front side of the flexible substrate. In some examples, multiple segments of a conductive phase can be distributed on the back side of the flexible substrate. In this case, multiple segments of a conductive phase are distributed on the same side of the flexible substrate, which can facilitate electrical connectivity between the multiple segments of the conductive phase.

[0042] In some examples, multiple sub-conductive phases of a conductive phase can be distributed on both the front side and the back side of the flexible substrate. For example, when a conductive phase is divided into two sub-conductive phases, the first sub-conductive phase can be distributed on the front side of the flexible substrate, and the second sub-conductive phase can be distributed on the back side of the flexible substrate. In this case, the position of each sub-conductive phase on the flexible substrate can be more flexibly allocated, and it is helpful to reduce the impact between the sub-conductive phases when processing each sub-conductive phase.

[0043] In some examples, the flexible substrate may have a through hole. In some examples, the through hole may penetrate the front and back sides of the flexible substrate. In some examples, the sub-conductive phases distributed on the front side of the flexible substrate and the sub-conductive phases distributed on the back side of the flexible substrate in one conductive phase may be connected by a through hole to achieve electrical connectivity. In this case, it can be beneficial to facilitate electrical connectivity between sub-conductive phases distributed on different sides of the flexible substrate in one conductive phase.

[0044] In some examples, the flexible substrate may be perforated to obtain through holes.

[0045] In some examples, multiple conductive phases can be distributed on the front and back of the flexible substrate, respectively. More specifically, when the flexible electrode includes three conductive phases, each conductive phase is divided into two sub-conductive phases, the four sub-conductive phases of two conductive phases can be distributed on the front of the flexible substrate, the two sub-conductive phases of another conductive phase can be distributed on the back of the flexible substrate, or the first sub-conductive phase of another conductive phase can be distributed on the front of the flexible substrate and the second sub-conductive phase can be distributed on the back of the flexible substrate.

[0046] In some examples, sub-conductive phases of different conductive phases distributed on the same surface of the flexible substrate may be arranged in parallel. In this case, a relatively simple process can be used to reduce the influence between different conductive phases distributed on the same surface of the flexible substrate.

[0047] In some examples, sub-conductive phases of different conductive phases distributed on the same surface of the flexible substrate can be isolated by insulating materials and then stacked vertically. In this case, the conductive phase of the flexible substrate can be processed on a smaller flexible substrate, in other words, it can be helpful to reduce the surface area of ​​the flexible substrate; in particular, when the number of conductive phases included in the flexible electrode is large, it can be helpful to miniaturize the flexible electrode.

[0048] In some examples, the sub-conductive phases can be electrically connected by partially overlapping and connecting. In this case, the conductivity of the sub-conductive phases processed by different processing methods at the connection can be improved, thereby enabling the conductive phase of the flexible electrode to have good conductivity.

[0049] Hereinafter, the processing method of the flexible electrode involved in the present disclosure will be described in conjunction with the accompanying drawings.

[0050] Figure 1 is a flow chart showing a method for processing a flexible electrode according to an example of the present disclosure.

[0051] See also Figure 1 In this embodiment, the processing method of the flexible electrode may include: selecting a flexible substrate according to the flexible electrode to be processed and formed (step S10); classifying multiple sub-conductive phases according to the corresponding preset characteristics of each sub-conductive phase (step S20); and processing each sub-conductive phase on the flexible substrate in sequence according to the preset characteristics using the corresponding preset processing method to obtain a conductive phase (step S30). The order of step S10 and step S20 is not specific, for example, step S10 may be performed first and then step S20, or step S20 may be performed first and then step S10, or step S10 and step S20 may be performed simultaneously.

[0052] In the processing method of the flexible electrode involved in the present disclosure, since the conductive phase of the flexible electrode to be processed and formed needs to have different characteristics in different parts, the conductive phase of the flexible electrode is divided into multiple sub-conductive phases, and each sub-conductive phase is processed by a corresponding processing method according to the corresponding characteristics of each sub-conductive phase, which can make the characteristics of each sub-conductive phase more significant, thereby improving the electrode performance of the flexible electrode.

[0053] In some examples, in step S10, selecting a flexible substrate according to the flexible electrode to be processed and formed may refer to selecting a flexible substrate that matches the specific application requirements and actual manufacturing conditions of the flexible electrode to be processed and formed. For example, when the flexible electrode to be processed and formed is a continuous blood glucose test electrode, since the needle-shaped tip of the continuous blood glucose test electrode needs to penetrate the subcutaneous tissue, the flexible substrate of the continuous blood glucose test electrode needs to have certain flexibility and plasticity to ensure that the continuous blood glucose test electrode can adapt to the curve of the skin surface, and in order to reduce irritation and discomfort to the skin, the flexible substrate of the continuous blood glucose test electrode also needs to have certain softness and air permeability; for another example, when the flexible electrode to be processed and formed is a flexible stimulation electrode, since the flexible stimulation electrode needs to be distributed with many conductive phases, the flexible substrate of the flexible stimulation electrode needs to have certain flexibility and ductility.

