75results about How to "Low loss transmission" patented technology

Optical to electrical and electrical to optical conversion assemblies provide precise and stable alignment, low loss, unperturbed electrical transmission and high thermal conductivity. Mechanically isolating the ceramic substrate of the conversion assembly relative to the surrounding structures enables good long-term optical alignment. Electrical transmission line connections to and from the optical conversion circuits on the ceramic substrates are made via flexible circuit board designs. The alignment of the components on the substrate relative to the plastic optics is thus preserved. The flexible circuit board includes a cross hatched ground layer, which relieves portions of the metallization below the signal layer and yet is able to maintain the desired transmission line properties. Electrical to optical conversion circuits are provided where the transmission of the electrical signals to the converter circuits is accomplished with minimal loss and with good signal integrity.

The invention discloses a micro-structured optical fiber surface plasmon resonance sensor, wherein a cladding layer is an annular cladding layer consisting of three concentric layers; the inner annular cladding layer consists of fan-shaped annular supporting arms (3) and inner layer air holes (2); the outer annular cladding layer consists of rectangular supporting arms (6) and outer layer liquid holes (5); the middle annular cladding layer is connected with the fan-shaped annular supporting arms (3) and the rectangular supporting arms (6); the number of both the fan-shaped annular supporting arms (3) and the rectangular supporting arms (6) is N; and the sensor has 360/No rotational symmetry. The fan-shaped annular supporting arms are used for adjusting coupling depth; and the spatial distribution of a fiber core fundamental mode is enabled to be gaussian. The operation wavelength of the sensor is at C+L wavelength; the spectral sensitivity within an analytic liquid refractive index range of 1.320-1.335 can reach over 10,000 nm RIU<1>, and the corresponding sensing resolution reaches the magnitude of 10<5> RIU; and the micro-structured optical fiber surface plasmon resonance sensor is suitable for high-accuracy real-time detection of liquid refractive index.

The invention belongs to the technical field of fiber optic laser light and provides an ultra-wideband supercontinuum source based on a two-waveband fiber optic laser. The ultra-wideband supercontinuum source comprises a first fiber optic laser, a second fiber optic laser, a wavelength division multiplexer, and a cascaded two-stage supercontinuum evolution assembly. The ultra-wideband supercontinuum source based on the two-waveband fiber optic laser is characterized in that two fiber optic lasers of different wavebands are adopted as seed sources to form the two-waveband fiber optic laser for simultaneously outputting two-waveband laser light, and the two-waveband laser light is used for pumping the cascaded evolution assembly. Specifically, when the two-waveband laser light passes through the first-stage evolution assembly, the laser light of one waveband is evolved into a visible light- near infrared supercontinuum, while the laser light of the other waveband is evolved into an ultrashort pulse, the visible light- near-infrared supercontinuum and the ultrashort pulse are coupled together to go into the second-stage evolution assembly, next, the ultrashort pulse is evolved into a near infrared-intermediate infrared supercontinuum in the second-stage evolution assembly, while the visible light- near-infrared supercontinuum generated in the previous stage is transmitted in the second-stage evolution assembly at low loss, and finally, an ultra-wideband supercontinuum covering three wavebands of visible light, near infrared and intermediate infrared is output from a cascaded optical fiber.

The invention discloses an electrically controlled micronano optical fiber optical switch based on a graphene thin film. The electrically controlled micronano optical fiber optical switch comprises a tapering light output micronano optical fiber, a tapering light input micronano optical fiber and a circuit control module based on the graphene thin film, wherein in the circuit control module based on the graphene thin film, a silicon base coated with the graphene thin film is used as a center; a metal electrode is arranged on the rim of the silicon base; the tapering light output micronano optical fiber and the tapering light input micronano optical fiber are oppositely arranged on the graphene silicon base; the ends of the two micronano optical fibers are adsorbed together by a van der Waals force, and serve as a coupling end of a light path; and ultraviolet photoresist with low refractive index is coated on the micronano optical fibers. On the basis of the property of graphene, the novel optical fiber optical switch has the characteristics of small size, short response time, low driving voltage and improved reliability by combining the evanescent wave characteristics of the micronano optical fibers.

The invention relates to transmission of broadband high-frequency signals, belongs to the field of electrical interconnection, and particularly to a high-frequency transmission based LTCC and PCB perpendicular interconnecting structure and method. The invention provides the perpendicular interconnecting structure and method for overcoming the problems existing in the prior art. The designed interconnecting structure is based on a ball grid array (BGA) welding structure, so that the miniaturization and high-density system integration can be promoted. The perpendicular interconnecting structure comprises an LTCC assembly, a PCB assembly and an interconnecting structure; ball-mounting welding on the bonding pad is carried out on the quasi coaxial structure of the second LTCC assembly; then the ball-mounted LTCC assembly is used as a device; next, the device is assembled on the PCB assembly by adopting a standard SMT process, so that the interconnection between the quasi coaxial structure of the second LTCC assembly and the coaxial structure in the first PCB assembly is realized through the solder ball; and the perpendicular interconnection between the LTCC assembly and the PCB assembly is realized.

