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High-frequency low-loss adhesive-free flexible copper-clad plate and manufacturing method thereof

A production method and low-loss technology, applied in chemical instruments and methods, printed circuit manufacturing, circuit substrate materials, etc., can solve the problem of large linear expansion coefficient, no adhesion of polytetrafluoroethylene resin, and inability to apply flexible copper clad laminates And other issues

Active Publication Date: 2020-01-31
SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, in the printed circuit board (referred to as PCB) industry, polytetrafluoroethylene resin (referred to as PTFE) is usually used to obtain a lower dielectric constant to meet the requirements of the PCB industry for high-frequency signal transmission, but it requires ceramics, glass Reinforced with fiber cloth, it belongs to hard copper clad laminate, and PTFE resin has no adhesiveness, large linear expansion coefficient, and is not resistant to bending, so it cannot be used in the field of flexible copper clad laminate

Method used

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  • High-frequency low-loss adhesive-free flexible copper-clad plate and manufacturing method thereof
  • High-frequency low-loss adhesive-free flexible copper-clad plate and manufacturing method thereof
  • High-frequency low-loss adhesive-free flexible copper-clad plate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] Step 1, preparing fluororesin coating solution;

[0064] (1) Take 60kg of tetrafluoroethylene, 25kg of perfluoroethyl vinyl ether, 1.5kg of hydroxybutyl acrylate, and 3.5kg of vinyl acetate, and obtain fluororesin micropowder after emulsion polymerization and demulsification.

[0065] (2) Add 3% perfluorooctanoic acid, 5% polyperfluoroethylene ether, and 40% NMP to the fluororesin micropowder prepared in (1) above, stir at high speed for 2 hours, and disperse for 2 hours with a homogenizer to obtain fluorine Resin emulsion: Add 10% methyl ethyl ketone and 6% polyamic acid with a solid content of 10% according to the weight percentage of the fluororesin emulsion to dissolve, stir and disperse evenly to obtain a fluororesin coating liquid.

[0066] Step 2, making fluororesin composite material;

[0067] Apply the fluororesin coating solution prepared in step 1 evenly on the surface of 12μm copper foil, dry at a speed of 4m / min, and a temperature of 80-240°C, and wind it ...

Embodiment 2

[0071] Step 1, preparing fluororesin coating solution;

[0072] (1) Get 30kg of tetrafluoroethylene, 40kg of perfluoropropylene, 40kg of perfluoropropylene, 10kg of perfluoropropyl vinyl ether, 2kg of hydroxypropyl acrylate, and 1kg of vinyl acetate, and obtain fluororesin micropowder after emulsion polymerization and demulsification.

[0073] (2) Add 1% perfluorooctanoic acid, 1% polyperfluoroethylene ether, and 40% DMAC by weight percentage to the fluororesin micropowder prepared in the above (1), stir at high speed for 2 hours, and disperse for 2 hours with a homogenizer to obtain fluorine Resin emulsion: Add 5% methyl isobutyl ketone and 2% fluoropolyamic acid with a solid content of 10% according to the weight percentage of the fluororesin emulsion to dissolve, stir and disperse evenly to obtain a fluororesin coating liquid.

[0074] Step 2, making fluororesin composite material;

[0075] Apply the fluororesin coating solution prepared in step 1 evenly on the surface of ...

Embodiment 3

[0079] Step 1, preparing fluororesin coating solution;

[0080] (1) Get 80kg of perfluoropropylene, 50kg of perfluoropropyl vinyl ether and perfluoroethyl vinyl ether, 0.5kg of hydroxybutyl acrylate, and 5kg of vinyl acetate to obtain fluororesin micropowder after emulsion polymerization and demulsification.

[0081] (2) Add 5% ammonium perfluorooctanoate, 8% polyperfluoroethylene ether, and 50% DMF to the fluororesin micropowder prepared in the above (1) by weight percentage, stir at high speed for 2 hours, and disperse for 2 hours with a homogenizer to obtain Fluororesin emulsion; then add 30% acetone and 10% polyamic acid with a solid content of 10% according to the weight percentage of the fluororesin emulsion to dissolve, stir and disperse evenly to obtain a fluororesin coating liquid.

[0082] Step 2, making fluororesin composite material;

[0083] Apply the fluororesin coating solution prepared in step 1 evenly on the surface of 12μm copper foil, dry at a speed of 4m / m...

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Abstract

The invention provides a high-frequency low-loss adhesive-free flexible copper-clad plate. The high-frequency low-loss adhesive-free flexible copper-clad plate comprises two layers of copper foils arranged on the top layer and the bottom layer, fluororesin films formed on the surfaces of the inner sides of the two layers of copper foils respectively, and a PI film arranged between the upper fluororesin film and the lower fluororesin film. The fluororesin film is a film layer formed by coating a copper foil with a fluororesin coating liquid, and the thickness of the fluororesin film is 3-50 [mu] m; wherein the melting temperature of the fluororesin film is greater than or equal to 290 DEG C, the peel strength of the fluororesin film to the copper foil is greater than 1.0 kg / cm, and the peelstrength of the fluororesin film to the polyimide film is greater than 0.6 kg / cm; the thickness ratio of the fluororesin film to the PI film is 1: 4-2: 1; the dielectric constant of the copper-clad plate at the frequency of 20-40GHz is lower than 3.0, the dielectric loss is lower than 0.2%, the bending resistance is higher than 300,000 times, and the linear expansion coefficient is lower than 30ppm. According to the invention, the loss of high-frequency signals in the transmission process can be reduced.

Description

technical field [0001] The invention relates to the technical field of flexible printed circuit boards, in particular to a high-frequency, low-loss, glue-free flexible copper-clad laminate and a manufacturing method thereof. Background technique [0002] Flexible printed circuit board (FPC for short) is an indispensable material in electronic products, and is currently widely used in computers and their peripheral equipment, communication products and consumer electronics products. In recent years, with the rapid development of electronic information products, especially the commercial application of 5G communication, higher signal transmission speed and lower signal transmission loss are required, and flexible copper clad laminates with low dielectric constant and low Dielectric loss requirements. [0003] The dielectric constant of traditional flexible copper-clad laminates is usually 3.5-4.0, and the dielectric loss is about 2%. If it is applied to 5G communication, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B15/08B32B27/28B32B37/06B32B37/10B32B38/00B32B38/16C09D127/18C09D127/20C09D7/65C08F214/26C08F216/14C08F220/20C08F218/08C08F214/28H05K1/03H05K3/02
CPCB32B15/08B32B15/20B32B27/281B32B37/06B32B37/10B32B38/00B32B38/0008B32B38/164B32B2250/40B32B2255/06B32B2255/26B32B2307/546B32B2307/734B32B2311/12B32B2379/08B32B2457/08C08F214/265C08F214/285C08L2205/03C09D127/18C09D127/20C09D7/65H05K1/036H05K3/022C08L79/08C08L71/02C08F216/1408C08F220/20C08F218/08
Inventor 刘仁成高继亮谢文波黄道明
Owner SHENZHEN HONGHAI ELECTRON MATERIAL TECH CO LTD
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