Optical transceiver and optical line terminal

Abstract

The embodiment of the invention provides an optical transceiver and an optical line terminal.The optical transceiver comprises a packaging shell, a first optical transmitting module, an optical receiving module and a semiconductor optical amplification assembly, the first optical transmitting module, the optical receiving module and the semiconductor optical amplification assembly are located in the packaging shell, and an optical window is arranged at the front end of the packaging shell; the first light emitting module is used for emitting a first emitting light signal; the semiconductor light amplification assembly is used for amplifying the first emission light signal and then transmitting the amplified first emission light signal to the light window, and is also used for amplifying the incident light signal received by the light window and then transmitting the amplified incident light signal to the light receiving module. According to the semiconductor optical amplification assembly in the embodiment of the invention, bidirectional amplification of the incident optical signal of the emitted optical signal can be realized, the packaging size of multi-mode coexistence is effectively reduced, and meanwhile, the problem caused by optical energy loss of an optical line terminal (OLT) is solved.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to an optical transceiver and an optical line terminal. Background Art

[0002] Passive optical network (PON) technology is a point-to-multipoint fiber access technology. PON mainly includes an optical line terminal (OLT) located at the central office, an optical distribution network (ODN) and at least one optical network unit (ONU) or at least one optical network terminal (ONT) located at the user end. ODN provides an optical transmission channel between OLT and ONU. ODN includes passive devices such as optical fiber and passive optical splitters (Splitter).

[0003] With the development of various services, users have an increasing demand for bandwidth, and the PON system is constantly upgrading from Gigabit Passive Optical Network (GPON) to 10 Gigabit Passive Optical Network (10-Gigabit-Capable Passive Optical Network, 10G-PON, also known as XG-PON) and 10 Gigabit Symmetric Passive Optical Network (10GS-PON, also known as XG(S)-PON), and then to 50 Gigabit Passive Optical Network (50-Gigabit-Capable Passive Optical Network, 50G-PON). In order to achieve a smooth upgrade of PON, multiple modes of PON need to coexist, for example, GPON, XG(S)-PON and 50G-PON coexist. For the transmitter on the OLT side, it is necessary to integrate multiple laser transmitters with different wavelengths. How to reduce the package size of the multi-mode transmitter and solve the problem of optical energy loss of the optical line terminal OLT are the technical issues that need to be addressed at present. Summary of the invention

[0004] The embodiments of the present invention provide an optical transceiver and an optical line terminal, which can effectively reduce the package size of multiple modes and solve the problem of optical energy loss of the optical line terminal OLT.

[0005] In a first aspect, an embodiment of the present invention provides an optical transceiver device, comprising a packaging shell and a first optical transmitting module, an optical receiving module, and a semiconductor optical amplification component located in the packaging shell, wherein:

[0006] A light window is provided at the front end of the packaging shell;

[0007] The first optical transmission module is used to transmit a first transmission optical signal;

[0008] The semiconductor optical amplifier component is used to amplify the first emission optical signal and transmit it to the optical window, and is also used to amplify the incident optical signal received through the optical window and transmit it to the optical receiving module.

[0009] In a second aspect, an embodiment of the present invention provides an optical line terminal, comprising the optical transceiver device as described in any one of the first aspects above.

[0010] In an embodiment of the present invention, an optical transceiver device includes a package shell and a first optical transmitting module, an optical receiving module, and a semiconductor optical amplifier component located in the package shell. A light window is provided at the front end of the package shell, and the first optical transmitting module is used to transmit a first transmitted optical signal. The semiconductor optical amplifier component is used to amplify the first transmitted optical signal and transmit it to the optical window, and is also used to amplify the incident optical signal received through the optical window and transmit it to the optical receiving module. The semiconductor optical amplifier component in the embodiment of the present invention can effectively reduce the package size of multi-mode coexistence, and solve the problem of optical energy loss generated by the optical line terminal OLT. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

[0012] Figure 1 is a schematic diagram of the architecture of a PON system provided by an embodiment of the present invention;

[0013] Figure 2 is a structural schematic diagram of an optical transceiver provided in an embodiment of the present invention;

[0014] Figure 3 is a schematic structural diagram of a semiconductor optical amplifier component provided by an embodiment of the present invention;

[0015] Figure 4 is a structural schematic diagram of a wavelength division multiplexing module provided by an embodiment of the present invention;

[0016] Figure 5 is a structural schematic diagram of a first optical transmission module provided by an embodiment of the present invention;

[0017] Figure 6 is a structural schematic diagram of an optical receiving module provided by an embodiment of the present invention;

[0018] Figure 7 is a structural schematic diagram of a transmission drive component provided by an embodiment of the present invention;

[0019] Figure 8 is a schematic diagram of the first scenario structure of the optical transceiver provided by an embodiment of the present invention;

[0020] Fig. 9 is a schematic diagram of the second scenario structure of the optical transceiver provided by an embodiment of the present invention;

[0021] Fig.10 is a schematic diagram of the third scenario structure of the optical transceiver provided by an embodiment of the present invention;

[0022] Fig.11 It is a schematic diagram of the fourth scenario structure of the optical transceiver provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0024] It should be understood that in the description of the embodiments of the present invention, if there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the order of the indicated technical features. "At least one" means one or more, and "plurality" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent the existence of A alone, the existence of A and B at the same time, and the existence of B alone. Among them, A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following" and similar expressions refer to any group of these items, including any group of single or plural items. For example, at least one of a, b and c can represent: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, c can be single or multiple.

[0025] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0026] The following is an analysis of several terms involved in the present invention:

[0027] Passive Optical Network (PON): is a point-to-multipoint fiber optic transmission and access technology. It uses broadcast for downstream and time division multiple access for upstream. It can flexibly form tree, star, bus and other topological structures. It has the advantages of saving optical cable resources, sharing bandwidth resources, saving equipment room investment, fast network construction and low comprehensive network construction cost.

[0028] Optical Line Terminal (OLT): It is the core component of the optical access network, equivalent to the switch or router in the traditional communication network, and is also a multi-service provision platform. OLT is generally used to provide the optical fiber interface of the passive optical fiber network for users.

[0029] Optical Network Unit (ONU): It is divided into active optical network unit and passive optical network unit. Generally, the equipment equipped with optical receiver, upstream optical transmitter, multiple bridge amplifier network monitoring is called optical node. PON uses a single optical fiber to connect to OLT, and then OLT connects to ONU. ONU provides data, interactive network TV, voice and other services.

[0030] Optical Distribution Network (ODN): It is a fiber-to-the-home (FTTH) optical cable network based on PON equipment. ODN is used to provide optical transmission channels between OLT and ONU.

[0031] Wave Division Multiplexing (WDM): It is a technology that combines two or more optical carrier signals of different wavelengths (carrying various information) at the transmitting end through MUX and couples them to the same optical fiber of the optical line for transmission. In addition, at the receiving end, the optical carriers of various wavelengths are separated through DeMUX, and then further processed by the optical receiver to restore the original signal.

[0032] Trans-Impedance Amplifier (TIA): It is the core module of high-speed optical communication circuits and plays a decisive role in the noise, sensitivity and bandwidth performance of the entire optical receiving system.

[0033] Transistor Outline (TO package): a fully enclosed packaging technology, which is a commonly used packaging method for microelectronic devices in current applications. Compared with other packaging technologies, the parasitic parameters of TO packaging are relatively small, the cost is very low, the process is relatively simple, and it is more flexible and convenient to use.

