Vertical transition device from W-band waveguide to strip line

By introducing probe coupling and metallized vias into the multi-layer composite substrate, the vertical transition from the W-band waveguide to the strip line is achieved, which solves the problem of low electromagnetic wave leakage and integration in the prior art, and achieves low loss transmission and Design of high-integration circuits.

CN119108783APending Publication Date: 2024-12-10SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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Patent Information

Application Number
CN202411500397.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-25
Publication Date
2024-12-10

AI Technical Summary

Technical Problem

The transition structure of the existing W-band waveguide to the microstrip line lacks closed characteristics, resulting in electromagnetic wave energy leakage and system performance degradation, and the degree of integration is not high, making it not suitable for miniaturized designs.

Method used

Design a vertical transition device from W-band waveguide to stripline, by introducing probes in a multi-layer composite substrate to coupled to standard waveguides, and providing equally spaced metallized through holes on both sides of the stripline, forming equivalent metals Boundary, realizes low loss transmission and signal isolation of electromagnetic signals.

Benefits of technology

It realizes low loss transmission and signal isolation of W-band electromagnetic wave signals, supports miniaturized design and high-integration circuits, and improves system performance.

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Abstract

The invention discloses a vertical transition device from a W-band waveguide to a strip line, which belongs to the technical field of microwaves and comprises a multi-layer composite substrate, the strip line, a probe, a standard waveguide port and a metalized through hole. The multi-layer composite substrate comprises a plurality of metal layers and media, and the metal layers and the media are arranged in an up-and-down staggered mode. The strip line is positioned between the first layer of medium and the second layer of medium in the multi-layer composite substrate; one end of the strip line is located at the edge of the composite substrate, the other end of the strip line is connected with the probe, and two rows of metalized through holes are formed in the two sides in the direction parallel to the strip line; the metalized through holes located at the two sides of the strip line are arranged at equal intervals to realize an equivalent metal boundary, so that the signal isolation is improved while the electromagnetic signal transmission is ensured; and the metalized through holes are punched from the first layer to the bottommost layer in the multi-layer composite substrate. The W-band high-integration-level waveguide structure is applied to the design of a W-band high-integration-level circuit, and vertical transition from the waveguide to the strip line is achieved by introducing the probe into the multi-layer composite substrate to be coupled to the standard waveguide.
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Description

Technical Field

[0001] The present invention relates to the field of microwave technology, and more specifically to a vertical transition device from a W-band waveguide to a stripline. Background Art

[0002] With the continuous advancement of electronic information technology, as part of the "atmospheric window", the W-band (75-110GHz) exhibits relatively low-loss transmission characteristics in atmospheric transmission. It also has the advantages of wide bandwidth, high precision, narrow beam, and strong anti-interference ability. It has broad application potential in many fields such as communications, radar, and imaging. However, due to the increase in frequency, the corresponding wavelength is only about 3mm. Existing W-band applications mostly use hybrid integration processes, and the corresponding equipment is large in size and low in integration. In order to achieve higher-density integrated integration, it is necessary to design a variety of transition structures to connect different functional modules.

[0003] Currently, the most common W-band transition is the waveguide-microstrip line transition, which is mostly used in hybrid integrated circuits and is relatively mature. It mainly includes the following two types:

[0004] 1) Waveguide probe transition. This transition method is to extend a section of microstrip line into the waveguide transmission cavity, and achieve the transition from the waveguide cavity to the microstrip line by adjusting the short-circuit distance of the waveguide and the probe size of the microstrip line. It is currently only used in hybrid integrated circuits.

[0005] 2) Fin line transition. This transition method is to place the surface metal copper in the shape of a fin line short circuit, and the bottom layer is a soft substrate with all copper removed, placed on the waveguide transmission slot. The waveguide is short-circuited, and the transition from waveguide to microstrip line can be achieved by adjusting the fin line size. It is currently only used in hybrid integrated circuits.

[0006] However, since this transition structure does not have a closed characteristic, electromagnetic wave energy leaks and is easily affected by environmental interference, resulting in reduced system performance and low integration, which is not conducive to miniaturized design. Summary of the invention

[0007] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a vertical transition device from a W-band waveguide to a stripline, which is applied to the design of a W-band highly integrated circuit. By introducing a probe coupling to a standard waveguide (e.g., a 3mm waveguide) in a multi-layer composite substrate, a vertical transition from a waveguide to a stripline can be achieved.

