Substrate assembly, display screen module and electronic equipment

Abstract

The invention discloses a substrate assembly, a display screen module and electronic equipment. The substrate assembly includes a substrate and a buffer. The substrate comprises a substrate body, a wiring layer and an organic layer which are arranged in a stacked mode, the wiring layer is located between the substrate body and the organic layer, the substrate comprises non-bending areas and a bending area, and the bending area is connected with the two adjacent non-bending areas in a bending mode. The buffer piece is arranged in the bending area and used for reducing the stress of the wiring layer located in the bending area. The substrate can be bent in the bending area, and the substrate, the wiring layer and the organic layer which are arranged in a stacked mode are bent together. Under the condition that the substrate is bent, the buffer piece can release stress on the wiring layer in the bending area, and damage or breakage of the wiring layer is avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a substrate assembly, a display screen module and an electronic device. Background Art

[0002] Some organic light-emitting diode (OLED) displays are made of flexible substrates and can be bent. The flexible substrate of the OLED display has a bending area, and the wiring in the bending area is generally made of metal straight lines. When the OLED display is bent, the internal metal straight lines will bend with it, resulting in the stress at the bending point of the metal straight lines being unable to be released, causing damage or breakage of the metal straight lines. Summary of the invention

[0003] The embodiments of the present application provide a substrate assembly, a display screen module and an electronic device, which are at least used to solve the problem that the metal inside the flexible substrate is easily damaged or broken when being bent.

[0004] The substrate assembly of the embodiment of the present application includes a substrate and a buffer. The substrate includes a substrate, a wiring layer and an organic layer arranged in layers, the wiring layer is located between the substrate and the organic layer, the substrate includes a non-bending area and a bending area, and the bending area is bent to connect two adjacent non-bending areas. The buffer is arranged in the bending area, and the buffer is used to reduce the stress of the wiring layer located in the bending area.

[0005] The display screen module of the embodiment of the present application includes a substrate assembly and a display assembly, and the substrate assembly includes a substrate and a buffer. The substrate includes a substrate, a wiring layer and an organic layer arranged in a stacked manner, and the wiring layer is located between the substrate and the organic layer. The substrate includes a non-bending area and a bending area, and the bending area is bent to connect two adjacent non-bending areas. The buffer is arranged in the bending area, and the buffer is used to reduce the stress of the wiring layer located in the bending area. The display assembly is arranged in the organic layer of one of the non-bending areas, and the display assembly is used to display a picture.

[0006] The electronic device of the embodiment of the present application includes a body and a display screen module, and the display screen module is installed on the body. The display screen module includes a substrate assembly and a display assembly, and the substrate assembly includes a substrate and a buffer. The substrate includes a substrate, a wiring layer and an organic layer arranged in a stacked manner, and the wiring layer is located between the substrate and the organic layer. The substrate includes a non-bending area and a bending area, and the bending area is bent to connect two adjacent non-bending areas. The buffer is arranged in the bending area, and the buffer is used to reduce the stress of the wiring layer located in the bending area. The display assembly is arranged in the organic layer of one of the non-bending areas, and the display assembly is used to display a picture.

[0007] In the substrate assembly, display module and electronic device of the present application, the substrate will bend in the bending area and cause the stacked substrate, wiring layer and organic layer to bend together. When the substrate is bent, the buffer can release the stress on the wiring layer in the bending area to avoid damage or breakage of the wiring layer.

[0008] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0010] Figure 1 is a schematic structural diagram of a substrate assembly of some embodiments of the present application;

[0011] Figure 2 yes Figure 1 A schematic cross-sectional structure diagram of the substrate assembly from another perspective;

[0012] Figure 3 It is a schematic diagram of the planar structure of the routing layer and the buffer of the substrate assembly in some embodiments of the present application;

[0013] Figure 4 yes Figure 1 A schematic cross-sectional structure diagram of the substrate assembly from another perspective;

[0014] Figure 5 is a schematic structural diagram of a substrate assembly of other embodiments of the present application;

[0015] Figure 6 is a schematic cross-sectional structure diagram of a substrate assembly in some other embodiments of the present application;

[0016] Figure 7 yes Figure 6A structural schematic diagram of the substrate assembly from another perspective shown;

[0017] Figure 8 is a schematic diagram of the structure of a display screen module according to some embodiments of the present application;

[0018] Fig. 9 It is a schematic diagram of the structure of an electronic device of certain embodiments of the present application.

