Bundy wire manufacturing method and device, electronic equipment and storage medium

Abstract

The invention discloses a Bundy wire manufacturing method and device, electronic equipment and a storage medium, and relates to the technical field of Bundy wires, a semi-finished product Bundy wire is soaked in a first glue bearing module, when the semi-finished product Bundy wire passes through a first transmission module, a first drying module carries out first drying treatment, and after the first drying treatment, the semi-finished product Bundy wire passes through a second transmission module; when the semi-finished product Bundy line passes through the first transmission module, the first drying module performs second drying treatment on the semi-finished product Bundy line, so that the bonding glue on the semi-finished product Bundy line is in a semi-dry state, and then the semi-finished product Bundy line is soaked in the first glue bearing module, so that the bonding glue is attached to the semi-finished product Bundy line again; the second drying time of the second drying treatment is longer than the first drying time of the first drying treatment, so that the binding glue on the semi-finished product Bundy line is completely dried and cured. Thus, through two times of soaking, the first drying treatment and the second drying treatment, the binding glue on the semi-finished product Bundy line is firm and not prone to falling off, and therefore the quality of the Bundy line is improved.

Description

Technical Field

[0001] The present application relates to the technical field of bondi wires, and in particular to a method, device, electronic device and storage medium for manufacturing bondi wires. Background Art

[0002] Bondi thread usually refers to a specially treated sewing thread, which may be made of nylon, polyester or other synthetic fibers, and has the characteristics of high strength, wear resistance, water resistance, chemical corrosion resistance, etc. This thread is often used in sewing tasks that require high strength and durability, such as sewing car seats, airbags, parachutes, diving suits, etc. Bondi thread is obtained by twisting multiple thin threads, and the production process of the bondi thread requires further bonding of multiple thin threads with glue. However, the bondi thread prepared by the related technology is easy to fall off when used, and the quality is poor. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a method, device, electronic device and storage medium for manufacturing a bondi wire, which can realize automated production of the bondi wire and improve the quality of the bondi wire.

[0004] According to the first aspect of the present application, the method for manufacturing a bonded wire is applied to a manufacturing device, wherein the manufacturing device comprises an unwinding module, a first glue receiving module, a first drying module, a first transmission module, a second transmission module, a second glue receiving module, a first surface treatment module, a second surface treatment module and a winding module, wherein the first drying module is arranged on one side of the first transmission module, and the second drying module is arranged on one side of the second transmission module, and the unwinding module is used to release the semi-finished bonded wire and drive the semi-finished bonded wire to move; the semi-finished bonded wire passes through the first glue receiving module, the first transmission module, the second glue receiving module, the second transmission module, the first surface treatment module, the second surface treatment module and the winding module in sequence; the first glue receiving module and the second glue receiving module are both provided with bonded glue; when the semi-finished bonded wire passes through the first glue receiving module and the second glue receiving module, it is immersed in the bonded glue;

[0005] The method comprises:

[0006] Control the unwinding module to release the semi-finished product bonded wire and drive the semi-finished product bonded wire to move;

[0007] Controlling the first drying module to perform a first drying process on the semi-finished product bonded wire on the first transmission module;

[0008] Controlling the second drying module to perform a second drying process on the semi-finished product bonded wire on the second transmission module; wherein the second drying time of the second drying process is greater than the first drying time of the first drying process;

[0009] Controlling the first surface treatment module to perform a first surface treatment on the semi-finished bonded wire that has undergone the second drying treatment, so as to remove attachments on the outer surface of the semi-finished bonded wire;

[0010] Controlling the second surface treatment module to perform a second surface treatment on the semi-finished bonded wire that has undergone the glue agglomeration removal treatment, so as to form a protective layer on the outer surface of the semi-finished bonded wire;

[0011] The winding module is controlled to wind up the finished product bonded wire.

[0012] According to the manufacturing method of the Bondi line of the embodiment of the present application, there are at least the following beneficial effects: in the manufacturing method of the Bondi line of the present application, the semi-finished Bondi line passes through the first glue receiving module, the first transmission module, the second glue receiving module, the second transmission module, the first surface treatment module, the second surface treatment module and the winding module in sequence, and the semi-finished Bondi line is immersed in the glue when passing through the first glue receiving module and the second glue receiving module; the semi-finished Bondi line is first immersed in the first glue receiving module, and when passing through the first transmission module, the first drying module performs a first drying treatment, and the first time of the first drying treatment is relatively short. After the first drying treatment, the glue on the semi-finished Bondi line is in a semi-dry state, and then the semi-finished Bondi line is immersed in the first glue receiving module, so that the semi-finished Bondi line is attached with glue again, and then when the semi-finished Bondi line passes through the second transmission module, the second drying module performs a second drying treatment, so that the second drying time of the second drying treatment is greater than the first drying time of the first drying treatment, and the second drying time is relatively long, so that the glue on the semi-finished Bondi line is completely dried and solidified. In this way, after two soakings and the first drying treatment and the second drying treatment, the adhesive on the semi-finished bonded wire is relatively firm and not easy to fall off, thereby improving the quality of the bonded wire; after that, the first surface treatment module is controlled to perform the first surface treatment on the semi-finished bonded wire that has undergone the second drying treatment to remove the attachments on the outer surface of the semi-finished bonded wire; the second surface treatment module is controlled to perform the second surface treatment on the semi-finished bonded wire that has undergone the glue agglomeration removal treatment to form a protective layer on the outer surface of the semi-finished bonded wire; the winding module is controlled to wind up the finished bonded wire. Therefore, the present application can realize the automated production of the bonded wire, and the adhesive on the bonded wire is relatively firm and not easy to fall off, thereby improving the quality of the bonded wire.