[0054] In some examples, in step S20, the preset feature may be bending, biocompatibility, good conductivity, high precision, flexibility or easy processing. Specifically, the classification of multiple sub-conductive phases according to the corresponding preset features of each sub-conductive phase may mean that the conductive phase can be divided into a sub-conductive phase that needs to be bent, a sub-conductive phase that needs to have biocompatibility, a sub-conductive phase that needs to have good conductivity, a sub-conductive phase that needs to be made into high precision, a sub-conductive phase that needs to have flexibility or a sub-conductive phase that can be easily processed. In this case, it can be helpful to divide the conductive phase of the flexible electrode into multiple sub-conductive phases with different characteristics, and further, it can be helpful to select a suitable processing method according to the characteristics of each sub-conductive phase.

[0055] In some examples, good conductivity may mean that the conductivity of the sub-conductive phase is greater than 1400 microSiemens per centimeter.

[0056] In some examples, the corresponding preset features of each sub-conductive phase may not be single. In other words, each sub-conductive phase may have multiple preset features. For example, a sub-conductive phase may need to be both bendable and biocompatible, or a sub-conductive phase may need to be both biocompatible and flexible, or a sub-conductive phase may need to have good conductivity and be easy to process. In this case, it is helpful to more flexibly select a suitable processing method according to the characteristics of each sub-conductive phase.

[0057] In some examples, in step S30, the preset processing method can be micro-electromechanical processing, screen printing, inkjet printing, electroplating, mold interconnection equipment process or laser direct forming process. Specifically, after the conductive phase of the flexible electrode is divided into multiple sub-conductive phases, each sub-conductive phase can be processed according to the corresponding preset characteristics from a variety of processing methods such as micro-electromechanical processing, screen printing, inkjet printing, electroplating, mold interconnection equipment process or laser direct forming process. In this case, according to the corresponding preset characteristics of each sub-conductive phase, the corresponding processing method can be selected to adapt to the characteristics of each sub-conductive phase, thereby obtaining a flexible electrode with higher electrode performance.

[0058] Hereinafter, the continuous blood glucose test electrode is taken as Example 1 to explain in detail the processing method of the continuous blood glucose test electrode involved in the present disclosure.

[0059] Figure 2 1 is a flowchart showing a method for manufacturing the continuous blood glucose monitoring electrode 10 according to an example of the present disclosure. Figure 3 FIG. 1 is a side view showing the continuous blood glucose monitoring electrode 10 according to the example of the present disclosure after processing.

[0060] See also Figure 2In this embodiment, the continuous blood glucose test electrode 10 (its structure is shown in Figure 3 The processing method of the continuous blood glucose testing electrode (as shown) may include: selecting a flexible substrate 110 of the continuous blood glucose testing electrode according to the continuous blood glucose testing electrode 10 (step S110); dividing the conductive phase of the continuous blood glucose testing electrode 10 into two sub-conductive phases according to preset characteristics (step S120); pre-treating the flexible substrate 110 of the continuous blood glucose testing electrode (step S130); using a laser direct forming process to process the first sub-conductive phase of the continuous blood glucose testing electrode 10 (step S140); and using screen printing to process the second sub-conductive phase of the continuous blood glucose testing electrode 10 (step S150).

[0061] See also Figure 3 In some examples, the flexible electrode may be a continuous blood glucose testing electrode 10 .

[0062] In other examples, the flexible electrode may also be other biological electrodes, such as enzyme electrodes and antigen-antibody electrodes.

[0063] In some examples, in step S110, the flexible substrate 110 of the continuous blood glucose test electrode can be one of polyethylene terephthalate (PET), polycarbonate (PC) or polyimide (PI). In this case, the polyethylene terephthalate material has good compatibility with biological tissues and can reduce the occurrence of allergic reactions or other side effects on the skin; the polycarbonate material has a smooth surface and can effectively reduce the growth of bacteria; the polyimide material has stability in a wide temperature range and can extend the life of the continuous blood glucose test electrode 10.

[0064] See also Figure 3 In some examples, in step S120 , the conductive phase of the continuous glucose monitoring electrode 10 may be the working electrode 120 , the reference electrode 130 , or the counter electrode 140 .

[0065] In some examples, in step S120, the preset feature may be a bend. In some examples, after selecting one of polyethylene terephthalate, polycarbonate or polyimide as the flexible substrate 110 of the continuous blood glucose test electrode, each conductive phase of the continuous blood glucose test electrode 10 may be divided into two sub-conductive phases, specifically, the working electrode 120 may be divided into a first sub-conductive phase 1210 of the working electrode and a second sub-conductive phase 1220 of the working electrode, the reference electrode 130 may be divided into a first sub-conductive phase 1310 of the reference electrode and a second sub-conductive phase 1320 of the reference electrode, and the counter electrode 140 may be divided into a first sub-conductive phase 1410 of the counter electrode and a second sub-conductive phase 1440 of the counter electrode. In some examples, the two sub-conductive phases of the working electrode 120, the reference electrode 130 and the counter electrode 140 may be classified according to the preset features. In this case, it is helpful to select a suitable processing method to process the two sub-conductive phases of the continuous blood glucose test electrode 10.