[0034] In the field of optical communication technology, Figure 1 As shown, Figure 1 1 is a schematic diagram of the architecture of a PON system. The PON system 100 is mainly composed of three parts: an optical line terminal OLT, an optical distribution network ODN, and an optical network unit ONU. Among them, the optical line terminal OLT is generally placed in a central computer room and connected to the ODN network through a PON interface to achieve centralized management of multiple ONUs. The optical network unit ODN is composed of passive optical devices such as an optical fiber 110, one or more passive optical splitters (Splitter, also called passive optical splitters), etc. The OLT and the ONU are connected through the ODN for communication. Specifically, the OLT can be connected to the switch at the front end through a network cable to send the PON signal sent by the control terminal to the switch through the server to the OLT. Then, the OLT processes the received PON signal and performs service forwarding processing. The ONU is placed on the user side and can provide various interfaces to connect multiple user terminal devices (such as the user's PC, set-top box, camera, wireless AP, printer, telephone, etc.). The ONU can convert the user terminal device signal into a PON signal, and transmit it to the OLT after connecting to the ODN through the PON uplink interface.

[0035] It should be noted that OLT and ONU are the core of the PON system, and the role of OLT and ONU is to realize the uplink and downlink transmission of signals according to the protocol requirements of photoelectric conversion, so as to achieve the function of uplink and downlink. Therefore, improving the performance of OLT devices is also very important for improving the PON system.

[0036] With the development of various services, users have an increasing demand for bandwidth, and the PON system is constantly upgrading from Gigabit Passive Optical Network (GPON) to 10 Gigabit Passive Optical Network (10-Gigabit-Capable Passive Optical Network, 10G-PON, also known as XG-PON) and 10 Gigabit Symmetric Passive Optical Network (10GS-PON, also known as XG(S)-PON), and then to 50 Gigabit Passive Optical Network (50-Gigabit-Capable Passive Optical Network, 50G-PON). In order to achieve a smooth upgrade of PON, multiple modes of PON need to coexist, for example, GPON, XG(S)-PON and 50G-PON coexist. In addition, in the face of the next generation of high-speed 50G-PON systems, in order to reduce the iteration cost of the PON system, it is necessary to reuse the optical distribution network (ODN) of the existing PON system. Therefore, multiple PON services are supported concurrently on the same port, that is, the existing XG(S)-PON service, GPON service and 50G-PON service are supported concurrently to achieve optimal deployment and flexible upgrade capabilities.

[0037] In order to achieve a smooth upgrade of PON, the link budget of the existing PON system ODN must be met, and the link budget mainly depends on the transmit optical power and receive sensitivity indicators of the optical components. However, there is an obvious technical problem for the 50G-PON system: the low power of the downstream optical signal of the optical line terminal OLT and the insufficient sensitivity of the upstream receiving detector, which limits the ODN splitting ratio or transmission distance, which is not conducive to the ODN multiplexing of the 50G-PON system and the rapid application of 50G-PON. Therefore, for the transmitter on the OLT side, it is necessary to integrate multiple laser transmitters of different wavelengths. How to reduce the package size of the transmitter with multiple modes and reduce the loss of optical energy is a technical problem that needs to be solved at present.

[0038] Since semiconductor optical amplifiers (SOAs) generally use independent dual-fiber connector component packaging technology, the related technology solves this technical problem by connecting to the OLT's transmitting and receiving devices through two fiber connectors, a multiplexer (MUX) and a demultiplexer (DeMUX), but the component size of this solution is large and the cost is high. In addition, in the field of optical communications, the related technology improves the luminous power index by integrating the SOA with the laser chip on a single chip at the transmitting end, while the receiving end uses a second independent externally packaged SOA to amplify the received optical signal to achieve the goal of improving sensitivity. However, the component size of this solution structure is large and is not conducive to the miniaturization of the device.

[0039] In order to solve the above problems, the embodiments of the present invention provide an optical transceiver and an optical line terminal, which can effectively reduce the package size of multi-mode coexistence and solve the problem of optical energy loss of the optical line terminal OLT.

[0040] The embodiments described in the present invention may be implemented in a communication system, such as in at least one of the following systems: a global system for mobile communications (GSM) or any other second generation cellular communication system, a universal mobile telecommunications system (UMTS, 3G) based on basic wideband code division multiple access (W-CDMA), high speed packet access (HSPA), long term evolution (LTE), advanced LTE, a system based on the IEEE 802.11 specification, a system based on the IEEE 802.15 specification and / or a fifth generation (5G) mobile or cellular communication system; and future mobile communication systems. However, the embodiments are not limited to the systems given in the above examples, but those skilled in the art may apply the solutions to other communication systems having the necessary properties.

[0041] In order to effectively improve the link budget of the OLT optical component in the PON system and increase the ODN splitting ratio of the OLT optical component in the PPON system, the embodiment of the present invention adopts a transmitting and receiving bidirectional integrated SOA solution at the PON OLT end, that is, an SOA is placed in front of the transmitting laser and receiving detector end with limited power indicators. The embodiment of the present invention can realize the function of bidirectional amplification of the laser transmitting optical signal and the receiving optical signal, improve the luminous power and receiving sensitivity, and effectively solve the problem of insufficient downstream transmitting optical power and upstream receiving sensitivity indicators of the 50G-PON system.

[0042] like Figure 2 As shown, Figure 2A schematic diagram of the structure of an optical transceiver provided in an embodiment of the present invention. The optical transceiver provided in an embodiment of the present invention can be used to replace an OLT optical component in a PON system, and the optical transceiver includes a package shell 210 and a first optical transmitting module 220, an optical receiving module 230, and a semiconductor optical amplifying component 240 located in the package shell 210.

[0043] Specifically, a light window 250 is provided at the front end of the packaging shell 210, the first optical transmitting module 220 is used to transmit a first transmitted light signal 260, the semiconductor optical amplifying component 240 is used to amplify the first transmitted light signal 260 and transmit it to the light window 250, and is also used to amplify the incident light signal 270 received through the light window 250 and transmit it to the light receiving module 230.

[0044] It is understandable that the present application uses an integrated packaging method for the semiconductor optical amplifier component 240 (including the SOA chip), the first optical transmitter module 220 (including the transmitting laser chip) and the optical receiver module 230 (including the receiving detector chip), which can effectively reduce the size of the entire component, provide more space for the layout of the printed circuit board assembly (PCBA) of the entire module, and better realize the miniaturization of components and modules. In addition, the optical transceiver device provided by the present invention adopts a transmitting and receiving bidirectional integrated SOA solution, which can reduce the packaging material cost of the OLT optical component.

[0045] It should be noted that the first optical transmission module of the embodiment of the present invention is used to transmit an optical signal based on a wavelength of 50G-PON.

[0046] It should be noted that the packaging shell is used to seal the optical transmitting module, optical receiving module and devices in the semiconductor optical amplifier assembly inside the shell in an environmentally stable cavity to prevent external pollution from affecting the performance and life of the devices.

[0047] It should be noted that the material of the optical window can be sapphire or coated glass, etc., which is not specifically limited here. The optical window is used to transmit the optical signal emitted from the package shell, and to receive the incident optical signal entering the package shell through the external optical network.

[0048] In some embodiments, since the embodiments of the present invention integrate the optical transmitting module and the optical receiving module in a package shell, the optical signal emitted by the first transmitting laser in the first optical transmitting module may partially enter the optical receiving module, thereby causing optical crosstalk to the optical receiving module, thereby enhancing the crosstalk effect of the transmitted optical signal on the received optical signal. Figure 2As shown, the optical transceiver device provided in the embodiment of the present invention further includes a baffle 280 , and the baffle 280 is used to be arranged between the first optical transmitting module 220 and the optical receiving module 230 .

[0049] It should be noted that the material of the baffle 280 can be selected to be coated glass or metal, and a light-absorbing material can be coated on the surface of the baffle 280 to further avoid or reduce the optical crosstalk problem between transmission and reception.

[0050] It should be noted that the baffle 280 can be directly formed once inside the package shell 210, that is, it is an integral part with the package shell 210. Alternatively, the baffle 280 can also be mounted later, that is, the baffle 280 and the package shell 210 are mounted, and the mounting process can be fixed by gluing, welding, etc., which is not specifically limited here.