A light energy collection and full reflecting light energy transmission system belongs to a solar energy collection and transmission device and comprises a concave collecting mirror, wherein the focal position of the concave collecting mirror is provided with a light energy density multiplier through a positioning bracket; the cylindrical light output end of the light energy density multiplier is connected with a full reflecting light transmission rod which is connected with a soft light transmission pipe; the light transmission pipe transmits light energy to using points; the light energy density multiplier is composed of a light energy density multiplication convex lens, a lens positioning body, a coat, a light transmission direction regulation convex lens or a light transmission regulation concave lens and a light transmission output end. The light energy collection and full reflecting light energy transmission system utilizes the full reflecting broadcasting principle of light in media to realize solar energy density multiplication and low-loss transmission of energy and expands the application field of the technology.

The invention discloses an implantable side-pumping coupling method. The implantable side-pumping coupling method is characterized by including a double-cladding active optical fiber and at least one multimode fiber, wherein the double-cladding active optical fiber is used for producing laser or amplifying the laser, and the multimode fiber is used for being connected with a pumping source. Pumping light is coupled into the double-cladding active optical fiber through the multimode fiber in the implantable side-pumping coupling method. The method includes the following steps: (1) carrying out pretreatment on the double-cladding active optical fiber and the multimode fiber respectively, (2) heating an area to be coupled in the double-cladding active optical fiber and implanting the multimode fiber into the double-cladding active optical fiber, and (3) encapsulating the implantation point after the area to be coupled cools down. Through the implantable side-pumping coupling method, pumping coupling efficiency is high, multipoint distributed pumping can be conveniently adopted, manufacturing process is simple, cost is low, and the method is particularly applicable to high-power fiber lasers high-power fiber amplifiers.

A plug-in connector for medical tubes is provided with a first plug-in part (10) and a second plug-in part (30), wherein the second plug-in part (30) extends around the first plug-in part (10) in the plugged-together state. The second plug-in part (30) has at least one forwardly protruding snap-in element (32), which has at its front end at least one inwardly protruding projection (34). The inwardly protruding projection is provided for meshing (engaging) with a complementary recess (14) in the outer surface of the first plug-in part (10) in order to thus hold the second plug-in part (30) fixed in the axial direction on the first plug-in part (10) due to the projection (34) meshing with the recess (14). Both plug-in parts (10,30) have a central passage opening (22, 24) each, wherein one plug-in part (10, 30) has an end area (16) expanding towards the outlet opening in a connection area (36) and the other plug-in part (10, 30) is connected to an elastic section (40), which is arranged in its interior and which protrudes into the connection area (36), so that the front end of the elastic section (40) is pressed into contact with the expanded end area (16) of the opposite plug-in part (10, 30). The projection (34) of the at least one snap-in element (32) maintains the second plug-in part (30) meshed with the first plug-in part (10), so that the elastic section (40) exerts a sealing function due to the pressure on the expanding end area (16).

The invention relates to an air-core polarization maintaining photonic crystal optical fiber. Along a circle of the inner wall of a glass tube, a plurality of micro capillaries are arranged to form a pore inner covering layer area, the peripheral part of the pore inner covering layer area and the contact part of the inner wall of the glass tube are fixed on the inner wall of the glass tube in a welding mode, the middle part of the pore inner covering layer area is a low refractive index fiber core I, namely a fiber core area, and the two sides of the fiber core area are low refractive index fiber cores II, namely seven-cell pores; the two sides in the fiber core area are gap areas which are enveloped by symmetrical fiber cores; or the upper side and the lower side in the fiber core area are symmetrically provided with convex areas which are enveloped by two fiber cores; or the two sides in the fiber core area are the gap areas which are enveloped by the fiber cores, and the upper side and the lower side in the fiber core area are symmetrically provided with the convex areas which are enveloped by the two fiber cores. The polarization maintaining performance, low-loss transmission and single-model advantages can be achieved, and the air-core polarization maintaining photonic crystal optical fiber has the advantages of being high in temperature stability, low in non-linear coefficient, low in magnetic field sensitivity, good in irradiation resistance and the like.