[0008] The object of the present invention is achieved through the following solutions:

[0009] A vertical transition device from a W-band waveguide to a stripline, comprising:

[0010] Multilayer composite substrates, strip lines, probes, standard waveguide ports and metallized through holes;

[0011] The multi-layer composite substrate comprises a plurality of metal layers and dielectrics, and the plurality of metal layers and dielectrics are arranged in an alternating manner up and down; the strip line is located between a first dielectric layer and a second dielectric layer in the multi-layer composite substrate; one end of the strip line is located at an edge of the composite substrate, and the other end is connected to a probe, and two rows of metallized through holes are provided on both sides in a direction parallel to the strip line; the metallized through holes located on both sides of the strip line are arranged at equal intervals to realize an equivalent metal boundary, thereby ensuring electromagnetic signal transmission while improving signal isolation; the metallized through hole is drilled from the first layer to the bottom layer in the multi-layer composite substrate.

[0012] Furthermore, the hole wall of the metallized through hole is metallized by a PCB process.

[0013] Furthermore, the probe is a rectangular metal sheet located in a metal layer under a first dielectric layer in a multi-layer composite substrate.

[0014] Furthermore, the size of the probe can be determined by simulation matching.

[0015] Furthermore, each metal layer in the multi-layer composite substrate is etched downward from the center of the probe according to the standard waveguide size to form a rectangular cavity, in which the multi-layer dielectrics are retained.

[0016] Furthermore, the size of the rectangular cavity is a rectangular cavity of 2.54 mm×1.27 mm.

[0017] Furthermore, a row of metallized through holes are distributed at equal intervals around the standard waveguide opening, and the rectangular cavity obtained by etching and the metallized through holes form a metal waveguide cavity.

[0018] Furthermore, one side of the standard waveguide port is connected to the probe, and the other side is located at the bottom layer of the composite substrate.

[0019] Furthermore, the transmission direction of the W-band signal includes: input through one end of the stripline, and the electromagnetic signal propagates along the stripline, the probe, and the standard waveguide port.

[0020] Furthermore, the transmission direction of the W-band signal includes: input through one end of the stripline, the electromagnetic signal propagates along the direction of the standard waveguide port, the probe, and the stripline, thereby realizing a vertical transition of the W-band electromagnetic signal waveguide to the stripline.

[0021] The beneficial effects of the present invention include:

[0022] (1) The present invention has a simple structure and realizes low-loss transmission of W-band electromagnetic wave signals from waveguide to stripline.

[0023] (2) The present invention realizes a miniaturized design, which can help realize the signal interconnection between the packaged on-chip system and the composite substrate, thereby realizing circuit integration and miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 This is a schematic structural diagram of a vertical transition device from a W-band waveguide to a stripline according to an embodiment of the present invention;

[0026] Figure 2 A schematic cross-sectional view of a vertical transition device from a W-band waveguide to a stripline according to an embodiment of the present invention;

[0027] Figure 3 A simulation model diagram of a vertical transition device from a W-band waveguide to a stripline according to an embodiment of the present invention;

[0028] Figure 4 This is a simulation result diagram of a vertical transition device from a W-band waveguide to a stripline according to an embodiment of the present invention;

[0029] In the figure, 1-multilayer composite substrate, 2-strip line, 3-probe, 4-standard waveguide port, 5-metallized through hole, 6-metal layer, 7-medium. DETAILED DESCRIPTION

[0030] All features disclosed in all embodiments in this specification, or steps in all methods or processes implicitly disclosed, except for mutually exclusive features and / or steps, can be combined and / or expanded or replaced in any manner.

[0031] The specific implementation process of the present invention is as follows:

[0032] like Figure 1 As shown, the present invention provides a vertical transition device from a W-band waveguide to a stripline, comprising: a multi-layer composite substrate 1, a stripline 2, a probe 3, a standard waveguide port 4 and a metallized through hole 5.