[0051] In some embodiments, Figure 2 As shown, the optical transceiver device of the embodiment of the present invention further includes: a circuit board 290, which is disposed outside the packaging shell 210 and is electrically connected to the first optical transmitting module 220 and the optical receiving module 230 respectively.

[0052] It should be noted that the circuit board 290 of the embodiment of the present invention can be a ceramic circuit board, etc. The circuit board 290 can electrically connect the internal chip of the transmitting optical module and the chip of the receiving optical module with the external hardware printed circuit board (Printed Circuit Board, PCB) or flexible circuit board (Flexible Printed Circuit, FPC) through gold wire bonding and other methods.

[0053] like Figure 3 As shown, Figure 3 The schematic diagram of the structure of the semiconductor optical amplifier assembly provided by the embodiment of the present invention is as follows: The optical path of the semiconductor optical amplifier assembly 240 includes a first converging lens 310 , a semiconductor optical amplifier 320 , and a collimating lens 330 .

[0054] It should be noted that the semiconductor optical amplifier 320 includes an SOA chip. The first converging lens 310 is used to converge the first emission light signal 260 (see the solid line in the figure) to the SOA chip of the semiconductor optical amplifier 320 for light signal amplification. The light signal output from the SOA chip is converted into collimated light through the collimating lens 330. The collimating lens 330 is used to collimate the amplified first emission light signal 260 and transmit it to the light window 250 to transmit it to the outside of the package shell. In addition, the light window 250 is also used to converge the incident light signal outside the package shell to the collimating lens 330. The collimating lens 330 is also used to collimate the incident light signal 270 (see the dotted line in the figure) and transmit it to the semiconductor optical amplifier 320. The semiconductor optical amplifier 320 is also used to amplify the incident light signal 270 and transmit it to the first converging lens 310. The first converging lens 310 is also used to converge the amplified incident light signal 270 to the optical receiving module.

[0055] Therefore, the semiconductor optical amplifier component of the embodiment of the present invention can simultaneously achieve the improvement of the transmitted optical power and the optimization of the receiving sensitivity, effectively improving the transmitted optical power index of the component and improving the receiving sensitivity index.

[0056] It should be noted that in order to prevent the gain performance of the semiconductor optical amplifier 320 of the SOA from changing when the ambient temperature changes, the semiconductor optical amplifier 320 generally needs to work in a temperature-stable state. Figure 3 As shown, the semiconductor optical amplifier assembly 240 of the embodiment of the present invention further includes: a first temperature controller, which includes a first thermistor 340 and a first refrigerator. The thermistor is used to feed back the operating temperature point of the corresponding device of the refrigerator, and the refrigerator performs temperature control according to a preset temperature threshold.

[0057] It should be noted that a heat sink can be mounted between the semiconductor optical amplifier 320 and the first refrigerator by eutectic welding or other processes to match the optical path or process requirements. Specifically, the first refrigerator can be mounted in the packaging shell by eutectic welding, silver paste process, etc., and the semiconductor optical amplifier 320 can be mounted on a substrate to form a chip on carrier (COC), and then the COC component is attached to the first refrigerator. Among them, a heat sink refers to an object whose temperature does not change with the amount of heat energy transferred.

[0058] It should be noted that the semiconductor optical amplifier 320 can be mounted on a ceramic substrate, and a first thermistor 340 is placed on the substrate next to the SOA chip close to the semiconductor optical amplifier 320 .

[0059] It should be noted that when the semiconductor optical amplifier 320 , the ceramic heat sink and the first thermistor 340 are fixed together on the first refrigerator, it is necessary to pay attention to the position and angle of the patch corresponding to the position of the light window.

[0060] It should be noted that when the semiconductor optical amplifier component 240 is fixed and adjusted, the embodiment of the present invention can provide a small current to the semiconductor optical amplifier to achieve spontaneous radiation according to the spontaneous radiation mechanism of the semiconductor optical amplifier. Therefore, a collimator is externally placed on the light window of the package shell to detect the spontaneous radiation light from the conductor optical amplifier, and adjust the position of the collimating lens 330 behind the semiconductor optical amplifier component 240 so that the energy of the spontaneous radiation light received by the collimator is maximized. Then the collimating lens 24 is fixed, and the collimating lens 330 is attached to the ceramic substrate below by UV glue ultraviolet curing, thermal curing and other process methods, which are not specifically limited here.

[0061] It should be noted that when adjusting the semiconductor optical amplifier assembly 240, the first converging lens 310 at the front end of the SOA can also be coupled by means of optical power monitoring to maximize the optical power passing through the first converging lens 310. Then, the first converging lens 310 is fixed, and the fixing method and process are the same as those of the collimating lens 330. Among them, the coupling process of the semiconductor optical amplifier 320 with the two front and rear lenses can be carried out in the packaging shell, or on an external coupling process platform, that is, after the lens coupling and fixing are completed by the same monitoring method, the semiconductor amplifier with the coupled lens is mounted on the first refrigerator in the shell 1.

[0062] like Figure 2 As shown, the optical transceiver device of the embodiment of the present invention also includes a wavelength division multiplexing module 2100, which is used to transmit the first transmitted optical signal 260 to the semiconductor optical amplifier of the semiconductor optical amplification component 240, and the wavelength division multiplexing module 2100 is also used to transmit the amplified incident optical signal 270 to the optical receiving module 230.

[0063] like Figure 4 As shown, Figure 4 A schematic diagram of the structure of a wavelength division multiplexing module provided in an embodiment of the present invention. The wavelength division multiplexing module 2100 of the embodiment of the present invention includes an optical substrate 410, a transmission filter 420, and a reflection filter 430. The transmission filter is arranged between the first light transmitting module 220 and the optical substrate 410, and the reflection filter 430 is arranged between the light receiving module 230 and the optical substrate 410.

[0064] It should be noted that the optical substrate 410 can be made of flat glass, and each filter only allows light signals of a fixed wavelength to pass through and / or reflect. For example, the transmission filter 420 only allows light of a specific wavelength emitted by the laser chip in the first optical transmitter module 220 to pass through, and the transmission filter 420 reflects the incident light signal 270 entering from the outside to the other reflection filter 430, so as to enter the optical receiving module 230 according to the reflection filter 430 that allows the incident light signal 270 to pass through.

[0065] It should be noted that if the wavelength division multiplexing module is set inside the package shell, the optical substrate, the transmission filter, and the reflection filter can be fixed inside the package shell by glue or other fixing methods. At this time, when adjusting the optical path of the wavelength division multiplexing module, a pad can be placed at the bottom of the optical substrate according to the center height of the optical path to match the position of the light window outlet of the shell, the center position of the transmission filter, and the center position of the reflection filter.

[0066] It should be noted that the transmission filter and the reflection filter can be fixed in front of the optical substrate by optical glue, and the relative spacing and position between the transmission filter and the reflection filter can be adjusted according to the actual optical path design size requirements, which is not specifically limited here.

[0067] It should be noted that, specifically, after the semi-finished assembly of the transmission filter, the reflection filter and the flat glass of a specific wavelength is completed, they can be placed together in the packaging shell for fixation. The mounting glue between the flat glass and the packaging shell can be fixed with silver paste or UV glue. In order to ensure the performance of the bidirectional amplification of the first optical transmitting module and the optical receiving module, the embodiment of the present invention can also fix the wavelength division multiplexing module by active coupling. For example, assuming that there are 3 reflection filters, the external collimated light is incident on the flat glass after passing through the SOA, and the spot positions of the four lights emitted from the transmission filter and the front end of the three reflection filters are matched with the spot positions of the component design, and the position where the spot energy is most concentrated is determined, and then the current position of the wavelength division multiplexing module is fixed.

[0068] like Figure 5 As shown, Figure 5 A schematic diagram of the structure of the first optical transmitter module provided in an embodiment of the present invention. The first optical transmitter module 220 in an embodiment of the present invention comprises: a first transmitting laser 510, a first transmitting lens 520, and a first isolator 530. The first transmitting lens 520 is arranged between the first transmitting laser 510 and the first isolator 530, and the first isolator 530 is arranged between the first transmitting lens 520 and the wavelength division multiplexing module 2100.

