Alloy temperature fuse

Abstract

The alloy temperature fuse is made of alloy materials, and the alloy materials comprise tin, lead, bismuth, antimony and nickel. The weight percentage of tin is 62%-63.5%. And the weight percentage of lead is 36-37%. The weight percentage of bismuth is 0.03%-0.5%. And the weight percentage of antimony is 0.03%-0.3%. The weight percentage of nickel is 0.03%-0.3%. Through the special component proportion, the alloy temperature fuse is uniform in heating when being heated and higher in sensitivity to temperature change, so that the heat conduction effect of the alloy temperature fuse is improved. Therefore, the alloy temperature fuse can be quickly fused when being heated. Besides, the structure of the alloy temperature fuse is a long-strip-shaped alloy, and an insulating shell and other complex components are not arranged, so that heat conduction loss caused by various media is avoided, and the technical effect can be further improved.

Description

Technical Field

[0001] The invention relates to a temperature fuse, in particular to an alloy temperature fuse. Background Art

[0002] Generally speaking, a cartridge thermal fuse inserts one of its pins into a circuit board, then performs wave soldering and fixes the fuse body to the location of a heating device or other components that are prone to heating (such as pins). In this way, the cartridge thermal fuse can be set between the protected circuit and the power supply network. However, the cartridge thermal fuse still has many disadvantages that need to be improved.

[0003] For example, the alloy material part of the box-type thermal fuse is easy to melt due to reaching the melting point during wave soldering, so that it loses its protection function in advance. Similarly, the box-type thermal fuse has an insulating shell and other complex components, which is easy to cause heat loss due to multiple media.

[0004] In addition, during the installation of the cartridge thermal fuse, the user needs to perform at least one shaping step on the alloy material part of the cartridge thermal fuse, and the pins of the cartridge thermal fuse connected to the circuit board need to be insulated. In addition, the distance between the pins and the circuit board also needs to be further adjusted, which may also require another shaping step. Furthermore, the cartridge thermal fuse also needs to be fixed to the circuit board by adhesive. The above factors increase the complexity of the installation of the cartridge thermal fuse. Summary of the invention

[0005] According to one embodiment of the present invention, an alloy temperature fuse is provided. The alloy temperature fuse is made of an alloy material, and the alloy material includes tin, lead, bismuth, antimony and nickel. The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%.

[0006] In one embodiment, the weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel.

[0007] In one embodiment, the sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth.

[0008] In one embodiment, the specific gravity of the alloy material is between 7 and 8.

[0009] In one embodiment, the alloy material further comprises copper, silver and zinc, wherein the weight percentage of copper is 0.0001% to 0.05%, the weight percentage of silver is 0.0001% to 0.05%, and the weight percentage of zinc is 0.001% to 0.002%.

[0010] In one embodiment, the alloy material further comprises iron and aluminum, wherein the weight percentage of iron is 0.0001% to 0.002%, and the weight percentage of aluminum is 0.0001% to 0.002%.

[0011] In one embodiment, the alloy material further comprises arsenic and cadmium, wherein the weight percentage of arsenic is 0.0001% to 0.002%, and the weight percentage of cadmium is 0.0001% to 0.002%.

[0012] In one embodiment, the weight percentage of any one of bismuth, antimony, and nickel is greater than the weight percentage of any one of copper, silver, zinc, iron, aluminum, arsenic, and cadmium.

[0013] In one embodiment, the weight percentage of copper is greater than the weight percentage of any of silver, zinc, iron, aluminum, arsenic, and cadmium.

[0014] In one embodiment, the weight percentage of silver is greater than the weight percentage of any of zinc, iron, aluminum, arsenic, and cadmium.

[0015] As described above, the alloy temperature fuse according to the embodiment of the present invention may have one or more of the following advantages:

[0016] (1) In one embodiment of the present invention, the alloy temperature fuse is made of an alloy material, and the alloy material includes tin, lead, bismuth, antimony and nickel. The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth. Through the above-mentioned special component ratio, the alloy temperature fuse heats evenly when heated, and is more sensitive to temperature changes, so as to improve the thermal conductivity of the alloy temperature fuse. Therefore, the alloy temperature fuse can be quickly melted when heated. In addition, since the structure of the alloy temperature fuse is a long strip of alloy, there is no insulating shell and other complex components, so there will be no heat conduction loss due to multiple media, so that the above-mentioned technical effects can be further improved.