[0033] As a preferred method, establish a 3D electromagnetic simulation software HFSS Figure 3 The vertical transition device model of W-band waveguide to stripline is shown in FIG. Figure 2As shown, in a specific embodiment of the transition model, the multilayer composite substrate 1 is composed of five metal layers 6 and four dielectric layers 7 arranged in an alternating manner; the selected dielectric is Taconic RF-30 with a thickness of 0.254 mm, and the metal layer 6 is a copper sheet with a thickness of 0.5 ounces; the stripline 2 is located between the first dielectric layer and the second dielectric layer in the multilayer composite substrate 1; one end of the stripline 2 is located at the edge of the composite substrate, and the other end is connected to the probe 3, and there are two rows of metallized through holes 5 on both sides in a direction parallel to the stripline 2; the metallized through holes 5 located on both sides of the stripline 2 are arranged at equal intervals to achieve equivalent metal boundaries, thereby ensuring electromagnetic signal transmission while improving signal isolation; the metallized through holes 5 are drilled from the first layer to the bottom layer in the multilayer composite substrate 1, and the hole walls are metallized using the PCB process.

[0034] As a preferred embodiment, the probe 3 is a rectangular metal sheet, which is located in the metal layer 6 under the first dielectric layer 7 in the multi-layer composite substrate 1; its size is determined by simulation matching.

[0035] As a preferred method, Figure 3 As shown, from the center of the probe 3 in the multi-layer composite substrate 1, each metal layer is etched downward according to the standard waveguide size to form a rectangular cavity with a size of 2.54mm×1.27mm, wherein the multi-layer dielectric is retained; a row of metallized through holes 5 are evenly spaced around the standard waveguide opening 4, and the etched rectangular cavity and the metallized through holes 5 form a metal waveguide cavity, i.e., the standard waveguide opening 4; as shown Figure 3 As shown, one side of the standard waveguide port 4 is connected to the probe 3, and the other side is located at the bottom layer of the composite substrate.

[0036] As a preferred method, Figure 3 The W-band waveguide to stripline vertical transition device simulation model shown in the figure is simulated in the full-wave simulation software HFSS. The S parameters are simulated at a simulation frequency of 75-110 GHz. The reflection coefficient (S 11 ) and insertion loss (S 21 ) The result is as follows Figure 4 as shown; Figure 4 As shown, the reflection coefficient of the transition structure is better than -10dB and the insertion loss is better than 2dB in the W-band range, achieving low-loss transition of W-band signals.

[0037] It should be noted that within the scope of protection defined in the claims of the present invention, the following embodiments can be combined and / or expanded or replaced in any logical way from the above specific implementation methods, such as disclosed technical principles, disclosed technical features or implicitly disclosed technical features.

[0038] Example 1

[0039] A vertical transition device from a W-band waveguide to a stripline, comprising:

[0040] Multilayer composite substrate 1, stripline 2, probe 3, standard waveguide port 4 and metallized through hole 5;

[0041] The multilayer composite substrate 1 includes multiple metal layers 6 and dielectrics 7, and the multiple metal layers 6 and dielectrics 7 are arranged alternately up and down; the strip line 2 is located between the first dielectric layer and the second dielectric layer in the multilayer composite substrate 1; one end of the strip line 2 is located at the edge of the composite substrate, and the other end is connected to the probe 3, and two rows of metallized through holes 5 are provided on both sides in a direction parallel to the strip line 2; the metallized through holes 5 located on both sides of the strip line 2 are arranged at equal intervals to achieve equivalent metal boundaries, thereby ensuring electromagnetic signal transmission while improving signal isolation; the metallized through holes 5 are drilled from the first layer to the bottom layer in the multilayer composite substrate 1.

[0042] Example 2

[0043] On the basis of Example 1, the hole wall of the metallized through hole 5 is metallized in the PCB process.

[0044] Example 3

[0045] On the basis of Example 1, the probe 3 is a rectangular metal sheet, which is located in the metal layer 6 under the first dielectric layer 7 in the multi-layer composite substrate 1 .

[0046] Example 4

[0047] Based on Example 3, the size of the probe 3 can be determined through simulation matching.

[0048] Example 5

[0049] On the basis of Example 1, each metal layer in the multi-layer composite substrate 1 is etched downward from the center of the probe 3 according to the standard waveguide size to form a rectangular cavity, in which the multi-layer dielectrics are retained.

[0050] Example 6

[0051] Based on Example 5, the size of the rectangular cavity is a rectangular cavity of 2.54 mm×1.27 mm.