[0069] It should be noted that the first transmitting laser 510 is used to transmit the first transmitting optical signal 260. The first transmitting lens 520 is used to collimate the first transmitting optical signal 260 and transmit it to the first isolator 530. The first isolator 530 is used to transmit the first transmitting optical signal 260 to the wavelength division multiplexing module 2100, and is also used to block the optical signal outside the package shell or the optical signal reflected back in the optical path from entering the first transmitting laser 510 through the wavelength division multiplexing module 2100, thereby avoiding the influence of the external optical signal or the reflected optical signal on the first transmitting laser 510.

[0070] It should be noted that, in order to make the first emitting laser 510 work in a temperature-stable state, the first optical emitting module 220 of the embodiment of the present invention further includes: a second temperature controller 540 , and the second temperature controller 540 includes a second thermistor 541 and a second refrigerator.

[0071] It should be noted that the second temperature controller of the first optical transmitter module is fixed in the package shell for temperature control. Since the second temperature controller and the package shell have good thermal conductivity, the embodiment of the present invention can fix the second temperature controller and the package shell by eutectic welding or silver paste pasting. Among them, the positive and negative electrodes of the second refrigerator of the second temperature controller can be electrically connected to the circuit board 290 on the shell through gold wire bonding, which is not specifically limited here.

[0072] It should be noted that the first optical transmitter module 220 of the embodiment of the present invention further includes: a first backlight detector 550. The first backlight detector 550 is used to detect whether the optical power from the first transmitting laser 510 is stable in a state, that is, to judge the output stability of the optical power by the current. The first backlight detector 550 converts the received optical signal into an electrical signal, and has no requirements on the frequency and rate. In addition, the first backlight detector 550 can adopt a multiphoton detector (MPD), which is not specifically limited here.

[0073] It should be noted that the first light emitting module 220 of the embodiment of the present invention further includes: a first emitting module heat sink 560 placed on the second temperature controller. The first emitting module heat sink 560 is used to carry components such as the first emitting laser 510, the first backlight detector 550, the first emitting lens 520, the first isolator 530, and the second thermistor 541. In addition, the first emitting module heat sink 560 and the second temperature controller 540 are generally eutectic welding or conductive adhesive bonding, which is not specifically limited here.

[0074] It should be noted that, in the embodiment of the present invention, the first transmitting laser 510 (for example, a 50G-PON 1342nm transmitting laser) can be mounted on the second transmitting module heat sink 570 through a eutectic welding process. In addition to carrying chips and adjusting the optical path height, the second transmitting module heat sink 570 can also adjust the bandwidth requirements of the high-frequency circuit, so the performance requirements for the second transmitting module heat sink 570 are higher than those for the first transmitting module heat sink 560.

[0075] It should be noted that the first emitting laser 510 is disposed between the first backlight detector 550 and the first emitting lens 520, and the first backlight detector 550 is used to monitor the backlight power stability of the laser.

[0076] It should be noted that the second thermistor 541 can be placed on the first transmitting module heat sink 560 or the second transmitting module heat sink 570. At the same time, according to the requirements of the peripheral circuit of the first transmitting laser 510, capacitors and resistors can also be placed on the second transmitting module heat sink 570, and connected to the circuit board 290 on the housing through gold wire bonding.

[0077] It should be noted that the first isolator 530 and the first transmitting module heat sink 560 may be bonded together using UV glue, 353 glue, or silver paste, which is not specifically limited here.

[0078] like Figure 6 As shown, Figure 6 A schematic diagram of the structure of an optical receiving module provided in an embodiment of the present invention. The optical receiving module 230 of the embodiment of the present invention includes at least one optical receiving component 610, which is used to allow only incident optical signals of a preset wavelength to be received. The preset wavelength corresponding to each optical receiving component 610 is different.

[0079] It should be noted that each optical receiving assembly 610 includes: a bandpass filter 620 , a receiving lens 630 , and a receiving detection unit 640 . The receiving lens 630 is disposed between the bandpass filter 620 and the receiving detection unit 640 .

[0080] It should be noted that the incident light signal is received outside the package shell, and the incident light signal enters the wavelength division multiplexing module after being amplified by the semiconductor optical amplifier component. Since the transmission filter on the wavelength division multiplexing module only allows the light signal of a specific wavelength emitted by the laser chip in the first optical transmitting module to pass through, the incident light signal is reflected to the side of the optical substrate through the transmission filter, and the side of the optical substrate is coated with a reflection enhancement film, that is, the incident light signal is reflected again to the reflection filter below. Since the reflection filter is the same as the transmission filter, it only allows light signals of a specific wavelength to pass through, and light of other wavelengths is reflected. After passing through the following multiple reflection filters in sequence, the transmission and reflection of light signals of different wavelengths can be realized, so that light signals of different wavelengths can be separated. Afterwards, the incident light signal of the preset wavelength is transmitted to the receiving lens 630 through the bandpass filter 620, and the receiving lens 630 converges the light signal to the receiving detection unit 640.

[0081] It should be noted that, since the optical signal entering from the outside may have some weak small signals amplified at the same time after being amplified by the semiconductor optical amplifier component, in order to further filter and separate the received incident optical signal, a bandpass filter 620 of the corresponding wavelength is placed on the collimated optical path of the receiving lens 630. The bandpass filter 620 can further prevent the external noise signal light from entering the APD chip of the receiving detection unit 640, thereby avoiding the influence of the error code on the receiving sensitivity of the optical receiving module 230. Figure 6 As shown, the bandpass filter 620 in each optical receiving component 610 can pass optical signals of different preset wavelengths, thereby transmitting incident optical signals of different wavelengths to the receiving lens 630 .

[0082] It should be noted that the receiving lens 630 may be an independent lens or a lens array coupled with the detector chip in the receiving detection unit 640, which is not specifically limited here.

[0083] It should be noted that the receiving detection unit 640 of the embodiment of the present invention includes: a receiving detector 641 and a cross-group amplifier 642. The receiving detector 641 is arranged between the cross-group amplifier 642 and the receiving lens 630. After the optical signal enters the receiving detector 641, the optical signal is converted into an electrical signal, and the electrical signal is transmitted to the cross-group amplifier 642, and the cross-group amplifier 642 is used to amplify the electrical signal.

[0084] It should be noted that the optical receiving module 230 of the embodiment of the present invention further includes: a peripheral circuit 650. The peripheral circuit 650 includes functional parts such as capacitors and resistors for power supply filters.

[0085] It should be noted that the optical receiving module 230 of the embodiment of the present invention further includes: a receiving module heat sink 660. The receiving module heat sink 660 is used to support components such as the bandpass filter 620, the receiving lens 630, and the receiving detection unit 640, and the bonding method between the packaging shell and the receiving module heat sink 660 can adopt a glue bonding process, which is not specifically limited here.

[0086] It should be noted that the receiving detector 641 and the cross-group amplifier 642 are sequentially mounted on the receiving module heat sink 660, and the mounting positions between the chips should be based on the requirements of the optical path structure and correspond to the spacing and positions of the reflective filters in the previous wavelength division multiplexing module.

[0087] The embodiment of the present invention integrates a laser for emitting a first emission light signal and a receiving detector for receiving three specific wavelengths inside an integrated package shell, and realizes the functions of amplifying the emission power of the first emission light signal and improving the receiving sensitivity of three receiving ends through an SOA semiconductor optical amplifier.

[0088] It should be noted that the bandpass filter 620 and the receiving module heat sink 660 may be mounted by silver paste, non-conductive glue, UV glue, etc., which is not specifically limited here.