[0019] Description of main component symbols:

[0020] 1000, electronic device; 100, display screen module; 200, main body; 10, substrate assembly; 30, display assembly; 11, substrate; 101, non-bending area; 103, bending area; 105, bending center line; 111, substrate; 113, routing layer; 1131, routing; 115, organic layer; 13, buffer; 131, first buffer portion; 133, second buffer portion; 135, accommodating space; 137, elastic member. DETAILED DESCRIPTION

[0021] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of the present application, and cannot be understood as limiting the embodiments of the present application.

[0022] In the description of the present application, it should be understood that the terms "thickness", "upper", "top", "bottom", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0023] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. In an example, it can be a fixed connection, or a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection, or they can communicate with each other; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements.

[0024] With the continuous development of display technology, OLED display technology is the mainstream display technology today. Flexible OLED display screens are widely used in various electronic devices and can realize functions such as full-screen display. Flexible OLED display screens are mostly made of flexible substrates that can be bent, but during the bending process, the bending degree of the bending zone of the substrate is large, and the bending shape is not fixed, resulting in the bending stress at both ends of the bending zone being concentrated near the vertex of the bending zone. Moreover, there are multiple metal traces in the substrate of the OLED display screen. When the bending stress in the bending zone is too large, the metal traces are prone to breakage.

[0025] In order to solve the problem that the metal line inside the flexible substrate is easily damaged or broken when it is bent, the present application provides a substrate assembly 10 ( Figure 1 As shown), display screen module 100 ( Figure 8 ) and electronic device 1000 ( Fig. 9 shown).

[0026] See also Figure 1 and Figure 2 The substrate assembly 10 of the present application includes a substrate 11 and a buffer 13. The substrate 11 includes a stacked substrate 111, a wiring layer 113 and an organic layer 115. The wiring layer 113 is located between the substrate 111 and the organic layer 115. The substrate 11 includes a non-bending area 101 and a bending area 103. The bending area 103 is bent to connect two adjacent non-bending areas 101. The buffer 13 is arranged in the bending area 103, and the buffer 13 is used to reduce the stress of the wiring layer 113 located in the bending area 103.

[0027] In the substrate assembly 10 of the present application, the substrate 11 is bent in the bending area 103 and the stacked substrate 111, wiring layer 113 and organic layer 115 are bent together. When the substrate 11 is bent, the buffer 13 can release the stress on the wiring layer 113 in the bending area 103 to avoid damage or breakage of the wiring layer 113.

[0028] The substrate assembly 10 is further described below with reference to the accompanying drawings.

[0029] See also Figure 1 and Figure 2 In some embodiments, the bending area 103 of the substrate 11 can be bent relative to the non-bending area 101 to form an arc. The non-bending area 101 of the substrate 11 can be electrically connected to an electrical component, for example: one of the non-bending areas 101 of the substrate 11 can be connected to the display component 30 ( Figure 8The non-bending area 101 of the substrate 11 can be electrically connected to the main board (not shown), for example, an OLED element is electrically connected, so that the non-bending area 101 of the substrate 11 emits light and displays an image. At this time, the non-bending area 101 can be a display area. Another non-bending area 101 of the substrate 11 can be electrically connected to the main board (not shown), which is convenient for outputting signals of the OLED element and controlling the OLED element. At the same time, due to the setting of the bending area 103, the OLED element and the main board can be better arranged, saving layout space.