[0066] In some examples, in step S130, pre-treating the flexible substrate 110 of the continuous glucose monitoring electrode may refer to using inkjet printing or extrusion molding technology to form an activation layer 1110 containing a laser activator on the front and back sides of the flexible substrate 110 of the continuous glucose monitoring electrode (see Figure 3 ). In this case, the activation layer 1110 can cover the surface of the flexible substrate 110 of the continuous blood glucose testing electrode, which is beneficial to improve the service life of the continuous blood glucose testing electrode 10 and can improve the conductivity of the continuous blood glucose testing electrode 10. At the same time, the activation layer 1110 can improve the smoothness and stability of the surface of the flexible substrate 110 of the continuous blood glucose testing electrode and can facilitate the subsequent use of a laser mechanism to make a predetermined pattern of sub-conductive phases.

[0067] In some examples, the thickness of the activation layer 1110 may be 10 microns to 50 microns, and specifically, may be 30 microns. It should be understood that, since there are many factors that are not convenient to maintain invariance during the process of making the activation layer 1110, the thickness of the activation layer 1110 being 30 microns may also mean that the thickness of the activation layer 1110 is about 30 microns.

[0068] In some examples, in step S140, the first sub-conductive phase of the continuous blood glucose testing electrode 10 can be formed by laser direct forming process on the flexible substrate 110 of the continuous blood glucose testing electrode. In this case, since the first sub-conductive phase of the continuous blood glucose testing electrode 10 needs to be bent, the metal sub-conductive phase formed by laser direct forming process can reduce the cracking of the conductive phase of the continuous blood glucose testing electrode 10 after bending.

[0069] See also Figure 3In some examples, in step S140, after the activation layer 1110 is made, a laser machine can be used to carve out the first sub-conductive phase 1210 of the working electrode 120 or the first sub-conductive phase 1310 of the reference electrode 130 on the activation layer 1110 on the front side of the flexible substrate 110 of the continuous blood glucose testing electrode, and then a laser machine can be used to carve out the first sub-conductive phase 1410 of the counter electrode 140 on the activation layer 1110 on the back side of the flexible substrate 110 of the continuous blood glucose testing electrode. In this case, since the first sub-conductive phase of the continuous blood glucose testing electrode 10 needs to be bent, compared with the method of printing carbon paste, the sub-conductive phase made by the laser machine can reduce the cracking of the conductive phase of the continuous blood glucose testing electrode 10 after bending.

[0070] In some examples, in step S140 , the first sub-conductive phase 1210 of the working electrode 120 and the first sub-conductive phase 1310 of the reference electrode 130 may be arranged in parallel on the front surface of the flexible substrate 110 of the continuous blood glucose monitoring electrode.

[0071] It should be understood that, since the first conductive sub-phase 1210 of the working electrode and the first conductive sub-phase 1310 of the reference electrode can be arranged in parallel, Figure 3 The first sub-conductive phase 1210 of the working electrode blocks the first sub-conductive phase 1310 of the reference electrode and fails to illustrate the first sub-conductive phase 1310 of the reference electrode.

[0072] In some examples, in step S140, the first sub-conductive phase of the continuous blood glucose testing electrode 10 is processed by the laser direct forming process, which specifically refers to inputting the pre-designed pattern of the first sub-conductive phase 1210 of the working electrode, the first sub-conductive phase 1310 of the reference electrode or the first sub-conductive phase 1410 of the counter electrode into the laser machine, first using the laser machine to carve out the pattern of the first sub-conductive phase 1210 of the working electrode and the first sub-conductive phase 1310 of the reference electrode on the front side of the flexible substrate 110 of the continuous blood glucose testing electrode, and then carving out the pattern of the first sub-conductive phase 1410 of the counter electrode on the back side of the flexible substrate 110 of the continuous blood glucose testing electrode.

[0073] See also Figure 3 In some examples, a counter electrode pad 1420 may be disposed on the front surface of the flexible substrate 110 of the continuous glucose monitoring electrode.

[0074] In some examples, in step S140, the flexible substrate 110 of the continuous glucose monitoring electrode may be punched to obtain the electrode through hole 1430. In some examples, the first conductive phase 1410 of the electrode may be connected to the electrode pad 1420 through the electrode through hole 1430 to achieve electrical communication.

[0075] In some examples, after step S140 and before step S150, the flexible substrate 110 of the continuous blood glucose testing electrode can be subjected to a first chemical plating, and then the flexible substrate 110 of the continuous blood glucose testing electrode can be rinsed for a first time with deionized water; then the flexible substrate 110 of the continuous blood glucose testing electrode can be subjected to a second chemical plating, and then the flexible substrate 110 of the continuous blood glucose testing electrode can be rinsed for a second time with deionized water, and then the flexible substrate 110 of the continuous blood glucose testing electrode can be placed in an oven for drying using a jig.