[0089] It should be noted that if Figure 2 As shown, the optical transceiver device of the embodiment of the present invention further includes: a flexible printed board 2110. The flexible printed board 2110 can be arranged outside the package shell, and the first emitting laser can be connected to the circuit board 290 by gold wire bonding, and then electrically connected to the outside through the flexible printed board 2110; or, a probe can be directly inserted into the corresponding position of the circuit board 290 to add current to the first emitting laser to make it emit light, and at the same time, a small current is given to the semiconductor light amplification component to couple the first emitting lens in front of the first emitting laser.

[0090] It should be noted that the embodiment of the present invention inputs an optical signal of a specific wavelength through an external collimator at the optical window of the shell, applies voltage to the optical receiving component, and provides current to the semiconductor optical amplifier component. After being amplified by the semiconductor optical amplifier component, it enters the wavelength division multiplexing module and reaches the three reflective filters. The light emitted from the bandpass filter in the optical receiving component is irradiated onto the APD chip of the receiving detector through the actively coupled receiving lens. Then, the position of the receiving lens is adjusted to maximize the response current generated by the receiving detector. The three receiving lenses in front of the receiving detector chip are fixed in sequence, and can be fixed on the receiving module heat by UV glue ultraviolet curing and heat curing process, which is not specifically limited here.

[0091] It should be noted that after the packaging process in the shell of the packaging shell is completed, the appearance and performance of each module or component are checked, and then a metal cover is placed on the module or component shell. The shell and the cover are generally fixed by a parallel sealing process, and the material of the cover is generally Kovar alloy, which is not specifically limited here.

[0092] like Figure 2 As shown, the optical transceiver device of the embodiment of the present invention further includes: a transmitting drive component 2120. The transmitting drive component 2120 is used to receive the incident optical signal 270 and transmit it to the optical window 250. The transmitting drive component 2120 is also used to receive the amplified first transmitting optical signal 260 transmitted by the optical window 250, and transmit the amplified first transmitting optical signal 260 to the optical distribution network ODN.

[0093] like Figure 7 As shown, Figure 7 A schematic diagram of the structure of the emission drive assembly provided in an embodiment of the present invention. The emission drive assembly 2120 includes a first emission filter 710, a second emission filter 720, a second converging lens 730, and an adapter 740. The second emission filter 720 is disposed between the first emission filter 710 and the second converging lens 730, and the second converging lens 730 is disposed between the second emission filter 720 and the adapter 740.

[0094] It should be noted that in order to realize the coexistence of 50G-PON, XG(S)-PON and GPON in the optical network system, in order to meet the link budget indicator requirements of ODN, a smooth system upgrade from XG(S)-PON and GPON Combo to 50G-PON / XG(S)-PON / GPON Combo can be achieved. Figure 2 As shown, the optical transceiver device of the embodiment of the present invention further includes: a second optical transmitter module 2130, and the second optical transmitter module 2130 is arranged between the wavelength division multiplexing module and the adapter 740. The second optical transmitter module 2130 is used to transmit the emitted second emission optical signal to the emission driving component 2120. Therefore, the optical transceiver device designed in the embodiment of the present invention can effectively reduce the component size and reduce the component cost.

[0095] It should be noted that after amplifying the optical signal of the first optical transmitter module (i.e., based on a 50G-PON laser), in order to achieve tri-mode coexistence, the second optical transmitter module of the embodiment of the present invention includes at least one of the following: an optical transmitter module based on GPON (i.e., based on a GPON laser), an optical transmitter module based on XG(S)-PON (i.e., based on an XG(S)-PON laser). The GPON laser can be a GPON 1490 nm DFB laser, and the XG(S)-PON laser can be a 1577 nm EML laser, which is not specifically limited here.

[0096] It should be noted that the first transmit filter 710 can reflect the optical signal of the wavelength of the GPON laser, the second transmit filter 720 can reflect the optical signal of the wavelength of the XG(S)-PON laser, and the second transmit filter 720 can also allow the optical signal of the wavelength of the GPON laser to pass through.

[0097] It should be noted that the circuit board 290 of the embodiment of the present invention can also electrically connect the chip of the optical transmission module inside each second optical transmission module with an external hardware printed circuit board, etc. through gold wire bonding, etc., and the circuit board 290 of the embodiment of the present invention can also be electrically connected to the transmission drive component through gold wire bonding, etc., which will not be repeated here.

[0098] It should be noted that the two types of lasers corresponding to the second optical transmission module can be packaged in a TO package. The two types of lasers in the second optical transmission module of the embodiment of the present invention can be electrically connected to the circuit board 290 through the leads on the TO tube holder, or the FPC flexible printed circuit board can be welded on the leads of the TO tube holder to achieve electrical connection with the circuit board 290.

[0099] It should be noted that the second optical transmitter module can be arranged inside the package shell or outside the package shell, which is not specifically limited here. In addition, the embodiment of the present invention does not specifically limit the specific placement order and position of the three optical transmitter modules and TO and the selection of the amplified optical signal light source. Therefore, when the power of the laser corresponding to any optical transmitter module is insufficient, the optical transmitter module corresponding to the limited laser can be set in the package shell of the optical transceiver device provided by the embodiment of the present invention, thereby amplifying it through the SOA semiconductor optical amplifier.

[0100] It should be noted that in order to prevent the external optical signal from affecting the laser in the second optical transmitter module, the second optical transmitter module also needs to place a second isolator in the corresponding laser TO package. The second isolator can block the external optical signal or the optical signal reflected in the optical path from entering the laser corresponding to the second optical transmitter module, so as to cause the laser chip to work unstably or fail in performance.

[0101] It should be noted that when the optical transceiver device of the embodiment of the present invention includes both an optical transmitter module based on a GPON laser and an optical transmitter module based on an XG(S)-PON laser, the embodiment of the present invention can realize the integration of three optical transmitter modules at the same time. The placement order and position of the two laser TOs are not specifically limited here and can be flexibly set according to actual needs.

[0102] It should be noted that when the optical transceiver device of the embodiment of the present invention includes both an optical transmitter module based on a GPON laser and an optical transmitter module based on an XG(S)-PON laser, the light emitted by these two types of lasers can be converged to the second convergent lens 730, and then converged to the adapter 740 through the second convergent lens 730, so as to be transmitted to the optical distribution network ODN through the adapter 740. In addition, the GPON 1490 nanometer wavelength laser and the XG(S)-PON 1577 nanometer wavelength laser can be coupled externally by converging light, and the collimated light can be emitted through the second converging lens. It is also possible to adopt a solution of passing the optical signals emitted by the two laser chips through a flat window cap and a second converging lens externally disposed outside the flat window cap to realize the TO package of the second optical transmitter module to emit collimated light. In addition, it is also possible to directly couple the collimating lens inside the TO package of the second optical transmitter module to realize the solution of collimating light, which is not specifically limited here.

[0103] It should be noted that, for each second light emitting module, it also includes a second backlight detector and a second emitting lens, and the emitting laser in the second light emitting module is arranged between the second backlight detector and the second emitting lens.

[0104] It should be noted that if Figure 7 As shown, the emission drive assembly 2120 of the embodiment of the present invention further includes: a first fixing member 750 and a second fixing member 760. The first fixing member 750 is used to fix the first emission filter 710, the second emission filter 720, and the second converging lens 730. The second fixing member 760 is used to fix the first fixing member 750 and the adapter 740.

[0105] It should be noted that the first fixing member 750 and the second fixing member may be metal structural members, which are not specifically limited herein.

[0106] It should be noted that the embodiment of the present invention can make the laser and receiving detector of the optical transmission module work through the flexible printing plate 2110. The embodiment of the present invention adjusts the position of the first fixing member 750 and connects the optical power meter through the adapter 740 to monitor the output light power, so as to maximize the optical power coupled to the adapter 740. Therefore, after the adapter 740 of the present application inputs the incident light signal corresponding to the receiving detector, it monitors the photocurrent converted by the receiving detector, and after the photocurrent of all the receiving detectors reaches the target value, the first fixing member is fixed to the packaging shell through a laser welding process. In addition, the relative position of the adapter 740 and the first fixing member 750 is fixed by the second fixing member.