[0030] Further, in some embodiments, the edge of the longitudinal section of the bending zone 103 is substantially arc-shaped, the longitudinal section of the bending zone 103 includes an inner edge and an outer edge opposite to each other, and the length of the inner edge of the longitudinal section of the bending zone 103 is less than the length of the outer edge of the longitudinal section of the bending zone 103. The bending zone 103 also has a vertex A and a concave point B. The vertex A of the bending zone 103 is located at the position where the curvature of the outer edge of the longitudinal section of the bending zone 103 is the largest, and the concave point B of the bending zone 103 is located at the position where the curvature of the inner edge of the longitudinal section of the bending zone 103 is the largest. The bending zone 103 also has a bending center line 105, the bending center line 105 is parallel to the extension direction of the non-bending zone 101, and the bending center line 105 passes through the vertex A of the bending zone 103 and the concave point B of the bending zone 103 respectively. At the vertex A and the concave point B of the bending area 103 (or on the bending center line 105), the stress (tensile stress and / or compressive stress) received by the routing layer 113 in the bending area 103 from both ends of the bending area 103 is the greatest, and the routing layer 113 is most likely to break in the area corresponding to the bending center line 105. Therefore, although the area corresponding to the bending center line 105 of the routing layer 113 is subjected to the greatest stress and is most likely to break, since the buffer 13 is provided on the bending center line 105, specifically, the buffer 13 is attached to the bending area 103 on the bending center line 105 and deforms, it can help disperse the stress of the routing layer 113 on the bending center line 105, thereby avoiding damage and breakage of the routing layer 113 to the greatest extent.

[0031] See also Figure 2 and Figure 3 In some embodiments, the substrate 111 is a flexible and bendable plate-like structure or film-like structure, and the substrate 111 can be used to carry the wiring layer 113 and the organic layer 115. When the substrate 111 is bent, the wiring layer 113 and the organic layer 115 can be bent together with the substrate 111, so that the substrate 11 can be bent according to the needs of the user. The substrate 111 can be made of polyimide (PI) or other suitable flexible materials. The wiring layer 113 is formed on one side of the substrate 111. In some embodiments, the wiring layer 113 covers the surface of the substrate 111. In other embodiments, the substrate 111 is provided with a groove, and the wiring layer 113 can be partially embedded in the substrate 111.

[0032] Please continue reading Figure 2 and Figure 3 In some embodiments, the routing layer 113 includes a plurality of routing lines 1131 so that the substrate 11 can be powered and transmit signals. The types of routing lines 1131 include, but are not limited to, scanning lines, charging lines, or signal transmission lines. The materials of routing lines 1131 include, but are not limited to, metals that can be deformed, such as silver, copper, or manganese. The routing lines 1131 include a length direction X and a width direction Y, wherein the length direction X of the routing lines 1131 is the extension direction of the routing lines 1131, that is, in the non-bending area 101, the length direction X of the routing lines 1131 is the direction from one end of any non-bending area 101 of the substrate 11 away from the bending area 103 to one end of the bending area 103 close to the non-bending area 101, or the direction from one end of the bending area 103 close to any non-bending area 101 to one end of the non-bending area 101 away from the bending area 103. In the bending area 103. The length direction X of the trace 1131 is the direction (arc-shaped path) from the end of the bending area 103 connected to one of the non-bending areas 101 along the extension direction of the bending area 103 to the end of the bending area 103 connected to the other non-bending area 101. The width direction Y of the trace 1131 is perpendicular to the length direction X of the trace 1131 ( Figure 1 in the direction perpendicular to the paper surface).

[0033] Specifically, in some embodiments, the routing layer 113 includes a plurality of routing lines 1131, and the plurality of routing lines 1131 are arranged at intervals on the substrate 111. The routing lines 1131 may be nanosilver wires formed on the substrate 111 or conductive wires formed on the substrate 111 by a copper plating process. In some embodiments, the routing layer 113 has only one layer. In other words, the plurality of routing lines 1131 are all disposed on the substrate 111 and are located on the same layer. In other embodiments, along the thickness direction of the routing lines 1131, the routing layer 113 may include multiple layers, the routing lines 1131 in each routing layer 113 are all located on the same layer, the routing lines 1131 in different routing layers 113 are located on different layers, and the routing lines 1131 in each routing layer 113 are spaced apart from each other in the same layer to achieve electrical insulation between the routing lines 1131 in the same layer. The wirings 1131 in the wiring layers 113 of different layers are also spaced apart from each other between layers to achieve electrical insulation between the wirings 1131 between layers. It should be noted that the electrical insulation between the wirings 1131 can be achieved by filling the organic layer 115 or the substrate 111 between the wirings 1131. In addition, the present application is described by taking only one wiring layer 113 as an example.

