Packaging method and packaging structure
By using peelable glue on the circuit board to form a storage space and injecting the packaging material, the glue spill problem caused by irregular products and thickness differences is solved, and a packaging method with wide applicability and low production cost is realized, and the removal of overflow spill is simplified. The process.
CN119110504AInactive Publication Date: 2024-12-10AVARY HLDG (SHENZHEN) CO LTD +1
Patent Information
- Application Number
- CN202310687297.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-09
- Publication Date
- 2024-12-10
- Estimated Expiration
- Not applicable · inactive patent
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Figure CN119110504A_ABST
Abstract
The packaging method comprises the following steps: mounting an electronic element on the surface of a circuit board; the surface of the circuit board is covered with peelable glue, the peelable glue surrounds the electronic element, and the peelable glue and the electronic element are arranged at intervals; covering a mold on the peelable glue, defining an accommodating space by the mold, the circuit board and the peelable glue, and accommodating the electronic element in the accommodating space; after injecting a packaging material into the accommodating space, solidifying the packaging material to form a packaging layer in the accommodating space; and removing the mold, and removing the peelable glue to obtain the packaging structure. The packaging method is wide in applicability and low in production cost. The invention also provides a packaging structure.
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Citation Information
Patent Citations
Circuit board structure with excess glue prevention layer, packaging method and manufacturing method thereof
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CN114449781A
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CN116017841A
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