[0107] The optical transceiver designed in the embodiment of the present invention can amplify both the power-limited laser and the detector with limited receiving sensitivity through an integrated SOA semiconductor optical amplifier, and at the same time realize the improvement of the transmitted optical power and the optimization of the receiving sensitivity, and improve the transmitted optical power index and the receiving sensitivity index of the component. In addition, according to a large number of experiments, the optical transceiver of the present invention can realize the improvement of the index of the three-mode Combo components of 50G-PON, XG(S)-PON, and GPON, can realize the space saving of PCB layout, is beneficial to the layout of the battery cells in the optical module, and effectively improves and optimizes the overall performance of the components and modules, meets the link budget requirements for laying ODN, and realizes that the transmitting end power and receiving sensitivity can be improved by at least 3dB. Therefore, the embodiment of the present invention can integrate the optical transmitting module, the optical receiving module and the semiconductor optical amplification component together, effectively solves the problem of low power of the downstream optical signal of the OLT and insufficient sensitivity of the upstream receiving detector, and can better realize the miniaturization of the device, which is beneficial to the rapid commercialization of the three-mode optical module, and can be better used in the ODN network with a high link budget.

[0108] Example 1: Figure 8As shown, when the second optical transmission module is arranged outside the package shell, that is, the optical transmission module based on the GPON laser and the optical transmission module based on the XG(S)-PON laser are both arranged outside the package shell, the emission drive component 2120 is arranged outside the package shell, and the external and internal optical signal transmission is performed through the optical window. Specifically, when the first emission laser 510 emits the first emission light signal 260 (as shown by the solid line in the figure), the first emission lens 520 collimates the first emission light signal 260 and transmits it to the first isolator 530. The first isolator 530 transmits the first emission light signal 260 to the wavelength division multiplexing module 2100, and is also used to block the optical signal outside the package shell from entering the first emission lens 520 through the wavelength division multiplexing module 2100. At the same time, the first backlight detector 550 detects whether the optical power of the first emission light signal 260 from the first emission laser 510 is stable in a state. The second temperature controller 540 and the second thermistor 541 keep the first emission laser 510 working in a temperature stable state. Then, the transmission filter 420 of the wavelength division multiplexing module 2100 only allows the light of a specific wavelength (i.e., the first transmission optical signal 260) emitted by the laser chip in the first optical transmission module 220 to pass through, and transmits it to the semiconductor optical amplifier component 240 through the optical substrate 410. Afterwards, the first converging lens 310 of the semiconductor optical amplifier component 240 converges the first transmission optical signal 260 to the SOA chip of the semiconductor optical amplifier 320 for optical signal amplification, and converts the optical signal output from the SOA chip into collimated light through the collimating lens 330, and then the collimating lens 330 can collimate the amplified first transmission optical signal 260 and transmit it to the optical window 250, so as to transmit it to the transmission driving component 2120. The first transmission optical signal 260 is transmitted from the first transmission filter 710 and the second transmission filter 720 to the second converging lens 730, and then the second converging lens 730 transmits the first transmission optical signal 260 to the optical distribution network ODN connected to the external communication of the optical transceiver device through the adapter 740.

[0109] It should be noted that if Figure 8As shown, when the second optical transmission module is arranged outside the package shell, that is, the optical transmission module based on the GPON laser and the optical transmission module based on the XG(S)-PON laser are both arranged outside the package shell, the transmission drive component 2120 is arranged outside the package shell, and the external and internal optical signal transmission is performed through the optical window. Specifically, when the transmission drive component 2120 receives the incident light signal 270 entering the external optical distribution network ODN (as shown by the dotted line in the figure), the incident light signal 270 passes through the adapter 740 and the second converging lens 730, and the converged light signal is transmitted to the light window 250 through the first transmission filter 710 and the second transmission filter 720, so as to enter the interior of the package shell 210 through the light window 250. Then, the light window 250 converges the incident light signal 270 outside the package shell to the collimating lens 330. The collimating lens 330 collimates the incident light signal 270 and transmits it to the semiconductor optical amplifier 320 for amplification. The semiconductor optical amplifier 320 amplifies the incident light signal 270 and transmits it to the first converging lens 310. The first converging lens 310 converges the amplified incident light signal 270 to the wavelength division multiplexing module 2100. After that, the incident light signal 270 is reflected to the corresponding light receiving component by the anti-reflection film and the reflective filter 430 on the side of the optical substrate 410 on the wavelength division multiplexing module 2100. The bandpass filter 620 of the light receiving component prevents the external noise signal light from entering the APD chip of the receiving detection unit 640, and transmits the incident light signal 270 that can pass through to the receiving lens 630. The receiving lens 630 converges the incident light signal 270 to the receiving detector 641 of the receiving detection unit 640. The receiving detector 641 converts the received incident optical signal 270 into an electrical signal, and transmits the electrical signal to the cross-group amplifier 642 , which is used to amplify the received electrical signal.

[0110] Example 2: Fig. 9As shown, when the second optical transmission module is arranged outside the package shell, that is, the optical transmission module based on the GPON laser and the optical transmission module based on the XG(S)-PON laser are both arranged outside the package shell, the emission drive component 2120 is arranged outside the package shell, and the external and internal optical signal transmission is performed through the optical window. Therefore, the emission and reception of the second optical transmission module at this time do not need to be amplified by a semiconductor optical amplifier. Specifically, for the optical transmission module 910 based on the GPON laser, the second emission laser 911 inside the module emits a second emission light signal 912 (as shown by the solid line in the figure), and the second emission lens 913 collimates the second emission light signal 912 and transmits it to the second isolator 914. The second isolator 914 transmits the second emission light signal 912 to the first emission filter 710, and is also used to block the optical signal outside the package shell from entering the second emission lens 913 through the first emission filter 710. At the same time, the second backlight detector 915 can detect whether the optical power of the second emission light signal 912 from the second emission laser 911 is stable in a state. In addition, the third temperature controller (not shown in the figure) and the third thermistor (not shown in the figure) can keep the second transmitting laser 911 working in a temperature stable state. Afterwards, the first transmitting filter 710 transmits the second transmitting optical signal 912 emitted by the optical transmitting module 910 based on the GPON laser to the second converging lens 730 through the second transmitting filter 720, and the second converging lens 730 transmits the second transmitting optical signal 912 to the optical distribution network ODN connected to the external communication of the optical transceiver device through the adapter 740.

[0111] It should be noted that if Fig. 9 As shown, for the optical transmission module 920 based on the XG(S)-PON laser, the third emission laser 921 inside the module emits a third emission light signal 922 (as shown by the dotted line in the figure), and the third emission lens 923 collimates the third emission light signal 922 and transmits it to the third isolator 924. The third isolator 924 transmits the third emission light signal 922 to the second emission filter 720, and is also used to block the optical signal outside the package housing from entering the third emission lens 923 through the second emission filter 720. At the same time, the third backlight detector 925 can detect whether the optical power of the third emission light signal 922 from the third emission laser 921 is stable in a state. In addition, the fourth temperature controller (not shown in the figure) and the fourth thermistor (not shown in the figure) can keep the third emission laser 921 working in a temperature stable state. Afterwards, the second transmission filter 720 transmits the third transmission optical signal 922 to the second converging lens 730 , and the second converging lens 730 transmits the third transmission optical signal 922 to the optical distribution network ODN to which the optical transceiver is externally connected for communication through the adapter 740 .