[0034] Furthermore, please combine Figure 5In some embodiments, the spaces between adjacent traces 1131 are filled with an organic layer 115. The organic layer 115 can insulate adjacent traces 1131 to prevent interference or short circuits between multiple traces 1131. In other embodiments, the substrate 111 is provided with grooves for embedding the traces 1131, and the spaces between adjacent traces 1131 are filled with the substrate 111.

[0035] See also Figure 1 and Figure 2 In some embodiments, the organic layer 115 is a plate-like structure or a film-like structure formed on a side of the wiring layer 113 away from the substrate 111. The organic layer 115 can be used to connect the buffer 13 and the display component 30 for forming an image ( Figure 8 ), such as an OLED device.

[0036] See also Figure 2 and Figure 3 In some embodiments, the buffer 13 is generally a structure capable of reducing or eliminating the stress generated by the routing layer 113 when it is bent. The buffer 13 is disposed in the bending area 103 and corresponds to the position of at least part of the routing 1131.

[0037] Furthermore, please combine Figure 4 In some embodiments, the buffer 13 is a metal interlayer disposed in the substrate 11 and connected to the wiring layer 113. The material of the buffer 13 includes but is not limited to manganese, aluminum or titanium aluminum laminated metal with a certain elasticity. In some embodiments, the buffer 13 is made of the same material as the wiring layer 113. In other embodiments, the buffer 13 is made of a different material from the wiring layer 113. The buffers 13 disposed on adjacent wirings 1131 are electrically insulated from each other to prevent adjacent wirings 1131 from being electrically connected through the buffer 13, resulting in a short circuit in the wiring 1131.

[0038] Specifically, in some embodiments, the buffer 13 includes multiple buffers, and each buffer 13 is in direct contact with a routing line 1131 to provide a stress to the corresponding routing line 1131 in the opposite direction to the stress generated when the routing line 1131 is bent, thereby reducing the stress ultimately received by the routing line 1131 and making the routing 1131 less likely to break.

[0039] More specifically, in some embodiments, the buffer 13 is disposed between the substrate 111 and the organic layer 115 and is at least partially disposed on the bending center line 105. When the bending area 103 is bent, the substrate 111, the wiring layer 113 and the organic layer 115 can all bend. Since the substrate 111 and the organic layer 115 are both fixedly connected to the wiring layer 113, the side of the wiring 1131 close to the convex point A of the bending area 103 will be subjected to the tensile stress generated by the two ends of the organic layer 115, and the side of the wiring 1131 close to the concave point B of the bending area 103 will be subjected to the compressive stress generated by the two ends of the substrate 111. In addition, the tensile stress at the convex point C and the compressive stress at the concave point D of the wiring 1131 located on the bending center line 105 are both the largest, and the wiring 1131 is most likely to be damaged or broken at the position corresponding to the bending center line 105.

[0040] In some embodiments, the buffer 13 is disposed between the wiring layer 113 and the organic layer 115 and is at least attached to the bump C of the wiring 1131. When the bending area 103 is bent, the buffer 13 is bent and deformed accordingly. At this time, since the buffer 13 is elastic, the side of the buffer 13 close to the wiring 1131 can apply force to the wiring 1131 to disperse the tensile stress on the side of the wiring 1131 close to the bump A of the bending area 103, thereby preventing the side of the wiring 1131 close to the bump A of the bending area 103 from being damaged or broken.

[0041] In other embodiments, the buffer 13 is disposed between the routing layer 113 and the substrate 111 and is at least attached to the concave point D of the routing 1131. When the bending area 103 is bent, the buffer 13 is bent and deformed accordingly. At this time, since the buffer 13 is elastic, the side of the buffer 13 close to the routing 1131 can apply force to the routing 1131 to disperse the compressive stress on the side of the routing 1131 close to the concave point B of the bending area 103, thereby preventing the side of the routing 1131 close to the concave point B of the bending area 103 from being damaged or broken.