[0013] According to some embodiments of the present application, the first transmission module includes a first distance adjustment component, a first fixed shaft and a first movable shaft, and the first fixed shaft and the first movable shaft are at the same horizontal height; the first drying module includes a plurality of first drying units, and the first drying units are arranged in sequence along the movement direction of the semi-finished product bonded line;

[0014] The second transmission module includes a second distance adjustment component and a plurality of transmission components, and the plurality of transmission components are sequentially arranged along the vertical direction; the transmission component includes a second fixed shaft and a second movable shaft, and the second fixed shaft and the corresponding second movable shaft are at the same horizontal height; the second drying module includes a plurality of second drying units, and the plurality of second drying units are sequentially arranged along the moving direction of the semi-finished product bonded line; the semi-finished product bonded line is sequentially wound around the transmission components, and the transmission directions of adjacent transmission components are opposite;

[0015] The controlling the first drying module to perform a first drying process on the semi-finished product bonded wire on the first transmission module includes:

[0016] Controlling the first distance adjustment component to drive the first movable axis to move in a horizontal direction so that the distance between the first movable axis and the first fixed axis is a first length;

[0017] Determine a first number of target first drying units based on the first length, and control the target first drying units to perform drying;

[0018] The controlling the second drying module to perform a second drying process on the semi-finished product bonded wire on the second transmission module includes:

[0019] Control the second distance adjustment assembly to drive each of the second movable shafts to move in the horizontal direction, so that the distance between each of the second movable shafts and the corresponding second fixed shaft is a second length; wherein the second length*the number of transmission assemblies>the first length;

[0020] A second number of target second drying units is determined based on the second length, and the target second drying units are controlled to perform drying.

[0021] According to some embodiments of the present application, the first length and the second length are determined by the following steps:

[0022] Get the glue type of the bond;

[0023] The first length and the second length are determined from a preset mapping relationship based on the glue type.

[0024] According to some embodiments of the present application, the second surface treatment module is provided with a heating component and a wax coating roller, and when the semi-finished product bonded wire passes through the second surface treatment module, it first passes through the heating component and then passes through the wax coating roller;

[0025] The controlling the second surface treatment module to apply wax to the semi-finished bonded wire after the glue agglomeration removal treatment comprises:

[0026] Controlling the heating component to heat the semi-finished bonded wire after the glue agglomeration removal treatment;

[0027] The wax coating roller is controlled to rotate so that the wax on the outer surface of the wax coating roller melts and adheres to the semi-finished product Bondi wire when it contacts the semi-finished product Bondi wire.

[0028] According to some embodiments of the present application, the winding module includes a clamping assembly, a first drive assembly, a second drive assembly, a third drive assembly and a slider, the first drive assembly is used to drive the clamping assembly to clamp the receiving shaft, the second drive assembly is used to drive the clamping assembly to rotate, so as to drive the receiving shaft to rotate; the finished bond wire is passed through the slider; the slider is arranged on one side of the clamping assembly, and the third drive assembly is connected to the slider;

[0029] The controlling the winding module to wind up the finished product bonded line comprises:

[0030] Control the first driving assembly to control the clamping assembly to clamp the receiving shaft;

[0031] The second driving assembly is controlled to drive the clamping assembly to rotate, so as to drive the receiving shaft to rotate, and the third driving assembly is controlled to drive the slider to drive the finished bond wire to reciprocate along the length direction of the receiving shaft.

[0032] According to some embodiments of the present application, the glue type includes a first glue; the first glue includes polybutene adhesive, pure water, ammonium hydroxide, a curing agent, a coupling agent, a degreasing agent, a phosphorus-free agent, an emulsifier and polyacrylamide, and the weight ratio between the polybutene adhesive, pure water, ammonium hydroxide, a curing agent, a coupling agent, a degreasing agent, a phosphorus-free agent, an emulsifier and polyacrylamide is 1: 2.7~2.9: 0.003~0.005: 0.9~1.1: 0.21~0.23: 0.06~0.08: 0.21~0.23: 0.28~0.30: 0.007~0.009.

[0033] According to some embodiments of the present application, the first glue is prepared by the following steps:

[0034] Pour the polybutene adhesive and the pure water into a stirring container for first stirring; wherein the weight ratio of the polybutene adhesive to the pure water is 1:2.7-2.9;

[0035] Pour the ammonium hydroxide into the stirring container for a second stirring; wherein the weight ratio of the polybutene adhesive to the ammonium hydroxide is 1:0.003-0.005;

[0036] Pour the coupling agent and the degreasing agent into the stirring container for a third stirring; wherein the weight ratio of the polybutene adhesive, the coupling agent, and the degreasing agent is 1:0.21-0.23:0.06-0.08;

[0037] Pour the phosphorus-free agent and the emulsifier into the stirring container for a fourth stirring; wherein the weight ratio of the polybutene adhesive, the phosphorus-free agent and the emulsifier is 1:0.21-0.23:0.28-0.30;

[0038] The polyacrylamide is poured into the stirring container for a fifth stirring; wherein the weight ratio between the polybutene adhesive and the polyacrylamide is 1:0.007-0.009.

[0039] The second aspect of the present application provides a Bondi line manufacturing device, which is applied to manufacturing equipment, wherein the manufacturing equipment includes an unwinding module, a first glue receiving module, a first drying module, a first transmission module, a second transmission module, a second glue receiving module, a first surface treatment module, a second surface treatment module and a winding module, wherein the first drying module is arranged on one side of the first transmission module, and the second drying module is arranged on one side of the second transmission module, and the unwinding module is used to release the semi-finished Bondi line and drive the semi-finished Bondi line to move; the semi-finished Bondi line passes through the first glue receiving module, the first transmission module, the second glue receiving module, the second transmission module, the first surface treatment module, the second surface treatment module and the winding module in sequence; the first glue receiving module and the second glue receiving module are both provided with Bond glue; when the semi-finished Bondi line passes through the first glue receiving module and the second glue receiving module, it is immersed in the Bond glue;

[0040] The device comprises:

[0041] An unwinding unit, used for controlling the unwinding module to release the semi-finished bonded wire and drive the semi-finished bonded wire to move;

[0042] A first drying unit, used for controlling the first drying module to perform a first drying process on the semi-finished product bonded wire on the first transmission module;

[0043] A second drying unit controls the second drying module to perform a second drying process on the semi-finished product bonded wire on the second transmission module; wherein a second drying time of the second drying process is greater than a first drying time of the first drying process;

[0044] A first surface treatment unit, used for controlling the first surface treatment module to perform a first surface treatment on the semi-finished bonded wire that has undergone the second drying treatment, so as to remove attachments on the outer surface of the semi-finished bonded wire;

[0045] A second surface treatment unit is used to control the second surface treatment module to perform a second surface treatment on the semi-finished bonded wire that has undergone the glue agglomeration removal treatment, so as to form a protective layer on the outer surface of the semi-finished bonded wire;

[0046] The winding unit is used to control the winding module to wind up the finished product bonded wire.