[0112] Example 3: Fig.10 As shown, when the second optical transmission module is arranged inside the package shell, that is, the optical transmission module based on the GPON laser and / or the optical transmission module based on the XG(S)-PON laser is arranged inside the package shell, the emission drive component 2120 is arranged outside the package shell, and the external and internal optical signal transmission is performed through the optical window. Assume that the optical transmission module based on the GPON laser and / or the optical transmission module based on the XG(S)-PON laser are arranged inside the package shell. Specifically, when the first emission laser 510 emits the first emission light signal 260 (as shown by the solid line in the figure), the first emission lens 520 collimates the first emission light signal 260 and transmits it to the first isolator 530. The first isolator 530 transmits the first emission light signal 260 to the wavelength division multiplexing module 2100, and is also used to block the optical signal outside the package shell from entering the first emission lens 520 through the wavelength division multiplexing module 2100. At the same time, the first backlight detector 550 detects whether the optical power of the first emission light signal 260 from the first emission laser 510 is stable in a state. The second temperature controller 540 and the second thermistor 541 keep the first emitting laser 510 in a stable temperature state. Then, the transmission filter 420 of the wavelength division multiplexing module 2100 only allows the light of a specific wavelength (i.e., the first emitting light signal 260) emitted by the laser chip in the first optical emitting module 220 to pass through, and transmits it to the semiconductor optical amplifying component 240 through the optical substrate 410. Afterwards, the first converging lens 310 of the semiconductor optical amplifying component 240 converges the first emitting light signal 260 to the SOA chip of the semiconductor optical amplifier 320 for optical signal amplification, and converts the optical signal output from the SOA chip into collimated light through the collimating lens 330, and the collimating lens 330 can collimate the amplified first emitting light signal 260 and transmit it to the emitting driving component 2120. The first transmitted optical signal 260 is transmitted from the first transmitting filter 710 and the second transmitting filter 720 to the optical window 250, and then transmitted to the second converging lens 730 through the optical window 250. The second converging lens 730 converges the transmitted optical signal 260 and transmits it to the optical distribution network ODN connected to the external communication of the optical transceiver device through the adapter 740.

[0113] It should be noted that if Fig.10As shown, when the second optical transmission module is arranged inside the package shell, that is, the optical transmission module based on the GPON laser and / or the optical transmission module based on the XG(S)-PON laser is arranged inside the package shell, the emission drive component 2120 is arranged outside the package shell, and the external and internal optical signal transmission is performed through the optical window. Assume that the optical transmission module based on the GPON laser and / or the optical transmission module based on the XG(S)-PON laser are arranged inside the package shell. Specifically, when the emission drive component 2120 receives the incident light signal 270 (as shown by the dotted line in the figure) entering the external optical distribution network ODN, the incident light signal 270 passes through the adapter 740 and the second converging lens 730, and transmits the converged light signal to the light window 250. The light window 250 transmits the incident light signal 270 to the collimating lens 330 through the first emission filter 710 and the second emission filter 720. The collimating lens 330 collimates the incident light signal 270 and transmits it to the semiconductor optical amplifier 320 for amplification. The semiconductor optical amplifier 320 amplifies the incident light signal 270 and transmits it to the first converging lens 310. The first converging lens 310 converges the amplified incident light signal 270 to the wavelength division multiplexing module 2100. After that, the incident light signal 270 is reflected to the corresponding light receiving component by the anti-reflection film and the reflective filter 430 on the side of the optical substrate 410 on the wavelength division multiplexing module 2100. The bandpass filter 620 of the light receiving component prevents the external noise signal light from entering the APD chip of the receiving detection unit 640, and transmits the incident light signal 270 that can pass through to the receiving lens 630. The receiving lens 630 converges the incident light signal 270 to the receiving detector 641 of the receiving detection unit 640. The receiving detector 641 converts the received incident optical signal 270 into an electrical signal, and transmits the electrical signal to the cross-group amplifier 642 , which is used to amplify the received electrical signal.

[0114] Example 4: Fig.11As shown, when the second optical transmission module is arranged inside the package shell, that is, the optical transmission module based on the GPON laser and / or the optical transmission module based on the XG(S)-PON laser is arranged inside the package shell, the emission drive component 2120 is arranged outside the package shell, and the external and internal optical signal transmission is performed through the optical window. Assume that the optical transmission module based on the GPON laser and / or the optical transmission module based on the XG(S)-PON laser are both arranged inside the package shell, and the emission and reception of the second optical transmission module at this time do not need to be amplified by a semiconductor optical amplifier. Specifically, for the optical transmission module 910 based on the GPON laser, the second emission laser 911 inside the module emits a second emission light signal 912 (as shown by the solid line in the figure), and the second emission lens 913 collimates the second emission light signal 912 and transmits it to the second isolator 914. The second isolator 914 transmits the second emission light signal 912 to the first emission filter 710, and is also used to block the optical signal outside the package shell from entering the second emission lens 913 through the first emission filter 710. At the same time, the second backlight detector 915 can detect whether the optical power of the second optical emission signal 912 from the second emitting laser 911 is stable in a state. In addition, the third temperature controller (not shown in the figure) and the third thermistor (not shown in the figure) can keep the second emitting laser 911 working in a temperature stable state. Afterwards, the first transmitting filter 710 transmits the second optical emission signal 912 emitted by the optical transmitting module 910 based on the GPON laser to the optical window 250 through the second transmitting filter 720, and the optical window 250 converges the second optical emission signal 912 through the second converging lens 730 and transmits it to the adapter 740 to the optical distribution network ODN connected to the external communication of the optical transceiver device.

[0115] It should be noted that if Fig.11As shown, for the optical transmission module 920 based on the XG(S)-PON laser, the third emission laser 921 inside the module emits a third emission light signal 922 (as shown by the dotted line in the figure), and the third emission lens 923 collimates the third emission light signal 922 and transmits it to the third isolator 924. The third isolator 924 transmits the third emission light signal 922 to the second emission filter 720, and is also used to block the optical signal outside the package housing from entering the third emission lens 923 through the second emission filter 720. At the same time, the third backlight detector 925 can detect whether the optical power of the third emission light signal 922 from the third emission laser 921 is stable in a state. In addition, the fourth temperature controller (not shown in the figure) and the fourth thermistor (not shown in the figure) can keep the third emission laser 921 working in a temperature stable state. Afterwards, the second transmitting filter 720 transmits the third transmitting optical signal 922 to the optical window 250, and the second converging lens 730, the optical window 250 converges the third transmitting optical signal 922 through the second converging lens 730 and transmits it to the adapter 740 to the optical distribution network ODN connected to the external communication of the optical transceiver device.

[0116] It should be noted that if Figures 8 to 11 As shown, in the embodiments of the present invention, for the optical transmission module based on GPON laser and / or the optical transmission module based on XG(S)-PON laser, the electrical connection between the transmitting laser and the outside can also be connected to the ceramic circuit board on the shell by gold wire bonding, and the ceramic circuit board is then electrically connected to the external hardware PCB through a flexible printed circuit board. The specific connection method can refer to the description of the first optical transmission module in the above embodiment, which will not be repeated here.

[0117] It should be noted that if Figures 8 to 11 As shown, in the embodiment of the present invention, three optical transmission modules with different working wavelengths can be combined, and the three optical transmission modules can work simultaneously or separately, which is not specifically limited here.

[0118] The embodiment of the present invention integrates and packages the semiconductor optical amplifier, the transmitting laser, and the receiving detector in a housing, and adopts an external TO subpackaging solution, which can reuse the rich industrial chain resources of the current XG(S)-PON and XG-PON, and integrate the 50G-PON working rate and wavelength. Therefore, the optical transceiver device of the embodiment of the present invention can transmit optical signals of three different working wavelengths, and can receive optical signals of three wavelengths at the same time, which meets the three-mode working requirements of 50G-PON, XG(S)-PON, and GPON, thereby realizing the smooth upgrade of GPON, XG(S)-PON, and 50G-PON. Compared with the external SOA component form of the related art, it saves component cost and reduces component size.