[0042] More specifically, in some embodiments, the routing wire 1131 of the routing layer 113 passes through the buffer 13 and is connected to the buffer 13. At this time, one side of the buffer 13 is connected to the substrate 111, and the other side of the buffer 13 is connected to the organic layer 115. The portion of the routing wire 1131 passing through the buffer 13 is isolated from the substrate 111 and the organic layer 115, respectively.

[0043] Also specifically, in some embodiments, the buffer 13 includes a first buffer portion 131 and a second buffer portion 133 connected to each other. The first buffer portion 131 is provided between the wiring layer 113 and the substrate 111. One side of the second buffer portion 133 is connected to the first buffer portion 131, and the other side of the second buffer portion 133 is connected to the organic layer 115. An accommodating space 135 is formed between the first buffer portion 131 and the second buffer portion 133. The wiring layer 113 is penetrated in the accommodating space 135 and contacts the first buffer portion 131 and the second buffer portion 133 respectively. In some embodiments, the materials of the first buffer portion 131 and the second buffer portion 133 are the same. In other embodiments, the materials of the first buffer portion 131 and the second buffer portion 133 are different. When the bending zone 103 is bent, the first buffer portion 131 and the second buffer portion 133 can be bent and deformed accordingly. Since the first buffer portion 131 and the second buffer portion 133 are both fixed to both sides of the wiring 1131 and have elasticity, the first buffer portion 131 can disperse the compressive stress on the side of the wiring 1131 with the concave point D, and the second buffer portion 133 can disperse the tensile stress on the side of the wiring 1131 with the convex point C. Compared with the solution in which the buffer 13 is only provided on one side of the wiring 1131, the first buffer portion 131 and the second buffer portion 133 can better disperse the stresses in different directions on both sides of the wiring 1131, thereby avoiding damage or breakage of the wiring 1131 to the greatest extent.

[0044] For further information, see Figure 5 and Figure 6 In some embodiments, the buffer 13 may further include an elastic member 137, which is disposed on the outer side of the substrate 11 and extends along the arrangement direction of the multiple routing layers 113. That is, the elastic member 137 is disposed along the width direction Y of the routing 1131, and the buffer 13 corresponds to the position of at least part of the routing 1131. The buffer 13 can be either a metal with a certain elasticity or a non-metal with a certain elasticity. When the bending zone 103 is bent, the routing 1131 in the bending zone 103 will be subjected to the compressive stress generated by the two ends of the bending zone 103 on the side close to the concave point B of the bending zone 103, and the routing 1131 in the bending zone 103 will be subjected to the tensile stress generated by the two ends of the bending zone 103 on the side close to the convex point A of the bending zone 103.

[0045] Please combine Figure 7In some embodiments, the buffer 13 is disposed on a side of the organic layer 115 away from the wiring layer 113 and is at least attached to the convex point A of the bending area 103. When the bending area 103 is bent, the buffer 13 is bent and deformed accordingly. At this time, since the buffer 13 is elastic, the side of the buffer 13 close to the organic layer 115 can apply force to the wiring 1131 in the substrate 11 through the organic layer 115 to disperse the tensile stress on the side of the wiring 1131 close to the convex point A of the bending area 103, thereby avoiding damage or breakage of the side of the wiring 1131 close to the convex point A of the bending area 103.

[0046] In other embodiments, the buffer 13 is disposed on a side of the substrate 111 away from the routing layer 113 and is at least attached to the concave point B of the routing 1131. When the bending zone 103 is bent, the buffer 13 is bent and deformed accordingly. At this time, since the buffer 13 is elastic, the side of the buffer 13 close to the substrate 111 can apply a tensile force to the routing 1131 in the substrate 11 through the substrate 111 to disperse the compressive stress on the side of the routing 1131 close to the concave point B of the bending zone 103, thereby avoiding damage or breakage of the side of the routing 1131 close to the concave point B of the bending zone 103.