[0047] The third aspect of the present application provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the method for manufacturing a Bondi wire as described in any one of the first aspect of the present application is implemented.

[0048] The fourth aspect of the present application provides a computer-readable storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the method for manufacturing a Bondi wire as described in any one of the first aspect embodiments is implemented.

[0049] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0051] Figure 1 A schematic diagram of the structure of a Bondi wire manufacturing device according to an embodiment of the present application;

[0052] Figure 2 A schematic diagram of the steps of the method for manufacturing a bondi wire according to an embodiment of the present application;

[0053] Figure 3 A schematic diagram of a part of the structure of a manufacturing device according to an embodiment of the present application;

[0054] Figure 4 This is a schematic diagram of the structure of the winding module of an embodiment of the present application;

[0055] Figure 5This is a schematic structural diagram of a Bondi wire manufacturing device according to an embodiment of the present application;

[0056] Figure 6 A schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0057] Reference numerals:

[0058] The unloading shaft 101; the driving shaft 102; the auxiliary shaft 103; the first glue receiving module 104; the second glue receiving module 105; the first transmission module 110; the first fixed shaft 111; the first movable shaft 112; the first distance adjustment component 113; the second transmission module 120; the second fixed shaft 121; the second movable shaft 122; the second distance adjustment component 123; the first grinding shaft 131; the second grinding shaft 132; the heating component 141; the wax coating roller 142; the winding module 150; the winding shaft 151; the clamping component 152; the first driving component 153; the second driving component 154; the slider 155; the third driving component 156; the first drying unit 160; the second drying unit 170. DETAILED DESCRIPTION

[0059] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0060] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0061] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0062] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0063] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0064] Waibang Bondi thread uses high-quality low-stretch polyester fiber or nylon filament with glue on the outer layer, and is matched with thread oil with special lubricating formula. It is resistant to high temperature, does not stretch, does not fade, does not break, does not lint, and has waterproof and mildew-proof properties during the sewing process. Waibang Bondi thread is suitable for sewing threads with various high-strength tensile requirements. Waibang Bondi thread needs to be attached with glue on the outer surface during the production process, but the glue on the outer surface of Waibang Bondi thread produced by related technology is easy to fall off and the quality is poor.

[0065] Based on this, the embodiments of the present application propose a method, device, electronic device and storage medium for manufacturing a Bondi wire, which can realize automated production of the Bondi wire and improve the quality of the Bondi wire.

[0066] Reference Figure 1 , Figure 1 The schematic diagram of the structure of the manufacturing equipment of the bonded wire of the embodiment of the present application is shown in FIG. The manufacturing equipment includes an unwinding module, a first glue receiving module 104, a first drying module, a first transmission module 110, a second transmission module 120, a second glue receiving module 105, a first surface treatment module, a second surface treatment module and a winding module 150. The first drying module is arranged on one side of the first transmission module 110, and the second drying module is arranged on one side of the second transmission module 120. The unwinding module is used to release the semi-finished bonded wire and drive the semi-finished bonded wire to move; the semi-finished bonded wire passes through the first glue receiving module 104, the first transmission module 110, the second glue receiving module 105, the second transmission module 120, the first surface treatment module, the second surface treatment module and the winding module 150 in sequence; the first glue receiving module 104 and the second glue receiving module 105 are both provided with bonded glue; when the semi-finished bonded wire passes through the first glue receiving module 104 and the second glue receiving module 105, it is immersed in the bonded glue. Specifically, the semi-finished Bondi thread refers to a Bondi thread in which a plurality of thin threads have been twisted.

[0067] The semi-finished product bonded wire is immersed in the bonded glue when passing through the first glue receiving module 104 and the second glue receiving module 105; the semi-finished product bonded wire is first immersed in the first glue receiving module 104, and when passing through the first transmission module 110, the first drying module performs the first drying treatment, and the first time of the first drying treatment is relatively short. After the first drying treatment, the bonded glue on the semi-finished product bonded wire is in a semi-dry state, and then the semi-finished product bonded wire is immersed in the first glue receiving module 104, so that the semi-finished product bonded wire is attached with the bonded glue again ... When the wire passes through the second transmission module 120, the second drying module performs a second drying treatment, so that the second drying time of the second drying treatment is greater than the first drying time of the first drying treatment; thereafter, the first surface treatment module performs a first surface treatment on the semi-finished Bondi wire that has undergone the second drying treatment to remove attachments on the outer surface of the semi-finished Bondi wire; the second surface treatment module performs a second surface treatment on the semi-finished Bondi wire that has undergone the glue agglomeration removal treatment to form a protective layer on the outer surface of the semi-finished Bondi wire; and the winding module 150 is controlled to wind up the finished Bondi wire.

[0068] The first aspect of the present application provides a method for manufacturing a bondi wire. The method for manufacturing a bondi wire is applied to Figure 1 Schematic diagram of the Bondi wire manufacturing equipment. Figure 2 , Figure 2 The step flow diagram of the method for manufacturing a bondi wire according to an embodiment of the present application is shown in FIG. The method for manufacturing a bondi wire may include but is not limited to steps S210 to S260.

[0069] Step S210, controlling the unwinding module to release the semi-finished bonded wire and drive the semi-finished bonded wire to move;

[0070] It is worth noting that referring to Figure 1 The unwinding module includes a discharge shaft 101 and a power assembly. The power assembly includes a motor, a driving shaft 102 and two auxiliary shafts 103. The driving shaft 102 is arranged between the two auxiliary shafts 103. The semi-finished Bundy line is released from the discharge shaft 101 and is sequentially wound around the auxiliary shafts 103 and the driving shaft 102. The driving shaft 102 is driven to rotate by the motor, and the semi-finished Bundy line is driven to move when the main shaft rotates.