The invention provides a high-frequency low-loss adhesive-free flexible copper-clad plate. The high-frequency low-loss adhesive-free flexible copper-clad plate comprises two layers of copper foils arranged on the top layer and the bottom layer, fluororesin films formed on the surfaces of the inner sides of the two layers of copper foils respectively, and a PI film arranged between the upper fluororesin film and the lower fluororesin film. The fluororesin film is a film layer formed by coating a copper foil with a fluororesin coating liquid, and the thickness of the fluororesin film is 3-50 [mu] m; wherein the melting temperature of the fluororesin film is greater than or equal to 290 DEG C, the peel strength of the fluororesin film to the copper foil is greater than 1.0 kg/cm, and the peelstrength of the fluororesin film to the polyimide film is greater than 0.6 kg/cm; the thickness ratio of the fluororesin film to the PI film is 1: 4-2: 1; the dielectric constant of the copper-clad plate at the frequency of 20-40GHz is lower than 3.0, the dielectric loss is lower than 0.2%, the bending resistance is higher than 300,000 times, and the linear expansion coefficient is lower than 30ppm. According to the invention, the loss of high-frequency signals in the transmission process can be reduced.

The invention provides an asymmetric directional coupler which comprises a substrate, top silicon is arranged on the substrate and comprises a first port, a coupling area, a first output waveguide and a second output waveguide, one end of the coupling area is connected with the first port, and the other end of the coupling area is connected with the first output waveguide and the second output waveguide. The coupling area is covered with a phase change material layer, the coupling area is divided into N * M rectangular units, a non-periodic first punching array meeting a preset first output target is formed by adjusting the state of the rectangular units, and the first output target refers to the sum of the transmittance of the first output waveguide and the transmittance of the second output waveguide; the asymmetric directional coupler provided by the invention is small in size, easy to process, stable in performance and capable of realizing regulation and control of a light propagation path.

A radio frequency module includes: a first antenna connection terminal; a second antenna connection terminal different from the first antenna connection terminal; a first filter having a passband of a first frequency range including a first communication band allocated as a TDD communication band; a second filter having a passband of a second frequency range including a second communication band allocated as a TDD communication band; and a third filter having a passband of a third frequency range including a third communication band allocated as a TDD communication band. The third frequency range is located between the first frequency range and the second frequency range. The first and second filters are both connected to one of the first antenna connection terminal and the second antenna connection terminal. The third filter is connected to the other of the first antenna connection terminal and the second antenna connection terminal.

The invention discloses a silicon-based on-chip Fourier transform spectrometer with high resolution and a large measurement range. A to-be-measured light source is connected with an input waveguide; the output end of the input waveguide is connected with the input end of a 3dB power beam splitter; two ends of the 3dB beam splitter are respectively connected with one ends of multi-stage optical path selectors, and the two multi-stage optical path selectors are used as upper and lower interference arms; the output ends of the two multi-stage optical path selectors are connected with low-loss Euler spiral lines which have a specific length and is covered with metal electrodes; the other ends of the two low-loss spiral line waveguides are simultaneously input to the input end of the optical power beam combiner; and the output end of the optical power beam combiner is connected with the input end of the optical power detector to monitor the intensity of output optical signals. According tothe invention, the low-loss waveguide and the quasi-continuous thermal regulation waveguide are combined with a traditional on-chip Fourier spectrometer for the first time, and the silicon-based on-chip Fourier transform spectrometer can be used for biosensing, spectral measurement and other systems, and has the advantages of high resolution, large measurement range, high luminous flux, compact structure and the like.

The invention discloses a millimeter wave/light wave common caliber transmission device. The device comprises a millimeter wave signal source, a millimeter wave signal detecting device, a light wave signal source and a light wave signal detecting device. Light wave signals emitted by the light wave signal source are transmitted to a pattern place for transmission according to an optimal reflectingrule in a direction of an optimal emitting angle equal to an incident angle, and are detected by the light wave signal detecting device; millimeter wave signals sent by the millimeter wave signal source are transmitted to one side of a nonmetal surface of a substrate for transmittance; the resonant frequency of the pattern is selected; and after selection of the resonant frequency of the pattern,the millimeter wave signals are transmitted in a traditional transmitting direction in space, and are detected by the millimeter wave signal detecting device. The thickness of a medium substrate andthe thickness and the material of a plated metal film layer are measured through the size change of the pattern; the selective low-loss transmission of radio-frequency signals with specific frequencyis realized; and high-reflectivity transmission of infrared signals is realized.

The invention provides a high heat dissipation silicon-based package substrate, which includes a silicon base. A plurality of vertical through-holes are formed in the silicon base longitudinally, thevertical through-holes penetrate through the upper surface and the lower surface of the silicon base, electric and heat conducting columns are arranged in the vertical through-holes, both ends of theelectric and heat conducting columns are exposed to the upper surface and the lower surface of the silicon base, electrical isolation layers are arranged on the outer side walls of the electric and heat conducting columns, and the diameter range of the vertical through-holes is 50-200 [mu]m. The high heat dissipation silicon-based package substrate has the advantages of high heat dissipation module integration level, small volume, low cost, and being facilitated to application of a package structure. Furthermore, the invention further provides a manufacturing method of the high heat dissipation silicon-based package substrate and the package structure based on the manufacturing method.