[0017] (2) In one embodiment of the present invention, the alloy temperature fuse can be directly soldered on a circuit board or a semi-finished product, so it will not be blown due to wave soldering and lose its protection function in advance. In this way, the reliability of the alloy temperature fuse can be greatly improved to ensure that the alloy temperature fuse can normally provide the temperature protection function. Therefore, the alloy temperature fuse can meet the needs of practical applications.

[0018] (3) In one embodiment of the present invention, the alloy temperature fuse is a long strip of alloy without an insulating shell and other complex components. The alloy temperature fuse does not need to be fixed to the circuit board by adhesive. In this way, the alloy temperature fuse can be installed using automated equipment, which greatly reduces the installation cost and complexity of the alloy temperature fuse. Therefore, the alloy temperature fuse can be used more widely and can meet the needs of different applications.

[0019] (4) In one embodiment of the present invention, the alloy temperature fuse is a long strip of alloy without an insulating shell and other complex components. Therefore, the size of the alloy temperature fuse can be very small and will not occupy the internal space of the device. Therefore, the device can be more miniaturized, which can not only reduce the manufacturing cost, but also save the transportation cost.

[0020] (5) In one embodiment of the present invention, the alloy temperature fuse has a special composition ratio. The special composition ratio enables the alloy temperature fuse to achieve excellent conduction performance. In this way, the alloy temperature fuse can not only provide temperature protection when the circuit board is overheated, but also provide temperature protection when the circuit board is overcurrent. Therefore, the safety of the alloy temperature fuse can be greatly improved.

[0021] (6) In one embodiment of the present invention, the alloy temperature fuse can achieve the desired effect under the premise of reducing costs. In this way, the practicality of the alloy temperature fuse can be greatly improved, and it can be applied to various electronic devices and improve the safety of these electronic devices. Therefore, the alloy temperature fuse can meet the trend of future development. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The first schematic diagram is a process of installing the alloy temperature fuse according to the first embodiment of the present invention.

[0023] Figure 2 This is a second schematic diagram of the installation process of the alloy temperature fuse according to the first embodiment of the present invention.

[0024] Figure 3 The third schematic diagram is a process of installing the alloy temperature fuse according to the first embodiment of the present invention.

[0025] Figure 4 The fourth schematic diagram is a process of installing the alloy temperature fuse according to the first embodiment of the present invention.

[0026] Figure 5 FIG. 4 is a flow chart of a method for installing an alloy temperature fuse according to a fifth embodiment of the present invention.

[0027] Description of reference numerals:

[0028] TS-alloy temperature fuse; MR-alloy material; LH-lamp holder; S51~S54-step process.

[0029] The detailed features and advantages of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable anyone skilled in the relevant art to understand the technical content of the present invention and implement it accordingly. Moreover, according to the contents, claims and drawings disclosed in this specification, any person skilled in the relevant art can easily understand the purposes and advantages of the present creation. DETAILED DESCRIPTION

[0030] The following will refer to the relevant drawings to illustrate the embodiments of the alloy temperature fuse according to the present invention. For the sake of clarity and convenience of the drawings, the components in the drawings may be exaggerated or reduced in size and proportion. In the following description and / or claims, when it is mentioned that a component is "connected" or "coupled" to another component, it may be directly connected or coupled to the other component or there may be an intervening component; and when it is mentioned that a component is "directly connected" or "directly coupled" to another component, there is no intervening component, and other words used to describe the relationship between components or layers should be interpreted in the same way. For ease of understanding, the same components in the following embodiments are illustrated with the same symbols.

[0031] See also Figure 1 , which is a first schematic diagram of the installation process of the alloy temperature fuse of the first embodiment of the present invention. As shown in the figure, the user can cut the alloy material MR into a suitable length through an automated device. In this embodiment, the alloy material MR is cut into a length that matches the lamp holder LH.

[0032] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse of this embodiment should still be included in the patent scope of the present invention.

[0033] See also Figure 2 , which is a second schematic diagram of the installation process of the alloy temperature fuse of the first embodiment of the present invention. As shown in the figure, the user can wave solder the circuit board MB (power supply or semi-finished product), and then use the general automatic soldering equipment to solder the alloy material MR to the pad of the circuit board MB.

[0034] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse of this embodiment should still be included in the patent scope of the present invention.

[0035] See also Figure 3, which is a third schematic diagram of the installation process of the alloy temperature fuse of the first embodiment of the present invention. As shown in the figure, the user can insert the alloy material MR into the pins of the lamp holder LH, and then rivet and cut off the excess part of the alloy material MR.