[0052] Example 7

[0053] On the basis of Example 5, a row of metallized through holes 5 are distributed at equal intervals around the standard waveguide opening 4, and the rectangular cavity obtained by etching and the metallized through holes 5 form a metal waveguide cavity.

[0054] Example 8

[0055] On the basis of Example 1, one side of the standard waveguide port 4 is connected to the probe 3 , and the other side is located at the bottom layer of the composite substrate 1 .

[0056] Example 9

[0057] On the basis of Example 8, the transmission direction of the W-band signal includes: input through one end of the stripline 2, and the electromagnetic signal propagates along the stripline 2, the probe 3, and the standard waveguide port 4.

[0058] Example 10

[0059] On the basis of Example 8, the transmission direction of the W-band signal includes: input through one end of the stripline 2, the electromagnetic signal propagates along the direction of the standard waveguide port 4, the probe 3, and the stripline 2, thereby realizing the vertical transition of the W-band electromagnetic signal waveguide to the stripline.

[0060] The specific implementation of the present invention is not limited to the above-mentioned methods. The above description is only the preferred embodiment of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. It is possible for those skilled in the art to make various obvious changes, adjustments and substitutions without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may also include more other equivalent embodiments without departing from the principles and concepts of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A vertical transition device from a W-band waveguide to a stripline, characterized in that: include: A multilayer composite substrate (1), a strip line (2), a probe (3), a standard waveguide port (4) and a metallized through hole (5); The multi-layer composite substrate (1) comprises a plurality of metal layers (6) and a dielectric (7), wherein the plurality of metal layers (6) and the dielectric (7) are arranged in an alternating manner up and down; the strip line (2) is located between a first dielectric layer and a second dielectric layer in the multi-layer composite substrate (1); one end of the strip line (2) is located at an edge of the composite substrate, and the other end is connected to a probe (3), and two rows of metallized through holes (5) are provided on both sides in a direction parallel to the strip line (2); the metallized through holes (5) located on both sides of the strip line (2) are arranged at equal intervals to realize equivalent metal boundaries, thereby ensuring electromagnetic signal transmission while improving signal isolation; the metallized through holes (5) are drilled from the first layer to the bottom layer in the multi-layer composite substrate (1).

2. The vertical transition device from W-band waveguide to stripline according to claim 1, characterized in that: The hole wall of the metallized through hole (5) is metallized using the PCB process.

3. The vertical transition device from W-band waveguide to stripline according to claim 1, characterized in that: The probe (3) is a rectangular metal sheet, located in a metal layer (6) below a first layer of dielectric (7) in a multi-layer composite substrate (1).

4. The vertical transition device from W-band waveguide to stripline according to claim 3, characterized in that: The size of the probe (3) can be determined through simulation matching.

5. The vertical transition device from W-band waveguide to stripline according to claim 1, characterized in that: From the center of the probe (3) in the multi-layer composite substrate (1), each metal layer is etched downward according to the standard waveguide size to form a rectangular cavity, in which the multi-layer dielectrics are retained.

6. The vertical transition device from W-band waveguide to stripline according to claim 5, characterized in that: The size of the rectangular cavity is a rectangular cavity of 2.54 mm×1.27 mm.

7. The vertical transition device from W-band waveguide to stripline according to claim 5, characterized in that: A row of metallized through holes (5) are distributed at equal intervals around the standard waveguide opening (4), and the rectangular cavity obtained by etching and the metallized through holes (5) form a metal waveguide cavity.

8. The vertical transition device from W-band waveguide to stripline according to claim 1, characterized in that: One side of the standard waveguide port (4) is connected to the probe (3), and the other side is located at the bottom layer of the composite substrate (1).

9. The vertical transition device from W-band waveguide to stripline according to claim 8, characterized in that: The transmission direction of the W-band signal includes: input through one end of the strip line (2), and the electromagnetic signal propagates along the direction of the strip line (2), the probe (3), and the standard waveguide port (4).

10. The vertical transition device from W-band waveguide to stripline according to claim 8, characterized in that: The transmission direction of the W-band signal includes: input through one end of the strip line (2), the electromagnetic signal propagates along the direction of the standard waveguide port (4), the probe (3), and the strip line (2), thereby realizing a vertical transition from the W-band electromagnetic signal waveguide to the strip line.

Citation Information

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