[0076] In some examples, the first chemical plating may refer to immersing the flexible substrate 110 of the continuous glucose monitoring electrode into a copper plating solution.

[0077] In some examples, the duration of the first electroless plating may be 30 minutes.

[0078] In some examples, the time for first rinsing the flexible substrate 110 of the continuous glucose monitoring electrode with deionized water may be 10 minutes.

[0079] In some examples, the second chemical plating may refer to immersing the flexible substrate 110 of the continuous glucose monitoring electrode into a gold plating or platinum plating solution.

[0080] In some examples, the duration of the second electroless plating may be 10 minutes.

[0081] In some examples, the time for rinsing the flexible substrate 110 of the continuous glucose monitoring electrode with deionized water for the second time may be 10 minutes.

[0082] In some examples, when the flexible substrate 110 of the continuous glucose monitoring electrode is placed in an oven for drying, the drying temperature may be 50 degrees Celsius and the drying time may be one hour.

[0083] In some examples, screen printing can be used to process the second conductive phase of the continuous blood glucose testing electrode 10. In this case, the second conductive phase of the continuous blood glucose testing electrode 10 does not need to be bent, and the use of screen printing can reduce processing costs.

[0084] Figure 4 1 is a flow chart showing the second sub-conductive phase of the continuous blood glucose monitoring electrode 10 produced by screen printing according to an example of the present disclosure.

[0085] See also Figure 4In this embodiment, the second sub-conductive phase of the continuous blood glucose test electrode 10 is processed by screen printing, which may include: printing the carbon slurry of the second sub-conductive phase 1220 of the working electrode on the front of the flexible substrate 110 of the continuous blood glucose test electrode (step S1510); printing the working electrode insulating layer 1230 on the second sub-conductive phase 1210 perpendicular to the working electrode (step S1520); printing the second sub-conductive phase of the reference electrode on the second sub-conductive phase 1210 perpendicular to the working electrode insulating layer 1230 The method comprises the following steps: printing a carbon paste of the second sub-conductive phase 1440 of the counter electrode on the reverse side of the flexible substrate 110 of the continuous blood glucose testing electrode (step S1550); printing a counter electrode insulating layer 1450 on the second sub-conductive phase 1440 perpendicular to the counter electrode (step S1560).

[0086] In some examples, in step S1510, when printing the second sub-conductive phase 1220 of the working electrode, it is important to connect the second sub-conductive phase 1220 of the working electrode with the first sub-conductive phase 1210 of the working electrode. Specifically, the second sub-conductive phase 1220 of the working electrode can be connected to the first sub-conductive phase 1210 of the working electrode in a partially overlapping and connected manner. In this case, it is possible to facilitate electrical connectivity between the sub-conductive phases of the working electrode 120.

[0087] In some examples, in step S1520 , the working electrode insulating layer 1230 may protect the second sub-conductive phase 1220 of the working electrode.

[0088] In some examples, in step S1530, when printing the second sub-conductive phase 1320 of the reference electrode, it is important to connect the second sub-conductive phase 1320 of the reference electrode with the first sub-conductive phase 1310 of the reference electrode. Specifically, the second sub-conductive phase 1320 of the reference electrode can be connected to the first sub-conductive phase 1310 of the reference electrode in a manner of partially overlapping and connecting. In this case, it is possible to facilitate electrical connectivity between the sub-conductive phases of the reference electrode 130.

[0089] In some examples, in step S1540 , reference electrode insulating layer 1340 may protect second sub-conductive phase 1320 of the reference electrode and silver-silver chloride reference electrode 1330 .

[0090] In some examples, in step S1550, when printing the second sub-conductive phase 1440 of the counter electrode, it is important to connect the second sub-conductive phase 1440 of the counter electrode with the first sub-conductive phase 1410 of the counter electrode. Specifically, the second sub-conductive phase 1440 of the counter electrode can be connected to the first sub-conductive phase 1410 of the counter electrode in a partially overlapping and connected manner. In this case, it is possible to facilitate electrical connectivity between the sub-conductive phases of the counter electrode 140.

[0091] In some examples, in step S1560 , the counter electrode insulating layer 1450 may protect the second sub-conductive phase 1440 of the counter electrode.

[0092] Hereinafter, the processing method of the flexible stimulation electrode involved in the present disclosure will be described in detail by taking the flexible stimulation electrode as Example 2.

[0093] Figure 5 is a flow chart showing a method for processing a flexible stimulation electrode according to an example of the present disclosure.

[0094] See also Figure 5 In this embodiment, the processing method of the flexible stimulation electrode may include: selecting a flexible substrate according to the flexible stimulation electrode (step S210); dividing the conductive phase of the flexible stimulation electrode into two sub-conductive phases according to preset characteristics (step S220); pre-treating the flexible substrate of the flexible stimulation electrode (step S230); using micro-electromechanical machining technology to process the first sub-conductive phase of the flexible stimulation electrode (step S240); and using inkjet printing to process the second sub-conductive phase of the flexible stimulation electrode (step S250).