[0036] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse of this embodiment should still be included in the patent scope of the present invention.

[0037] See also Figure 4 , which is a fourth schematic diagram of the installation process of the alloy temperature fuse of the first embodiment of the present invention. As shown in the figure, the alloy material MR can then be used as the alloy temperature fuse TS to provide the function of temperature protection.

[0038] This embodiment discloses an alloy temperature fuse made of an alloy material MR. The alloy material includes tin (Sn), lead (Pb), bismuth (Bi), antimony (Sb) and nickel (Ni). The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth. For example, the weight percentage of tin is 63%; the weight percentage of lead is 36.5%; the weight percentage of bismuth is 0.2%; the weight percentage of antimony is 0.15%; the weight percentage of nickel is 0.15%. For example, the weight percentage of tin is 63.5%; the weight percentage of lead is 36.3%; the weight percentage of bismuth is 0.08%; the weight percentage of antimony is 0.07%; the weight percentage of nickel is 0.05%. For example, the weight percentage of tin is 63.5%; the weight percentage of lead is 36.3%; the weight percentage of bismuth is 0.09%; the weight percentage of antimony is 0.08%; the weight percentage of nickel is 0.03%. The specific gravity of the alloy material MR is between 7 and 8. The solid line temperature (Solidus temperature) of the alloy material MR is between 181° and 185°. The liquidus temperature (Liguidstemperature) of the alloy material MR is between 181° and 185°.

[0039] Through the above special component ratio, the alloy temperature fuse TS generates heat evenly when heated and is more sensitive to temperature changes, thereby improving the thermal conductivity of the alloy temperature fuse TS. Therefore, the alloy temperature fuse TS can be quickly melted when heated. In addition, since the structure of the alloy temperature fuse TS is a long strip of alloy, there is no insulating shell and other complex components, so there will be no heat conduction loss due to multiple media, so that the above technical effects can be further improved.

[0040] Furthermore, in this embodiment, the alloy temperature fuse TS can be directly soldered on the circuit board MB or the semi-finished product, so it will not be melted due to wave soldering and lose its protection function in advance. In this way, the reliability of the alloy temperature fuse TS can be greatly improved to ensure that the alloy temperature fuse TS can normally provide the temperature protection function. Therefore, the alloy temperature fuse TS can meet the needs of practical applications.

[0041] In addition, in this embodiment, since the alloy temperature fuse TS is a long strip of alloy, there is no insulating shell and other complex components. The alloy temperature fuse TS does not need to be fixed on the circuit board MB by adhesive. In this way, the alloy temperature fuse TS can be installed using automated equipment, which greatly reduces the installation cost and installation complexity of the alloy temperature fuse TS. Therefore, the application of the alloy temperature fuse TS can be more extensive and can meet the needs of different applications.

[0042] In addition, in this embodiment, the structure of the alloy temperature fuse TS is a long strip of alloy without an insulating shell and other complex components. Therefore, the size of the alloy temperature fuse TS can be very small and will not occupy the internal space of the device. Therefore, the device can be more miniaturized, which can not only reduce the manufacturing cost, but also save the transportation cost.

[0043] Furthermore, in this embodiment, the alloy temperature fuse TS has a special composition ratio. The special composition ratio enables the alloy temperature fuse TS to achieve excellent conduction performance. Thus, the alloy temperature fuse TS can not only provide temperature protection when the circuit board MB is overheated, but also provide temperature protection when the circuit board MB is overcurrent. Therefore, the safety of the alloy temperature fuse TS can be greatly improved.

[0044] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse of this embodiment should still be included in the patent scope of the present invention.

[0045] It is worth mentioning that the alloy material MR part of the box-type temperature fuse is easily melted due to reaching the melting point during wave soldering, which makes it lose its protection function in advance. Similarly, the box-type temperature fuse has an insulating shell and other complex components, which are easily caused by heat loss due to various media. In addition, during the installation of the box-type temperature fuse, the user needs to perform at least one shaping step on the alloy material MR part of the box-type temperature fuse, and the pins of the box-type temperature fuse connected to the circuit board need to be insulated. In addition, the distance between the above pins and the circuit board also needs to be further adjusted, which may also require another shaping step. Furthermore, the box-type temperature fuse also needs to be fixed to the circuit board by adhesive. The above factors increase the installation complexity of the box-type temperature fuse. In contrast, according to an embodiment of the present invention, the alloy temperature fuse TS is made of an alloy material MR, and the alloy material MR includes tin, lead, bismuth, antimony and nickel. The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth. Through the above-mentioned special component ratio, the alloy temperature fuse TS generates heat evenly when heated, and is more sensitive to temperature changes, so as to improve the thermal conductivity of the alloy temperature fuse TS. Therefore, the alloy temperature fuse TS can be quickly melted when heated. In addition, since the structure of the alloy temperature fuse TS is a long strip of alloy, there is no insulating shell and other complex components, so there will be no heat conduction loss due to multiple media, so that the above-mentioned technical effects can be further improved.