[0071] In one embodiment, the Bondi wire manufacturing equipment is also provided with multiple power components, and the rotation speed of the motors of each power component is the same. For example, a power component is provided between controlling the first surface treatment module and the second surface treatment module, for example, a power component is provided between the second surface treatment module and the winding module 150.

[0072] Step S220, controlling the first drying module to perform a first drying process on the semi-finished product bonded wire on the first transmission module;

[0073] Step S230, controlling the second drying module to perform a second drying process on the semi-finished product bonded wire on the second transmission module; wherein the second drying time of the second drying process is greater than the first drying time of the first drying process;

[0074] It is worth noting that when the semi-finished product bonded line passes through the first transmission module 110, it moves along the length direction of the first transmission module 110; when the semi-finished product bonded line passes through the second transmission module 120, it moves along the length direction of the second transmission module 120. Since the bonded line speed of the semi-finished products at various locations is the same during the movement of the semi-finished product bonded line, the length of the second transmission module 120 is greater than the length of the first transmission module 110, so that the time length of the semi-finished product bonded line passing through the second transmission module 120 is greater than the time length of the semi-finished product passing through the first transmission module 110, thereby achieving that the second drying time of the second drying process is greater than the first drying time of the first drying process.

[0075] Step S240, controlling the first surface treatment module to perform a first surface treatment on the semi-finished bonded wire that has undergone the second drying treatment, so as to remove attachments on the outer surface of the semi-finished bonded wire;

[0076] It is worth noting that referring to Figure 1 The first surface treatment module includes a first grinding shaft 131 and a second grinding shaft 132. The first grinding shaft 131 is arranged above the second grinding shaft 132. The outer surface of the first grinding shaft 131 is provided with a grinding material. The outer surface of the second grinding shaft 132 is smooth. The semi-finished Bondi wire is located between the first grinding shaft 131 and the second grinding shaft 132. The semi-finished Bondi wire contacts the first grinding shaft 131 and the second grinding shaft 132 during movement to generate friction. The first grinding shaft 131 and the second grinding shaft 132 can remove attachments on the outer surface of the semi-finished Bondi wire during friction, such as removing the lumps of the glue on the outer surface of the semi-finished Bondi wire, so that the outer surface of the semi-finished Bondi wire is smooth. In one embodiment, the grinding material is polyurethane, and those skilled in the art can set a specific grinding material according to actual needs.

[0077] Step S250, controlling the second surface treatment module to perform a second surface treatment on the semi-finished bonded wire that has undergone the glue agglomeration removal treatment, so that a protective layer is formed on the outer surface of the semi-finished bonded wire;

[0078] It is worth noting that referring to Figure 1 The second surface treatment module is provided with a heating component 141 and a wax coating roller 142. When the semi-finished product of the bonded wire passes through the second surface treatment module, it first passes through the heating component 141 and then passes through the wax coating roller 142;

[0079] Then the second surface treatment module is controlled to wax the semi-finished bonded wire after the glue agglomeration removal treatment, including:

[0080] Controlling the heating component 141 to heat the semi-finished bonded wire after the glue agglomeration removal treatment;

[0081] The wax coating roller 142 is controlled to rotate so that the wax on the outer surface of the wax coating roller 142 melts and adheres to the semi-finished bonded thread when it contacts the semi-finished bonded thread. In this way, a protective layer can be formed on the outer surface of the semi-finished bonded thread, further making the outer surface of the semi-finished bonded thread smooth, thereby improving its performance during sewing and protecting the bonded thread.

[0082] Step S260, controlling the winding module to wind up the finished product of the bondi line.

[0083] In the embodiment of the present application, through steps S210 to S260, the semi-finished Bond line is immersed in the glue when passing through the first glue receiving module 104 and the second glue receiving module 105; the semi-finished Bond line is first immersed in the first glue receiving module 104, and when passing through the first transmission module 110, the first drying module performs a first drying treatment, and the first drying time of the first drying treatment is relatively short. After the first drying treatment, the glue on the semi-finished Bond line is in a semi-dry state, and then the semi-finished Bond line is immersed in the first glue receiving module 104, so that the semi-finished Bond line is attached with glue again, and then when the semi-finished Bond line passes through the second transmission module 120, the second drying module performs a second drying treatment, so that the second drying time of the second drying treatment is greater than the first drying time of the first drying treatment, and the second drying time is relatively long, so that the glue on the semi-finished Bond line is completely dried and solidified. In this way, after two soakings and the first drying treatment and the second drying treatment, the adhesive on the semi-finished bonded wire is relatively firm and not easy to fall off, thereby improving the quality of the bonded wire; then, the first surface treatment module is controlled to perform the first surface treatment on the semi-finished bonded wire that has undergone the second drying treatment to remove the attachments on the outer surface of the semi-finished bonded wire; the second surface treatment module is controlled to perform the second surface treatment on the semi-finished bonded wire that has undergone the glue agglomeration removal treatment to form a protective layer on the outer surface of the semi-finished bonded wire; and the winding module 150 is controlled to wind up the finished bonded wire. Therefore, the present application can realize the automated production of the bonded wire, and the adhesive on the bonded wire is relatively firm and not easy to fall off, thereby improving the quality of the bonded wire.

[0084] It is understandable that, referring to Figure 3 , Figure 3The schematic diagram of the structure of the manufacturing equipment of the embodiment of the present application is a brief structure diagram. The first transmission module 110 includes a first distance adjustment component 113, a first fixed shaft 111 and a first movable shaft 112, and the first fixed shaft 111 and the first movable shaft 112 are at the same horizontal height; the first drying module includes a plurality of first drying units 160, and the first drying units 160 are arranged in sequence along the movement direction of the semi-finished product bonded line. The second transmission module 120 includes a second distance adjustment component 123 and a plurality of transmission components, and the plurality of transmission components are arranged in sequence along the vertical direction; the transmission component includes a second fixed shaft 121 and a second movable shaft 122, and the second fixed shaft 121 and the corresponding second movable shaft 122 are at the same horizontal height; the second drying module includes a plurality of second drying units 170, and the plurality of second drying units 170 are arranged in sequence along the movement direction of the semi-finished product bonded line; the semi-finished product bonded line is wound around the transmission component from top to bottom.

