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High-frequency transmission based LTCC and PCB perpendicular interconnecting structure and method

A high-frequency transmission and interconnection structure technology, which is applied in the direction of electrical connection of printed components, printed circuit components, printed circuits, etc., can solve the problems of long signal transmission distance, large loss, and large occupied space

Active Publication Date: 2016-10-12
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

In the past, box isolation and gold wire (or gold belt) cascading were used to achieve interconnection, but this interconnection method occupies a large space, the signal transmission distance is long, the loss is large, and it is not conducive to the application of high-frequency signals

Method used

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  • High-frequency transmission based LTCC and PCB perpendicular interconnecting structure and method
  • High-frequency transmission based LTCC and PCB perpendicular interconnecting structure and method
  • High-frequency transmission based LTCC and PCB perpendicular interconnecting structure and method

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specific Embodiment

[0059] according to figure 1 The signal transmission structure, detailed design of each parameter

[0060] LTCC upper surface microstrip line: conduction band width 0.42mm, conduction band thickness 0.01mm, dielectric thickness 0.336mm, dielectric relative permittivity 7.1.

[0061] The first LTCC component has a coaxial structure; the outer diameter of the inner conductor is 0.18mm, and the equivalent inner diameter of the outer conductor is 1.66mm (the specific distribution of the outer conductor is the grounding surface layer 0.83mm away from the center of the inner conductor and the center of the inner conductor as the axis, along the radius of 0.92mm) Cloth ￠0.18mm vertical solid ground metal hole), the relative dielectric constant of the medium is 7.1.

[0062] LTCC inner stripline: conduction band width 0.18mm, conduction band thickness 0.01mm, dielectric thickness 0.672mm, dielectric relative permittivity 7.1;

[0063] The coaxial structure part of the second LTCC co...

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Abstract

The invention relates to transmission of broadband high-frequency signals, belongs to the field of electrical interconnection, and particularly to a high-frequency transmission based LTCC and PCB perpendicular interconnecting structure and method. The invention provides the perpendicular interconnecting structure and method for overcoming the problems existing in the prior art. The designed interconnecting structure is based on a ball grid array (BGA) welding structure, so that the miniaturization and high-density system integration can be promoted. The perpendicular interconnecting structure comprises an LTCC assembly, a PCB assembly and an interconnecting structure; ball-mounting welding on the bonding pad is carried out on the quasi coaxial structure of the second LTCC assembly; then the ball-mounted LTCC assembly is used as a device; next, the device is assembled on the PCB assembly by adopting a standard SMT process, so that the interconnection between the quasi coaxial structure of the second LTCC assembly and the coaxial structure in the first PCB assembly is realized through the solder ball; and the perpendicular interconnection between the LTCC assembly and the PCB assembly is realized.

Description

technical field [0001] The invention relates to the transmission of broadband high-frequency signals (DC-35GHz), and belongs to the field of electrical interconnection, in particular to a vertical interconnection structure and method between LTCC and PCB based on high-frequency transmission. Background technique [0002] With the continuous maturity of Low Temperature Cofired Ceramics (LTCC) and Printed Circuit Board (PCB) technologies, driven by today's demand for miniaturization and multi-function products, the two There is an increasing demand for such components to achieve high-frequency, high-density interconnections on system-level products. In the past, box isolation and gold wire (or gold ribbon) cascading were used to achieve interconnection, but this interconnection method takes up a lot of space, has long signal transmission distances, and high loss, which is not conducive to the application of high-frequency signals. Contents of the invention [0003] The tech...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K1/02H05K3/34
CPCH05K1/025H05K1/111H05K3/341H05K3/3489H05K2201/09445H05K2201/10734H05K2203/041
Inventor 赵少伟张婧亮张继帆常义宽王庆兵
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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