[0046] According to the embodiment of the present invention, the alloy temperature fuse TS can be directly welded on the circuit board or semi-finished product, so it will not be melted due to wave soldering and lose its protection function in advance. In this way, the reliability of the alloy temperature fuse TS can be greatly improved to ensure that the alloy temperature fuse TS can normally provide the temperature protection function. Therefore, the alloy temperature fuse TS can meet the needs of practical applications.

[0047] Furthermore, according to an embodiment of the present invention, the structure of the alloy temperature fuse TS is a long strip of alloy without an insulating shell and other complex components. The alloy temperature fuse TS does not need to be fixed on the circuit board by adhesive. In this way, the alloy temperature fuse TS can be installed using automated equipment, which greatly reduces the installation cost and installation complexity of the alloy temperature fuse TS. Therefore, the application of the alloy temperature fuse TS can be more extensive and can meet the needs of different applications.

[0048] In addition, according to the embodiment of the present invention, the structure of the alloy temperature fuse TS is a long strip of alloy without an insulating shell and other complex components. Therefore, the size of the alloy temperature fuse TS can be very small and will not occupy the internal space of the device. Therefore, the device can be more miniaturized, which can not only reduce the manufacturing cost, but also save the transportation cost.

[0049] In addition, according to the embodiment of the present invention, the alloy temperature fuse TS has a special composition ratio. The special composition ratio enables the alloy temperature fuse TS to achieve excellent conduction performance. In this way, the alloy temperature fuse TS can not only provide a temperature protection function when the circuit board is overheated, but also provide a temperature protection function when the circuit board is overcurrent. Therefore, the safety of the alloy temperature fuse TS can be greatly improved.

[0050] Furthermore, according to the embodiment of the present invention, the alloy temperature fuse TS can achieve the desired effect under the premise of reducing the cost. In this way, the practicality of the alloy temperature fuse TS can be greatly improved, and it can be applied to various electronic devices and improve the safety of these electronic devices. Therefore, the alloy temperature fuse TS can meet the trend of future development. From the above, it can be seen that the alloy temperature fuse TS according to the embodiment of the present invention can indeed achieve excellent technical effects.

[0051] The second embodiment of the present invention discloses that the alloy material MR of the alloy temperature fuse TS includes not only tin, lead, bismuth, antimony and nickel, but also copper (Cu), silver (Ag) and zinc (Zn). The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of copper is 0.0001% to 0.05%. The weight percentage of silver is 0.0001% to 0.05%. The weight percentage of zinc is 0.0001% to 0.002%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth.

[0052] For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.03%; the weight percentage of zinc is 0.001%. For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.029%; the weight percentage of zinc is 0.002%.

[0053] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse of this embodiment should still be included in the patent scope of the present invention.

[0054] The third embodiment of the present invention discloses that the alloy material MR of the alloy temperature fuse TS includes not only tin, lead, bismuth, antimony, nickel, copper, silver and zinc, but also iron (Fe) and aluminum (Al). The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of copper is 0.0001% to 0.05%. The weight percentage of silver is 0.0001% to 0.05%. The weight percentage of zinc is 0.0001% to 0.002%. The weight percentage of iron is 0.0001% to 0.002%. The weight percentage of aluminum is 0.0001% to 0.002%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth.

[0055] For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.028%; the weight percentage of zinc is 0.001%; ​​the weight percentage of iron is 0.001%; ​​the weight percentage of aluminum is 0.001%. For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.027%; the weight percentage of zinc is 0.002%; the weight percentage of iron is 0.001%; ​​the weight percentage of aluminum is 0.001%.

[0056] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse of this embodiment should still be included in the patent scope of the present invention.