[0085] Step S220, controlling the first drying module to perform a first drying process on the semi-finished product bonded wire on the first transmission module 110, including:

[0086] Controlling the first distance adjustment component 113 to drive the first movable shaft 112 to move in the horizontal direction, so that the distance between the first movable shaft 112 and the first fixed shaft 111 is a first length;

[0087] Determine a first number of first drying units 160 based on the first length, and control the first number of first drying units 160 to perform drying;

[0088] Step S230, controlling the second drying module to perform a second drying process on the semi-finished product bonded wire on the second transmission module 120, including:

[0089] Control the second distance adjustment component 123 to drive each second movable shaft 122 to move in the horizontal direction, so that the distance between each second movable shaft 122 and the corresponding second fixed shaft 121 is a second length; wherein the second length*the number of transmission components>the first length;

[0090] A second number of second drying units 170 is determined based on the second length, and the second number of second drying units 170 are controlled to perform drying.

[0091] Specifically, the Bondi line manufacturing equipment is provided with a frame, and the first fixed axis 111 and the second fixed axis 121 are fixed on the frame. The first drying unit 160 is used to emit hot air to the first transmission module 110, and the second drying unit 170 is used to emit hot air to the second transmission module 120. The first quantity * the width of the first drying unit 160 = the first length. After determining the first quantity, a first number of target first drying units 160 are determined from a plurality of first drying units 160, and the first number of target first drying units 160 are all located on one side between the first fixed axis 111 and the first movable axis 112; the target first drying unit 160 is controlled to start, and the other first drying units 160 do not need to be started, and the hot air emitted by the first number of target first drying units 160 can act on the semi-finished Bondi line. Exemplarily, the width of each first drying unit 160 is 0.1m, and the first length is 0.3m, then the first quantity can be determined to be 3.

[0092] Each second drying unit 170 can emit hot air to each transmission component; the second number*the width of the second drying unit 170=the second length. After determining the second number, a second number of target second drying units 170 are determined from the plurality of second drying units 170, and the second number of target second drying units 170 are all located on one side between the second fixed shaft 121 and the second movable shaft 122, and the second number of target second drying units 170 are controlled to start, and the remaining second drying units 170 do not need to be started;

[0093] The hot air emitted by the second number of second drying units 170 can all act on the semi-finished product bonded line. For example, the width of each second drying unit 170 is 0.1m, and the second length is 0.4m, then the second number can be determined to be 4. Since the second length*the number of transmission components>the first length, it can be ensured that the second drying time of the second drying process is greater than the first drying time of the first drying process.

[0094] It should be noted that position sensors are provided on the first movable axis 112 and the second movable axis 122, so that the positions of the first movable axis 112 and the second movable axis 122 can be determined, thereby determining the distance between the first movable axis 112 and the first fixed axis 111, and determining the distance between the second movable axis 122 and the corresponding second fixed axis 121.

[0095] It can be understood that the first length and the second length are determined by the following steps:

[0096] Get the glue type of the bond;

[0097] The first length and the second length are determined from a preset mapping relationship based on the glue type.

[0098] It should be noted that different glues can be used for the bond glue, for example, the glue type can be a customized first glue, or it can be epoxy resin glue, acrylic glue, etc. Different glue types require different times to be dried to a semi-dry state, and the time to be dried to completely dry is different, so the corresponding first length and second length are also different. Therefore, before executing the method, multiple glue types are tested first to determine the first length corresponding to the semi-dry state that each type of glue needs to be dried to when attached to the bond wire, and the second length corresponding to when dried to completely dry. Thereby constructing a preset mapping relationship between each type of glue and the first length and the second length. Therefore, the first length and the second length can be determined according to the glue type of the bond glue. It should be noted that the method of the present application is executed in the control module of the bond wire manufacturing equipment, and the glue type of the bond glue can be manually input into the control module through a touch device (such as a keyboard), so that the control module can obtain the glue type. It should be noted that the bond glue in the first glue holding module 104 and the second glue holding module 105 is the same.

[0099] It is understandable that the glue type includes a first glue; the first glue includes polybutene adhesive, purified water, ammonium hydroxide, a curing agent, a coupling agent, a degreasing agent, a phosphorus-free agent, an emulsifier and polyacrylamide, and the weight ratio between the polybutene adhesive, purified water, ammonium hydroxide, a curing agent, a coupling agent, a degreasing agent, a phosphorus-free agent, an emulsifier and polyacrylamide is 1: 2.7~2.9: 0.003~0.005: 0.9~1.1: 0.21~0.23: 0.06~0.08: 0.21~0.23: 0.28~0.30: 0.007~0.009.

[0100] Exemplarily, in the first glue, the weight of the polybutene adhesive PB is 1, the weight of the pure water H2O can be 2.7 or 2.8 or 2.9, the weight of ammonium hydroxide NH40H is 0.003 or 0.004 or 0.005, the weight of the curing agent B49 is 0.9 or 1 or 1.1, the weight of the coupling agent CLD is 0.21 or 0.22 or 0.23, the weight of the degreaser R20 is 0.06 or 0.07 or 0.08, the weight of the phosphorus-free agent DG is 0.21 or 0.22 or 0.23, the weight of the emulsifier A6D is 0.28 or 0.29 or 0.30, and the weight of the polyacrylamide FM80 is 0.007 or 0.008 or 0.009.