[0095] In some examples, the flexible electrode can be a flexible stimulation electrode. In some examples, the flexible stimulation electrode can be used to apply electrical stimulation to the brain.

[0096] In other examples, the flexible electrodes can also be artificial retinal stimulation electrodes and flexible electrodes in flexible wearable devices, etc.

[0097] In some examples, in step S210, the flexible substrate of the flexible stimulation electrode may be a double-polished silicon wafer. In this case, the double-polished silicon wafer has good electrical conductivity and relatively stable electrical characteristics, which can be beneficial for manufacturing the flexible stimulation electrode.

[0098] In some examples, in step S220, the conductive phase of the flexible stimulation electrode may be a plurality of stimulation electrodes. For example, the conductive phase of the flexible stimulation electrode may be 60 stimulation electrodes.

[0099] In some examples, in step S220, the preset feature may be both biocompatible and flexible or the conductivity may be greater than 1400 microSiemens per centimeter. In some examples, after selecting a double-polished silicon wafer as the flexible substrate of the flexible stimulation electrode, each conductive phase of the flexible stimulation electrode may be divided into two sub-conductive phases. In some examples, the two sub-conductive phases may be classified according to the preset features. In other words, the first sub-conductive phase of the flexible stimulation electrode may need to be both biocompatible and flexible, and the second sub-conductive phase of the flexible stimulation electrode may need to have a conductivity greater than 1400 microSiemens per centimeter. In this case, it is helpful to select a suitable processing method to process the two sub-conductive phases of the flexible stimulation electrode.

[0100] In some examples, the first sub-conductive phase of the flexible stimulation electrode can be divided into two groups and the two groups of first sub-conductive phases can be stacked in layers and distributed on the front side of the double-polished silicon wafer, and each group can include the first sub-conductive phases of 30 stimulation electrodes.

[0101] In some examples, the first sub-conductive phase of the flexible stimulation electrode can be manufactured using a micro-electromechanical machining process. In this case, the micro-electromechanical machining process can be used to manufacture a sub-conductive phase with high precision and flexibility, and the manufactured sub-conductive phase has thinner lines and better biocompatibility.

[0102] In some examples, the second sub-conductive phase of the flexible stimulation electrode can be produced by inkjet printing. In this case, the process of inkjet printing is simple, and inkjet printing can produce a sub-conductive phase with a larger pattern and good conductivity to the external circuit.

[0103] Figure 6 is a flow chart showing the pre-processing of the double-polished silicon wafer 210 involved in the example of the present disclosure. Figure 7 1 is a side view showing the double-polished silicon wafer 210 involved in the example of the present disclosure after pre-processing is completed.

[0104] See also Figure 6 In this embodiment, pre-processing the flexible substrate of the flexible stimulation electrode 20 (step S230) may include: forming a composite dielectric film 2110 on the front and back surfaces of the double-polished silicon wafer 210 (step S2310); making an aluminum film sacrificial layer 220 on the composite dielectric film 2110 on the front surface of the double-polished silicon wafer 210 (step S2320); and making a polyimide base layer 230 on the aluminum film sacrificial layer 220 (step S2330).

[0105] See also Figure 7In some examples, in step S2310, forming the composite dielectric film 2110 on the front and back surfaces of the double-polished silicon wafer 210 may refer to using FSI to clean the double-polished silicon wafer 210 to remove the natural oxide layer on the front and back surfaces of the double-polished silicon wafer 210, and then using an industrial standard wet cleaning process (RCA cleaning process) to further clean the double-polished silicon wafer 210, and then thermally oxidizing 1 micron silicon dioxide in a diffusion oxidation furnace, and then using a low pressure chemical vapor deposition (LPVCD) device to deposit 0.5 micron silicon nitride, and finally forming the composite dielectric film 2110. In this case, the contaminants on the surface of the double-polished silicon wafer 210 can be removed and the defects on the surface of the double-polished silicon wafer 210 can be reduced.

[0106] In some examples, in step S2320, forming an aluminum film sacrificial layer 220 on the composite dielectric film 2110 on the front side of the double-polished silicon wafer 210 may refer to forming an aluminum film sacrificial layer 220 of about 1 micron on the composite dielectric film 2110 on the front side of the double-polished silicon wafer 210 by sputtering or evaporation. In this case, the aluminum film sacrificial layer 220 can provide protection and support for subsequent processing.