[0057] The fourth embodiment of the present invention discloses that the alloy material MR of the alloy temperature fuse TS not only includes tin, lead, bismuth, antimony, nickel, copper, silver, zinc, iron and aluminum, but also includes arsenic (As) and cadmium (Cd). The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of copper is 0.0001% to 0.05%. The weight percentage of silver is 0.0001% to 0.05%. The weight percentage of zinc is 0.0001% to 0.002%. The weight percentage of iron is 0.0001% to 0.002%. The weight percentage of aluminum is 0.0001% to 0.002%. The weight percentage of arsenic is 0.0001% to 0.002%. The weight percentage of cadmium is 0.0001% to 0.002%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth. The weight percentage of copper is greater than the weight percentage of any one of silver, zinc, iron, aluminum, arsenic and cadmium. The weight percentage of silver is greater than the weight percentage of any one of zinc, iron, aluminum, arsenic and cadmium.

[0058] For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.026%; the weight percentage of zinc is 0.001%; ​​the weight percentage of iron is 0.001%; ​​the weight percentage of aluminum is 0.001%; ​​the weight percentage of arsenic is 0.001%; ​​and the weight percentage of cadmium is 0.001%. For example, the weight percentage of tin is 63.0012%; the weight percentage of lead is 36.9939%; the weight percentage of bismuth is 0.0013%; the weight percentage of antimony is 0.0009%; the weight percentage of nickel is 0.0009%; the weight percentage of copper is 0.0006%; the weight percentage of silver is 0.0005%; the weight percentage of zinc is 0.0001%; ​​the weight percentage of iron is 0.0003%; the weight percentage of aluminum is 0.0001%; ​​the weight percentage of arsenic is 0.0001%; ​​the weight percentage of cadmium is 0.0001%. The specific gravity of the alloy temperature fuse TS can be 7.41. The fixed line temperature of the alloy temperature fuse TS can be 183°. The liquidus temperature of the alloy temperature fuse TS can be 183°.

[0059] As mentioned above, the alloy temperature fuse TS has a special composition ratio. In this way, the alloy temperature fuse TS generates heat evenly when heated, and is more sensitive to temperature changes, so as to improve the thermal conductivity of the alloy temperature fuse TS. Therefore, the alloy temperature fuse TS can be quickly melted when heated. In addition, since the structure of the alloy temperature fuse TS is a long strip of alloy, there is no insulating shell and other complex components, so there will be no heat conduction loss due to multiple media, so that the above technical effects can be further improved.

[0060] The alloy temperature fuse TS can achieve the desired effect under the premise of reducing costs. In this way, the practicality of the alloy temperature fuse TS can be greatly improved, and it can be applied to various electronic devices and improve the safety of these electronic devices. Therefore, the alloy temperature fuse TS can meet the trend of future development.

[0061] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse of this embodiment should still be included in the patent scope of the present invention.

[0062] See also Figure 5 , which is a flow chart of the method for installing the alloy temperature fuse of the fifth embodiment of the present invention. As shown in the figure, the method for installing the alloy temperature fuse of this embodiment includes the following steps:

[0063] Step S51: Cut the alloy material MR into appropriate lengths.

[0064] Step S52: soldering the alloy material MR onto the soldering pad of the circuit board.

[0065] Step S53: inserting the alloy material MR into the pins of the lamp holder LH.

[0066] Step S54: perform riveting and trim off the excess portion of the alloy material MR.

[0067] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made according to the installation method of the alloy temperature fuse of this embodiment should still be included in the patent scope of the present invention.

[0068] Although the steps of the method described in the present invention are shown and described in a particular order, the order of operation of each method can be changed, and some steps can be performed in a reverse order, or some steps are also performed simultaneously with other steps. In another embodiment, different steps can be implemented in an intermittent and / or alternating manner.

[0069] In summary, according to an embodiment of the present invention, the alloy temperature fuse TS is made of an alloy material MR, and the alloy material MR includes tin, lead, bismuth, antimony and nickel. The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.03% to 0.5%. The weight percentage of antimony is 0.03% to 0.3%. The weight percentage of nickel is 0.03% to 0.3%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth. Through the above-mentioned special component ratio, the alloy temperature fuse TS heats evenly when heated, and is more sensitive to temperature changes, so as to improve the thermal conductivity of the alloy temperature fuse TS. Therefore, the alloy temperature fuse TS can be quickly melted when heated. In addition, since the structure of the alloy temperature fuse TS is a long strip alloy, there is no insulating shell and other complex components, so there will be no heat conduction loss due to multiple media, so that the above-mentioned technical effects can be further improved.

[0070] According to the embodiment of the present invention, the alloy temperature fuse TS can be directly welded on the circuit board or semi-finished product, so it will not be melted due to wave soldering and lose its protection function in advance. In this way, the reliability of the alloy temperature fuse TS can be greatly improved to ensure that the alloy temperature fuse TS can normally provide the temperature protection function. Therefore, the alloy temperature fuse TS can meet the needs of practical applications.