[0101] The first glue is prepared by the following steps:

[0102] Pour the polybutene adhesive and pure water into a stirring container for first stirring; wherein the weight ratio of the polybutene adhesive to the pure water is 1:2.7-2.9;

[0103] Pour ammonium hydroxide into the stirring container for a second stirring; wherein the weight ratio of the polybutene adhesive to the ammonium hydroxide is 1:0.003-0.005;

[0104] Pour the coupling agent and the degreasing agent into a stirring container for a third stirring; wherein the weight ratio of the polybutene adhesive, the coupling agent, and the degreasing agent is 1:0.21-0.23:0.06-0.08;

[0105] Pour the phosphorus-free agent and the emulsifier into a stirring container for a fourth stirring; wherein the weight ratio of the polybutene adhesive, the phosphorus-free agent and the emulsifier is 1:0.21-0.23:0.28-0.30;

[0106] Pour polyacrylamide into a stirring container for a fifth stirring; wherein the weight ratio of the polybutene adhesive to the polyacrylamide is 1:0.007-0.009.

[0107] In one embodiment, the stirring time of the first stirring is 15 minutes; the stirring time of the second stirring is 10 minutes; the stirring time of the third stirring is 15 minutes; the stirring time of the fourth stirring is 10 minutes; and the stirring time of the fifth stirring is 60 minutes.

[0108] Compared with the glue types in the related art, the first glue of the embodiment of the present application has stronger viscosity, is not easy to fall off, and can make the Bundy line more firm. Specifically, polybutene is a high molecular inert polymer. As an adhesive for the Bundy line, it can make the strands stick together, improve the adhesion of the Bundy line, and reduce the probability of the Bundy line becoming loose during use. Ammonium hydroxide has a cleaning effect, which acts on the surface of the line to play a cleaning role, enhances the adhesion of polybutene on the surface of the line, and makes it adhere better. The curing agent has the function of consolidating the surface, improving permeability and adhesion, and is integrated with the main glue polybutene to improve the hardness, brightness, adhesion and chemical stability of the film, reduce the time required for the bottom layer to dry, so that the strands are completely penetrated, and stick together more quickly, improve the curing speed of the line adhesion, shorten the adhesion curing time of the Bundy line, and speed up the drying speed of the water-based glue. The surface of the line is consolidated and formed to achieve the effect of non-adhesion between the lines. Coupling agent is an organosilicon compound with a special structure. It is used as a surface modifier. When it is used to fill plastics with inorganic fillers, it can improve its dispersibility and adhesion, increase the internal bonding strength, consolidate the surface and prevent adhesion, and shorten the adhesion curing time. Degreasing agent can remove oil stains on the wire, improve the surface quality and glossiness of the Bundy wire, make the Bundy wire have good adhesion effect and more glossy surface. Phosphorus-free agent not only has water softening effect but also degreasing effect, which can further improve the adhesion effect of the Bundy wire. The role of emulsifier is to stabilize the emulsion. It can reduce the interfacial tension between droplets and form a firm emulsified film, thereby preventing droplets from aggregating and separating. This makes the formed emulsion more stable. In the production process, emulsifiers can improve plasticity and brittleness, prevent adhesion during production, and thus improve production efficiency. The solution of polyacrylamide has a certain viscosity, which can promote the adhesion of water-based glue and promote its use.

[0109] Reference Figure 4 , Figure 4 The structure diagram of the winding module 150 of the embodiment of the present application. The winding module 150 includes a clamping assembly 152, a first drive assembly 153, a second drive assembly 154, a third drive assembly 156 and a slider 155. The first drive assembly 153 is used to drive the clamping assembly 152 to clamp the receiving shaft 151, and the second drive assembly 154 is used to drive the clamping assembly 152 to rotate, so as to drive the receiving shaft 151 to rotate; the finished bond wire is passed through the slider 155; the slider 155 is arranged on one side of the clamping assembly 152, and the third drive assembly 156 is connected to the slider 155;

[0110] Step S260, controlling the winding module 150 to wind the finished product bonded line, including:

[0111] Control the first driving assembly 153 to control the clamping assembly 152 to clamp the receiving shaft 151;

[0112] The second driving assembly 154 is controlled to drive the clamping assembly 152 to rotate, so as to drive the receiving shaft 151 to rotate, and the third driving assembly 156 is controlled to drive the slider 155 to drive the finished bond wire to reciprocate along the length direction of the receiving shaft 151.

[0113] Specifically, while the second drive assembly 154 drives the clamping assembly 152 to drive the receiving shaft 151 to rotate to wind up the finished Bondi wire, the third drive assembly 156 drives the slider 155 to drive the finished Bondi wire to reciprocate along the length direction of the receiving shaft 151, so that the finished Bondi wire can be evenly wound up in the receiving shaft 151.

[0114] The second aspect of the present application provides a Bondi wire manufacturing device. Figure 5 , Figure 5 The structure diagram of the Bondi wire manufacturing device of the embodiment of the present application is shown in FIG. The Bondi wire manufacturing device of the embodiment of the present application is applied to Figure 1 manufacturing equipment.

[0115] The Bondi wire manufacturing device of the embodiment of the present application comprises:

[0116] The unwinding unit 510 is used to control the unwinding module to release the semi-finished bonded wire and drive the semi-finished bonded wire to move;

[0117] The first drying unit 520 is used to control the first drying module to perform a first drying process on the semi-finished product bonded wire on the first transmission module 110;

[0118] The second drying unit 530 controls the second drying module to perform a second drying process on the semi-finished product bonded wire on the second transmission module 120; wherein the second drying time of the second drying process is greater than the first drying time of the first drying process;

[0119] The first surface treatment unit 540 is used to control the first surface treatment module to perform a first surface treatment on the semi-finished bonded wire that has undergone the second drying treatment, so as to remove attachments on the outer surface of the semi-finished bonded wire;

[0120] The second surface treatment unit 550 is used to control the second surface treatment module to perform a second surface treatment on the semi-finished bonded wire that has undergone the glue agglomeration removal treatment, so as to form a protective layer on the outer surface of the semi-finished bonded wire;

[0121] The winding unit 560 is used to control the winding module 150 to wind up the finished bonded wire.