[0107] In some examples, after step S2320 and before step S2330, AZ6130 photoresist may be firstly spin-coated on the aluminum film sacrificial layer 220 at a speed of 4000 rpm for 30 seconds, then baked at 100 degrees Celsius for 2 minutes, then exposed to ultraviolet light with a wavelength between 365 nanometers and 406 nanometers and including ig lines for 5 seconds, and after development, the aluminum film sacrificial layer 220 is hardened at 110 degrees Celsius for 2 minutes, and then the aluminum film sacrificial layer 220 is etched using aluminum etching solution or a metal etcher to form an etching window 2210, and finally the AZ6130 photoresist is removed by a wet method and the double-polished silicon wafer 210 is dried by a spin dryer. In this way, the patterning of the aluminum film sacrificial layer 220 can be completed.

[0108] In some examples, in step S2330, forming a polyimide base layer 230 on the aluminum film sacrificial layer 220 may refer to spin coating polyimide on the patterned aluminum film sacrificial layer 220 at a speed of 3000 rpm for 35 seconds to form a first layer of polyimide with a thickness of about 5 microns to 6 microns, and then drying at a temperature of 150 degrees Celsius for 3 minutes, and then baking the double-polished silicon wafer 210 in a vacuum nitrogen oven at a baking temperature of 350 degrees Celsius and a baking time of 0.5 to 1 hour to solidify the first layer of polyimide. In some examples, according to the required thickness of the polyimide base layer 230, multiple layers of polyimide may be repeatedly spin-coated to finally form the final polyimide base layer 230. In this way, a polyimide base layer 230 of a desired thickness can be produced.

[0109] In some examples, after the double-polished silicon wafer 210 is pre-processed, the first conductive phase of the flexible stimulation electrode 20 can be manufactured.

[0110] Figure 8 is a flow chart showing the first sub-conductive phase of processing the flexible stimulation electrode 20 involved in the example of the present disclosure. Fig. 9 1 is a side view showing the first conductive phase of the flexible stimulation electrode 20 according to the example of the present disclosure after processing is completed.

[0111] See also Figure 8 In this embodiment, processing the first conductive phase of the flexible stimulation electrode 20 (step S240) may include: making a first metal composite layer 240 on the polyimide base layer 230 (step S2410); making a polyimide matrix layer 250 on the polyimide base layer 230 and the first metal composite layer 240 (step S2420); and making a second metal composite layer 260 on the polyimide matrix layer 250 (step S2430).

[0112] See also Fig. 9 In some examples, in step S2410, making the first metal composite layer 240 on the polyimide base layer 230 specifically refers to coating a layer of negative reverse double-layer resist or positive reverse double-layer resist on the polyimide base layer 230, treating the surface of the resist with plasma after exposure and development, and then sputtering titanium particles with a size of 30 nanometers to 100 nanometers, gold particles with a size of 100 nanometers to 300 nanometers, and a titanium metal composite layer with a size of 30 nanometers to 100 nanometers, and then peeling to remove the resist on the surface of the polyimide base layer 230 and the metal sputtered on the resist, leaving the first metal composite layer 240. In this way, the first segment conductive phase of the first group of 30 stimulation electrodes of the flexible stimulation electrode 20 can be made.

[0113] In some examples, the first sub-conductive phases of the first group of 30 stimulation electrodes can be arranged in parallel.

[0114] See also Fig. 9 In some examples, in step S2420, forming the polyimide base layer 250 on the polyimide base layer 230 and the first metal composite layer 240 may specifically refer to spin coating polyimide on the polyimide base layer 230 and the first metal composite layer 240 at a speed of 3000 rpm for 35 seconds to form a polyimide base layer 250 having a thickness of about 5 microns to 6 microns, and then drying at a temperature of 150 degrees Celsius for 3 minutes, and then baking the double-polished silicon wafer at a temperature of 350 degrees Celsius in a vacuum nitrogen oven for 0.5 to 1 hour to solidify the polyimide base layer 250. In this way, the polyimide base layer 250 can be formed.

[0115] See also Fig. 9In some examples, in step S2430, making the second metal composite layer 260 on the polyimide base layer 250 specifically refers to coating a layer of negative reverse double-layer resist or positive reverse double-layer resist on the polyimide base layer 250, treating the surface of the resist with plasma after exposure and development, and then sputtering titanium particles with a size of 30 nanometers to 100 nanometers, gold particles with a size of 100 nanometers to 300 nanometers, and a titanium metal composite layer with a size of 30 nanometers to 100 nanometers, and then stripping to remove the resist on the surface of the polyimide base layer 250 and the metal sputtered on the resist, leaving the second metal composite layer 260. In this way, the first sub-conductive phase of the second group of 30 stimulation electrodes of the flexible stimulation electrode 20 can be manufactured.

[0116] In some examples, the first sub-conductive phases of the second set of 30 stimulation electrodes can be arranged in parallel.

[0117] In some examples, after step S240 and before step S250 , the double-polished silicon wafer 210 may be reprocessed.

[0118] Fig.10 is a flow chart showing the reprocessing of the double-throw silicon wafer 210 involved in the example of the present disclosure. Fig.11 FIG. 1 is a side view of a double-polished silicon wafer 210 according to an example of the present disclosure before etching. Fig.12 2 is a side view showing the double-polished silicon wafer 210 involved in the example of the present disclosure after reprocessing is completed.