[0047] In some other embodiments, the buffer 13 includes two buffers 13 disposed in opposite directions, wherein one buffer 13 is disposed on a side of the organic layer 115 away from the wiring layer 113 and is at least fixed to the convex point A of the bending area 103, and the other buffer 13 is disposed on a side of the substrate 111 away from the wiring layer 113 and is at least fixed to the concave point B of the bending area 103. Compared with the solution in which the buffer 13 is disposed on only one side of the substrate 11, the two buffers 13 can better disperse stresses in different directions on both sides of the wiring 1131 through the substrate 11, thereby avoiding damage or breakage of the wiring 1131 to the greatest extent.

[0048] See also Figure 1 and Figure 8 The present application also provides a display screen module 100. The display screen module 100 includes a substrate assembly 10 and a display assembly 30. The display assembly 30 is disposed on an organic layer 115 of one of the non-bending regions 101. The display assembly 30 is used to display images.

[0049] In the display screen module 100 of the present application, the non-display area of ​​the display screen module 100 can be bent to change the shape of the display screen module 100, and the non-display area can be electrically connected to other components. The bent substrate assembly 10 can save installation space.

[0050] See also Figure 8 and Fig. 9The present application also provides an electronic device 1000 . The electronic device 1000 includes a body 200 and a display screen module 100 , and the display screen module 100 is installed on the body 200 .

[0051] In the electronic device 1000 of the present application, the display module 100 can be bent to match the shape of the body 200, and the buffer member 13 in the display module 100 can release the stress on the wiring layer 113 in the bending area 103 of the display module 100 to avoid damage or breakage of the wiring layer 113.

[0052] In the description of this specification, the descriptions with reference to the terms "certain embodiments", "in an example", "exemplarily", etc., mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0053] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A substrate assembly, characterized in that: include: A substrate, the substrate comprising a stacked substrate, a wiring layer and an organic layer, the wiring layer being located between the substrate and the organic layer, the substrate comprising a non-bending area and a bending area, the bending area bending to connect two adjacent non-bending areas; and A buffer is provided in the bending area, and is used to reduce the stress of the routing layer located in the bending area.

2. The substrate assembly according to claim 1, characterized in that: The routing layer includes a plurality of routings, the plurality of routings are spaced apart and arranged on the substrate, the intervals between adjacent routings are filled with the organic layer, and the buffer corresponds to at least a portion of the routings.

3. The substrate assembly according to claim 2, characterized in that: The buffer component is disposed in the substrate and connected to the wiring layer, and adjacent buffer components are spaced apart from each other.

4. The substrate assembly according to claim 3, characterized in that: The buffer component is arranged between the substrate and the organic layer, and the routing layer passes through the buffer component.

5. The substrate assembly according to claim 4, characterized in that: The buffer and the routing layer are both made of metal.

6. The substrate assembly according to claim 4, characterized in that: The buffer member comprises: A first buffer portion, the first buffer portion is provided between the routing layer and the substrate; and A second buffer portion, one side of the second buffer portion is connected to the first buffer portion, the other side of the second buffer portion is connected to the organic layer, an accommodating space is formed between the first buffer portion and the second buffer portion, the routing layer is penetrated in the accommodating space and contacts the first buffer portion and the second buffer portion respectively.

7. The substrate assembly according to claim 2, characterized in that: The buffer is arranged on the outer side of the substrate, and the buffer is arranged on a side of the substrate away from the wiring layer and / or a side of the organic layer away from the wiring layer.

8. The substrate assembly according to claim 7, characterized in that: The buffer member includes an elastic member, and the elastic member extends along an arrangement direction of the plurality of routing layers.

9. The substrate assembly according to claim 1, characterized in that: The bending zone has a bending center line, the bending center line is parallel to the extension direction of the non-bending zone, the bending center line passes through the vertex of the bending zone, and the buffer is located on the bending center line.

10. A display screen module, characterized in that: include: The substrate assembly according to any one of claims 1 to 9; and A display component is disposed on the organic layer of one of the non-bending regions, and is used for displaying images.

11. An electronic device, characterized in that: include: ontology; and The display screen module described in claim 10 is installed on the main body.

Images