[0122] The Bondi wire manufacturing device is used to execute the Bondi wire manufacturing method implemented in the first aspect of the present application. When executing the method, the semi-finished Bondi wire passes through the first glue receiving module 104, the first transmission module 110, the second glue receiving module 105, the second transmission module 120, the first surface treatment module, the second surface treatment module and the winding module 150 in sequence. When the semi-finished Bondi wire passes through the first glue receiving module 104 and the second glue receiving module 105, it is immersed in the Bondi glue; the semi-finished Bondi wire is first immersed in the first glue receiving module 104, and when passing through the first transmission module 110, the second surface treatment module 120, the first surface treatment module, the second surface treatment module and the winding module 150. A drying module performs a first drying treatment, and the first drying time of the first drying treatment is relatively short. After the first drying treatment, the adhesive on the semi-finished bonded line is in a semi-dry state, and then the semi-finished bonded line is immersed in the first glue holding module 104, so that the semi-finished bonded line is attached with adhesive again. Then, when the semi-finished bonded line passes through the second transmission module 120, the second drying module performs a second drying treatment, so that the second drying time of the second drying treatment is greater than the first drying time of the first drying treatment. The second drying time is relatively long, so that the adhesive on the semi-finished bonded line is completely dried and solidified. In this way, after two soakings and the first drying treatment and the second drying treatment, the adhesive on the semi-finished bonded wire is relatively firm and not easy to fall off, thereby improving the quality of the bonded wire; then, the first surface treatment module is controlled to perform the first surface treatment on the semi-finished bonded wire that has undergone the second drying treatment to remove the attachments on the outer surface of the semi-finished bonded wire; the second surface treatment module is controlled to perform the second surface treatment on the semi-finished bonded wire that has undergone the glue agglomeration removal treatment to form a protective layer on the outer surface of the semi-finished bonded wire; and the winding module 150 is controlled to wind up the finished bonded wire. Therefore, the present application can realize the automated production of the bonded wire, and the adhesive on the bonded wire is relatively firm and not easy to fall off, thereby improving the quality of the bonded wire.

[0123] The third aspect of the present application provides an electronic device, the electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the method for manufacturing a bondi wire according to any one of the first aspect embodiments when executing the computer program. The electronic device can be any smart terminal including a tablet computer, a car computer, etc.

[0124] Reference Figure 6 , Figure 6 FIG. 1 is a schematic diagram of the structure of an electronic device according to an embodiment of the present invention. The electronic device includes:

[0125] The processor 601 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0126] The memory 602 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 602 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 602, and the processor 601 is called to execute the method for manufacturing the bondi wire in the embodiment of this application;

[0127] Input / output interface 603, used to implement information input and output;

[0128] Communication interface 604, used to realize communication interaction between the device and other devices, which can be realized by wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.);

[0129] Bus 606 , which transmits information between various components of the device (e.g., processor 601 , memory 602 , input / output interface 603 , and communication interface 604 );

[0130] The processor 601 , the memory 602 , the input / output interface 603 and the communication interface 604 are connected to each other in communication within the device via a bus 606 .

[0131] The fourth aspect of the present application is a computer-readable storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the method for manufacturing a Bondi wire of any one of the first aspect embodiments is implemented.

[0132] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0133] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0134] Those skilled in the art will appreciate that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0135] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0136] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0137] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0138] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the mapping relationship of the mapping objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next mapping objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0139] In the several embodiments provided in the present application, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system embodiments described above are merely schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0140] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0141] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0142] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store programs.

[0143] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A method for manufacturing a bondi wire, It is characterized in that Applied to manufacturing equipment, the manufacturing equipment includes an unwinding module, a first glue receiving module, a first drying module, a first transmission module, a second transmission module, a second glue receiving module, a first surface treatment module, a second surface treatment module and a winding module, the first drying module is arranged on one side of the first transmission module, the second drying module is arranged on one side of the second transmission module, the unwinding module is used to release the semi-finished product bonded line and drive the semi-finished product bonded line to move; the semi-finished product bonded line passes through the first glue receiving module, the first transmission module, the second glue receiving module, the second transmission module, the first surface treatment module, the second surface treatment module and the winding module in sequence; the first glue receiving module and the second glue receiving module are both provided with bonded glue; when the semi-finished product bonded line passes through the first glue receiving module and the second glue receiving module, it is immersed in the bonded glue; The method comprises: Control the unwinding module to release the semi-finished product bonded wire and drive the semi-finished product bonded wire to move; Controlling the first drying module to perform a first drying process on the semi-finished product bonded wire on the first transmission module; Controlling the second drying module to perform a second drying process on the semi-finished product bonded wire on the second transmission module; wherein the second drying time of the second drying process is greater than the first drying time of the first drying process; Controlling the first surface treatment module to perform a first surface treatment on the semi-finished bonded wire that has undergone the second drying treatment, so as to remove attachments on the outer surface of the semi-finished bonded wire; Controlling the second surface treatment module to perform a second surface treatment on the semi-finished bonded wire that has undergone the glue agglomeration removal treatment, so as to form a protective layer on the outer surface of the semi-finished bonded wire; The winding module is controlled to wind up the finished product bonded wire.

2. The method for manufacturing a bondi wire according to claim 1, It is characterized in that The first transmission module includes a first distance adjustment component, a first fixed shaft and a first movable shaft, and the first fixed shaft and the first movable shaft are at the same horizontal height; the first drying module includes a plurality of first drying units, and the first drying units are arranged in sequence along the moving direction of the semi-finished product bonded line; The second transmission module includes a second distance adjustment component and a plurality of transmission components, and the plurality of transmission components are sequentially arranged along the vertical direction; the transmission component includes a second fixed shaft and a second movable shaft, and the second fixed shaft and the corresponding second movable shaft are at the same horizontal height; the second drying module includes a plurality of second drying units, and the plurality of second drying units are sequentially arranged along the moving direction of the semi-finished product bonded line; the semi-finished product bonded line is sequentially wound around the transmission components, and the transmission directions of adjacent transmission components are opposite; The controlling the first drying module to perform a first drying process on the semi-finished product bonded wire on the first transmission module includes: Controlling the first distance adjustment component to drive the first movable axis to move in a horizontal direction so that the distance between the first movable axis and the first fixed axis is a first length; Determine a first number of target first drying units based on the first length, and control the target first drying units to perform drying; The controlling the second drying module to perform a second drying process on the semi-finished product bonded wire on the second transmission module includes: Control the second distance adjustment assembly to drive each of the second movable shafts to move in the horizontal direction, so that the distance between each of the second movable shafts and the corresponding second fixed shaft is a second length; wherein the second length*the number of transmission assemblies>the first length; A second number of target second drying units is determined based on the second length, and the target second drying units are controlled to perform drying.