[0119] See also Fig.10 In this embodiment, reprocessing the double-polished silicon wafer 210 may include: forming a polyimide insulating layer 270 on the polyimide base layer 250 and the second metal composite layer 260 (step S2440); forming a layer of hard mask aluminum 280 on the polyimide insulating layer 270 (step S2450); etching the double-polished silicon wafer 210 to expose the connection between the sub-conductive phases (step S2460); and removing the aluminum film sacrificial layer 220 and the hard mask aluminum 280 (step S2470).

[0120] See also Fig.11 In some examples, in step S2440, forming a polyimide insulating layer 270 on the polyimide base layer 250 and the second metal composite layer 260 may specifically refer to spin coating polyimide on the polyimide base layer 250 and the second metal composite layer 260 at a rotation speed of 3000 rpm for 35 seconds to form a polyimide insulating layer 270 with a thickness of about 5 microns to 6 microns, and then drying it at a temperature of 150 degrees Celsius for 3 minutes, and then baking the double-polished silicon wafer 210 in a vacuum nitrogen oven at a baking temperature of 350 degrees Celsius and a baking time of 0.5 to 1 hour to solidify the polyimide insulating layer 270.

[0121] See also Fig.11 In some examples, in step S2450 , forming a layer of hard mask aluminum 280 on the polyimide insulating layer 270 may refer to sputtering or evaporating a layer of hard mask aluminum 280 with a thickness of 1 micrometer on the polyimide insulating layer 270 .

[0122] See also Fig.12 In some examples, in step S2460, etching the double-polished silicon wafer 210 to expose the connection of the sub-conductive phase can specifically refer to spin-coating a positive photoresist on the composite dielectric film 2110 on the back side of the double-polished silicon wafer 210, and using a double-sided exposure machine to expose, to form an etching pattern after development, and using an ICP etcher to etch the composite dielectric film 2110 on the back side of the double-polished silicon wafer 210 to form a deep groove etching opening; using a silicon deep groove etcher to etch the double-polished silicon wafer 210 to the composite dielectric film 2110 on the back side of the double-polished silicon wafer 210, stop, and use the ICP etcher again to etch the composite dielectric film 2110 on the front side of the double-polished silicon wafer 210 to expose the polyamide The polyimide base layer 230 is etched by a RIE etcher to expose the connection between the sub-conductive phases of the first group of 30 stimulation electrodes of the first metal composite layer 240; a positive photoresist is spin-coated on the hard mask aluminum 280, and an aluminum etching pattern is formed on the hard mask aluminum 280 after exposure and development, and the hard mask aluminum 280 is etched by a RIE etcher to pattern the hard mask aluminum 280, and the polyimide insulating layer 270 and the polyimide matrix layer 250 are etched by a RIE etcher on the sample with the dry etching pattern to expose the connection between the sub-conductive phases of the second group of 30 stimulation electrodes of the second metal composite layer 260.

[0123] In some examples, in step S2470, removing the aluminum film sacrificial layer 220 and the hard mask aluminum 280 may refer to etching the double-polished silicon wafer 210 with an aluminum etching solution, and the aluminum film sacrificial layer 220 and the hard mask aluminum 280 on the double-polished silicon wafer 210 may be etched away. It should be understood that since the aluminum film sacrificial layer 220 is located between the composite dielectric film 2110 and the polyimide base layer 230 on the front side of the double-polished silicon wafer 210, when the aluminum film sacrificial layer 220 is removed, the portion below the composite dielectric film 2110 on the front side of the double-polished silicon wafer 210 can be separated from the portion above the polyimide base layer 230. Thus, the array flexible stimulation electrode 200 can be formed.

[0124] In some examples, after step S2470, the array flexible stimulation electrode 200 may be immersed and cleaned in deionized water for 3 times, each time for 5 minutes, and then the array flexible stimulation electrode 200 may be dried at a temperature of 50 degrees Celsius for 1 hour.

[0125] In some examples, the second conductive phase of the flexible stimulation electrode 20 may be processed by reprocessing the double-polished silicon wafer 210 .

[0126] In some examples, the second segments of the flexible stimulation electrode 20 can be divided into two groups and the two groups of second segments of the conductive phase can be distributed on the front and back sides of the array flexible stimulation electrode 200, and each group can include 30 second segments of the conductive phase of the stimulation electrode.

[0127] Fig.13 is a side view showing the flexible stimulation electrode 20 involved in the example of the present disclosure after processing.