[0119] The embodiment of the present invention further provides an optical line terminal, comprising an optical transceiver device, the optical transceiver device comprising a packaging shell and a first optical transmitting module, an optical receiving module, and a semiconductor optical amplification component located in the packaging shell, wherein:

[0120] A light window is arranged at the front end of the packaging shell;

[0121] The first optical transmission module is used to transmit a first transmission optical signal;

[0122] The semiconductor optical amplifier component is used for amplifying the first transmitted optical signal and transmitting it to the optical window, and is also used for amplifying the incident optical signal received through the optical window and transmitting it to the optical receiving module.

[0123] Exemplarily, the semiconductor optical amplification component of the optical line terminal includes: a first converging lens, a semiconductor optical amplifier, and a collimating lens. The first converging lens is used to converge the first transmitted light signal to the semiconductor optical amplifier, the semiconductor optical amplifier is used to amplify the first transmitted light signal and transmit it to the collimating lens, the collimating lens is used to collimate the amplified first transmitted light signal and transmit it to the optical window; the collimating lens is also used to collimate the incident light signal and transmit it to the semiconductor optical amplifier, the semiconductor optical amplifier is also used to amplify the incident light signal and transmit it to the first converging lens, and the first converging lens is also used to converge the amplified incident light signal to the optical receiving module.

[0124] Exemplarily, the first optical transmission module of the optical line terminal includes: a first transmission laser, a first transmission lens, and a first isolator, wherein the first transmission lens is arranged between the first transmission laser and the first isolator, and the first isolator is arranged between the first transmission lens and the wavelength division multiplexing module. The first transmission laser is used to transmit the first transmission light signal; the first transmission lens is used to collimate the first transmission light signal and transmit it to the first isolator; the first isolator is used to transmit the first transmission light signal to the wavelength division multiplexing module, and is also used to block the optical signal outside the package shell from entering the first transmission lens through the wavelength division multiplexing module.

[0125] Exemplarily, the optical line terminal further includes: a wavelength division multiplexing module, the wavelength division multiplexing module is used to transmit the first transmitted optical signal to the semiconductor optical amplifier, and the wavelength division multiplexing module is also used to transmit the amplified incident optical signal to the optical receiving module.

[0126] Exemplarily, the wavelength division multiplexing module of the optical line terminal includes: an optical substrate, a transmission filter, and a reflection filter. The transmission filter is arranged between the first optical transmitting module and the optical substrate, and the reflection filter is arranged between the optical receiving module and the optical substrate.

[0127] Exemplarily, the optical line terminal further includes: a transmitting drive component, which is disposed outside the package housing. The transmitting drive component is used to receive an incident optical signal, and is also used to receive an amplified first transmitting optical signal transmitted by the optical window, and transmit the amplified first transmitting optical signal to the optical distribution network.

[0128] Exemplarily, the transmit drive assembly of the optical line terminal includes: a first transmit filter, a second transmit filter, a second convergent lens, and an adapter. The second transmit filter is arranged between the first transmit filter and the second convergent lens, and the second convergent lens is arranged between the second transmit filter and the adapter.

[0129] Exemplarily, the optical line terminal further includes: a second optical transmission module, the second optical transmission module is arranged between the wavelength division multiplexing module and the adapter, and the second optical transmission module is used to transmit the emitted second transmission optical signal to the transmission driving component. The second optical transmission module includes at least one of the following: an optical transmission module based on a gigabit passive optical network GPON, and an optical transmission module based on a symmetric passive optical network XG(S)-PON with 10-Gigabit capability.

[0130] Exemplarily, the optical receiving module of the optical line terminal includes: an optical receiving component, which is used to allow only incident optical signals of a preset wavelength to be received.

[0131] Exemplarily, the optical line terminal further includes: a baffle, which is arranged between the first optical transmitting module and the optical receiving module.

[0132] Exemplarily, the optical line terminal further includes: a circuit board, which is disposed outside the packaging shell and is electrically connected to the first optical transmitting module and the optical receiving module respectively.

[0133] It should be noted that in the embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0134] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above implementation. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the embodiments of the present invention.

Claims

1. An optical transceiver device, comprising a package shell and a first optical transmitting module, an optical receiving module, and a semiconductor optical amplifier component located in the package shell, wherein: A light window is provided at the front end of the packaging shell; The first optical transmission module is used to transmit a first transmission optical signal; The semiconductor optical amplifier component is used to amplify the first emission optical signal and transmit it to the optical window, and is also used to amplify the incident optical signal received through the optical window and transmit it to the optical receiving module.

2. The device according to claim 1, characterized in that The semiconductor optical amplification component includes a first converging lens, a semiconductor optical amplifier, and a collimating lens; wherein, The first converging lens is used to converge the first emission light signal to the semiconductor optical amplifier, the semiconductor optical amplifier is used to amplify the first emission light signal and transmit it to the collimating lens, and the collimating lens is used to collimate the amplified first emission light signal and transmit it to the optical window; The collimating lens is further used to collimate the incident light signal and transmit it to the semiconductor optical amplifier, the semiconductor optical amplifier is further used to amplify the incident light signal and transmit it to the first converging lens, and the first converging lens is further used to converge the amplified incident light signal to the optical receiving module.

3. The device according to claim 1, characterized in that The device further comprises: a wavelength division multiplexing module; wherein, The wavelength division multiplexing module is used to transmit the first transmitted optical signal to the semiconductor optical amplification component, and the wavelength division multiplexing module is also used to transmit the amplified incident optical signal to the optical receiving module.

4. The device according to claim 3, characterized in that The first optical transmission module includes: a first transmission laser, a first transmission lens, and a first isolator, wherein the first transmission lens is arranged between the first transmission laser and the first isolator, and the first isolator is arranged between the first transmission lens and the wavelength division multiplexing module; wherein, The first transmitting laser is used to transmit the first transmitting light signal; The first transmitting lens is used to collimate the first transmitting optical signal and transmit it to the first isolator; The first isolator is used to transmit the first transmitting optical signal to the wavelength division multiplexing module, and is also used to block the optical signal outside the packaging housing from entering the first transmitting laser through the wavelength division multiplexing module.

5. The device according to claim 3, characterized in that The wavelength division multiplexing module includes an optical substrate, a transmission filter, and a reflection filter. The transmission filter is arranged between the first light transmitting module and the optical substrate, and the reflection filter is arranged between the light receiving module and the optical substrate.

6. The device according to claim 3, characterized in that The device further comprises: a launch drive component; wherein, The transmit driving component is used to receive the incident optical signal. The transmit driving component is also used to receive the amplified first transmit optical signal transmitted by the optical window, and transmit the amplified first transmit optical signal to the optical distribution network.

7. The device according to claim 6, characterized in that The transmit drive assembly includes a first transmit filter, a second transmit filter, a second converging lens, and an adapter. The second transmit filter is arranged between the first transmit filter and the second converging lens, and the second converging lens is arranged between the second transmit filter and the adapter.

8. The device according to claim 7, characterized in that The device further includes: a second optical transmission module, the second optical transmission module is arranged between the wavelength division multiplexing module and the adapter, and the second optical transmission module is used to transmit the emitted second emission optical signal to the emission driving component; wherein the second optical transmission module includes at least one of the following: Optical transmitter modules based on Gigabit Passive Optical Network (GPON) and optical transmitter modules based on Symmetric Passive Optical Network (XG(S)-PON) with 10-Gigabit capability.

9. The device according to any one of claims 1 to 8, characterized in that The optical receiving module includes an optical receiving component, and the optical receiving component is used to allow only the incident optical signal of a preset wavelength to be received.

10. The device according to any one of claims 1 to 8, characterized in that The device further includes: a baffle, which is arranged between the first optical transmitting module and the optical receiving module.

11. The device according to any one of claims 1 to 8, characterized in that The device further includes: a circuit board, which is disposed outside the packaging shell and is electrically connected to the first optical transmitting module and the optical receiving module respectively.

12. An optical line terminal, comprising the optical transceiver according to any one of claims 1 to 11.

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