3. The method for manufacturing a bondi wire according to claim 2, It is characterized in that The first length and the second length are determined by the following steps: Get the glue type of the bond; The first length and the second length are determined from a preset mapping relationship based on the glue type.

4. The method for manufacturing a bondi wire according to claim 1, It is characterized in that The second surface treatment module is provided with a heating component and a wax coating roller, and when the semi-finished product bonded line passes through the second surface treatment module, it first passes through the heating component and then passes through the wax coating roller; The controlling the second surface treatment module to apply wax to the semi-finished bonded wire after the glue agglomeration removal treatment comprises: Controlling the heating component to heat the semi-finished bonded wire after the glue agglomeration removal treatment; The wax coating roller is controlled to rotate so that the wax on the outer surface of the wax coating roller melts and adheres to the semi-finished product Bondi wire when it contacts the semi-finished product Bondi wire.

5. The method for manufacturing a bondi wire according to claim 1, It is characterized in that The winding module includes a clamping assembly, a first driving assembly, a second driving assembly, a third driving assembly and a slider, wherein the first driving assembly is used to drive the clamping assembly to clamp the receiving shaft, and the second driving assembly is used to drive the clamping assembly to rotate, so as to drive the receiving shaft to rotate; the finished bond wire is passed through the slider; the slider is arranged at one side of the clamping assembly, and the third driving assembly is connected to the slider; The controlling the winding module to wind up the finished product bonded line comprises: Control the first driving assembly to control the clamping assembly to clamp the receiving shaft; The second driving assembly is controlled to drive the clamping assembly to rotate, so as to drive the receiving shaft to rotate, and the third driving assembly is controlled to drive the slider to drive the finished bond wire to reciprocate along the length direction of the receiving shaft.

6. The method for manufacturing a bondi wire according to claim 1, It is characterized in that The glue type includes a first glue; the first glue includes polybutene adhesive, purified water, ammonium hydroxide, a curing agent, a coupling agent, a degreasing agent, a phosphorus-free agent, an emulsifier and polyacrylamide, and the weight ratio of the polybutene adhesive, purified water, ammonium hydroxide, a curing agent, a coupling agent, a degreasing agent, a phosphorus-free agent, an emulsifier and polyacrylamide is 1: 2.7-2.9: 0.003-0.005: 0.9-1.1: 0.21-0.23: 0.06-0.08: 0.21-0.23: 0.28-0.30: 0.007-0.

009.

7. The method for manufacturing a bondi wire according to claim 6, It is characterized in that The first glue is prepared by the following steps: Pour the polybutene adhesive and the pure water into a stirring container for first stirring; wherein the weight ratio of the polybutene adhesive to the pure water is 1:2.7-2.9; Pour the ammonium hydroxide into the stirring container for a second stirring; wherein the weight ratio of the polybutene adhesive to the ammonium hydroxide is 1:0.003-0.005; Pour the coupling agent and the degreasing agent into the stirring container for a third stirring; wherein the weight ratio of the polybutene adhesive, the coupling agent, and the degreasing agent is 1:0.21-0.23:0.06-0.08; Pour the phosphorus-free agent and the emulsifier into the stirring container for a fourth stirring; wherein the weight ratio of the polybutene adhesive, the phosphorus-free agent and the emulsifier is 1:0.21-0.23:0.28-0.30; The polyacrylamide is poured into the stirring container for a fifth stirring; wherein the weight ratio between the polybutene adhesive and the polyacrylamide is 1:0.007-0.

009.

8. A device for manufacturing a bondi wire, It is characterized in that Applied to manufacturing equipment, the manufacturing equipment includes an unwinding module, a first glue receiving module, a first drying module, a first transmission module, a second transmission module, a second glue receiving module, a first surface treatment module, a second surface treatment module and a winding module, the first drying module is arranged on one side of the first transmission module, the second drying module is arranged on one side of the second transmission module, the unwinding module is used to release the semi-finished product bonded line and drive the semi-finished product bonded line to move; the semi-finished product bonded line passes through the first glue receiving module, the first transmission module, the second glue receiving module, the second transmission module, the first surface treatment module, the second surface treatment module and the winding module in sequence; the first glue receiving module and the second glue receiving module are both provided with bonded glue; when the semi-finished product bonded line passes through the first glue receiving module and the second glue receiving module, it is immersed in the bonded glue; The device comprises: An unwinding unit, used for controlling the unwinding module to release the semi-finished bonded wire and drive the semi-finished bonded wire to move; A first drying unit, used for controlling the first drying module to perform a first drying process on the semi-finished product bonded wire on the first transmission module; A second drying unit controls the second drying module to perform a second drying process on the semi-finished product bonded wire on the second transmission module; wherein the second drying time of the second drying process is greater than the first drying time of the first drying process; A first surface treatment unit, used for controlling the first surface treatment module to perform a first surface treatment on the semi-finished bonded wire that has undergone the second drying treatment, so as to remove attachments on the outer surface of the semi-finished bonded wire; A second surface treatment unit is used to control the second surface treatment module to perform a second surface treatment on the semi-finished bonded wire that has undergone the glue agglomeration removal treatment, so as to form a protective layer on the outer surface of the semi-finished bonded wire; The winding unit is used to control the winding module to wind up the finished product bonded wire.

9. An electronic device, It is characterized in that The electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the method for manufacturing the bondi wire according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium storing a computer program. It is characterized in that When the computer program is executed by a processor, the method for manufacturing a bondi wire according to any one of claims 1 to 7 is implemented.

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