[0128] In some examples, in step S250, processing the second segment conductive phase of the flexible stimulation electrode 20 may specifically refer to placing the array flexible stimulation electrode 200 on an inkjet printer platform, printing a second segment conductive phase connected to the first segment conductive phase of the second group of 30 stimulation electrodes on the second metal composite layer 260 on the polyimide insulating layer 270, and then placing the array flexible stimulation electrode 200 in an oven at 100 degrees Celsius for 10 to 30 minutes, then spraying a second protective layer 2610 on the surface of the second segment conductive phase of the second group of 30 stimulation electrodes on the second metal composite layer 260, and then placing the array flexible stimulation electrode 200 in an oven at 100 degrees Celsius for 10 to 30 minutes. The flexible stimulation electrode array 200 is then placed on the inkjet printer platform, and the second sub-conductive phase connected to the first sub-conductive phase of the first group of 30 stimulation electrodes on the first metal composite layer 240 is printed on the reverse side of the polyimide base layer 230, and then the flexible stimulation electrode array 200 is placed in a 100 degree Celsius oven for 10 to 30 minutes, and then the first protective layer 2410 is sprayed on the surface of the second sub-conductive phase of the first group of 30 stimulation electrodes on the first metal composite layer 240, and then the flexible stimulation electrode array 200 is placed in a 100 degree Celsius oven for 10 to 30 minutes. In this way, the second sub-conductive phase of the flexible stimulation electrode 20 can be manufactured.

[0129] In some examples, the second conductive phase of the flexible stimulation electrode 20 may be a copper-based circuit or a silver-based circuit, etc. In this case, the second conductive phase of the flexible stimulation electrode 20 can have better conductivity with the external circuit.

[0130] Although the present disclosure is specifically described above in conjunction with the accompanying drawings and examples, it is to be understood that the above description does not limit the present disclosure in any form. Those skilled in the art may modify and change the present disclosure as needed without departing from the essential spirit and scope of the present disclosure, and these modifications and changes all fall within the scope of the present disclosure.

Claims

1. A method for processing a flexible electrode, characterized in that: The flexible electrode comprises a flexible substrate and at least one conductive phase, wherein the conductive phase is divided into multiple sub-conductive phases, and the processing method comprises: Selecting the flexible substrate according to the flexible electrode to be processed and formed; Classifying the plurality of sub-conductive phases according to the corresponding preset features of each sub-conductive phase; According to the preset features, each section of the sub-conductive phase is processed sequentially on the flexible substrate using a corresponding preset processing method to obtain the conductive phase.

2. The method for processing a flexible electrode according to claim 1, characterized in that: The flexible electrode is a continuous blood glucose testing electrode, the conductive phase of the continuous blood glucose testing electrode is a working electrode, a reference electrode or a counter electrode, and the flexible substrate of the continuous blood glucose testing electrode is one of polyethylene terephthalate, polycarbonate or polyimide.

3. The method for processing a flexible electrode according to claim 2, characterized in that: The preset feature is bending. After selecting one of the polyethylene terephthalate, the polycarbonate or the polyimide as the flexible substrate of the continuous blood glucose testing electrode, each conductive phase of the continuous blood glucose testing electrode is divided into two sub-conductive phases, and the two sub-conductive phases are classified according to the preset feature.

4. The method for processing a flexible electrode according to claim 3, characterized in that: After the two conductive phases of the working electrode, the reference electrode or the counter electrode are classified according to the preset characteristics, an activation layer containing a laser activator is made on the front and back sides of the flexible substrate of the continuous blood glucose test electrode using inkjet printing or extrusion molding technology.

5. The method for processing a flexible electrode according to claim 4, characterized in that: After the activation layer is made, a laser machine is used to carve the first sub-conductive phase of the working electrode or the reference electrode on the activation layer on the front side of the flexible substrate of the continuous blood glucose testing electrode, and then the laser machine is used to carve the first sub-conductive phase of the counter electrode on the activation layer on the back side of the flexible substrate of the continuous blood glucose testing electrode; The second conductive phase of the continuous blood glucose testing electrode is processed by screen printing.

6. The method for processing a flexible electrode according to claim 1, characterized in that: The flexible electrode is a flexible stimulation electrode, the conductive phase of the flexible stimulation electrode is a plurality of stimulation electrodes, and the flexible substrate of the flexible stimulation electrode is a double-polished silicon wafer.

7. The method for processing a flexible electrode according to claim 6, characterized in that: The preset characteristics are that it is both biocompatible and flexible or has a conductivity greater than 1400 microSiemens per centimeter. After selecting the double-polished silicon wafer as the flexible substrate of the flexible stimulation electrode, each conductive phase of the flexible stimulation electrode is divided into two sub-conductive phases, and the two sub-conductive phases are classified according to the preset characteristics.

8. The method for processing a flexible electrode according to claim 7, characterized in that: After the two sub-conductive phases are classified according to the preset characteristics, the first sub-conductive phase of the flexible stimulation electrode is processed by micro-electromechanical machining technology; and the second sub-conductive phase of the flexible stimulation electrode is processed by inkjet printing.

9. The method for processing a flexible electrode according to claim 1, characterized in that: The sub-conductive phases are electrically connected in a manner of partially overlapping and connecting.

10. The method for processing a flexible electrode according to claim 1, characterized in that: The preset processing method is micro-electromechanical processing, screen printing, inkjet printing, electroplating, mold interconnection equipment process or laser direct forming process.

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