[0071] Furthermore, according to an embodiment of the present invention, the structure of the alloy temperature fuse TS is a long strip of alloy without an insulating shell and other complex components. The alloy temperature fuse TS does not need to be fixed on the circuit board by adhesive. In this way, the alloy temperature fuse TS can be installed using automated equipment, which greatly reduces the installation cost and installation complexity of the alloy temperature fuse TS. Therefore, the application of the alloy temperature fuse TS can be more extensive and can meet the needs of different applications.

[0072] In addition, according to the embodiment of the present invention, the structure of the alloy temperature fuse TS is a long strip of alloy without an insulating shell and other complex components. Therefore, the size of the alloy temperature fuse TS can be very small and will not occupy the internal space of the device. Therefore, the device can be more miniaturized, which can not only reduce the manufacturing cost, but also save the transportation cost.

[0073] In addition, according to the embodiment of the present invention, the alloy temperature fuse TS has a special composition ratio. The special composition ratio enables the alloy temperature fuse TS to achieve excellent conduction performance. In this way, the alloy temperature fuse TS can not only provide a temperature protection function when the circuit board is overheated, but also provide a temperature protection function when the circuit board is overcurrent. Therefore, the safety of the alloy temperature fuse TS can be greatly improved.

[0074] Furthermore, according to the embodiment of the present invention, the alloy temperature fuse TS can achieve the desired effect under the premise of reducing the cost. In this way, the practicality of the alloy temperature fuse TS can be greatly improved, and it can be applied to various electronic devices and improve the safety of these electronic devices. Therefore, the alloy temperature fuse TS can meet the trend of future development.

[0075] It should be noted that, although the above embodiments have been described in this article, the scope of patent protection of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, changes and modifications made to the embodiments described herein, or equivalent structures or equivalent process changes made using the contents of the present specification and drawings, directly or indirectly applying the above technical solutions to other related technical fields are all included in the scope of protection of the patent of the present invention.

Claims

1. An alloy temperature fuse, characterized in that: The alloy temperature fuse is made of an alloy material, which includes tin, lead, bismuth, antimony and nickel, wherein the weight percentage of the tin is 62% to 63.5%, the weight percentage of the lead is 36% to 37%, the weight percentage of the bismuth is 0.0001% to 0.5%, the weight percentage of the antimony is 0.0001% to 0.3%, and the weight percentage of the nickel is 0.0001% to 0.3%.

2. The alloy thermal fuse according to claim 1, characterized in that: The weight percentage of the bismuth is greater than the weight percentage of the antimony and the weight percentage of the nickel.

3. The alloy thermal fuse according to claim 1, characterized in that: The sum of the weight percentage of the antimony and the weight percentage of the nickel is greater than the weight percentage of the bismuth.

4. The alloy thermal fuse according to claim 1, characterized in that: The specific gravity of the alloy material is between 7 and 8.

5. The alloy thermal fuse according to claim 1, characterized in that: The alloy material also includes copper, silver and zinc. The weight percentage of copper is 0.0001% to 0.05%, the weight percentage of silver is 0.0001% to 0.05%, and the weight percentage of zinc is 0.0001% to 0.002%.

6. The alloy thermal fuse according to claim 5, characterized in that: The alloy material also includes iron and aluminum, the weight percentage of the iron is 0.0001% to 0.002%, and the weight percentage of the aluminum is 0.0001% to 0.002%.

7. The alloy thermal fuse according to claim 6, characterized in that: The alloy material also includes arsenic and cadmium. The weight percentage of the arsenic is 0.0001% to 0.002%, and the weight percentage of the cadmium is 0.0001% to 0.002%.

8. The alloy thermal fuse according to claim 7, characterized in that: The weight percentage of any one of the bismuth, the antimony, and the nickel is greater than the weight percentage of any one of the copper, the silver, the zinc, the iron, the aluminum, the arsenic, and the cadmium.

9. The alloy thermal fuse according to claim 8, characterized in that: The weight percentage of the copper is greater than the weight percentage of any one of the silver, the zinc, the iron, the aluminum, the arsenic, and the cadmium.

10. The alloy temperature fuse according to claim 9, characterized in that: The weight percentage of the silver is greater than the weight percentage of any one of the zinc, the iron, the aluminum, the arsenic, and the cadmium.

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